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WO2018198527A1 - Condensateur - Google Patents

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Publication number
WO2018198527A1
WO2018198527A1 PCT/JP2018/007683 JP2018007683W WO2018198527A1 WO 2018198527 A1 WO2018198527 A1 WO 2018198527A1 JP 2018007683 W JP2018007683 W JP 2018007683W WO 2018198527 A1 WO2018198527 A1 WO 2018198527A1
Authority
WO
WIPO (PCT)
Prior art keywords
capacitor element
electrode
bus bar
capacitor
opening
Prior art date
Application number
PCT/JP2018/007683
Other languages
English (en)
Japanese (ja)
Inventor
孝彦 木下
真 田寺
Original Assignee
パナソニックIpマネジメント株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by パナソニックIpマネジメント株式会社 filed Critical パナソニックIpマネジメント株式会社
Priority to JP2019515128A priority Critical patent/JP7213407B2/ja
Publication of WO2018198527A1 publication Critical patent/WO2018198527A1/fr

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/10Housing; Encapsulation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/228Terminals
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/32Wound capacitors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/38Multiple capacitors, i.e. structural combinations of fixed capacitors

Definitions

  • the present invention relates to a capacitor.
  • Patent Document 1 discloses a metallized film capacitor that is filled with.
  • case mold type capacitor As in Patent Document 1, a configuration in which a plurality of capacitor element units including a capacitor element and a pair of bus bars are accommodated in one case and molded with a filling resin can be employed.
  • Each capacitor element unit is incorporated in different electronic circuit units in a device (device) on which a capacitor is mounted. With such a configuration, when a plurality of capacitor element units are used in one device, it is not necessary to provide a case for each capacitor element unit.
  • an object of the present invention is to provide a capacitor that can be made compact and reduce ESL when a plurality of capacitor element units are accommodated in one case.
  • the capacitor according to the main aspect of the present invention includes a first capacitor element having a first electrode and a second electrode, a first bus bar connected to the first electrode, and a connection to the second electrode.
  • each of the first bus bar and the second bus bar overlaps each other in the normal direction at a position deviated from the first capacitor element in the normal direction of the opening surface where the case opens.
  • the first superposition part and 2nd superposition part are included, and the 1st insulating part intervenes between the 1st superposition part and the 2nd superposition part.
  • the second capacitor element is disposed in the case so as to overlap the first overlapping portion and the second overlapping portion in the normal direction.
  • the third bus bar includes a third overlapping portion that overlaps the second overlapping portion in the normal direction, and a second insulation is provided between the second overlapping portion and the third overlapping portion. The part intervenes.
  • the present invention when a plurality of capacitor element units are accommodated in one case, it is possible to provide a capacitor that can be made compact and reduce ESL.
  • FIG. 1A is a perspective view of a film capacitor according to the embodiment as viewed from the front upper side
  • FIG. 1B is a perspective view of the film capacitor with the filled resin removed according to the embodiment. It is the perspective view seen from the front upper direction.
  • FIG. 2 is an exploded perspective view of the film capacitor according to the embodiment.
  • FIG. 3A is a perspective view of the first capacitor element unit according to the embodiment as viewed from the rear lower side
  • FIG. 3B is a rear lower side of the second capacitor element unit according to the embodiment. It is the perspective view seen from.
  • FIG. 4A is a perspective view of the first bus bar according to the embodiment
  • FIG. 4B is a perspective view of the second bus bar according to the embodiment.
  • FIG.5 (a) is the perspective view which looked at the 1st insulating board based on embodiment from the front upper direction
  • FIG.5 (b) looked at the 1st insulating board based on embodiment from the back lower back.
  • FIG. FIG. 6A is a perspective view of the third bus bar according to the embodiment
  • FIG. 6B is a perspective view of the fourth bus bar and the insulating sheet according to the embodiment.
  • FIG. 7 is a perspective view of the case according to the embodiment as viewed from the rear and upper side.
  • FIG. 8 is a left side sectional view of the film capacitor taken along the line AA ′ in FIG. 1B according to the embodiment.
  • 9A to 9C are cross-sectional views of main parts of a film capacitor according to a modification.
  • a film capacitor 1 which is an embodiment of the capacitor of the present invention will be described with reference to the drawings.
  • front and rear, left and right, and up and down directions are appropriately appended to each drawing.
  • the direction of illustration shows the relative direction of the film capacitor 1 to the last, and does not show an absolute direction.
  • the film capacitor 1 corresponds to a “capacitor” described in the claims.
  • the first capacitor element unit 10 ⁇ / b> A corresponds to a “first capacitor element unit” recited in the claims.
  • the second capacitor element unit 10B corresponds to a “second capacitor element unit” recited in the claims.
  • the first capacitor element 100 corresponds to a “first capacitor element” recited in the claims.
  • the upper end face electrode 101 and the lower end face electrode 102 correspond to “first electrode” and “second electrode” recited in the claims, respectively.
  • the first bus bar 200 and the second bus bar 300 correspond to the “first bus bar” and the “second bus bar” recited in the claims, respectively.
  • correspond to the "1st superposition
  • the first opening 231 and the second opening 331 respectively correspond to the “first opening” and the “second opening” recited in the claims.
  • the first insulating plate 400 corresponds to a “first insulating portion” recited in the claims.
  • the third opening 411 corresponds to a “third opening” recited in the claims.
  • first annular protrusion 412 and the second annular protrusion 413 correspond to a “first annular protrusion” and a “second annular protrusion” recited in the claims, respectively.
  • the second capacitor element 500 corresponds to a “second capacitor element” recited in the claims.
  • the upper end face electrode 501 and the lower end face electrode 502 correspond to “third electrode” and “fourth electrode” recited in the claims, respectively.
  • the third bus bar 600 and the fourth bus bar 700 correspond to the “third bus bar” and the “fourth bus bar” recited in the claims, respectively.
  • the third electrode terminal portion 610 corresponds to a “third overlapping portion” recited in the claims.
  • the electrode pin 611 corresponds to a “joint portion” described in the claims.
  • the second insulating plate 800 corresponds to a “second insulating portion” recited in the claims.
  • the fourth opening 811 corresponds to a “fourth opening” recited in the claims.
  • the fitting protrusion 812 corresponds to a “protrusion” described in the claims.
  • FIG. 1A is a perspective view of the film capacitor 1 according to the present embodiment as viewed from the front upper side
  • FIG. 1B is a state in which the filling resin 30 according to the present embodiment is removed. It is the perspective view which looked at the film capacitor 1 of this from the front upper direction.
  • the film capacitor 1 includes a capacitor assembly 10, a case 20 in which the capacitor assembly 10 is accommodated, and thermal curing that is filled in the case 20 and cured in the case 20.
  • Filling resin 30 In the state where the inside of the case 20 is molded with the filling resin 30, the four first connection terminal portions 240 and the first sub-connection terminal portions 250 of the first bus bar 200 and the four second connection terminal portions 340 of the second bus bar 300.
  • the third connection terminal portion 630 of the third bus bar 600, the fourth connection terminal portion 730 of the fourth bus bar 700, and the fifth sub connection terminal portion 952 of the fifth bus bar 950 are exposed from the filling resin 30.
  • Most of the capacitor assembly 10 embedded in the filling resin 30 is protected from moisture and impact.
  • FIG. 2 is an exploded perspective view of the film capacitor 1 according to the present embodiment.
  • FIG. 3A is a perspective view of the first capacitor element unit 10A according to the present embodiment as viewed from the lower rear side
  • FIG. 3B is a second capacitor element unit according to the present embodiment. It is the perspective view which looked at 10B from back lower direction.
  • the capacitor assembly 10 includes a first capacitor element unit 10A and a second capacitor element unit 10B.
  • the first capacitor element unit 10A includes five first capacitor elements 100, a first bus bar 200, a second bus bar 300, and a first insulating plate 400.
  • the first capacitor element unit 10A includes three pieces. Second capacitor element 500, third bus bar 600, and fourth bus bar 700 are included.
  • the first capacitor element unit 10 ⁇ / b> A and the second capacitor element unit 10 ⁇ / b> B can be respectively incorporated in different electronic circuit units included in an external device (not shown) on which the film capacitor 1 is mounted.
  • the capacitor assembly 10 further includes a second insulating plate 800.
  • the first capacitor element unit 10A includes a third capacitor element 910, two fourth capacitor elements 920, 5 capacitor element 930, sixth capacitor element 940, fifth bus bar 950, and sixth bus bar 960 are included.
  • the five first capacitor elements 100 are arranged in the short direction (the left-right direction in FIG. 2) in the case 20 so that both end surfaces face the up-down direction. Arranged.
  • Each first capacitor element 100 is formed by stacking two metallized films on which aluminum is vapor-deposited on a dielectric film, winding or stacking the stacked metallized films, and pressing them flatly.
  • an upper end face electrode 101 is formed on the upper end face by spraying a metal such as zinc
  • a lower end face electrode 102 is similarly formed on the lower end face by spraying a metal such as zinc. Is formed.
  • the first capacitor element 100 of the present embodiment is formed of a metallized film in which aluminum is vapor-deposited on a dielectric film, but other metals such as zinc and magnesium are vapor-deposited in addition to this. It may be formed of a metallized film. Or the 1st capacitor
  • the third capacitor element 910 is disposed on the right side of the first capacitor element 100 at the right end in the case 20 so that both end faces are directed in the vertical direction
  • the fourth capacitor element 920, the fifth capacitor element 930, and the The six-capacitor element 940 is disposed between the first capacitor element 100 and the third capacitor element 910 in the case 20 so that both end faces are directed in the vertical direction.
  • the configurations of the third capacitor element 910, the fourth capacitor element 920, the fifth capacitor element 930, and the sixth capacitor element 940 are the same as the configuration of the first capacitor element 100, and the upper end electrode 911 is disposed on the upper end surface thereof. , 921, 931, 941 are formed, and lower end face electrodes 912, 922, 932, 942 are formed on the lower end face thereof.
  • the third capacitor element 910 has the same capacitance and the same size as the first capacitor element 100, but the fourth capacitor element 920, the fifth capacitor element 930, and the sixth capacitor element 940 are more static than the first capacitor element 100. Small capacity and small size.
  • FIG. 4A is a perspective view of the first bus bar 200 according to the present embodiment.
  • the first bus bar 200 is formed of a conductive material, for example, a copper plate, and includes a first electrode terminal portion 210 and a first sub electrode terminal portion. 220, a first overlapping portion 230, four first connection terminal portions 240, and a first sub connection terminal portion 250.
  • the first bus bar 200 is formed by, for example, appropriately cutting and bending a single copper plate, and the first electrode terminal portion 210, the first sub electrode terminal portion 220, the first overlapping portion 230, and the first connection.
  • the terminal part 240 and the first sub-connecting terminal part 250 are integrated.
  • the first electrode terminal portion 210 has a plate shape that is elongated to the left and right. Ten electrode pins 211 are formed on the front edge of the first electrode terminal portion 210 so as to be arranged in the left-right direction. The first electrode terminal portion 210 is in contact with the upper end face electrodes 101 of the five first capacitor elements 100. Two electrode pins 211 are arranged on each upper end face electrode 101. The electrode pins 211 are joined to the corresponding upper end face electrodes 101 of the first capacitor elements 100 by a joining method such as soldering. Thereby, the first electrode terminal portion 210 of the first bus bar 200 is electrically connected to the upper end surface electrodes 101 of the five first capacitor elements 100.
  • the first sub electrode terminal portion 220 is formed so as to extend obliquely forward to the right from the right end portion of the first electrode terminal portion 210.
  • Two electrode pins 221 are formed in the first sub electrode terminal portion 220 at positions corresponding to the upper end face electrodes 911 of the third capacitor element 910, and correspond to the upper end face electrodes 921 of the two fourth capacitor elements 920.
  • One electrode pin 222 is formed at each position.
  • Two electrode pins 221 are joined to the upper end face electrode 911 of the third capacitor element 910 by a joining method such as soldering, and each electrode pin 222 is soldered to the upper end face electrode 921 of each fourth capacitor element 920. Bonded by the bonding method.
  • the first sub-electrode terminal portion 220 of the first bus bar 200 is electrically connected to the upper end face electrode 911 of the third capacitor element 910 and the upper end face electrodes 921 of the two fourth capacitor elements 920.
  • the first overlapping part 230 has a plate shape that is long on the left and right, and is provided to be higher by one step behind the first electrode terminal part 210.
  • six circular first openings 231 are formed at predetermined intervals so as to be aligned in the left-right direction.
  • the four first connection terminal portions 240 are formed so as to rise upward from the rear end edge of the first overlapping portion 230, and the front and back surfaces thereof face in the front-rear direction. Two first connection terminal portions 240 are provided on the left side of the first overlapping portion 230, and the other two first connection terminal portions 240 are provided on the right side of the first overlapping portion 230. Each first connection terminal portion 240 is formed with a circular attachment hole 241 penetrating the front and back. The first connection terminal portion 240 is electrically connected to a corresponding external terminal (not shown) by screwing using the attachment hole 241.
  • the first sub-connecting terminal portion 250 is formed so as to rise upward from the right end portion of the first sub-electrode terminal portion 220, and the front and back surfaces thereof face in the left-right direction.
  • the first sub-connecting terminal portion 250 is formed with a circular mounting hole 251 penetrating the front and back.
  • the first sub-connecting terminal portion 250 is electrically connected to a corresponding external terminal (not shown) by screwing using the mounting hole 251.
  • FIG. 4B is a perspective view of the second bus bar 300 according to the present embodiment.
  • the second bus bar 300 is formed of a conductive material, for example, a copper plate, and includes a second electrode terminal portion 310, a second relay portion 320, and the like.
  • the second overlapping portion 330 and the four second connection terminal portions 340 are included.
  • the second bus bar 300 is formed, for example, by appropriately cutting and bending a single copper plate, and the second electrode terminal portion 310, the second relay portion 320, the second overlapping portion 330, and the second connection terminal portion. 340 is integrated.
  • the second electrode terminal portion 310 has a plate shape that is elongated to the left and right. Two electrode pins 311 corresponding to the first capacitor element 100 at the left end are formed at the corner between the left end edge and the front end edge of the second electrode terminal portion 310. Further, eight electrode pins 311 corresponding to the four first capacitor elements 100 other than the left end are formed on the front end edge of the second electrode terminal portion 310 so as to be arranged in the left-right direction. The second electrode terminal portion 310 is in contact with the lower end surface electrodes 102 of the five first capacitor elements 100. Two electrode pins 311 are arranged on each lower end face electrode 102.
  • the electrode pin 311 is joined to the lower end face electrode 102 of the corresponding first capacitor element 100 by a joining method such as soldering. Thereby, the second electrode terminal portion 310 of the second bus bar 300 is electrically connected to the lower end surface electrodes 102 of the five first capacitor elements 100. Furthermore, an electrode pin 312 corresponding to the fifth capacitor element 930 is formed on the right end edge of the second electrode terminal portion 310. The electrode pin 312 is joined to the lower end face electrode 932 of the fifth capacitor element 930 by a joining method such as soldering. As a result, the second electrode terminal portion 310 of the second bus bar 300 is electrically connected to the lower end surface electrode 932 of the fifth capacitor element 930.
  • the second relay unit 320 relays between the second electrode terminal unit 310 and the second overlapping unit 330.
  • the second relay part 320 has a long plate shape on the left and right, and extends upward from the rear edge of the second electrode terminal part 310.
  • a large number of circular flow holes 321 are formed so as to be lined up, down, left, and right in order to flow the filled resin 30 in a molten state.
  • the second overlapping portion 330 has a long plate shape on the left and right, and extends rearward from the upper edge of the second relay portion 320.
  • Six circular second openings 331 are formed in the second overlapping portion 330 so as to be aligned in the left-right direction.
  • the arrangement interval (pitch) between the adjacent second openings 331 is made equal to the arrangement interval between the adjacent first openings 231.
  • the four second connection terminal portions 340 are formed so as to rise upward from the rear end edge of the second overlapping portion 330, and the front and back surfaces thereof face in the front-rear direction.
  • Two second connection terminal portions 340 are provided at positions on the left side of the second overlapping portion 330, and the other two second connection terminal portions 340 are respectively positioned at a central portion and a position on the right side of the second overlapping portion 330.
  • Each second connection terminal portion 340 is formed with a circular attachment hole 341 that penetrates the front and back surfaces.
  • the second connection terminal portion 340 is electrically connected to a corresponding external terminal (not shown) by screwing using the attachment hole 341.
  • the second connection terminal portion 340 at the left end and the second connection terminal portion 340 second from the left end are connected to the first connection terminal portion 240 at the left end of the first bus bar 200.
  • the second connection terminal portion 340 at the right end is arranged on the left side of the first connection terminal portion 240 at the right end in the first bus bar 200
  • the second connection terminal portion 340 at the center portion is arranged from the right end in the first bus bar 200.
  • the third connection terminal portion 630 of the third bus bar 600 and the fourth connection terminal portion 730 of the fourth bus bar 700 are arranged with a gap on the left side of the second first connection terminal portion 240.
  • the fifth bus bar 950 is formed of, for example, a copper plate and includes a fifth electrode terminal portion 951 and a fifth sub connection terminal portion 952.
  • the fifth electrode terminal portion 951 two electrode pins 953 corresponding to the third capacitor element 910 and electrode pins 954 corresponding to the sixth capacitor element 940 are formed.
  • the two electrode pins 953 are joined to the lower end face electrode 912 of the third capacitor element 910 by a joining method such as soldering, and the electrode pins 954 are joined to the lower end face electrode 942 of the sixth capacitor element 940 such as soldering. Bonded by the bonding method.
  • the fifth electrode terminal portion 951 of the fifth bus bar 950 is electrically connected to the lower end face electrode 912 of the third capacitor element 910 and the lower end face electrode 942 of the sixth capacitor element 940.
  • the fifth sub connection terminal portion 952 is arranged next to the first sub connection terminal portion 250 of the first bus bar 200.
  • the fifth sub-connecting terminal portion 952 is formed with a circular mounting hole 955 that penetrates the front and back surfaces.
  • the fifth sub-connecting terminal portion 952 is electrically connected to a corresponding external terminal (not shown) by screwing using the mounting hole 955.
  • Insulating paper 956 is wound around the lower portion of the fifth sub-connecting terminal portion 952 to ensure insulation between the fifth sub-connecting terminal portion 952 and the upper end face electrode 911 of the third capacitor element 910.
  • the sixth bus bar 960 is formed of, for example, a copper plate.
  • the sixth bus bar 960 includes electrode pins 961 corresponding to the fourth capacitor elements 920, electrode pins 962 corresponding to the fifth capacitor elements 930, and electrode pins 963 corresponding to the sixth capacitor elements 940.
  • the electrode pin 961 is joined to the lower end face electrode 922 of each fourth capacitor element 920 by a joining method such as soldering, and the electrode pin 962 is joined to the upper end face electrode 931 of the fifth capacitor element 930 by soldering or the like.
  • the electrode pin 963 is bonded to the upper end surface electrode 941 of the sixth capacitor element 940 by a bonding method such as soldering. Accordingly, the sixth bus bar 960 is electrically connected to the lower end face electrode 922 of each fourth capacitor element 920, the upper end face electrode 931 of the fifth capacitor element 930, and the upper end face electrode 941 of the sixth capacitor element 940. .
  • the sixth bus bar 960 further includes a sixth connection terminal portion 964.
  • the sixth connection terminal portion 964 is formed with a circular attachment hole 965 penetrating the front and back.
  • the sixth connection terminal portion 964 is disposed on the upper surface of the attachment tab 24 on the right side of the rear surface of the case 20. In this state, the attachment hole 965 of the sixth connection terminal portion 964 is aligned with the insertion hole 24 a of the attachment tab 24.
  • FIG. 5A is a perspective view of the first insulating plate 400 according to the present embodiment as viewed from the front upper side
  • FIG. 5B is a perspective view of the first insulating plate 400 according to the present embodiment. It is the perspective view seen from the back lower part.
  • the first insulating plate 400 is formed of an insulating resin material such as polyphenylene sulfide, acrylic, or silicon, and includes a main plate portion 410, a front plate portion 420, And a rear plate portion 430.
  • the main plate portion 410 has a horizontally long rectangular shape.
  • the front plate portion 420 extends downward from the front end edge of the main plate portion 410 and has a horizontally elongated rectangular shape.
  • the rear plate portion 430 extends upward from the rear end edge of the main plate portion 410 and has an elongated rectangular shape on the side.
  • the first insulating plate 400 is interposed between the first overlapping portion 230 of the first bus bar 200 and the second overlapping portion 330 of the second bus bar 300.
  • Three circular third openings 411 are formed in the main plate portion 410 so as to be arranged in the left-right direction.
  • the arrangement interval (pitch) between the adjacent third openings 411 is equal to the arrangement interval between the adjacent first openings 231 and the arrangement interval between the adjacent second openings 331.
  • an annular first annular protrusion 412 is formed around the third opening 411 on the surface of the main plate portion 410 (the surface facing the first overlapping portion 230).
  • the outer diameter of the first annular protrusion 412 is slightly smaller than the inner diameter of the first opening 231, and the height of the first annular protrusion 412 is slightly larger than the thickness of the first overlapping portion 230. .
  • annular second annular protrusion 413 is formed around the third opening 411 on the back surface (the surface facing the second overlapping portion 330) of the main plate portion 410.
  • the outer diameter of the second annular protrusion 413 is slightly smaller than the inner diameter of the second opening 331, and the height of the second annular protrusion 413 is slightly larger than the thickness of the second overlapping portion 330. .
  • the second capacitor element unit 10B includes an insulating sheet 970 in addition to the second capacitor element 500, the third bus bar 600, and the fourth bus bar 700.
  • the three second capacitor elements 500 are arranged in the longitudinal direction (left-right direction in FIG. 2) in the case 20 so that both end faces are directed in the vertical direction. Arranged.
  • the configuration of the second capacitor element 500 is the same as the configuration of the first capacitor element 100.
  • the upper end face electrode 501 is formed on the upper end face thereof, and the lower end face electrode 502 is formed on the lower end face thereof.
  • the second capacitor element 500 has a smaller capacitance and smaller size than the first capacitor element 100 and the third capacitor element 910, but is quieter than the fourth capacitor element 920, the fifth capacitor element 930, and the sixth capacitor element 940. Large capacity and large size.
  • FIG. 6A is a perspective view of the third bus bar 600 according to the present embodiment.
  • the third bus bar 600 is formed of a conductive material, for example, a copper plate, and includes a third electrode terminal portion 610, a third relay portion 620, And the third connection terminal portion 630.
  • the third bus bar 600 is formed by, for example, appropriately cutting and bending a single copper plate, and the third electrode terminal portion 610, the third relay portion 620, and the third connection terminal portion 630 are integrated. Yes.
  • the third electrode terminal portion 610 has a long plate shape on the left and right.
  • Six electrode pins 611 are formed on the front end edge of the third electrode terminal portion 610 so as to be arranged in the left-right direction.
  • the third electrode terminal portion 610 contacts the upper end face electrodes 501 of the three second capacitor elements 500.
  • Two electrode pins 611 are arranged on each upper end face electrode 501.
  • the electrode pin 611 is joined to the upper end surface electrode 501 of the corresponding second capacitor element 500 by a joining method such as soldering.
  • the third electrode terminal portion 610 of the third bus bar 600 is electrically connected to the upper end face electrodes 501 of the three second capacitor elements 500.
  • six circular flow holes 612 are formed in the third electrode terminal portion 610 so as to line up in the left-right direction in order to flow the filled resin 30 in a molten state.
  • the third relay unit 620 relays between the third electrode terminal unit 610 and the third connection terminal unit 630.
  • the third relay portion 620 has an elongated plate shape on the left and right, and extends upward from the rear end edge of the third electrode terminal portion 610.
  • 3rd connection terminal part 630 is formed in the upper end edge of the 3rd relay part 620, and the front and back turns to the front-back direction.
  • the third connection terminal portion 630 is formed with a circular attachment hole 631 penetrating the front and back.
  • the third connection terminal portion 630 is electrically connected to a corresponding external terminal (not shown) by screwing using the attachment hole 631.
  • a wide portion 630b having a width wider than that of the upper terminal portion 630a is formed below the third connection terminal portion 630.
  • FIG. 6B is a perspective view of the fourth bus bar 700 and the insulating sheet 970 according to the present embodiment.
  • the fourth bus bar 700 is formed of a conductive material, for example, a copper plate, and includes a fourth electrode terminal portion 710, a fourth relay portion 720, and the like. And a fourth connection terminal portion 730.
  • the fourth bus bar 700 is formed by appropriately cutting and bending a single copper plate, and the fourth electrode terminal portion 710, the fourth relay portion 720, and the fourth connection terminal portion 730 are integrated. Yes.
  • the fourth electrode terminal portion 710 has a long plate shape on the left and right. Two electrode pins 711 corresponding to the second capacitor element 500 at the left end are formed at the corner between the left end edge and the front end edge of the fourth electrode terminal portion 710. Further, two electrode pins 711 corresponding to the second capacitor element 500 at the right end are formed at the corner between the right end edge and the front end edge of the fourth electrode terminal portion 710. Further, two electrode pins 711 corresponding to the central second capacitor element 500 are formed at the central portion of the front edge of the fourth electrode terminal portion 710. The fourth electrode terminal portion 710 is in contact with the lower end surface electrodes 502 of the three second capacitor elements 500. Two electrode pins 711 are arranged on each lower end face electrode 502.
  • the electrode pin 711 is joined to the lower end face electrode 502 of the corresponding second capacitor element 500 by a joining method such as soldering.
  • a joining method such as soldering.
  • the fourth electrode terminal portion 710 of the fourth bus bar 700 is electrically connected to the lower end surface electrodes 502 of the three second capacitor elements 500.
  • the fourth relay unit 720 relays between the fourth electrode terminal unit 710 and the fourth connection terminal unit 730.
  • the fourth relay portion 720 has a substantially trapezoidal plate shape, and extends upward from the rear end edge of the fourth electrode terminal portion 710.
  • six circular flow holes 721 are formed so as to be aligned in the vertical and horizontal directions in order to distribute the filled resin 30 in a molten state.
  • the fourth connection terminal portion 730 is formed at the upper end edge of the fourth relay portion 720, and the front and back surfaces thereof are directed in the front-rear direction.
  • the fourth connection terminal portion 730 is formed with a circular attachment hole 731 penetrating the front and back.
  • the fourth connection terminal portion 730 is electrically connected to a corresponding external terminal (not shown) by screwing using the attachment hole 731.
  • a wide portion 730b having a width wider than that of the upper terminal portion 730a is formed below the fourth connection terminal portion 730.
  • the terminal portion 630a of the third connection terminal portion 630 and the terminal portion 730a of the fourth connection terminal portion 730 are arranged in the left-right direction. Moreover, the wide part 630b of the 3rd connection terminal part 630 and the wide part 730b of the 4th connection terminal part 730 overlap in the front-back direction. Reduction of ESL (equivalent series inductance) in the second capacitor element unit 10B is expected due to the overlapping of the wide portions 630b and 730b. Further, as shown in FIG. 1A, in a state where the film capacitor 1 is completed, a third capacitor terminal is formed between the second connection terminal part 340 at the second part from the second first connection terminal part 240 from the right end. The connection terminal part 630 and the fourth connection terminal part 730 are arranged.
  • the insulating sheet 970 is formed of an insulating resin material such as insulating paper, acrylic, or silicon.
  • the insulating sheet 970 has a substantially horizontally long rectangular shape, and its central portion is once bent backward and then bent downward so as to match the shape of the fourth bus bar 700. 6B, the insulating sheet 970 is attached to the fourth bus bar 700 so as to straddle the upper portion of the fourth relay portion 720 and the wide portion 730b of the fourth connection terminal portion 730. .
  • the insulating sheet 970 insulates between the wide portion 630 b of the third connection terminal portion 630 and the wide portion 730 b of the fourth connection terminal portion 730.
  • the second insulating plate 800 is formed of an insulating resin material such as polyphenylene sulfide, acrylic, silicon, etc., and includes a main plate portion 810, a front plate portion 820, and a left plate portion. 830, a right plate portion 840, and a rear plate portion 850.
  • the main plate portion 810 has a horizontally long rectangular shape.
  • the front plate portion 820, the left plate portion 830, and the right plate portion 840 extend downward from the front end edge, the left end edge, and the right end edge of the main plate portion 810, respectively, and have a horizontally elongated rectangular shape.
  • the rear plate portion 850 extends upward from the rear end edge of the main plate portion 810 and has a rectangular shape that is elongated horizontally.
  • the second insulating plate 800 is substantially in contact with the three capacitors in which the inner surfaces of the front plate portion 820, the left plate portion 830, and the right plate portion 840 are arranged in the left-right direction.
  • the insulating plate 800 is positioned.
  • four circular fourth openings 811 are formed so as to be aligned in the left-right direction.
  • the arrangement interval (pitch) between the adjacent fourth openings 811 is equal to the arrangement interval between the adjacent third openings 411 in the first insulating plate 400 and the arrangement interval between the adjacent electrode pins 611 in the third bus bar 600. Is done.
  • An annular fitting protrusion 812 is formed around the fourth opening 811 on the surface of the main plate portion 810 (the surface facing the second overlapping portion 330).
  • the outer diameter of the fitting protrusion 812 is slightly smaller than the inner diameter of the third opening 411.
  • the height of the fitting protrusion 812 is made larger than the total thickness of the second overlapping portion 330 and the thickness of the main plate portion 410 of the first insulating plate 400.
  • FIG. 7 is a perspective view of the case 20 as viewed from the upper rear side according to the present embodiment.
  • the case 20 is formed of a resin material such as polyphenylene sulfide.
  • the case 20 is a substantially rectangular parallelepiped that is long on the left and right, the case 20 is formed in a box shape with a rear center portion slightly protruding rearward, and the upper surface opens as an opening surface 20a.
  • a region projecting rearward in the case 20 is an arrangement region of the second capacitor element unit 10B.
  • a second spacer portion 22 and a third spacer portion 23 are provided.
  • mounting tabs 24 are formed on the outside of the case 20 at four locations on the front surface and three locations on the rear surface. Each mounting tab 24 is formed with an insertion hole 24a penetrating vertically. A metal collar 25 is fitted into the insertion hole 24a in order to increase the strength of the hole. When the film capacitor 1 is installed in the installation part of the external device, these mounting tabs 24 are fixed to the installation part with screws or the like.
  • FIG. 8 is a left side cross-sectional view of the film capacitor 1 cut along the line AA ′ in FIG. 1B according to the present embodiment.
  • the upper surface position of the filling resin 30 is indicated by a one-dot chain line.
  • the first overlapping portion 230 of the first bus bar 200 and the second overlapping portion 330 of the second bus bar 300 are in the vertical direction, that is, the normal direction of the opening surface 20 a of the case 20.
  • the first capacitor plate 100 is overlapped in the vertical direction via the first insulating plate 400 at a position away from the five first capacitor elements 100.
  • ESL equivalent series inductance
  • the first overlapping portion 230 and the second overlapping portion 330 are insulated by the first insulating plate 400.
  • the first annular protrusion 412 formed on the surface of the main plate portion 410 of the first insulating plate 400 fits into the first opening 231 formed in the first overlapping portion 230 of the first bus bar 200.
  • the second annular protrusion 413 formed on the back surface of the main plate portion 410 of the first insulating plate 400 is fitted into the second opening 331 formed in the second overlapping portion 330 of the second bus bar 300. Accordingly, the first bus bar 200 and the second bus bar 300 are positioned in the front-rear and left-right directions with respect to the first insulating plate 400, and are difficult to move in the front-rear and left-right directions.
  • annular protrusion part 412 and the 3rd opening part 411 which exist between the periphery of the 3rd opening part 411, and the periphery of the 1st opening part 231, and the periphery of the 2nd opening part 331.
  • the second annular protrusion 413 the creeping distance between the first overlapping part 230 and the second overlapping part 330 through the third opening 411 is set to the first annular protruding part 412 and the second annular protruding part 413. Therefore, the insulation between the first bus bar 200 and the second bus bar 300 can be improved.
  • the second capacitor is located at a position directly below the superimposed first overlapping portion 230 and second overlapping portion 330, that is, at a position overlapping the first overlapping portion 230 and the second overlapping portion 330 in the vertical direction.
  • Three second capacitor elements 500 of the element unit 10B are arranged.
  • a second insulating plate 800 is interposed between the second overlapping portion 330 and the third electrode terminal portion 610 of the third bus bar 600 that overlaps the second overlapping portion 330.
  • the second overlapping portion 330, the third electrode terminal portion 610, Is insulated.
  • the space formed between the first overlapping portion 230 and the second overlapping portion 330 and the bottom surface of the case 20 can be effectively used as the arrangement region of the second capacitor element 500.
  • the fitting protrusion 812 of the second insulating plate 800 is fitted into the third opening 411 of the first insulating plate 400.
  • the 2nd insulating board 800 is positioned with respect to the 1st insulating board 400 in the front-back, left-right direction, and becomes difficult to move to the front-back, left-right direction.
  • each electrode pin 611 of the third electrode terminal portion 610 is located in each fourth opening portion 811 of the main plate portion 810 of the second insulating plate 800, and includes a first opening portion 231, a second opening portion 331, It is exposed above the first bus bar 200 through the communication path P formed by the overlap of the third opening 411 and the fourth opening 811. Thereby, it is possible to join each electrode pin 611 and the corresponding upper end electrode 501 of the second capacitor element 500 by soldering or the like through the communication path P.
  • each electrode pin 611 in the second capacitor element unit 10B and the corresponding upper end face electrode 501 of the second capacitor element 500 can be joined to each electrode pin 211 of the first bus bar 200 and the corresponding upper end face electrode 101 of the first capacitor element 100 at a time.
  • the bonding agent S such as solder accumulated on each electrode pin 611 is accommodated in the communication path P, the bonding agent S accumulated between the second insulating plate 800 and the third electrode terminal portion 610. It is no longer necessary to provide a gap corresponding to.
  • the molten filling resin 30 is injected into the case 20, the injected filling resin 30 passes through the communication path P and reaches the portion of the second capacitor element 500 under the second insulating plate 800. It becomes easy.
  • the front plate portion 420 of the first insulating plate 400 is interposed between the second relay portion 320 of the second bus bar 300 and the peripheral surface of the first capacitor element 100. Thereby, the creeping distance between the second relay part 320 of the second bus bar 300 and the upper end face electrode 101 of the first capacitor element 100 can be increased. Further, the front plate part 820 of the second insulating plate 800 is interposed between the second relay part 320 of the second bus bar 300 and the peripheral surface of the second capacitor element 500. Thereby, the creeping distance between the second relay part 320 of the second bus bar 300 and the upper end face electrode 501 of the second capacitor element 500 can be increased.
  • the lower part of the insulating sheet 970 is interposed between the fourth relay portion 720 of the fourth bus bar 700 and the peripheral surface of the second capacitor element 500. Thereby, the creeping distance between the fourth relay part 720 of the fourth bus bar 700 and the upper end face electrode 501 of the second capacitor element 500 can be increased.
  • the ESL in the first capacitor element unit 10A can be reduced.
  • the space formed between the first overlapping portion 230 and the second overlapping portion 330 and the bottom surface of the case 20 can be effectively used as the arrangement region of the second capacitor element 500, the first capacitor element unit 10A and When the second capacitor element unit 10B is accommodated in one case 20, the size of the case 20 can be made compact. Thereby, the size of the film capacitor 1 can be made compact.
  • each electrode pin 611 of the third bus bar 600 is positioned in each fourth opening 811 of the second insulating plate 800, and the first opening 231, the second opening 331, the third opening 411, and the fourth opening 811. Since the first bus bar 200 is exposed through the communication path P formed by the overlapping of the openings 811, the electrode pins 611 and the upper end surface electrodes 501 of the second capacitor elements 500 can be joined through the communication path P. . As a result, each electrode pin 611 in the second capacitor element unit 10B and the upper end surface electrode 501 of each second capacitor element 500 are joined to each electrode pin 211 of the first bus bar 200 in the first capacitor element unit 10A. It can be performed once, together with bonding to the upper end face electrode 101 of each first capacitor element 100.
  • the bonding agent S such as solder accumulated on each electrode pin 611 of the third bus bar 600 is accommodated in the communication path P, it is accumulated between the second insulating plate 800 and the third electrode terminal portion 610. It is not necessary to provide a gap for the bonding agent S. Thereby, since the height from the bottom surface of the case 20 of the second overlapping portion 330 of the second bus bar 300 and the first overlapping portion 230 of the first bus bar 200 overlapping the third electrode terminal portion 610 is suppressed, Can be prevented from becoming high.
  • the second insulating plate 800 is provided with a fitting projection 812 that is fitted into the third opening 411 of the first insulating plate 400, the second insulating plate 800 is attached to the first insulating plate 400. Positioning can be performed in the front-rear and left-right directions, and the second insulating plate 800 is less likely to move in the front-rear and left-right directions.
  • first overlapping portion 230 and the second overlapping portion 330 through the third opening 411 are formed by the first annular protrusion 412 existing between the periphery of the third opening 411 and the periphery of the first opening 231.
  • the creepage distance between the first bus bar 200 and the second bus bar 300 can be increased.
  • the first overlapping portion 230 and the second overlapping portion through the third opening 411 are also caused by the second annular protrusion 413 existing between the periphery of the third opening 411 and the periphery of the second opening 331. Since the creepage distance between the first bus bar 200 and the second bus bar 300 can be increased, the creeping distance between the first bus bar 200 and the second bus bar 300 can be increased.
  • the first annular protrusion 412 is formed around the third opening 411 on the front surface, and the third opening 411 on the back surface is formed.
  • a second annular protrusion 413 was formed around the periphery.
  • FIG. 9B a configuration in which the first annular protrusion 412 is not provided may be employed, or a configuration in which the first annular protrusion 412 is not provided as illustrated in FIG. 9B may be employed. . Further, as shown in FIG.
  • the inner diameter of the second opening 331 of the second bus bar 300 is slightly larger than the outer diameter of the fitting protrusion 812 of the second insulating plate 800.
  • the two bus bars 300 are positioned with respect to the second insulating plate 800.
  • the first bus bar 200 is configured such that the inner diameter of the first opening 231 of the first bus bar 200 is slightly larger than the outer diameter of the fitting protrusion 812. Positioned with respect to the second insulating plate 800. Furthermore, in the case of the configuration of FIG.
  • the inner diameter of the first opening 231 and the inner diameter of the second opening 331 are slightly larger than the outer diameter of the fitting protrusion 812, thereby
  • the bus bar 200 and the second bus bar 300 are positioned with respect to the second insulating plate 800.
  • the first capacitor element unit 10A includes the third capacitor element 910, the fourth capacitor element 920, the fifth capacitor element 930, and the sixth capacitor element 940.
  • the capacitor element unit 10A may not include at least one of the capacitor elements 910, 920, 930, and 940.
  • the first capacitor element unit 10A may not include the fifth bus bar 950 and the sixth bus bar 960, and the first bus bar 200 includes the first sub electrode terminal portion 220 and the first sub connection terminal portion 250. It may not be provided.
  • first capacitor elements 100 are included in the first capacitor element unit 10A, and three second capacitor elements 500 are included in the second capacitor element unit 10B.
  • the number of the first capacitor elements 100 and the second capacitor elements 500 can be appropriately changed including the case where the number is one.
  • the numbers of the third capacitor element 910, the fourth capacitor element 920, the fifth capacitor element 930, and the sixth capacitor element 940 may be changed as appropriate.
  • the first capacitor element 100, the second capacitor element 500, the third capacitor element 910, the fourth capacitor element 920, the fifth capacitor element 930, and the sixth capacitor element 940 have both end faces. It was arranged in the case 20 so as to face the vertical direction, that is, the normal direction of the opening 20a of the case 20. However, the capacitor elements 100, 500, 910, 920, 930, and 940 may be disposed in the case 20 so that their both end faces face in the front-rear direction, that is, the direction orthogonal to the normal direction.
  • the first capacitor element 100, the second capacitor element 500, the third capacitor element 910, the fourth capacitor element 920, the fifth capacitor element 930, and the sixth capacitor element 940 are formed on the dielectric film. It is formed by stacking two metallized films deposited with aluminum and winding or laminating the stacked metallized films. In addition to this, aluminum is deposited on both sides of the dielectric film.
  • the capacitor elements 100, 500, 910, 920, 930, and 940 may be formed by overlapping a metallized film and an insulating film and winding or laminating them.
  • six electrode pins 611 and six electrode pins 611 are formed in the third electrode terminal portion 610 of the third bus bar 600, and the first bus bar 200, the second bus bar 300, and the first insulating plate 400 are accordingly formed.
  • six first openings 231, second openings 331, third openings 411, and fourth openings 811 are formed in the second insulating plate 800, respectively.
  • the number of electrode pins 611 can be appropriately changed according to the number of second capacitor elements 500 and the like, and accordingly, the first opening 231, the second opening 331, and the third opening The number of 411 and the fourth opening 811 is also changed.
  • the film capacitor 1 was mentioned as an example of the capacitor
  • the present invention can also be applied to capacitors other than the film capacitor 1.
  • the terms indicating directions such as “upward” and “downward” indicate relative directions that depend only on the relative positional relationship of the constituent members, and include vertical and horizontal directions. It does not indicate the absolute direction.
  • the present invention is useful for capacitors used in various electronic equipment, electrical equipment, industrial equipment, vehicle electrical equipment, and the like.
  • First capacitor element (first capacitor element) 101 Upper end face electrode (first electrode) 102 Lower end face electrode (second electrode) 200 First bus bar (first bus bar) 230 1st polymerization part (1st polymerization part) 231 1st opening part (1st opening part) 300 Second bus bar (second bus bar) 330 2nd polymerization part (2nd polymerization part) 331 second opening (second opening) 400 1st insulation board (1st insulation part) 411 Third opening (third opening) 412 First annular protrusion (first annular protrusion) 413 Second annular projection (second annular projection) 500 Second capacitor element (second capacitor element) 501 Upper end face electrode (third electrode) 502 Lower end face electrode (fourth electrode) 600 3rd bus bar (3rd bus bar) 610 Third electrode terminal portion (third overlapping portion) 611 Electrode pin (joint) 700 4th bus bar

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

L'invention concerne un condensateur à film dans lequel une première barre omnibus et une seconde barre omnibus comprennent respectivement une première partie de chevauchement et une seconde partie de chevauchement qui, à une position espacée d'un premier élément de condensateur dans une direction normale par rapport à une surface d'ouverture dans laquelle un boîtier a une ouverture, se chevauchent mutuellement dans la direction normale. Une première plaque isolante est interposée entre la première partie de chevauchement et la seconde partie de chevauchement. Un second élément de condensateur est disposé dans le boîtier de façon à chevaucher la première partie de chevauchement et la seconde partie de chevauchement dans la direction normale. Une troisième barre omnibus comprend une troisième partie de borne d'électrode chevauchant la seconde partie de chevauchement dans la direction normale. Une seconde plaque isolante est interposée entre la seconde partie de chevauchement et la troisième partie de borne d'électrode.
PCT/JP2018/007683 2017-04-26 2018-03-01 Condensateur WO2018198527A1 (fr)

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020113688A (ja) * 2019-01-16 2020-07-27 ニチコン株式会社 ケースモールド型コンデンサ
JP2020167215A (ja) * 2019-03-28 2020-10-08 株式会社デンソー コンデンサユニット
WO2021085107A1 (fr) * 2019-10-29 2021-05-06 パナソニックIpマネジメント株式会社 Condensateur
CN113366593A (zh) * 2019-02-05 2021-09-07 松下知识产权经营株式会社 电容器
WO2022059530A1 (fr) * 2020-09-18 2022-03-24 パナソニックIpマネジメント株式会社 Condensateur
US20220230808A1 (en) * 2019-10-02 2022-07-21 Denso Corporation Capacitor
CN115485797A (zh) * 2020-04-28 2022-12-16 株式会社村田制作所 电容器模块

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JP2009188313A (ja) * 2008-02-08 2009-08-20 Panasonic Corp ケースモールド型コンデンサ
JP2014161159A (ja) * 2013-02-20 2014-09-04 Hitachi Ltd 電力変換装置
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Publication number Priority date Publication date Assignee Title
JP2020113688A (ja) * 2019-01-16 2020-07-27 ニチコン株式会社 ケースモールド型コンデンサ
JP7198674B2 (ja) 2019-01-16 2023-01-04 ニチコン株式会社 ケースモールド型コンデンサ
CN113366593A (zh) * 2019-02-05 2021-09-07 松下知识产权经营株式会社 电容器
JP2020167215A (ja) * 2019-03-28 2020-10-08 株式会社デンソー コンデンサユニット
US20220230808A1 (en) * 2019-10-02 2022-07-21 Denso Corporation Capacitor
US12062496B2 (en) * 2019-10-02 2024-08-13 Denso Corporation Capacitor
CN114467158A (zh) * 2019-10-29 2022-05-10 松下知识产权经营株式会社 电容器
WO2021085107A1 (fr) * 2019-10-29 2021-05-06 パナソニックIpマネジメント株式会社 Condensateur
JP7570036B2 (ja) 2019-10-29 2024-10-21 パナソニックIpマネジメント株式会社 コンデンサ
CN115485797A (zh) * 2020-04-28 2022-12-16 株式会社村田制作所 电容器模块
EP4120298A4 (fr) * 2020-04-28 2024-05-22 Murata Manufacturing Co., Ltd. Module de condensateur
WO2022059530A1 (fr) * 2020-09-18 2022-03-24 パナソニックIpマネジメント株式会社 Condensateur
JP7634209B2 (ja) 2020-09-18 2025-02-21 パナソニックIpマネジメント株式会社 コンデンサ

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