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WO2008139996A1 - Film-like circuit connecting material and connection structure for circuit member - Google Patents

Film-like circuit connecting material and connection structure for circuit member Download PDF

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Publication number
WO2008139996A1
WO2008139996A1 PCT/JP2008/058489 JP2008058489W WO2008139996A1 WO 2008139996 A1 WO2008139996 A1 WO 2008139996A1 JP 2008058489 W JP2008058489 W JP 2008058489W WO 2008139996 A1 WO2008139996 A1 WO 2008139996A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit
film
connecting material
connection structure
circuit connecting
Prior art date
Application number
PCT/JP2008/058489
Other languages
French (fr)
Japanese (ja)
Inventor
Nichiomi Mochizuki
Motohiro Arifuku
Kazuyoshi Kojima
Kouji Kobayashi
Original Assignee
Hitachi Chemical Company, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Company, Ltd. filed Critical Hitachi Chemical Company, Ltd.
Priority to JP2009514131A priority Critical patent/JP4941554B2/en
Priority to KR1020097013931A priority patent/KR101100507B1/en
Priority to CN2008800141483A priority patent/CN101675715B/en
Publication of WO2008139996A1 publication Critical patent/WO2008139996A1/en

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    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
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  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Combinations Of Printed Boards (AREA)
  • Adhesive Tapes (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)

Abstract

Disclosed is a film-like circuit connecting material for electrically connecting a first circuit member, wherein a first circuit electrode is formed on a major surface of a first circuit board, with a second circuit member, wherein a second circuit electrode is formed on a major surface of a second circuit board, in such a manner that the first and second circuit electrodes face each other. The film-like circuit connecting material contains a film-forming material, a radically polymerizable compound, a radical polymerization initiator which generates a free radical when heated, and an isocyanate group-containing compound. In this film-like circuit connecting material, the isocyanate group-containing compound is contained in an amount of 0.09-5 parts by mass relative to 100 parts by mass of the total of the film-forming material and the radically polymerizable compound.
PCT/JP2008/058489 2007-05-09 2008-05-07 Film-like circuit connecting material and connection structure for circuit member WO2008139996A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2009514131A JP4941554B2 (en) 2007-05-09 2008-05-07 Film-like circuit connection material and circuit member connection structure
KR1020097013931A KR101100507B1 (en) 2007-05-09 2008-05-07 Connection structure of film-form circuit connection material and circuit member
CN2008800141483A CN101675715B (en) 2007-05-09 2008-05-07 Film-like circuit connecting material and connection structure for circuit member

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007124436 2007-05-09
JP2007-124436 2007-05-09

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WO2008139996A1 true WO2008139996A1 (en) 2008-11-20

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KR (1) KR101100507B1 (en)
CN (3) CN101675715B (en)
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WO (1) WO2008139996A1 (en)

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CN104559902A (en) * 2013-10-09 2015-04-29 日立化成株式会社 Circuit connecting material, connection structure of circuit members, and method for manufacturing connection structure of circuit member
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JPWO2016199252A1 (en) * 2015-06-10 2018-03-29 日立化成株式会社 Adhesive composition and connector
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CN101675715A (en) 2010-03-17
CN101982515A (en) 2011-03-02
CN102199404B (en) 2013-12-04
CN101982515B (en) 2013-07-03
TWI378745B (en) 2012-12-01
TWI378751B (en) 2012-12-01
CN101675715B (en) 2011-06-08
KR20090086465A (en) 2009-08-12
TW200913808A (en) 2009-03-16
CN102199404A (en) 2011-09-28
TW201130940A (en) 2011-09-16
JPWO2008139996A1 (en) 2010-08-05
JP4941554B2 (en) 2012-05-30
KR101100507B1 (en) 2011-12-29

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