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WO2018018849A1 - Module de puissance intelligent et son procédé de fabrication - Google Patents

Module de puissance intelligent et son procédé de fabrication Download PDF

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Publication number
WO2018018849A1
WO2018018849A1 PCT/CN2016/113993 CN2016113993W WO2018018849A1 WO 2018018849 A1 WO2018018849 A1 WO 2018018849A1 CN 2016113993 W CN2016113993 W CN 2016113993W WO 2018018849 A1 WO2018018849 A1 WO 2018018849A1
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WO
WIPO (PCT)
Prior art keywords
circuit wiring
circuit
power module
component
layer
Prior art date
Application number
PCT/CN2016/113993
Other languages
English (en)
Chinese (zh)
Inventor
冯宇翔
Original Assignee
广东美的制冷设备有限公司
美的集团股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201610616067.7A external-priority patent/CN106067450A/zh
Priority claimed from CN201610616058.8A external-priority patent/CN106024651A/zh
Priority claimed from CN201610693508.3A external-priority patent/CN106098652A/zh
Priority claimed from CN201610783777.9A external-priority patent/CN106298698A/zh
Priority claimed from CN201621257329.7U external-priority patent/CN206163481U/zh
Priority claimed from CN201611036146.7A external-priority patent/CN106409787A/zh
Priority claimed from CN201611036147.1A external-priority patent/CN106409778A/zh
Application filed by 广东美的制冷设备有限公司, 美的集团股份有限公司 filed Critical 广东美的制冷设备有限公司
Publication of WO2018018849A1 publication Critical patent/WO2018018849A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge

Definitions

  • the invention belongs to the field of electronic device manufacturing processes, and in particular relates to an intelligent power module and a manufacturing method thereof.
  • IPM Intelligent Power Module
  • the IPM integrates a power switching device and a high voltage driving circuit, and has built-in fault detection circuits such as overvoltage, overcurrent, and overheating.
  • the IPM receives the control signal of the MCU, drives the subsequent circuit to work, and on the other hand sends the status detection signal of the system back to the MCU.
  • IPM has won more and more large markets with its high integration and high reliability. It is especially suitable for inverters and various inverter power supplies for driving motors. It is frequency control and metallurgical machinery. An ideal power electronic device for electric traction, servo drive, and frequency conversion appliances.
  • the intelligent power module generally works in harsh working conditions, such as the outdoor unit of the inverter air conditioner. Under high temperature and high humidity, the high temperature will increase the internal temperature of the intelligent power module, and the current intelligent power module is completely sealed by the sealing resin. Knot The inside of the smart power module is very easy to generate heat accumulation, and high humidity causes water vapor to enter the internal circuit of the intelligent power module through the gap between the sealing resin and the pin, and the high temperature inside the intelligent power module makes the ion In particular, chloride ions and bromide ions migrate under the action of water vapor, causing corrosion to the metal wires, which often occurs at the junction of the metal wires and the circuit components or the metal wires and the circuit wiring, resulting in an open circuit, The intelligent power module constitutes a fatal damage. In severe cases, the intelligent power module will have an uncontrolled explosion accident, which will cause damage to its application environment and cause major economic losses.
  • the intelligent power module has different power devices.
  • the material and thickness of the metal wires are different, which increases the processing difficulty of the intelligent power module.
  • the purchase of different state-of-the-line devices also increases the processing cost, and
  • the combination of various bonding processes makes the manufacturing pass-through rate of the intelligent power module low, and the production yield is difficult to increase. As a result, the cost of the intelligent power module is high, which affects the popular application of the intelligent power module.
  • the invention aims to solve the deficiencies of the prior art, and provides a high-reliability intelligent power module and a process flow adapted to the structure as a manufacturing method, which can reduce the intelligence while ensuring better contact reliability of the intelligent power module.
  • the cost of the power module is not limited to a high-reliability intelligent power module and a process flow adapted to the structure as a manufacturing method, which can reduce the intelligence while ensuring better contact reliability of the intelligent power module.
  • an intelligent power module comprising: a circuit wiring layer as a carrier, the circuit wiring layer having an upper surface and a lower surface opposite to the upper surface; a circuit component soldered to a predetermined position on an upper surface of the circuit wiring layer; a heat sink of the power component mounted in the circuit component; and an upper surface covering the circuit wiring layer and the circuit component, and A bare sealing layer on the surface of the heat sink.
  • a pin is further included, the circuit wiring layer including a pin pad adjacent to the edge, the pin being connected to the pin pad and extending outside the circuit wiring.
  • the surface of the lead is covered with a plating layer.
  • the power component is a planar power device.
  • the heat sink is a heat sink.
  • the sealing layer is a resin layer.
  • the above-mentioned intelligent power module has the beneficial effects that the metal substrate is no longer needed, the circuit board layer is fixed by the reusable bottom plate, and the final fixing is performed by the resin, and the metal bonding wire is no longer needed, thereby saving the cost and wiring the circuit back.
  • the heat sink is completely exposed to the outside of the resin to maximize the heat dissipation effect, the gap between the circuit wirings is completely exposed, the moisture is hard to adhere, and even if the external moisture is invaded, it is difficult to form corrosion because the metal wire is no longer present.
  • Another object of the present invention is to provide a method for manufacturing an intelligent power module, comprising the following steps:
  • a sealing layer is coated on the surface of the circuit wiring layer to cover the circuit component and expose the at least part of the surface of the heat sink.
  • the manufacturing method of the above intelligent power module has the beneficial effects of: positioning by the base reduces the difficulty of positioning during plastic sealing, and the bottom is completely exposed, which reduces the difficulty of controlling the parameter thickness difference between the upper and lower surfaces during the injection, and eliminates the bonding of the metal wire.
  • the cleaning process saves equipment investment, improves production efficiency, reduces process control requirements, greatly reduces the manufacturing difficulty of the intelligent power module, improves the manufacturing yield, and further reduces the cost of the intelligent power module.
  • an intelligent power module comprising: a circuit wiring layer as a carrier, the circuit wiring layer having an upper surface and a lower surface opposite to the upper surface; a circuit component soldered to a predetermined position on an upper surface of the circuit wiring layer; a heat sink of the power component mounted in the circuit component, wherein a heat sensitive component is attached to an upper surface of the heat sink; and covering the An upper surface of the circuit wiring layer and the circuit component, and a sealing layer that exposes the surface of the heat sensitive element.
  • a pin is further included, the circuit wiring layer including a pin pad adjacent to the edge, the pin being connected to the pin pad and extending outside the circuit wiring.
  • an upper surface of the heat sink is provided with an insulating layer, and a circuit pattern is pressed on the insulating layer, and the heat sensitive element is disposed on the circuit pattern.
  • the power component is a planar power device.
  • the heat sink is a heat sink.
  • the sealing layer is a resin layer.
  • the above-mentioned intelligent power module has the beneficial effects that the metal substrate is no longer needed, the circuit board layer is fixed by the reusable bottom plate, and the final fixing is performed by the resin, and the metal bonding wire is no longer needed, thereby saving the cost and wiring the circuit back. It is completely exposed to the outside of the resin to maximize the heat dissipation effect, the gap between the circuit wirings is completely exposed, the moisture is hard to adhere, and even if the external moisture is invaded, it is difficult to form corrosion because there is no metal wire.
  • the thermal element and the power element are located on the upper and lower sides of the same heat sink, and the temperature sensitive element is exposed from the resin, so that the temperature of the power element can be detected in real time, thereby improving the safety of use of the smart power module.
  • Another object of the present invention is to provide a method for manufacturing an intelligent power module, comprising the following steps:
  • a sealing layer is coated on a surface of the circuit wiring layer to cover the circuit element and expose the surface of the heat sensitive element.
  • the manufacturing method of the above intelligent power module has the beneficial effects of eliminating the process of fabricating the substrate and the insulating layer thereon, positioning through the base, reducing the difficulty of positioning during plastic sealing, and completely exposing the bottom portion, thereby reducing the thickness difference between the upper and lower surfaces during injection molding.
  • the difficulty of parameter control eliminates the need for metal wire bonding and cleaning processes, saves equipment investment, improves production efficiency, reduces process control requirements, greatly reduces the manufacturing difficulty of intelligent power modules, and improves manufacturing yield. Reduce the cost of intelligent power modules.
  • an intelligent power module comprising: a circuit wiring layer as a carrier, the circuit wiring layer having an upper surface and a lower surface opposite to the upper surface; a circuit component soldered to a predetermined position on an upper surface of the circuit wiring layer, wherein a surface of the power component of the circuit component is provided with a heat sink, a lower surface is provided with a temperature sensing component; and the circuit wiring layer is covered The upper surface and the circuit component and the exposed surface of the heat sink portion of the sealing layer.
  • a pin is further included, the circuit wiring layer including a pin pad adjacent to the edge, the pin being connected to the pin pad and extending outside the circuit wiring.
  • the surface of the lead is covered with a plating layer.
  • the power component is a planar power device.
  • the heat sink is a heat sink.
  • the temperature sensing element is mounted on one of the electrodes of the power element by a non-conductive gel.
  • the above-mentioned intelligent power module has the beneficial effects that the metal substrate is no longer needed, the circuit board layer is fixed by the reusable bottom plate, and the final fixing is performed by the resin, and the metal bonding wire is no longer needed, thereby saving the cost and wiring the circuit back.
  • the heat sink is completely exposed outside the resin to maximize the heat dissipation effect, the gap between the circuit wiring is completely exposed, the moisture is difficult to adhere, and even if the external moisture is invaded, it is difficult to form corrosion because there is no metal wire;
  • the temperature component is directly mounted on the surface of the high-power circuit component, and the temperature of the high-power power circuit component can be monitored in real time.
  • Another object of the present invention is to provide a method for manufacturing an intelligent power module, comprising the following steps:
  • circuit components on the surface of the circuit wiring layer, wherein the circuit components are assembled in an inverted manner, wherein the upper surface of the power component of the circuit component is provided with a heat sink, and the lower surface is provided with a temperature sensing component;
  • a sealing layer is coated on a surface of the circuit wiring layer to cover the circuit component and expose at least a portion of the surface of the heat sink.
  • the manufacturing method of the above intelligent power module has the beneficial effects of eliminating the process of fabricating the substrate and the insulating layer thereon, positioning through the base, reducing the difficulty of positioning during plastic sealing, and completely exposing the bottom portion, thereby reducing the thickness difference between the upper and lower surfaces during injection molding.
  • the difficulty of parameter control eliminates the need for metal wire bonding and cleaning processes, saves equipment investment, improves production efficiency, reduces process control requirements, greatly reduces the manufacturing difficulty of intelligent power modules, and improves manufacturing yield. Lower The cost of the smart power module.
  • an intelligent power module comprising: a circuit wiring layer as a carrier, the circuit wiring layer having an upper surface and a lower surface opposite to the upper surface; a circuit component soldered to a predetermined position on an upper surface of the circuit wiring layer, wherein the circuit component includes a power component and a driving component of the power component, the power component and the driving component being electrically connected to the circuit wiring layer by ball implantation a heat sink mounted on an upper surface of the power component; and a sealing layer covering the upper surface of the circuit wiring layer and the circuit component and exposing the surface of the heat sink portion.
  • a pin is further included, the circuit wiring layer including a pin pad adjacent to the edge, the pin being connected to the pin pad and extending outside the circuit wiring.
  • the driving element is located between a lower surface of the power element and an upper surface of the circuit wiring layer.
  • the power component is a planar power device.
  • the drive element comprises a temperature sensing device.
  • the sealing layer is a resin layer.
  • the above-mentioned intelligent power module has the beneficial effects that the metal substrate is no longer needed, the circuit board layer is fixed by the reusable bottom plate, and the final fixing is performed by the resin, and the metal bonding wire is no longer needed, thereby saving the cost and wiring the circuit back.
  • the heat sink is completely exposed to the outside of the resin to maximize the heat dissipation effect, the gap between the circuit wirings is completely exposed, the moisture is hard to adhere, and even if the external moisture is invaded, it is difficult to form corrosion because the metal wire is no longer present.
  • Another object of the present invention is to provide a method for manufacturing an intelligent power module, comprising the following steps:
  • circuit component Assembling a circuit component on a surface of the circuit wiring layer, wherein the circuit component is assembled in an inverted manner, the circuit component comprising a power component and a driving component of the power component, the power component and the driving component passing a ball Electrically connecting to the circuit wiring layer;
  • a sealing layer is coated on a surface of the circuit wiring layer to cover the circuit component and expose at least a portion of the surface of the heat sink.
  • the manufacturing method of the above intelligent power module has the beneficial effects of eliminating the process of fabricating the substrate and the insulating layer thereon, positioning through the base, reducing the difficulty of positioning during plastic sealing, and completely exposing the bottom portion, thereby reducing the thickness difference between the upper and lower surfaces during injection molding.
  • the difficulty of parameter control eliminates the need for metal wire bonding and cleaning processes, saves equipment investment, improves production efficiency, reduces process control requirements, greatly reduces the manufacturing difficulty of intelligent power modules, and improves manufacturing yield. Reduce the cost of intelligent power modules.
  • an embodiment of the fifth aspect of the present invention is achieved by the intelligent power module according to the present invention comprising: a circuit Wiring, at least one end of the circuit wiring is provided with a pad for electrically connecting to an external circuit; a plurality of circuit elements, a plurality of the circuit elements are disposed on an upper surface of the circuit wiring, and the plurality of the circuits The components are electrically connected to the circuit wiring through metal wires, respectively; a sealing resin is disposed on the circuit wiring.
  • the smart power module of the present invention by providing a pad at the end of the circuit wiring and electrically connecting the external circuit through the pad, the outwardly extending pin on the smart power module in the related art is omitted, thereby avoiding the lead.
  • the short circuit caused by condensation on the foot improves the reliability of the intelligent power module, prolongs the service life of the intelligent power module, and reduces the use cost.
  • the structure and processing technology of the intelligent power module are simplified, and the processing cost of the intelligent power module is reduced, thereby further reducing the overall cost of the intelligent power module.
  • the intelligent power module according to the invention may also have the technical features of the following accessories:
  • the sealing resin covers an upper surface of the circuit wiring and an upper portion of a side surface of the circuit wiring, and a lower portion of the side surface of the circuit wiring and a lower surface of the circuit wiring are exposed at The sealing resin is outside.
  • the sealing resin completely covers the circuit component and the metal line on the upper surface of the circuit wiring.
  • the side of the circuit wiring is exposed to a height h outside the sealing resin, and the h satisfies: 0.3 oz ⁇ h ⁇ 0.8 oz.
  • the circuit wiring is machined from a copper plate having a thickness t, the t satisfying: t ⁇ 5 ounces.
  • an anti-oxidation layer is disposed on an outer surface of the circuit wiring.
  • the diameter of the metal wire is d, and the d satisfies: 15 ⁇ m ⁇ d ⁇ 400 ⁇ m.
  • the metal wire is an aluminum wire, a gold wire or a copper wire.
  • the smart power module comprising: circuit wiring, at least one end of the circuit wiring is provided with a pad for electrically connecting to an external circuit; a circuit component, a plurality of the circuit components are disposed on an upper surface of the circuit wiring, and the plurality of the circuit components are directly electrically connected to the circuit wiring; a sealing resin is disposed on the circuit wiring.
  • the smart power module of the present invention by providing a pad at at least one end of the circuit wiring and electrically connecting the external circuit through the pad, the outwardly extending pin on the smart power module in the related art is omitted, thereby avoiding Short circuit caused by condensation on the pin improves the reliability of the intelligent power module, prolongs the service life of the intelligent power module, and reduces the use cost.
  • the circuit components are directly electrically connected to the circuit wiring, and the metal wires for electrically connecting the circuit components and the circuit wirings in the related art are omitted, which further saves cost.
  • it simplifies the structure and processing technology of the intelligent power module improves the production efficiency, and reduces the processing cost of the intelligent power module. The overall cost of the intelligent power module is further reduced.
  • the intelligent power module according to the invention may also have the technical features of the following accessories:
  • each of said circuit elements is a planar circuit element, each of said circuit elements having electrodes, each of said circuit elements being electrically connected to said circuit wiring by said electrodes.
  • At least one of the plurality of circuit elements is a power element
  • the smart power module further includes: a heat sink connected to an upper surface of the power element.
  • the sealing resin covers an upper portion of a side surface of the circuit wiring and an upper surface of the circuit wiring, and a lower portion of the side surface of the circuit wiring and a lower surface of the circuit wiring are exposed at The sealing resin is outside.
  • the sealing resin completely covers the circuit component on the upper surface of the circuit wiring, and a side surface of the heat sink away from the power component is exposed outside the sealing resin.
  • the side of the circuit wiring exposed to the outside of the sealing resin has a height h, and the h satisfies: 0.3 oz ⁇ h ⁇ 0.8 oz.
  • the heat sink is a copper sheet, the heat sink has a thickness of t1, and the t1 satisfies: 1.0 mm ⁇ t1 ⁇ 1.5 mm.
  • the outer surface of the heat sink has an electroplated silver layer.
  • the thickness of the electroplated silver layer is t2, and the t2 satisfies: 22 ⁇ m ⁇ t2 ⁇ 30 ⁇ m.
  • the circuit wiring is machined from a copper plate having a thickness t3, the t3 satisfying: t3 ⁇ 5 ounces.
  • S6420 fabricating a base, and digging a groove on the base according to a shape of the circuit wiring, wherein a lower portion of the circuit wiring is adapted to be placed in the groove;
  • S6450 The circuit wiring is taken out from the base to obtain an intelligent power module.
  • the manufacturing method of the intelligent power module of the present invention by placing the circuit wiring in the recess on the reusable base and positioning the circuit wiring through the base, the manufacturing difficulty of the intelligent power module is greatly reduced, and the manufacturing is improved.
  • the yield reduces the cost of the intelligent power module and is beneficial to the popularization and application of the intelligent power module.
  • directly connecting the electrodes of the circuit components directly to the circuit wiring eliminating the related art for realizing the electrical connection between the circuit components and the circuit wiring
  • the metal wire further saves costs and improves production efficiency.
  • the method before the electrodes of the circuit component are connected to the circuit wiring, the method further includes the step of attaching a heat sink to the power component in the circuit component.
  • the step S6410 specifically includes the following steps:
  • the step S6430 specifically includes the following steps:
  • the method further includes the following steps:
  • the overflow formed during the circuit wiring process is removed.
  • the depth of the groove is H, and the H satisfies: 0.3 oz ⁇ H ⁇ 0.8 oz.
  • the base is a stainless steel piece.
  • an embodiment of the seventh aspect of the present invention is achieved by the intelligent power module according to the present invention comprising: circuit wiring, at least one end of the circuit wiring is provided with a pad for electrically connecting to an external circuit; a circuit component, a plurality of the circuit components being disposed on an upper surface of the circuit wiring, each of the circuit components being a planar circuit component, each of the circuit components having an electrode, each of the circuit components passing through The electrode is electrically connected to the circuit wiring, at least one of the plurality of circuit elements is a power element, at least one of the power elements is provided with a temperature sensing element, a sealing resin, and the sealing resin is disposed on the circuit wiring .
  • the temperature of the power component can be monitored in real time by setting the temperature sensing component on the power component, thereby taking measures to respond in time when the intelligent power module is abnormally heated during the working process. Therefore, the intelligent power module can be effectively prevented from being burnt due to overheating, the probability of damage of the intelligent power module is reduced, and the reliability of the intelligent power module is improved.
  • the intelligent power module according to the invention may also have the technical features of the following accessories:
  • the smart power module further includes: a heat sink connected to the upper surface of the power component.
  • the sealing resin covers an upper portion of the side of the circuit wiring and the electric The upper surface of the wiring, the lower portion of the side surface of the circuit wiring and the lower surface of the circuit wiring are exposed outside the sealing resin.
  • the sealing resin completely covers the circuit component on the upper surface of the circuit wiring, and a side surface of the heat sink away from the power component is exposed outside the sealing resin, and a lower portion of the temperature sensing component The temperature sensing electrode is exposed outside the sealing resin.
  • the side of the circuit wiring is exposed to a height h outside the sealing resin, and the h satisfies: 0.3 oz ⁇ h ⁇ 0.8 oz.
  • the height of the temperature sensing element is A, and the A satisfies: 0.1 mm ⁇ A ⁇ 0.15 mm.
  • the heat sink is a copper sheet, the heat sink has a thickness t1, and the t1 satisfies: 1.0 mm ⁇ t1 ⁇ 1.5 mm.
  • the outer surface of the heat sink has an electroplated silver layer.
  • the thickness of the electroplated silver layer is t2, and the t2 satisfies: 22 ⁇ m ⁇ t2 ⁇ 30 ⁇ m.
  • the circuit wiring is machined from a copper plate having a thickness t3, the t3 satisfying: t3 ⁇ 5 ounces.
  • a method of manufacturing an intelligent power module according to the present invention includes the following steps:
  • S7820 fabricating a base, and scooping a first recess on the base according to the shape of the circuit wiring, and digging a second recess on the base according to the position and shape of the temperature sensing element, the circuit wiring a lower portion is adapted to be placed in the first recess, and a lower end of the temperature sensing element is adapted to be placed in the second recess;
  • S7850 The circuit wiring is taken out from the base to obtain an intelligent power module.
  • the circuit wiring is positioned by using the reusable base, thereby reducing the difficulty in positioning the sealing resin, greatly reducing the manufacturing difficulty of the intelligent power module, and improving the manufacturing yield.
  • the cost of the intelligent power module is reduced, which is beneficial to the popularization and application of the intelligent power module.
  • the electrodes of the circuit components are directly connected to the circuit wiring, and the metal wires for electrically connecting the circuit components and the circuit wirings in the related art are omitted, which further saves cost and improves production efficiency.
  • the method before the electrodes of the circuit component are connected to the circuit wiring, the method further includes the following steps:
  • a heat sink is attached to the power component in the circuit component.
  • the step S7810 specifically includes the following steps:
  • the step S7830 specifically includes the following steps:
  • S7831 coating a non-conductive gel on a lower surface of the power element, the temperature sensing element being connected to the power element through the non-conductive gel;
  • the method further includes the following steps:
  • the depth of the first groove is H, and the H satisfies: 0.3 oz ⁇ H ⁇ 0.8 oz.
  • the base is a stainless steel piece.
  • FIG. 1(A) is a top plan view of an intelligent power module according to an embodiment of the first aspect of the present invention
  • Figure 1 (B) is a cross-sectional view taken along line X-X' in Figure 1 (A);
  • FIG. 2 is a flowchart of a manufacturing process of an intelligent power module according to an embodiment of the present invention
  • 3(A) and 3(B) are schematic views showing a side view and a plan view of a circuit component and a lead on a circuit wiring;
  • 4(A) and 4(B) are respectively a side view and a plan view showing a process of assembling a metal wire
  • FIG. 5 is a schematic view showing a sealing process of an intelligent power module
  • 6(A) is a schematic view showing a process of arranging circuit wiring on a base
  • 6(B) and 6(C) are schematic views showing side view and top view of assembled circuit components and leads, respectively;
  • FIG. 7 is a schematic view showing a sealing process of a method of manufacturing an intelligent power module
  • FIG. 8 is a schematic diagram of a detecting process of a method for manufacturing an intelligent power module
  • FIG. 9 is a process flow diagram of a method of manufacturing an intelligent power module.
  • FIG. 10(A) is a top plan view of an intelligent power module according to an embodiment of the second aspect of the present invention.
  • Figure 10 (B) is a cross-sectional view taken along line X-X' in Figure 10 (A);
  • Figure 10 (C) is a plan view of the smart power module of the present invention with the sealing layer removed;
  • Figure 10 (D) is a top plan view of the lower surface of the smart power module of the present invention.
  • FIG. 11 is a flowchart of a manufacturing process of an intelligent power module according to an embodiment of the present invention.
  • 12(A) and 12(B) are respectively a plan view and a side view process for fabricating a circuit wiring in the method of manufacturing the smart power module of the present invention
  • Figure 13 (A) is a dimension drawing of the pin
  • Figure 13 (B) is a schematic view showing the process of making a lead
  • 13(C) is a schematic view showing a process of forming a heat sink and forming a circuit pattern on the heat sink;
  • Figure 14 is a schematic view showing a process of mounting a heat sink on the bottom of the power component
  • Figure 15 (A) is a schematic view showing a process of arranging circuit wiring on a base
  • 15(B) and 15(C) are schematic side and top plan views of the assembled circuit components and leads, respectively;
  • 16 is a schematic view showing a sealing process of a method of manufacturing an intelligent power module
  • 17 is a schematic diagram of a detecting process of a method of manufacturing an intelligent power module
  • 18 is a process flow diagram of a method of manufacturing an intelligent power module.
  • 19(A) is a top plan view of an intelligent power module according to an embodiment of a third aspect of the present invention.
  • Figure 19 (B) is a cross-sectional view taken along line X-X' in Figure 19 (A);
  • Figure 19 (C) is a plan view of the smart power module of the present invention with the sealing layer removed;
  • Figure 19 (D) is a top plan view of the lower surface of the smart power module of the present invention.
  • 21(A) and 21(B) are respectively a plan view and a side view process for fabricating a circuit wiring in the method of manufacturing the smart power module of the present invention
  • Figure 22 (A) is a dimension drawing of the pin
  • Figure 22 (B) is a schematic view showing a process of manufacturing a lead
  • Figure 23 is a schematic view showing the process of mounting the power component on the heat sink and the temperature sensing component.
  • Figure 24 (A) is a schematic view showing a process of arranging circuit wiring on a base
  • 24(B) and 24(C) are schematic side and top plan views of the assembled circuit components and leads, respectively;
  • 25 is a schematic view showing a sealing process of a method of manufacturing an intelligent power module
  • 26 is a schematic diagram of a detecting process of a method of manufacturing an intelligent power module
  • 27 is a process flow diagram of a method of manufacturing an intelligent power module.
  • 28(A) is a top plan view of an intelligent power module according to an embodiment of a fourth aspect of the present invention.
  • Figure 28 (B) is a cross-sectional view taken along line X-X' in Figure 28 (A);
  • 28(C) is a plan view of the smart power module of the present invention with the sealing layer removed;
  • 28(D) is a top plan view of the lower surface of the smart power module of the present invention.
  • FIG. 29 is a flowchart of a manufacturing process of an intelligent power module according to an embodiment of the present invention.
  • 30(A) and 30(B) are respectively a plan view and a side view process for fabricating a circuit wiring in the method of manufacturing the smart power module of the present invention
  • Figure 31 (A) is a dimension drawing of the pin
  • Figure 31 (B) is a schematic view showing the process of manufacturing a lead
  • 32 is a schematic view showing a process of mounting a heat sink on the bottom of the power component
  • Figure 33 (A) is a schematic view showing a process of arranging circuit wiring on a base
  • 33(B) and 33(C) are schematic side and top plan views of the assembled circuit components and leads, respectively;
  • Figure 34 is a schematic view showing a sealing process of a method of manufacturing an intelligent power module
  • 35 is a schematic diagram of a detecting process of a method of manufacturing an intelligent power module
  • 36 is a process flow diagram of a method of manufacturing an intelligent power module.
  • FIG. 37 is a top plan view of a smart power module in accordance with a new embodiment of the fifth aspect of the present invention.
  • Figure 38 is a cross-sectional view taken along line A-A of Figure 37;
  • 39 is a top plan view of an intelligent power module in which a sealing resin of an upper surface of an intelligent power module is removed, according to an embodiment of the present invention.
  • Figure 40 is a bottom plan view of an intelligent power module in accordance with an embodiment of the present invention.
  • 41 is a top plan view showing circuit wiring of an intelligent power module according to an embodiment of the present invention.
  • Figure 42 is a cross-sectional view taken along line B-B of Figure 41;
  • FIG. 43 is a top plan view of a base in a method of manufacturing an intelligent power module according to an embodiment of the present invention.
  • 44 is a plan view showing a method of mating a base with a carrier in a method of manufacturing an intelligent power module according to an embodiment of the present invention
  • Figure 45 is a cross-sectional view taken along line C-C of Figure 44;
  • FIG. 46 is a schematic structural diagram of an intelligent power module after a metal wire is bonded according to an embodiment of the present invention.
  • FIG. 48 is a schematic diagram of a package sealing resin of an intelligent power module according to an embodiment of the present invention.
  • 49 is a bottom view of the smart power module after encapsulating the sealing resin according to an embodiment of the present invention.
  • 50 is a flow chart of a method of fabricating an intelligent power module in accordance with an embodiment of the present invention.
  • Figure 51 is a top plan view of an intelligent power module in accordance with an embodiment of a sixth aspect of the present invention.
  • Figure 52 is a cross-sectional view taken along line A-A of Figure 51;
  • FIG. 53 is a top plan view of an intelligent power module in which a sealing resin of an upper surface of an intelligent power module is removed, according to an embodiment of the present invention
  • Figure 54 is a bottom plan view of an intelligent power module in accordance with an embodiment of the present invention.
  • 55 is a top plan view of circuit wiring of an intelligent power module in accordance with an embodiment of the present invention.
  • Figure 56 is a cross-sectional view taken along line B-B of Figure 55;
  • 57 is a schematic structural diagram of a heat sink and a power component of an intelligent power module according to an embodiment of the present invention.
  • FIG. 58 is a top plan view of a base in a method of manufacturing an intelligent power module according to an embodiment of the present invention.
  • FIG. 59 is a top plan view showing a mating of a base and a carrier in a method of manufacturing an intelligent power module according to an embodiment of the present invention
  • Figure 60 is a cross-sectional view taken along line C-C of Figure 59;
  • 61 is a schematic diagram of a package sealing resin of an intelligent power module according to an embodiment of the present invention.
  • FIG. 62 is a bottom view of the smart power module after encapsulating the sealing resin according to an embodiment of the present invention.
  • FIG. 63 is a top plan view of a smart power module packaged with a sealing resin according to an embodiment of the invention.
  • 64 is a flow chart of a method of fabricating an intelligent power module in accordance with an embodiment of the present invention.
  • Figure 65 is a top plan view of an intelligent power module in accordance with an embodiment of a seventh aspect of the present invention.
  • Figure 66 is a cross-sectional view taken along line A-A of Figure 65;
  • 67 is a top plan view of an intelligent power module in which a sealing resin of an upper surface of an intelligent power module is removed, according to an embodiment of the present invention
  • Figure 68 is a bottom plan view of an intelligent power module in accordance with an embodiment of the present invention.
  • Figure 69 is a top plan view of circuit wiring of an intelligent power module in accordance with an embodiment of the present invention.
  • Figure 70 is a cross-sectional view taken along line B-B of Figure 69;
  • 71 is a schematic structural diagram of a heat sink, a power element, and a temperature sensing element of an intelligent power module according to an embodiment of the present invention
  • FIG. 72 is a top plan view of a base in a method of manufacturing an intelligent power module according to an embodiment of the present invention.
  • Figure 73 is a plan view of a mating of a base and a carrier in accordance with an embodiment of the present invention.
  • Figure 74 is a cross-sectional view taken along line C-C of Figure 69;
  • 75 is a schematic diagram of a package sealing resin of an intelligent power module according to an embodiment of the present invention.
  • Figure 76 is a bottom plan view of the smart power module encapsulating the sealing resin according to an embodiment of the present invention.
  • 77 is a top plan view of a smart power module packaged with a sealing resin in accordance with an embodiment of the present invention.
  • FIG. 78 is a flow chart of a method of fabricating an intelligent power module in accordance with an embodiment of the present invention.
  • the smart power module includes a circuit including a circuit wiring (circuit wiring) 18, a circuit component 14, and a heat sink 15. And a pin 11 disposed at an edge of the circuit wiring 18, and a sealing layer 12 that seals the circuit and completely covers the circuit element 14 and the upper surface of the circuit wiring 18.
  • 1(A) is a top plan view of the upper surface of the smart power module 10 of the present invention, the heat sink 15 is exposed from the upper surface
  • FIG. 1(B) is a cross section taken along line XX' of FIG. 1(A).
  • 1(C) is a plan view showing the sealing layer 12 covering the circuit component 14 removed
  • FIG. 1(D) is a top plan view of the smart power module 10 of the present invention, the circuit wiring 18 from below The surface is exposed.
  • the circuit wiring layer 18 serves as a carrier of the smart power module 10 having an upper surface and a lower surface opposite to the upper surface; the circuit component 14 is inverted and soldered to a predetermined position on the upper surface of the circuit wiring layer 18.
  • the heat sink 15 is mounted on the power element in the circuit component 14; the sealing layer 12 covers the upper surface of the circuit wiring layer 18 and the circuit component 18, and partially exposes the surface of the heat sink 15.
  • the power component is a planar power device, such as an IGBT transistor, and an LIGBT must be used.
  • the heat sink is a heat sink, and the surface of the heat sink can be treated with silver plating to increase the wettability.
  • the sealing layer is a sealing resin layer.
  • a pin pad 18A there is a special circuit wiring for configuring the pin 11, which is referred to as a pin pad 18A.
  • the pin 11 pin pad 18A is connected and extends from the outside of the circuit wiring 18.
  • the surface of the lead is covered with a plating layer.
  • the circuit wiring 18 is formed by stamping or etching a copper material having a thickness of 5 ounces or more. To prevent oxidation, the upper surface of the circuit wiring 18 may be subjected to gold plating treatment, and the circuit wiring 18 is provided for cost. The surface can also be silver plated or shipped in a vacuum or nitrogen-filled package with no treatment on the upper surface.
  • the circuit component 14 is flip-chip mounted on the circuit wiring 18.
  • the circuit element 14 uses an active element such as a transistor or a diode, or a passive element such as a capacitor or a resistor. Further, the heat sink 15 made of copper or the like is attached to the back surface of the element having a large amount of heat such as a power element.
  • solder solder
  • Pin 11 is generally made of metal such as copper, and the surface of the copper is formed by electroless plating and electroplating to form a layer of nickel-tin alloy.
  • the thickness of the layer is generally 5 ⁇ m, and the plating layer protects the copper from corrosion by oxidation and improves solderability.
  • the sealing layer 12 may be molded by a transfer molding using a thermosetting resin or an injection molding using a thermoplastic resin.
  • the sealing layer 12 completely seals all the elements on one side of the circuit wiring 18 and wraps most of the depth of the circuit wiring 18, exposing only a small portion of the circuit wiring lower surface 18B, and the circuit wiring lower surface 18B is deep.
  • it can be considered to be designed to be about 0.5 ounce. If the depth of the lower surface 18B of the circuit wiring is too small, it may cause the smart power module 10 of the present invention to be difficult to be wrapped by solder such as solder paste in the subsequent soldering and fixing process, if the lower surface of the circuit wiring 18B is too deep.
  • soldering height of the solder paste in the subsequent soldering and fixing process of the smart power module 10 of the present invention may not completely wrap the circuit wiring lower surface 18B; here, the heat sink 15 is exposed from the sealing layer 12, so that The heat of the power components is quickly dissipated.
  • the beneficial effect of the intelligent power module is that the metal substrate is no longer needed, the circuit layer is fixed by the reusable bottom plate, and the final fixing by the resin eliminates the need for the metal bonding wire, thereby saving the cost, and the circuit wiring is back and The heat sink is completely exposed outside the resin to maximize the heat dissipation effect, the gap between the circuit wirings is completely exposed, the moisture is hard to adhere, and even if the external moisture is invaded, it is difficult to form corrosion because the metal wire is no longer present.
  • a method for manufacturing the smart power module including the following steps:
  • Step S210 using a metal plate to form a circuit wiring layer as a carrier;
  • Step S220 assembling a circuit component on a surface of the circuit wiring layer, wherein the circuit component is assembled in an inverted manner;
  • Step S230 mounting a heat sink on the power component in the circuit component
  • Step S240 covering a surface of the circuit wiring layer with a sealing layer, covering the circuit element with a sealing layer that exposes at least a part of the surface of the heat sink.
  • Step S240 specifically includes: providing a thermosetting resin frame around the surface of the circuit wiring layer; and injecting a thermoplastic resin into the range of the thermosetting resin frame to seal the circuit wiring layer and the circuit component.
  • step S220 is also included before step S220 .
  • the step specifically includes: selecting a copper substrate, forming a row of pins by punching or etching the copper substrate, connecting the pins through the ribs; forming a nickel layer and a nickel tin on the surface of the lead The alloy layer gives a plated lead.
  • the method further comprises the steps of: soldering the circuit component to the circuit wiring layer by reflow soldering; and removing the flux remaining in the insulating layer.
  • Positioning through the base reduces the difficulty of positioning during plastic sealing, and the bottom is completely exposed, which reduces the difficulty of controlling the parameter thickness difference between the upper and lower surfaces during the injection, eliminating the metal wire bonding and cleaning process, saving equipment investment and improving
  • the production efficiency reduces the process control requirements, the manufacturing difficulty of the intelligent power module is greatly reduced, the manufacturing yield is improved, and the cost of the intelligent power module is further reduced.
  • the method of manufacturing the smart power module includes the following steps.
  • the first process 902 refers to FIGS. 3(A) and 3(B):
  • the first step 902 of the present invention is a step of the present invention, and the step is a step of forming a circuit wiring on a copper substrate having an appropriate size.
  • the circuit layout should not be larger than 64 mm ⁇ 30mm.
  • High-speed steel can also be used as the material by the boring tool.
  • the motor uses a speed of 5000 rpm, and the boring tool and the aluminum plane are at right angles to the specific shape of the lower stroke. It is also possible to etch a specific shape by a chemical reaction by an etching tool.
  • this specific shape is the circuit wiring 18.
  • a gold layer may be formed on the surface of the circuit wiring 18 by means of electroplating gold or chemical immersion gold.
  • the thickness of the copper plate used for manufacturing the circuit wiring 18 should be not less than 5 ounces, ensuring a larger contact area with the subsequent resin 12, so that the smart power module 10 is more fixed. effect.
  • the second process 904 referring to FIG. 4(A) and FIG. 4(B):
  • the second step 904 of the present invention is a step of the present invention, and the step is a step of forming an independent lead 11 with a plating layer.
  • Each of the leads 11 is made of a copper substrate, and is formed into a strip shape having a length C of 25 mm, a width K of 1.5 mm, and a thickness H of 1 mm, as shown in Fig. 4(A); here, for ease of assembly, Pressing a certain arc at one end, as shown in Figure 4 (B);
  • a nickel layer is formed by electroless plating: a nickel layer is formed on the surface of the copper material having a specific shape by a mixed solution of a nickel salt and a sodium hypophosphite, and a suitable complexing agent is added, and the nickel metal is strong in the metal nickel. Passivation ability, can quickly form a very thin passivation film, resistant to atmospheric, alkali and some acid corrosion.
  • the nickel-plated crystal is extremely fine, and the thickness of the nickel layer is generally 0.1 ⁇ m;
  • the copper material having the formed shape and the nickel layer is immersed in the plating solution with the positive tin ions at room temperature to form a nickel-tin alloy layer on the surface of the nickel layer, and the thickness of the nickel layer is generally controlled at 5 ⁇ m.
  • the formation of the nickel layer greatly improves the protection and solderability;
  • the pin 11 of the present invention is a single pin, which is different from the entire row of pins of the prior art, because the circuit wiring 18 to which the pin 11 is fixed is only wrapped by a resin portion.
  • the impact strength is limited, and the separate pins avoid the process of cutting the ribs, and the systemic impact on the smart power module 10 of the present invention can be reduced.
  • the third process 906, refer to FIG. 5:
  • the third step 906 of the present invention is a step of the present invention. This step is a step of manufacturing the heat sink 15 and attaching the bottom of the L-type power element 14 to the heat sink 15.
  • the heat sink 15 can be designed as a copper sheet having a thickness of about 1.5 mm, which is formed by stamping or etching.
  • the copper sheet is silver plated by electroplating, and the thickness of the silver layer can be designed to be 22 to 30 ⁇ m.
  • the L-type power device 14 is a planar power device, and all the electrodes of the power device are located on the front side of the power device, and the front electrode is connected to the circuit wiring 18 in the following process.
  • the eutectic flatness of the power device 14 is controlled to be ⁇ 0.1 mm.
  • the fourth step 908 of the present invention is a process characterized by the present invention, in which the circuit wiring 18 is disposed on the chassis 16, and the circuit component 14 is flipped on the surface of the circuit wiring 18 and the pins are disposed.
  • a bottom plate 16 as shown in Fig. 6(A) is produced, and the bottom plate 16 can be made of high-strength stainless steel, and a recess 17 which is dug according to the shape of the circuit wiring 18 is formed on the surface of the bottom plate 16,
  • the width of the recess 17 is slightly larger than the width of the corresponding circuit trace 18, which has a depth of about 0.5 ounces.
  • the fabricated circuit wiring 18 is placed at the corresponding recess of the base 16, and is passed through a solder paste printing machine using a steel mesh.
  • the solder paste is applied to a specific position of the circuit wiring 18, and the steel mesh may have a thickness of 0.13 mm.
  • the circuit component 14 is formed by an apparatus such as an SMT machine or a DA machine, including the circuit component 14 on which the heat sink 15 has been disposed, and the mounting of the pin 11, which can be directly flipped over the circuit wiring 18.
  • the specific position, and the pin 11 is placed on the pad 18A at one end, and the carrier 20 is required to be fixed at the other end, and the carrier 20 is made of a material such as synthetic stone.
  • the circuit substrate 16 placed on the carrier 20 is reflowed, the solder paste is cured, and the circuit component 14 and the lead 11 are fixed.
  • the fifth step 910 of the present invention is a step of the present invention. Referring to Fig. 7, this step illustrates the step of sealing the circuit wiring 18 with the sealing resin 12.
  • FIG. 7 is a cross-sectional view showing a step of sealing the circuit wiring 18 carried by the base 16 with the sealing resin 12 using the mold 50.
  • the circuit wiring 18 is baked in an oxygen-free environment, the baking time should not be less than 2 hours, the baking temperature and the selection of 125 °C.
  • the base 16 on which the circuit board 18 is placed is transported to the models 44 and 45. By making a specific part of pin 11 The positioning of the circuit substrate 16 is performed by contacting the fixing device 46.
  • the circuit substrate 16 is placed in a cavity formed inside the mold 50, and then the sealing resin 12 is injected from the gate 53.
  • the method of performing the sealing can be carried out by transfer molding using a thermosetting resin or injection molding using a thermosetting resin. Further, the gas inside the cavity of the sealing resin 12 injected corresponding to the gate 103 is discharged to the outside through the exhaust port 54.
  • the upper mold 44 should be in contact with the heat sink 15, and the lower mold 45 should be in contact with the base 16.
  • the sixth step of the present invention is a process of performing the pin 11 molding and the module function test, and the intelligent power module is completed as a product through this process.
  • the portion other than the lead 11 is sealed by the resin 12. This step is required according to the length and shape used, for example, the outer lead 11 is bent into a shape at the position of the broken line 51 to facilitate subsequent assembly.
  • the pins 11 are independent of each other, some pins may not be on the same level after molding, which affects the contact, so it is generally necessary to first test the machine gold finger. Contact test with the pin. If the contact test does not pass, the pin 11 needs to be trimmed until the contact test passes, and then the electrical characteristic test is performed, including insulation withstand voltage, static power consumption, delay time, etc. For the project, the qualified person is the finished product.
  • the smart power module 10 shown in Fig. 1 is completed by the above steps.
  • the smart power module includes a circuit including a circuit wiring (circuit wiring) 18, a circuit component 14, and a heat sink 15, And a pin 11 disposed at an edge of the circuit wiring 18, and an insulating layer 19 and a circuit pattern 18C disposed on the heat sink 15, and a heat-sensitive element 21 disposed on the circuit wiring 18C, and sealing the circuit and completely covering The circuit component 14 and the sealing layer 12 on the upper surface of the circuit wiring 18.
  • 10(A) is a top plan view of the upper surface of the smart power module 10 of the present invention, the heat sink 15 is exposed from the upper surface, and FIG.
  • FIG. 10(B) is a cross section taken along line XX' of FIG. 10(A).
  • 10(C) is a plan view showing the sealing layer 12 covering the circuit component 14 removed, and
  • FIG. 10(D) is a top plan view of the smart power module 10 of the present invention, the circuit wiring 18 from below The surface is exposed.
  • the circuit wiring layer 18 serves as a carrier of the smart power module 10, the circuit wiring layer 18 having an upper surface and a lower surface opposite to the upper surface; the circuit component 14 is inverted and soldered to the circuit wiring layer 18. a predetermined position of the surface; a heat sink 15 is mounted on the power component in the circuit component 14, wherein the heat sink 15 is attached to the upper surface of the heat sink 15; the sealing layer 12 covers the upper surface of the circuit wiring layer 18 and The circuit component 18 is described and the surface of the thermal element 21 is exposed.
  • the power component is a planar power device, such as an IGBT transistor, and an LIGBT must be used.
  • the heat sink 15 is a heat sink, and the surface of the heat sink can be treated with silver plating to increase the wettability.
  • the sealing layer 12 is a sealing resin layer.
  • an insulating layer 19 is disposed on the upper surface of the heat sink 15, and a circuit pattern 18C is press-bonded on the insulating layer 19, and the heat-sensitive element 21 is disposed on the circuit pattern 18C.
  • the pin pad 18A On the near side of the circuit wiring 18, there is a special circuit wiring for configuring the pin 11, called the pin pad 18A.
  • the pin 11 pin pad 18A is connected and extends from the outside of the circuit wiring 18.
  • the surface of the lead 11 is covered with a plating layer.
  • the circuit wiring 18 is formed by stamping or etching a copper material having a thickness of 5 ounces or more. To prevent oxidation, the upper surface of the circuit wiring 18 may be subjected to gold plating treatment, and the circuit wiring 18 is provided for cost. The surface can also be silver plated or shipped in a vacuum or nitrogen-filled package with no treatment on the upper surface.
  • the circuit component 14 is flip-chip mounted on the circuit wiring 18.
  • the circuit element 14 uses an active element such as a transistor or a diode, or a passive element such as a capacitor or a resistor. Further, the heat sink 15 made of copper or the like is attached to the back surface of the element having a large amount of heat such as a power element.
  • the upper surface of the heat sink 15 is covered with an insulating layer 19, and the thickness of the insulating layer 19 can be designed to be 70 ⁇ m and a thermal conductivity of 2 W/(m ⁇ K).
  • the heat of the LIGBT is increased. It can be quickly transferred to the heat-sensitive element 21, the thickness of the insulating layer 19 can be reduced to 50 ⁇ m, and the thermal conductivity can be increased to 5 W/(m ⁇ K).
  • the insulating layer 19 is avoided.
  • the thin and uneven coating causes local breakdown during long-term use, and the thickness of the insulating layer 19 can be increased to 110 ⁇ m, and the thermal conductivity can be reduced to 1.5 W/(m ⁇ K) in order to balance the cost.
  • the upper surface of the insulating layer 19 is made of a copper foil to form the circuit pattern 18C.
  • One ounce of copper foil may be selected, the heat sensitive element 21 is disposed on the circuit pattern 18C, and the heat sensitive element 21 may be an NTC.
  • the resistor which may be a PTC resistor or other temperature sensing element, is used to monitor in real time the temperature change of the LIGBT tube disposed on the same heat sink 15 below it. In the present embodiment, both end elements are used, and a three-terminal element such as a PNP tube or an NPN tube may be used.
  • solder solder
  • the lead 11 is generally made of a metal such as copper.
  • the surface of the copper is formed by electroless plating and electroplating to form a layer of nickel-tin alloy.
  • the thickness of the alloy layer is generally 5 ⁇ m.
  • the plating layer protects the copper from corrosion and oxidation and improves solderability.
  • the sealing layer 12 may be molded by a transfer molding using a thermosetting resin or an injection molding using a thermoplastic resin.
  • the sealing layer 12 completely seals all the elements on one side of the circuit wiring 18 and wraps most of the depth of the circuit wiring 18, exposing only a small portion of the circuit wiring lower surface 18B, and the circuit wiring lower surface 18B is deep.
  • it can be considered to be designed to be about 0.5 ounce. If the depth of the lower surface 18B of the circuit wiring is too small, the present invention may be caused.
  • the smart power module 10 is difficult to be wrapped by solder such as solder paste in the subsequent soldering and fixing process.
  • the soldering tin height of the solder paste in the subsequent soldering and fixing process of the smart power module 10 of the present invention may not be
  • the circuit wiring lower surface 18B is completely wrapped; here, the heat sensitive element 21 is exposed from the sealing layer 12, and the electrode of the heat sensitive element 21 is exposed, so that it can be detected outside the smart power module 10.
  • the heat of the power component is quickly dissipated.
  • the beneficial effect of the intelligent power module is that the metal substrate is no longer needed, the circuit layer is fixed by the reusable bottom plate, and the final fixing by the resin eliminates the need for the metal bonding wire, thereby saving the cost, and the circuit wiring is back and
  • the heat sink is completely exposed outside the resin to maximize heat dissipation, the gap between the circuit wirings is completely exposed, moisture is difficult to adhere, and even if external moisture is invaded, it is difficult to form corrosion because there is no metal wire.
  • the thermal element and the power element are located on the upper and lower sides of the same heat sink, and the temperature sensitive element is exposed from the resin, so that the temperature of the power element can be detected in real time, thereby improving the safety of use of the smart power module.
  • a method for manufacturing the smart power module including the following steps:
  • Step S1110 using a metal plate to form a circuit wiring layer as a carrier;
  • Step S1120 assembling a circuit component on a surface of the circuit wiring layer, wherein the circuit component is assembled in an inverted manner;
  • Step S1120 mounting a heat sink on the power component in the circuit component, wherein the heat sink upper surface is provided with a heat sensitive component;
  • Step S1140 covering a surface of the circuit wiring layer with a sealing layer, covering the circuit component and exposing the surface of the thermal element.
  • Step S1140 specifically includes: providing a thermosetting resin frame around the surface of the circuit wiring layer; and injecting a thermoplastic resin into the range of the thermosetting resin frame to seal the circuit wiring layer and the circuit component.
  • step S1120 is also included before step S1120 .
  • the step specifically includes: selecting a copper substrate, forming a row of pins by punching or etching the copper substrate, connecting the pins through the ribs; forming a nickel layer and a nickel tin on the surface of the lead The alloy layer gives a plated lead.
  • step S1140 Also included before step S1140 is the step of removing the flux remaining in the insulating layer.
  • Positioning through the base reduces the difficulty of positioning during plastic sealing, and the bottom is completely exposed, which reduces the difficulty of controlling the parameter thickness difference between the upper and lower surfaces during the injection, eliminating the metal wire bonding and cleaning process, saving equipment investment and improving
  • the production efficiency reduces the process control requirements, the manufacturing difficulty of the intelligent power module is greatly reduced, the manufacturing yield is improved, and the cost of the intelligent power module is further reduced.
  • the method of manufacturing the smart power module includes the following steps.
  • the first step 1802 of the present invention is a step of the present invention, and the step is a step of forming a circuit wiring on a copper substrate having an appropriate size.
  • the circuit layout should not be larger than 64 mm ⁇ 30mm.
  • High-speed steel can also be used as the material by the boring tool.
  • the motor uses a speed of 5000 rpm, and the boring tool and the aluminum plane are at right angles to the specific shape of the lower stroke. It is also possible to etch a specific shape by a chemical reaction by an etching tool.
  • this specific shape is the circuit wiring 18.
  • a gold layer may be formed on the surface of the circuit wiring 18 by means of electroplating gold or chemical immersion gold.
  • the thickness of the copper plate used for manufacturing the circuit wiring 18 should be not less than 5 ounces, ensuring a larger contact area with the subsequent resin 12, so that the smart power module 10 is more fixed. effect.
  • the second step 1804 of the present invention is a step of the features of the present invention, and this step is a step of forming an independent lead 11 with a plating layer.
  • Each of the leads 11 is made of a copper substrate, and is formed into a strip shape having a length C of 25 mm, a width K of 1.5 mm, and a thickness H of 1 mm, as shown in Fig. 13(A); here, for ease of assembly, Pressing a certain arc at one end, as shown in Figure 13 (B);
  • a nickel layer is formed by electroless plating: a nickel layer is formed on the surface of the copper material having a specific shape by a mixed solution of a nickel salt and a sodium hypophosphite, and a suitable complexing agent is added, and the nickel metal is strong in the metal nickel. Passivation ability, can quickly form a very thin passivation film, resistant to atmospheric, alkali and some acid corrosion.
  • the nickel-plated crystal is extremely fine, and the thickness of the nickel layer is generally 0.1 ⁇ m;
  • the copper material having the formed shape and the nickel layer is immersed in the plating solution with the positive tin ions at room temperature to form a nickel-tin alloy layer on the surface of the nickel layer, and the thickness of the nickel layer is generally controlled at 5 ⁇ m.
  • the formation of the nickel layer greatly improves the protection and solderability;
  • the pin 11 of the present invention is a single pin, which is different from the entire row of pins of the prior art, because the circuit wiring 18 to which the pin 11 is fixed is only wrapped by a resin portion.
  • the impact strength is limited, and the separate pins avoid the process of cutting the ribs, and the systemic impact on the smart power module 10 of the present invention can be reduced.
  • copper sheets of different sizes such as 20 mm ⁇ 30 mm and 30 mm ⁇ 40 mm are designed.
  • the thickness of the copper sheet can be 2 mm in order to save cost, and it is also possible to improve heat dissipation. Is 3mm, through the rush It is made by pressing or etching.
  • the copper sheet is silver plated by electroplating.
  • the thickness of the silver layer can be designed to be 22-30 ⁇ m.
  • the insulating layer 19 and the copper foil are simultaneously pressed on one surface, and pressed at a high temperature. It is obtained by cooling at room temperature, and then the copper foil is etched to remove excess portions to form a desired circuit pattern 18C.
  • the combination of the heat sink, the insulating layer 19, and the circuit pattern 18C may be formed separately, or may be formed by integrally pressing a large profile, etching, and stamping.
  • the third step 1806 of the present invention is a step of the present invention. This step is a step of manufacturing the heat sink 15 and attaching the bottom of the L-type power element 14 to the heat sink 15.
  • the heat sink 15 can be designed as a copper sheet having a thickness of about 1.5 mm, and is formed by stamping or etching.
  • the copper sheet is plated by silver plating, and the thickness of the silver layer can be designed to be 22 to 30 ⁇ m.
  • the L-type power device 14 is a planar power device, and all the electrodes of the power device are located on the front side of the power device, and the front electrode is connected to the circuit wiring 18 in the following process.
  • the eutectic flatness of the power device 14 is controlled to be ⁇ 0.1 mm.
  • the third step 1806 of the present invention is a process characterized by the present invention, in which the circuit wiring 18 is disposed on the chassis 16, and the circuit component 14 is flipped on the surface of the circuit wiring 18 and the pins are disposed.
  • a bottom plate 16 as shown in Fig. 15(A) is produced.
  • the bottom plate 16 can be made of high-strength stainless steel.
  • the width of the recess 17 is slightly larger than the width of the corresponding circuit trace 18, which has a depth of about 0.5 ounces.
  • the fabricated circuit wiring 18 is placed at the corresponding recess of the bottom plate 16, and through a solder paste printing machine, using a steel mesh, The solder paste is applied to a specific position of the circuit wiring 18, and the steel mesh may have a thickness of 0.13 mm.
  • the circuit component 14 is formed by an apparatus such as an SMT machine or a DA machine, including the circuit component 14 on which the heat sink 15 has been disposed, and the mounting of the pin 11, which can be directly flipped over the circuit wiring 18
  • the specific position, and the pin 11 is placed on the pad 18A at one end, and the carrier 20 is required to be fixed at the other end, and the carrier 20 is made of a material such as synthetic stone.
  • the thermal element 21 is placed on the circuit pattern 18C by an SMT machine or a DA machine.
  • the bottom plate 16 placed on the carrier 20 is reflowed, the solder paste is cured, and the circuit component 14 and the lead 11 are fixed.
  • the fifth step 1810 of the present invention is a process characterized by the present invention. Referring to Figure 16, the process is illustrated by a sealed tree. The process of sealing the circuit wiring 18 by the grease 12. FIG. 16 is a cross-sectional view showing a step of sealing the circuit wiring 18 carried by the bottom plate 16 with a sealing resin using the mold 50.
  • the circuit wiring 18 is baked in an oxygen-free environment, the baking time should not be less than 2 hours, the baking temperature and the selection of 125 °C.
  • the bottom plate 16 on which the circuit wiring 18 is disposed is transported to the models 44 and 45.
  • the positioning of the bottom plate 16 is performed by bringing a specific portion of the pin 11 into contact with the fixture 46.
  • the bottom plate 16 is placed in a cavity formed inside the mold 50, and then the sealing resin is injected from the gate 53 to form the sealing layer 12.
  • the method of performing the sealing can be carried out by transfer molding using a thermosetting resin or injection molding using a thermosetting resin. Further, the gas inside the cavity of the sealing resin 12 injected corresponding to the gate 103 is discharged to the outside through the exhaust port 54.
  • the upper mold 44 should be in contact with the heat-sensitive element 21, and the lower mold 45 should be in contact with the bottom plate 16.
  • the sixth step 1812 of the present invention is a step of performing the pin 11 molding and the module function test, and the smart power module is completed as a product through this process.
  • the portion other than the lead 11 is sealed by the resin 12. This step is required according to the length and shape used, for example, the outer lead 11 is bent into a shape at the position of the broken line 51 to facilitate subsequent assembly.
  • the pins 11 are independent of each other, some pins may not be on the same level after molding, which affects the contact, so it is generally necessary to first test the machine gold finger. Contact test with the pin. If the contact test does not pass, the pin 11 needs to be trimmed until the contact test passes, and then the electrical characteristic test is performed, including insulation withstand voltage, static power consumption, delay time, etc. For the project, the qualified person is the finished product.
  • the smart power module 10 shown in Fig. 11 is completed by the above steps.
  • the smart power module includes a circuit wiring layer (circuit wiring) 18, a circuit component 14, a temperature sensing component 19, and heat dissipation.
  • a circuit 15 is constructed, and a pin 11 disposed at an edge of the circuit wiring layer 18, and a sealing layer 12 that seals the circuit and completely covers the circuit element 14 and the upper surface of the circuit wiring 18.
  • 19(A) is a top plan view of the smart power module 10 of the present invention, the heat sink 15 is exposed from the upper surface
  • FIG. 19(B) is a cross section taken along line XX' of FIG. 19(A).
  • 19(C) is a plan view showing the sealing layer 12 covering the circuit component 14 removed
  • FIG. 19(D) is a top plan view of the smart power module 10 of the present invention, the circuit wiring 18 from below The surface is exposed.
  • the circuit wiring layer 18 serves as a carrier of the smart power module 10, and the circuit wiring layer 18 has an upper surface. And a lower surface opposite to the upper surface; the circuit component 14 is inverted and soldered to a predetermined position on the upper surface of the circuit wiring layer 18; the upper surface of the power component in the circuit component 14 is mounted with a heat sink 15, and the lower surface is mounted There is a temperature sensing element 19; a sealing layer 12 covers the upper surface of the circuit wiring layer 18 and the circuit component 18, and exposes a portion of the surface of the heat sink 15 to the surface. .
  • the electrode 19A of the temperature sensing element 19 is exposed from the lower surface of the circuit wiring layer 18, and the power element is a planar power device, such as an IGBT tube, and an LIGBT must be used.
  • the heat sink 15 is a heat sink, and the surface of the heat sink can be treated with silver plating to increase the wettability.
  • the sealing layer 12 is a sealing resin layer.
  • a pin pad 18A there is a special circuit wiring for configuring the pin 11, which is referred to as a pin pad 18A.
  • the pin 11 pin pad 18A is connected and extends from the outside of the circuit wiring 18.
  • the surface of the pin 11 is covered with a plating layer, and the temperature sensing element 19 is mounted on one of the electrodes of the power element through the non-conductive gel 13.
  • the circuit wiring 18 is formed by stamping or etching a copper material having a thickness of 5 ounces or more. To prevent oxidation, the upper surface of the circuit wiring 18 may be subjected to gold plating treatment, and the circuit wiring 18 is provided for cost. The surface can also be silver plated or shipped in a vacuum or nitrogen-filled package with no treatment on the upper surface.
  • the circuit component 14 is flip-chip mounted on the circuit wiring 18.
  • the circuit element 14 uses an active element such as a transistor or a diode, or a passive element such as a capacitor or a resistor. Further, the heat sink 15 made of copper or the like is attached to the back surface (upper surface) of the element having a large amount of heat such as a power element.
  • the temperature sensing element 19 is mounted on a complete electrode on the surface of the power component, such as an emitter, and the surface of the emitter is coated with a non-conductive material such as red glue.
  • the temperature sensing element 19 is mounted on the red glue, and the red glue is fixed by the high temperature baking solidification.
  • an element having a thickness of about 0.15 mm such as an NTC resistor, a PTC resistor or the like, should be selected such that the position of the outer electrode 19A of the temperature sensing element after the assembly is completed is substantially equal to the thickness of the circuit wiring 18, that is, The outer electrode 19A of the temperature sensing element does not protrude from the lower surface of the circuit wiring 18.
  • solder solder
  • the lead 11 is generally made of a metal such as copper.
  • the surface of the copper is formed by electroless plating and electroplating to form a layer of nickel-tin alloy.
  • the thickness of the alloy layer is generally 5 ⁇ m.
  • the plating layer protects the copper from corrosion and oxidation and improves solderability.
  • the sealing layer 12 may be molded by a transfer molding using a thermosetting resin or an injection molding using a thermoplastic resin.
  • the sealing layer 12 completely seals all the elements of the upper surface of the circuit wiring 18 and wraps most of the depth of the circuit wiring 18, exposing only a small portion of the lower surface of the circuit wiring, and the depth of the surface of the circuit wiring is generally Considering that the design is about 0.5 ounces, if the depth of the surface of the circuit wiring is too small, it may cause the smart power module 10 of the present invention to be difficult to be wrapped by solder such as solder paste in the subsequent soldering and fixing process.
  • the surface depth of the circuit wiring is too large, it may be The soldering height of the solder paste in the subsequent soldering and fixing process of the intelligent power module 10 of the present invention cannot completely wrap the circuit cloth.
  • the lower surface of the wire; here, the heat sink 15 is exposed from the sealing layer 12, so that the heat of the power element is quickly dissipated.
  • the beneficial effect of the intelligent power module is that the metal substrate is no longer needed, the circuit layer is fixed by the reusable bottom plate, and the final fixing by the resin eliminates the need for the metal bonding wire, thereby saving the cost, and the circuit wiring is back and
  • the heat sink is completely exposed outside the resin to maximize the heat dissipation effect, the gap between the circuit wiring is completely exposed, the moisture is difficult to adhere, and even if the external moisture is invaded, since there is no metal wire, it is difficult to form corrosion, and the temperature is sensitive.
  • the component is directly mounted on the surface of the high-power circuit component, and the temperature of the high-power power circuit component can be monitored in real time, and the temperature sensing component is housed in the circuit wiring layer and receives the protection of the circuit wiring layer.
  • a method of manufacturing the smart power module including the following steps:
  • Step S2010 using a metal plate to form a circuit wiring layer as a carrier;
  • Step S2020 assembling a circuit component on a surface of the circuit wiring layer, wherein the circuit component is assembled in an inverted manner, wherein a surface of the power component of the circuit component is mounted with a heat sink, and a feeling of the lower surface is attached.
  • a temperature element in particular, the temperature sensing element is mounted on one of the electrodes of the power element by a non-conductive gel
  • Step S2030 coating a surface of the circuit wiring layer with a sealing layer to cover the circuit component and expose at least part of the surface of the heat sink.
  • Step S2030 specifically includes: providing a thermosetting resin frame around the surface of the circuit wiring layer; and injecting a thermoplastic resin into the range of the thermosetting resin frame to seal the circuit wiring layer and the circuit component.
  • step S2020 Also included prior to step S2020 is the step of making separate, coated pins.
  • the step specifically includes: selecting a copper substrate, forming a row of pins by punching or etching the copper substrate, connecting the pins through the ribs; forming a nickel layer and a nickel tin on the surface of the lead The alloy layer gives a plated lead.
  • the method further includes the step of removing the flux remaining in the insulating layer.
  • Positioning through the base reduces the difficulty of positioning during plastic sealing, and the bottom is completely exposed, which reduces the difficulty of controlling the parameter thickness difference between the upper and lower surfaces during the injection, eliminating the metal wire bonding and cleaning process, saving equipment investment and improving
  • the production efficiency reduces the process control requirements, the manufacturing difficulty of the intelligent power module is greatly reduced, the manufacturing yield is improved, and the cost of the intelligent power module is further reduced.
  • the method of manufacturing the smart power module includes the following steps.
  • the first process 2702 refers to FIGS. 21(A) and 21(B):
  • the first step 2702 of the present invention is a step of the present invention, and the step is a step of forming a circuit wiring on a copper substrate having an appropriate size.
  • the circuit layout should not be larger than 64 mm ⁇ 30mm.
  • High-speed steel can also be used as a material by a file, and the motor uses 5000 rpm, ⁇
  • the knife and the aluminum plane are at right angles to the specific shape of the knife stroke. It is also possible to etch a specific shape by a chemical reaction by an etching tool.
  • this specific shape is the circuit wiring 18.
  • a gold layer may be formed on the surface of the circuit wiring 18 by means of electroplating gold or chemical immersion gold.
  • the thickness of the copper plate used for manufacturing the circuit wiring 18 should be not less than 5 ounces, ensuring a larger contact area with the subsequent resin 12, so that the smart power module 10 is more fixed. effect.
  • the second step 2704 of the present invention is a step of the present invention, and this step is a step of forming an independent lead 11 with a plating layer.
  • Each of the leads 11 is made of a copper substrate, and is formed into a strip shape having a length C of 25 mm, a width K of 1.5 mm, and a thickness H of 1 mm, as shown in Fig. 22(A); here, for ease of assembly, Pressing a certain arc at one end, as shown in Figure 22 (B);
  • a nickel layer is formed by electroless plating: a nickel layer is formed on the surface of the copper material having a specific shape by a mixed solution of a nickel salt and a sodium hypophosphite, and a suitable complexing agent is added, and the nickel metal is strong in the metal nickel. Passivation ability, can quickly form a very thin passivation film, resistant to atmospheric, alkali and some acid corrosion.
  • the nickel-plated crystal is extremely fine, and the thickness of the nickel layer is generally 0.1 ⁇ m;
  • the copper material having the formed shape and the nickel layer is immersed in the plating solution with the positive tin ions at room temperature to form a nickel-tin alloy layer on the surface of the nickel layer, and the thickness of the nickel layer is generally controlled at 5 ⁇ m.
  • the formation of the nickel layer greatly improves the protection and solderability;
  • the pin 11 of the present invention is a single pin, which is different from the entire row of pins of the prior art, because the circuit wiring 18 to which the pin 11 is fixed is only wrapped by a resin portion.
  • the impact strength is limited, and the separate pins avoid the process of cutting the ribs, and the systemic impact on the smart power module 10 of the present invention can be reduced.
  • the third process 2706 refer to FIG. 23:
  • the third step 2706 of the present invention is a step of the present invention.
  • the heat sink 15 is manufactured, and the bottom of the L-type power element 14 is placed on the heat sink 15, and the temperature sensing element 19 is attached. Process on power component 14.
  • the heat sink 15 can be designed as a copper sheet having a thickness of about 1.5 mm, and is formed by stamping or etching.
  • the copper sheet is plated by silver plating, and the thickness of the silver layer can be designed to be 22 to 30 ⁇ m.
  • the L-type power device 14 is a planar power The device, all of the electrodes of such a power device are located on the front side (lower surface) of the power device, and the front electrode is connected to the circuit wiring 18 in the following process.
  • the non-conductive gel 13 is applied on the lower surface of the power component 14 by dispensing or dispensing, and the coating area of the non-conductive gel 13 should be More than the area of the temperature sensing element 19, the temperature sensing element 19 is placed on the surface of the non-conductive gel 13 by the DA machine, in particular, the temperature sensing element 19 electrode 19A cannot be in conductive contact with the electrode of the power element 14, and all need to fall in the non-conductive condensation.
  • the baking temperature is determined according to the material of the non-conductive gel 13 used. Generally, the baking temperature should be about 125 ° C, and the baking time is 1-2 hours, so that the gel is completely solidification.
  • the eutectic flatness of the power device 14 is controlled to be ⁇ 0.1 mm.
  • the fourth step 2708 of the present invention is a process characterized by the present invention, in which the circuit wiring 18 is disposed on the substrate 16, and the circuit component 14 is flipped on the surface of the circuit wiring 18 and the pins are disposed.
  • a bottom plate 16 as shown in Fig. 24(A) is produced.
  • the bottom plate 16 can be made of high-strength stainless steel.
  • the fabricated circuit wiring 18 is placed at the corresponding recess of the bottom plate 16, and through a solder paste printing machine, using a steel mesh, The solder paste is applied to a specific position of the circuit wiring 18, and the steel mesh may have a thickness of 0.13 mm.
  • the circuit component 14 is formed by an apparatus such as an SMT machine or a DA machine, including the circuit component 14 on which the heat sink 15 has been disposed, and the mounting of the pin 11, which can be directly flipped over the circuit wiring 18
  • the specific position, and the pin 11 is placed on the pad 18A at one end, and the carrier 20 is required to be fixed at the other end, and the carrier 20 is made of a material such as synthetic stone.
  • the bottom plate 16 placed on the carrier 20 is reflowed, the solder paste is cured, and the circuit component 14 and the lead 11 are fixed.
  • the non-conductive gel 13 does not generally melt, and, due to the presence of the bottom plate 16, even if the non-conductive gel 13 softens, the relative position of the temperature sensing element 19 does not The change occurs, and after the reflow process is finished, the non-conductive gel 13 is hardened again, and the temperature sensing element 19 does not fall off.
  • the fifth step 2710 of the present invention is a step of the present invention. Referring to Fig. 25, this step illustrates the step of sealing the circuit wiring 18 by the sealing layer 12.
  • FIG. 25 is a cross-sectional view showing a step of sealing the circuit wiring 18 carried by the bottom plate 16 with a sealing resin using a mold 50.
  • the circuit wiring 18 is baked in an oxygen-free environment, the baking time should not be less than 2 hours, the baking temperature and the selection of 125 °C.
  • the bottom plate 16 on which the circuit wiring 18 is disposed is transported to the models 44 and 45.
  • the positioning of the circuit substrate 16 is performed by bringing a specific portion of the pin 11 into contact with the fixture 46.
  • the bottom plate 16 is placed in a cavity formed inside the mold 50, and then the sealing resin is injected from the gate 53 to form the sealing layer 12.
  • the method of performing the sealing can be carried out by transfer molding using a thermosetting resin or injection molding using a thermosetting resin. Further, the gas inside the cavity of the sealing resin 12 injected corresponding to the gate 103 is discharged to the outside through the exhaust port 54.
  • the upper mold 44 should be in contact with the heat sink 15, and the lower mold 45 should be in contact with the bottom plate 16.
  • the sixth step 2712 of the present invention is a step of performing the pin 11 molding and the module function test, and the intelligent power module is completed as a product through this process.
  • the portion other than the lead 11 is sealed by the resin 12. This step is required according to the length and shape used, for example, the outer lead 11 is bent into a shape at the position of the broken line 51 to facilitate subsequent assembly.
  • the pins 11 are independent of each other, some pins may not be on the same level after molding, which affects the contact, so it is generally necessary to first test the machine gold finger. Contact test with the pin. If the contact test does not pass, the pin 11 needs to be trimmed until the contact test passes, and then the electrical characteristic test is performed, including insulation withstand voltage, static power consumption, delay time, etc. For the project, the qualified person is the finished product.
  • the smart power module 10 shown in Fig. 20 is completed by the above steps.
  • the manufacturing method of the invention has the advantages that the positioning by the base reduces the difficulty of positioning during the plastic sealing, and the bottom is completely exposed, which reduces the difficulty of controlling the parameters of the thickness difference between the upper and lower surfaces during the injection, and eliminates the bonding of the metal wires.
  • the cleaning process saves equipment investment, improves production efficiency, reduces process control requirements, greatly reduces the manufacturing difficulty of the intelligent power module, improves the manufacturing yield, and further reduces the cost of the intelligent power module.
  • the smart power module includes a circuit wiring layer (circuit wiring) 18, a driving element 14, a power element 14A, and a heat sink. a circuit constructed by 15, a ball 19 for electrically contacting the circuit wiring layer 18 with the driving element 14 and the power element 14A, and a pin 11 disposed at an edge of the circuit wiring layer 18, and sealing the circuit and completely covering the The circuit component 14 and the sealing layer 12 on the upper surface of the circuit wiring 18.
  • 28(A) is a top plan view of the smart power module 10 of the present invention, the heat sink 15 is exposed from the upper surface
  • FIG. 28(B) is a cross section taken along line XX' of FIG. 28(A).
  • Figure 28 (C) is to remove the cover circuit component 14
  • FIG. 28(D) is a plan view of the lower surface of the smart power module 10 of the present invention, and the circuit wiring 18 is exposed from the lower surface.
  • the circuit wiring layer 18 serves as a carrier of the smart power module 10, the circuit wiring layer 18 having an upper surface and a lower surface opposite to the upper surface; circuit components are reversed and soldered to the upper surface of the circuit wiring layer 18.
  • the circuit component includes a power component 14A and a driving component 14 of the power component 14A, the power component 14A and the driving component 14 being electrically connected to the circuit wiring layer 18 through the ball 19; the heat sink 15 is mounted on the power component
  • the upper surface of the circuit wiring layer 18 and the circuit component are covered by the sealing layer 12, and a part of the surface of the heat sink 15 is exposed.
  • the power element 14A is a planar power device, such as an IGBT tube, and an LIGBT must be used.
  • the heat sink 15 is a heat sink, and the surface of the heat sink can be treated with silver plating to increase the wettability.
  • the sealing layer 12 is a sealing resin layer.
  • the drive element 14 is located between the lower surface of the power element 14A and the upper surface of the circuit wiring 18 layer.
  • a pin pad 18A there is a special circuit wiring for configuring the pin 11, which is referred to as a pin pad 18A.
  • the pin 11 pin pad 18A is connected and extends from the outside of the circuit wiring 18.
  • the surface of the lead 11 is covered with a plating layer.
  • the circuit wiring 18 is formed by stamping or etching a copper material having a thickness of 5 ounces or more. To prevent oxidation, the upper surface of the circuit wiring 18 may be subjected to gold plating treatment, and the circuit wiring 18 is provided for cost. The surface can also be silver plated or shipped in a vacuum or nitrogen-filled package with no treatment on the upper surface.
  • the circuit component is flip-chip mounted on the circuit wiring 18.
  • the circuit element uses an active element such as a transistor or a diode, or a passive element such as a capacitor or a resistor. Further, the heat sink 15 made of copper or the like is attached to the back surface of the element having a large amount of heat such as the power element 14A.
  • the heat sink 15 made of copper or the like is mounted on the back surface of the element having a large amount of heat such as the power element 14A.
  • the power element 14A is generally an IGBT tube or a MOS tube; the driving element 14 is mounted on the circuit wiring layer 18, and the driving element 14 is a driving circuit of an IGBT tube and a MOS tube, and is generally a high voltage integrated circuit.
  • the drive element 14 further includes a temperature sensing device, and the temperature sensing device on the drive element 14 can monitor the temperature of the power element 14A in real time and further reduce the module area.
  • a ball point 18B is disposed at a specific position on the upper surface of the circuit wiring layer 18, and the driving element 14 is reversely fitted on the ball point 18B of the circuit wiring 18.
  • the height of the ball 19 in contact with the power element 14A is higher than the height of the ball 19 in contact with the driving element 14, generally 400 ⁇ About 500 ⁇ m.
  • solder solder
  • Pin 11 is generally made of metal such as copper, and the surface of the copper is formed by electroless plating and electroplating to form a layer of nickel-tin alloy.
  • the thickness of the layer is generally 5 ⁇ m, and the plating layer protects the copper from corrosion by oxidation and improves solderability.
  • the sealing layer 12 may be molded by a transfer molding using a thermosetting resin or an injection molding using a thermoplastic resin.
  • the sealing layer 12 completely seals all the elements on one side of the circuit wiring 18 and wraps most of the depth of the circuit wiring 18, exposing only a small portion of the lower surface of the circuit wiring, and the depth of the lower surface of the circuit wiring is generally Considering that the design is about 0.5 ounces, if the depth of the surface of the circuit wiring is too small, it may cause the smart power module 10 of the present invention to be difficult to be wrapped by solder such as solder paste in the subsequent soldering and fixing process.
  • the surface depth of the circuit wiring is too large, it may be The soldering height of the solder paste in the subsequent soldering and fixing process of the smart power module 10 of the present invention cannot completely wrap the lower surface of the circuit wiring; here, the heat sink 15 is exposed from the sealing layer 12, so that the heat of the power component 14A is quickly Lost.
  • the beneficial effect of the intelligent power module is that the metal substrate is no longer needed, the circuit layer is fixed by the reusable bottom plate, and the final fixing by the resin eliminates the need for the metal bonding wire, thereby saving the cost, and the circuit wiring is back and
  • the heat sink is completely exposed outside the resin to maximize the heat dissipation effect, the gap between the circuit wirings is completely exposed, the moisture is hard to adhere, and even if the external moisture is invaded, it is difficult to form corrosion because the metal wire is no longer present.
  • the driving component is directly mounted on the surface of the power component, and the temperature sensing device on the driving component can monitor the temperature of the high power power circuit component in real time and further reduce the module area.
  • a method of manufacturing the smart power module including the following steps:
  • Step S2910 using a metal plate to form a circuit wiring layer as a carrier;
  • Step S2920 assembling a circuit component on a surface of the circuit wiring layer, wherein the circuit component is assembled in an inverted manner, the circuit component including a power component and a driving component of the power component, the power component and the driving component Electrically connecting to the circuit wiring layer by ball implantation;
  • Step S2930 mounting a heat sink on the power component 14A;
  • Step S2940 covering a surface of the circuit wiring layer with a sealing layer, covering the circuit component and exposing at least part of the surface of the heat sink.
  • Step S2940 specifically includes: providing a thermosetting resin frame around the surface of the circuit wiring layer; and injecting a thermoplastic resin into the range of the thermosetting resin frame to seal the circuit wiring layer and the circuit component.
  • step S2920 is also included before step S2920.
  • the step specifically includes: selecting a copper substrate, forming a row of pins by punching or etching the copper substrate, connecting the pins through the ribs; forming a nickel layer and a nickel tin on the surface of the lead The alloy layer gives a plated lead.
  • step S2940 Also included before step S2940 is the step of removing the flux remaining in the insulating layer.
  • Positioning through the base reduces the difficulty of positioning during plastic sealing, and the bottom is completely exposed, which reduces the difficulty of controlling the parameter thickness difference between the upper and lower surfaces during the injection, eliminating the metal wire bonding and cleaning process, saving equipment investment and improving Production efficiency, reducing process control requirements, making the manufacturing difficulty of intelligent power modules significantly reduced, manufacturing yield is improved, One step reduces the cost of intelligent power modules.
  • the method of manufacturing the smart power module includes the following steps.
  • the first step 3602 of the present invention is a step of the present invention, and the step is a step of forming a circuit wiring on a copper substrate having an appropriate size.
  • the circuit layout should not be larger than 64 mm ⁇ 30mm.
  • High-speed steel can also be used as the material by the boring tool.
  • the motor uses a speed of 5000 rpm, and the boring tool and the aluminum plane are at right angles to the specific shape of the lower stroke. It is also possible to etch a specific shape by a chemical reaction by an etching tool.
  • this specific shape is the circuit wiring 18.
  • a gold layer may be formed on the surface of the circuit wiring 18 by means of electroplating gold or chemical immersion gold.
  • the thickness of the copper plate used for manufacturing the circuit wiring 18 should be not less than 5 ounces, ensuring a larger contact area with the subsequent resin 12, so that the smart power module 10 is more fixed. effect.
  • the second step 3604 of the present invention is a step of the present invention, and the step is a step of forming an independent lead 11 with a plating layer.
  • Each of the leads 11 is made of a copper substrate, and is formed into a strip shape having a length C of 25 mm, a width K of 1.5 mm, and a thickness H of 1 mm, as shown in Fig. 31 (A); here, for ease of assembly, Pressing a certain arc at one end, as shown in Figure 31 (B);
  • a nickel layer is formed by electroless plating: a nickel layer is formed on the surface of the copper material having a specific shape by a mixed solution of a nickel salt and a sodium hypophosphite, and a suitable complexing agent is added, and the nickel metal is strong in the metal nickel. Passivation ability, can quickly form a very thin passivation film, resistant to atmospheric, alkali and some acid corrosion.
  • the nickel-plated crystal is extremely fine, and the thickness of the nickel layer is generally 0.1 ⁇ m;
  • the copper material having the formed shape and the nickel layer is immersed in the plating solution with the positive tin ions at room temperature to form a nickel-tin alloy layer on the surface of the nickel layer, and the thickness of the nickel layer is generally controlled at 5 ⁇ m.
  • the formation of the nickel layer greatly improves the protection and solderability;
  • the pin 11 of the present invention is a single pin, which is different from the entire row of pins of the prior art, because the circuit wiring 18 to which the pin 11 is fixed is only wrapped by a resin portion. , limited impact strength, alone The pins avoid the process of cutting the ribs, and the systemic impact on the smart power module 10 of the present invention can be reduced.
  • the third process 3606, refer to FIG. 32:
  • the third step 3606 of the present invention is a step of the present invention.
  • the heat sink 15 is manufactured, and the back surface (upper surface) of the L-type power element 14A is mounted on the heat sink 15 to be driven.
  • the heat sink 15 can be designed as a copper sheet having a thickness of about 1.5 mm, and is formed by stamping or etching.
  • the copper sheet is plated by silver plating, and the thickness of the silver layer can be designed to be 22 to 30 ⁇ m.
  • the L-type power device 14 is a planar power device, and all the electrodes of the power device are located on the front side of the power device, and the front electrode is connected to the circuit wiring 18 in the following process.
  • the non-conductive gel is applied on the surface of the power component 14A by dispensing or dispensing, and the coated area of the gel is slightly smaller than the area of the driving component 14.
  • the driving component 14 is placed on the surface of the gel by a DA machine.
  • the driving component 14 avoids contact with the electrodes of the power component 14 as much as possible even if the back surface is a Si material, to avoid accidents, if the back surface of the driving component 14 is a metal material.
  • the contact with the electrode of the power component 14 should be avoided; then, the baking temperature is determined according to the material of the gel used. Generally, the baking temperature should be about 125 ° C, and the baking time is 1-2 hours.
  • the gel is completely solidified.
  • the eutectic flatness of the power device 14 is controlled to be ⁇ 0.1 mm.
  • the fourth step 3608 of the present invention is a step of the present invention.
  • the circuit wiring 18 is placed on the substrate 16, and the circuit element is flipped on the surface of the circuit wiring 18 and the lead 11 is disposed.
  • a bottom plate 16 as shown in Fig. 33(A) is produced.
  • the bottom plate 16 can be made of high-strength stainless steel.
  • the width of the recess 17 is slightly larger than the width of the corresponding circuit trace 18, which has a depth of about 0.5 ounces.
  • the fabricated circuit wiring 18 is placed at the corresponding recess of the bottom plate 16, and through a solder paste printing machine, using a steel mesh,
  • the specific position of the circuit wiring 18, the lead pad 18A and the ball point 18B, are solder-coated, and the steel mesh can be used with a thickness of 0.13 mm to 0.20 mm.
  • the ball placement point 19B is applied to the ball point 18B at a specific position of the circuit wiring 18, where the ball 19 is a "solder paste" + "tin ball” manner, and the position of each ball point 18B is made through the hole of the steel mesh.
  • tin balls There are tin balls, and it should be noted that the height of the solder balls is different.
  • the bottom plate 16 placed on the carrier 20 is reflowed, the solder paste is cured, and the circuit component and the lead 11 are fixed.
  • the reflux time generally does not exceed 10 minutes, the gel generally does not melt, and, due to the presence of the bottom plate 16, even if the gel softens, the relative position of the driving member 14 does not change, at the end of the reflow process. Thereafter, the gel re-hardens and the drive element 14 does not peel off from the power element 14A.
  • the fifth step 3610 of the present invention is a step of the present invention.
  • this step is a step of sealing the circuit wiring 18 with the sealing resin 12.
  • FIG. 34 is a cross-sectional view showing a step of sealing the circuit wiring 18 carried by the bottom plate 16 with a sealing resin using a mold 50.
  • the circuit wiring 18 is baked in an oxygen-free environment, the baking time should not be less than 2 hours, the baking temperature and the selection of 125 °C.
  • the bottom plate 16 on which the circuit wiring 18 is disposed is transported to the models 44 and 45.
  • the positioning of the circuit substrate 16 is performed by bringing a specific portion of the pin 11 into contact with the fixture 46.
  • the bottom plate 16 is placed in a cavity formed inside the mold 50, and then the sealing resin is injected from the gate 53 to form the sealing layer 12.
  • the method of performing the sealing can be carried out by transfer molding using a thermosetting resin or injection molding using a thermosetting resin. Further, the gas inside the cavity of the sealing resin 12 injected corresponding to the gate 103 is discharged to the outside through the exhaust port 54.
  • the upper mold 44 should be in contact with the heat sink 15, and the lower mold 45 should be in contact with the bottom plate 16.
  • the sixth step 3612 of the present invention is a step of performing the pin 11 molding and the module function test, and the smart power module is completed as a product through this process.
  • the portion other than the lead 11 is sealed by the resin 12. This step is required according to the length and shape used, for example, the outer lead 11 is bent into a shape at the position of the broken line 51 to facilitate subsequent assembly.
  • the pins 11 are independent of each other, some pins may not be on the same level after molding, which affects the contact, so it is generally necessary to first test the machine gold finger.
  • Contact test with the pin if the contact test does not pass, the pin 11 needs to be trimmed until the contact test After passing, the electrical characteristics test, including insulation withstand voltage, static power consumption, delay time and other test items, the test is qualified.
  • the smart power module 10 shown in Fig. 29 is completed by the above steps.
  • An intelligent power module 100 in accordance with an embodiment of the present invention will now be described with reference to FIGS. 37-50.
  • an intelligent power module 100 includes a circuit wiring 1, a plurality of circuit elements 2, and a sealing resin 3.
  • At least one end portion of the circuit wiring 1 (for example, the front end in FIG. 39) is provided with pads 11 for electrical connection with an external circuit.
  • pads 11 for electrical connection with an external circuit.
  • the pad 11 may be formed in a square structure, and the longitudinal cross-sectional area of the pad 11 is preferably larger than the longitudinal cross-sectional area of the end portion of the circuit wiring 1. Thereby, the contact area of the pad 11 with the external circuit can be increased, and the reliability of the connection of the smart power module 100 to the external circuit is improved.
  • the pad 11 is integrally formed with the circuit wiring 1.
  • the process is simple, the processing is convenient and the processing cost is low.
  • a plurality of circuit elements 2 are provided on the upper surface of the circuit wiring 1, and the plurality of circuit elements 2 are electrically connected to the circuit wiring 1 through the metal wires 4, respectively.
  • the circuit component 2 may be an active component such as a transistor or a diode, or may be a passive component such as a capacitor or a resistor.
  • the circuit component 2 can be mounted on the upper surface of the circuit wiring 1. Specifically, the circuit component 2 can be fixed on the circuit wiring 1 by solder paste. The front side of the circuit component 2 is mounted upward, and the circuit component 2 is electrically connected to the circuit wiring 1 via a metal wire 4.
  • one end of the metal wire 4 is connected to the upper surface of the circuit component 2, and the other end of the metal wire 4 is connected to the circuit component 2. It can be understood that the metal wire 4 can also be used for electrical connection between the circuit component 2 and the circuit component 2, between the circuit wiring 1 and the circuit wiring 1.
  • the sealing resin 3 is provided on the circuit wiring 1.
  • the sealing resin 3 is used to encapsulate the circuit wiring 1 to protect the circuit wiring 1 and the circuit component 2 on the circuit wiring 1, improving the reliability of the smart power module 100.
  • the sealing resin 3 may be molded by a transfer mold using a thermosetting resin, or may be molded using a thermoplastic resin using an injection mold.
  • the smart power module 100 eliminates the outward extension of the smart power module 100 in the related art by providing the pads 11 at the ends of the circuit wiring 1 and electrically connecting them to the external circuits through the pads 11.
  • the pin avoids the short circuit caused by the condensation on the pin, improves the reliability of the smart power module 100, prolongs the service life of the smart power module 100, and reduces the use cost.
  • the structure and processing process of the smart power module 100 are simplified, and the processing cost of the smart power module 100 is reduced, thereby further reducing the overall cost of the smart power module 100.
  • the sealing resin 3 covers the upper surface of the circuit wiring 1 and the upper portion of the side surface of the circuit wiring 1, and the lower portion of the side surface of the circuit wiring 1 and the lower surface of the circuit wiring 1 are exposed outside the sealing resin 3.
  • the sealing resin 3 may completely cover the circuit component 2 and the metal wire 4 on the upper surface of the circuit wiring 1, and cover most of the height of the side surface of the circuit wiring 1, the circuit wiring 1 The small portion of the lower portion of the side and the lower surface of the circuit wiring 1 are exposed outside the sealing resin 3.
  • the heat dissipation performance of the smart power module 100 can be effectively improved, the heat accumulation inside the smart power module 100 can be avoided, and the gap between the circuit wires 1 can be completely exposed, thereby making it difficult for moisture to adhere to the circuit wiring 1
  • the ions inside the intelligent power module 100 in a high-temperature and high-humidity environment are effectively avoided, for example, chloride ions, bromide ions, etc., which are caused by the migration of water vapor to cause corrosion to the circuit, and the circuit and circuit components of the circuit wiring 1 are avoided.
  • the short circuit of the circuit further improves the reliability of the smart power module 100, prolongs the service life of the smart power module 100, and reduces the use cost of the smart power module 100.
  • the side of the circuit wiring 1 exposed to the outside of the sealing resin 3 has a height h, h satisfies: 0.3 oz ⁇ h ⁇ 0.8 oz.
  • the smart power module 100 facilitates soldering of the solder paste during the subsequent soldering fixing process, so that the circuit wiring 1 exposed outside the sealing resin 3 can be completely wrapped by solder such as solder paste, thereby facilitating assembly of the smart power module 100, The assembly efficiency and assembly reliability of the smart power module 100 are improved.
  • the circuit wiring 1 is machined from a copper plate having a thickness t, t satisfying: t ⁇ 5 ounces.
  • a copper plate having a cross-sectional area of less than 64 mm ⁇ 30 mm and a thickness of not less than 5 ounces may be selected, and the shape of the circuit wiring 1 is punched out on the copper plate by a stamping die to form the circuit wiring 1; or the high-speed steel may be used as a material by the file.
  • the rotation speed of the control motor is 5000 rpm, so that the boring tool and the plane are formed at right angles to form the shape of the circuit wiring 1.
  • the shape of the circuit wiring 1 can also be etched on the copper plate by a chemical reaction by an etching tool.
  • an oxidation resistant layer is provided on the outer surface of the circuit wiring 1.
  • the oxidation resistant layer may be a gold layer.
  • a gold layer may be formed on the outer surface of the circuit wiring 1 by means of electroplating gold or chemical immersion gold to improve the oxidation resistance of the circuit wiring 1, so that the smart power module 100 can be applied to a place where the oxidation resistance is high. Thereby, the performance of the smart power module 100 is increased to expand the use range of the smart power module 100.
  • the diameter of the metal wire 4 is d, and d satisfies: 15 ⁇ m ⁇ d ⁇ 400 ⁇ m.
  • the metal wire 4 may be an aluminum wire, a gold wire or a copper wire or the like.
  • the specific diameter of the metal wire 4 can be selected according to the size of the binding point, the required cocurrent capability, the processability of the component, and the like, and the metal wire 4 of appropriate diameter and material is selected.
  • an aluminum wire of an appropriate diameter is selected as a bonding wire, and for an integrated circuit for signal control, a gold wire may also be considered as a bonding wire.
  • the power component of the circuit component 2 has a large power and generates a large amount of heat.
  • a plurality of metal wires 4 for example, aluminum wires, etc.
  • a single metal wire 4 having a diameter of 38 ⁇ m to 200 ⁇ m (for example, an aluminum wire or the like) can be used for bonding. Thereby, the reliability of the smart power module 100 can be further improved.
  • an intelligent power module 100 includes a circuit wiring 1, a plurality of circuit elements 2, and a sealing resin 3.
  • the circuit wiring 1 is stamped from a copper plate having a thickness of not less than 5 ounces.
  • the end of the circuit wiring 1 is provided with a pad 11 for electrical connection with an external circuit, and the longitudinal sectional area of the pad 11 is preferably larger than the longitudinal sectional area of the end of the circuit wiring 1.
  • the pad 11 is integrally formed with the circuit wiring 1.
  • the plurality of circuit elements 2 are electrically connected to the circuit wiring 1 through the metal wires 4, respectively.
  • the sealing resin 3 completely covers the circuit element 2 and the metal wire 4 on the upper surface of the circuit wiring 1, and covers most of the height of the side surface of the circuit wiring 1, the small portion of the lower portion of the side surface of the circuit wiring 1 and the lower surface of the circuit wiring 1 are exposed Outside the sealing resin 3.
  • the side of the circuit wiring 1 is exposed to a height of 0.5 ounce outside the sealing resin 3.
  • the smart power module 100 is electrically connected to an external circuit through the pad 11, which improves the reliability of the smart power module 100, prolongs the service life of the smart power module 100, and reduces the use cost.
  • the structure and processing technology of the smart power module 100 are simplified, and the processing cost of the smart power module 100 is reduced, thereby further reducing the overall cost of the smart power module 100.
  • the heat dissipation performance of the smart power module 100 is improved, thereby further improving the reliability of the smart power module 100.
  • a method for manufacturing the smart power module 100 includes the following steps:
  • S560 The circuit wiring 1 is taken out from the base 5 to obtain the smart power module 100.
  • the width of the groove 51 on the base 5 may be slightly larger than the width of the circuit wiring 1 corresponding thereto in order to place the lower portion of the circuit wiring 1 in the groove 51.
  • the circuit wiring 1 can be positioned by the base 5 to facilitate encapsulation of the sealing resin 3 on the circuit wiring 1, so that the lower and lower surfaces of the side surface of the circuit wiring 1 that protrude into the recess 51 are exposed outside the sealing resin 3.
  • the difficulty in positioning the sealing resin 3 on the circuit wiring 1 is reduced.
  • the smart power module 100 completely sealed with respect to the conventional sealed resin 3 reduces the difficulty in controlling the parameters of the thickness of the sealing resin 3 on the upper surface and the lower surface of the circuit wiring 1 during the injection molding, thereby greatly reducing the intelligence.
  • the manufacturing of the power module 100 is difficult and the manufacturing yield is improved, thereby further reducing the cost of the smart power module 100.
  • the base 5 needs to be taken out, and the base 5 can be reused, thereby eliminating the metal substrate in the smart power module 100 in the related art, thereby further reducing the smart power.
  • the cost of module 100 is the cost of module 100.
  • the manufacturing method of the smart power module 100 by placing the circuit wiring 1 in the recess 51 on the reusable base 5, the circuit wiring 1 is positioned through the base 5, which greatly reduces the smart power.
  • the manufacturing difficulty of the module 100 improves the manufacturing yield, reduces the cost of the smart power module 100, and facilitates the popularization and application of the smart power module 100.
  • step S510 specifically includes the following steps:
  • a copper plate having a cross-sectional area of less than 64 mm ⁇ 30 mm and a thickness of not less than 5 ounces may be selected, and the shape of the circuit wiring 1 is punched out on the copper plate by a stamping die to form the circuit wiring 1; or by etching a chemical reaction The shape of the circuit wiring 1 is etched on the copper plate.
  • the high speed steel can be used as a material by the boring tool, and the rotation speed of the motor is controlled to be 5000 rpm, so that the boring tool and the aluminum plane are formed at right angles to form the shape of the circuit wiring 1. Then, the outer surface of the circuit wiring 1 is subjected to an oxidation treatment.
  • a gold layer may be formed on the outer surface of the circuit wiring 1 by means of electroplating gold or chemical immersion gold to improve the oxidation resistance of the circuit wiring 1, so that the smart power module 100 can be applied to a place where the oxidation resistance is high. Thereby, the use range of the smart power module 100 is expanded.
  • step S512 can be omitted to simplify the processing process of the smart power module 100 and reduce the processing cost.
  • step S530 specifically includes the following steps:
  • the fabricated circuit wiring 1 can be placed in the corresponding groove 51 of the base 5 (as shown in FIG. 43), and the circuit component to be mounted of the circuit wiring 1 is spliced by a solder paste using a steel mesh.
  • the position is solder paste coating, wherein the thickness of the steel mesh can be 0.13 mm.
  • the circuit component 2 is mounted by an apparatus such as an SMT machine or a DA machine.
  • the circuit component 2 can be placed directly at the position where the solder paste of the circuit wiring 1 is applied, and then the bottom of the chassis 5 is placed over the carrier 6 such that at least one edge of the chassis 5 is in contact with the carrier 6 for fixing. (As shown in FIGS.
  • the solder paste is cured by reflow soldering to fix the circuit component 2 on the circuit wiring 1.
  • the base 5 can be positioned by the carrier 6 to prevent the base 5 from moving, thereby facilitating the fixing of the circuit component 2 to the circuit wiring 1 by reflow soldering.
  • the carrier 6 may be formed in a rectangular shape, and at least one edge of the carrier 6 is provided with a fixing strip 61 which can be pushed from the side edge of the carrier 6 without the fixing strip 61 to the carrier. 6 on. At least one edge of the base 5 is in contact with the carrier 6.
  • the carrier 6 may be made of a material such as synthetic stone. High structural strength and low cost.
  • the three edges of the carrier 6 are provided with fixing bars 61 which can be pushed from the side edges of the carrier 6 without the fixing bars 61 to the carrier 6.
  • SMT SurfaceMountTechnology
  • Chinese can be translated into “surface assembly technology” or “surface mount technology”
  • SMT machine refers to a slicer.
  • DA is the abbreviation of DieAttach
  • Chinese can be translated as “chip bonding”
  • DA machine refers to chip bonding machine.
  • the circuit wiring 1 fixed to the chassis 5 can be placed in a cleaning machine for cleaning, and the flux such as rosin remaining during reflow and the aluminum wire remaining during the pressing can be washed. .
  • cleaning may be performed according to the arrangement density of the circuit component 2 at the arrangement density of the circuit wiring 1, by spraying or ultrasonic or by a combination of spraying and ultrasonic.
  • the base 5 can be held by the robot arm, and the base 5 can be placed in the cleaning tank for cleaning.
  • the method further includes the step of removing the overflow glue 7 formed during the process of packaging the circuit wiring 1.
  • the circuit wiring 1 When encapsulating the sealing resin 3, the circuit wiring 1 can be first baked in an oxygen-free environment, the baking time should not be less than 2 hours, and the baking temperature can be selected to be about 125 °C.
  • the package mold includes an upper mold 81 and a lower mold 82, and a cavity is defined between the upper mold 81 and the lower mold 82.
  • the mold cavity has a gate 83 and an exhaust port 84.
  • the base 5 on which the circuit wiring 1 is placed is placed in the cavity, and the base 5 and the lower die 82 are made.
  • the sealing resin 3 is injected into the cavity from the gate 83, and the gas inside the cavity can be discharged to the outside through the exhaust port 84 during the injection.
  • the portion of the side of the circuit wiring 1 where the groove 51 is exposed, the upper surface of the circuit wiring 1, the circuit component 2 on the upper surface of the circuit wiring 1, and the metal wire 4 are sealed by the resin 3. cover. Due to the action of the pressure, part of the resin enters the recess 51 of the base 5, and an overflow glue 7 is formed on the circuit wiring 1, as shown in FIG.
  • the thickness of the overflow glue 7 is very thin, generally does not exceed 0.1 mm, and can be removed by using a wind knife or the like, or can be removed by chemical means. Thereby, it is possible to prevent the overflow glue 7 from affecting the input and output connection and heat dissipation of the circuit wiring 1, and improving the heat dissipation performance of the smart power module 100.
  • the smart power module 100 can be placed in the test equipment for routine electrical parameter testing. Specifically, the contact test can be performed by the thimble and the test point. If the contact test does not pass, the thimble needs to be trimmed until the contact test passes, and then the electrical characteristics test, including the insulation withstand voltage, static power consumption, delay time and other test items, the test is qualified.
  • the contact test can be performed by the thimble and the test point. If the contact test does not pass, the thimble needs to be trimmed until the contact test passes, and then the electrical characteristics test, including the insulation withstand voltage, static power consumption, delay time and other test items, the test is qualified.
  • the depth of the groove 51 is H, H satisfies: 0.3 oz ⁇ H ⁇ 0.8 oz.
  • the base 5 is a stainless steel piece.
  • the base 5 can be machined from a high temperature resistant steel having a smooth surface. Thereby, the structural strength and high temperature resistance of the base 5 can be improved, the service life of the base 5 can be prolonged, and the cost of the stainless steel is low, and the material cost can be reduced.
  • FIGS. 41-50 A specific embodiment of a method of manufacturing the smart power module 100 according to an embodiment of the present invention will now be described with reference to FIGS. 41-50.
  • the base 5 is made of a high-temperature resistant steel having a smooth surface, and a groove 51 having a depth of 0.5 ounce is dug on the base 5 according to the shape of the circuit wiring 1;
  • solder paste is applied to the position of the circuit component 1 where the circuit component 2 is to be mounted;
  • the circuit wiring 1 is cleaned to remove foreign matter remaining on the circuit wiring 1.
  • the circuit wiring 1 is encapsulated by a sealing resin 3;
  • the circuit wiring 1 is taken out from the base 5, and the overflow glue 7 formed on the circuit wiring 1 is removed;
  • the smart power module 100 is tested.
  • the circuit wiring 1 is positioned by using the reusable base 5, which reduces the difficulty of positioning when encapsulating the sealing resin 3, and greatly reduces the manufacturing difficulty of the smart power module 100.
  • the manufacturing yield is improved, the cost of the smart power module 100 is reduced, and the popularity and application of the smart power module 100 are facilitated.
  • An intelligent power module 100 in accordance with an embodiment of the present invention will now be described with reference to FIGS. 51-64.
  • the smart power module 100 includes: a circuit wiring 1, a plurality of circuit elements 2, and a sealing resin 3, and at least one end of the circuit wiring 1 is provided with a pad 11 for electrically connecting to an external circuit, and a plurality of The circuit element 2 is provided on the upper surface of the circuit wiring 1, and the plurality of circuit elements 2 are directly electrically connected to the circuit wiring 1, and the sealing resin 3 is provided on the circuit wiring 1.
  • the smart power module 100 eliminates the related art in the smart power module 100 by providing the pad 11 at at least one end of the circuit wiring 1 and electrically connecting to the external circuit through the pad 11.
  • the extended pin avoids the short circuit caused by the condensation on the pin, improves the reliability of the smart power module 100, prolongs the service life of the smart power module 100, and reduces the use cost.
  • the circuit component 2 is directly electrically connected to the circuit wiring 1, and the metal wire for electrically connecting the circuit component 2 and the circuit wiring 1 in the related art is omitted, which further saves cost.
  • the structure and processing technology of the smart power module 100 are simplified, the production efficiency is improved, and the processing cost of the smart power module 100 is reduced, thereby further reducing the overall cost of the smart power module 100.
  • an intelligent power module 100 includes a circuit wiring 1, a plurality of circuit elements 2, and a sealing resin 3.
  • At least one end portion of the circuit wiring 1 (for example, the front end in FIG. 53) is provided with a pad 11 for electrical connection with an external circuit.
  • a pad 11 for electrical connection with an external circuit.
  • the external connection of the pad 11 to the external circuit eliminates the outward extension of the smart power module 100 in the related art, thereby avoiding a short circuit caused by condensation on the pin, thereby improving the wisdom.
  • the reliability of the power module 100 extends the service life of the smart power module 100 and reduces the cost of use.
  • the pad 11 may be formed in a square structure, and the longitudinal sectional area of the pad 11 is preferably larger than the longitudinal sectional area of the end portion of the circuit wiring 1. Thereby, the contact area of the pad 11 with the external circuit can be increased, and the reliability of the connection of the smart power module 100 to the external circuit is improved.
  • a plurality of circuit elements 2 are provided on the upper surface of the circuit wiring 1, and a plurality of circuit elements 2 are directly electrically connected to the circuit wiring 1.
  • the circuit component 2 may be an active component such as a transistor or a diode, or may be a passive component such as a capacitor or a resistor.
  • the circuit component 2 can be mounted on the upper surface of the circuit wiring 1.
  • each circuit element 2 is a planar circuit element 2, each circuit element 2 having electrodes, each circuit element 2 being electrically connected to the circuit wiring 1 by electrodes.
  • an IGBT an L-type IGBT can be selected.
  • the planar type circuit element 2 refers to the circuit element 2 in which all the electrodes are located on the same side surface (for example, the lower surface in FIG. 52) of the circuit element 2.
  • the side surface on which the electrode of the circuit component 2 is located is connected to the upper surface of the circuit wiring 1, and the electrode of the circuit component 2 can be directly connected to the circuit wiring 1, and the electrical connection between the circuit component 2 and the circuit wiring 1 can be realized.
  • the metal wire for realizing the electrical connection between the circuit component 2 and the circuit wiring 1 in the related art is omitted, the processing technology of the smart power module 100 is simplified, the production efficiency is improved, and the material cost and the processing cost of the smart power module 100 are saved.
  • the surface on which the electrodes of the planar type circuit component 2 are located may be referred to as "front side” (for example, the lower surface in FIG. 52), and accordingly, the side surface of the planar type circuit component 2 opposite to the electrode It is called “reverse surface” (for example, the upper surface in Fig. 52).
  • the front surface of the circuit component 2 can be connected to the upper surface of the circuit wiring 1 during assembly.
  • the electrodes of the circuit element 2 may be fixed to the circuit wiring 1 by solder paste, but are not limited thereto.
  • the smart power module 100 further includes a heat sink 4 that is coupled to the upper surface of the power component 21.
  • the heat generation of the power component 21 is large, and the heat sink 4 is connected to the upper surface of the power component 21 to effectively improve the heat dissipation performance of the smart power module 100, thereby improving the reliability of the smart power module 100.
  • the heat sink 4 is a copper piece, which has good heat dissipation effect and low material cost.
  • the thickness of the fin 4 is t1, and t1 satisfies: 1.0 mm ⁇ t1 ⁇ 1.5 mm.
  • the specific value can be adjusted according to the specific specification and type of the power component 21 to ensure the heat dissipation effect of the heat sink 4.
  • the outer surface of the heat sink 4 has an electroplated silver layer.
  • the outer surface of the heat sink 4 may be subjected to an electroplating silver treatment to form an electroplated silver layer on the outer surface of the heat sink 4. Thereby, it can be improved
  • the wettability of the heat sink 4 further improves the heat dissipation effect of the heat sink 4.
  • the thickness of the electroplated silver layer is t2, and t2 satisfies: 22 ⁇ m ⁇ t2 ⁇ 30 ⁇ m.
  • the specific value can be adjusted according to the specific specification and model of the intelligent power module 100.
  • the sealing resin 3 covers the upper portion of the side surface of the circuit wiring 1 and the upper surface of the circuit wiring 1, and the lower portion of the side surface of the circuit wiring 51 and the lower surface of the circuit wiring 1 are exposed outside the sealing resin 3.
  • the sealing resin 3 completely covers the circuit component 2 on the upper surface of the circuit wiring 1, and the surface of the heat sink 4 away from the power component 21 is exposed outside the sealing resin 3.
  • the sealing resin 3 covers most of the height of the upper portion of the side surface of the circuit wiring 1, and the small portion of the lower portion of the side surface of the circuit wiring 1 and the lower surface of the circuit wiring 1 are exposed outside the sealing resin 3.
  • the heat dissipation performance of the smart power module 100 can be effectively improved, the heat accumulation inside the smart power module 100 can be avoided, and the gap between the circuit wires 1 can be completely exposed, thereby making it difficult for moisture to adhere to the circuit wiring 1
  • the ions inside the intelligent power module 100 in a high-temperature and high-humidity environment are effectively avoided, for example, chloride ions, bromide ions, etc., which are caused by the migration of water vapor to cause corrosion to the circuit, and the circuit and circuit components of the circuit wiring 1 are avoided.
  • the short circuit of the circuit further improves the reliability of the smart power module 100, prolongs the service life of the smart power module 100, and reduces the use cost of the smart power module 100.
  • the side of the circuit wiring 1 exposed to the outside of the sealing resin 3 has a height h, h satisfies: 0.3 oz ⁇ h ⁇ 0.8 oz.
  • the smart power module 100 facilitates soldering of the solder paste during the subsequent soldering fixing process, so that the circuit wiring 1 exposed outside the sealing resin 3 can be completely wrapped by solder such as solder paste, thereby facilitating assembly of the smart power module 100, The assembly efficiency and assembly reliability of the smart power module 100 are improved.
  • the circuit wiring 1 is formed by using a copper plate having a thickness t3 and t3 satisfying: t3 ⁇ 5 ounces.
  • a copper plate having a cross-sectional area of less than 64 mm ⁇ 30 mm and a thickness of not less than 5 ounces may be selected, using a stamping die
  • the shape of the circuit wiring 1 is punched out on the copper plate to form the circuit wiring 1; the high speed steel can be used as the material by the boring tool, and the rotation speed of the motor is controlled to 5000 rpm, so that the boring tool and the plane are formed at right angles to form a circuit wiring.
  • the shape of 1; the shape of the circuit wiring 1 can also be etched on the copper plate by a chemical reaction by an etching tool.
  • an oxidation resistant layer is provided on the outer surface of the circuit wiring 1.
  • the oxidation resistant layer may be a gold layer.
  • a gold layer may be formed on the outer surface of the circuit wiring 1 by means of electroplating gold or chemical immersion gold to improve the oxidation resistance of the circuit wiring 1, so that the smart power module 100 can be applied to a place where the oxidation resistance is high. Thereby, the performance of the smart power module 100 is increased to expand the use range of the smart power module 100.
  • an intelligent power module 100 includes: a circuit wiring 1, a plurality of circuit elements 2, a heat sink 4, and a sealing resin 3.
  • the circuit wiring 1 is stamped from a copper plate having a thickness of not less than 5 ounces.
  • the end of the circuit wiring 1 is provided with a pad 11 for electrical connection with an external circuit, and the longitudinal sectional area of the pad 11 is preferably larger than the longitudinal sectional area of the end of the circuit wiring 1.
  • the pad 11 is integrally formed with the circuit wiring 1.
  • Each of the circuit elements 2 is a planar type circuit element 2, and all the electrodes of the circuit element 2 are located on the same side surface of the circuit element 2, and the electrodes of the circuit element 2 are directly connected to the circuit wiring 1 to realize the circuit element 2 and the circuit wiring 1 Electrical connection.
  • the heat sink 4 is provided on the upper surface of the circuit component 2.
  • the sealing resin 3 covers a portion other than the upper surface of the heat sink 4 on the upper surface of the circuit wiring 1 and most of the height of the side surface of the circuit wiring 1, a small portion of the lower portion of the side surface of the circuit wiring 1 and the lower surface of the circuit wiring 1 are exposed Outside the sealing resin 3.
  • the side of the circuit wiring 1 is exposed to a height of 0.5 ounce outside the sealing resin 3.
  • the smart power module 100 of the embodiment of the present invention by providing the pad 11 at the end of the circuit wiring 1 and electrically connecting to the external circuit through the pad 11, the reliability of the smart power module 100 is improved, and the smart power module is extended.
  • the service life of 100 reduces the cost of use.
  • the circuit component 2 is directly electrically connected to the circuit wiring 1 , which simplifies the structure and processing process of the smart power module 100 , and saves material cost and processing cost of the smart power module 100 .
  • the heat dissipation performance of the module 100 further improves the reliability of the smart power module 100.
  • a method for manufacturing the smart power module 100 includes the following steps:
  • S6420 Manufacture the base 5, and dig a groove 51 on the base 5 according to the shape of the circuit wiring 1, and the lower portion of the circuit wiring 1 is adapted to be placed in the groove 51;
  • the lower portion of the side surface of the circuit wiring 1 extends into the recess 51, and the upper portion of the side surface of the circuit wiring 1 is exposed outside the recess 51.
  • the width of the groove 51 on the base 5 may be slightly larger than the width of the circuit wiring 1 corresponding thereto in order to place the lower portion of the circuit wiring 1 in the groove 51.
  • the circuit wiring 1 can be positioned by the base 5 to facilitate encapsulation of the sealing resin 3 on the circuit wiring 1, so that the lower and lower surfaces of the side surface of the circuit wiring 1 that protrude into the recess 51 are exposed outside the sealing resin 3.
  • the difficulty in positioning the sealing resin 3 on the circuit wiring 1 is reduced.
  • the smart power module 100 completely sealed with respect to the conventional sealed resin 3 reduces the difficulty in controlling the parameters of the thickness of the sealing resin 3 on the upper surface and the lower surface of the circuit wiring 1 during the injection molding, thereby greatly reducing the intelligence.
  • the manufacturing of the power module 100 is difficult and the manufacturing yield is improved, thereby further reducing the cost of the smart power module 100.
  • the manufacturing method of the smart power module 100 by placing the circuit wiring 1 in the recess 51 on the reusable base 5, the circuit wiring 1 is positioned through the base 5, which greatly reduces the smart power.
  • the manufacturing difficulty of the module 100 improves the manufacturing yield, reduces the cost of the smart power module 100, and facilitates the popularization and application of the smart power module 100.
  • the electrodes of the circuit component 2 are directly connected to the circuit wiring 1, and the metal wires for electrically connecting the circuit component 2 and the circuit wiring 1 in the related art are omitted, which further saves cost and improves production efficiency.
  • the method before the electrodes of the circuit component 2 are connected to the circuit wiring 1, the method further includes the step of attaching the heat sink 4 to the power component 21 in the circuit component 2, as shown in FIG. Specifically, the surface of the circuit component 2 opposite to the surface on which the electrode is located may be attached to the heat sink 4.
  • the heat sink 4 may be formed by stamping or etching a copper sheet having a thickness of about 1.5 mm.
  • the outer surface of the heat sink 4 may be plated by silver to form an electroplated silver layer, and then passed through a eutectic.
  • the power element 21 is mounted on the heat sink 4 with a high temperature solder paste having a melting point of 300 ° C or higher.
  • the eutectic flatness of the power device can be controlled within 0.1 mm.
  • step S6410 specifically includes the following steps:
  • a copper plate having a cross-sectional area of less than 64 mm ⁇ 30 mm and a thickness of not less than 5 ounces may be selected, and the shape of the circuit wiring 1 is punched out on the copper plate by a stamping die to form the circuit wiring 1; or by etching a chemical reaction The shape of the circuit wiring 1 is etched on the copper plate.
  • the high speed steel can be used as a material by the boring tool, and the rotation speed of the motor is controlled to be 5000 rpm, so that the boring tool and the aluminum plane are formed at right angles to form the shape of the circuit wiring 1. Then, the outer surface of the circuit wiring 1 is subjected to an oxidation treatment.
  • a gold layer may be formed on the outer surface of the circuit wiring 1 by means of electroplating gold or chemical immersion gold to improve the oxidation resistance of the circuit wiring 1, so that the smart power module 100 can be applied to a place where the oxidation resistance is high. Thereby, the use range of the smart power module 100 is expanded.
  • step 6412 can be omitted to simplify the processing process of the smart power module 100 and reduce the processing cost.
  • step S6430 specifically includes the following steps:
  • the fabricated circuit wiring 1 can be placed in the corresponding groove 51 of the base 5 (as shown in FIG. 58), and the circuit component to be mounted of the circuit wiring 1 is spliced by a solder paste using a steel mesh.
  • the position is solder paste coating, wherein the thickness of the steel mesh can be 0.13 mm.
  • the circuit component 2 is mounted by an apparatus such as an SMT machine or a DA machine.
  • one side surface on which the electrodes of the circuit component 2 are located may be placed at the position where the solder paste of the circuit wiring 1 is applied, and then the bottom of the base 5 is placed over the carrier 6 such that at least one edge of the base 5 is
  • the carrier 6 is contact-fixed (as shown in FIGS.
  • the base 5 can be positioned by the carrier 6 to prevent the base 5 from moving, thereby facilitating the fixing of the circuit component 2 to the circuit wiring 1 by reflow soldering.
  • the carrier 6 may be formed in a rectangular shape, and at least one edge of the carrier 6 is provided with a fixing strip 61 which can be pushed from the side edge of the carrier 6 without the fixing strip 61 to the carrier. 6 on. At least one edge of the base 5 is in contact with the carrier 6.
  • the carrier 6 may be made of a material such as synthetic stone. High structural strength and low cost.
  • one of the edges of the carrier 6 is provided with a fixing strip 61 which can be pushed onto the carrier 6 from the side edge opposite to the edge of the carrier 6 on which the fixing strip 61 is provided. .
  • SMT SurfaceMountTechnology
  • Chinese can be translated into “surface assembly technology” or “surface mount technology”
  • SMT machine refers to a slicer.
  • DA is the abbreviation of DieAttach
  • Chinese can be translated as “chip bonding”
  • DA machine refers to chip bonding machine.
  • the circuit wiring 1 fixed to the chassis 5 can be placed in a cleaning machine for cleaning, and the flux such as rosin remaining during reflow and the aluminum wire remaining during the pressing can be washed. .
  • cleaning may be performed according to the arrangement density of the circuit component 2 at the arrangement density of the circuit wiring 1, by spraying or ultrasonic or by a combination of spraying and ultrasonic.
  • the base 5 can be held by the robot arm, and the base 5 can be placed in the cleaning tank for cleaning.
  • the overflow glue 7 formed during the process of packaging the circuit wiring 1 is removed.
  • the circuit wiring 1 When encapsulating the sealing resin 3, the circuit wiring 1 can be first baked in an oxygen-free environment, the baking time should not be less than 2 hours, and the baking temperature can be selected to be about 125 °C.
  • the package mold includes an upper mold 81 and a lower mold 82, and a cavity is defined between the upper mold 81 and the lower mold 82.
  • the mold cavity has a gate 83 and an exhaust port 84.
  • the portion of the side of the circuit wiring 1 where the groove 51 is exposed, the upper surface of the circuit wiring 1, the circuit component 2 on the upper surface of the circuit wiring 1, and the metal wire are covered with the sealing resin 3. . Due to the action of the pressure, part of the resin enters the recess 51 of the base 5, and an overflow gel 7 is formed on the circuit wiring 1, as shown in FIG. The portion of the sealing resin 3 also enters between the fins 4 and the upper mold 81 due to the pressure, and adheres to the upper surface of the fins 4 to form the overflow rubber 7.
  • the thickness of the overflow glue 7 is very thin, generally does not exceed 0.1 mm, and can be removed by using a wind knife or the like, or can be removed by chemical means. Thereby, it is possible to prevent the overflow rubber 7 from affecting the heat dissipation performance of the heat sink 4, and it is possible to prevent the overflow glue 7 from affecting the input and output connection of the circuit wiring 1, and improving the performance of the smart power module 100.
  • the smart power module 100 can be placed in the test equipment for routine electrical parameter testing. Specifically, the contact test can be performed by the thimble and the test point. If the contact test does not pass, the thimble needs to be trimmed until the contact test passes, and then the electrical characteristics test, including the insulation withstand voltage, static power consumption, delay time and other test items, the test is qualified.
  • the contact test can be performed by the thimble and the test point. If the contact test does not pass, the thimble needs to be trimmed until the contact test passes, and then the electrical characteristics test, including the insulation withstand voltage, static power consumption, delay time and other test items, the test is qualified.
  • the depth of the groove 51 is H, H satisfies: 0.3 oz ⁇ H ⁇ 0.8 oz.
  • the lower portion of the circuit wiring 1 can be inserted into the recess 51 without being covered by the sealing resin 3, and the smart power module 100 can facilitate the soldering of the solder paste in the subsequent soldering and fixing process, so that the solder is exposed outside the sealing resin 3.
  • the circuit wiring 1 can be completely wrapped by solder such as solder paste, thereby facilitating the assembly of the smart power module 100, improving the assembly efficiency and assembly reliability of the smart power module 100.
  • the base 5 is a stainless steel piece.
  • the base 5 can be machined from a high temperature resistant steel having a smooth surface. Thereby, the structural strength and high temperature resistance of the base 5 can be improved, the service life of the base 5 can be prolonged, and the cost of the stainless steel is low, and the material cost can be reduced.
  • the circuit wiring 1 is positioned by using the reusable base 5, which reduces the difficulty of positioning when encapsulating the sealing resin 3, and greatly reduces the manufacturing difficulty of the smart power module 100.
  • the manufacturing yield is improved, the cost of the smart power module 100 is reduced, and the popularity and application of the smart power module 100 are facilitated.
  • the electrode of the circuit component 2 is directly connected to the circuit wiring 1, and the metal wire for electrically connecting the circuit component 2 and the circuit wiring 1 in the related art is omitted, which further saves cost and improves production efficiency.
  • FIGS. 65-78 An intelligent power module 100 in accordance with an embodiment of the present invention will now be described with reference to FIGS. 65-78.
  • An intelligent power module 100 includes: a circuit wiring 1, a plurality of circuit elements 2, and a sealing resin 3, at least one end of the circuit wiring 1 is provided with a pad 11 for electrically connecting with an external circuit; Circuit elements 2 are provided on the upper surface of the circuit wiring 1, each circuit element 2 is a planar type circuit element 2, each circuit element 2 has electrodes, and each circuit element 2 is electrically connected to the circuit wiring 1 through electrodes, and a plurality of circuits At least one of the elements 2 is a power element 21, and at least one power element 21 is provided with a temperature sensing element 9; a sealing resin 3 is provided on the circuit wiring 1.
  • the smart power module 100 eliminates the related art in the smart power module 100 by providing the pad 11 at at least one end of the circuit wiring 1 and electrically connecting to the external circuit through the pad 11.
  • the extended pin avoids the short circuit caused by the condensation on the pin, improves the reliability of the smart power module 100, prolongs the service life of the smart power module 100, and reduces the use cost.
  • the electrodes of the circuit component 2 are directly electrically connected to the circuit wiring 1, and the metal wires for electrically connecting the circuit component 2 and the circuit wiring 1 in the related art are omitted, which further saves cost.
  • the temperature of the power component 21 can be monitored in real time, and thus, when the intelligent power module 100 is abnormally heated during operation, measures can be taken in time to respond, thereby being effective.
  • the intelligent power module 100 is prevented from being burned by overheating, the probability of damage of the smart power module 100 is reduced, and the reliability of the smart power module 100 is improved.
  • the structure and processing technology of the smart power module 100 are simplified, the production efficiency is improved, and the addition of the smart power module 100 is reduced.
  • the cost of labor further reduces the overall cost of the smart power module 100.
  • an intelligent power module 100 includes a circuit wiring 1, a plurality of circuit elements 2, and a sealing resin 3.
  • At least one end portion of the circuit wiring 1 (for example, the front end in FIG. 67) is provided with pads 11 for electrical connection with an external circuit.
  • pads 11 are electrically connected to the external circuit, thereby eliminating the outwardly extending pins on the smart power module 100 in the related art, thereby avoiding short circuits caused by condensation on the pins, and improving the smart power module 100.
  • the reliability of the smart power module 100 extends the service life and reduces the cost of use.
  • the pad 11 may be formed in a square structure, and the longitudinal cross-sectional area of the pad 11 is preferably larger than the longitudinal cross-sectional area of the end portion of the circuit wiring 1. Thereby, the contact area of the pad 11 with the external circuit can be increased, and the reliability of the connection of the smart power module 100 to the external circuit is improved.
  • a plurality of circuit elements 2 are provided on the upper surface of the circuit wiring 1, and each of the circuit elements 2 is a planar type circuit element 2.
  • each of the circuit elements 2 is a planar type circuit element 2.
  • the circuit component 2 may be an active component such as a transistor or a diode, or may be a passive component such as a capacitor or a resistor.
  • the circuit component 2 can be mounted on the upper surface of the circuit wiring 1. Specifically, the electrode of the circuit component 2 can be fixed on the upper surface of the circuit wiring 1 by solder paste, but is not limited thereto.
  • the planar type circuit element 2 refers to the circuit element 2 in which all the electrodes are located on the same side surface (for example, the lower surface in FIG. 66) of the circuit element 2.
  • the side surface on which the electrode of the circuit component 2 is located is connected to the upper surface of the circuit wiring 1, and the electrode of the circuit component 2 can be directly connected to the circuit wiring 1, and the electrical connection between the circuit component 2 and the circuit wiring 1 can be realized.
  • the metal wire for realizing the electrical connection between the circuit component 2 and the circuit wiring 1 in the related art is omitted, the processing technology of the smart power module 100 is simplified, the production efficiency and the production yield are improved, and the material cost of the smart power module 100 is saved.
  • the equipment cost and processing cost reduce the overall cost of the smart power module 100.
  • the surface on which the electrodes of the planar type circuit component 2 are located may be referred to as "front side” (for example, the lower surface in FIG. 66), and accordingly, the side surface of the planar type circuit component 2 opposite to the electrode It is called “reverse surface” (for example, the upper surface in Fig. 66).
  • the front surface of the circuit component 2 can be connected to the upper surface of the circuit wiring 1 during assembly.
  • At least one of the plurality of circuit elements 2 is a power element 21, and at least one of the power elements 21 is provided with a temperature sensing element 9. That is to say, one or more power elements 21 may be included in the plurality of circuit elements 2, and the other elements in the circuit elements 2 are non-power elements 22.
  • the power component 21 is one, the power component 21 is provided with a temperature sensing component 9,
  • one or more of the plurality of power elements 21 are provided with temperature sensing elements 9. Therefore, the temperature of the surface of the power component 21 can be monitored in real time by the temperature sensing element 9, so that when the intelligent power module 100 is abnormally heated during the working process, measures can be taken to respond in time, thereby effectively avoiding the intelligent power module.
  • the 100 is burned by overheating, the probability of damage of the smart power module 100 is reduced, and the reliability of the smart power module 100 is improved.
  • the temperature sensing element 9 can be mounted on a complete electrode of the surface of the power element 21 such as the LIGBT, such as an emitter or the like.
  • the surface of the emitter may be coated with a non-conductive gel 101 (for example, red glue or the like), and then the temperature sensing element 9 is mounted on the red glue, and the red glue is solidified by high temperature baking to set the temperature sensing element 9 It is fixed to the power element 21.
  • a non-conductive gel 101 for example, red glue or the like
  • the height of the temperature sensing element 9 is A, A satisfies: 0.1 mm ⁇ A ⁇ 0.15 mm, whereby the lower end of the temperature sensing element 9 and the lower end of the circuit wiring 1 are basically made after the temperature sensing element 9 is assembled. Located on the same level.
  • the specific height of the temperature sensing element 9 can be adjusted according to the specific specification and model of the smart power module 100, which is not specifically limited in the present invention.
  • the temperature sensing element 9 may be an NTC resistor, a PTC resistor, or the like, but is not limited thereto.
  • the smart power module 100 further includes a heat sink 4 that is coupled to the upper surface of the power component 21.
  • the heat generation of the power component 21 is large, and the heat sink 4 is connected to the upper surface of the power component 21 to effectively improve the heat dissipation performance of the smart power module 100, thereby improving the reliability of the smart power module 100.
  • the heat sink 4 is a copper piece, which has good heat dissipation effect and low material cost.
  • the thickness of the fin 4 is t1, and t1 satisfies: 1.0 mm ⁇ t1 ⁇ 1.5 mm.
  • the specific value can be adjusted according to the specific specification and type of the power component 21 to ensure the heat dissipation effect of the heat sink 4.
  • the outer surface of the heat sink 4 has an electroplated silver layer.
  • the outer surface of the heat sink 4 may be subjected to an electroplating silver treatment to form an electroplated silver layer on the outer surface of the heat sink 4.
  • the wettability of the heat sink 4 can be improved, and the heat radiation effect of the heat sink 4 can be further improved.
  • the thickness of the electroplated silver layer is t2, and t2 satisfies: 22 ⁇ m ⁇ t2 ⁇ 30 ⁇ m.
  • the specific value can be adjusted according to the specific specification and model of the intelligent power module 100.
  • the sealing resin 3 covers the upper portion of the side surface of the circuit wiring 1 and the circuit wiring 1
  • the upper surface, the lower portion of the side surface of the circuit wiring 1 and the lower surface of the circuit wiring 1 are exposed outside the sealing resin 3.
  • the sealing resin 3 completely covers the circuit component 2 on the upper surface of the circuit wiring 1, and the side surface of the heat sink 4 remote from the power component 21 is exposed outside the sealing resin 3. .
  • the sealing resin 3 covers most of the height of the side surface of the circuit wiring 1, the small portion of the lower portion of the side surface of the circuit wiring 1, the lower surface of the circuit wiring 1 is exposed outside the sealing resin 3, and the temperature sensing electrode 91 at the lower end of the temperature sensing element 9 is exposed to the seal. Resin 3 outside. That is, the portion of the upper surface of the circuit wiring 1 except the upper surface of the heat sink 4 is entirely covered with the sealing resin 3, the small portion of the lower portion of the side surface of the circuit wiring 1 and the lower surface of the circuit wiring 1 are exposed to the sealing resin. Further, the temperature sensing electrode 91 at the lower end of the temperature sensing element 9 is exposed outside the sealing resin 3.
  • the heat dissipation performance of the smart power module 100 can be effectively improved, the heat accumulation inside the smart power module 100 can be avoided, and the gap between the circuit wires 1 can be completely exposed, thereby making it difficult for moisture to adhere to the circuit wiring 1
  • the ions inside the intelligent power module 100 in a high-temperature and high-humidity environment are effectively avoided, for example, chloride ions, bromide ions, etc., which are caused by the migration of water vapor to cause corrosion to the circuit, and the circuit and circuit components of the circuit wiring 1 are avoided.
  • the short circuit of the circuit further improves the reliability of the smart power module 100, prolongs the service life of the smart power module 100, and reduces the use cost of the smart power module 100.
  • the temperature sensing electrode 91 at the lower end of the temperature sensing element 9 to the sealing resin 3, the temperature of the power element 21 can be accurately detected and transmitted, and the reliability of the temperature sensing element 9 can be improved.
  • the side of the circuit wiring 1 exposed to the outside of the sealing resin 3 has a height h, h satisfies: 0.3 oz ⁇ h ⁇ 0.8 oz.
  • the smart power module 100 facilitates soldering of the solder paste during the subsequent soldering fixing process, so that the circuit wiring 1 exposed outside the sealing resin 3 can be completely wrapped by solder such as solder paste, thereby facilitating assembly of the smart power module 100, The assembly efficiency and assembly reliability of the smart power module 100 are improved.
  • the circuit wiring 1 is formed by using a copper plate having a thickness t3 and t3 satisfying: t3 ⁇ 5 ounces.
  • a copper plate having a cross-sectional area of less than 64 mm ⁇ 30 mm and a thickness of not less than 5 ounces may be selected, and the shape of the circuit wiring 1 is punched out on the copper plate by a stamping die to form the circuit wiring 1; or the high-speed steel may be used as a material by the file.
  • the rotation speed of the control motor is 5000 rpm, so that the boring tool and the plane are formed at right angles to form the shape of the circuit wiring 1.
  • the shape of the circuit wiring 1 can also be etched on the copper plate by a chemical reaction by an etching tool.
  • an oxidation resistant layer is provided on the outer surface of the circuit wiring 1.
  • the oxidation resistant layer may be a gold layer.
  • a gold layer may be formed on the outer surface of the circuit wiring 1 by means of electroplating gold or chemical immersion gold to improve the oxidation resistance of the circuit wiring 1, so that the smart power module 100 can be applied to a place where the oxidation resistance is high. Thereby, the performance of the smart power module 100 is increased to expand the use range of the smart power module 100.
  • the smart power module 100 includes: a circuit wiring 1, a plurality of circuit elements 2, a heat sink 4, and a sealing resin 3.
  • the circuit wiring 1 is stamped from a copper plate having a thickness of not less than 5 ounces.
  • the end of the circuit wiring 1 is provided with a pad 11 for electrical connection with an external circuit, and the longitudinal sectional area of the pad 11 is preferably larger than the longitudinal sectional area of the end of the circuit wiring 1.
  • the pad 11 is integrally formed with the circuit wiring 1.
  • Each of the circuit elements 2 is a planar type circuit element 2, and all the electrodes of the circuit element 2 are located on the same side surface of the circuit element 2, and the electrodes of the circuit element 2 are directly connected to the circuit wiring 1 to realize the circuit element 2 and the circuit wiring 1 Electrical connection.
  • the heat sink 4 is disposed on the upper surface of the power element 21, and the temperature sensing element 9 is disposed on the lower surface of the power element 21.
  • the sealing resin 3 covers a portion other than the upper surface of the heat sink 4 on the upper surface of the circuit wiring 1 and most of the height of the side surface of the circuit wiring 1, a small portion of the lower portion of the side surface of the circuit wiring 1 and the lower surface of the circuit wiring 1 are exposed.
  • the temperature sensing electrode 91 outside the sealing resin 3 and at the lower end of the temperature sensing element 9 is exposed outside the sealing resin 3.
  • the side of the circuit wiring 1 is exposed to a height of 0.5 ounce outside the sealing resin 3.
  • the smart power module 100 improves the reliability of the smart power module 100, prolongs the service life of the smart power module 100, and reduces the use cost.
  • the structure and processing technology of the smart power module 100 are simplified, the production efficiency is improved, and the processing cost of the smart power module 100 is reduced, thereby further reducing the overall cost of the smart power module 100.
  • a method for manufacturing the smart power module 100 includes the following steps:
  • the base 5 is fabricated, and the first recess 51 is dug out on the base 5 according to the shape of the circuit wiring 1.
  • the second recess 52 is dug out on the base 5 according to the position and shape of the temperature sensing element 9, and the circuit wiring 1 is The lower portion is adapted to be placed in the first recess 51, and the lower end of the temperature sensing element 9 is adapted to be placed in the second recess 52;
  • the lower portion of the side surface of the circuit wiring 1 protrudes into the first recess 51, and the upper portion of the side surface of the circuit wiring 1 is exposed outside the first recess 51.
  • the lower end of the temperature sensing element 9 extends into the second recess 52.
  • the first groove 51 on the 5 The width may be slightly larger than the width of the circuit wiring 1 corresponding thereto, and the width of the second groove 52 is slightly larger than the width of the lower end of the temperature sensing element 9 in order to place the lower portion of the circuit wiring 1 in the groove.
  • the circuit wiring 1 can be positioned by the base 5 to facilitate encapsulation of the sealing resin 3 on the circuit wiring 1, so that the lower and lower surfaces of the side surface of the circuit wiring 1 that protrudes into the first recess 51 are exposed to the sealing resin.
  • the difficulty in positioning the sealing resin 3 on the circuit wiring 1 is reduced.
  • the smart power module 100 completely sealed with respect to the conventional sealed resin 3 reduces the difficulty in controlling the parameters of the thickness of the sealing resin 3 on the upper surface and the lower surface of the circuit wiring 1 during the injection molding, thereby greatly reducing the intelligence.
  • the manufacturing of the power module 100 is difficult and the manufacturing yield is improved, thereby further reducing the cost of the smart power module 100.
  • the processing of the smart power module 100 is simplified, and the material cost and processing cost of the smart power module 100 are reduced.
  • the temperature sensing element 9 By connecting the temperature sensing element 9 to the lower surface of the power element 21, the temperature of the power element 21 can be monitored in real time by the temperature sensing element 9, improving the reliability of the smart power module 100.
  • the base 5 after the sealing resin 3 is packaged on the circuit wiring 1, the base 5 needs to be taken out, and the base 5 can be reused, thereby eliminating the metal substrate in the smart power module 100 in the related art, thereby further reducing the smart power. The cost of module 100.
  • the manufacturing method of the smart power module 100 by placing the circuit wiring 1 in the first recess 51 on the reusable base 5, the temperature sensing element 9 is placed in the second recess 52, through The base 5 positions the circuit wiring 1 , which greatly reduces the manufacturing difficulty of the smart power module 100 , improves the manufacturing yield, reduces the cost of the smart power module 100 , and facilitates the popularization and application of the smart power module 100 . Further, the electrodes of the circuit component 2 are directly connected to the circuit wiring 1, and the metal wires for electrically connecting the circuit component 2 and the circuit wiring 1 in the related art are omitted, which further saves cost and improves production efficiency.
  • the method before the electrodes of the circuit component 2 are connected to the circuit wiring 1, the method further includes the step of attaching the heat sink 4 to the power component 21 in the circuit component 2.
  • the heat sink 4 As shown in Figure 71. Specifically, a side surface of the circuit component 2 opposite to the surface on which the electrode is located (for example, the lower surface in FIG. 71) may be attached to the heat sink 4.
  • the heat sink 4 may be formed by stamping or etching a copper sheet having a thickness of about 1.5 mm.
  • the outer surface of the heat sink 4 may be plated by silver to form an electroplated silver layer, and then passed through a eutectic.
  • the power element 21 is mounted on the heat sink 4 with a high temperature solder paste having a melting point of 300 ° C or higher.
  • the eutectic flatness of the power device can be controlled within 0.1 mm.
  • step S7810 specifically includes the following steps:
  • a copper plate having a cross-sectional area of less than 64 mm ⁇ 30 mm and a thickness of not less than 5 ounces may be selected, and the shape of the circuit wiring 1 is punched out on the copper plate by a stamping die to form the circuit wiring 1; or by etching a chemical reaction The shape of the circuit wiring 1 is etched on the copper plate.
  • the high speed steel can be used as a material by the boring tool, and the rotation speed of the motor is controlled to be 5000 rpm, so that the boring tool and the aluminum plane are formed at right angles to form the shape of the circuit wiring 1. Then, the outer surface of the circuit wiring 1 is subjected to an oxidation treatment.
  • a gold layer may be formed on the outer surface of the circuit wiring 1 by means of electroplating gold or chemical immersion gold to improve the oxidation resistance of the circuit wiring 1, so that the smart power module 100 can be applied to a place where the oxidation resistance is high. Thereby, the use range of the smart power module 100 is expanded.
  • step S7812 can be omitted to simplify the processing process of the smart power module 100 and reduce the processing cost.
  • step S7830 specifically includes the following steps:
  • the non-conductive gel 101 may be applied on the lower surface of the power component 21 by dispensing or dispensing, the non-conductive gel 101.
  • the coating area is larger than the area of the upper end of the temperature sensing element 9, and the temperature sensing element 9 is placed on the surface of the non-conductive gel 101 by the DA machine, and the temperature sensing electrode 91 at the upper end of the temperature sensing element 9 cannot be in contact with the electrode of the power element 21, and all of them are required.
  • the fabricated circuit wiring 1 is placed in the corresponding first groove 51 of the base 5 (as shown in FIG. 72), and the circuit component to be mounted of the circuit wiring 1 is spliced by a solder paste using a steel mesh.
  • the position is solder paste coating, wherein the thickness of the steel mesh can be 0.13 mm.
  • the circuit component 2 is mounted by an apparatus such as an SMT machine or a DA machine.
  • one side surface (for example, the lower surface in FIG. 72) where the electrode of the circuit component 2 is placed may be placed at the position where the solder paste of the circuit wiring 1 is applied, and the lower end of the temperature sensing element 9 is placed in the second recess.
  • the bottom of the base 5 is then placed over the carrier 6, such that at least one edge of the base 5 is in contact with the carrier 6 for fixation (as shown in Figures 73 and 74), and the solder paste is cured by reflow soldering.
  • the base 5 can be positioned by the carrier 6 to prevent the base 5 from moving, thereby facilitating the fixing of the circuit component 2 to the circuit wiring 1 by reflow soldering.
  • the carrier 6 may be formed in a rectangular shape, and at least one edge of the carrier 6 is provided with a fixing strip 61 which can be pushed from the side edge of the carrier 6 without the fixing strip 61 to the carrier. 6 on. At least one edge of the base 5 is in contact with the carrier 6.
  • the carrier 6 may be made of a material such as synthetic stone. High structural strength and low cost.
  • the three edges of the carrier 6 are provided with fixing bars 61 that can be pushed from the edges of the carrier 6 without the fixing bars 61 to the carrier 6.
  • SMT SurfaceMountTechnology
  • Chinese can be translated into “surface assembly technology” or “surface mount technology”
  • SMT machine refers to a slicer.
  • DA is the abbreviation of DieAttach
  • Chinese can be translated as “chip bonding”
  • DA machine refers to chip bonding machine.
  • the reflow time during the reflow process generally does not exceed 10 minutes to prevent the non-conductive gel 101 from melting due to excessive reflow time.
  • the relative position of the temperature sensing element 9 and the power element 21 does not change, and after the reflow process is finished, the non-conductive gel 101 is hardened again to the temperature sensing element. 9 is fixed to the power element 21, and the temperature sensing element 9 does not fall off.
  • the circuit wiring 1 fixed to the chassis 5 can be placed in a cleaning machine for cleaning, and the flux such as rosin remaining during reflow and the aluminum wire remaining during the pressing can be washed. .
  • cleaning may be performed according to the arrangement density of the circuit component 2 at the arrangement density of the circuit wiring 1, by spraying or ultrasonic or by a combination of spraying and ultrasonic.
  • the base 5 can be held by the robot arm, and the base 5 can be placed in the cleaning tank for cleaning.
  • the overflow 7 formed during the process of sealing the circuit wiring 1 is removed.
  • the circuit wiring 1 When encapsulating the sealing resin 3, the circuit wiring 1 can be first baked in an oxygen-free environment, the baking time should not be less than 2 hours, and the baking temperature can be selected to be about 125 °C.
  • the package mold includes an upper mold 81 and a lower mold 82, and a cavity is defined between the upper mold 81 and the lower mold 82.
  • the mold cavity has a gate 83 and an exhaust port 84.
  • the portion of the side of the circuit wiring 1 where the groove is exposed, the upper surface of the circuit wiring 1, the circuit component 2 on the upper surface of the circuit wiring 1, and the metal wire Densified The sealing resin 3 is covered. Due to the action of the pressure, part of the resin enters the recess of the base 5, and an overflow glue 7 is formed on the circuit wiring 1, as shown in FIG.
  • the portion of the sealing resin 3 also enters between the fins 4 and the upper mold 81 due to the pressure, and adheres to the upper surface of the fins 4 to form the overflow rubber 7.
  • the thickness of the overflow glue 7 is very thin, generally does not exceed 0.1 mm, and can be removed by using a wind knife or the like, or can be removed by chemical means. Thereby, it is possible to prevent the overflow rubber 7 from affecting the heat dissipation performance of the heat sink 4, and it is possible to prevent the overflow glue 7 from affecting the input and output connection of the circuit wiring 1, and improving the performance of the smart power module 100.
  • the smart power module 100 can be placed in the test equipment for routine electrical parameter testing. Specifically, the contact test can be performed by the thimble and the test point. If the contact test does not pass, the thimble needs to be trimmed until the contact test passes, and then the electrical characteristics test, including the insulation withstand voltage, static power consumption, delay time and other test items, the test is qualified.
  • the contact test can be performed by the thimble and the test point. If the contact test does not pass, the thimble needs to be trimmed until the contact test passes, and then the electrical characteristics test, including the insulation withstand voltage, static power consumption, delay time and other test items, the test is qualified.
  • the depth of the first groove 51 is H, and H satisfies: 0.3 oz ⁇ H ⁇ 0.8 oz.
  • the lower portion of the circuit wiring 1 can be inserted into the first recess 51 without being covered by the sealing resin 3, and the smart power module 100 can facilitate the soldering of the solder paste in the subsequent soldering fixing process, so that the sealing resin is exposed.
  • the outer circuit wiring 1 can be completely wrapped by solder such as solder paste, thereby facilitating the assembly of the smart power module 100, improving the assembly efficiency and assembly reliability of the smart power module 100.
  • the depth of the second groove 52 is equal to the depth of the first groove 51.
  • the lower portion of the circuit wiring 1 can be made to protrude into the first recess 51, so that the temperature sensing electrode 91 at the lower end of the temperature sensing element 9 is not covered by the sealing resin 3 and exposed to the sealing resin during the process of encapsulating the sealing resin 3. 3 outside.
  • the temperature of the power element 21 can be accurately detected and transmitted, and the reliability of the temperature sensing element 9 is improved.
  • the base 5 is a stainless steel piece.
  • the base 5 can be machined from a high temperature resistant steel having a smooth surface. Thereby, the structural strength and high temperature resistance of the base 5 can be improved, the service life of the base 5 can be prolonged, and the cost of the stainless steel is low, and the material cost can be reduced.
  • the circuit wiring 1 is positioned by using the reusable base 5, which reduces the difficulty of positioning when encapsulating the sealing resin 3, and greatly reduces the manufacturing difficulty of the smart power module 100.
  • the manufacturing yield is improved, the cost of the smart power module 100 is reduced, and the popularity and application of the smart power module 100 are facilitated.
  • the electrode of the circuit component 2 is directly connected to the circuit wiring 1, and the metal wire for electrically connecting the circuit component 2 and the circuit wiring 1 in the related art is omitted, which further saves cost and improves production efficiency.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

L'invention concerne un module de puissance intelligent et son procédé de fabrication. Le module de puissance intelligent comprend une couche de câblage de circuit servant de support et ayant une surface supérieure et une surface inférieure opposée à la surface supérieure; des éléments de circuit montés en sens inverse et soudés en des positions prédéterminées sur une surface supérieure de la couche de câblage de circuit; un radiateur monté en surface sur un élément de puissance dans les éléments de circuit; et une couche d'étanchéité recouvrant une surface supérieure de la couche de câblage de circuit et des éléments de circuit et exposant une partie de la surface du radiateur. Aucun substrat métallique n'est nécessaire, et la couche de câblage de circuit peut être fixée au moyen d'une plaque de base réutilisable pour le traitement. La résine est utilisée pour la fixation finale, aucun fil métallique de liaison n'est nécessaire, et le coût peut être réduit. La surface arrière de la couche de câblage de circuit et une ailette de rayonnement sont totalement exposées à l'extérieur de la résine, et l'effet de rayonnement est maximisé. Les intervalles entre les câblages du circuit sont totalement exposés, l'humidité peut difficilement adhérer. En outre, même si l'humidité extérieure pénètre, il est difficile de provoquer la corrosion parce qu'il n'y a pas de fil métallique.
PCT/CN2016/113993 2016-07-29 2016-12-31 Module de puissance intelligent et son procédé de fabrication WO2018018849A1 (fr)

Applications Claiming Priority (14)

Application Number Priority Date Filing Date Title
CN201610616067.7A CN106067450A (zh) 2016-07-29 2016-07-29 一种智能功率模块及其制造方法
CN201610616058.8A CN106024651A (zh) 2016-07-29 2016-07-29 一种智能功率模块及其制造方法
CN201610616058.8 2016-07-29
CN201610616067.7 2016-07-29
CN201610693508.3 2016-08-19
CN201610693508.3A CN106098652A (zh) 2016-08-19 2016-08-19 一种智能功率模块及其制造方法
CN201610783777.9A CN106298698A (zh) 2016-08-31 2016-08-31 一种智能功率模块及其制造方法
CN201610783777.9 2016-08-31
CN201611036146.7 2016-11-15
CN201611036147.1 2016-11-15
CN201621257329.7U CN206163481U (zh) 2016-11-15 2016-11-15 智能功率模块
CN201611036146.7A CN106409787A (zh) 2016-11-15 2016-11-15 智能功率模块及其制造方法
CN201611036147.1A CN106409778A (zh) 2016-11-15 2016-11-15 智能功率模块及其制造方法
CN201621257329.7 2016-11-15

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