+

WO2003041165A3 - Electrically conductive thermal interface - Google Patents

Electrically conductive thermal interface Download PDF

Info

Publication number
WO2003041165A3
WO2003041165A3 PCT/US2001/032544 US0132544W WO03041165A3 WO 2003041165 A3 WO2003041165 A3 WO 2003041165A3 US 0132544 W US0132544 W US 0132544W WO 03041165 A3 WO03041165 A3 WO 03041165A3
Authority
WO
WIPO (PCT)
Prior art keywords
flakes
edges
heat transfer
metal flakes
network
Prior art date
Application number
PCT/US2001/032544
Other languages
French (fr)
Other versions
WO2003041165A2 (en
Inventor
Ignatius J Rasiah
Original Assignee
Honeywell Int Inc
Ignatius J Rasiah
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell Int Inc, Ignatius J Rasiah filed Critical Honeywell Int Inc
Priority to CNA2007100968120A priority Critical patent/CN101038795A/en
Priority to CNB018235581A priority patent/CN1319162C/en
Priority to KR1020047001319A priority patent/KR100782235B1/en
Priority to PCT/US2001/032544 priority patent/WO2003041165A2/en
Priority to EP01988123A priority patent/EP1436835A2/en
Priority to CA002454155A priority patent/CA2454155A1/en
Priority to JP2003543099A priority patent/JP4202923B2/en
Priority to US10/483,370 priority patent/US7083850B2/en
Priority to TW091124081A priority patent/TW578180B/en
Publication of WO2003041165A2 publication Critical patent/WO2003041165A2/en
Publication of WO2003041165A3 publication Critical patent/WO2003041165A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/10—Sintering only
    • B22F3/11—Making porous workpieces or articles
    • B22F3/1103—Making porous workpieces or articles with particular physical characteristics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Powder Metallurgy (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Conductive Materials (AREA)
  • Die Bonding (AREA)

Abstract

A porous, flexible, resilient heat transfer material which comprises network of metal flakes. Such heat transfer materials are preferably produced by first forming a conductive paste comprising a volatile organic solvent and conductive metal flakes. The conductive paste is heated to a temperature below the melting point of the metal flakes, thereby evaporating the solvent and sintering the flakes only at their edges. The edges of the flakes are fused to the edges of adjacent flakes such that open pores are defined between at least some of the adjacent flakes, thereby forming a network of metal flakes. This network structure allows the heat transfer material to have a low storage modulus of less than about 10 Gpa, while having good electrical resistance properties.
PCT/US2001/032544 2001-10-18 2001-10-18 Electrically conductive thermal interface WO2003041165A2 (en)

Priority Applications (9)

Application Number Priority Date Filing Date Title
CNA2007100968120A CN101038795A (en) 2001-10-18 2001-10-18 Conductive paste and heat diffusion material
CNB018235581A CN1319162C (en) 2001-10-18 2001-10-18 Current conducting and heat conducting interface
KR1020047001319A KR100782235B1 (en) 2001-10-18 2001-10-18 Sintered Metal Flake
PCT/US2001/032544 WO2003041165A2 (en) 2001-10-18 2001-10-18 Electrically conductive thermal interface
EP01988123A EP1436835A2 (en) 2001-10-18 2001-10-18 Electrically conductive thermal interface
CA002454155A CA2454155A1 (en) 2001-10-18 2001-10-18 Electrically conductive thermal interface
JP2003543099A JP4202923B2 (en) 2001-10-18 2001-10-18 Thermally conductive material, microelectronic device, method of forming thermally conductive material, and method of conducting and removing heat from a microchip
US10/483,370 US7083850B2 (en) 2001-10-18 2001-10-18 Electrically conductive thermal interface
TW091124081A TW578180B (en) 2001-10-18 2002-10-18 Sintered metal flakes

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2001/032544 WO2003041165A2 (en) 2001-10-18 2001-10-18 Electrically conductive thermal interface

Publications (2)

Publication Number Publication Date
WO2003041165A2 WO2003041165A2 (en) 2003-05-15
WO2003041165A3 true WO2003041165A3 (en) 2003-07-24

Family

ID=21742921

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/032544 WO2003041165A2 (en) 2001-10-18 2001-10-18 Electrically conductive thermal interface

Country Status (7)

Country Link
EP (1) EP1436835A2 (en)
JP (1) JP4202923B2 (en)
KR (1) KR100782235B1 (en)
CN (2) CN101038795A (en)
CA (1) CA2454155A1 (en)
TW (1) TW578180B (en)
WO (1) WO2003041165A2 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100529112B1 (en) * 2003-09-26 2005-11-15 삼성에스디아이 주식회사 Display apparatus having porous heat transfer sheet
KR101118632B1 (en) * 2007-10-12 2012-03-06 제일모직주식회사 Composition for fabricating the electrode comprising flake type aluminium and electrode made by the same
WO2009090915A1 (en) 2008-01-17 2009-07-23 Nichia Corporation Method for producing conductive material, conductive material obtained by the method, electronic device containing the conductive material, light-emitting device, and method for manufacturing light-emitting device
CN101319775B (en) * 2008-07-18 2010-06-09 东莞东海龙环保科技有限公司 High thermal conductivity flexible sealant of power type LED lamp
KR101716397B1 (en) * 2009-03-06 2017-03-14 도요 알루미늄 가부시키가이샤 Electrically conductive paste composition and electrically conductive film formed by using the same
CN103079819B (en) * 2010-08-31 2015-06-17 保力马科技(日本)株式会社 Thermally conductive sheet
US10000670B2 (en) 2012-07-30 2018-06-19 Henkel IP & Holding GmbH Silver sintering compositions with fluxing or reducing agents for metal adhesion
EP3294799B1 (en) 2015-05-08 2024-09-04 Henkel AG & Co. KGaA Sinterable films and pastes and methods for the use thereof
KR20210143812A (en) * 2019-03-20 2021-11-29 스미또모 베이크라이트 가부시키가이샤 Thermally Conductive Compositions and Semiconductor Devices
CN112207481A (en) * 2020-09-09 2021-01-12 中山大学 Low-temperature pressureless sintering micron silver soldering paste and preparation method and application thereof
CN113492281A (en) * 2021-05-27 2021-10-12 中山大学 Micron silver soldering paste directly sintered on bare copper at low temperature and without pressure, and preparation method and application thereof

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63140292A (en) * 1986-11-30 1988-06-11 Chuo Denki Kogyo Kk Porous-type heat radiator
JPH07118701A (en) * 1993-10-22 1995-05-09 Katayama Tokushu Kogyo Kk Flaky metal powder, metallic porous body and production of the powder
JPH09162336A (en) * 1995-12-11 1997-06-20 Mitsubishi Materials Corp Radiation sheet
EP0816423A1 (en) * 1996-06-27 1998-01-07 W.L. GORE & ASSOCIATES, INC. Thermally conductive polytetrafluoroethylene article
JPH1135914A (en) * 1997-07-14 1999-02-09 Sumitomo Bakelite Co Ltd Conductive resin paste and semiconductor device manufacture using the same

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1019760B (en) * 1987-06-11 1992-12-30 国家机械工业委员会上海材料研究所 Method for making porous elements from spherical metal powders
JPH08213026A (en) * 1994-11-28 1996-08-20 Katayama Tokushu Kogyo Kk Metallic porous body for battery electrode substrate, battery plate, and manufacture thereof

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63140292A (en) * 1986-11-30 1988-06-11 Chuo Denki Kogyo Kk Porous-type heat radiator
JPH07118701A (en) * 1993-10-22 1995-05-09 Katayama Tokushu Kogyo Kk Flaky metal powder, metallic porous body and production of the powder
JPH09162336A (en) * 1995-12-11 1997-06-20 Mitsubishi Materials Corp Radiation sheet
EP0816423A1 (en) * 1996-06-27 1998-01-07 W.L. GORE & ASSOCIATES, INC. Thermally conductive polytetrafluoroethylene article
JPH1135914A (en) * 1997-07-14 1999-02-09 Sumitomo Bakelite Co Ltd Conductive resin paste and semiconductor device manufacture using the same

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 012, no. 392 (M - 755) 19 October 1988 (1988-10-19) *
PATENT ABSTRACTS OF JAPAN vol. 1995, no. 08 29 September 1995 (1995-09-29) *
PATENT ABSTRACTS OF JAPAN vol. 1997, no. 10 31 October 1997 (1997-10-31) *
PATENT ABSTRACTS OF JAPAN vol. 1999, no. 05 31 May 1999 (1999-05-31) *

Also Published As

Publication number Publication date
KR100782235B1 (en) 2007-12-05
JP2005509293A (en) 2005-04-07
KR20040051582A (en) 2004-06-18
CN1545731A (en) 2004-11-10
CA2454155A1 (en) 2003-05-15
JP4202923B2 (en) 2008-12-24
WO2003041165A2 (en) 2003-05-15
EP1436835A2 (en) 2004-07-14
CN1319162C (en) 2007-05-30
TW578180B (en) 2004-03-01
CN101038795A (en) 2007-09-19

Similar Documents

Publication Publication Date Title
WO2003041165A3 (en) Electrically conductive thermal interface
EP1052653A3 (en) Conductive powder and making process
WO2006116323A3 (en) Diamond-like carbon thermoelectric conversion devices and methods for the use and manufacture thereof
CA2265199A1 (en) High temperature ptc device and conductive polymer composition
EP0953998A3 (en) Electrode for an electric double layer capacitor and electric double layer capacitor employing the electrode
EP1382437A3 (en) Thermal conductive polymer molded article and method for producing the same
WO2001015180A3 (en) Improvements to circuit protection devices
EP0862191A4 (en) Ptc thermistor material
JPH0359558B2 (en)
CA1291513C (en) Thick film track material
WO2007047165A3 (en) Programmable fuse with silicon germanium
MX2008014354A (en) Ceramic heating elements.
CA2381355A1 (en) Anode assembly
EP1160896A3 (en) Electrode structure, battery and electrical double-layer capacitor and method of manufacturing same
EP1306864A4 (en) ELECTROLYTE COMPOSITION FOR ELECTRIC DOUBLE LAYER CAPACITOR, SOLID POLYMER ELECTROLYTE, COMPOSITION FOR POLARIZABLE ELECTRODE, POLARIZABLE ELECTRODE, AND ELECTRIC DOUBLE LAYER CAPACITOR
US6054175A (en) Conductive filler, conductive paste and method of fabricating circuit body using the conductive paste
EP1143543A3 (en) Electrode structure, battery and electrical double-layer capacitor and method of manufacturing same
US6104274A (en) Composite PTC material
WO1995004443A1 (en) Ceramic heating element and process for producing such a heating element
JP2014099431A (en) Composite ptc thermistor member
JPH08250371A (en) Capacitor, its manufacture and manufacture of dielectric
JP3340644B2 (en) Composite PTC material
US4337498A (en) Small ignition device comprising string-like silicon carbide heating element affixed to terminal supports
AU2001268928A1 (en) Electrical component and method for production thereof
砂取久哉 et al. Hot Spot in La-Doped BaTiO3 Ceramic Rod.

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ PL PT RO RU SD SE SG SI SK SL TJ TM TR TT TZ UA UG US UZ VN YU ZA ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
WWE Wipo information: entry into national phase

Ref document number: 10483370

Country of ref document: US

Ref document number: 2454155

Country of ref document: CA

WWE Wipo information: entry into national phase

Ref document number: 2003543099

Country of ref document: JP

WWE Wipo information: entry into national phase

Ref document number: 2001988123

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 1020047001319

Country of ref document: KR

WWE Wipo information: entry into national phase

Ref document number: 20018235581

Country of ref document: CN

WWP Wipo information: published in national office

Ref document number: 2001988123

Country of ref document: EP

点击 这是indexloc提供的php浏览器服务，不要输入任何密码和下载