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WO2008105163A1 - Method for forming joint part having excellent sealing properties between dissimilar metal materials, and dissimilar metal composite - Google Patents

Method for forming joint part having excellent sealing properties between dissimilar metal materials, and dissimilar metal composite Download PDF

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Publication number
WO2008105163A1
WO2008105163A1 PCT/JP2008/000326 JP2008000326W WO2008105163A1 WO 2008105163 A1 WO2008105163 A1 WO 2008105163A1 JP 2008000326 W JP2008000326 W JP 2008000326W WO 2008105163 A1 WO2008105163 A1 WO 2008105163A1
Authority
WO
WIPO (PCT)
Prior art keywords
dissimilar metal
metal materials
joint part
sealing properties
excellent sealing
Prior art date
Application number
PCT/JP2008/000326
Other languages
French (fr)
Japanese (ja)
Inventor
Seiji Katayama
Yosuke Kawahito
Shuji Kubota
Akio Tange
Original Assignee
Osaka University
Toyo Boseki Kabushiki Kaisha
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osaka University, Toyo Boseki Kabushiki Kaisha filed Critical Osaka University
Priority to JP2009501127A priority Critical patent/JP5119458B2/en
Publication of WO2008105163A1 publication Critical patent/WO2008105163A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/206—Laser sealing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/02—Iron or ferrous alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/10—Aluminium or alloys thereof
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials
    • C09J2400/16—Metal
    • C09J2400/163—Metal in the substrate

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)

Abstract

This invention provides a method for forming a joint part having excellent sealing properties, which, in joining between dissimilar metal materials, is less likely to cause corrosion of dissimilar metal contact. This method is characterized by holding a thermoplastic resin material between dissimilar metal materials (for example, an iron material and an aluminum material) and heating a joining part between the dissimilar materials and/or a resin material around the joining part by a laser beam source to a melting temperature or above to join the dissimilar metal materials while forming a sealing part.
PCT/JP2008/000326 2007-02-28 2008-02-25 Method for forming joint part having excellent sealing properties between dissimilar metal materials, and dissimilar metal composite WO2008105163A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009501127A JP5119458B2 (en) 2007-02-28 2008-02-25 Method for forming joints of dissimilar metal materials having excellent sealing properties

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007049840 2007-02-28
JP2007-049840 2007-02-28

Publications (1)

Publication Number Publication Date
WO2008105163A1 true WO2008105163A1 (en) 2008-09-04

Family

ID=39721005

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/000326 WO2008105163A1 (en) 2007-02-28 2008-02-25 Method for forming joint part having excellent sealing properties between dissimilar metal materials, and dissimilar metal composite

Country Status (2)

Country Link
JP (1) JP5119458B2 (en)
WO (1) WO2008105163A1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008208296A (en) * 2007-02-28 2008-09-11 Toyobo Co Ltd Laser welding resin composition and molded body using the same
JP2009173023A (en) * 2007-12-25 2009-08-06 Hayakawa Rubber Co Ltd Sheet for laser joining and joining method using it
JP2009269401A (en) * 2008-04-09 2009-11-19 Okayama Prefecture Bonding process using laser beam
JP2014151333A (en) * 2013-02-06 2014-08-25 Nippon Steel & Sumitomo Metal Method of manufacturing weld joint and apparatus for manufacturing the weld joint
JP7324392B1 (en) 2022-06-07 2023-08-10 株式会社日本ピット Surface welded structure of stainless steel plate and galvanized steel plate

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61130425U (en) * 1985-02-05 1986-08-15
JPH067978A (en) * 1992-05-25 1994-01-18 Nkk Corp Method for laser beam welding galvanized steel sheets
JP2007276295A (en) * 2006-04-07 2007-10-25 Mazda Motor Corp Method for manufacturing laminated sheet member, and laminated sheet member

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61130425U (en) * 1985-02-05 1986-08-15
JPH067978A (en) * 1992-05-25 1994-01-18 Nkk Corp Method for laser beam welding galvanized steel sheets
JP2007276295A (en) * 2006-04-07 2007-10-25 Mazda Motor Corp Method for manufacturing laminated sheet member, and laminated sheet member

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008208296A (en) * 2007-02-28 2008-09-11 Toyobo Co Ltd Laser welding resin composition and molded body using the same
JP2009173023A (en) * 2007-12-25 2009-08-06 Hayakawa Rubber Co Ltd Sheet for laser joining and joining method using it
JP2009269401A (en) * 2008-04-09 2009-11-19 Okayama Prefecture Bonding process using laser beam
JP2014151333A (en) * 2013-02-06 2014-08-25 Nippon Steel & Sumitomo Metal Method of manufacturing weld joint and apparatus for manufacturing the weld joint
JP7324392B1 (en) 2022-06-07 2023-08-10 株式会社日本ピット Surface welded structure of stainless steel plate and galvanized steel plate
JP2023179335A (en) * 2022-06-07 2023-12-19 株式会社日本ピット Surface welded structure of stainless steel plate and galvanized steel plate

Also Published As

Publication number Publication date
JPWO2008105163A1 (en) 2010-06-03
JP5119458B2 (en) 2013-01-16

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