+

WO2003041165A3 - Interface thermique electriquement conductrice - Google Patents

Interface thermique electriquement conductrice Download PDF

Info

Publication number
WO2003041165A3
WO2003041165A3 PCT/US2001/032544 US0132544W WO03041165A3 WO 2003041165 A3 WO2003041165 A3 WO 2003041165A3 US 0132544 W US0132544 W US 0132544W WO 03041165 A3 WO03041165 A3 WO 03041165A3
Authority
WO
WIPO (PCT)
Prior art keywords
flakes
edges
heat transfer
metal flakes
network
Prior art date
Application number
PCT/US2001/032544
Other languages
English (en)
Other versions
WO2003041165A2 (fr
Inventor
Ignatius J Rasiah
Original Assignee
Honeywell Int Inc
Ignatius J Rasiah
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell Int Inc, Ignatius J Rasiah filed Critical Honeywell Int Inc
Priority to CNA2007100968120A priority Critical patent/CN101038795A/zh
Priority to CNB018235581A priority patent/CN1319162C/zh
Priority to KR1020047001319A priority patent/KR100782235B1/ko
Priority to PCT/US2001/032544 priority patent/WO2003041165A2/fr
Priority to EP01988123A priority patent/EP1436835A2/fr
Priority to CA002454155A priority patent/CA2454155A1/fr
Priority to JP2003543099A priority patent/JP4202923B2/ja
Priority to US10/483,370 priority patent/US7083850B2/en
Priority to TW091124081A priority patent/TW578180B/zh
Publication of WO2003041165A2 publication Critical patent/WO2003041165A2/fr
Publication of WO2003041165A3 publication Critical patent/WO2003041165A3/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/10—Sintering only
    • B22F3/11—Making porous workpieces or articles
    • B22F3/1103—Making porous workpieces or articles with particular physical characteristics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Powder Metallurgy (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Conductive Materials (AREA)
  • Die Bonding (AREA)

Abstract

L'invention concerne un matériau de transfert de chaleur poreux, souple et élastique comprenant un réseau de flocons métalliques. De tels matériaux de transfert de chaleur sont, de préférence, obtenus, dans un premier temps, par formation d'une pâte conductrice comprenant un solvant volatil organique et des flocons métalliques conducteurs. La pâte conductrice est chauffée à une température inférieure au point de fusion des flocons métalliques, évaporant ainsi le solvant et frittant uniquement les bords des flocons qui sont fusionnés aux bords de flocons adjacents, de manière que des pores ouverts soient définis entre au moins quelques flocons parmi les flocons adjacents, formant ainsi un réseau de flocons métalliques. Grâce à cette structure en réseau, le matériau de transfert de chaleur présente aussi bien un faible module de stockage inférieur à environ 10 Gpa que de bonnes propriétés de résistance électrique.
PCT/US2001/032544 2001-10-18 2001-10-18 Interface thermique electriquement conductrice WO2003041165A2 (fr)

Priority Applications (9)

Application Number Priority Date Filing Date Title
CNA2007100968120A CN101038795A (zh) 2001-10-18 2001-10-18 导电膏及传热材料
CNB018235581A CN1319162C (zh) 2001-10-18 2001-10-18 传热材料及其形成方法
KR1020047001319A KR100782235B1 (ko) 2001-10-18 2001-10-18 소결된 금속 플레이크
PCT/US2001/032544 WO2003041165A2 (fr) 2001-10-18 2001-10-18 Interface thermique electriquement conductrice
EP01988123A EP1436835A2 (fr) 2001-10-18 2001-10-18 Interface thermique electriquement conductrice
CA002454155A CA2454155A1 (fr) 2001-10-18 2001-10-18 Interface thermique electriquement conductrice
JP2003543099A JP4202923B2 (ja) 2001-10-18 2001-10-18 熱伝導性材料、マイクロエレクトロニクス装置、熱伝導性材料を形成する方法及びマイクロチップから熱を伝導して取り去る方法
US10/483,370 US7083850B2 (en) 2001-10-18 2001-10-18 Electrically conductive thermal interface
TW091124081A TW578180B (en) 2001-10-18 2002-10-18 Sintered metal flakes

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2001/032544 WO2003041165A2 (fr) 2001-10-18 2001-10-18 Interface thermique electriquement conductrice

Publications (2)

Publication Number Publication Date
WO2003041165A2 WO2003041165A2 (fr) 2003-05-15
WO2003041165A3 true WO2003041165A3 (fr) 2003-07-24

Family

ID=21742921

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/032544 WO2003041165A2 (fr) 2001-10-18 2001-10-18 Interface thermique electriquement conductrice

Country Status (7)

Country Link
EP (1) EP1436835A2 (fr)
JP (1) JP4202923B2 (fr)
KR (1) KR100782235B1 (fr)
CN (2) CN101038795A (fr)
CA (1) CA2454155A1 (fr)
TW (1) TW578180B (fr)
WO (1) WO2003041165A2 (fr)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100529112B1 (ko) * 2003-09-26 2005-11-15 삼성에스디아이 주식회사 다공성 열전달 시트를 갖는 디스플레이 장치
KR101118632B1 (ko) * 2007-10-12 2012-03-06 제일모직주식회사 박편형상의 알루미늄 성분을 포함하는 전극형성용조성물과 이를 이용하여 제조되는 전극
WO2009090915A1 (fr) 2008-01-17 2009-07-23 Nichia Corporation Procédé de production d'un matériau conducteur, matériau conducteur obtenu grâce au procédé, dispositif électronique contenant le matériau conducteur, dispositif électroluminescent, et procédé de fabrication d'un dispositif électroluminescent
CN101319775B (zh) * 2008-07-18 2010-06-09 东莞东海龙环保科技有限公司 功率型led灯具的高导热柔性填隙材料
KR101716397B1 (ko) * 2009-03-06 2017-03-14 도요 알루미늄 가부시키가이샤 도전성 페이스트 조성물 및 그를 이용하여 형성된 도전성 막
CN103079819B (zh) * 2010-08-31 2015-06-17 保力马科技(日本)株式会社 导热片
US10000670B2 (en) 2012-07-30 2018-06-19 Henkel IP & Holding GmbH Silver sintering compositions with fluxing or reducing agents for metal adhesion
EP3294799B1 (fr) 2015-05-08 2024-09-04 Henkel AG & Co. KGaA Films et pâtes frittables, et procédés d'utilisation
KR20210143812A (ko) * 2019-03-20 2021-11-29 스미또모 베이크라이트 가부시키가이샤 열전도성 조성물 및 반도체 장치
CN112207481A (zh) * 2020-09-09 2021-01-12 中山大学 一种低温无压烧结微米银焊膏及其制备方法和应用
CN113492281A (zh) * 2021-05-27 2021-10-12 中山大学 一种在裸铜上低温无压直接烧结的微米银焊膏及其制备方法和应用

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63140292A (ja) * 1986-11-30 1988-06-11 Chuo Denki Kogyo Kk 多孔型放熱体
JPH07118701A (ja) * 1993-10-22 1995-05-09 Katayama Tokushu Kogyo Kk フレーク状金属粉末、金属多孔体およびフレーク状金属粉末の製造方法
JPH09162336A (ja) * 1995-12-11 1997-06-20 Mitsubishi Materials Corp 放熱シート
EP0816423A1 (fr) * 1996-06-27 1998-01-07 W.L. GORE & ASSOCIATES, INC. Article thermiquement conductrice de polytétrafluoréthylène
JPH1135914A (ja) * 1997-07-14 1999-02-09 Sumitomo Bakelite Co Ltd 導電性樹脂ペースト及びこれを用いて製造された半導体装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1019760B (zh) * 1987-06-11 1992-12-30 国家机械工业委员会上海材料研究所 由球形金属粉末制造多孔元件的方法
JPH08213026A (ja) * 1994-11-28 1996-08-20 Katayama Tokushu Kogyo Kk 電池電極基板用金属多孔体、電池電極板およびその製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63140292A (ja) * 1986-11-30 1988-06-11 Chuo Denki Kogyo Kk 多孔型放熱体
JPH07118701A (ja) * 1993-10-22 1995-05-09 Katayama Tokushu Kogyo Kk フレーク状金属粉末、金属多孔体およびフレーク状金属粉末の製造方法
JPH09162336A (ja) * 1995-12-11 1997-06-20 Mitsubishi Materials Corp 放熱シート
EP0816423A1 (fr) * 1996-06-27 1998-01-07 W.L. GORE & ASSOCIATES, INC. Article thermiquement conductrice de polytétrafluoréthylène
JPH1135914A (ja) * 1997-07-14 1999-02-09 Sumitomo Bakelite Co Ltd 導電性樹脂ペースト及びこれを用いて製造された半導体装置

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 012, no. 392 (M - 755) 19 October 1988 (1988-10-19) *
PATENT ABSTRACTS OF JAPAN vol. 1995, no. 08 29 September 1995 (1995-09-29) *
PATENT ABSTRACTS OF JAPAN vol. 1997, no. 10 31 October 1997 (1997-10-31) *
PATENT ABSTRACTS OF JAPAN vol. 1999, no. 05 31 May 1999 (1999-05-31) *

Also Published As

Publication number Publication date
KR100782235B1 (ko) 2007-12-05
JP2005509293A (ja) 2005-04-07
KR20040051582A (ko) 2004-06-18
CN1545731A (zh) 2004-11-10
CA2454155A1 (fr) 2003-05-15
JP4202923B2 (ja) 2008-12-24
WO2003041165A2 (fr) 2003-05-15
EP1436835A2 (fr) 2004-07-14
CN1319162C (zh) 2007-05-30
TW578180B (en) 2004-03-01
CN101038795A (zh) 2007-09-19

Similar Documents

Publication Publication Date Title
WO2003041165A3 (fr) Interface thermique electriquement conductrice
EP1052653A3 (fr) Poudre conductrice et son procédé de production
WO2006116323A3 (fr) Dispositifs de conversion thermoelectriques a depot cda et leurs procedes d'utilisation et de fabrication
CA2265199A1 (fr) Dispositif ctp haute temperature et composition a base d'un polymere conducteur
EP0953998A3 (fr) Electrode pour condensateur à double couche et condensateur électrique utilisant ladite électrode
EP1382437A3 (fr) Article moulé à base de polymère ayant une conductibilité thermique et procédé pour sa fabrication
WO2001015180A3 (fr) Ameliorations de dispositifs de protection de circuits
EP0862191A4 (fr) Materiau pour thermistor a ctp
JPH0359558B2 (fr)
CA1291513C (fr) Element chauffant en pellicule epaisse
WO2007047165A3 (fr) Fusible programmable au silicium germanium
MX2008014354A (es) Elementos de calentamiento de ceramica.
CA2381355A1 (fr) Ensemble anode
EP1160896A3 (fr) Structure d'électrode, batterie et condensateur électrique à double couche et son procédé de fabrication
EP1306864A4 (fr) Composition d'electrolyte pour condensateur electrique double couche, electrolyte polymere solide, composition pour electrode polarisable, electrode polarisable et condensateur electrique double couche
US6054175A (en) Conductive filler, conductive paste and method of fabricating circuit body using the conductive paste
EP1143543A3 (fr) Structure d'électrode, pile et condensateur électrique à double couche et leur méthode de fabrication
US6104274A (en) Composite PTC material
WO1995004443A1 (fr) Element ceramique chauffant et procede de fabrication d'un element chauffant de ce type
JP2014099431A (ja) コンポジットｐｔｃサーミスタ部材
JPH08250371A (ja) コンデンサ及びその製造方法並びに誘電体の製造方法
JP3340644B2 (ja) コンポジットｐｔｃ材料
US4337498A (en) Small ignition device comprising string-like silicon carbide heating element affixed to terminal supports
AU2001268928A1 (en) Electrical component and method for production thereof
砂取久哉 et al. Hot Spot in La-Doped BaTiO3 Ceramic Rod.

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ PL PT RO RU SD SE SG SI SK SL TJ TM TR TT TZ UA UG US UZ VN YU ZA ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
WWE Wipo information: entry into national phase

Ref document number: 10483370

Country of ref document: US

Ref document number: 2454155

Country of ref document: CA

WWE Wipo information: entry into national phase

Ref document number: 2003543099

Country of ref document: JP

WWE Wipo information: entry into national phase

Ref document number: 2001988123

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 1020047001319

Country of ref document: KR

WWE Wipo information: entry into national phase

Ref document number: 20018235581

Country of ref document: CN

WWP Wipo information: published in national office

Ref document number: 2001988123

Country of ref document: EP

点击 这是indexloc提供的php浏览器服务，不要输入任何密码和下载