WO2018199148A1 - Electric element, actuator, and communication device - Google Patents

Abstract

Provided is an electric element capable of suppressing changes in the sensitivity of Hall elements even when a base substrate is thinly formed. An electric element 1 comprises a coil 2 and a Hall element 3 connected to a single base substrate 4, wherein the base substrate 4 comprises a flexible resin substrate and has a thin first region R1 and a thick second region R2, the coil 2 is connected at the first region R1, and the Hall element 3 is connected at the second region R2.

Description

ELECTRIC ELEMENT, ACTUATOR, AND COMMUNICATION DEVICE

The present invention relates to an electric element, an actuator, and a communication device.

Conventionally, an actuator configured using an electromagnet in which a coil having a conductor pattern is formed over a plurality of layers has been proposed.

For example, in Patent Document 1, a coil of a conductor pattern is provided on four sides of a printed coil board that is a rectangular frame-shaped insulating base material, and a plurality of such printed coil boards are prepared and laminated, whereby a laminated coil is obtained. Form. And in patent document 1, the actuator is comprised by making this laminated coil oppose the lower surface of the permanent magnet arrange | positioned so that a movement is possible.

JP 2016-191849 A

However, the electric element of Patent Document 1 is not suitable for use in, for example, a portable device that tends to be thin because the base material on which the Hall element is arranged is laminated and thick. On the other hand, when the base substrate is thinned for use in a portable device or the like, the base substrate is deformed and stress is applied to the Hall element package, resulting in a change in Hall element sensitivity. It was.

An object of the present invention is to provide an electric element that can suppress a change in sensitivity of the Hall element even when the base substrate is thinned.

A first aspect of the present invention is an electric element in which a coil and a Hall element are connected to one base substrate, and the base substrate is made of a flexible resin substrate, and has a small thickness. One region and a thick second region, wherein the coil is connected in the first region, and the Hall element is connected to the second region.

According to the present invention, even when the base substrate is thinned, the change in the sensitivity of the Hall element can be suppressed.

(A) is side surface sectional drawing which shows typically the structure of the electric element which concerns on the 1st Embodiment of this invention, (B) is a top view which shows typically the coil of (A). (A), (B) is a figure for demonstrating the manufacturing method of the coil 2. FIG. It is a figure for demonstrating the manufacturing method of the electrical element of 1st Embodiment. It is side surface sectional drawing which shows typically the structure of the electric element in the 2nd Embodiment of this invention. (A) is side surface sectional drawing which shows typically the structure of the electrical element in the 3rd Embodiment of this invention, (B) is a top view which shows typically the electrical element in the 3rd Embodiment of this invention It is. It is a top view which shows typically the insulating base material in each layer which comprises the coil in the 4th Embodiment of this invention. (A) is a top view which shows typically the electric element in 4th Embodiment, (B) is side sectional drawing which shows typically the electric element in 4th Embodiment. It is side surface sectional drawing which shows typically the actuator of the application example of this invention. It is side surface sectional drawing which shows typically the communication apparatus of the application example of this invention.

Hereinafter, various embodiments for carrying out the present invention will be described with reference to the drawings. In the drawings, corresponding members having the same functions are denoted by the same reference numerals. In consideration of ease of explanation or understanding of the main points, the embodiments are shown separately for convenience, but partial replacement or combination of configurations shown in different embodiments is possible. In the second and subsequent embodiments, descriptions of matters common to the first embodiment are omitted, and only different points will be described. In particular, the same operation and effect of the same configuration will not be sequentially described for each embodiment.
In all the drawings, the thickness direction of the insulating substrate, that is, the stacking direction is shown as the Z-axis direction, and in the plane orthogonal to the Z-axis, the longitudinal direction corresponding to the direction in which the permanent magnet moves is the X-axis direction, The direction is shown as the Y-axis direction.

<First Embodiment>
FIG. 1A is a side sectional view schematically showing the structure of the electric element 1 according to the first embodiment of the present invention, and FIG. 1B is a schematic view of the coil 2 in FIG. FIG. A coil 2 in FIG. 1A shows a cross section along AA ′ in FIG.

The electric element 1 of the present embodiment includes a coil 2, a hall element 3, and a base substrate 4. The electric element 1 is used, for example, for an actuator or an RFID (Radio Frequency Identifier) reader.

The coil 2 is formed of conductor patterns 20 and 21 and insulating base materials 2a, 2b, and 2c (see FIG. 2A). 2A and 2B are views for explaining a method of manufacturing the coil 2. First, as shown in FIG. 2A, three insulating base materials 2a, 2b, and 2c in which a copper foil is stretched over the entire surface of one side are prepared. As the insulating bases 2a, 2b, and 2c, for example, a thermoplastic resin such as a liquid crystal polymer (LCP) can be used. Next, the conductor patterns 20 and 21 and the electrode 22 are formed by a patterning process such as photolithography. The conductor patterns 20 and 21 are formed on the lower surfaces of the insulating base materials 2a and 2b when viewed from the Z-axis direction, and the electrodes 22 are formed on the lower surface of the insulating base material 2c when viewed from the Z-axis direction. Next, laser processing or the like from the upper surface side of the insulating base material 2a, 2b where the copper foil of the conductor patterns 20, 21 is not stretched and from the upper surface side of the insulating base material 2c where the copper foil of the electrode 22 is not stretched. Thus, a via hole penetrating the insulating base materials 2a, 2b, 2c is formed. The via hole is filled with a conductive paste containing a conductive material such as a Sn—Cu alloy.

Next, the insulating bases 2a, 2b, and 2c in which the conductive patterns 20 and 21 and the electrode 22 are formed and the via holes are filled with the conductive paste are laminated and integrated by a heating press or the like. At this time, the conductive paste filled in the via holes is also heated and hardened to form interlayer connection conductors 6a, 6b, 6c, and 6d that electrically connect the conductor patterns of the respective insulating base materials. Conductor patterns 20 and 21 and electrode 22 are electrically connected by interlayer connection conductors 6a, 6b, 6c, and 6d. As described above, the coil 2 as shown in FIG. 2B is formed.

As shown in FIG. 2A, the conductor patterns 20 and 21 are wound two turns on the lower surfaces of the insulating bases 2a and 2b to form a rectangular coil. The end 20a of the conductor pattern 20 is connected to the electrode 22 via the interlayer connection conductors 6b and 6c. Further, the end 21a of the conductor pattern 21 is connected to the electrode 22 through the interlayer connection conductor 6d. The electrode 22 is connected to a current supply source via an electrode 41 of the base substrate 4 described later.

Hall element 3 detects a magnetic field and outputs an analog signal proportional to the magnitude. It is used for detecting the position of a member or the like disposed to face the electric element 1. The Hall element 3 may be packaged with a resin, or may be potted with a silicone resin or an epoxy resin. Alternatively, the Hall element 3 may be covered with a cover made of zirconia or the like. In the present embodiment, as an example, the Hall element is a resin packaged one. As shown in FIG. 1A, an electrode 30 for taking out an analog signal output from the Hall element 3 is provided on the lower surface of the Hall element 3 viewed from the Z-axis direction.

The base substrate 4 is formed from the same type of resin substrate as the insulating substrates 2a, 2b, 2c forming the coil 2. For example, the base substrate 4 can be formed using a thermoplastic resin such as liquid crystal polymer (LCP: Liquid Crystal Polymer). As shown in FIG. 1A, the base substrate 4 of the present embodiment has a first region R1 having a small thickness in the Z-axis direction and a second region R2 having a large thickness. The thick second region R2 is formed, for example, by laminating a liquid crystal polymer in a portion corresponding to the thick second region R2 and integrating them with a hot press or the like. In the present embodiment, an electrode 41 corresponding to the electrode 22 of the coil 2 and an electrode 42 corresponding to the electrode 30 of the Hall element 3 are formed on the upper surface of the base substrate 4 viewed from the Z-axis direction. . The electrodes 41 and 42 are made of, for example, copper foil.

The base substrate 4 of this embodiment can be formed by the following manufacturing method. First, two resin base materials in which a copper foil is stretched over the entire surface of one side are prepared. Next, the electrode 41, the electrode 42, and a wiring pattern (not shown) are formed by a patterning process such as photolithography. Next, the resin base material on which the electrode 41 and the wiring pattern are formed and the resin base material on which the electrode 42 and the wiring pattern are formed are laminated at a position corresponding to the thick second region R2, and are integrated by a heating press or the like. Make it. The base substrate 4 is formed as described above.

In the present embodiment, the thickness of the first region R1 of the base substrate 4 is set to 80 μm, and the thickness of the thick second region R2 is set to 130 μm. However, these thicknesses are examples, and can be appropriately changed according to the use of the electric element 1 and the like.

FIG. 3 is a diagram for explaining a method of manufacturing the electric element 1 of the present embodiment. As shown in FIG. 3, first, the base substrate 4 manufactured as described above, the coil 2 manufactured as described above, and the Hall element 3 are prepared. Next, the electrode 22 of the coil 2 and the electrode 41 of the base substrate 4 are soldered using the solder 7 (see FIG. 1A), and the electrode 30 of the Hall element 3 and the electrode 42 of the base substrate 4 are soldered. Are soldered using a solder 7 (see FIG. 1A).

As described above, the electric element 1 in which the coil 2 is connected to the thin first region R1 of the base substrate 4 and the Hall element 3 is connected to the thick second region R2 of the base substrate 4 is manufactured. The electrical element 1 thus manufactured generates a magnetic field in a direction from the upper surface to the lower surface or from the lower surface to the upper surface of the coil 2 by supplying current to the conductor patterns 20 and 21 of the coil 2. This magnetic field can be used as an actuator or a communication device. Moreover, it can utilize as a communication apparatus by using the coil 2 as an antenna.

In this embodiment, since the electric base 1 is formed of a flexible resin base material, the base base material 4 can be reduced in thickness, and various modifications can be made by deformation of the base base material 4. Attachment to the device can be facilitated. Moreover, since the area | region where the Hall element 3 was connected becomes the 2nd area | region R2 where the base base material 4 is thick, the electrical element 1 becomes difficult to deform | transform the connection part of the Hall element 3, and the base base material 4 of FIG. It can suppress that the stress which generate | occur | produces by a deformation | transformation is transmitted to the Hall element 3, and can prevent that the sensitivity of the Hall element 3 changes.

Moreover, in this embodiment, since the base base material 4 was formed with the same kind of flexible resin base material as the insulating base material forming the coil 2, after mounting the coil 2 on the base base material 4, It is possible to make it difficult for distortion due to shrinkage or the like to occur, and it is also possible to make it difficult for stress resulting from the distortion to be transmitted to the Hall element 3. As a result, it is possible to prevent the sensitivity of the Hall element 3 from changing.

Furthermore, in the present embodiment, by connecting the Hall element 3 to the thick second region R2 of the base substrate 4, as shown in FIG. 1A, the coil is formed in the height direction (Z-axis direction). The Hall element 3 can be disposed so as to overlap at least part of the region B, and the sensitivity of the Hall element 3 can be increased.

As described above, according to the present embodiment, the coil 2 is connected to the thin first region R1 of the base substrate 4 and the Hall element 3 is connected to the thick second region R2 of the base substrate 4, 1 can be achieved, and the stress generated by the deformation of the base substrate 4 can be suppressed from being transmitted to the Hall element 3, and the sensitivity of the Hall element 3 can be prevented from changing.

<Modification>
In the present embodiment, as an example, a mode has been described in which the thin first region R1 of the base substrate 4 is a single-layer resin substrate, and the thick second region R2 of the base substrate 4 is a two-layer resin substrate. However, the present invention is not limited to such an embodiment, and the number of stacked layers in each region can be changed as appropriate.

In the present embodiment, as an example, a mode in which the coil 2 is configured by three layers of insulating base materials 2a, 2b, and 2c has been described. However, the present invention is not limited to such a mode, and the coil 2 is laminated. The number can be changed as appropriate.

In this embodiment, the aspect which forms a rectangular coil by the conductor patterns 20 and 21 was demonstrated as an example, However, This invention is not necessarily limited to such an aspect, The shape of a coil is circular shape. Alternatively, it may be oval.

In the present embodiment, as an example, the aspect in which the number of turns of the conductor patterns 20 and 21 is set to 2 has been described. However, the present invention is not limited to such an aspect, and the number of turns can be changed as appropriate. It is. Moreover, the number of turns of the conductor patterns 20 and 21 may be plural, and the number of turns may be different. In this case, it is preferable that the number of turns of the conductor pattern 20 on the upper surface side of the coil 2 is larger than the number of turns of the conductor pattern 21.

In the present embodiment, the mode in which the line widths of the conductor patterns 20 and 21 are made equal is described as an example, but the present invention is not limited to such a mode, and the line width of the conductor pattern 20 and the conductor pattern The line width of 21 may be different.

<Second Embodiment>
Next, a second embodiment of the present invention will be described with reference to the drawings. FIG. 4 is a side sectional view schematically showing the structure of the electric element 1A in the present embodiment.

The electric element 1A of the present embodiment is different from the first embodiment in that the base substrate 4 is bent at the thin first region R1-2. As shown in FIG. 4, in the electric element 1A according to the present embodiment, the thin first region of the base substrate 4 has two thick regions, the first region R1-1 and the first region R1-2, and the thick second region. The regions are provided at two locations, the second region R2-1 and the second region R2-2. The thin first region R1-1 to which the coil 2 is connected and the thick second region R2-1 to which the Hall element 3 is connected are the first region R1 and the second region R2 of the first embodiment, respectively. It is the same. However, in the electric element 1A of the present embodiment, as shown in FIG. 4, the coil 2 is arranged on the negative side in the X-axis direction with the thick second region R2-1 where the hall element 3 is arranged as the center. The thin first region R1-1 is provided, and the thin first region R1-2 is provided on the positive side in the X-axis direction. In the thin first region R1-2 provided on the positive side in the X-axis direction with respect to the second region R2-1, the base substrate 4 is bent.

Further, in the electric element 1A of the present embodiment, a thick second region R2-2 is provided on the bending direction side of the thin first region R1-2 where the base substrate 4 is bent, and the second region R2- 2 is connected to a connector 8 as an external mounting portion.

Also in this embodiment, the base substrate 4 is formed from a resin substrate such as a liquid crystal polymer of the same type as the insulating substrates 2a, 2b, 2c forming the coil 2. The two thick second regions R2-1 and R2-2 in the base substrate 4 of the present embodiment include, for example, the thin first regions R1-1 and R1-2 formed of a single-layer resin substrate. The resin base material is laminated at portions corresponding to the thick second regions R2-1 and R2-2, and integrated by a hot press or the like. In the present embodiment, as shown in FIG. 4, an electrode 43 corresponding to the electrode 80 of the connector 8 is formed on the upper surface of the base substrate 4 in addition to the electrodes 41 and 42. The electrode 43 is formed of a copper foil, for example, like the electrodes 41 and 42.

The base substrate 4 of this embodiment can be formed by the following manufacturing method. First, three resin base materials in which a copper foil is stretched over the entire surface of one side are prepared. Next, the electrode 41, the electrode 42, the electrode 43, and a wiring pattern (not shown) are formed by a patterning process such as photolithography. Next, the resin base material on which the electrode 41 and the wiring pattern are formed, the resin base material on which the electrode 42 and the wiring pattern are formed, and the resin base material on which the electrode 43 and the wiring pattern are formed are thick at two places. They are stacked at positions corresponding to the second regions R2-1 and R2-2, and are integrated by a heating press or the like. The base substrate 4 is formed as described above.

In the present embodiment, the thickness of the first regions R1-1 and R1-2 of the base substrate 4 is set to 80 μm, and the thickness of the thick second region R2-1 to which the Hall element 3 is connected is , 130 μm. The thickness of the thick second region R2-2 to which the connector 8 is connected is set to 130 μm. However, these thicknesses are examples, and can be appropriately changed according to the use of the electric element 1A.

In the present embodiment, the coil 2 and the Hall element 3 are soldered to the base substrate 4 manufactured as described above with the solder 7 in the same manner as in the first embodiment. Next, the electrode 43 formed on the base substrate 4 and the electrode 80 of the connector 8 are soldered with the solder 7. Then, the thin first region R1-2 on the positive side in the X-axis direction is bent from the thin first region R1-1 to which the coil 2 is connected, and the thin first region R1- to which the coil 2 is connected is bent. 1 and the thick second region R2-1 to which the Hall element 3 is connected are attached at predetermined positions.

In the present embodiment, as described above, the base substrate 4 is bent when the electric element 1A is attached. Since the region to be bent is the thin first region R1-2, the bending is easily performed. be able to. Further, since the Hall element 3 is connected to the thick second region R2-1, it is possible to make it difficult to transmit the stress due to the bending process to the Hall element 3 even when the bending process as described above is performed. As a result, it is possible to prevent the sensitivity of the Hall element 3 from changing.

Moreover, when the base substrate 4 is bent and attached to an external attachment portion such as the connector 8 as in this embodiment, it is considered that internal stress or residual stress is generated. Since the Hall element 3 is connected to the thick second region R2-1, the internal stress or residual stress as described above can be made difficult to be transmitted to the Hall element 3. As a result, it is possible to prevent the sensitivity of the Hall element 3 from changing.

Furthermore, in the present embodiment, since the connection portion with the connector 8 is the thick second region R2-2, it is possible to suppress poor bonding with the connector 8.

<Modification>
In the present embodiment, as an example, the thin first region is the two regions of the first region R1-1 and the first region R1-2, and the thick second region is the two regions of the second region R2-1 and the second region R2-2. Although the aspect made into the place was demonstrated, this invention is not necessarily limited to such an aspect, and the number of places which provide a thin 1st area | region and a thick 2nd area | region can be changed suitably.

In the present embodiment, as an example, the thin first region R1 of the base substrate 4 is a single layer resin substrate, and the two thick second regions R2-1 and R2-2 are a two layer resin substrate. Although the embodiment has been described, the present invention is not limited to such an embodiment, and the number of stacked layers in each region can be changed as appropriate.

Also in this embodiment, the coil shape of the conductor patterns 20 and 21 is not limited to a rectangular coil, and the number of turns of the conductor patterns 20 and 21 is not limited to two. Further, the line widths of the conductor patterns 20 and 21 can be changed as appropriate.

<Third Embodiment>
Next, a third embodiment of the present invention will be described with reference to the drawings. FIG. 5A is a side cross-sectional view schematically showing the structure of the electric element 1B in the present embodiment. FIG. 5B is a plan view schematically showing the structure of the electric element 1B in the present embodiment. FIG. 5A shows the AA ′ cross section in FIG.

The electrical element 1B of the present embodiment is different from the second embodiment in that the two coils 2 are connected to the base substrate 4. As shown in FIG. 5A, the electric element 1B of the present embodiment includes two thin first regions on both sides of the thick second region R2-1 to which the Hall element 3 is connected in the X-axis direction. R1-1 and R1-3 are provided, and the coil 2 is connected to each of these two thin first regions R1-1 and R1-3. In other words, the connection portion of the Hall element 3 is provided at a position sandwiched between the connection portions with the two coils 2. Further, in the X-axis direction, the thin first region outside the thin first regions R1-1 and R1-3 to which the coil 2 is connected as viewed from the thick second region R2-1 to which the Hall element 3 is connected. R1-4 and R1-5 are bent.

Also in this embodiment, the base substrate 4 is formed from a resin substrate such as a liquid crystal polymer of the same type as the insulating substrates 2a, 2b, 2c forming the coil 2. The two thick second regions R2-1 in the base substrate 4 of the present embodiment include, for example, the thin first regions R1-1, R1-3, R1-4, and R1-5 as a single-layer resin substrate. It is formed by laminating a resin base material in a portion corresponding to the thick second region R2-1 and integrating them by a heating press or the like. Further, in the present embodiment, on the upper surface of the base substrate 4, as shown in FIG. 5A, corresponding to the two coils 2, the electrodes 41 are thin first regions R1-1 and R1. -3.

The base substrate 4 of this embodiment can be formed by the following manufacturing method. First, two resin base materials in which a copper foil is stretched over the entire surface of one side are prepared. Next, the electrode 41, the electrode 42, and a wiring pattern (not shown) are formed by a patterning process such as photolithography. At this time, the electrodes 41 are formed in the thin first regions R1-1 and R1-3 so as to correspond to the two coils 2 as described above. Next, the resin base material on which the electrode 41 and the wiring pattern are formed and the resin base material on which the electrode 42 and the wiring pattern are formed are laminated at a position corresponding to the thick second region R2-1, To integrate. The base substrate 4 is formed as described above.

In the present embodiment, the Hall element 3 is soldered to the base substrate 4 manufactured as described above with the solder 7 and the two coils 2 are soldered to the base 7 with the solder 7 as in the first embodiment. Next, the thin first regions R1-4 and R1-5 at both ends are bent, and the electric element 1B is attached to a predetermined position.

In the present embodiment, as described above, when the electric element 1B is attached, the base substrate 4 is bent, but as shown in FIGS. 5A and 5B, the mounting portion of the two coils 2 is used. Since the Hall element 3 is arranged at the sandwiched position, it is possible to suppress the generation of stress associated with the bending process and to prevent the Hall element 3 from changing in sensitivity. In addition, since the regions to be bent are thin first regions R1-4 and R1-5, the bending can be easily performed. Further, even after the bending process, even if deformation occurs in the vicinity of the mounting portion of the Hall element 3, it is possible to suppress the generation of stress accompanying the deformation and prevent the sensitivity of the Hall element 3 from changing. Can do.

<Modification>
In this embodiment, the aspect which attaches the two coils 2 to the base base material 4 as an example was demonstrated, However, this invention is not necessarily limited to such an aspect, IC other than the coil 2, etc. These parts may be attached.

In the present embodiment, as an example, two thin first regions R1-1 and R1-3 as mounting portions of the coil 2, one thick second region R2-1 as mounting portions of the Hall element 3, and The mode in which the thin first regions R1-4 and R1-5 as the bent portions are provided in two places has been described. However, the present invention is not limited to such an embodiment, and the number of places where each region is provided can be changed as appropriate.

In the present embodiment, as an example, the thin first regions R1-1, R1-3, R1-4, and R1-5 of the base substrate 4 are used as one layer of resin substrate, and two thick second regions R2- Although the embodiment in which 1 is a two-layer resin base material has been described, the present invention is not limited to such an embodiment, and the number of layers in each region can be changed as appropriate.

Also in this embodiment, the coil shape of the conductor patterns 20 and 21 is not limited to a rectangular coil, and the number of turns of the conductor patterns 20 and 21 is not limited to two. Further, the line widths of the conductor patterns 20 and 21 can be changed as appropriate.

<Fourth Embodiment>
Next, a fourth embodiment of the present invention will be described with reference to the drawings. FIG. 6 is a plan view schematically showing the insulating bases 2a, 2b, 2b in each layer constituting the coil 2 in the present embodiment. FIG. 7A is a plan view schematically showing the electric element 1C in the present embodiment, and FIG. 7B is a side cross-sectional view schematically showing the electric element 1C in the present embodiment. FIG. 7B shows the AA ′ cross section in FIG.

As shown in FIG. 6, the coil 2 in the electric element 1 </ b> C of the present embodiment is different from the first embodiment in that the coil 2 is formed using insulating base materials 2 a, 2 b, and 2 b in which a through hole 9 is formed in the center. . The manufacturing method of the coil 2 is the same as that of the first embodiment, and the insulating base materials 2a, 2b, and 2b may be laminated so that the through holes 9 overlap with each other and integrated by a heating press or the like.

Further, as shown in FIG. 7B, the base substrate 4 in the present embodiment is a thin base plate in which two electrodes 41 corresponding to the two electrodes 22 of the coil 2 are formed in the X-axis direction. A thick second region R2-1 for connecting the Hall element 3 is provided between the first regions R1-6 and R1-7. The base substrate 4 is formed from a resin substrate such as a liquid crystal polymer of the same type as the insulating substrates 2a, 2b, and 2c forming the coil 2 as in the above-described embodiments. The thick second region R2-1 in the base substrate 4 of the present embodiment includes, for example, the thin first regions R1-6 and R1-7 made of a single-layer resin substrate, and the thick second region R2-1 It is formed by laminating a resin base material at a corresponding portion and integrating by a heat press or the like.

The base substrate 4 of this embodiment can be formed by the following manufacturing method. First, two resin base materials in which a copper foil is stretched over the entire surface of one side are prepared. Next, two patterns of the electrode 41, the electrode 42, and a wiring pattern (not shown) are formed by a patterning process such as photolithography. At this time, a gap between the two electrodes 41 is opened so that a mounting portion for the Hall element 3 can be formed. Next, on the resin base material on which the two electrodes 41 are formed, the electrode base material and the resin base material on which the wiring pattern is formed are laminated so as to be positioned between the two electrode 41, and a heating press or the like. To integrate. The base substrate 4 is formed as described above.

In the present embodiment, the Hall element 3 is soldered to the base substrate 4 manufactured as described above with the solder 7 as in the first embodiment. Next, the coil 2 is soldered to the base substrate 4 with the solder 7 so that the Hall element 3 is disposed in the through hole 9 of the coil 2.

In the present embodiment, as described above, the thick second region R2-1 is formed inside the coil 2 and the Hall element 3 is disposed. Therefore, after the coil 2 is mounted, The surroundings can be made difficult to deform, and the change in sensitivity of the Hall element 3 accompanying the generation of stress can be suppressed.

<Modification>
Also in the present embodiment, a bent portion may be provided as in the second embodiment and the third embodiment. It is preferable that the bent portion is a thin first region R1.

In this embodiment, as an example, the thin first regions R1-6 and R1-7 of the base substrate 4 are used as one layer of resin base material, and the thick second regions R2-1 are used as two layers of resin base material. However, the present invention is not limited to such an embodiment, and the number of stacked layers in each region can be changed as appropriate.

Also in this embodiment, the coil shape of the conductor patterns 20 and 21 is not limited to a rectangular coil, and the number of turns of the conductor patterns 20 and 21 is not limited to two. Further, the line widths of the conductor patterns 20 and 21 can be changed as appropriate.

<Application example>
The electric elements 1, 1A, 1B, and 1C of the above-described embodiments can be applied to various devices. For example, as shown in FIG. FIG. 8 is a side sectional view schematically showing the actuator 35 of the application example. As shown in FIG. 8, the actuator 35 is provided above the electric element 1C described in the third embodiment (in the Z-axis direction) so that the movable body 10 can move in the positive and negative directions in the X-axis direction. Yes. Two permanent magnets 11 are provided on the lower surface of the moving body 10 in the Z-axis direction. In such an actuator 35, a current is supplied to the conductor patterns 20 and 21 of the coil 2 to generate a magnetic field from the coil 2, and the repulsive force and the attractive force between the electromagnetic force and the permanent magnet 11 are used to move. The body 10 can be moved in the positive and negative directions in the X-axis direction.

When configuring such an actuator, it is also possible to use electric elements of other embodiments other than the electric element 1C described in the third embodiment.

Moreover, the electric elements 1, 1A, 1B, and 1C of the above-described embodiment can be used for a communication device 40 as shown in FIG. 9, for example. FIG. 9 is a side sectional view schematically showing the communication device 40 of the application example. In the communication device 40 shown in FIG. 9, the electric element 1 described in the first embodiment is used as an RFID reader. In this communication device 40, the tag information is detected while the position of the RF tag 50 is detected by the Hall element 3 by bringing the RF tag 50 above (in the Z-axis direction) the electric element 1 as an RFID reader. It can be read by the electric element 1 as an RFID reader.

When configuring such a communication device, it is possible to use an electric element of another embodiment other than the electric element 1 described in the first embodiment.

In addition to the above-described examples, the present invention can be applied to various devices using magnetic field coupling.

The above description of the embodiment is illustrative in all respects and not restrictive. Modifications and changes can be made as appropriate by those skilled in the art. The scope of the present invention is shown not by the above embodiments but by the claims. Furthermore, the scope of the present invention includes modifications from the embodiments within the scope equivalent to the claims.

The present invention can be used in the field of communication devices such as an electric element using an electromagnet, an actuator using the electric element, or an RFID reader.

1, 1A, 1B, 1C Electrical element 2 Coil 3 Hall element 4 Base substrate 8 Connector 20, 21 Conductor pattern 30 Actuator 40 Communication device R1 First region R1-1 to R1-7 First region R2 Second region R2- 1, R2-2 2nd region

Claims (11)

1. An electrical element in which a coil and a Hall element are connected to one base substrate,
   The base substrate is made of a flexible resin substrate,
   A thin first region and a thick second region;
   The coils are connected in the first region;
   The Hall element is connected to the second region;
   An electrical element characterized by that.
2. The coil is formed of an insulating base material and a conductor pattern,
   The insulating base material forming the coil and the base base material are made of the same type of resin base material.
   The electrical element according to claim 1.
3. Hall elements are arranged so that at least a part thereof overlaps the coil formation region in the height direction.
   The electric element according to claim 1 or 2, wherein the electric element is provided.
4. The base substrate is bent in the first region;
   The electrical device according to claim 1, wherein the electrical device is a device.
5. The base substrate is bent in the first region and attached to an external attachment portion;
   The electrical element according to claim 4, wherein
6. A plurality of at least one of the first region and the second region are provided;
   The electrical device according to claim 1, wherein the electrical device is a device.
7. The Hall element is disposed in a region sandwiched between the coils,
   The electrical element according to claim 6.
8. The first region that is bent is opposite to the region where the Hall element is disposed, as viewed from the region where the coil is disposed.
   The electric element according to claim 4, wherein the electric element is any of the above.
9. The Hall element is disposed inside the coil,
   9. The electric element according to claim 1, wherein
10. An actuator comprising the electrical element according to any one of claims 1 to 8.
11. A communication device comprising the electrical element according to any one of claims 1 to 8.

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