WO1997011482A3 - Elimination d'halogenes et de vernis photosensible de tranches - Google Patents
Elimination d'halogenes et de vernis photosensible de tranches Download PDFInfo
- Publication number
- WO1997011482A3 WO1997011482A3 PCT/US1996/014054 US9614054W WO9711482A3 WO 1997011482 A3 WO1997011482 A3 WO 1997011482A3 US 9614054 W US9614054 W US 9614054W WO 9711482 A3 WO9711482 A3 WO 9711482A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- wafer
- plasma
- halogen
- removal
- photoresist material
- Prior art date
Links
- 150000002367 halogens Chemical class 0.000 title abstract 6
- 229920002120 photoresistant polymer Polymers 0.000 title abstract 5
- 229910052736 halogen Inorganic materials 0.000 title abstract 4
- 235000012431 wafers Nutrition 0.000 title 1
- 239000000463 material Substances 0.000 abstract 3
- 238000000034 method Methods 0.000 abstract 3
- 239000000470 constituent Substances 0.000 abstract 2
- 238000005530 etching Methods 0.000 abstract 2
- 239000007795 chemical reaction product Substances 0.000 abstract 1
- 230000005684 electric field Effects 0.000 abstract 1
- 229910052739 hydrogen Inorganic materials 0.000 abstract 1
- 239000001257 hydrogen Substances 0.000 abstract 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 abstract 1
- 229920005591 polysilicon Polymers 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
- H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
- H01L21/02071—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers the processing being a delineation, e.g. RIE, of conductive layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3266—Magnetic control means
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/334—Etching
- H01J2237/3342—Resist stripping
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Drying Of Semiconductors (AREA)
Abstract
L'invention concerne un procédé et un appareil pour éliminer les traces résiduelles (9) de vernis photosensible et d'halogènes après l'attaque d'une tranche de polysilicium ou d'une tranche métallisée (15, 35, 55). Les portions exposées de la tranche (8) non couvertes par le vernis photosensible sont soumises à une attaque par un premier plasma contenant un halogène, tel que HBr ou CmHnBr2m+2-n' pendant une première durée déterminée. La tranche est ensuite exposée à un second plasma contenant du H2O comme constituant primaire, pendant une seconde durée déterminée. Ce second plasma peut également contenir O2, H2, OH et/ou H2O2 comme autres constituants. Les radicaux hydrogène et les autres radicaux réagissent avec le vernis photosensible résiduel et avec tout halogène libre ou tout composé halogéné résiduel sur la tranche, avec formation de produits qui sont éliminés de la tranche. Chaque plasma (22, 44, 62, 64) est maintenu sous la forme d'un corps approximativement plan, en lui imposant un champ magnétique variable dans le temps et éventuellement un champ électrique variable dans le temps, dans des directions approximativement perpendiculaires à la surface traitée de la tranche. Le procédé d'attaque et d'élimination des résidus halogénés et de résidus de vernis photosensible peut s'effectuer dans deux chambres séparées (11, 31) ou dans une chambre unique (51). La tranche est à des températures qui sont différentes dans les deux opérations.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US52429695A | 1995-09-05 | 1995-09-05 | |
US524,296 | 1995-09-05 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO1997011482A2 WO1997011482A2 (fr) | 1997-03-27 |
WO1997011482A3 true WO1997011482A3 (fr) | 1997-05-15 |
Family
ID=24088608
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US1996/014054 WO1997011482A2 (fr) | 1995-09-05 | 1996-09-03 | Elimination d'halogenes et de vernis photosensible de tranches |
Country Status (1)
Country | Link |
---|---|
WO (1) | WO1997011482A2 (fr) |
Cited By (4)
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---|---|---|---|---|
US9272095B2 (en) | 2011-04-01 | 2016-03-01 | Sio2 Medical Products, Inc. | Vessels, contact surfaces, and coating and inspection apparatus and methods |
US9545360B2 (en) | 2009-05-13 | 2017-01-17 | Sio2 Medical Products, Inc. | Saccharide protective coating for pharmaceutical package |
US9554968B2 (en) | 2013-03-11 | 2017-01-31 | Sio2 Medical Products, Inc. | Trilayer coated pharmaceutical packaging |
US9572526B2 (en) | 2009-05-13 | 2017-02-21 | Sio2 Medical Products, Inc. | Apparatus and method for transporting a vessel to and from a PECVD processing station |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6548230B1 (en) * | 1998-09-18 | 2003-04-15 | Taiwan Semiconductor Manufacturing Co., Ltd | Method for in-situ removal of photoresist and sidewall polymer |
US6368517B1 (en) | 1999-02-17 | 2002-04-09 | Applied Materials, Inc. | Method for preventing corrosion of a dielectric material |
US6734120B1 (en) * | 1999-02-19 | 2004-05-11 | Axcelis Technologies, Inc. | Method of photoresist ash residue removal |
US6852636B1 (en) | 1999-12-27 | 2005-02-08 | Lam Research Corporation | Insitu post etch process to remove remaining photoresist and residual sidewall passivation |
US20070032081A1 (en) | 2005-08-08 | 2007-02-08 | Jeremy Chang | Edge ring assembly with dielectric spacer ring |
US7479457B2 (en) | 2005-09-08 | 2009-01-20 | Lam Research Corporation | Gas mixture for removing photoresist and post etch residue from low-k dielectric material and method of use thereof |
US9458536B2 (en) | 2009-07-02 | 2016-10-04 | Sio2 Medical Products, Inc. | PECVD coating methods for capped syringes, cartridges and other articles |
US11624115B2 (en) | 2010-05-12 | 2023-04-11 | Sio2 Medical Products, Inc. | Syringe with PECVD lubrication |
US9878101B2 (en) | 2010-11-12 | 2018-01-30 | Sio2 Medical Products, Inc. | Cyclic olefin polymer vessels and vessel coating methods |
CA2855353C (fr) | 2011-11-11 | 2021-01-19 | Sio2 Medical Products, Inc. | Revetement de passivation, de protection de ph ou a pouvoir lubrifiant pour conditionnement pharmaceutique, processus et appareil de revetement |
US11116695B2 (en) | 2011-11-11 | 2021-09-14 | Sio2 Medical Products, Inc. | Blood sample collection tube |
US20150297800A1 (en) | 2012-07-03 | 2015-10-22 | Sio2 Medical Products, Inc. | SiOx BARRIER FOR PHARMACEUTICAL PACKAGE AND COATING PROCESS |
CN104854257B (zh) | 2012-11-01 | 2018-04-13 | Sio2医药产品公司 | 涂层检查方法 |
EP2920567B1 (fr) | 2012-11-16 | 2020-08-19 | SiO2 Medical Products, Inc. | Procédé et appareil pour détecter des caractéristiques d'intégrité de revêtement de barrière rapide |
US9764093B2 (en) | 2012-11-30 | 2017-09-19 | Sio2 Medical Products, Inc. | Controlling the uniformity of PECVD deposition |
US10201660B2 (en) | 2012-11-30 | 2019-02-12 | Sio2 Medical Products, Inc. | Controlling the uniformity of PECVD deposition on medical syringes, cartridges, and the like |
EP2961858B1 (fr) | 2013-03-01 | 2022-09-07 | Si02 Medical Products, Inc. | Seringue revetu. |
US9937099B2 (en) | 2013-03-11 | 2018-04-10 | Sio2 Medical Products, Inc. | Trilayer coated pharmaceutical packaging with low oxygen transmission rate |
EP2971227B1 (fr) | 2013-03-15 | 2017-11-15 | Si02 Medical Products, Inc. | Procede de revetement. |
US11066745B2 (en) | 2014-03-28 | 2021-07-20 | Sio2 Medical Products, Inc. | Antistatic coatings for plastic vessels |
EP3337915B1 (fr) | 2015-08-18 | 2021-11-03 | SiO2 Medical Products, Inc. | Conditionnement pharmaceutique et autre présentant un faible taux de transmission d'oxygène |
US10504746B2 (en) | 2016-04-12 | 2019-12-10 | Applied Materials, Inc. | HKMG integration |
US10903065B2 (en) * | 2017-05-12 | 2021-01-26 | Lam Research Corporation | Halogen removal module and associated systems and methods |
CN114823297B (zh) * | 2022-04-19 | 2023-01-31 | 度亘激光技术(苏州)有限公司 | 光刻胶去除工艺及半导体制造工艺 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4222839A (en) * | 1978-09-21 | 1980-09-16 | Motorola, Inc. | Workpiece holder and method for plasma reactor apparatus |
US4292384A (en) * | 1977-09-30 | 1981-09-29 | Horizons Research Incorporated | Gaseous plasma developing and etching process employing low voltage DC generation |
US5016332A (en) * | 1990-04-13 | 1991-05-21 | Branson International Plasma Corporation | Plasma reactor and process with wafer temperature control |
US5545289A (en) * | 1994-02-03 | 1996-08-13 | Applied Materials, Inc. | Passivating, stripping and corrosion inhibition of semiconductor substrates |
-
1996
- 1996-09-03 WO PCT/US1996/014054 patent/WO1997011482A2/fr active Search and Examination
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4292384A (en) * | 1977-09-30 | 1981-09-29 | Horizons Research Incorporated | Gaseous plasma developing and etching process employing low voltage DC generation |
US4222839A (en) * | 1978-09-21 | 1980-09-16 | Motorola, Inc. | Workpiece holder and method for plasma reactor apparatus |
US5016332A (en) * | 1990-04-13 | 1991-05-21 | Branson International Plasma Corporation | Plasma reactor and process with wafer temperature control |
US5545289A (en) * | 1994-02-03 | 1996-08-13 | Applied Materials, Inc. | Passivating, stripping and corrosion inhibition of semiconductor substrates |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9545360B2 (en) | 2009-05-13 | 2017-01-17 | Sio2 Medical Products, Inc. | Saccharide protective coating for pharmaceutical package |
US9572526B2 (en) | 2009-05-13 | 2017-02-21 | Sio2 Medical Products, Inc. | Apparatus and method for transporting a vessel to and from a PECVD processing station |
US9272095B2 (en) | 2011-04-01 | 2016-03-01 | Sio2 Medical Products, Inc. | Vessels, contact surfaces, and coating and inspection apparatus and methods |
US9554968B2 (en) | 2013-03-11 | 2017-01-31 | Sio2 Medical Products, Inc. | Trilayer coated pharmaceutical packaging |
Also Published As
Publication number | Publication date |
---|---|
WO1997011482A2 (fr) | 1997-03-27 |
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