WO2018199148A1 - Élément électrique, actionneur et dispositif de communication - Google Patents
Élément électrique, actionneur et dispositif de communication Download PDFInfo
- Publication number
- WO2018199148A1 WO2018199148A1 PCT/JP2018/016768 JP2018016768W WO2018199148A1 WO 2018199148 A1 WO2018199148 A1 WO 2018199148A1 JP 2018016768 W JP2018016768 W JP 2018016768W WO 2018199148 A1 WO2018199148 A1 WO 2018199148A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- region
- coil
- base substrate
- hall element
- present
- Prior art date
Links
- 238000004891 communication Methods 0.000 title claims description 13
- 239000000758 substrate Substances 0.000 claims abstract description 86
- 229920005989 resin Polymers 0.000 claims abstract description 39
- 239000011347 resin Substances 0.000 claims abstract description 39
- 239000000463 material Substances 0.000 claims description 48
- 239000004020 conductor Substances 0.000 claims description 37
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 230000035945 sensitivity Effects 0.000 abstract description 13
- 239000010410 layer Substances 0.000 description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 229920000106 Liquid crystal polymer Polymers 0.000 description 9
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 9
- 239000011889 copper foil Substances 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 230000008569 process Effects 0.000 description 9
- 229910000679 solder Inorganic materials 0.000 description 8
- 238000005452 bending Methods 0.000 description 7
- 230000004048 modification Effects 0.000 description 7
- 238000012986 modification Methods 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 6
- 238000000059 patterning Methods 0.000 description 5
- 238000000206 photolithography Methods 0.000 description 5
- 239000002356 single layer Substances 0.000 description 5
- 230000008859 change Effects 0.000 description 4
- 239000011229 interlayer Substances 0.000 description 4
- 238000010030 laminating Methods 0.000 description 3
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- 229910020888 Sn-Cu Inorganic materials 0.000 description 1
- 229910019204 Sn—Cu Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
- G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
- G01R33/07—Hall effect devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
Definitions
- An object of the present invention is to provide an electric element that can suppress a change in sensitivity of the Hall element even when the base substrate is thinned.
- FIG. 1A is a side sectional view schematically showing the structure of the electric element 1 according to the first embodiment of the present invention
- FIG. 1B is a schematic view of the coil 2 in FIG.
- a coil 2 in FIG. 1A shows a cross section along AA ′ in FIG.
- the insulating bases 2a, 2b, and 2c in which the conductive patterns 20 and 21 and the electrode 22 are formed and the via holes are filled with the conductive paste are laminated and integrated by a heating press or the like.
- the conductive paste filled in the via holes is also heated and hardened to form interlayer connection conductors 6a, 6b, 6c, and 6d that electrically connect the conductor patterns of the respective insulating base materials.
- Conductor patterns 20 and 21 and electrode 22 are electrically connected by interlayer connection conductors 6a, 6b, 6c, and 6d.
- the coil 2 as shown in FIG. 2B is formed.
- the base substrate 4 is formed from the same type of resin substrate as the insulating substrates 2a, 2b, 2c forming the coil 2.
- the base substrate 4 can be formed using a thermoplastic resin such as liquid crystal polymer (LCP: Liquid Crystal Polymer).
- LCP liquid Crystal Polymer
- the base substrate 4 of the present embodiment has a first region R1 having a small thickness in the Z-axis direction and a second region R2 having a large thickness.
- the thick second region R2 is formed, for example, by laminating a liquid crystal polymer in a portion corresponding to the thick second region R2 and integrating them with a hot press or the like.
- the base substrate 4 of this embodiment can be formed by the following manufacturing method. First, two resin base materials in which a copper foil is stretched over the entire surface of one side are prepared. Next, the electrode 41, the electrode 42, and a wiring pattern (not shown) are formed by a patterning process such as photolithography. Next, the resin base material on which the electrode 41 and the wiring pattern are formed and the resin base material on which the electrode 42 and the wiring pattern are formed are laminated at a position corresponding to the thick second region R2, and are integrated by a heating press or the like. Make it. The base substrate 4 is formed as described above.
- the thin first regions R1-1, R1-3, R1-4, and R1-5 of the base substrate 4 are used as one layer of resin substrate, and two thick second regions R2-
- 1 is a two-layer resin base material
- the present invention is not limited to such an embodiment, and the number of layers in each region can be changed as appropriate.
- the coil 2 in the electric element 1 ⁇ / b> C of the present embodiment is different from the first embodiment in that the coil 2 is formed using insulating base materials 2 a, 2 b, and 2 b in which a through hole 9 is formed in the center.
- the manufacturing method of the coil 2 is the same as that of the first embodiment, and the insulating base materials 2a, 2b, and 2b may be laminated so that the through holes 9 overlap with each other and integrated by a heating press or the like.
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Hall/Mr Elements (AREA)
- Measuring Magnetic Variables (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Coils Or Transformers For Communication (AREA)
- Structure Of Printed Boards (AREA)
Abstract
L'invention concerne un élément électrique capable de supprimer les changements de sensibilité d'éléments à effet Hall même lorsqu'un substrat de base est formé de manière mince. Un élément électrique 1 comprend une bobine 2 et un élément à effet Hall 3 connecté à un substrat de base unique 4, le substrat de base 4 comprenant un substrat de résine souple et ayant une première région mince R1 et une seconde région épaisse R2, la bobine 2 étant connectée au niveau de la première région R1, et l'élément à effet Hall 3 étant connecté au niveau de la seconde région R2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201890000771.2U CN211152314U (zh) | 2017-04-27 | 2018-04-25 | 电元件、致动器以及通信装置 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017088553A JP2020129571A (ja) | 2017-04-27 | 2017-04-27 | 電気素子、アクチュエータ、および通信装置 |
| JP2017-088553 | 2017-04-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2018199148A1 true WO2018199148A1 (fr) | 2018-11-01 |
Family
ID=63918490
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2018/016768 WO2018199148A1 (fr) | 2017-04-27 | 2018-04-25 | Élément électrique, actionneur et dispositif de communication |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2020129571A (fr) |
| CN (1) | CN211152314U (fr) |
| WO (1) | WO2018199148A1 (fr) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62245700A (ja) * | 1986-04-18 | 1987-10-26 | セイコーエプソン株式会社 | ブレキシブル基板 |
| JP2000081589A (ja) * | 1998-07-09 | 2000-03-21 | Olympus Optical Co Ltd | 光偏向器 |
| JP2007212821A (ja) * | 2006-02-10 | 2007-08-23 | Matsushita Electric Ind Co Ltd | レンズ鏡筒 |
| WO2009031542A1 (fr) * | 2007-09-07 | 2009-03-12 | Alps Electric Co., Ltd. | Dispositif d'entraînement magnétique |
| JP2015149405A (ja) * | 2014-02-06 | 2015-08-20 | デクセリアルズ株式会社 | アンテナ装置、非接触電力伝送用アンテナユニット、及び電子機器 |
-
2017
- 2017-04-27 JP JP2017088553A patent/JP2020129571A/ja active Pending
-
2018
- 2018-04-25 CN CN201890000771.2U patent/CN211152314U/zh active Active
- 2018-04-25 WO PCT/JP2018/016768 patent/WO2018199148A1/fr active Application Filing
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62245700A (ja) * | 1986-04-18 | 1987-10-26 | セイコーエプソン株式会社 | ブレキシブル基板 |
| JP2000081589A (ja) * | 1998-07-09 | 2000-03-21 | Olympus Optical Co Ltd | 光偏向器 |
| JP2007212821A (ja) * | 2006-02-10 | 2007-08-23 | Matsushita Electric Ind Co Ltd | レンズ鏡筒 |
| WO2009031542A1 (fr) * | 2007-09-07 | 2009-03-12 | Alps Electric Co., Ltd. | Dispositif d'entraînement magnétique |
| JP2015149405A (ja) * | 2014-02-06 | 2015-08-20 | デクセリアルズ株式会社 | アンテナ装置、非接触電力伝送用アンテナユニット、及び電子機器 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN211152314U (zh) | 2020-07-31 |
| JP2020129571A (ja) | 2020-08-27 |
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