WO2018198527A1 - Capacitor - Google Patents
Capacitor Download PDFInfo
- Publication number
- WO2018198527A1 WO2018198527A1 PCT/JP2018/007683 JP2018007683W WO2018198527A1 WO 2018198527 A1 WO2018198527 A1 WO 2018198527A1 JP 2018007683 W JP2018007683 W JP 2018007683W WO 2018198527 A1 WO2018198527 A1 WO 2018198527A1
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- WO
- WIPO (PCT)
- Prior art keywords
- capacitor element
- electrode
- bus bar
- capacitor
- opening
- Prior art date
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 262
- 239000011347 resin Substances 0.000 claims description 22
- 229920005989 resin Polymers 0.000 claims description 22
- 239000010408 film Substances 0.000 description 25
- 238000005476 soldering Methods 0.000 description 12
- 239000011104 metalized film Substances 0.000 description 11
- 238000000034 method Methods 0.000 description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
- 229910052802 copper Inorganic materials 0.000 description 10
- 239000010949 copper Substances 0.000 description 10
- 238000006116 polymerization reaction Methods 0.000 description 8
- 238000004891 communication Methods 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 230000000149 penetrating effect Effects 0.000 description 6
- 238000009413 insulation Methods 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 238000005452 bending Methods 0.000 description 4
- 239000007767 bonding agent Substances 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000004734 Polyphenylene sulfide Substances 0.000 description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 229920000069 polyphenylene sulfide Polymers 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 238000004804 winding Methods 0.000 description 3
- 229910052725 zinc Inorganic materials 0.000 description 3
- 239000011701 zinc Substances 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/10—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/32—Wound capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors
Definitions
- the present invention relates to a capacitor.
- Patent Document 1 discloses a metallized film capacitor that is filled with.
- case mold type capacitor As in Patent Document 1, a configuration in which a plurality of capacitor element units including a capacitor element and a pair of bus bars are accommodated in one case and molded with a filling resin can be employed.
- Each capacitor element unit is incorporated in different electronic circuit units in a device (device) on which a capacitor is mounted. With such a configuration, when a plurality of capacitor element units are used in one device, it is not necessary to provide a case for each capacitor element unit.
- an object of the present invention is to provide a capacitor that can be made compact and reduce ESL when a plurality of capacitor element units are accommodated in one case.
- the capacitor according to the main aspect of the present invention includes a first capacitor element having a first electrode and a second electrode, a first bus bar connected to the first electrode, and a connection to the second electrode.
- each of the first bus bar and the second bus bar overlaps each other in the normal direction at a position deviated from the first capacitor element in the normal direction of the opening surface where the case opens.
- the first superposition part and 2nd superposition part are included, and the 1st insulating part intervenes between the 1st superposition part and the 2nd superposition part.
- the second capacitor element is disposed in the case so as to overlap the first overlapping portion and the second overlapping portion in the normal direction.
- the third bus bar includes a third overlapping portion that overlaps the second overlapping portion in the normal direction, and a second insulation is provided between the second overlapping portion and the third overlapping portion. The part intervenes.
- the present invention when a plurality of capacitor element units are accommodated in one case, it is possible to provide a capacitor that can be made compact and reduce ESL.
- FIG. 1A is a perspective view of a film capacitor according to the embodiment as viewed from the front upper side
- FIG. 1B is a perspective view of the film capacitor with the filled resin removed according to the embodiment. It is the perspective view seen from the front upper direction.
- FIG. 2 is an exploded perspective view of the film capacitor according to the embodiment.
- FIG. 3A is a perspective view of the first capacitor element unit according to the embodiment as viewed from the rear lower side
- FIG. 3B is a rear lower side of the second capacitor element unit according to the embodiment. It is the perspective view seen from.
- FIG. 4A is a perspective view of the first bus bar according to the embodiment
- FIG. 4B is a perspective view of the second bus bar according to the embodiment.
- FIG.5 (a) is the perspective view which looked at the 1st insulating board based on embodiment from the front upper direction
- FIG.5 (b) looked at the 1st insulating board based on embodiment from the back lower back.
- FIG. FIG. 6A is a perspective view of the third bus bar according to the embodiment
- FIG. 6B is a perspective view of the fourth bus bar and the insulating sheet according to the embodiment.
- FIG. 7 is a perspective view of the case according to the embodiment as viewed from the rear and upper side.
- FIG. 8 is a left side sectional view of the film capacitor taken along the line AA ′ in FIG. 1B according to the embodiment.
- 9A to 9C are cross-sectional views of main parts of a film capacitor according to a modification.
- a film capacitor 1 which is an embodiment of the capacitor of the present invention will be described with reference to the drawings.
- front and rear, left and right, and up and down directions are appropriately appended to each drawing.
- the direction of illustration shows the relative direction of the film capacitor 1 to the last, and does not show an absolute direction.
- the film capacitor 1 corresponds to a “capacitor” described in the claims.
- the first capacitor element unit 10 ⁇ / b> A corresponds to a “first capacitor element unit” recited in the claims.
- the second capacitor element unit 10B corresponds to a “second capacitor element unit” recited in the claims.
- the first capacitor element 100 corresponds to a “first capacitor element” recited in the claims.
- the upper end face electrode 101 and the lower end face electrode 102 correspond to “first electrode” and “second electrode” recited in the claims, respectively.
- the first bus bar 200 and the second bus bar 300 correspond to the “first bus bar” and the “second bus bar” recited in the claims, respectively.
- correspond to the "1st superposition
- the first opening 231 and the second opening 331 respectively correspond to the “first opening” and the “second opening” recited in the claims.
- the first insulating plate 400 corresponds to a “first insulating portion” recited in the claims.
- the third opening 411 corresponds to a “third opening” recited in the claims.
- first annular protrusion 412 and the second annular protrusion 413 correspond to a “first annular protrusion” and a “second annular protrusion” recited in the claims, respectively.
- the second capacitor element 500 corresponds to a “second capacitor element” recited in the claims.
- the upper end face electrode 501 and the lower end face electrode 502 correspond to “third electrode” and “fourth electrode” recited in the claims, respectively.
- the third bus bar 600 and the fourth bus bar 700 correspond to the “third bus bar” and the “fourth bus bar” recited in the claims, respectively.
- the third electrode terminal portion 610 corresponds to a “third overlapping portion” recited in the claims.
- the electrode pin 611 corresponds to a “joint portion” described in the claims.
- the second insulating plate 800 corresponds to a “second insulating portion” recited in the claims.
- the fourth opening 811 corresponds to a “fourth opening” recited in the claims.
- the fitting protrusion 812 corresponds to a “protrusion” described in the claims.
- FIG. 1A is a perspective view of the film capacitor 1 according to the present embodiment as viewed from the front upper side
- FIG. 1B is a state in which the filling resin 30 according to the present embodiment is removed. It is the perspective view which looked at the film capacitor 1 of this from the front upper direction.
- the film capacitor 1 includes a capacitor assembly 10, a case 20 in which the capacitor assembly 10 is accommodated, and thermal curing that is filled in the case 20 and cured in the case 20.
- Filling resin 30 In the state where the inside of the case 20 is molded with the filling resin 30, the four first connection terminal portions 240 and the first sub-connection terminal portions 250 of the first bus bar 200 and the four second connection terminal portions 340 of the second bus bar 300.
- the third connection terminal portion 630 of the third bus bar 600, the fourth connection terminal portion 730 of the fourth bus bar 700, and the fifth sub connection terminal portion 952 of the fifth bus bar 950 are exposed from the filling resin 30.
- Most of the capacitor assembly 10 embedded in the filling resin 30 is protected from moisture and impact.
- FIG. 2 is an exploded perspective view of the film capacitor 1 according to the present embodiment.
- FIG. 3A is a perspective view of the first capacitor element unit 10A according to the present embodiment as viewed from the lower rear side
- FIG. 3B is a second capacitor element unit according to the present embodiment. It is the perspective view which looked at 10B from back lower direction.
- the capacitor assembly 10 includes a first capacitor element unit 10A and a second capacitor element unit 10B.
- the first capacitor element unit 10A includes five first capacitor elements 100, a first bus bar 200, a second bus bar 300, and a first insulating plate 400.
- the first capacitor element unit 10A includes three pieces. Second capacitor element 500, third bus bar 600, and fourth bus bar 700 are included.
- the first capacitor element unit 10 ⁇ / b> A and the second capacitor element unit 10 ⁇ / b> B can be respectively incorporated in different electronic circuit units included in an external device (not shown) on which the film capacitor 1 is mounted.
- the capacitor assembly 10 further includes a second insulating plate 800.
- the first capacitor element unit 10A includes a third capacitor element 910, two fourth capacitor elements 920, 5 capacitor element 930, sixth capacitor element 940, fifth bus bar 950, and sixth bus bar 960 are included.
- the five first capacitor elements 100 are arranged in the short direction (the left-right direction in FIG. 2) in the case 20 so that both end surfaces face the up-down direction. Arranged.
- Each first capacitor element 100 is formed by stacking two metallized films on which aluminum is vapor-deposited on a dielectric film, winding or stacking the stacked metallized films, and pressing them flatly.
- an upper end face electrode 101 is formed on the upper end face by spraying a metal such as zinc
- a lower end face electrode 102 is similarly formed on the lower end face by spraying a metal such as zinc. Is formed.
- the first capacitor element 100 of the present embodiment is formed of a metallized film in which aluminum is vapor-deposited on a dielectric film, but other metals such as zinc and magnesium are vapor-deposited in addition to this. It may be formed of a metallized film. Or the 1st capacitor
- the third capacitor element 910 is disposed on the right side of the first capacitor element 100 at the right end in the case 20 so that both end faces are directed in the vertical direction
- the fourth capacitor element 920, the fifth capacitor element 930, and the The six-capacitor element 940 is disposed between the first capacitor element 100 and the third capacitor element 910 in the case 20 so that both end faces are directed in the vertical direction.
- the configurations of the third capacitor element 910, the fourth capacitor element 920, the fifth capacitor element 930, and the sixth capacitor element 940 are the same as the configuration of the first capacitor element 100, and the upper end electrode 911 is disposed on the upper end surface thereof. , 921, 931, 941 are formed, and lower end face electrodes 912, 922, 932, 942 are formed on the lower end face thereof.
- the third capacitor element 910 has the same capacitance and the same size as the first capacitor element 100, but the fourth capacitor element 920, the fifth capacitor element 930, and the sixth capacitor element 940 are more static than the first capacitor element 100. Small capacity and small size.
- FIG. 4A is a perspective view of the first bus bar 200 according to the present embodiment.
- the first bus bar 200 is formed of a conductive material, for example, a copper plate, and includes a first electrode terminal portion 210 and a first sub electrode terminal portion. 220, a first overlapping portion 230, four first connection terminal portions 240, and a first sub connection terminal portion 250.
- the first bus bar 200 is formed by, for example, appropriately cutting and bending a single copper plate, and the first electrode terminal portion 210, the first sub electrode terminal portion 220, the first overlapping portion 230, and the first connection.
- the terminal part 240 and the first sub-connecting terminal part 250 are integrated.
- the first electrode terminal portion 210 has a plate shape that is elongated to the left and right. Ten electrode pins 211 are formed on the front edge of the first electrode terminal portion 210 so as to be arranged in the left-right direction. The first electrode terminal portion 210 is in contact with the upper end face electrodes 101 of the five first capacitor elements 100. Two electrode pins 211 are arranged on each upper end face electrode 101. The electrode pins 211 are joined to the corresponding upper end face electrodes 101 of the first capacitor elements 100 by a joining method such as soldering. Thereby, the first electrode terminal portion 210 of the first bus bar 200 is electrically connected to the upper end surface electrodes 101 of the five first capacitor elements 100.
- the first sub electrode terminal portion 220 is formed so as to extend obliquely forward to the right from the right end portion of the first electrode terminal portion 210.
- Two electrode pins 221 are formed in the first sub electrode terminal portion 220 at positions corresponding to the upper end face electrodes 911 of the third capacitor element 910, and correspond to the upper end face electrodes 921 of the two fourth capacitor elements 920.
- One electrode pin 222 is formed at each position.
- Two electrode pins 221 are joined to the upper end face electrode 911 of the third capacitor element 910 by a joining method such as soldering, and each electrode pin 222 is soldered to the upper end face electrode 921 of each fourth capacitor element 920. Bonded by the bonding method.
- the first sub-electrode terminal portion 220 of the first bus bar 200 is electrically connected to the upper end face electrode 911 of the third capacitor element 910 and the upper end face electrodes 921 of the two fourth capacitor elements 920.
- the first overlapping part 230 has a plate shape that is long on the left and right, and is provided to be higher by one step behind the first electrode terminal part 210.
- six circular first openings 231 are formed at predetermined intervals so as to be aligned in the left-right direction.
- the four first connection terminal portions 240 are formed so as to rise upward from the rear end edge of the first overlapping portion 230, and the front and back surfaces thereof face in the front-rear direction. Two first connection terminal portions 240 are provided on the left side of the first overlapping portion 230, and the other two first connection terminal portions 240 are provided on the right side of the first overlapping portion 230. Each first connection terminal portion 240 is formed with a circular attachment hole 241 penetrating the front and back. The first connection terminal portion 240 is electrically connected to a corresponding external terminal (not shown) by screwing using the attachment hole 241.
- the first sub-connecting terminal portion 250 is formed so as to rise upward from the right end portion of the first sub-electrode terminal portion 220, and the front and back surfaces thereof face in the left-right direction.
- the first sub-connecting terminal portion 250 is formed with a circular mounting hole 251 penetrating the front and back.
- the first sub-connecting terminal portion 250 is electrically connected to a corresponding external terminal (not shown) by screwing using the mounting hole 251.
- FIG. 4B is a perspective view of the second bus bar 300 according to the present embodiment.
- the second bus bar 300 is formed of a conductive material, for example, a copper plate, and includes a second electrode terminal portion 310, a second relay portion 320, and the like.
- the second overlapping portion 330 and the four second connection terminal portions 340 are included.
- the second bus bar 300 is formed, for example, by appropriately cutting and bending a single copper plate, and the second electrode terminal portion 310, the second relay portion 320, the second overlapping portion 330, and the second connection terminal portion. 340 is integrated.
- the second electrode terminal portion 310 has a plate shape that is elongated to the left and right. Two electrode pins 311 corresponding to the first capacitor element 100 at the left end are formed at the corner between the left end edge and the front end edge of the second electrode terminal portion 310. Further, eight electrode pins 311 corresponding to the four first capacitor elements 100 other than the left end are formed on the front end edge of the second electrode terminal portion 310 so as to be arranged in the left-right direction. The second electrode terminal portion 310 is in contact with the lower end surface electrodes 102 of the five first capacitor elements 100. Two electrode pins 311 are arranged on each lower end face electrode 102.
- the electrode pin 311 is joined to the lower end face electrode 102 of the corresponding first capacitor element 100 by a joining method such as soldering. Thereby, the second electrode terminal portion 310 of the second bus bar 300 is electrically connected to the lower end surface electrodes 102 of the five first capacitor elements 100. Furthermore, an electrode pin 312 corresponding to the fifth capacitor element 930 is formed on the right end edge of the second electrode terminal portion 310. The electrode pin 312 is joined to the lower end face electrode 932 of the fifth capacitor element 930 by a joining method such as soldering. As a result, the second electrode terminal portion 310 of the second bus bar 300 is electrically connected to the lower end surface electrode 932 of the fifth capacitor element 930.
- the second relay unit 320 relays between the second electrode terminal unit 310 and the second overlapping unit 330.
- the second relay part 320 has a long plate shape on the left and right, and extends upward from the rear edge of the second electrode terminal part 310.
- a large number of circular flow holes 321 are formed so as to be lined up, down, left, and right in order to flow the filled resin 30 in a molten state.
- the second overlapping portion 330 has a long plate shape on the left and right, and extends rearward from the upper edge of the second relay portion 320.
- Six circular second openings 331 are formed in the second overlapping portion 330 so as to be aligned in the left-right direction.
- the arrangement interval (pitch) between the adjacent second openings 331 is made equal to the arrangement interval between the adjacent first openings 231.
- the four second connection terminal portions 340 are formed so as to rise upward from the rear end edge of the second overlapping portion 330, and the front and back surfaces thereof face in the front-rear direction.
- Two second connection terminal portions 340 are provided at positions on the left side of the second overlapping portion 330, and the other two second connection terminal portions 340 are respectively positioned at a central portion and a position on the right side of the second overlapping portion 330.
- Each second connection terminal portion 340 is formed with a circular attachment hole 341 that penetrates the front and back surfaces.
- the second connection terminal portion 340 is electrically connected to a corresponding external terminal (not shown) by screwing using the attachment hole 341.
- the second connection terminal portion 340 at the left end and the second connection terminal portion 340 second from the left end are connected to the first connection terminal portion 240 at the left end of the first bus bar 200.
- the second connection terminal portion 340 at the right end is arranged on the left side of the first connection terminal portion 240 at the right end in the first bus bar 200
- the second connection terminal portion 340 at the center portion is arranged from the right end in the first bus bar 200.
- the third connection terminal portion 630 of the third bus bar 600 and the fourth connection terminal portion 730 of the fourth bus bar 700 are arranged with a gap on the left side of the second first connection terminal portion 240.
- the fifth bus bar 950 is formed of, for example, a copper plate and includes a fifth electrode terminal portion 951 and a fifth sub connection terminal portion 952.
- the fifth electrode terminal portion 951 two electrode pins 953 corresponding to the third capacitor element 910 and electrode pins 954 corresponding to the sixth capacitor element 940 are formed.
- the two electrode pins 953 are joined to the lower end face electrode 912 of the third capacitor element 910 by a joining method such as soldering, and the electrode pins 954 are joined to the lower end face electrode 942 of the sixth capacitor element 940 such as soldering. Bonded by the bonding method.
- the fifth electrode terminal portion 951 of the fifth bus bar 950 is electrically connected to the lower end face electrode 912 of the third capacitor element 910 and the lower end face electrode 942 of the sixth capacitor element 940.
- the fifth sub connection terminal portion 952 is arranged next to the first sub connection terminal portion 250 of the first bus bar 200.
- the fifth sub-connecting terminal portion 952 is formed with a circular mounting hole 955 that penetrates the front and back surfaces.
- the fifth sub-connecting terminal portion 952 is electrically connected to a corresponding external terminal (not shown) by screwing using the mounting hole 955.
- Insulating paper 956 is wound around the lower portion of the fifth sub-connecting terminal portion 952 to ensure insulation between the fifth sub-connecting terminal portion 952 and the upper end face electrode 911 of the third capacitor element 910.
- the sixth bus bar 960 is formed of, for example, a copper plate.
- the sixth bus bar 960 includes electrode pins 961 corresponding to the fourth capacitor elements 920, electrode pins 962 corresponding to the fifth capacitor elements 930, and electrode pins 963 corresponding to the sixth capacitor elements 940.
- the electrode pin 961 is joined to the lower end face electrode 922 of each fourth capacitor element 920 by a joining method such as soldering, and the electrode pin 962 is joined to the upper end face electrode 931 of the fifth capacitor element 930 by soldering or the like.
- the electrode pin 963 is bonded to the upper end surface electrode 941 of the sixth capacitor element 940 by a bonding method such as soldering. Accordingly, the sixth bus bar 960 is electrically connected to the lower end face electrode 922 of each fourth capacitor element 920, the upper end face electrode 931 of the fifth capacitor element 930, and the upper end face electrode 941 of the sixth capacitor element 940. .
- the sixth bus bar 960 further includes a sixth connection terminal portion 964.
- the sixth connection terminal portion 964 is formed with a circular attachment hole 965 penetrating the front and back.
- the sixth connection terminal portion 964 is disposed on the upper surface of the attachment tab 24 on the right side of the rear surface of the case 20. In this state, the attachment hole 965 of the sixth connection terminal portion 964 is aligned with the insertion hole 24 a of the attachment tab 24.
- FIG. 5A is a perspective view of the first insulating plate 400 according to the present embodiment as viewed from the front upper side
- FIG. 5B is a perspective view of the first insulating plate 400 according to the present embodiment. It is the perspective view seen from the back lower part.
- the first insulating plate 400 is formed of an insulating resin material such as polyphenylene sulfide, acrylic, or silicon, and includes a main plate portion 410, a front plate portion 420, And a rear plate portion 430.
- the main plate portion 410 has a horizontally long rectangular shape.
- the front plate portion 420 extends downward from the front end edge of the main plate portion 410 and has a horizontally elongated rectangular shape.
- the rear plate portion 430 extends upward from the rear end edge of the main plate portion 410 and has an elongated rectangular shape on the side.
- the first insulating plate 400 is interposed between the first overlapping portion 230 of the first bus bar 200 and the second overlapping portion 330 of the second bus bar 300.
- Three circular third openings 411 are formed in the main plate portion 410 so as to be arranged in the left-right direction.
- the arrangement interval (pitch) between the adjacent third openings 411 is equal to the arrangement interval between the adjacent first openings 231 and the arrangement interval between the adjacent second openings 331.
- an annular first annular protrusion 412 is formed around the third opening 411 on the surface of the main plate portion 410 (the surface facing the first overlapping portion 230).
- the outer diameter of the first annular protrusion 412 is slightly smaller than the inner diameter of the first opening 231, and the height of the first annular protrusion 412 is slightly larger than the thickness of the first overlapping portion 230. .
- annular second annular protrusion 413 is formed around the third opening 411 on the back surface (the surface facing the second overlapping portion 330) of the main plate portion 410.
- the outer diameter of the second annular protrusion 413 is slightly smaller than the inner diameter of the second opening 331, and the height of the second annular protrusion 413 is slightly larger than the thickness of the second overlapping portion 330. .
- the second capacitor element unit 10B includes an insulating sheet 970 in addition to the second capacitor element 500, the third bus bar 600, and the fourth bus bar 700.
- the three second capacitor elements 500 are arranged in the longitudinal direction (left-right direction in FIG. 2) in the case 20 so that both end faces are directed in the vertical direction. Arranged.
- the configuration of the second capacitor element 500 is the same as the configuration of the first capacitor element 100.
- the upper end face electrode 501 is formed on the upper end face thereof, and the lower end face electrode 502 is formed on the lower end face thereof.
- the second capacitor element 500 has a smaller capacitance and smaller size than the first capacitor element 100 and the third capacitor element 910, but is quieter than the fourth capacitor element 920, the fifth capacitor element 930, and the sixth capacitor element 940. Large capacity and large size.
- FIG. 6A is a perspective view of the third bus bar 600 according to the present embodiment.
- the third bus bar 600 is formed of a conductive material, for example, a copper plate, and includes a third electrode terminal portion 610, a third relay portion 620, And the third connection terminal portion 630.
- the third bus bar 600 is formed by, for example, appropriately cutting and bending a single copper plate, and the third electrode terminal portion 610, the third relay portion 620, and the third connection terminal portion 630 are integrated. Yes.
- the third electrode terminal portion 610 has a long plate shape on the left and right.
- Six electrode pins 611 are formed on the front end edge of the third electrode terminal portion 610 so as to be arranged in the left-right direction.
- the third electrode terminal portion 610 contacts the upper end face electrodes 501 of the three second capacitor elements 500.
- Two electrode pins 611 are arranged on each upper end face electrode 501.
- the electrode pin 611 is joined to the upper end surface electrode 501 of the corresponding second capacitor element 500 by a joining method such as soldering.
- the third electrode terminal portion 610 of the third bus bar 600 is electrically connected to the upper end face electrodes 501 of the three second capacitor elements 500.
- six circular flow holes 612 are formed in the third electrode terminal portion 610 so as to line up in the left-right direction in order to flow the filled resin 30 in a molten state.
- the third relay unit 620 relays between the third electrode terminal unit 610 and the third connection terminal unit 630.
- the third relay portion 620 has an elongated plate shape on the left and right, and extends upward from the rear end edge of the third electrode terminal portion 610.
- 3rd connection terminal part 630 is formed in the upper end edge of the 3rd relay part 620, and the front and back turns to the front-back direction.
- the third connection terminal portion 630 is formed with a circular attachment hole 631 penetrating the front and back.
- the third connection terminal portion 630 is electrically connected to a corresponding external terminal (not shown) by screwing using the attachment hole 631.
- a wide portion 630b having a width wider than that of the upper terminal portion 630a is formed below the third connection terminal portion 630.
- FIG. 6B is a perspective view of the fourth bus bar 700 and the insulating sheet 970 according to the present embodiment.
- the fourth bus bar 700 is formed of a conductive material, for example, a copper plate, and includes a fourth electrode terminal portion 710, a fourth relay portion 720, and the like. And a fourth connection terminal portion 730.
- the fourth bus bar 700 is formed by appropriately cutting and bending a single copper plate, and the fourth electrode terminal portion 710, the fourth relay portion 720, and the fourth connection terminal portion 730 are integrated. Yes.
- the fourth electrode terminal portion 710 has a long plate shape on the left and right. Two electrode pins 711 corresponding to the second capacitor element 500 at the left end are formed at the corner between the left end edge and the front end edge of the fourth electrode terminal portion 710. Further, two electrode pins 711 corresponding to the second capacitor element 500 at the right end are formed at the corner between the right end edge and the front end edge of the fourth electrode terminal portion 710. Further, two electrode pins 711 corresponding to the central second capacitor element 500 are formed at the central portion of the front edge of the fourth electrode terminal portion 710. The fourth electrode terminal portion 710 is in contact with the lower end surface electrodes 502 of the three second capacitor elements 500. Two electrode pins 711 are arranged on each lower end face electrode 502.
- the electrode pin 711 is joined to the lower end face electrode 502 of the corresponding second capacitor element 500 by a joining method such as soldering.
- a joining method such as soldering.
- the fourth electrode terminal portion 710 of the fourth bus bar 700 is electrically connected to the lower end surface electrodes 502 of the three second capacitor elements 500.
- the fourth relay unit 720 relays between the fourth electrode terminal unit 710 and the fourth connection terminal unit 730.
- the fourth relay portion 720 has a substantially trapezoidal plate shape, and extends upward from the rear end edge of the fourth electrode terminal portion 710.
- six circular flow holes 721 are formed so as to be aligned in the vertical and horizontal directions in order to distribute the filled resin 30 in a molten state.
- the fourth connection terminal portion 730 is formed at the upper end edge of the fourth relay portion 720, and the front and back surfaces thereof are directed in the front-rear direction.
- the fourth connection terminal portion 730 is formed with a circular attachment hole 731 penetrating the front and back.
- the fourth connection terminal portion 730 is electrically connected to a corresponding external terminal (not shown) by screwing using the attachment hole 731.
- a wide portion 730b having a width wider than that of the upper terminal portion 730a is formed below the fourth connection terminal portion 730.
- the terminal portion 630a of the third connection terminal portion 630 and the terminal portion 730a of the fourth connection terminal portion 730 are arranged in the left-right direction. Moreover, the wide part 630b of the 3rd connection terminal part 630 and the wide part 730b of the 4th connection terminal part 730 overlap in the front-back direction. Reduction of ESL (equivalent series inductance) in the second capacitor element unit 10B is expected due to the overlapping of the wide portions 630b and 730b. Further, as shown in FIG. 1A, in a state where the film capacitor 1 is completed, a third capacitor terminal is formed between the second connection terminal part 340 at the second part from the second first connection terminal part 240 from the right end. The connection terminal part 630 and the fourth connection terminal part 730 are arranged.
- the insulating sheet 970 is formed of an insulating resin material such as insulating paper, acrylic, or silicon.
- the insulating sheet 970 has a substantially horizontally long rectangular shape, and its central portion is once bent backward and then bent downward so as to match the shape of the fourth bus bar 700. 6B, the insulating sheet 970 is attached to the fourth bus bar 700 so as to straddle the upper portion of the fourth relay portion 720 and the wide portion 730b of the fourth connection terminal portion 730. .
- the insulating sheet 970 insulates between the wide portion 630 b of the third connection terminal portion 630 and the wide portion 730 b of the fourth connection terminal portion 730.
- the second insulating plate 800 is formed of an insulating resin material such as polyphenylene sulfide, acrylic, silicon, etc., and includes a main plate portion 810, a front plate portion 820, and a left plate portion. 830, a right plate portion 840, and a rear plate portion 850.
- the main plate portion 810 has a horizontally long rectangular shape.
- the front plate portion 820, the left plate portion 830, and the right plate portion 840 extend downward from the front end edge, the left end edge, and the right end edge of the main plate portion 810, respectively, and have a horizontally elongated rectangular shape.
- the rear plate portion 850 extends upward from the rear end edge of the main plate portion 810 and has a rectangular shape that is elongated horizontally.
- the second insulating plate 800 is substantially in contact with the three capacitors in which the inner surfaces of the front plate portion 820, the left plate portion 830, and the right plate portion 840 are arranged in the left-right direction.
- the insulating plate 800 is positioned.
- four circular fourth openings 811 are formed so as to be aligned in the left-right direction.
- the arrangement interval (pitch) between the adjacent fourth openings 811 is equal to the arrangement interval between the adjacent third openings 411 in the first insulating plate 400 and the arrangement interval between the adjacent electrode pins 611 in the third bus bar 600. Is done.
- An annular fitting protrusion 812 is formed around the fourth opening 811 on the surface of the main plate portion 810 (the surface facing the second overlapping portion 330).
- the outer diameter of the fitting protrusion 812 is slightly smaller than the inner diameter of the third opening 411.
- the height of the fitting protrusion 812 is made larger than the total thickness of the second overlapping portion 330 and the thickness of the main plate portion 410 of the first insulating plate 400.
- FIG. 7 is a perspective view of the case 20 as viewed from the upper rear side according to the present embodiment.
- the case 20 is formed of a resin material such as polyphenylene sulfide.
- the case 20 is a substantially rectangular parallelepiped that is long on the left and right, the case 20 is formed in a box shape with a rear center portion slightly protruding rearward, and the upper surface opens as an opening surface 20a.
- a region projecting rearward in the case 20 is an arrangement region of the second capacitor element unit 10B.
- a second spacer portion 22 and a third spacer portion 23 are provided.
- mounting tabs 24 are formed on the outside of the case 20 at four locations on the front surface and three locations on the rear surface. Each mounting tab 24 is formed with an insertion hole 24a penetrating vertically. A metal collar 25 is fitted into the insertion hole 24a in order to increase the strength of the hole. When the film capacitor 1 is installed in the installation part of the external device, these mounting tabs 24 are fixed to the installation part with screws or the like.
- FIG. 8 is a left side cross-sectional view of the film capacitor 1 cut along the line AA ′ in FIG. 1B according to the present embodiment.
- the upper surface position of the filling resin 30 is indicated by a one-dot chain line.
- the first overlapping portion 230 of the first bus bar 200 and the second overlapping portion 330 of the second bus bar 300 are in the vertical direction, that is, the normal direction of the opening surface 20 a of the case 20.
- the first capacitor plate 100 is overlapped in the vertical direction via the first insulating plate 400 at a position away from the five first capacitor elements 100.
- ESL equivalent series inductance
- the first overlapping portion 230 and the second overlapping portion 330 are insulated by the first insulating plate 400.
- the first annular protrusion 412 formed on the surface of the main plate portion 410 of the first insulating plate 400 fits into the first opening 231 formed in the first overlapping portion 230 of the first bus bar 200.
- the second annular protrusion 413 formed on the back surface of the main plate portion 410 of the first insulating plate 400 is fitted into the second opening 331 formed in the second overlapping portion 330 of the second bus bar 300. Accordingly, the first bus bar 200 and the second bus bar 300 are positioned in the front-rear and left-right directions with respect to the first insulating plate 400, and are difficult to move in the front-rear and left-right directions.
- annular protrusion part 412 and the 3rd opening part 411 which exist between the periphery of the 3rd opening part 411, and the periphery of the 1st opening part 231, and the periphery of the 2nd opening part 331.
- the second annular protrusion 413 the creeping distance between the first overlapping part 230 and the second overlapping part 330 through the third opening 411 is set to the first annular protruding part 412 and the second annular protruding part 413. Therefore, the insulation between the first bus bar 200 and the second bus bar 300 can be improved.
- the second capacitor is located at a position directly below the superimposed first overlapping portion 230 and second overlapping portion 330, that is, at a position overlapping the first overlapping portion 230 and the second overlapping portion 330 in the vertical direction.
- Three second capacitor elements 500 of the element unit 10B are arranged.
- a second insulating plate 800 is interposed between the second overlapping portion 330 and the third electrode terminal portion 610 of the third bus bar 600 that overlaps the second overlapping portion 330.
- the second overlapping portion 330, the third electrode terminal portion 610, Is insulated.
- the space formed between the first overlapping portion 230 and the second overlapping portion 330 and the bottom surface of the case 20 can be effectively used as the arrangement region of the second capacitor element 500.
- the fitting protrusion 812 of the second insulating plate 800 is fitted into the third opening 411 of the first insulating plate 400.
- the 2nd insulating board 800 is positioned with respect to the 1st insulating board 400 in the front-back, left-right direction, and becomes difficult to move to the front-back, left-right direction.
- each electrode pin 611 of the third electrode terminal portion 610 is located in each fourth opening portion 811 of the main plate portion 810 of the second insulating plate 800, and includes a first opening portion 231, a second opening portion 331, It is exposed above the first bus bar 200 through the communication path P formed by the overlap of the third opening 411 and the fourth opening 811. Thereby, it is possible to join each electrode pin 611 and the corresponding upper end electrode 501 of the second capacitor element 500 by soldering or the like through the communication path P.
- each electrode pin 611 in the second capacitor element unit 10B and the corresponding upper end face electrode 501 of the second capacitor element 500 can be joined to each electrode pin 211 of the first bus bar 200 and the corresponding upper end face electrode 101 of the first capacitor element 100 at a time.
- the bonding agent S such as solder accumulated on each electrode pin 611 is accommodated in the communication path P, the bonding agent S accumulated between the second insulating plate 800 and the third electrode terminal portion 610. It is no longer necessary to provide a gap corresponding to.
- the molten filling resin 30 is injected into the case 20, the injected filling resin 30 passes through the communication path P and reaches the portion of the second capacitor element 500 under the second insulating plate 800. It becomes easy.
- the front plate portion 420 of the first insulating plate 400 is interposed between the second relay portion 320 of the second bus bar 300 and the peripheral surface of the first capacitor element 100. Thereby, the creeping distance between the second relay part 320 of the second bus bar 300 and the upper end face electrode 101 of the first capacitor element 100 can be increased. Further, the front plate part 820 of the second insulating plate 800 is interposed between the second relay part 320 of the second bus bar 300 and the peripheral surface of the second capacitor element 500. Thereby, the creeping distance between the second relay part 320 of the second bus bar 300 and the upper end face electrode 501 of the second capacitor element 500 can be increased.
- the lower part of the insulating sheet 970 is interposed between the fourth relay portion 720 of the fourth bus bar 700 and the peripheral surface of the second capacitor element 500. Thereby, the creeping distance between the fourth relay part 720 of the fourth bus bar 700 and the upper end face electrode 501 of the second capacitor element 500 can be increased.
- the ESL in the first capacitor element unit 10A can be reduced.
- the space formed between the first overlapping portion 230 and the second overlapping portion 330 and the bottom surface of the case 20 can be effectively used as the arrangement region of the second capacitor element 500, the first capacitor element unit 10A and When the second capacitor element unit 10B is accommodated in one case 20, the size of the case 20 can be made compact. Thereby, the size of the film capacitor 1 can be made compact.
- each electrode pin 611 of the third bus bar 600 is positioned in each fourth opening 811 of the second insulating plate 800, and the first opening 231, the second opening 331, the third opening 411, and the fourth opening 811. Since the first bus bar 200 is exposed through the communication path P formed by the overlapping of the openings 811, the electrode pins 611 and the upper end surface electrodes 501 of the second capacitor elements 500 can be joined through the communication path P. . As a result, each electrode pin 611 in the second capacitor element unit 10B and the upper end surface electrode 501 of each second capacitor element 500 are joined to each electrode pin 211 of the first bus bar 200 in the first capacitor element unit 10A. It can be performed once, together with bonding to the upper end face electrode 101 of each first capacitor element 100.
- the bonding agent S such as solder accumulated on each electrode pin 611 of the third bus bar 600 is accommodated in the communication path P, it is accumulated between the second insulating plate 800 and the third electrode terminal portion 610. It is not necessary to provide a gap for the bonding agent S. Thereby, since the height from the bottom surface of the case 20 of the second overlapping portion 330 of the second bus bar 300 and the first overlapping portion 230 of the first bus bar 200 overlapping the third electrode terminal portion 610 is suppressed, Can be prevented from becoming high.
- the second insulating plate 800 is provided with a fitting projection 812 that is fitted into the third opening 411 of the first insulating plate 400, the second insulating plate 800 is attached to the first insulating plate 400. Positioning can be performed in the front-rear and left-right directions, and the second insulating plate 800 is less likely to move in the front-rear and left-right directions.
- first overlapping portion 230 and the second overlapping portion 330 through the third opening 411 are formed by the first annular protrusion 412 existing between the periphery of the third opening 411 and the periphery of the first opening 231.
- the creepage distance between the first bus bar 200 and the second bus bar 300 can be increased.
- the first overlapping portion 230 and the second overlapping portion through the third opening 411 are also caused by the second annular protrusion 413 existing between the periphery of the third opening 411 and the periphery of the second opening 331. Since the creepage distance between the first bus bar 200 and the second bus bar 300 can be increased, the creeping distance between the first bus bar 200 and the second bus bar 300 can be increased.
- the first annular protrusion 412 is formed around the third opening 411 on the front surface, and the third opening 411 on the back surface is formed.
- a second annular protrusion 413 was formed around the periphery.
- FIG. 9B a configuration in which the first annular protrusion 412 is not provided may be employed, or a configuration in which the first annular protrusion 412 is not provided as illustrated in FIG. 9B may be employed. . Further, as shown in FIG.
- the inner diameter of the second opening 331 of the second bus bar 300 is slightly larger than the outer diameter of the fitting protrusion 812 of the second insulating plate 800.
- the two bus bars 300 are positioned with respect to the second insulating plate 800.
- the first bus bar 200 is configured such that the inner diameter of the first opening 231 of the first bus bar 200 is slightly larger than the outer diameter of the fitting protrusion 812. Positioned with respect to the second insulating plate 800. Furthermore, in the case of the configuration of FIG.
- the inner diameter of the first opening 231 and the inner diameter of the second opening 331 are slightly larger than the outer diameter of the fitting protrusion 812, thereby
- the bus bar 200 and the second bus bar 300 are positioned with respect to the second insulating plate 800.
- the first capacitor element unit 10A includes the third capacitor element 910, the fourth capacitor element 920, the fifth capacitor element 930, and the sixth capacitor element 940.
- the capacitor element unit 10A may not include at least one of the capacitor elements 910, 920, 930, and 940.
- the first capacitor element unit 10A may not include the fifth bus bar 950 and the sixth bus bar 960, and the first bus bar 200 includes the first sub electrode terminal portion 220 and the first sub connection terminal portion 250. It may not be provided.
- first capacitor elements 100 are included in the first capacitor element unit 10A, and three second capacitor elements 500 are included in the second capacitor element unit 10B.
- the number of the first capacitor elements 100 and the second capacitor elements 500 can be appropriately changed including the case where the number is one.
- the numbers of the third capacitor element 910, the fourth capacitor element 920, the fifth capacitor element 930, and the sixth capacitor element 940 may be changed as appropriate.
- the first capacitor element 100, the second capacitor element 500, the third capacitor element 910, the fourth capacitor element 920, the fifth capacitor element 930, and the sixth capacitor element 940 have both end faces. It was arranged in the case 20 so as to face the vertical direction, that is, the normal direction of the opening 20a of the case 20. However, the capacitor elements 100, 500, 910, 920, 930, and 940 may be disposed in the case 20 so that their both end faces face in the front-rear direction, that is, the direction orthogonal to the normal direction.
- the first capacitor element 100, the second capacitor element 500, the third capacitor element 910, the fourth capacitor element 920, the fifth capacitor element 930, and the sixth capacitor element 940 are formed on the dielectric film. It is formed by stacking two metallized films deposited with aluminum and winding or laminating the stacked metallized films. In addition to this, aluminum is deposited on both sides of the dielectric film.
- the capacitor elements 100, 500, 910, 920, 930, and 940 may be formed by overlapping a metallized film and an insulating film and winding or laminating them.
- six electrode pins 611 and six electrode pins 611 are formed in the third electrode terminal portion 610 of the third bus bar 600, and the first bus bar 200, the second bus bar 300, and the first insulating plate 400 are accordingly formed.
- six first openings 231, second openings 331, third openings 411, and fourth openings 811 are formed in the second insulating plate 800, respectively.
- the number of electrode pins 611 can be appropriately changed according to the number of second capacitor elements 500 and the like, and accordingly, the first opening 231, the second opening 331, and the third opening The number of 411 and the fourth opening 811 is also changed.
- the film capacitor 1 was mentioned as an example of the capacitor
- the present invention can also be applied to capacitors other than the film capacitor 1.
- the terms indicating directions such as “upward” and “downward” indicate relative directions that depend only on the relative positional relationship of the constituent members, and include vertical and horizontal directions. It does not indicate the absolute direction.
- the present invention is useful for capacitors used in various electronic equipment, electrical equipment, industrial equipment, vehicle electrical equipment, and the like.
- First capacitor element (first capacitor element) 101 Upper end face electrode (first electrode) 102 Lower end face electrode (second electrode) 200 First bus bar (first bus bar) 230 1st polymerization part (1st polymerization part) 231 1st opening part (1st opening part) 300 Second bus bar (second bus bar) 330 2nd polymerization part (2nd polymerization part) 331 second opening (second opening) 400 1st insulation board (1st insulation part) 411 Third opening (third opening) 412 First annular protrusion (first annular protrusion) 413 Second annular projection (second annular projection) 500 Second capacitor element (second capacitor element) 501 Upper end face electrode (third electrode) 502 Lower end face electrode (fourth electrode) 600 3rd bus bar (3rd bus bar) 610 Third electrode terminal portion (third overlapping portion) 611 Electrode pin (joint) 700 4th bus bar
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Abstract
Provided is a film capacitor in which a first bus bar and a second bus bar respectively include a first overlap portion and a second overlap portion which, at a position spaced apart from a first capacitor element in a normal direction with respect to an opening surface in which a case has an opening, overlap each other in the normal direction. A first insulating plate is interposed between the first overlap portion and the second overlap portion. A second capacitor element is disposed in the case so as to overlap the first overlap portion and the second overlap portion in the normal direction. A third bus bar includes a third electrode terminal portion overlapping the second overlap portion in the normal direction. A second insulating plate is interposed between the second overlap portion and the third electrode terminal portion.
Description
本発明は、コンデンサに関する。
The present invention relates to a capacitor.
両端面にメタリコン電極(端面電極)が形成され、それぞれのメタリコン電極に外部引き出し端子(バスバー)が接続された複数のコンデンサ素子を、上面が開口するケース内に収納し、当該ケース内に充填樹脂を充填するようにした金属化フィルムコンデンサが特許文献1に記載されている。
A plurality of capacitor elements each having a metallicon electrode (end surface electrode) formed on both end faces and having an external lead terminal (bus bar) connected to each metallicon electrode are accommodated in a case having an upper surface opened, and the resin is filled in the case. Patent Document 1 discloses a metallized film capacitor that is filled with.
特許文献1の金属化フィルムコンデンサでは、ESL(等価直列インダクタンス)を低減させるために、一対の外部引き出し端子が、絶縁シート(絶縁板)を間に挟んで重ね合わされている。
In the metallized film capacitor of Patent Document 1, a pair of external lead terminals are overlapped with an insulating sheet (insulating plate) interposed therebetween in order to reduce ESL (equivalent series inductance).
特許文献1のような、いわゆるケースモールド型のコンデンサにおいて、コンデンサ素子と一対のバスバーとを含む複数のコンデンサ素子ユニットを、一つのケースに収容し、充填樹脂でモールドするような構成が採られ得る。各コンデンサ素子ユニットは、コンデンサが搭載される機器(装置)において、互いに異なる電子回路部に組み込まれる。このような構成とすれば、一つの機器に複数のコンデンサ素子ユニットが用いられる場合に、コンデンサ素子ユニット毎にケースを設けずに済む。
In the so-called case mold type capacitor as in Patent Document 1, a configuration in which a plurality of capacitor element units including a capacitor element and a pair of bus bars are accommodated in one case and molded with a filling resin can be employed. . Each capacitor element unit is incorporated in different electronic circuit units in a device (device) on which a capacitor is mounted. With such a configuration, when a plurality of capacitor element units are used in one device, it is not necessary to provide a case for each capacitor element unit.
しかしながら、複数のコンデンサ素子ユニットを一つのケースに収容する場合、各コンデンサ素子ユニットの配置構成が適正でないと、ケースが無駄に大きくなってしまい、延いてはコンデンサ自身が無駄に大きくなってしまう虞がある。また、特許文献1のコンデンサと同様、ESLの低減が図れることも望ましい。
However, when a plurality of capacitor element units are accommodated in one case, if the arrangement configuration of each capacitor element unit is not appropriate, the case may be unnecessarily large and the capacitor itself may be unnecessarily large. There is. In addition, like the capacitor disclosed in Patent Document 1, it is also desirable that ESL can be reduced.
かかる課題に鑑み、本発明は、複数のコンデンサ素子ユニットを一つのケースに収容する場合に、コンパクト化とESLの低減とが図れるコンデンサを提供することを目的とする。
In view of such a problem, an object of the present invention is to provide a capacitor that can be made compact and reduce ESL when a plurality of capacitor element units are accommodated in one case.
本発明の主たる態様に係るコンデンサは、第1の電極および第2の電極を有する第1のコンデンサ素子と、前記第1の電極に接続された第1のバスバーと、前記第2の電極に接続された第2のバスバーと、を含む第1のコンデンサ素子ユニットと、第3の電極および第4の電極を有する第2のコンデンサ素子と、前記第3の電極に接続された第3のバスバーと、前記第4の電極に接続された第4のバスバーと、を含む第2のコンデンサ素子ユニットと、前記第1のコンデンサ素子ユニットおよび前記第2のコンデンサ素子ユニットが収容されたケースと、前記ケース内に充填された充填樹脂と、を備える。ここで、前記第1のバスバーおよび前記第2のバスバーは、それぞれ、前記ケースが開口する開口面の法線方向において前記第1のコンデンサ素子から外れた位置で、前記法線方向に互いに重なり合う第1の重合部および第2の重合部を含み、前記第1の重合部と前記第2の重合部との間には第1の絶縁部が介在する。さらに、前記第2のコンデンサ素子は、前記法線方向において前記第1の重合部および前記第2の重合部に重なるように前記ケース内に配置される。前記第3のバスバーは、前記法線方向において前記第2の重合部と重なり合う第3の重合部を含み、前記第2の重合部と前記第3の重合部との間には第2の絶縁部が介在する。
The capacitor according to the main aspect of the present invention includes a first capacitor element having a first electrode and a second electrode, a first bus bar connected to the first electrode, and a connection to the second electrode. A second capacitor bar, a second capacitor element having a third electrode and a fourth electrode, and a third bus bar connected to the third electrode, A second capacitor element unit including a fourth bus bar connected to the fourth electrode, a case in which the first capacitor element unit and the second capacitor element unit are accommodated, and the case And a filled resin filled therein. Here, each of the first bus bar and the second bus bar overlaps each other in the normal direction at a position deviated from the first capacitor element in the normal direction of the opening surface where the case opens. 1 superposition part and 2nd superposition part are included, and the 1st insulating part intervenes between the 1st superposition part and the 2nd superposition part. Further, the second capacitor element is disposed in the case so as to overlap the first overlapping portion and the second overlapping portion in the normal direction. The third bus bar includes a third overlapping portion that overlaps the second overlapping portion in the normal direction, and a second insulation is provided between the second overlapping portion and the third overlapping portion. The part intervenes.
本発明によれば、複数のコンデンサ素子ユニットを一つのケースに収容する場合に、コンパクト化とESLの低減とが図れるコンデンサを提供することができる。
According to the present invention, when a plurality of capacitor element units are accommodated in one case, it is possible to provide a capacitor that can be made compact and reduce ESL.
本発明の効果ないし意義は、以下に示す実施の形態の説明により更に明らかとなろう。ただし、以下に示す実施の形態は、あくまでも、本発明を実施化する際の一つの例示であって、本発明は、以下の実施の形態に記載されたものに何ら制限されるものではない。
The effect or significance of the present invention will become more apparent from the following description of embodiments. However, the embodiment described below is merely an example when the present invention is implemented, and the present invention is not limited to what is described in the following embodiment.
以下、本発明のコンデンサの一実施形態であるフィルムコンデンサ1について図を参照して説明する。便宜上、各図には、適宜、前後、左右および上下の方向が付記されている。なお、図示の方向は、あくまでフィルムコンデンサ1の相対的な方向を示すものであり、絶対的な方向を示すものではない。
Hereinafter, a film capacitor 1 which is an embodiment of the capacitor of the present invention will be described with reference to the drawings. For convenience, front and rear, left and right, and up and down directions are appropriately appended to each drawing. In addition, the direction of illustration shows the relative direction of the film capacitor 1 to the last, and does not show an absolute direction.
本実施の形態において、フィルムコンデンサ1が、特許請求の範囲に記載の「コンデンサ」に対応する。また、第1コンデンサ素子ユニット10Aが、特許請求の範囲に記載の「第1のコンデンサ素子ユニット」に対応する。さらに、第2コンデンサ素子ユニット10Bが、特許請求の範囲に記載の「第2のコンデンサ素子ユニット」に対応する。第1コンデンサ素子100が、特許請求の範囲に記載の「第1のコンデンサ素子」に対応する。さらに、上側端面電極101および下側端面電極102が、それぞれ、特許請求の範囲に記載の「第1の電極」および「第2の電極」に対応する。さらに、第1バスバー200および第2バスバー300が、それぞれ、特許請求の範囲に記載の「第1のバスバー」および「第2のバスバー」に対応する。さらに、第1重合部230および第2重合部330が、それぞれ、特許請求の範囲に記載の「第1の重合部」および「第2の重合部」に対応する。さらに、第1開口部231および第2開口部331が、それぞれ、特許請求の範囲に記載の「第1の開口部」および「第2の開口部」に対応する。さらに、第1絶縁板400が、特許請求の範囲に記載の「第1の絶縁部」に対応する。さらに、第3開口部411が、特許請求の範囲に記載の「第3の開口部」に対応する。さらに、第1環状突起部412および第2環状突起部413が、それぞれ、特許請求の範囲に記載の「第1の環状突起部」および「第2の環状突起部」に対応する。第2コンデンサ素子500が、特許請求の範囲に記載の「第2のコンデンサ素子」に対応する。さらに、上側端面電極501および下側端面電極502が、それぞれ、特許請求の範囲に記載の「第3の電極」および「第4の電極」に対応する。さらに、第3バスバー600および第4バスバー700が、それぞれ、特許請求の範囲に記載の「第3のバスバー」および「第4のバスバー」に対応する。さらに、第3電極端子部610が、特許請求の範囲に記載の「第3の重合部」に対応する。さらに、電極ピン611が、特許請求の範囲に記載の「接合部」に対応する。さらに、第2絶縁板800が、特許請求の範囲に記載の「第2の絶縁部」に対応する。さらに、第4開口部811が、特許請求の範囲に記載の「第4の開口部」に対応する。さらに、嵌合突起部812が、特許請求の範囲に記載の「突起部」に対応する。
In the present embodiment, the film capacitor 1 corresponds to a “capacitor” described in the claims. The first capacitor element unit 10 </ b> A corresponds to a “first capacitor element unit” recited in the claims. Furthermore, the second capacitor element unit 10B corresponds to a “second capacitor element unit” recited in the claims. The first capacitor element 100 corresponds to a “first capacitor element” recited in the claims. Furthermore, the upper end face electrode 101 and the lower end face electrode 102 correspond to “first electrode” and “second electrode” recited in the claims, respectively. Furthermore, the first bus bar 200 and the second bus bar 300 correspond to the “first bus bar” and the “second bus bar” recited in the claims, respectively. Furthermore, the 1st superposition | polymerization part 230 and the 2nd superposition | polymerization part 330 respond | correspond to the "1st superposition | polymerization part" and the "2nd superposition | polymerization part" as described in a claim, respectively. Further, the first opening 231 and the second opening 331 respectively correspond to the “first opening” and the “second opening” recited in the claims. Further, the first insulating plate 400 corresponds to a “first insulating portion” recited in the claims. Furthermore, the third opening 411 corresponds to a “third opening” recited in the claims. Further, the first annular protrusion 412 and the second annular protrusion 413 correspond to a “first annular protrusion” and a “second annular protrusion” recited in the claims, respectively. The second capacitor element 500 corresponds to a “second capacitor element” recited in the claims. Further, the upper end face electrode 501 and the lower end face electrode 502 correspond to “third electrode” and “fourth electrode” recited in the claims, respectively. Furthermore, the third bus bar 600 and the fourth bus bar 700 correspond to the “third bus bar” and the “fourth bus bar” recited in the claims, respectively. Furthermore, the third electrode terminal portion 610 corresponds to a “third overlapping portion” recited in the claims. Furthermore, the electrode pin 611 corresponds to a “joint portion” described in the claims. Further, the second insulating plate 800 corresponds to a “second insulating portion” recited in the claims. Further, the fourth opening 811 corresponds to a “fourth opening” recited in the claims. Further, the fitting protrusion 812 corresponds to a “protrusion” described in the claims.
ただし、上記記載は、あくまで、特許請求の範囲の構成と実施形態の構成とを対応付けることを目的とするものであって、上記対応付けによって特許請求の範囲に記載の発明が実施形態の構成に何ら限定されるものではない。
However, the above description is only for the purpose of associating the configuration of the claims with the configuration of the embodiment, and the invention described in the claims is incorporated into the configuration of the embodiment by the above association. It is not limited at all.
図1(a)は、本実施の形態に係る、フィルムコンデンサ1を前方上方から見た斜視図であり、図1(b)は、本実施の形態に係る、充填樹脂30が除かれた状態のフィルムコンデンサ1を前方上方から見た斜視図である。
FIG. 1A is a perspective view of the film capacitor 1 according to the present embodiment as viewed from the front upper side, and FIG. 1B is a state in which the filling resin 30 according to the present embodiment is removed. It is the perspective view which looked at the film capacitor 1 of this from the front upper direction.
図1(a)および(b)に示すように、フィルムコンデンサ1は、コンデンサアセンブリ10と、コンデンサアセンブリ10が収容されるケース20と、ケース20内に充填され、ケース20内で硬化する熱硬化性の充填樹脂30とを備える。ケース20内が充填樹脂30でモールドされた状態において、第1バスバー200の4つの第1接続端子部240および第1副接続端子部250と、第2バスバー300の4つの第2接続端子部340と、第3バスバー600の第3接続端子部630と、第4バスバー700の第4接続端子部730と、第5バスバー950の第5副接続端子部952とが充填樹脂30から露出する。コンデンサアセンブリ10の充填樹脂30に埋没した大部分が、湿気や衝撃から保護される。
As shown in FIGS. 1A and 1B, the film capacitor 1 includes a capacitor assembly 10, a case 20 in which the capacitor assembly 10 is accommodated, and thermal curing that is filled in the case 20 and cured in the case 20. Filling resin 30. In the state where the inside of the case 20 is molded with the filling resin 30, the four first connection terminal portions 240 and the first sub-connection terminal portions 250 of the first bus bar 200 and the four second connection terminal portions 340 of the second bus bar 300. The third connection terminal portion 630 of the third bus bar 600, the fourth connection terminal portion 730 of the fourth bus bar 700, and the fifth sub connection terminal portion 952 of the fifth bus bar 950 are exposed from the filling resin 30. Most of the capacitor assembly 10 embedded in the filling resin 30 is protected from moisture and impact.
図2は、本実施の形態に係る、フィルムコンデンサ1の分解斜視図である。図3(a)は、本実施の形態に係る、第1コンデンサ素子ユニット10Aを後方下方から見た斜視図であり、図3(b)は、本実施の形態に係る、第2コンデンサ素子ユニット10Bを後方下方から見た斜視図である。
FIG. 2 is an exploded perspective view of the film capacitor 1 according to the present embodiment. FIG. 3A is a perspective view of the first capacitor element unit 10A according to the present embodiment as viewed from the lower rear side, and FIG. 3B is a second capacitor element unit according to the present embodiment. It is the perspective view which looked at 10B from back lower direction.
コンデンサアセンブリ10は、第1コンデンサ素子ユニット10Aと第2コンデンサ素子ユニット10Bとを含む。第1コンデンサ素子ユニット10Aは、5個の第1コンデンサ素子100と、第1バスバー200と、第2バスバー300と、第1絶縁板400とを含み、第1コンデンサ素子ユニット10Aは、3個の第2コンデンサ素子500と、第3バスバー600と、第4バスバー700とを含む。第1コンデンサ素子ユニット10Aと第2コンデンサ素子ユニット10Bは、フィルムコンデンサ1が搭載される外部機器(図示せず)が有する異なる電子回路部にそれぞれ組み込まれ得る。コンデンサアセンブリ10は、この他に第2絶縁板800を含む。
The capacitor assembly 10 includes a first capacitor element unit 10A and a second capacitor element unit 10B. The first capacitor element unit 10A includes five first capacitor elements 100, a first bus bar 200, a second bus bar 300, and a first insulating plate 400. The first capacitor element unit 10A includes three pieces. Second capacitor element 500, third bus bar 600, and fourth bus bar 700 are included. The first capacitor element unit 10 </ b> A and the second capacitor element unit 10 </ b> B can be respectively incorporated in different electronic circuit units included in an external device (not shown) on which the film capacitor 1 is mounted. The capacitor assembly 10 further includes a second insulating plate 800.
まず、第1コンデンサ素子ユニット10Aの構成について説明する。
First, the configuration of the first capacitor element unit 10A will be described.
第1コンデンサ素子ユニット10Aは、第1コンデンサ素子100、第1バスバー200、第2バスバー300および第1絶縁板400の他に、第3コンデンサ素子910と、2つの第4コンデンサ素子920と、第5コンデンサ素子930と、第6コンデンサ素子940と、第5バスバー950と、第6バスバー960とを含む。
In addition to the first capacitor element 100, the first bus bar 200, the second bus bar 300, and the first insulating plate 400, the first capacitor element unit 10A includes a third capacitor element 910, two fourth capacitor elements 920, 5 capacitor element 930, sixth capacitor element 940, fifth bus bar 950, and sixth bus bar 960 are included.
図2および図3(a)に示すように、5個の第1コンデンサ素子100は、ケース20内において、両端面が上下方向を向くようにして、その短手方向(図2の左右方向)に配列される。各第1コンデンサ素子100は、誘電体フィルム上にアルミニウムを蒸着させた2枚の金属化フィルムを重ね、重ねた金属化フィルムを巻回または積層し、扁平状に押圧することにより形成される。各第1コンデンサ素子100には、上側の端面に、亜鉛等の金属の吹付けにより上側端面電極101が形成され、下側の端面に、同じく亜鉛等の金属の吹付けにより下側端面電極102が形成される。
As shown in FIGS. 2 and 3A, the five first capacitor elements 100 are arranged in the short direction (the left-right direction in FIG. 2) in the case 20 so that both end surfaces face the up-down direction. Arranged. Each first capacitor element 100 is formed by stacking two metallized films on which aluminum is vapor-deposited on a dielectric film, winding or stacking the stacked metallized films, and pressing them flatly. In each first capacitor element 100, an upper end face electrode 101 is formed on the upper end face by spraying a metal such as zinc, and a lower end face electrode 102 is similarly formed on the lower end face by spraying a metal such as zinc. Is formed.
なお、本実施の形態の第1コンデンサ素子100は、誘電体フィルム上にアルミニウムを蒸着させた金属化フィルムにより形成されたが、これ以外にも、亜鉛、マグネシウム等の他の金属を蒸着させた金属化フィルムにより形成されてもよい。あるいは、第1コンデンサ素子100は、これらの金属のうち、複数の金属を蒸着させた金属化フィルムにより形成されてもよいし、これらの金属どうしの合金を蒸着させた金属化フィルムにより形成されてもよい。
The first capacitor element 100 of the present embodiment is formed of a metallized film in which aluminum is vapor-deposited on a dielectric film, but other metals such as zinc and magnesium are vapor-deposited in addition to this. It may be formed of a metallized film. Or the 1st capacitor | condenser element 100 may be formed with the metallized film which vapor-deposited several metal among these metals, and is formed with the metallized film vapor-deposited the alloy of these metals. Also good.
第3コンデンサ素子910は、ケース20内において、両端面が上下方向を向くようにして、右端の第1コンデンサ素子100の右方に配置され、第4コンデンサ素子920、第5コンデンサ素子930および第6コンデンサ素子940は、ケース20内において、両端面が上下方向を向くようにして、第1コンデンサ素子100と第3コンデンサ素子910との間に配置される。
The third capacitor element 910 is disposed on the right side of the first capacitor element 100 at the right end in the case 20 so that both end faces are directed in the vertical direction, and the fourth capacitor element 920, the fifth capacitor element 930, and the The six-capacitor element 940 is disposed between the first capacitor element 100 and the third capacitor element 910 in the case 20 so that both end faces are directed in the vertical direction.
第3コンデンサ素子910、第4コンデンサ素子920、第5コンデンサ素子930および第6コンデンサ素子940の構成は、第1コンデンサ素子100の構成と同様であり、それぞれ、その上側の端面に上側端面電極911、921、931、941が形成され、その下側の端面に下側端面電極912、922、932、942が形成される。第3コンデンサ素子910は、第1コンデンサ素子100と静電容量が等しくサイズが等しいが、第4コンデンサ素子920、第5コンデンサ素子930および第6コンデンサ素子940は、第1コンデンサ素子100よりも静電容量が小さくサイズが小さい。
The configurations of the third capacitor element 910, the fourth capacitor element 920, the fifth capacitor element 930, and the sixth capacitor element 940 are the same as the configuration of the first capacitor element 100, and the upper end electrode 911 is disposed on the upper end surface thereof. , 921, 931, 941 are formed, and lower end face electrodes 912, 922, 932, 942 are formed on the lower end face thereof. The third capacitor element 910 has the same capacitance and the same size as the first capacitor element 100, but the fourth capacitor element 920, the fifth capacitor element 930, and the sixth capacitor element 940 are more static than the first capacitor element 100. Small capacity and small size.
図4(a)は、本実施の形態に係る、第1バスバー200の斜視図である。
FIG. 4A is a perspective view of the first bus bar 200 according to the present embodiment.
図2、図3(a)および図4(a)に示すように、第1バスバー200は、導電性材料、たとえば、銅板により形成され、第1電極端子部210と、第1副電極端子部220と、第1重合部230と、4つの第1接続端子部240と、第1副接続端子部250とを含む。第1バスバー200は、たとえば、一枚の銅板を適宜切り抜き、折り曲げることによって形成され、これら第1電極端子部210と、第1副電極端子部220と、第1重合部230と、第1接続端子部240と、第1副接続端子部250とが一体となっている。
As shown in FIGS. 2, 3 (a) and 4 (a), the first bus bar 200 is formed of a conductive material, for example, a copper plate, and includes a first electrode terminal portion 210 and a first sub electrode terminal portion. 220, a first overlapping portion 230, four first connection terminal portions 240, and a first sub connection terminal portion 250. The first bus bar 200 is formed by, for example, appropriately cutting and bending a single copper plate, and the first electrode terminal portion 210, the first sub electrode terminal portion 220, the first overlapping portion 230, and the first connection. The terminal part 240 and the first sub-connecting terminal part 250 are integrated.
第1電極端子部210は、左右に細長い板状を有する。第1電極端子部210の前端縁には、10個の電極ピン211が左右方向に並ぶように形成される。第1電極端子部210は、5個の第1コンデンサ素子100の上側端面電極101に接触する。各上側端面電極101に、電極ピン211が2ずつ配置される。電極ピン211が、対応する第1コンデンサ素子100の上側端面電極101に半田付け等の接合方法によって接合される。これにより、第1バスバー200の第1電極端子部210が5個の第1コンデンサ素子100の上側端面電極101と電気的に接続される。
The first electrode terminal portion 210 has a plate shape that is elongated to the left and right. Ten electrode pins 211 are formed on the front edge of the first electrode terminal portion 210 so as to be arranged in the left-right direction. The first electrode terminal portion 210 is in contact with the upper end face electrodes 101 of the five first capacitor elements 100. Two electrode pins 211 are arranged on each upper end face electrode 101. The electrode pins 211 are joined to the corresponding upper end face electrodes 101 of the first capacitor elements 100 by a joining method such as soldering. Thereby, the first electrode terminal portion 210 of the first bus bar 200 is electrically connected to the upper end surface electrodes 101 of the five first capacitor elements 100.
第1副電極端子部220は、第1電極端子部210の右端部から右斜め前方に延びるように形成される。第1副電極端子部220には、第3コンデンサ素子910の上側端面電極911に対応する位置に2つの電極ピン221が形成され、2つの第4コンデンサ素子920の各上側端面電極921に対応する位置に1つずつ電極ピン222が形成される。2つの電極ピン221が、第3コンデンサ素子910の上側端面電極911に半田付け等の接合方法によって接合され、各電極ピン222が、各第4コンデンサ素子920の上側端面電極921に半田付け等の接合方法によって接合される。これにより、第1バスバー200の第1副電極端子部220が第3コンデンサ素子910の上側端面電極911および2個の第4コンデンサ素子920の上側端面電極921と電気的に接続される。
The first sub electrode terminal portion 220 is formed so as to extend obliquely forward to the right from the right end portion of the first electrode terminal portion 210. Two electrode pins 221 are formed in the first sub electrode terminal portion 220 at positions corresponding to the upper end face electrodes 911 of the third capacitor element 910, and correspond to the upper end face electrodes 921 of the two fourth capacitor elements 920. One electrode pin 222 is formed at each position. Two electrode pins 221 are joined to the upper end face electrode 911 of the third capacitor element 910 by a joining method such as soldering, and each electrode pin 222 is soldered to the upper end face electrode 921 of each fourth capacitor element 920. Bonded by the bonding method. As a result, the first sub-electrode terminal portion 220 of the first bus bar 200 is electrically connected to the upper end face electrode 911 of the third capacitor element 910 and the upper end face electrodes 921 of the two fourth capacitor elements 920.
第1重合部230は、左右に長い板状を有し、第1電極端子部210の後方に一段高くなるように設けられる。第1重合部230には、左右方向に並ぶように、所定の間隔で6個の円形の第1開口部231が形成される。
The first overlapping part 230 has a plate shape that is long on the left and right, and is provided to be higher by one step behind the first electrode terminal part 210. In the first overlapping portion 230, six circular first openings 231 are formed at predetermined intervals so as to be aligned in the left-right direction.
4つの第1接続端子部240は、第1重合部230の後端縁から上方に立ち上がるように形成され、その表裏面が前後方向を向く。2つの第1接続端子部240が第1重合部230の左寄りの位置に設けられ、他の2つの第1接続端子部240が第1重合部230の右寄りの位置に設けられる。各第1接続端子部240には、表裏を貫通する円形の取付穴241が形成される。第1接続端子部240は、取付穴241を用いたネジ止めによって、対応する外部端子(図示せず)に電気的に接続される。
The four first connection terminal portions 240 are formed so as to rise upward from the rear end edge of the first overlapping portion 230, and the front and back surfaces thereof face in the front-rear direction. Two first connection terminal portions 240 are provided on the left side of the first overlapping portion 230, and the other two first connection terminal portions 240 are provided on the right side of the first overlapping portion 230. Each first connection terminal portion 240 is formed with a circular attachment hole 241 penetrating the front and back. The first connection terminal portion 240 is electrically connected to a corresponding external terminal (not shown) by screwing using the attachment hole 241.
第1副接続端子部250は、第1副電極端子部220の右端部から上方に立ち上がるように形成され、その表裏面が左右方向を向く。第1副接続端子部250には、表裏を貫通する円形の取付穴251が形成される。第1副接続端子部250は、取付穴251を用いたネジ止めによって、対応する外部端子(図示せず)に電気的に接続される。
The first sub-connecting terminal portion 250 is formed so as to rise upward from the right end portion of the first sub-electrode terminal portion 220, and the front and back surfaces thereof face in the left-right direction. The first sub-connecting terminal portion 250 is formed with a circular mounting hole 251 penetrating the front and back. The first sub-connecting terminal portion 250 is electrically connected to a corresponding external terminal (not shown) by screwing using the mounting hole 251.
図4(b)は、本実施の形態に係る、第2バスバー300の斜視図である。
FIG. 4B is a perspective view of the second bus bar 300 according to the present embodiment.
図2、図3(a)および図4(b)に示すように、第2バスバー300は、導電性材料、たとえば、銅板により形成され、第2電極端子部310と、第2中継部320と、第2重合部330と、4つの第2接続端子部340とを含む。第2バスバー300は、たとえば、一枚の銅板を適宜切り抜き、折り曲げることによって形成され、これら第2電極端子部310と、第2中継部320と、第2重合部330と、第2接続端子部340とが一体となっている。
As shown in FIGS. 2, 3 (a), and 4 (b), the second bus bar 300 is formed of a conductive material, for example, a copper plate, and includes a second electrode terminal portion 310, a second relay portion 320, and the like. The second overlapping portion 330 and the four second connection terminal portions 340 are included. The second bus bar 300 is formed, for example, by appropriately cutting and bending a single copper plate, and the second electrode terminal portion 310, the second relay portion 320, the second overlapping portion 330, and the second connection terminal portion. 340 is integrated.
第2電極端子部310は、左右に細長い板状を有する。第2電極端子部310の左端縁と前端縁の間の角部には、左端の第1コンデンサ素子100に対応する2つの電極ピン311が形成される。また、第2電極端子部310の前端縁には、左端以外の4つの第1コンデンサ素子100に対応する8個の電極ピン311が左右方向に並ぶように形成される。第2電極端子部310は、5個の第1コンデンサ素子100の下側端面電極102に接触する。各下側端面電極102に、電極ピン311が2ずつ配置される。電極ピン311が、対応する第1コンデンサ素子100の下側端面電極102に半田付け等の接合方法によって接合される。これにより、第2バスバー300の第2電極端子部310が5個の第1コンデンサ素子100の下側端面電極102と電気的に接続される。さらに、第2電極端子部310の右端縁には、第5コンデンサ素子930に対応する電極ピン312が形成される。電極ピン312が、第5コンデンサ素子930の下側端面電極932に半田付け等の接合方法によって接合される。これにより、第2バスバー300の第2電極端子部310が第5コンデンサ素子930の下側端面電極932と電気的に接続される。
The second electrode terminal portion 310 has a plate shape that is elongated to the left and right. Two electrode pins 311 corresponding to the first capacitor element 100 at the left end are formed at the corner between the left end edge and the front end edge of the second electrode terminal portion 310. Further, eight electrode pins 311 corresponding to the four first capacitor elements 100 other than the left end are formed on the front end edge of the second electrode terminal portion 310 so as to be arranged in the left-right direction. The second electrode terminal portion 310 is in contact with the lower end surface electrodes 102 of the five first capacitor elements 100. Two electrode pins 311 are arranged on each lower end face electrode 102. The electrode pin 311 is joined to the lower end face electrode 102 of the corresponding first capacitor element 100 by a joining method such as soldering. Thereby, the second electrode terminal portion 310 of the second bus bar 300 is electrically connected to the lower end surface electrodes 102 of the five first capacitor elements 100. Furthermore, an electrode pin 312 corresponding to the fifth capacitor element 930 is formed on the right end edge of the second electrode terminal portion 310. The electrode pin 312 is joined to the lower end face electrode 932 of the fifth capacitor element 930 by a joining method such as soldering. As a result, the second electrode terminal portion 310 of the second bus bar 300 is electrically connected to the lower end surface electrode 932 of the fifth capacitor element 930.
第2中継部320は、第2電極端子部310と第2重合部330との間を中継する。第2中継部320は、左右に長い板状を有し、第2電極端子部310の後端縁から上方に延びる。第2中継部320には、溶融状態の充填樹脂30を流通させるため、多数の円形の流通孔321が上下左右方向に並ぶように形成される。
The second relay unit 320 relays between the second electrode terminal unit 310 and the second overlapping unit 330. The second relay part 320 has a long plate shape on the left and right, and extends upward from the rear edge of the second electrode terminal part 310. In the second relay portion 320, a large number of circular flow holes 321 are formed so as to be lined up, down, left, and right in order to flow the filled resin 30 in a molten state.
第2重合部330は、左右に長い板状を有し、第2中継部320の上端縁から後方に延びる。第2重合部330には、左右方向に並ぶように6個の円形の第2開口部331が形成される。隣接する第2開口部331同士の配置間隔(ピッチ)は、隣接する第1開口部231同士の配置間隔と等しくされる。
The second overlapping portion 330 has a long plate shape on the left and right, and extends rearward from the upper edge of the second relay portion 320. Six circular second openings 331 are formed in the second overlapping portion 330 so as to be aligned in the left-right direction. The arrangement interval (pitch) between the adjacent second openings 331 is made equal to the arrangement interval between the adjacent first openings 231.
4つの第2接続端子部340は、第2重合部330の後端縁から上方に立ち上がるように形成され、その表裏面が前後方向を向く。2つの第2接続端子部340が第2重合部330の左寄りの位置に設けられ、他の2つの第2接続端子部340が第2重合部330の中央部の位置と右寄りの位置とにそれぞれ設けられる。各第2接続端子部340には、表裏を貫通する円形の取付穴341が形成される。第2接続端子部340は、取付穴341を用いたネジ止めによって、対応する外部端子(図示せず)に電気的に接続される。
The four second connection terminal portions 340 are formed so as to rise upward from the rear end edge of the second overlapping portion 330, and the front and back surfaces thereof face in the front-rear direction. Two second connection terminal portions 340 are provided at positions on the left side of the second overlapping portion 330, and the other two second connection terminal portions 340 are respectively positioned at a central portion and a position on the right side of the second overlapping portion 330. Provided. Each second connection terminal portion 340 is formed with a circular attachment hole 341 that penetrates the front and back surfaces. The second connection terminal portion 340 is electrically connected to a corresponding external terminal (not shown) by screwing using the attachment hole 341.
第1コンデンサ素子ユニット10Aが組み立てられた状態において、左端の第2接続端子部340と左端から2つ目の第2接続端子部340は、第1バスバー200における左端の第1接続端子部240と左端から2つ目の第1接続端子部240の左隣にそれぞれ配置される。また、右端の第2接続端子部340は、第1バスバー200における右端の第1接続端子部240の左隣に配置され、中央部の第2接続端子部340は、第1バスバー200における右端から2つ目の第1接続端子部240の左側に、第3バスバー600の第3接続端子部630と第4バスバー700の第4接続端子部730とが並ぶ隙間を開けて配置される。
In a state where the first capacitor element unit 10A is assembled, the second connection terminal portion 340 at the left end and the second connection terminal portion 340 second from the left end are connected to the first connection terminal portion 240 at the left end of the first bus bar 200. Arranged on the left side of the second first connection terminal 240 from the left end. Further, the second connection terminal portion 340 at the right end is arranged on the left side of the first connection terminal portion 240 at the right end in the first bus bar 200, and the second connection terminal portion 340 at the center portion is arranged from the right end in the first bus bar 200. The third connection terminal portion 630 of the third bus bar 600 and the fourth connection terminal portion 730 of the fourth bus bar 700 are arranged with a gap on the left side of the second first connection terminal portion 240.
図2および図3(a)に示すように、第5バスバー950は、たとえば、銅板により形成され、第5電極端子部951と第5副接続端子部952とを含む。第5電極端子部951には、第3コンデンサ素子910に対応する2つの電極ピン953と、第6コンデンサ素子940に対応する電極ピン954が形成される。2つの電極ピン953は、第3コンデンサ素子910の下側端面電極912に半田付け等の接合方法によって接合され、電極ピン954は、第6コンデンサ素子940の下側端面電極942に半田付け等の接合方法によって接合される。これにより、第5バスバー950の第5電極端子部951が第3コンデンサ素子910の下側端面電極912および第6コンデンサ素子940の下側端面電極942と電気的に接続される。
2 and 3A, the fifth bus bar 950 is formed of, for example, a copper plate and includes a fifth electrode terminal portion 951 and a fifth sub connection terminal portion 952. In the fifth electrode terminal portion 951, two electrode pins 953 corresponding to the third capacitor element 910 and electrode pins 954 corresponding to the sixth capacitor element 940 are formed. The two electrode pins 953 are joined to the lower end face electrode 912 of the third capacitor element 910 by a joining method such as soldering, and the electrode pins 954 are joined to the lower end face electrode 942 of the sixth capacitor element 940 such as soldering. Bonded by the bonding method. As a result, the fifth electrode terminal portion 951 of the fifth bus bar 950 is electrically connected to the lower end face electrode 912 of the third capacitor element 910 and the lower end face electrode 942 of the sixth capacitor element 940.
第1コンデンサ素子ユニット10Aが組まれた状態において、第5副接続端子部952は、第1バスバー200の第1副接続端子部250の隣に並ぶ。第5副接続端子部952には、表裏を貫通する円形の取付穴955が形成される。第5副接続端子部952は、取付穴955を用いたネジ止めによって、対応する外部端子(図示せず)に電気的に接続される。第5副接続端子部952の下部には、第5副接続端子部952と第3コンデンサ素子910の上側端面電極911との間の絶縁性を確保するため、絶縁紙956が巻かれる。
In the state where the first capacitor element unit 10A is assembled, the fifth sub connection terminal portion 952 is arranged next to the first sub connection terminal portion 250 of the first bus bar 200. The fifth sub-connecting terminal portion 952 is formed with a circular mounting hole 955 that penetrates the front and back surfaces. The fifth sub-connecting terminal portion 952 is electrically connected to a corresponding external terminal (not shown) by screwing using the mounting hole 955. Insulating paper 956 is wound around the lower portion of the fifth sub-connecting terminal portion 952 to ensure insulation between the fifth sub-connecting terminal portion 952 and the upper end face electrode 911 of the third capacitor element 910.
図2および図3(a)に示すように、第6バスバー960は、たとえば、銅板により形成される。第6バスバー960は、各第4コンデンサ素子920に対応する電極ピン961と、第5コンデンサ素子930に対応する電極ピン962と、第6コンデンサ素子940に対応する電極ピン963とを有する。電極ピン961は、各第4コンデンサ素子920の下側端面電極922に半田付け等の接合方法によって接合され、電極ピン962は、第5コンデンサ素子930の上側端面電極931に半田付け等の接合方法によって接合され、電極ピン963は、第6コンデンサ素子940の上側端面電極941に半田付け等の接合方法によって接合される。これにより、第6バスバー960は、各第4コンデンサ素子920の下側端面電極922、第5コンデンサ素子930の上側端面電極931および第6コンデンサ素子940の上側端面電極941と電気的に接続される。
2 and 3A, the sixth bus bar 960 is formed of, for example, a copper plate. The sixth bus bar 960 includes electrode pins 961 corresponding to the fourth capacitor elements 920, electrode pins 962 corresponding to the fifth capacitor elements 930, and electrode pins 963 corresponding to the sixth capacitor elements 940. The electrode pin 961 is joined to the lower end face electrode 922 of each fourth capacitor element 920 by a joining method such as soldering, and the electrode pin 962 is joined to the upper end face electrode 931 of the fifth capacitor element 930 by soldering or the like. The electrode pin 963 is bonded to the upper end surface electrode 941 of the sixth capacitor element 940 by a bonding method such as soldering. Accordingly, the sixth bus bar 960 is electrically connected to the lower end face electrode 922 of each fourth capacitor element 920, the upper end face electrode 931 of the fifth capacitor element 930, and the upper end face electrode 941 of the sixth capacitor element 940. .
第6バスバー960は、さらに、第6接続端子部964を有する。第6接続端子部964には、表裏を貫通する円形の取付穴965が形成される。第6接続端子部964は、ケース20の後面右側の取付タブ24の上面に配置される。この状態において、第6接続端子部964の取付穴965が、取付タブ24の挿通穴24aに整合する。
The sixth bus bar 960 further includes a sixth connection terminal portion 964. The sixth connection terminal portion 964 is formed with a circular attachment hole 965 penetrating the front and back. The sixth connection terminal portion 964 is disposed on the upper surface of the attachment tab 24 on the right side of the rear surface of the case 20. In this state, the attachment hole 965 of the sixth connection terminal portion 964 is aligned with the insertion hole 24 a of the attachment tab 24.
図5(a)は、本実施の形態に係る、第1絶縁板400を前方上方から見た斜視図であり、図5(b)は、本実施の形態に係る、第1絶縁板400を後方下方から見た斜視図である。
FIG. 5A is a perspective view of the first insulating plate 400 according to the present embodiment as viewed from the front upper side, and FIG. 5B is a perspective view of the first insulating plate 400 according to the present embodiment. It is the perspective view seen from the back lower part.
図5(a)および(b)に示すように、第1絶縁板400は、ポリフェニレンサルファイド、アクリル、シリコン等の絶縁性を有する樹脂材料により形成され、メインプレート部410と、前プレート部420と、後プレート部430とを含む。メインプレート部410は、横長の長方形状を有する。前プレート部420は、メインプレート部410の前端縁から下方に延び、横に細長い長方形状を有する。後プレート部430は、メインプレート部410の後端縁から上方に延び、横に細長い長方形状を有する。第1絶縁板400は、第1バスバー200の第1重合部230と第2バスバー300の第2重合部330との間に介在される。
As shown in FIGS. 5A and 5B, the first insulating plate 400 is formed of an insulating resin material such as polyphenylene sulfide, acrylic, or silicon, and includes a main plate portion 410, a front plate portion 420, And a rear plate portion 430. The main plate portion 410 has a horizontally long rectangular shape. The front plate portion 420 extends downward from the front end edge of the main plate portion 410 and has a horizontally elongated rectangular shape. The rear plate portion 430 extends upward from the rear end edge of the main plate portion 410 and has an elongated rectangular shape on the side. The first insulating plate 400 is interposed between the first overlapping portion 230 of the first bus bar 200 and the second overlapping portion 330 of the second bus bar 300.
メインプレート部410には、左右方向に並ぶように6個の円形の第3開口部411が形成される。隣接する第3開口部411同士の配置間隔(ピッチ)は、隣接する第1開口部231同士の配置間隔および隣接する第2開口部331同士の配置間隔と等しくされる。また、メインプレート部410の表面(第1重合部230に対向する面)には、第3開口部411の周囲に円環状の第1環状突起部412が形成される。第1環状突起部412の外径は、第1開口部231の内径よりも僅かに小さくされ、第1環状突起部412の高さは、第1重合部230の厚さよりも僅かに大きくされる。さらに、メインプレート部410の裏面(第2重合部330に対向する面)には、第3開口部411の周囲に円環状の第2環状突起部413が形成される。第2環状突起部413の外径は、第2開口部331の内径よりも僅かに小さくされ、第2環状突起部413の高さは、第2重合部330の厚さよりも僅かに大きくされる。
Six circular third openings 411 are formed in the main plate portion 410 so as to be arranged in the left-right direction. The arrangement interval (pitch) between the adjacent third openings 411 is equal to the arrangement interval between the adjacent first openings 231 and the arrangement interval between the adjacent second openings 331. In addition, an annular first annular protrusion 412 is formed around the third opening 411 on the surface of the main plate portion 410 (the surface facing the first overlapping portion 230). The outer diameter of the first annular protrusion 412 is slightly smaller than the inner diameter of the first opening 231, and the height of the first annular protrusion 412 is slightly larger than the thickness of the first overlapping portion 230. . Furthermore, an annular second annular protrusion 413 is formed around the third opening 411 on the back surface (the surface facing the second overlapping portion 330) of the main plate portion 410. The outer diameter of the second annular protrusion 413 is slightly smaller than the inner diameter of the second opening 331, and the height of the second annular protrusion 413 is slightly larger than the thickness of the second overlapping portion 330. .
次に、第2コンデンサ素子ユニット10Bの構成について説明する。
Next, the configuration of the second capacitor element unit 10B will be described.
第2コンデンサ素子ユニット10Bは、第2コンデンサ素子500、第3バスバー600、第4バスバー700の他に、絶縁シート970を含む。
The second capacitor element unit 10B includes an insulating sheet 970 in addition to the second capacitor element 500, the third bus bar 600, and the fourth bus bar 700.
図2および図3(b)に示すように、3個の第2コンデンサ素子500は、ケース20内において、両端面が上下方向を向くようにして、その長手方向(図2の左右方向)に配列される。第2コンデンサ素子500の構成は、第1コンデンサ素子100の構成と同様であり、その上側の端面に上側端面電極501が形成され、その下側の端面に下側端面電極502が形成される。第2コンデンサ素子500は、第1コンデンサ素子100および第3コンデンサ素子910よりも静電容量が小さくサイズが小さいが、第4コンデンサ素子920、第5コンデンサ素子930および第6コンデンサ素子940よりも静電容量が大きくサイズが大きい。
As shown in FIG. 2 and FIG. 3B, the three second capacitor elements 500 are arranged in the longitudinal direction (left-right direction in FIG. 2) in the case 20 so that both end faces are directed in the vertical direction. Arranged. The configuration of the second capacitor element 500 is the same as the configuration of the first capacitor element 100. The upper end face electrode 501 is formed on the upper end face thereof, and the lower end face electrode 502 is formed on the lower end face thereof. The second capacitor element 500 has a smaller capacitance and smaller size than the first capacitor element 100 and the third capacitor element 910, but is quieter than the fourth capacitor element 920, the fifth capacitor element 930, and the sixth capacitor element 940. Large capacity and large size.
図6(a)は、本実施の形態に係る、第3バスバー600の斜視図である。
FIG. 6A is a perspective view of the third bus bar 600 according to the present embodiment.
図2、図3(a)および図6(a)に示すように、第3バスバー600は、導電性材料、たとえば、銅板により形成され、第3電極端子部610と、第3中継部620と、第3接続端子部630とを含む。第3バスバー600は、たとえば、一枚の銅板を適宜切り抜き、折り曲げることによって形成され、これら第3電極端子部610と、第3中継部620と、第3接続端子部630とが一体となっている。
As shown in FIGS. 2, 3 (a) and 6 (a), the third bus bar 600 is formed of a conductive material, for example, a copper plate, and includes a third electrode terminal portion 610, a third relay portion 620, And the third connection terminal portion 630. The third bus bar 600 is formed by, for example, appropriately cutting and bending a single copper plate, and the third electrode terminal portion 610, the third relay portion 620, and the third connection terminal portion 630 are integrated. Yes.
第3電極端子部610は、左右に長い板状を有する。第3電極端子部610の前端縁には、6個の電極ピン611が左右方向に並ぶように形成される。第3電極端子部610は、3個の第2コンデンサ素子500の上側端面電極501に接触する。各上側端面電極501に、電極ピン611が2ずつ配置される。電極ピン611が、対応する第2コンデンサ素子500の上側端面電極501に半田付け等の接合方法によって接合される。これにより、第3バスバー600の第3電極端子部610が3個の第2コンデンサ素子500の上側端面電極501と電気的に接続される。また、第3電極端子部610には、溶融状態の充填樹脂30を流通させるため、6つの円形の流通孔612が左右方向に並ぶように形成される。
The third electrode terminal portion 610 has a long plate shape on the left and right. Six electrode pins 611 are formed on the front end edge of the third electrode terminal portion 610 so as to be arranged in the left-right direction. The third electrode terminal portion 610 contacts the upper end face electrodes 501 of the three second capacitor elements 500. Two electrode pins 611 are arranged on each upper end face electrode 501. The electrode pin 611 is joined to the upper end surface electrode 501 of the corresponding second capacitor element 500 by a joining method such as soldering. As a result, the third electrode terminal portion 610 of the third bus bar 600 is electrically connected to the upper end face electrodes 501 of the three second capacitor elements 500. In addition, six circular flow holes 612 are formed in the third electrode terminal portion 610 so as to line up in the left-right direction in order to flow the filled resin 30 in a molten state.
第3中継部620は、第3電極端子部610と第3接続端子部630との間を中継する。第3中継部620は、左右に細長い板状を有し、第3電極端子部610の後端縁から上方に延びる。
The third relay unit 620 relays between the third electrode terminal unit 610 and the third connection terminal unit 630. The third relay portion 620 has an elongated plate shape on the left and right, and extends upward from the rear end edge of the third electrode terminal portion 610.
第3接続端子部630は、第3中継部620の上端縁に形成され、その表裏面が前後方向を向く。第3接続端子部630には、表裏を貫通する円形の取付穴631が形成される。第3接続端子部630は、取付穴631を用いたネジ止めによって、対応する外部端子(図示せず)に電気的に接続される。第3接続端子部630の下部には、上部の端子部630aより幅の広い幅広部630bが形成される。
3rd connection terminal part 630 is formed in the upper end edge of the 3rd relay part 620, and the front and back turns to the front-back direction. The third connection terminal portion 630 is formed with a circular attachment hole 631 penetrating the front and back. The third connection terminal portion 630 is electrically connected to a corresponding external terminal (not shown) by screwing using the attachment hole 631. A wide portion 630b having a width wider than that of the upper terminal portion 630a is formed below the third connection terminal portion 630.
図6(b)は、本実施の形態に係る、第4バスバー700および絶縁シート970の斜視図である。
FIG. 6B is a perspective view of the fourth bus bar 700 and the insulating sheet 970 according to the present embodiment.
図2、図3(a)および図6(b)に示すように、第4バスバー700は、導電性材料、たとえば、銅板により形成され、第4電極端子部710と、第4中継部720と、第4接続端子部730とを含む。第4バスバー700は、たとえば、一枚の銅板を適宜切り抜き、折り曲げることによって形成され、これら第4電極端子部710と、第4中継部720と、第4接続端子部730とが一体となっている。
As shown in FIGS. 2, 3A and 6B, the fourth bus bar 700 is formed of a conductive material, for example, a copper plate, and includes a fourth electrode terminal portion 710, a fourth relay portion 720, and the like. And a fourth connection terminal portion 730. For example, the fourth bus bar 700 is formed by appropriately cutting and bending a single copper plate, and the fourth electrode terminal portion 710, the fourth relay portion 720, and the fourth connection terminal portion 730 are integrated. Yes.
第4電極端子部710は、左右に長い板状を有する。第4電極端子部710の左端縁と前端縁の間の角部には、左端の第2コンデンサ素子500に対応する2つの電極ピン711が形成される。また、第4電極端子部710の右端縁と前端縁の間の角部には、右端の第2コンデンサ素子500に対応する2つの電極ピン711が形成される。さらに、第4電極端子部710の前端縁の中央部には、中央の第2コンデンサ素子500に対応する2つの電極ピン711が形成される。第4電極端子部710は、3個の第2コンデンサ素子500の下側端面電極502に接触する。各下側端面電極502に、電極ピン711が2ずつ配置される。電極ピン711が、対応する第2コンデンサ素子500の下側端面電極502に半田付け等の接合方法によって接合される。これにより、第4バスバー700の第4電極端子部710が3個の第2コンデンサ素子500の下側端面電極502と電気的に接続される。
The fourth electrode terminal portion 710 has a long plate shape on the left and right. Two electrode pins 711 corresponding to the second capacitor element 500 at the left end are formed at the corner between the left end edge and the front end edge of the fourth electrode terminal portion 710. Further, two electrode pins 711 corresponding to the second capacitor element 500 at the right end are formed at the corner between the right end edge and the front end edge of the fourth electrode terminal portion 710. Further, two electrode pins 711 corresponding to the central second capacitor element 500 are formed at the central portion of the front edge of the fourth electrode terminal portion 710. The fourth electrode terminal portion 710 is in contact with the lower end surface electrodes 502 of the three second capacitor elements 500. Two electrode pins 711 are arranged on each lower end face electrode 502. The electrode pin 711 is joined to the lower end face electrode 502 of the corresponding second capacitor element 500 by a joining method such as soldering. As a result, the fourth electrode terminal portion 710 of the fourth bus bar 700 is electrically connected to the lower end surface electrodes 502 of the three second capacitor elements 500.
第4中継部720は、第4電極端子部710と第4接続端子部730との間を中継する。第4中継部720は、ほぼ台形の板状を有し、第4電極端子部710の後端縁から上方に延びる。第4中継部720には、溶融状態の充填樹脂30を流通させるため、6個の円形の流通孔721が上下左右方向に並ぶように形成される。
The fourth relay unit 720 relays between the fourth electrode terminal unit 710 and the fourth connection terminal unit 730. The fourth relay portion 720 has a substantially trapezoidal plate shape, and extends upward from the rear end edge of the fourth electrode terminal portion 710. In the fourth relay portion 720, six circular flow holes 721 are formed so as to be aligned in the vertical and horizontal directions in order to distribute the filled resin 30 in a molten state.
第4接続端子部730は、第4中継部720の上端縁に形成され、その表裏面が前後方向を向く。第4接続端子部730には、表裏を貫通する円形の取付穴731が形成される。第4接続端子部730は、取付穴731を用いたネジ止めによって、対応する外部端子(図示せず)に電気的に接続される。第4接続端子部730の下部には、上部の端子部730aより幅の広い幅広部730bが形成される。
The fourth connection terminal portion 730 is formed at the upper end edge of the fourth relay portion 720, and the front and back surfaces thereof are directed in the front-rear direction. The fourth connection terminal portion 730 is formed with a circular attachment hole 731 penetrating the front and back. The fourth connection terminal portion 730 is electrically connected to a corresponding external terminal (not shown) by screwing using the attachment hole 731. A wide portion 730b having a width wider than that of the upper terminal portion 730a is formed below the fourth connection terminal portion 730.
第2コンデンサ素子ユニット10Bが組み立てられた状態において、第3接続端子部630の端子部630aと第4接続端子部730の端子部730aとが左右方向に並ぶ。また、第3接続端子部630の幅広部630bと第4接続端子部730の幅広部730bとが前後方向に重なる。これら幅広部630b、730b同士の重なりにより、第2コンデンサ素子ユニット10BにおけるESL(等価直列インダクタンス)の低減が期待される。さらに、図1(a)に示すように、フィルムコンデンサ1が完成した状態において、右端から2つ目の第1接続端子部240と中央部の第2接続端子部340との間に、第3接続端子部630と第4接続端子部730とが配置される。
In the state where the second capacitor element unit 10B is assembled, the terminal portion 630a of the third connection terminal portion 630 and the terminal portion 730a of the fourth connection terminal portion 730 are arranged in the left-right direction. Moreover, the wide part 630b of the 3rd connection terminal part 630 and the wide part 730b of the 4th connection terminal part 730 overlap in the front-back direction. Reduction of ESL (equivalent series inductance) in the second capacitor element unit 10B is expected due to the overlapping of the wide portions 630b and 730b. Further, as shown in FIG. 1A, in a state where the film capacitor 1 is completed, a third capacitor terminal is formed between the second connection terminal part 340 at the second part from the second first connection terminal part 240 from the right end. The connection terminal part 630 and the fourth connection terminal part 730 are arranged.
絶縁シート970は、絶縁紙やアクリル、シリコン等の絶縁性を有する樹脂材料により形成される。絶縁シート970は、ほぼ横長の長方形状を有し、第4バスバー700の形状に合うように、その中央部が、後方に一旦折り曲げられた後下方に折り曲げられている。図6(b)の破線に示すように、絶縁シート970は、第4中継部720の上部と第4接続端子部730の幅広部730bとに跨がるように第4バスバー700に貼り付けられる。第3接続端子部630の幅広部630bと第4接続端子部730の幅広部730bとの間が、絶縁シート970により絶縁される。
The insulating sheet 970 is formed of an insulating resin material such as insulating paper, acrylic, or silicon. The insulating sheet 970 has a substantially horizontally long rectangular shape, and its central portion is once bent backward and then bent downward so as to match the shape of the fourth bus bar 700. 6B, the insulating sheet 970 is attached to the fourth bus bar 700 so as to straddle the upper portion of the fourth relay portion 720 and the wide portion 730b of the fourth connection terminal portion 730. . The insulating sheet 970 insulates between the wide portion 630 b of the third connection terminal portion 630 and the wide portion 730 b of the fourth connection terminal portion 730.
次に、第2絶縁板800の構成について説明する。
Next, the configuration of the second insulating plate 800 will be described.
図2(a)に示すように、第2絶縁板800は、ポリフェニレンサルファイド、アクリル、シリコン等の絶縁性を有する樹脂材料により形成され、メインプレート部810と、前プレート部820と、左プレート部830と、右プレート部840と、後プレート部850とを含む。メインプレート部810は、横長の長方形状を有する。前プレート部820、左プレート部830および右プレート部840は、それぞれ、メインプレート部810の前端縁、左端縁および右端縁から下方に延び、横に細長い長方形状を有する。後プレート部850は、メインプレート部810の後端縁から上方に延び、横に細長い長方形状を有する。
As shown in FIG. 2 (a), the second insulating plate 800 is formed of an insulating resin material such as polyphenylene sulfide, acrylic, silicon, etc., and includes a main plate portion 810, a front plate portion 820, and a left plate portion. 830, a right plate portion 840, and a rear plate portion 850. The main plate portion 810 has a horizontally long rectangular shape. The front plate portion 820, the left plate portion 830, and the right plate portion 840 extend downward from the front end edge, the left end edge, and the right end edge of the main plate portion 810, respectively, and have a horizontally elongated rectangular shape. The rear plate portion 850 extends upward from the rear end edge of the main plate portion 810 and has a rectangular shape that is elongated horizontally.
第2絶縁板800は、前プレート部820、左プレート部830および右プレート部840の内面が左右方向に並ぶ3個のコンデンサにほぼ接し、これによって、3個の第2コンデンサ素子500に対する第2絶縁板800の位置決めがなされる。
The second insulating plate 800 is substantially in contact with the three capacitors in which the inner surfaces of the front plate portion 820, the left plate portion 830, and the right plate portion 840 are arranged in the left-right direction. The insulating plate 800 is positioned.
メインプレート部810には、左右方向に並ぶように6個の円形の第4開口部811が形成される。隣接する第4開口部811同士の配置間隔(ピッチ)は、第1絶縁板400における隣接する第3開口部411同士の配置間隔および第3バスバー600における隣接する電極ピン611同士の配置間隔と等しくされる。また、メインプレート部810の表面(第2重合部330に対向する面)には、第4開口部811の周囲に円環状の嵌合突起部812が形成される。嵌合突起部812の外径は、第3開口部411の内径より僅かに小さくされる。嵌合突起部812の高さは、第2重合部330の厚さと第1絶縁板400のメインプレート部410の厚さとを合わせた厚さよりも大きくされる。
In the main plate portion 810, six circular fourth openings 811 are formed so as to be aligned in the left-right direction. The arrangement interval (pitch) between the adjacent fourth openings 811 is equal to the arrangement interval between the adjacent third openings 411 in the first insulating plate 400 and the arrangement interval between the adjacent electrode pins 611 in the third bus bar 600. Is done. An annular fitting protrusion 812 is formed around the fourth opening 811 on the surface of the main plate portion 810 (the surface facing the second overlapping portion 330). The outer diameter of the fitting protrusion 812 is slightly smaller than the inner diameter of the third opening 411. The height of the fitting protrusion 812 is made larger than the total thickness of the second overlapping portion 330 and the thickness of the main plate portion 410 of the first insulating plate 400.
次に、ケース20の構成について説明する。
Next, the configuration of the case 20 will be described.
図7は、本実施の形態に係る、ケース20を後方上方から見た斜視図である。
FIG. 7 is a perspective view of the case 20 as viewed from the upper rear side according to the present embodiment.
図2および図7に示すように、ケース20は、ポリフェニレンサルファイド等の樹脂材料により形成される。ケース20は、左右に長いほぼ直方体ではあるが後側の中央部が後方にやや張り出した形状の箱状に形成され、上面が開口面20aとして開放する。ケース20における後方へ張出す領域が、第2コンデンサ素子ユニット10Bの配置領域とされる。ケース20内には、コンデンサ素子100、500、910、920、930、940が配置されていないスペースに、このスペースを埋めることで充填樹脂30の量を低減させるために、第1スペーサ部21、第2スペーサ部22および第3スペーサ部23が設けられる。また、ケース20の外側には、前面の4か所と後面の3か所に取付タブ24が形成される。各取付タブ24には、上下に貫通する挿通穴24aが形成される。挿通穴24aには、穴の強度を上げるために金属製のカラー25が嵌め込まれる。フィルムコンデンサ1が外部機器の設置部に設置される際、これら取付タブ24がネジ等によって設置部に固定される。
As shown in FIGS. 2 and 7, the case 20 is formed of a resin material such as polyphenylene sulfide. Although the case 20 is a substantially rectangular parallelepiped that is long on the left and right, the case 20 is formed in a box shape with a rear center portion slightly protruding rearward, and the upper surface opens as an opening surface 20a. A region projecting rearward in the case 20 is an arrangement region of the second capacitor element unit 10B. In the case 20, in order to reduce the amount of the filling resin 30 by filling this space in a space where the capacitor elements 100, 500, 910, 920, 930, 940 are not disposed, A second spacer portion 22 and a third spacer portion 23 are provided. Further, mounting tabs 24 are formed on the outside of the case 20 at four locations on the front surface and three locations on the rear surface. Each mounting tab 24 is formed with an insertion hole 24a penetrating vertically. A metal collar 25 is fitted into the insertion hole 24a in order to increase the strength of the hole. When the film capacitor 1 is installed in the installation part of the external device, these mounting tabs 24 are fixed to the installation part with screws or the like.
図8は、本実施の形態に係る、図1(b)のA-A´線の位置で切断したフィルムコンデンサ1の左側面断面図である。図8には、充填樹脂30の上面位置が一点鎖線で示されている。
FIG. 8 is a left side cross-sectional view of the film capacitor 1 cut along the line AA ′ in FIG. 1B according to the present embodiment. In FIG. 8, the upper surface position of the filling resin 30 is indicated by a one-dot chain line.
図8に示すように、ケース20内では、第1バスバー200の第1重合部230と第2バスバー300の第2重合部330とが、上下方向、即ちケース20の開口面20aの法線方向において5個の第1コンデンサ素子100から外れた位置で、第1絶縁板400を介して上下方向に重ね合される。これにより、第1コンデンサ素子ユニット10AにおけるESL(等価直列インダクタンス)を低減させることができる。また、第1絶縁板400により、第1重合部230と第2重合部330間が絶縁される。
As shown in FIG. 8, in the case 20, the first overlapping portion 230 of the first bus bar 200 and the second overlapping portion 330 of the second bus bar 300 are in the vertical direction, that is, the normal direction of the opening surface 20 a of the case 20. In FIG. 5, the first capacitor plate 100 is overlapped in the vertical direction via the first insulating plate 400 at a position away from the five first capacitor elements 100. Thereby, ESL (equivalent series inductance) in the first capacitor element unit 10A can be reduced. In addition, the first overlapping portion 230 and the second overlapping portion 330 are insulated by the first insulating plate 400.
ここで、第1絶縁板400のメインプレート部410の表面に形成された第1環状突起部412が、第1バスバー200の第1重合部230に形成された第1開口部231に嵌り込む。また、第1絶縁板400のメインプレート部410の裏面に形成された第2環状突起部413が、第2バスバー300の第2重合部330に形成された第2開口部331に嵌り込む。これにより、第1絶縁板400に対して第1バスバー200および第2バスバー300が前後左右方向に位置決めされ、前後左右方向に動きにくくなる。また、第3開口部411の周縁と第1開口部231の周縁との間に存在する第1環状突起部412と第3開口部411の周縁と第2開口部331の周縁との間に存在する第2環状突起部413とによって、第3開口部411を通じた第1重合部230と第2重合部330との間の沿面距離を、これら第1環状突起部412と第2環状突起部413の表面の分だけ長くでき、第1バスバー200と第2バスバー300との間の絶縁性を高めることができる。
Here, the first annular protrusion 412 formed on the surface of the main plate portion 410 of the first insulating plate 400 fits into the first opening 231 formed in the first overlapping portion 230 of the first bus bar 200. Further, the second annular protrusion 413 formed on the back surface of the main plate portion 410 of the first insulating plate 400 is fitted into the second opening 331 formed in the second overlapping portion 330 of the second bus bar 300. Accordingly, the first bus bar 200 and the second bus bar 300 are positioned in the front-rear and left-right directions with respect to the first insulating plate 400, and are difficult to move in the front-rear and left-right directions. Moreover, it exists between the periphery of the 1st cyclic | annular protrusion part 412 and the 3rd opening part 411 which exist between the periphery of the 3rd opening part 411, and the periphery of the 1st opening part 231, and the periphery of the 2nd opening part 331. And the second annular protrusion 413, the creeping distance between the first overlapping part 230 and the second overlapping part 330 through the third opening 411 is set to the first annular protruding part 412 and the second annular protruding part 413. Therefore, the insulation between the first bus bar 200 and the second bus bar 300 can be improved.
さらに、ケース20内では、重ね合わされた第1重合部230および第2重合部330の真下の位置、即ち、上下方向において第1重合部230および第2重合部330と重なる位置に、第2コンデンサ素子ユニット10Bの3個の第2コンデンサ素子500が配置される。そして、第2重合部330と、これに重なる第3バスバー600の第3電極端子部610との間に第2絶縁板800が介在され、これら第2重合部330と第3電極端子部610との間が絶縁される。このように、本実施の形態では、第1重合部230および第2重合部330とケース20の底面との間にできるスペースを、第2コンデンサ素子500の配置領域として有効利用することができる。
Further, in the case 20, the second capacitor is located at a position directly below the superimposed first overlapping portion 230 and second overlapping portion 330, that is, at a position overlapping the first overlapping portion 230 and the second overlapping portion 330 in the vertical direction. Three second capacitor elements 500 of the element unit 10B are arranged. A second insulating plate 800 is interposed between the second overlapping portion 330 and the third electrode terminal portion 610 of the third bus bar 600 that overlaps the second overlapping portion 330. The second overlapping portion 330, the third electrode terminal portion 610, Is insulated. As described above, in the present embodiment, the space formed between the first overlapping portion 230 and the second overlapping portion 330 and the bottom surface of the case 20 can be effectively used as the arrangement region of the second capacitor element 500.
さらに、第2絶縁板800の嵌合突起部812は、第1絶縁板400の第3開口部411に嵌め込まれる。これにより、第1絶縁板400に対して第2絶縁板800が前後左右方向に位置決めされ、前後左右方向に動きにくくなる。
Furthermore, the fitting protrusion 812 of the second insulating plate 800 is fitted into the third opening 411 of the first insulating plate 400. Thereby, the 2nd insulating board 800 is positioned with respect to the 1st insulating board 400 in the front-back, left-right direction, and becomes difficult to move to the front-back, left-right direction.
さらに、嵌合突起部812が第3開口部411に嵌め込まれることにより、第1開口部231、第2開口部331、第3開口部411および第4開口部811が上下方向に重なる。第3電極端子部610の各電極ピン611は、第2絶縁板800のメインプレート部810の各第4開口部811内に位置しており、第1開口部231、第2開口部331、第3開口部411および第4開口部811の重なりによってできる連通路Pを通じて第1バスバー200の上方に露出している。これにより、連通路Pを通じて、各電極ピン611とそれに対応する第2コンデンサ素子500の上側端面電極501との間の半田付け等による接合が可能となる。よって、第1コンデンサ素子ユニット10Aと第2コンデンサ素子ユニット10Bとが組み合わされた状態において、第2コンデンサ素子ユニット10Bでの各電極ピン611とそれに対応する第2コンデンサ素子500の上側端面電極501との接合を、第1コンデンサ素子ユニット10Aでの第1バスバー200の各電極ピン211とそれに対応する第1コンデンサ素子100の上側端面電極101との接合などと共に、一度期に行うことが可能となる。また、各電極ピン611に盛られた半田など接合剤Sが、連通路P内に収容されるため、第2絶縁板800と第3電極端子部610との間に、盛られた接合剤Sの分の隙間を設ける必要がなくなる。さらに、溶融した充填樹脂30をケース20内に注入する際、注入された充填樹脂30が、連通路Pを通ることにより、第2絶縁板800の下にある第2コンデンサ素子500の部分に行き渡りやすくなる。
Furthermore, when the fitting protrusion 812 is fitted into the third opening 411, the first opening 231, the second opening 331, the third opening 411, and the fourth opening 811 overlap in the vertical direction. Each electrode pin 611 of the third electrode terminal portion 610 is located in each fourth opening portion 811 of the main plate portion 810 of the second insulating plate 800, and includes a first opening portion 231, a second opening portion 331, It is exposed above the first bus bar 200 through the communication path P formed by the overlap of the third opening 411 and the fourth opening 811. Thereby, it is possible to join each electrode pin 611 and the corresponding upper end electrode 501 of the second capacitor element 500 by soldering or the like through the communication path P. Therefore, in the state where the first capacitor element unit 10A and the second capacitor element unit 10B are combined, each electrode pin 611 in the second capacitor element unit 10B and the corresponding upper end face electrode 501 of the second capacitor element 500, The first capacitor element unit 10A can be joined to each electrode pin 211 of the first bus bar 200 and the corresponding upper end face electrode 101 of the first capacitor element 100 at a time. . Further, since the bonding agent S such as solder accumulated on each electrode pin 611 is accommodated in the communication path P, the bonding agent S accumulated between the second insulating plate 800 and the third electrode terminal portion 610. It is no longer necessary to provide a gap corresponding to. Further, when the molten filling resin 30 is injected into the case 20, the injected filling resin 30 passes through the communication path P and reaches the portion of the second capacitor element 500 under the second insulating plate 800. It becomes easy.
なお、第1絶縁板400の前プレート部420は、第2バスバー300の第2中継部320と第1コンデンサ素子100の周面との間に介在される。これにより、第2バスバー300の第2中継部320と第1コンデンサ素子100の上側端面電極101との間の沿面距離を長くすることができる。また、第2絶縁板800の前プレート部820は、第2バスバー300の第2中継部320と第2コンデンサ素子500の周面との間に介在される。これにより、第2バスバー300の第2中継部320と第2コンデンサ素子500の上側端面電極501との間の沿面距離を長くすることができる。さらに、絶縁シート970の下部は、第4バスバー700の第4中継部720と第2コンデンサ素子500の周面との間に介在される。これにより、第4バスバー700の第4中継部720と第2コンデンサ素子500の上側端面電極501との間の沿面距離が長くすることができる。
Note that the front plate portion 420 of the first insulating plate 400 is interposed between the second relay portion 320 of the second bus bar 300 and the peripheral surface of the first capacitor element 100. Thereby, the creeping distance between the second relay part 320 of the second bus bar 300 and the upper end face electrode 101 of the first capacitor element 100 can be increased. Further, the front plate part 820 of the second insulating plate 800 is interposed between the second relay part 320 of the second bus bar 300 and the peripheral surface of the second capacitor element 500. Thereby, the creeping distance between the second relay part 320 of the second bus bar 300 and the upper end face electrode 501 of the second capacitor element 500 can be increased. Further, the lower part of the insulating sheet 970 is interposed between the fourth relay portion 720 of the fourth bus bar 700 and the peripheral surface of the second capacitor element 500. Thereby, the creeping distance between the fourth relay part 720 of the fourth bus bar 700 and the upper end face electrode 501 of the second capacitor element 500 can be increased.
<実施の形態の効果>
以上、本実施の形態によれば、以下の効果が奏される。 <Effect of Embodiment>
As described above, according to the present embodiment, the following effects are exhibited.
以上、本実施の形態によれば、以下の効果が奏される。 <Effect of Embodiment>
As described above, according to the present embodiment, the following effects are exhibited.
第1バスバー200および第2バスバー300に、それぞれ、互いに重なり合う第1重合部230および第2重合部330が設けられているので、第1コンデンサ素子ユニット10AでのESLを低減させることができる。
Since the first bus bar 200 and the second bus bar 300 are provided with the first overlapping portion 230 and the second overlapping portion 330, respectively, the ESL in the first capacitor element unit 10A can be reduced.
また、第1重合部230および第2重合部330とケース20の底面との間にできるスペースを、第2コンデンサ素子500の配置領域として有効利用することができるので、第1コンデンサ素子ユニット10Aと第2コンデンサ素子ユニット10Bとを1つのケース20に収容した場合に、ケース20のサイズをコンパクトにできる。これにより、フィルムコンデンサ1のサイズをコンパクトにできる。
Further, since the space formed between the first overlapping portion 230 and the second overlapping portion 330 and the bottom surface of the case 20 can be effectively used as the arrangement region of the second capacitor element 500, the first capacitor element unit 10A and When the second capacitor element unit 10B is accommodated in one case 20, the size of the case 20 can be made compact. Thereby, the size of the film capacitor 1 can be made compact.
さらに、第3バスバー600の各電極ピン611が、第2絶縁板800の各第4開口部811内に位置し、第1開口部231、第2開口部331、第3開口部411および第4開口部811の重なりによってできる連通路Pを通じて第1バスバー200の上方に露出するので、連通路Pを通じて、各電極ピン611と各第2コンデンサ素子500の上側端面電極501との接合が可能となる。これにより、第2コンデンサ素子ユニット10Bでの各電極ピン611と各第2コンデンサ素子500の上側端面電極501との接合を、第1コンデンサ素子ユニット10Aでの第1バスバー200の各電極ピン211と各第1コンデンサ素子100の上側端面電極101との接合などと共に、一度期に行うことが可能となる。
Further, each electrode pin 611 of the third bus bar 600 is positioned in each fourth opening 811 of the second insulating plate 800, and the first opening 231, the second opening 331, the third opening 411, and the fourth opening 811. Since the first bus bar 200 is exposed through the communication path P formed by the overlapping of the openings 811, the electrode pins 611 and the upper end surface electrodes 501 of the second capacitor elements 500 can be joined through the communication path P. . As a result, each electrode pin 611 in the second capacitor element unit 10B and the upper end surface electrode 501 of each second capacitor element 500 are joined to each electrode pin 211 of the first bus bar 200 in the first capacitor element unit 10A. It can be performed once, together with bonding to the upper end face electrode 101 of each first capacitor element 100.
さらに、第3バスバー600の各電極ピン611に盛られた半田など接合剤Sが連通路P内に収容されるため、第2絶縁板800と第3電極端子部610との間に、盛られた接合剤Sの分の隙間を設けなくて済む。これにより、第3電極端子部610に重なる第2バスバー300の第2重合部330および第1バスバー200の第1重合部230のケース20の底面からの高さが抑えられるので、ケース20の高さが高くなるのを抑えられる。
Further, since the bonding agent S such as solder accumulated on each electrode pin 611 of the third bus bar 600 is accommodated in the communication path P, it is accumulated between the second insulating plate 800 and the third electrode terminal portion 610. It is not necessary to provide a gap for the bonding agent S. Thereby, since the height from the bottom surface of the case 20 of the second overlapping portion 330 of the second bus bar 300 and the first overlapping portion 230 of the first bus bar 200 overlapping the third electrode terminal portion 610 is suppressed, Can be prevented from becoming high.
さらに、第2絶縁板800には、第1絶縁板400の第3開口部411に嵌め込まれる嵌合突起部812が設けられているので、第1絶縁板400に対して第2絶縁板800を前後左右方向に位置決めすることができ、第2絶縁板800が前後左右方向に動きにくくなる。
Further, since the second insulating plate 800 is provided with a fitting projection 812 that is fitted into the third opening 411 of the first insulating plate 400, the second insulating plate 800 is attached to the first insulating plate 400. Positioning can be performed in the front-rear and left-right directions, and the second insulating plate 800 is less likely to move in the front-rear and left-right directions.
さらに、第3開口部411の周縁と第1開口部231の周縁との間に存在する第1環状突起部412によって、第3開口部411を通じた第1重合部230と第2重合部330との間の沿面距離を長くできるので、第1バスバー200と第2バスバー300との間の絶縁性を高めることができる。同様に、第3開口部411の周縁と第2開口部331の周縁との間に存在する第2環状突起部413によっても、第3開口部411を通じた第1重合部230と第2重合部330との間の沿面距離を長くできるので、第1バスバー200と第2バスバー300との間の絶縁性を高めることができる。
Further, the first overlapping portion 230 and the second overlapping portion 330 through the third opening 411 are formed by the first annular protrusion 412 existing between the periphery of the third opening 411 and the periphery of the first opening 231. The creepage distance between the first bus bar 200 and the second bus bar 300 can be increased. Similarly, the first overlapping portion 230 and the second overlapping portion through the third opening 411 are also caused by the second annular protrusion 413 existing between the periphery of the third opening 411 and the periphery of the second opening 331. Since the creepage distance between the first bus bar 200 and the second bus bar 300 can be increased, the creeping distance between the first bus bar 200 and the second bus bar 300 can be increased.
<変更例>
以上、本発明の実施の形態について説明したが、本発明は、上記実施の形態に限定されるものではなく、また、本発明の適用例も、上記実施の形態の他に、種々の変更が可能である。 <Example of change>
The embodiment of the present invention has been described above, but the present invention is not limited to the above embodiment, and the application example of the present invention can be modified in various ways in addition to the above embodiment. Is possible.
以上、本発明の実施の形態について説明したが、本発明は、上記実施の形態に限定されるものではなく、また、本発明の適用例も、上記実施の形態の他に、種々の変更が可能である。 <Example of change>
The embodiment of the present invention has been described above, but the present invention is not limited to the above embodiment, and the application example of the present invention can be modified in various ways in addition to the above embodiment. Is possible.
たとえば、上記実施の形態では、第1絶縁板400のメインプレート部410において、その表面の第3開口部411の周囲に第1環状突起部412が形成され、その裏面の第3開口部411の周囲に第2環状突起部413が形成された。しかしながら、第3開口部411を通じた第1バスバー200の第1重合部230と第2バスバー300の第2重合部330との間の沿面距離が適正に確保できるのであれば、図9(a)のように、第2環状突起部413が設けられない構成が採られてもよく、あるいは、図9(b)のように、第1環状突起部412が設けられない構成が採られてもよい。さらには、図9(c)のように、第1環状突起部412と第2環状突起部413の双方が設けられない構成が採られてもよい。図9(a)の構成とされる場合、第2バスバー300の第2開口部331の内径が第2絶縁板800の嵌合突起部812の外径よりも僅かに大きくされることで、第2バスバー300が第2絶縁板800に対して位置決めされる。また、図9(b)の構成とされる場合、第1バスバー200の第1開口部231の内径が嵌合突起部812の外径よりも僅かに大きくされることで、第1バスバー200が第2絶縁板800に対して位置決めされる。さらに、図9(c)の構成とされる場合、第1開口部231の内径および第2開口部331の内径が嵌合突起部812の外径よりも僅かに大きくされることで、第1バスバー200および第2バスバー300が第2絶縁板800に対して位置決めされる。
For example, in the above embodiment, in the main plate portion 410 of the first insulating plate 400, the first annular protrusion 412 is formed around the third opening 411 on the front surface, and the third opening 411 on the back surface is formed. A second annular protrusion 413 was formed around the periphery. However, if the creepage distance between the first overlapping portion 230 of the first bus bar 200 and the second overlapping portion 330 of the second bus bar 300 through the third opening 411 can be appropriately secured, FIG. Thus, a configuration in which the second annular protrusion 413 is not provided may be employed, or a configuration in which the first annular protrusion 412 is not provided as illustrated in FIG. 9B may be employed. . Further, as shown in FIG. 9C, a configuration in which both the first annular protrusion 412 and the second annular protrusion 413 are not provided may be employed. In the case of the configuration of FIG. 9A, the inner diameter of the second opening 331 of the second bus bar 300 is slightly larger than the outer diameter of the fitting protrusion 812 of the second insulating plate 800. The two bus bars 300 are positioned with respect to the second insulating plate 800. 9B, the first bus bar 200 is configured such that the inner diameter of the first opening 231 of the first bus bar 200 is slightly larger than the outer diameter of the fitting protrusion 812. Positioned with respect to the second insulating plate 800. Furthermore, in the case of the configuration of FIG. 9C, the inner diameter of the first opening 231 and the inner diameter of the second opening 331 are slightly larger than the outer diameter of the fitting protrusion 812, thereby The bus bar 200 and the second bus bar 300 are positioned with respect to the second insulating plate 800.
また、上記実施の形態では、第1コンデンサ素子ユニット10Aに、第3コンデンサ素子910、第4コンデンサ素子920、第5コンデンサ素子930および第6コンデンサ素子940が含まれる構成とされたが、第1コンデンサ素子ユニット10Aに、これらコンデンサ素子910、920、930、940のうち少なくとも1つが含まれなくてもよい。この場合、第1コンデンサ素子ユニット10Aに、第5バスバー950や第6バスバー960が含まれなくなる場合があり、第1バスバー200に、第1副電極端子部220や第1副接続端子部250が設けられなくなる場合がある。
In the above embodiment, the first capacitor element unit 10A includes the third capacitor element 910, the fourth capacitor element 920, the fifth capacitor element 930, and the sixth capacitor element 940. The capacitor element unit 10A may not include at least one of the capacitor elements 910, 920, 930, and 940. In this case, the first capacitor element unit 10A may not include the fifth bus bar 950 and the sixth bus bar 960, and the first bus bar 200 includes the first sub electrode terminal portion 220 and the first sub connection terminal portion 250. It may not be provided.
さらに、上記実施の形態では、第1コンデンサ素子ユニット10Aに5個の第1コンデンサ素子100が含まれ、第2コンデンサ素子ユニット10Bに3個の第2コンデンサ素子500が含まれた。しかしながら、第1コンデンサ素子100および第2コンデンサ素子500の個数は、1個である場合も含めて、適宜、変更することができる。同様に、第3コンデンサ素子910、第4コンデンサ素子920、第5コンデンサ素子930および第6コンデンサ素子940の個数についても、適宜、変更されてよい。
Furthermore, in the above embodiment, five first capacitor elements 100 are included in the first capacitor element unit 10A, and three second capacitor elements 500 are included in the second capacitor element unit 10B. However, the number of the first capacitor elements 100 and the second capacitor elements 500 can be appropriately changed including the case where the number is one. Similarly, the numbers of the third capacitor element 910, the fourth capacitor element 920, the fifth capacitor element 930, and the sixth capacitor element 940 may be changed as appropriate.
さらに、上記実施の形態では、第1コンデンサ素子100、第2コンデンサ素子500、第3コンデンサ素子910、第4コンデンサ素子920、第5コンデンサ素子930および第6コンデンサ素子940は、これらの両端面が、上下方向、即ち、ケース20の開口面20aの法線方向を向くようにケース20内に配置された。しかしながら、これらコンデンサ素子100、500、910、920、930、940は、これらの両端面が、前後方向、即ち、法線方向と直交する方向を向くようにケース20内に配置されてもよい。
Further, in the above embodiment, the first capacitor element 100, the second capacitor element 500, the third capacitor element 910, the fourth capacitor element 920, the fifth capacitor element 930, and the sixth capacitor element 940 have both end faces. It was arranged in the case 20 so as to face the vertical direction, that is, the normal direction of the opening 20a of the case 20. However, the capacitor elements 100, 500, 910, 920, 930, and 940 may be disposed in the case 20 so that their both end faces face in the front-rear direction, that is, the direction orthogonal to the normal direction.
さらに、上記実施の形態では、第1コンデンサ素子100、第2コンデンサ素子500、第3コンデンサ素子910、第4コンデンサ素子920、第5コンデンサ素子930および第6コンデンサ素子940は、誘電体フィルム上にアルミニウムを蒸着させた2枚の金属化フィルムを重ね、重ねた金属化フィルムを巻回または積層することで形成されたものであるが、これ以外にも、誘電体フィルムの両面にアルミニウムを蒸着させた金属化フィルムと絶縁フィルムとを重ね、これを巻回または積層することにより、これらコンデンサ素子100、500、910、920、930、940が形成されてもよい。
Furthermore, in the above embodiment, the first capacitor element 100, the second capacitor element 500, the third capacitor element 910, the fourth capacitor element 920, the fifth capacitor element 930, and the sixth capacitor element 940 are formed on the dielectric film. It is formed by stacking two metallized films deposited with aluminum and winding or laminating the stacked metallized films. In addition to this, aluminum is deposited on both sides of the dielectric film. The capacitor elements 100, 500, 910, 920, 930, and 940 may be formed by overlapping a metallized film and an insulating film and winding or laminating them.
さらに、上記実施の形態では、第3バスバー600の第3電極端子部610に6個と電極ピン611が形成され、これに合わせて、第1バスバー200、第2バスバー300、第1絶縁板400および第2絶縁板800に、それぞれ、6個の第1開口部231、第2開口部331、第3開口部411および第4開口部811が形成された。しかしながら、電極ピン611の個数は、第2コンデンサ素子500の個数などに応じて、適宜、変更することができ、これに合わせて、第1開口部231、第2開口部331、第3開口部411および第4開口部811の個数も変更される。
Furthermore, in the above-described embodiment, six electrode pins 611 and six electrode pins 611 are formed in the third electrode terminal portion 610 of the third bus bar 600, and the first bus bar 200, the second bus bar 300, and the first insulating plate 400 are accordingly formed. In addition, six first openings 231, second openings 331, third openings 411, and fourth openings 811 are formed in the second insulating plate 800, respectively. However, the number of electrode pins 611 can be appropriately changed according to the number of second capacitor elements 500 and the like, and accordingly, the first opening 231, the second opening 331, and the third opening The number of 411 and the fourth opening 811 is also changed.
さらに、上記実施の形態では、本発明のコンデンサの一例として、フィルムコンデンサ1が挙げられた。しかしながら、本発明は、フィルムコンデンサ1以外のコンデンサに適用することもできる。
Furthermore, in the said embodiment, the film capacitor 1 was mentioned as an example of the capacitor | condenser of this invention. However, the present invention can also be applied to capacitors other than the film capacitor 1.
この他、本発明の実施の形態は、特許請求の範囲に示された技術的思想の範囲内において、適宜、種々の変更が可能である。
In addition, the embodiment of the present invention can be variously modified as appropriate within the scope of the technical idea shown in the claims.
なお、上記実施の形態の説明において「上方」「下方」等の方向を示す用語は、構成部材の相対的な位置関係にのみ依存する相対的な方向を示すものであり、鉛直方向、水平方向等の絶対的な方向を示すものではない。
In the description of the above embodiment, the terms indicating directions such as “upward” and “downward” indicate relative directions that depend only on the relative positional relationship of the constituent members, and include vertical and horizontal directions. It does not indicate the absolute direction.
本発明は、各種電子機器、電気機器、産業機器、車両の電装等に使用されるコンデンサに有用である。
The present invention is useful for capacitors used in various electronic equipment, electrical equipment, industrial equipment, vehicle electrical equipment, and the like.
1 フィルムコンデンサ(コンデンサ)
10A 第1コンデンサ素子ユニット(第1のコンデンサ素子ユニット)
10B 第2コンデンサ素子ユニット(第2のコンデンサ素子ユニット)
20 ケース
30 充填樹脂
100 第1コンデンサ素子(第1のコンデンサ素子)
101 上側端面電極(第1の電極)
102 下側端面電極(第2の電極)
200 第1バスバー(第1のバスバー)
230 第1重合部(第1の重合部)
231 第1開口部(第1の開口部)
300 第2バスバー(第2のバスバー)
330 第2重合部(第2の重合部)
331 第2開口部(第2の開口部)
400 第1絶縁板(第1の絶縁部)
411 第3開口部(第3の開口部)
412 第1環状突起部(第1の環状突起部)
413 第2環状突起部(第2の環状突起部)
500 第2コンデンサ素子(第2のコンデンサ素子)
501 上側端面電極(第3の電極)
502 下側端面電極(第4の電極)
600 第3バスバー(第3のバスバー)
610 第3電極端子部(第3の重合部)
611 電極ピン(接合部)
700 第4バスバー(第4のバスバー)
800 第2絶縁板(第2の絶縁部)
811 第4開口部(第4の開口部)
812 嵌合突起部(突起部) 1 Film capacitor (capacitor)
10A First capacitor element unit (first capacitor element unit)
10B Second capacitor element unit (second capacitor element unit)
20Case 30 Filling resin 100 First capacitor element (first capacitor element)
101 Upper end face electrode (first electrode)
102 Lower end face electrode (second electrode)
200 First bus bar (first bus bar)
230 1st polymerization part (1st polymerization part)
231 1st opening part (1st opening part)
300 Second bus bar (second bus bar)
330 2nd polymerization part (2nd polymerization part)
331 second opening (second opening)
400 1st insulation board (1st insulation part)
411 Third opening (third opening)
412 First annular protrusion (first annular protrusion)
413 Second annular projection (second annular projection)
500 Second capacitor element (second capacitor element)
501 Upper end face electrode (third electrode)
502 Lower end face electrode (fourth electrode)
600 3rd bus bar (3rd bus bar)
610 Third electrode terminal portion (third overlapping portion)
611 Electrode pin (joint)
700 4th bus bar (4th bus bar)
800 Second insulating plate (second insulating portion)
811 Fourth opening (fourth opening)
812 Mating protrusion (protrusion)
10A 第1コンデンサ素子ユニット(第1のコンデンサ素子ユニット)
10B 第2コンデンサ素子ユニット(第2のコンデンサ素子ユニット)
20 ケース
30 充填樹脂
100 第1コンデンサ素子(第1のコンデンサ素子)
101 上側端面電極(第1の電極)
102 下側端面電極(第2の電極)
200 第1バスバー(第1のバスバー)
230 第1重合部(第1の重合部)
231 第1開口部(第1の開口部)
300 第2バスバー(第2のバスバー)
330 第2重合部(第2の重合部)
331 第2開口部(第2の開口部)
400 第1絶縁板(第1の絶縁部)
411 第3開口部(第3の開口部)
412 第1環状突起部(第1の環状突起部)
413 第2環状突起部(第2の環状突起部)
500 第2コンデンサ素子(第2のコンデンサ素子)
501 上側端面電極(第3の電極)
502 下側端面電極(第4の電極)
600 第3バスバー(第3のバスバー)
610 第3電極端子部(第3の重合部)
611 電極ピン(接合部)
700 第4バスバー(第4のバスバー)
800 第2絶縁板(第2の絶縁部)
811 第4開口部(第4の開口部)
812 嵌合突起部(突起部) 1 Film capacitor (capacitor)
10A First capacitor element unit (first capacitor element unit)
10B Second capacitor element unit (second capacitor element unit)
20
101 Upper end face electrode (first electrode)
102 Lower end face electrode (second electrode)
200 First bus bar (first bus bar)
230 1st polymerization part (1st polymerization part)
231 1st opening part (1st opening part)
300 Second bus bar (second bus bar)
330 2nd polymerization part (2nd polymerization part)
331 second opening (second opening)
400 1st insulation board (1st insulation part)
411 Third opening (third opening)
412 First annular protrusion (first annular protrusion)
413 Second annular projection (second annular projection)
500 Second capacitor element (second capacitor element)
501 Upper end face electrode (third electrode)
502 Lower end face electrode (fourth electrode)
600 3rd bus bar (3rd bus bar)
610 Third electrode terminal portion (third overlapping portion)
611 Electrode pin (joint)
700 4th bus bar (4th bus bar)
800 Second insulating plate (second insulating portion)
811 Fourth opening (fourth opening)
812 Mating protrusion (protrusion)
Claims (5)
- 第1の電極および第2の電極を有する第1のコンデンサ素子と、前記第1の電極に接続された第1のバスバーと、前記第2の電極に接続された第2のバスバーと、を含む第1のコンデンサ素子ユニットと、
第3の電極および第4の電極を有する第2のコンデンサ素子と、前記第3の電極に接続された第3のバスバーと、前記第4の電極に接続された第4のバスバーと、を含む第2のコンデンサ素子ユニットと、
前記第1のコンデンサ素子ユニットおよび前記第2のコンデンサ素子ユニットが収容されたケースと、
前記ケース内に充填された充填樹脂と、を備え、
前記第1のバスバーおよび前記第2のバスバーは、それぞれ、前記ケースが開口する開口面の法線方向において前記第1のコンデンサ素子から外れた位置で、前記法線方向に互いに重なり合う第1の重合部および第2の重合部を含み、
前記第1の重合部と前記第2の重合部との間には第1の絶縁部が介在し、
前記第2のコンデンサ素子は、前記法線方向において前記第1の重合部および前記第2の重合部に重なるように前記ケース内に配置され、
前記第3のバスバーは、前記法線方向において前記第2の重合部と重なり合う第3の重合部を含み、
前記第2の重合部と前記第3の重合部との間には第2の絶縁部が介在する、
ことを特徴とするコンデンサ。 A first capacitor element having a first electrode and a second electrode; a first bus bar connected to the first electrode; and a second bus bar connected to the second electrode. A first capacitor element unit;
A second capacitor element having a third electrode and a fourth electrode; a third bus bar connected to the third electrode; and a fourth bus bar connected to the fourth electrode. A second capacitor element unit;
A case in which the first capacitor element unit and the second capacitor element unit are accommodated;
A filling resin filled in the case,
Each of the first bus bar and the second bus bar overlaps each other in the normal direction at a position away from the first capacitor element in the normal direction of the opening surface where the case opens. Part and a second superposition part,
A first insulating portion is interposed between the first overlapping portion and the second overlapping portion,
The second capacitor element is disposed in the case so as to overlap the first overlapping portion and the second overlapping portion in the normal direction,
The third bus bar includes a third overlapping portion that overlaps the second overlapping portion in the normal direction,
A second insulating portion is interposed between the second overlapping portion and the third overlapping portion.
Capacitor characterized by that. - 請求項1に記載のコンデンサにおいて、
前記第1の重合部、前記第2の重合部、前記第1の絶縁部および前記第2の絶縁部には、それぞれ、前記法線方向に互いに重なる位置に第1の開口部、第2の開口部、第3の開口部および第4の開口部が設けられ、
前記3の重合部は、前記第4の開口部内に位置して前記第2の電極と接合される接合部を含む、
ことを特徴とするコンデンサ。 The capacitor of claim 1,
The first overlapping portion, the second overlapping portion, the first insulating portion, and the second insulating portion respectively include a first opening and a second opening at positions overlapping each other in the normal direction. An opening, a third opening and a fourth opening are provided;
The three overlapping portions include a bonding portion that is located in the fourth opening and is bonded to the second electrode.
Capacitor characterized by that. - 請求項2に記載のコンデンサにおいて、
前記第2の絶縁部は、前記第4の開口部の周囲に設けられ、前記第3の開口部側に突出し、前記第3の開口部が嵌め込まれる突起部を含む、
ことを特徴とするコンデンサ。 The capacitor according to claim 2,
The second insulating portion includes a protrusion provided around the fourth opening, protruding toward the third opening, and into which the third opening is fitted.
Capacitor characterized by that. - 請求項2または3に記載のコンデンサにおいて、
前記1の絶縁部は、前記第1の重合部に対向する面における前記第3の開口部の周囲であって前記第1の開口部の内側に設けられる第1の環状突起部および前記第2の重合部に対向する面における前記第3の開口部の周囲であって前記第2の開口部の内側に設けられる第2の環状突起部の少なくとも1つを含む、
ことを特徴とするコンデンサ。 The capacitor according to claim 2 or 3,
The first insulating portion includes a first annular protrusion provided on the inner side of the first opening and the second annular protrusion around the third opening on a surface facing the first overlapping portion. Including at least one second annular projection provided around the third opening and on the inner side of the second opening on the surface facing the overlapping portion of
Capacitor characterized by that. - 請求項4に記載のコンデンサにおいて、
前記1の絶縁部は、前記第1の環状突起部および前記第2の環状突起部の双方を含む、
ことを特徴とするコンデンサ。 The capacitor according to claim 4, wherein
The one insulating portion includes both the first annular protrusion and the second annular protrusion.
Capacitor characterized by that.
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JP2020113688A (en) * | 2019-01-16 | 2020-07-27 | ニチコン株式会社 | Case mold type capacitor |
JP2020167215A (en) * | 2019-03-28 | 2020-10-08 | 株式会社デンソー | Capacitor unit |
WO2021085107A1 (en) * | 2019-10-29 | 2021-05-06 | パナソニックIpマネジメント株式会社 | Capacitor |
CN113366593A (en) * | 2019-02-05 | 2021-09-07 | 松下知识产权经营株式会社 | Capacitor with a capacitor element |
WO2022059530A1 (en) * | 2020-09-18 | 2022-03-24 | パナソニックIpマネジメント株式会社 | Capacitor |
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