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WO2008139996A1 - Matériau de liaison de circuit similaire à un film et structure de liaison pour un élément de circuit - Google Patents

Matériau de liaison de circuit similaire à un film et structure de liaison pour un élément de circuit Download PDF

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Publication number
WO2008139996A1
WO2008139996A1 PCT/JP2008/058489 JP2008058489W WO2008139996A1 WO 2008139996 A1 WO2008139996 A1 WO 2008139996A1 JP 2008058489 W JP2008058489 W JP 2008058489W WO 2008139996 A1 WO2008139996 A1 WO 2008139996A1
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WO
WIPO (PCT)
Prior art keywords
circuit
film
connecting material
connection structure
circuit connecting
Prior art date
Application number
PCT/JP2008/058489
Other languages
English (en)
Japanese (ja)
Inventor
Nichiomi Mochizuki
Motohiro Arifuku
Kazuyoshi Kojima
Kouji Kobayashi
Original Assignee
Hitachi Chemical Company, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Company, Ltd. filed Critical Hitachi Chemical Company, Ltd.
Priority to JP2009514131A priority Critical patent/JP4941554B2/ja
Priority to KR1020097013931A priority patent/KR101100507B1/ko
Priority to CN2008800141483A priority patent/CN101675715B/zh
Publication of WO2008139996A1 publication Critical patent/WO2008139996A1/fr

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    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
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    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
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    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
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    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
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    • C08G18/4205—Polycondensates having carboxylic or carbonic ester groups in the main chain containing cyclic groups
    • C08G18/4208—Polycondensates having carboxylic or carbonic ester groups in the main chain containing cyclic groups containing aromatic groups
    • C08G18/4211—Polycondensates having carboxylic or carbonic ester groups in the main chain containing cyclic groups containing aromatic groups derived from aromatic dicarboxylic acids and dialcohols
    • C08G18/4213—Polycondensates having carboxylic or carbonic ester groups in the main chain containing cyclic groups containing aromatic groups derived from aromatic dicarboxylic acids and dialcohols from terephthalic acid and dialcohols
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    • C08G18/4266—Polycondensates having carboxylic or carbonic ester groups in the main chain prepared from hydroxycarboxylic acids and/or lactones
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    • C08G18/753—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring containing at least one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group containing one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group having a primary carbon atom next to the isocyanate or isothiocyanate group
    • C08G18/755—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring containing at least one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group containing one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group having a primary carbon atom next to the isocyanate or isothiocyanate group and at least one isocyanate or isothiocyanate group linked to a secondary carbon atom of the cycloaliphatic ring, e.g. isophorone diisocyanate
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    • C08G18/76—Polyisocyanates or polyisothiocyanates cyclic aromatic
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    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
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  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Combinations Of Printed Boards (AREA)
  • Adhesive Tapes (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)

Abstract

La présente invention concerne un matériau de liaison de circuit similaire à un film pour relier électriquement un premier élément de circuit, une première électrode de circuit étant formée sur une surface majeure d'une première carte de circuit, avec un second élément de circuit, une seconde électrode de circuit étant formée sur une surface majeure d'une seconde carte de circuit, de manière telle que les première et seconde électrodes de circuit se retrouvent face à face. le matériau de liaison de circuit similaire à un film contient un matériau de formation de film, un composant radicalement polymérisable un initiateur de polymérisation de radical qui génère un radical libre quand il est chauffé et un composant contenant un groupe d'isocyanates. Dans ce matériau de liaison de circuit similaire à un film, le composant contenant un groupe d'isocyanates est contenu selon une quantité de 0,09-5 parties en masse pour 100 parties sur masse de la totalité du matériau de formation de film et du composant radicalement polymérisable.
PCT/JP2008/058489 2007-05-09 2008-05-07 Matériau de liaison de circuit similaire à un film et structure de liaison pour un élément de circuit WO2008139996A1 (fr)

Priority Applications (3)

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JP2009514131A JP4941554B2 (ja) 2007-05-09 2008-05-07 フィルム状回路接続材料及び回路部材の接続構造
KR1020097013931A KR101100507B1 (ko) 2007-05-09 2008-05-07 필름상 회로 접속 재료 및 회로 부재의 접속 구조
CN2008800141483A CN101675715B (zh) 2007-05-09 2008-05-07 膜状电路连接材料及电路部件的连接结构

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JP2007124436 2007-05-09
JP2007-124436 2007-05-09

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CN104559898A (zh) * 2013-10-16 2015-04-29 日立化成株式会社 粘接剂组合物和连接体
JP2015166406A (ja) * 2014-03-03 2015-09-24 日立化成株式会社 接着剤組成物及び接続体
JPWO2016199252A1 (ja) * 2015-06-10 2018-03-29 日立化成株式会社 接着剤組成物及び接続体
JP2018184607A (ja) * 2018-06-27 2018-11-22 日立化成株式会社 接着剤組成物及び接続体
JP2020521852A (ja) * 2017-05-31 2020-07-27 ダウ グローバル テクノロジーズ エルエルシー 溶剤系接着剤組成物

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CN107613675A (zh) * 2017-08-10 2018-01-19 维沃移动通信有限公司 一种柔性电路板的压合方法、集成电路板及移动终端
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CN102449095B (zh) * 2010-07-26 2016-06-01 日立化成株式会社 粘接剂组合物、连接结构体、连接结构体的制造方法以及粘接剂组合物的应用
JP5855459B2 (ja) * 2010-07-26 2016-02-09 日立化成株式会社 回路部材の接続構造体
CN102449096A (zh) * 2010-07-26 2012-05-09 日立化成工业株式会社 粘接剂组合物、连接结构体、连接结构体的制造方法、以及粘接剂组合物的应用
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JP5454578B2 (ja) * 2010-07-26 2014-03-26 日立化成株式会社 接着剤組成物、接続構造体、接続構造体の製造方法及び接着剤組成物の応用
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WO2012014563A1 (fr) * 2010-07-26 2012-02-02 日立化成工業株式会社 Composition adhésive, structure de connexion, procédé de fabrication de la structure de connexion et application de la composition adhésive
WO2012014562A1 (fr) * 2010-07-26 2012-02-02 日立化成工業株式会社 Composition adhésive, structure de connexion, procédé de fabrication d'une structure de connexion et application de la composition adhésive
CN103589384B (zh) * 2010-07-26 2016-03-02 日立化成株式会社 粘接剂组合物、连接结构体、连接结构体的制造方法、以及粘接剂组合物的应用
CN102449095A (zh) * 2010-07-26 2012-05-09 日立化成工业株式会社 粘接剂组合物、连接结构体、连接结构体的制造方法以及粘接剂组合物的应用
CN104559902A (zh) * 2013-10-09 2015-04-29 日立化成株式会社 电路连接材料、电路构件的连接结构体、和电路构件的连接结构体的制造方法
CN104559898A (zh) * 2013-10-16 2015-04-29 日立化成株式会社 粘接剂组合物和连接体
JP2015166406A (ja) * 2014-03-03 2015-09-24 日立化成株式会社 接着剤組成物及び接続体
JPWO2016199252A1 (ja) * 2015-06-10 2018-03-29 日立化成株式会社 接着剤組成物及び接続体
JP2020521852A (ja) * 2017-05-31 2020-07-27 ダウ グローバル テクノロジーズ エルエルシー 溶剤系接着剤組成物
JP7149292B2 (ja) 2017-05-31 2022-10-06 ダウ グローバル テクノロジーズ エルエルシー 溶剤系接着剤組成物
US11773303B2 (en) 2017-05-31 2023-10-03 Dow Global Technologies Llc Solvent-based adhesive compositions
JP2018184607A (ja) * 2018-06-27 2018-11-22 日立化成株式会社 接着剤組成物及び接続体

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CN101675715A (zh) 2010-03-17
CN101982515A (zh) 2011-03-02
CN102199404B (zh) 2013-12-04
CN101982515B (zh) 2013-07-03
TWI378745B (fr) 2012-12-01
TWI378751B (fr) 2012-12-01
CN101675715B (zh) 2011-06-08
KR20090086465A (ko) 2009-08-12
TW200913808A (en) 2009-03-16
CN102199404A (zh) 2011-09-28
TW201130940A (en) 2011-09-16
JPWO2008139996A1 (ja) 2010-08-05
JP4941554B2 (ja) 2012-05-30
KR101100507B1 (ko) 2011-12-29

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