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WO2007046190A1 - Composition adhesive, materiau de connexion de circuit, structure de connexion de connecteurs de circuit ainsi que dispositifs a semi-conducteurs - Google Patents

Composition adhesive, materiau de connexion de circuit, structure de connexion de connecteurs de circuit ainsi que dispositifs a semi-conducteurs Download PDF

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Publication number
WO2007046190A1
WO2007046190A1 PCT/JP2006/316589 JP2006316589W WO2007046190A1 WO 2007046190 A1 WO2007046190 A1 WO 2007046190A1 JP 2006316589 W JP2006316589 W JP 2006316589W WO 2007046190 A1 WO2007046190 A1 WO 2007046190A1
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WO
WIPO (PCT)
Prior art keywords
circuit
adhesive composition
semiconductor element
film
adhesive
Prior art date
Application number
PCT/JP2006/316589
Other languages
English (en)
Japanese (ja)
Inventor
Toshiaki Shirasaka
Shigeki Katogi
Original Assignee
Hitachi Chemical Company, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Company, Ltd. filed Critical Hitachi Chemical Company, Ltd.
Priority to JP2007540896A priority Critical patent/JPWO2007046190A1/ja
Publication of WO2007046190A1 publication Critical patent/WO2007046190A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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Definitions

  • Adhesive composition Adhesive composition, circuit connection material, circuit member connection structure and semiconductor device
  • the present invention relates to an adhesive composition, a circuit connection material, a circuit member connection structure, and a semiconductor device.
  • thermosetting resin such as an epoxy resin having excellent adhesiveness and particularly excellent adhesiveness even under high temperature and high humidity conditions has been used.
  • a curing agent such as epoxy resin, phenol resin having reactivity with epoxy resin, and a thermal latent catalyst that promotes the reaction between the epoxy resin and the curing agent are generally used. Speak. Thermal latent catalysts are important factors that determine the curing temperature and curing rate of adhesives, and various compounds are used from the viewpoint of storage stability at room temperature and curing rate during heating! .
  • Such an adhesive is usually cured by heating at a temperature of 170 to 250 ° C. for 1 to 3 hours, thereby obtaining adhesiveness.
  • radical curing type adhesives which are a combination of an acrylate derivative or a meta acrylate derivative (hereinafter referred to as a (meth) acrylate derivative) and a peroxide as a radical polymerization initiator. Radical curing can be cured in a short time because radicals which are reactive species are highly reactive (see, for example, Patent Documents 2 and 3).
  • Patent Document 1 Japanese Patent Laid-Open No. 01-113480
  • Patent Document 2 Japanese Patent Laid-Open No. 2002-203427
  • Patent Document 3 Pamphlet of International Publication No. 98Z044067
  • the radical curable adhesive is highly reactive, the process margin when performing the curing process tends to be narrow.
  • the process conditions such as temperature and time for obtaining the cured product vary slightly, the adhesive strength There is a tendency that characteristics such as connection resistance cannot be stably obtained.
  • the present invention has been made in view of the above circumstances, and is capable of performing a curing process sufficiently quickly at a low temperature, and has a sufficiently stable characteristic in which a process margin during the curing process is wide. It is an object of the present invention to provide an adhesive composition having (adhesive strength and connection resistance), a circuit connection material using the same, a circuit member connection structure, and a semiconductor device. Means for solving the problem
  • the present invention is an adhesive composition
  • an adhesive component comprising a thermoplastic resin, a radical polymerizable compound and a radical polymerization initiator, wherein the adhesive component is an ESR at 25 ° C.
  • An adhesive composition having a signal in measurement is provided.
  • This adhesive composition can be cured sufficiently quickly at a low temperature, and obtains sufficiently stable characteristics such as adhesive strength and connection resistance with a wide process margin during the curing process. Can do.
  • the factor which produces the effect which the adhesive composition of this invention shows is not clarified in detail at present, the present inventors consider the following factors. However, the factor is not limited to this.
  • the factor that enables short-time curing at low temperatures is mainly due to the adhesive composition of the present invention.
  • the product is a so-called radical curable adhesive composition containing an adhesive component such as a thermoplastic resin, a radical polymerizable compound and a radical polymerization initiator.
  • the adhesive composition of the present invention has a signal mainly during ESR measurement at 25 ° C. It is because it contains an agent component. That is, the adhesive component according to the present invention has stable radicals.
  • the adhesive composition of the present invention when used, the curing treatment can be performed in a short time and the process margin can be widened. Therefore, the adhesive composition of the present invention heats not only the desired connection part but also the peripheral member even if the pitch between the elements such as the semiconductor element and the liquid crystal element is narrowed, and damages the peripheral member. Can be prevented and throughput can be improved.
  • the adhesive composition of the present invention preferably has a g value of 2.000 0 to 2.0100 in ESR measurement of the adhesive component. By having such a g value, the obtained adhesive composition can further widen the process margin when performing the curing treatment.
  • the above-described adhesive component preferably further contains a stable radical compound.
  • the “stable radical compound” refers to a compound that continues for 10 minutes or more at a state force of 25 ° C. where the spin density in an equilibrium state measured by ESR measurement is 10 16 spinZg or more.
  • the above stable radical compound is preferably a nitroxide compound.
  • the adhesive composition can further widen the process margin when performing the curing treatment.
  • the adhesive composition of the present invention comprises 50 to 250 parts by mass of a radical polymerizable compound, 0.05 to 30 parts by mass of a radical polymerization initiator, and a stable radical with respect to 100 parts by mass of thermoplastic resin.
  • Cal compound 0.01 ⁇ It is preferable to contain L0 parts by mass.
  • Adhesive composition of the present invention The product can exhibit the effect of the present invention more remarkably by setting the constituent material to a blending ratio in the above range.
  • the adhesive composition of the present invention preferably further contains conductive particles.
  • Such an adhesive composition itself can easily have electrical conductivity. Therefore, this adhesive composition can be used as a conductive adhesive in the fields of electrical and electronic industries such as circuit electrodes and semiconductors. Furthermore, in this case, since the adhesive composition has electrical conductivity, it becomes possible to further lower the connection resistance after curing.
  • the adhesive composition of the present invention preferably contains 0.5 to 30 parts by mass of conductive particles with respect to 100 parts by mass of thermoplastic resin.
  • a blending ratio of the conductive particles can further exert the effect of the conductive particles.
  • anisotropic conductivity can be provided to prevent electrical conduction between opposing circuit electrodes or short-circuiting between adjacent circuit electrodes.
  • the adhesive composition containing the conductive particles in the above-described blending ratio can further show the electrical connection anisotropy, and can be used as an anisotropic conductive adhesive composition. become able to.
  • the circuit connection material of the present invention is a circuit connection material for electrically connecting opposing circuit electrodes, and the circuit connection material preferably contains the above-described adhesive composition.
  • the circuit electrodes facing each other can be bonded to each other in a sufficiently short time even at a low temperature, and the process margin can be widened. Furthermore, the cured product obtained with such a circuit connecting material strength can have a stable adhesive strength even if the process temperature and time for obtaining the cured product vary. In addition, it is possible to suppress a decrease in adhesive strength over time of the cured product of the circuit connecting material. Furthermore, if this circuit connecting material contains the conductive particles in the above-mentioned blending ratio, the electrical connection anisotropy can be shown even better, and as an anisotropic conductive circuit connecting material for circuit electrodes. It can also be used.
  • the present invention provides a film adhesive obtained by forming the above-described adhesive composition into a film.
  • the present invention also provides a film formed by forming the above-mentioned circuit connection material into a film shape. Provide a circuit connection material. Since the adhesive composition or circuit connecting material in the form of a film is excellent in handleability, the throughput can be further improved.
  • the present invention provides a first circuit member in which a first circuit electrode is formed on a main surface of a first circuit board, and a second circuit electrode on a main surface of a second circuit board.
  • the second circuit member formed is provided between the main surface of the first circuit board and the main surface of the second circuit board, and the first circuit electrode and the second circuit electrode are arranged to face each other.
  • connection structure of circuit members can effectively use electrically connected circuit electrodes. That is, since the above-described circuit connection material is used so that the first circuit electrode and the second circuit electrode can be electrically connected, the circuit member having the connection structure of the present invention has a sufficiently low variation in quality. Stable characteristics can be shown. Furthermore, when the cured product of the circuit connection material contains conductive particles, the connection resistance can be lowered. By blending the conductive particles, selective electrical connection between desired members can be easily performed. Further, if the conductive particles are contained in the above-mentioned blending ratio, the anisotropic electrical connection is shown, and an anisotropic conductive circuit connecting material can be obtained.
  • the present invention also includes a semiconductor element, a substrate on which the semiconductor element is mounted, a semiconductor element and a semiconductor element connection member that is provided between the semiconductor element and the substrate and electrically connects the semiconductor element and the substrate.
  • the connection member provides a semiconductor device that is a cured product or a film-like adhesive of the above-described adhesive composition.
  • the cured product of the adhesive composition that electrically connects the semiconductor element and the substrate is the cured product of the above-described adhesive composition, the variation in quality is sufficiently small. Can exhibit stable characteristics. Furthermore, when the cured product of the adhesive composition contains conductive particles, the connection resistance can be lowered. By blending these conductive particles, sufficient conductivity can be secured between the semiconductor element and the substrate facing each other.
  • the curing process can be performed sufficiently quickly at a low temperature, and the process margin during the curing process is wide and the characteristics are sufficiently stable (adhesion strength and connection resistance). And a circuit connection material, a circuit member connection structure, and a semiconductor device using the same.
  • FIG. 1 is a partial cross-sectional view showing an embodiment of a circuit member connection structure according to the present invention.
  • FIG. 2 is a series of process diagrams for connecting circuit members.
  • FIG. 3 is a partial cross-sectional view showing an embodiment of a semiconductor device of the present invention.
  • the adhesive composition of the present invention contains an adhesive component containing a thermoplastic resin, a radical polymerizable compound, and a radical polymerization initiator, and this adhesive component is used for ESR measurement at 25 ° C.
  • V has a signal.
  • thermoplastic resin according to the present invention is used for strengthening the adhesion between objects to be bonded (hereinafter simply referred to as “adhered bodies").
  • thermoplastic rosin used in the present invention is not particularly limited and a known one is used. be able to. Specifically, for example, polyamides, phenoxy resins, poly (meth) acrylates, polyimides, polyurethanes, polyesters, polybutyrals, and the like can be used. These can be used alone or in admixture of two or more. Furthermore, these rosins may contain a siloxane bond or a fluorine substituent in the molecule. These can be suitably used as long as the mixed fats are completely compatible with each other or microphase separation occurs and the mixture becomes cloudy.
  • the molecular weight of the thermoplastic resin described above is not particularly limited, the larger the molecular weight of the thermoplastic resin, the easier it is to form a film, which will be described later. It is also possible to set the melt viscosity that affects the mobility in a wide range. If the melt viscosity can be set in a wide range, when used for connection of semiconductor elements, liquid crystal elements, etc., even if the pitch between elements and between wirings is narrowed, adhesion of adhesive to peripheral members is further prevented. And throughput can be improved.
  • the general weight average molecular weight is 5,000 to 150,000 force, 10000 to 80,000 force is especially preferred! When the weight average molecular weight is less than 5,000, the film formability tends to be insufficient when used as a film described later, and when the weight average molecular weight exceeds 150,000, the compatibility with other components tends to be poor.
  • the weight average molecular weight in the present specification is determined by gel permeation chromatography (GPC) analysis under the following conditions according to the following conditions, and converted using a standard polystyrene calibration curve.
  • the radical polymerizable compound used in the present invention is given some energy.
  • a compound having the ability to generate a radical and polymerize the radical by a chain reaction to form a polymer This radical polymerization reaction generally proceeds more rapidly than cationic polymerization or cation polymerization. Therefore, in the present invention using a radical polymerizable compound, polymerization can be performed in a relatively short time.
  • the radical polymerizable compound used in the present invention is particularly a compound having a carbon-carbon double bond in the molecule, such as a (meth) acryl group, a (meth) acryloyl group or a vinyl group.
  • a well-known thing can be used without a restriction
  • a radically polymerizable compound having a (meth) atalyloyl group is preferred.
  • radical polymerizable compound examples include, for example, epoxy (meth) acrylate oligomer, urethane (meth) acrylate oligomer, polyether (meth) acrylate oligomer, polyester (meth) acrylate. Oligomers such as oligomers, trimethylolpropane tri
  • (Meth) acrylate polyethylene glycol di (meth) acrylate, polyalkylene glycol di (meth) acrylate, dicyclopentane (meth) acrylate, dicyclopente-mouth quichetil (meth) acrylate, neopentyl glycol di (meta ) Atalylate, dipenta erythritol hexa (meth) attalylate, isocyanuric acid modified bifunctional (meth) acrylate, isocyanuric acid modified trifunctional (meth) attalylate, 2, 2'-di (meth) atta loyroyloxy jet And polyfunctional (meth) atare toy compounds such as ruphosphate and 2- (meth) atariloylokischeyl acid phosphate. These compounds may be used alone or in combination of two or more as required.
  • the radically polymerizable compound according to the present invention can be firmly bonded regardless of the material of the adherend, as long as it has a (meth) atalyloyl group as a reactive group.
  • This adherend includes organic substrates such as printed wiring boards and polyimides, metals such as copper and aluminum, ITO (indium tin oxide), silicon nitride (SiN), silicon dioxide (SiO 2), etc. From materials containing
  • the base material which becomes is mentioned.
  • the blending ratio of the radical polymerizable compound in the adhesive composition of the present invention is preferably 50 to 250 parts by mass with respect to 100 parts by mass of the thermoplastic resin. More preferred to be a department. If the blending ratio of the radical polymerizable compound is less than 50 parts by mass, the heat resistance of the cured product of the adhesive composition tends to decrease, and if it exceeds 250 parts by mass, When the adhesive composition is used as a film to be described later, the film formability tends to be insufficient.
  • the adhesive composition of the present invention contains a radical polymerization initiator.
  • the radical polymerizable compound once undergoes a radical polymerization reaction, undergoes a chain reaction and can be hardened.
  • a radical polymerization initiator capable of generating radicals relatively easily is contained in the adhesive composition.
  • a known compound such as a peroxide azo compound known in the art can be used. Specifically, Tamil peroxyneodecanoate, 1, 1, 3, 3-tetramethylbutyl peroxyneodecanoate, 1-cyclohexyl 1-methylethylperoxyneodecanoate, t Monohexyloxyneodecanoate, t-butylperoxyneodecanoate, t-butylperoxybivalate, 1,1,3,3-tetramethylbutylperoxy-2-ethylhexanoate, 2, 5 Dimethyl-2-2,5-di (2-ethylhexylperoxy) hexane, tert-hexyloxy-2-ethynolehexanoate, tert-butylenoperoxy-2-ethenorehexanoate, t-butylperoxyne
  • peroxyester derivatives or disilveroxide having a 1 minute half-life temperature of 90 to 175 ° C and a weight average molecular weight of 180 to 1000 are preferred!
  • one-minute half-life temperature refers to the temperature at which the half-life is 1 minute
  • half-life refers to the time until the concentration of the compound decreases to half of the initial value.
  • the half-life temperature of the radical polymerization initiator is 90 to 175 ° C
  • the cured product obtained from the adhesive composition of the present invention can have superior connection resistance compared to conventional ones. It becomes.
  • the blending ratio of the radical polymerization initiator in the adhesive composition of the present invention is preferably 0.05 to 30 parts by mass with respect to 100 parts by mass of the thermoplastic resin. More preferably, it is ⁇ 20 parts by mass.
  • the blending ratio of the radical polymerization initiator is less than 0.05 parts by mass, the polymerization rate of the radical polymerization tends to decrease, and the cured product of the adhesive composition tends to be insufficiently cured.
  • the blending ratio of the agent exceeds 30 parts by mass, the storage stability of the adhesive composition tends to be lowered.
  • the form of energy to be applied is not particularly limited, and examples thereof include heat, electron beam, gamma ray, ultraviolet ray, infrared ray, visible light, microwave and the like.
  • the adhesive component according to the present invention contains the above-mentioned thermoplastic resin, radical polymerizable compound, and radical polymerization initiator, and has a signal for ESR measurement at 25 ° C. ing.
  • ESR is an abbreviation for Electron Spin Resonance, and this measurement can detect radical species present in a sample.
  • “having an ESR measurement signal” refers to a signal having a signal intensity of 1.0 ⁇ 10 16 spi nsZg or more in terms of spin density.
  • the spin density can be obtained by comparison with the signal intensity when 4-hydroxy 2,2, 6, 6-tetramethylpiperidine 1-oxyl with a known concentration is used as a standard sample.
  • the ESR signal in the present specification is obtained by measurement under the following conditions: Equipment used: ESP350 (BRUKER, product name)
  • Microwave frequency counter HP5351B (trade name, manufactured by HEWLETT PACKARD)
  • Gauss meter ER035M (trade name, manufactured by BRUKER)
  • ESR measurement the sample is not restricted by the shape or phase state (solid, liquid, gas), and ESR measurement is possible even in a film form.
  • the radicals in it show anisotropy with respect to the magnetic field and show a wide and asymmetric signal. Therefore, in the present invention, ESR measurement is performed using a solution in which the sample is dissolved in a solvent.
  • the solvent to be used is not particularly limited as long as the sample is soluble, but in the present invention where black mouth form is preferred, black mouth form is used.
  • the solution in which the sample is dissolved may be measured only for the filtrate by filtering insoluble matter such as particles or filler as necessary.
  • the measurement temperature may be room temperature, but when measuring ESR in film form, it may be measured at low temperature to facilitate analysis. In the present invention, ESR is measured at 25 ° C.
  • the adhesive composition contains conductive particles in addition to the adhesive component! /, It is preferable that the adhesive component itself has a signal after the SR measurement. . Force that may have a signal in ESR measurement based on the metal component used in the conductive particles In such a case, it is difficult to obtain the effect of the present invention.
  • An adhesive composition containing an adhesive component having such an ESR signal indicates that the radicals contained therein are stably present.
  • radical polymerization is said to have high growth radicals and high reactivity, making it difficult to control the polymerization rate. Only In the case where the adhesive composition contains radicals that exist stably (hereinafter referred to as “stable radicals”), the progress rate of radical polymerization can be controlled.
  • a stable radical compound is a radical compound even though it is stable, and therefore has a very high reactivity with an initiating radical species or a polymerization terminal radical. Therefore, stable radicals almost completely trap radicals that also generate radical polymerization initiator forces.
  • the adhesive component in the adhesive composition preferably has a g value of 2.0000 to 2.0100 in ESR measurement. This g value is given by the following equation (A).
  • Equation (A) h is Planck's constant ( 6.661 X 10 _34 Js), v is the microwave frequency ( ⁇ ⁇ ⁇ ), ⁇ is Bohr magneton (9.2740 X 10 " 24 J / T) and H indicate the resonance magnetic field (T).
  • the ESR signal may give a split signal based on the nuclear spin, certain! /, Based on the interaction between radicals.
  • the center of the split signal is the resonance magnetic field.
  • the center between the signal on the lowest magnetic field side and the signal on the highest magnetic field side is the center of the signal, and that is the resonance magnetic field.
  • a g value of 2.0000-2.100 indicates that the adhesive component generally contains a ⁇ -electron radical species of an organic compound. By having such radical species, the adhesive composition of the present invention can more effectively exhibit the effect of extending the process margin. It is preferable that the g value is 2. 0040-2.0090 because the process margin can be expanded more effectively.
  • the adhesive component In order for the adhesive component to have the g value as described above, a transition metal, a ferromagnetic material, a method of adding a radical species of a stable organic compound, and the like can be mentioned.
  • the adhesive composition of the present invention It is most preferable to add a stable radical compound.
  • the stable radical compound used in the present invention is not particularly limited as long as it is an organic compound having a ⁇ -electron radical species, and known compounds can be used.
  • the stable radical compound include a -troxide compound having an aminoxyl group (> ⁇ - ⁇ ⁇ ). Specific examples thereof include -troxoxide compounds represented by the following general formula (I).
  • R 1 is a hydrogen atom, a hydroxyl group, an amino group, a carboxyl group, a cyano group, a thioisocyanate group, an alkyl group having 1 to 10 carbon atoms, an aryl group, or a carbon number.
  • 1 to 20 represents an alkoxy group, an ester group or an amide group
  • X 1 , X 2 , X 3 and X 4 each independently represent a hydrogen atom or an alkyl group having 1 to 5 carbon atoms.
  • examples of the nitroxide compound include compounds represented by the following formulas (1) to (16).
  • the above-mentioned stable radical compounds may be used alone or in combination of two or more.
  • the blending ratio of the stable radical compound is preferably 0.01 to 10 parts by mass with respect to 100 parts by mass of the thermoplastic resin, more preferably 0.02 to 0.5 parts by mass. If the blending ratio is less than 0.01 parts by mass, the above-mentioned effect due to the stable radical compound will be difficult to achieve, and if it exceeds 10 parts by mass, the curability of the adhesive composition tends to decrease.
  • the adhesive composition of the present invention preferably contains conductive particles. By containing conductive particles, conductivity can be imparted to the adhesive composition. This Thus, the adhesive composition of the present invention can be used as a conductive adhesive in the fields of electrical and electronic industries such as circuit electrodes and semiconductors.
  • the conductive particles used in the present invention are not particularly limited as long as they have conductivity capable of obtaining electrical connection.
  • the conductive particles include metals such as Au, Ag, Ni, Cu and solder, or carbon.
  • non-conductive glass, ceramic, plastic or the like may be used as a core, and the core may be coated with the metal particles or carbon.
  • the case where the metal itself is a heat-meltable metal, or the case where the metal is coated with metal or carbon with a plastic as a core is preferable. In these cases, since it becomes easier to deform the cured product of the adhesive composition by heating or pressurization, the contact area between the electrode and the adhesive composition is increased when the electrodes are electrically connected to each other. Thus, the conductivity between the electrodes can be improved.
  • the adhesive composition of the present invention may contain layered particles in which the surface of the conductive particles is covered with a polymer resin. If the conductive particles are added to the adhesive composition in the form of layered particles, even if the amount of the conductive particles is increased, they are covered with the resin so that a short circuit occurs due to contact between the conductive particles. Occurrence can be further suppressed, and insulation between electrode circuits can be improved. These conductive particles and layered particles may be used alone or in combination of two or more.
  • the average particle size of the conductive particles is preferably 1 to 18 ⁇ m from the viewpoint of dispersibility and conductivity. Moreover, it is preferable that the mixture ratio of electroconductive particle is 0.5-30 mass parts with respect to 100 mass parts of thermoplastic resin. Further, the blending ratio of the conductive particles is preferably 0.1 to 30% by volume with respect to 100% by volume of the adhesive composition, and more preferably 0.1 to 10% by volume. If the blending ratio of the conductive particles is less than 0.1% by volume, sufficient conductivity tends not to be obtained, and if it exceeds 30% by volume, a short circuit tends to occur. The blending ratio (volume%) of the conductive particles is determined based on the volume of each component before curing the adhesive composition at 23 ° C.
  • each component is charged into a container such as a graduated cylinder containing a suitable solvent (water, alcohol, etc.) that wets the component well, such as a method that converts the weight to volume using specific gravity, It can be obtained by the method of calculating the increased volume.
  • a bonding aid such as a coupling agent, an adhesion improver, and an agent may be appropriately added to the adhesive composition of the present invention.
  • an alkoxysilane derivative or a silazane derivative can be used. Among them, it is preferable to add a compound represented by the following general formula (C).
  • R 6 , R 7 and R 8 are each independently a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, an alkoxy group having 1 to 5 carbon atoms, or 1 carbon atom.
  • ⁇ 5 represents an alkoxy carbo group or aryl group
  • R 9 represents a hydrogen atom or a methyl group
  • p represents an integer of 1 to 10.
  • R 6 is an alkyl group or aryl group having 1 to 5 carbon atoms
  • R 7 and R 8 are each independently an alkoxy group having 1 to 3 carbon atoms
  • p is 2 to 4 because it is more excellent in adhesion and connection resistance.
  • the compound represented by the general formula (C) may be used alone or in combination of two or more.
  • the adhesion assistant may be a phosphate ester derivative.
  • the phosphate ester derivative is preferably a compound represented by the following general formula (D).
  • R 2 represents a hydrogen atom or a methyl group
  • n represents an integer of 1 to 10
  • m represents 1 or 2.
  • the adhesive composition of the present invention may be added to the adhesive composition of the present invention depending on the purpose of use.
  • the adhesive strength can be further increased. That is, it has a (meth) atalyloyl
  • a compound having a radical polymerizable functional group such as an aryl group, a maleimide group, or a vinyl group may be added.
  • N-Buremidazole N-Bulupyridine, N-Buylpyrrolidone, N-Buylformamide, N-Buhl force prolatatam, 4, 4, Monovinylidenebis (N, N-dimethylaniline), N-vinylacetamide, N, N-dimethylacrylamide, N-isopropylacrylamide, N, N-ethylacrylamide and the like can be mentioned.
  • These adhesion improvers may be used alone or in combination of two or more.
  • the adhesive composition of the present invention may be used in combination with a fluidity improver such as a monofunctional (meth) acrylate.
  • a fluidity improver such as a monofunctional (meth) acrylate.
  • liquidity of the adhesive composition at the time of a connection can be improved more.
  • the adhesive composition of the present invention may be used in combination with a rubber-based material that improves stress relaxation and adhesion.
  • a rubber-based material that improves stress relaxation and adhesion.
  • the rubber-based material described above is preferably a rubber-based material having high polarity and having a functional group, a cyano group or a carboxyl group as a side chain, or a terminal group. Further, from the viewpoint of improving fluidity, it is more preferable that it is liquid. Specific examples include liquid acrylate-tolyl-butadiene rubber, carboxyl group, hydroxyl group, liquid acrylonitrile-butadiene rubber containing a (meth) atalyloyl group or morpholine group at the polymer end, and liquid carboxyl ⁇ -tolyl rubber. acrylonitrile content force which is a polar group and more preferably 10 to 60 mass 0/0 of the total of these rubber-based material. These rubber materials may be used alone or in combination of two or more.
  • the adhesive composition of the present invention may be used in combination with an additive such as a polymerization inhibitor typified by t-butylpyrocatechol, t-butylphenol, P-methoxyphenol and the like.
  • an additive such as a polymerization inhibitor typified by t-butylpyrocatechol, t-butylphenol, P-methoxyphenol and the like.
  • the adhesive composition of the present invention can be used as a paste when it is liquid at room temperature. If it is solid at room temperature, it can be pasted by using a solvent in addition to heating to make a paste.
  • the solvent that can be used is not particularly limited as long as it does not react with the adhesive composition and exhibits sufficient solubility, but preferably has a boiling point of 50 to 150 ° C. at normal pressure. When the boiling point is less than 50 ° C, the solvent easily evaporates at room temperature, and the workability when producing a film described later tends to deteriorate. On the other hand, if the boiling point exceeds 150 ° C, sufficient adhesive strength tends not to be obtained after bonding, which makes it difficult to volatilize the solvent.
  • the adhesive composition of the present invention can be used in the form of a film.
  • This film-like adhesive is obtained by applying a mixed solution obtained by adding a solvent or the like to an adhesive composition on a peelable substrate such as a fluorine resin film, a polyethylene terephthalate film, a release paper, or a non-woven cloth. It can be obtained by impregnating the substrate with the above mixed solution and placing it on a peelable substrate and removing the solvent and the like.
  • a peelable substrate such as a fluorine resin film, a polyethylene terephthalate film, a release paper, or a non-woven cloth.
  • an anisotropic conductive film can be obtained.
  • the anisotropic conductive film is placed between opposing electrodes on the substrate, and both electrodes can be bonded together by heating and pressurizing, and can be electrically connected.
  • an inorganic material such as a semiconductor, glass or ceramic, an organic material such as polyimide or polycarbonate, or a combination of these composites such as glass Z epoxy can be applied.
  • the adhesive composition of the present invention can be bonded by using both heating and pressurization.
  • the heating temperature is not particularly limited, but a temperature of 50 to 190 ° C is preferable. Generally, the pressure is within a range that does not damage the adherend, and 0.1 to: LOMPa is preferable. These heating and pressurization are preferably performed in the range of 0.5 seconds to 120 seconds.
  • an adhesive composition that can be cured sufficiently quickly at a low temperature and has sufficiently stable characteristics (adhesion strength and connection resistance) with a wide process margin during the curing process. Can be provided.
  • the adhesive composition of the present invention can be cured sufficiently quickly at a low temperature, and has a sufficiently stable characteristic (adhesion strength) with a wide process margin during the curing process.
  • the adhesive composition of the present invention is placed with these circuit members facing each other. It can be applied to one circuit electrode and electrically connected to the other circuit electrode by a radical polymerization reaction.
  • the adhesive composition is used as a circuit connection material in this way, electrical connection can be made in a short time, and even if the process temperature and time during connection vary, the adhesive strength, connection resistance, etc. The characteristics can be stabilized.
  • this circuit connecting material contains conductive particles, it can exhibit anisotropy of electrical connection and can also be used as an anisotropic conductive circuit connecting material for circuit electrodes.
  • the circuit connection material described above can also be used as a circuit connection material of different types of adherends having different thermal expansion coefficients. Specifically, anisotropic conductive adhesive, silver paste, silver film, etc. It can be used as a semiconductor element adhesive material typified by circuit connection material represented by CSP, elastomer for CSP, underfill material for CSP, LOC tape, etc.
  • FIG. 1 is a schematic cross-sectional view showing an embodiment of a circuit member connection structure of the present invention.
  • the circuit member connection structure 1 of the present embodiment includes a first circuit member 20 and a second circuit member 30 that face each other. Between the two circuit members 30, there is provided a circuit connection member 10 for electrically connecting them.
  • the first circuit member 20 includes a first circuit board 21 and a first circuit electrode 22 formed on the main surface 21 a of the circuit board 21. In some cases, an insulating layer (not shown) may be formed on the main surface 21a of the circuit board 21.
  • the second circuit member 30 includes a second circuit board 31 and a second circuit electrode 32 formed on the main surface 31a of the second circuit board 31.
  • an insulating layer (not shown) may be formed on the main surface 31a of the circuit board 31 in some cases.
  • the first circuit member 20 and the second circuit member 30 are not particularly limited as long as electrodes that require electrical connection are formed. Specifically, it is used for liquid crystal displays, and electrodes such as ITO or the like are used to form glass or plastic substrates, printed wiring boards, ceramic wiring boards, flexible wiring boards, semiconductor silicon chips, and the like. They can be used in combination as needed. As described above, in the present embodiment, materials such as printed wiring boards and polyimide, as well as materials having organic properties, such as metals such as copper and aluminum, ITO (indium tin oxide), nitride nitride (SiN), and silicon dioxide (SiO 2) are used. None
  • Circuit members with various surface conditions such as machine materials can be used.
  • the circuit connecting member 10 contains an insulating substance 11 and conductive particles 7.
  • the conductive particles 7 are disposed not only between the first circuit electrode 22 and the second circuit electrode 32 facing each other but also between the main surfaces 21a and 3la.
  • the first circuit electrode 22 and the second circuit electrode 32 are electrically connected via the conductive particles 7. For this reason, the connection resistance between the first circuit electrode 22 and the second circuit electrode 32 is sufficiently reduced. Therefore, the power between the first circuit electrode 22 and the second circuit electrode 32 is The flow of the flow can be made smooth, and the functions of the circuit can be fully exhibited. Further, it is possible to show anisotropy in electrical connection by setting the conductive particles 7 to the above-described mixing ratio.
  • circuit connecting member 10 does not contain the conductive particles 7, a desired amount of current flows between the first circuit electrode 22 and the second circuit electrode 32. They are electrically connected by direct contact or close enough.
  • the circuit connection member 10 is composed of a cured product of the circuit connection material containing the adhesive composition, the circuit connection member 10 is bonded to the first circuit member 20 or the second circuit member 30.
  • the strength is sufficiently high and the connection resistance is sufficiently low, and this state can be maintained for a long period of time. Therefore, the long-term reliability of the electrical characteristics between the first circuit electrode 22 and the second circuit electrode 32 can be sufficiently enhanced.
  • the first circuit member 20 and the film-like circuit connecting material 40 described above are prepared (FIG. 2).
  • the film-like circuit connecting material 40 is formed by forming a circuit connecting material into a film shape.
  • the circuit connecting material contains an adhesive component 5 and conductive particles 7.
  • the adhesive component according to the present invention described above is used for the adhesive component 5.
  • NCP Non-Conductive Paste
  • the circuit connecting material can be used for anisotropic conductive bonding as an insulating adhesive, and is called NCP (Non-Conductive Paste).
  • NCP Non-Conductive Paste
  • the circuit connecting material is sometimes called ACP (Anisotropic Conductive Paste).
  • the thickness of the film-like circuit connecting material 40 is preferably 10 to 50 ⁇ m! /. If the thickness of the film-like circuit connecting material 40 is less than 10 m, the circuit connecting material tends to be insufficiently filled between the circuit electrodes 22 and 32. On the other hand, if it exceeds, the adhesive composition between the circuit electrodes 22 and 32 cannot be sufficiently removed, and it tends to be difficult to ensure conduction between the circuit electrodes 22 and 32.
  • the circuit electrode 22 of the first circuit member 20 is formed from the film-like circuit connecting material 40.
  • the film-like circuit connecting material 40 is adhered on a support (not shown), the film-like circuit connecting material 40 side is directed to the first circuit member 20 so that the first circuit member 20 faces the first circuit member 20. Place on circuit member 20.
  • the film-like circuit connecting material 40 is film-like and easy to handle. Therefore, the film-like circuit connecting material 40 can be easily interposed between the first circuit member 20 and the second circuit member 30, and the first circuit member 20 and the second circuit member 30 Connection work can be performed easily.
  • the film-like circuit connecting material 40 is pressurized in the directions of arrows A and B in Fig. 2 (a), and the film-like circuit connecting material 40 is temporarily connected to the first circuit member 20 (Fig. 2 ( b)).
  • the heating temperature is set to a temperature at which the adhesive composition in the film-like circuit connecting material 40 is not cured, that is, a temperature lower than the temperature at which the radical polymerization initiator generates radicals.
  • the second circuit member 30 is placed on the film-like circuit connection material 40 so that the second circuit electrode faces the first circuit member 20. Put it on.
  • the support is peeled off to place the second circuit member 30 on the film-like circuit connecting material 40. Put it on.
  • the film-like circuit connecting material 40 is pressurized through the first and second circuit members 20 and 30 in the directions of arrows A and B in FIG.
  • the heating temperature at this time is a temperature at which the radical polymerization initiator can generate radicals.
  • radicals are generated in the radical polymerization initiator, and polymerization of the radical polymerizable compound is started.
  • the film-like circuit connecting material 40 is cured, and this connection is made, so that a circuit member connection structure as shown in FIG. 1 is obtained.
  • the heating temperature is, for example, 90 to 200 ° C, and the connection time is, for example, 1 second to 10 minutes. These conditions are appropriately selected depending on the intended use, the adhesive composition, and the circuit member, and may be post-cured as necessary.
  • the conductive particles 7 can be brought into contact with both the opposing circuit electrodes 22 and 32 in the resulting circuit member connection structure.
  • the connection resistance between the circuit electrodes 22 and 32 can be sufficiently reduced.
  • the circuit electrode 22 and the circuit electrode 32 are The adhesive component 5 is cured to become an insulating material 11 in a state where the distance is sufficiently small, and the first circuit member 20 and the second circuit member 30 are firmly connected via the circuit connection member 10. . That is, in the obtained circuit member connection structure, since the circuit connection member 10 is composed of a cured product of the circuit connection material containing the above-mentioned adhesive composition, the circuit connection member 10 for the circuit member 20 or 30 is used. Can be sufficiently increased in adhesive strength, and the connection resistance between the circuit electrodes 22 and 32 can be sufficiently reduced. The circuit member connection structure can maintain such a state for a long period of time. Therefore, the obtained circuit member connection structure sufficiently prevents the change in the distance between the circuit electrodes 22 and 32 with time, and is excellent in the long-term reliability of the electrical characteristics between the circuit electrodes 22 and 32.
  • the adhesive component 5 may include at least a radical polymerization initiator that generates radicals upon heating.
  • a radical polymerization initiator that generates radicals only by light irradiation may be used. It may be used. In this case, when the film-like circuit connecting material 40 is cured, light irradiation may be performed instead of heating.
  • a radical polymerization initiator that generates radicals by ultrasonic waves, electromagnetic waves, or the like may be used as necessary.
  • epoxy resin and latent curing agent may be used as the curable component in the adhesive component 5.
  • connection structure of the circuit member is manufactured using the film-like circuit connection material 40.
  • a circuit that is not formed in a film shape instead of the film-like circuit connection material 40 is used.
  • a connecting material may be used. Even in this case, if the circuit connection material is dissolved in a solvent, and the solution is applied to either the first circuit member 20 or the second circuit member 30 and dried, the first and second circuits are provided.
  • a circuit connecting material can be interposed between the members 20 and 30.
  • conductive particles 7 instead of the conductive particles 7, other conductive materials may be used.
  • Other conductive materials include particulate or short fiber carbon, metal wires such as Au-plated Ni wire, and the like.
  • FIG. 3 is a schematic sectional view showing an embodiment of the semiconductor device of the present invention.
  • the conductor device 2 includes a semiconductor element 50 and a substrate 60 that serves as a semiconductor support member. Between the semiconductor element 50 and the substrate 60, a semiconductor element connection member 80 that electrically connects them is provided. ing.
  • the semiconductor element connection member 80 is laminated on the main surface 60a of the substrate 60, and the semiconductor element 50 is further laminated on the semiconductor element connection member 80.
  • the substrate 60 includes a circuit pattern 61.
  • the circuit pattern 61 is electrically connected to the semiconductor element 50 via the semiconductor connection member 80 on the main surface 60a of the substrate 60 or directly. Then, these are sealed with a sealing material 70 to form the semiconductor device 2.
  • the material of the semiconductor element 50 is not particularly limited, but silicon, germanium group 4 semiconductor element, GaAs, InP, GaP, InGaAs, InGaAsP, AlGaAs, InAs, GaInP, AlInP, AlGalnPln GaNAs ⁇ GaNP ⁇ GalnNAs ⁇ GalnNP ⁇ III-V compound semiconductor elements such as GaSb, InSb, GaN, A1N, InGaN, InNAsP, HgTe, HgCdTe, CdM nTe, CdS, CdSe, MgSe, MgS, ZnSe, ZeTe, etc.
  • Various compounds such as compound semiconductor elements and CuInSe (CIS) can be used.
  • the semiconductor element connection member 80 contains the insulating substance 11 and the conductive particles 7.
  • the conductive particles 7 are disposed not only between the semiconductor element 50 and the circuit pattern 61 but also between the semiconductor element 50 and the main surface 60a.
  • the semiconductor element 50 and the circuit pattern 61 are electrically connected via the conductive particles 7. For this reason, the connection resistance between the semiconductor element 50 and the circuit pattern 61 is sufficiently reduced. Therefore, the current flow between the semiconductor element 50 and the circuit pattern 61 can be made smooth, and the functions of the semiconductor can be fully exhibited.
  • it is also possible to show the anisotropy of electrical connection by setting the conductive particles 7 to the above-described mixing ratio.
  • the semiconductor element connecting member 80 contains the conductive particles 7, the force that directly contacts the semiconductor element 50 and the circuit pattern 61 so that a desired amount of current flows. Or it is electrically connected by being close enough.
  • the semiconductor element connecting member 80 is made of a cured product of the adhesive composition containing the adhesive component. Accordingly, the bonding strength of the semiconductor element connecting member 40 to the semiconductor element 50 and the substrate 60 is sufficiently high, and the gap between the semiconductor element 50 and the circuit pattern 61 is increased. Can be sufficiently reduced. This state can be maintained for a long time. Therefore, the long-term reliability of the electrical characteristics between the semiconductor element 50 and the substrate 60 can be sufficiently increased.
  • a substrate 60 on which a circuit pattern 61 is formed and a film-like semiconductor element connecting material are prepared.
  • the film-like semiconductor element connecting material is formed by forming a semiconductor element connecting material into a film shape.
  • the semiconductor element connecting material contains an adhesive component 5 and conductive particles 7.
  • the adhesive component according to the present invention described above is used as the adhesive component 5.
  • the semiconductor element connection material can be used as an anisotropic adhesive for anisotropic conductive bonding, and is sometimes called NCP (Non-Conductive Paste).
  • NCP Non-Conductive Paste
  • the semiconductor element connection material contains conductive particles 7, the semiconductor element connection material is sometimes called ACP (Anisotropic Conductive Paste).
  • the thickness of the film-like semiconductor element connecting material is preferably 10 to 50 m. If the thickness of the film-like semiconductor element connecting material is less than 10 m, the semiconductor element connecting material tends to be insufficiently filled between the circuit pattern 61 and the semiconductor element 50. On the other hand, if it exceeds, the adhesive composition between the circuit pattern 61 and the semiconductor element 50 cannot be sufficiently removed, and it tends to be difficult to ensure conduction between the circuit pattern 61 and the semiconductor element 50.
  • a film-like semiconductor element connecting material is placed on the surface of the substrate 60 where the circuit pattern 61 is formed.
  • the film-like semiconductor element connecting material adheres on a support (not shown)
  • the film-like semiconductor element connecting material is placed on the substrate 60 so that the film-like semiconductor element connecting material side faces the substrate 60.
  • the film-like semiconductor element connecting material is film-like and easy to handle. Therefore, the film-like semiconductor element connecting material can be easily interposed between the substrate 60 and the semiconductor element 50, and the connection work between the substrate 60 and the semiconductor element 50 can be easily performed.
  • the film-like semiconductor element connecting material is pressurized, and the film-like semiconductor element connecting material is temporarily connected to the substrate 60.
  • the heating temperature is The temperature at which the adhesive composition in the film-like semiconductor element connecting material is not cured, that is, a temperature lower than the temperature at which the radical polymerization initiator generates radicals is set.
  • the semiconductor element 50 is placed on the film-like semiconductor element connecting material.
  • the semiconductor element 50 is placed on the film-like semiconductor element connecting material after the support is peeled off.
  • the film-like semiconductor element connecting material is pressurized through the substrate 60 and the semiconductor element 50 while being heated.
  • the heating temperature at this time is a temperature at which the radical polymerization initiator can generate radicals.
  • radicals are generated in the radical polymerization initiator, and polymerization of the radical polymerizable compound is started.
  • the film-like semiconductor element connecting material is cured, and the main connection is performed.
  • the heating temperature is, for example, 90 to 200 ° C, and the connection time is, for example, 1 second to 10 minutes. These conditions are appropriately selected depending on the intended use, the adhesive composition, and the substrate, and may be post-cured as necessary.
  • the semiconductor element is sealed with grease as necessary.
  • the resin sealing material is formed on the surface of the substrate, but the resin sealing material may also be formed on the surface opposite to the surface of the substrate. As a result, a semiconductor device as shown in FIG. 3 is obtained.
  • the conductive particles 7 can be brought into contact with both the circuit pattern 61 and the semiconductor element 50 facing each other.
  • the connection resistance between the elements 50 can be sufficiently reduced.
  • the adhesive component 5 is cured and becomes an insulating substance 11 in a state where the distance between the circuit pattern 61 and the semiconductor element 50 is sufficiently reduced by heating the film-like semiconductor element connecting material, The substrate 60 and the semiconductor element 50 are firmly connected via the semiconductor element connecting member 80. That is, in the obtained semiconductor device, since the semiconductor element connecting member 80 is formed of a cured product of the semiconductor element connecting material containing the adhesive composition, the semiconductor element connecting member 80 for the substrate 50 or the semiconductor element 50 is used. The bonding strength of the semiconductor element 50 is sufficiently high, and the connection resistance between the semiconductor element 50 and the circuit pattern 61 is sufficiently reduced. Further, in this semiconductor device, such a state is maintained for a long time. Shi Therefore, the obtained semiconductor device can sufficiently prevent the temporal change in the distance between the circuit pattern 61 and the semiconductor element 50, and has excellent long-term reliability of the electrical characteristics between the circuit pattern 61 and the semiconductor element 50.
  • the adhesive component 5 includes at least a radical polymerization initiator that generates radicals by heating.
  • this radical polymerization initiator only light irradiation is used.
  • a radical polymerization initiator that generates radicals may be used.
  • a radical polymerization initiator that generates radicals by ultrasonic waves, electromagnetic waves, or the like may be used as necessary.
  • epoxy resin and latent curing agent may be used as the curable component in adhesive component 5.
  • the semiconductor device is manufactured using the film-like semiconductor element connection material.
  • a semiconductor element connection material that is not formed in a film shape is used. It may be used. Even in this case, if the semiconductor element connection material is dissolved in a solvent and the solution is applied to either the substrate 60 or the semiconductor element 50 and dried, the semiconductor element connection material is interposed between the substrate 60 or the semiconductor element 50. It can be made.
  • conductive particles 7 instead of the conductive particles 7, other conductive materials may be used.
  • Other conductive materials include particulate or short fiber carbon, metal wires such as Au-plated Ni wire, and the like.
  • Methylethylketone manufactured by Wako Pure Chemical Industries, Ltd., trade name: 2-butanone
  • a phenoxy resin Union Carbide, trade name: PKHC, weight average molecular weight 4500 0
  • Feno having a solid content of 40% by mass dissolved in 60 parts by mass
  • a xylose solution was prepared.
  • Polybutylene adipate diol (Aldrich, weight average molecular weight 2000) 450 parts by mass, polyoxytetramethylene glycol (Aldrich, weight average molecular weight 2000) 450 parts by mass and 1,4-butylene glycol (Aldrich) 100 masses Part was dissolved in 4000 parts by mass of methyl ethyl ketone (manufactured by Wako Pure Chemical Industries, Ltd., trade name: 2 butanone, purity 99%). 390 parts by mass of diphenylmethane diisocyanate (manufactured by Aldrich) was added thereto to obtain a reaction solution. Next, the reaction solution was reacted at 70 ° C. for 60 minutes to obtain urethane resin. The temperature control at this time was performed using an oil bath (manufactured by AZONE Corporation, trade name: HOB-50D). The weight average molecular weight of the obtained urethane resin was measured by GPC and found to be 350,000.
  • Isocyanuric acid EO-modified diatalylate manufactured by Toagosei Co., Ltd., trade name: M-215
  • urethane tantalate manufactured by Kyoeisha Igaku Co., Ltd., trade name: AT-600
  • 2 (meth) atariloy mouth Shetyl phosphate manufactured by Kyoeisha Igaku Co., Ltd., trade name: P-2M
  • a layer made of nickel is provided on the surface of the polystyrene particles so that the thickness becomes 0.2 / zm, and a layer made of gold so that the thickness becomes 0.02 m is further formed on the surface of the layer made of nickel.
  • conductive particles having an average particle diameter of 4 m and a specific gravity of 2.5 were produced.
  • the obtained adhesive composition was applied to an 80 ⁇ m-thick fluorine resin film using a coating device (manufactured by Yasui Seiki Co., Ltd., trade name: SNC—S3.0). And coated to obtain a coating film. Next, the coating film was dried with hot air at 70 ° C. for 10 minutes to obtain a film-like circuit connecting material having a thickness of 15 m.
  • a coating device manufactured by Yasui Seiki Co., Ltd., trade name: SNC—S3.0
  • a film-like circuit connecting material was obtained in the same manner as in Example 1 except that TEMPOL-NHAcO. 2 parts by mass was added as a stable radical compound instead of TEMPOL 0.2 part by mass.
  • a film-like circuit connecting material was obtained in the same manner as in Example 1, except that TEMPO 0.2 part by mass was added as a stable radical compound instead of TEMPOL 0.2 part by mass.
  • a film-like circuit connecting material was obtained in the same manner as in Example 1, except that 0.05 part by mass of TEMPOL, which is a stable radical compound, was added instead of 0.2 part by mass.
  • a film-like circuit connecting material was obtained in the same manner as in Example 1 except that TEMPOL, which is a stable radical compound, was not blended.
  • Table 1 shows the mixing ratio of each component of the adhesive compositions obtained in the above Examples and Comparative Examples.
  • the ESR of the adhesive component was measured to obtain the g value.
  • the ESR measurement conditions at this time are around 3490G for the central magnetic field, 200G for the magnetic field sweep range, 100kHz modulation, 1G, microwave 9.8GHz, lmW, sweep time 83.886s X 4times, time constant 327.68ms, 25. C.
  • a flexible circuit board with 500 copper circuit lines with a line width of 25 ⁇ m, a pitch of 50 ⁇ m and a thickness of 18 ⁇ m, and a thin layer of 0.2 m indium oxide (ITO).
  • a glass substrate ITO substrate, thickness 1. lmm, surface resistance 20 ⁇ well
  • the film-like circuit connecting material obtained as described above was placed between the FPC substrate and the ITO substrate.
  • thermocompression bonding apparatus heating and pressurization was performed for 10 seconds in the laminating direction under conditions of a predetermined temperature and 3 MPa.
  • circuit member connection structure in which the FPC substrate and the ITO substrate were electrically connected with a cured product of the circuit connection material over a width of 2 mm was produced. Note that three patterns of 160 ° C, 180 ° C and 200 ° C were adopted as the predetermined temperature.
  • connection resistance between circuits in the connection structure of the obtained circuit members was (1) immediately after bonding, and (2) after bonding, a humidity test was performed for 120 hours in a high-temperature, high-humidity tank at 80 ° C and 95% RH. After that, the measurement was performed using a multimeter (trade name: TR6848, manufactured by Advantest). The resistance value is shown as the average (x + 3 ⁇ ) of 150 resistances between adjacent circuits. The results are shown in Table 3.
  • the adhesion strength between circuits in the circuit member connection structure obtained was as follows: (1) Immediately after bonding, and (2) 120% humidity test in a high-temperature, high-humidity tank at 80 ° C and 95% RH after bonding. After that, it was measured and evaluated by a 90 ° peeling method according to JIS-Z0237.
  • Tensilon UTM-4 peeleling speed 50 mmZmin, 25 ° C., manufactured by Toyo Baldwin was used as an adhesive strength measuring device. The results are shown in Table 3.
  • connection resistance immediately after bonding and after the moisture resistance test showed a small variation value at each heating temperature. Showed good electrical characteristics.
  • connection resistance increased significantly as the heating temperature increased. After the moisture resistance test, the connection resistance further increased.
  • the present invention it is possible to perform a curing process sufficiently quickly at a low temperature, and a bonding process having sufficiently stable characteristics (adhesion strength and connection resistance) with a wide process margin when the curing process is performed.
  • An agent composition, a circuit connecting material using the same, a circuit member connecting structure, and a semiconductor device can be provided.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Wire Bonding (AREA)
  • Conductive Materials (AREA)

Abstract

L'invention concerne une composition adhésive contenant une composante adhésive qui comprend une résine thermoplastique, un composé pouvant être polymérisé par des radicaux ainsi qu'un initiateur de polymérisation par radicaux, la composante adhésive émettant une signal dans la mesure ESR à 25 °C.
PCT/JP2006/316589 2005-10-18 2006-08-24 Composition adhesive, materiau de connexion de circuit, structure de connexion de connecteurs de circuit ainsi que dispositifs a semi-conducteurs WO2007046190A1 (fr)

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JP2008291199A (ja) * 2007-04-23 2008-12-04 Hitachi Chem Co Ltd 回路接続材料およびそれを用いた接続構造体
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JP2012033495A (ja) * 2006-08-22 2012-02-16 Hitachi Chem Co Ltd 回路接続材料、回路部材の接続構造及び回路部材の接続構造の製造方法
JP2008291199A (ja) * 2007-04-23 2008-12-04 Hitachi Chem Co Ltd 回路接続材料およびそれを用いた接続構造体
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WO2008139996A1 (fr) * 2007-05-09 2008-11-20 Hitachi Chemical Company, Ltd. Matériau de liaison de circuit similaire à un film et structure de liaison pour un élément de circuit
CN101675715B (zh) * 2007-05-09 2011-06-08 日立化成工业株式会社 膜状电路连接材料及电路部件的连接结构
CN102199404A (zh) * 2007-05-09 2011-09-28 日立化成工业株式会社 膜状电路连接材料及电路部件的连接结构
JP2010528153A (ja) * 2007-05-23 2010-08-19 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン 防食接着剤組成物
JP2009152274A (ja) * 2007-12-19 2009-07-09 Tdk Corp 固体電解コンデンサ及び固体電解コンデンサの製造方法
WO2013035206A1 (fr) * 2011-09-09 2013-03-14 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン Composition d'agent d'étanchéité pour dispositif électronique
WO2013035871A1 (fr) * 2011-09-09 2013-03-14 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン Composition d'agent d'étanchéité pour dispositif électronique
US20140187714A1 (en) * 2011-09-09 2014-07-03 Henkel Ag & Co. Kgaa Sealant composition for electronic device
JPWO2013035871A1 (ja) * 2011-09-09 2015-03-23 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェンＨｅｎｋｅｌ ＡＧ ＆ Ｃｏ．ＫＧａＡ 電子装置用シール剤組成物
EP2755232A4 (fr) * 2011-09-09 2015-09-30 Henkel Ag & Co Kgaa Composition d'agent d'étanchéité pour dispositif électronique
US20160177148A1 (en) * 2011-09-09 2016-06-23 Henkel Ag & Co. Kgaa Sealant composition for electronic device
US9771500B2 (en) 2011-09-09 2017-09-26 Henkel Ag & Co. Kgaa Sealant composition for electronic device
WO2022210166A1 (fr) * 2021-03-31 2022-10-06 デンカ株式会社 Composition adhésive, corps collé et procédé de production d'une composition adhésive
JPWO2022210166A1 (fr) * 2021-03-31 2022-10-06

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KR101010108B1 (ko) 2011-01-24
TW200718764A (en) 2007-05-16
CN102277091A (zh) 2011-12-14
KR20080068865A (ko) 2008-07-24
JPWO2007046190A1 (ja) 2009-04-23
CN102222649A (zh) 2011-10-19
TWI336724B (fr) 2011-02-01

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