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WO2018193581A1 - Power conversion device - Google Patents

Power conversion device Download PDF

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Publication number
WO2018193581A1
WO2018193581A1 PCT/JP2017/015897 JP2017015897W WO2018193581A1 WO 2018193581 A1 WO2018193581 A1 WO 2018193581A1 JP 2017015897 W JP2017015897 W JP 2017015897W WO 2018193581 A1 WO2018193581 A1 WO 2018193581A1
Authority
WO
WIPO (PCT)
Prior art keywords
wiring member
mold resin
fuse portion
fuse
power conversion
Prior art date
Application number
PCT/JP2017/015897
Other languages
French (fr)
Japanese (ja)
Inventor
雄二 白形
政紀 加藤
健太 藤井
武弘 齋藤
雅博 上野
友明 島野
Original Assignee
三菱電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱電機株式会社 filed Critical 三菱電機株式会社
Priority to JP2019513163A priority Critical patent/JP6797289B2/en
Priority to PCT/JP2017/015897 priority patent/WO2018193581A1/en
Publication of WO2018193581A1 publication Critical patent/WO2018193581A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/18—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of the types provided for in two or more different main groups of the same subclass of H10B, H10D, H10F, H10H, H10K or H10N
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/401—Disposition
    • H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Definitions

  • the present invention relates to a power converter, and more particularly to a power converter having a function of cutting off a short-circuit current when a component is short-circuited.
  • Such a vehicle has an inverter device for driving a motor.
  • the motor drive inverter device supplies high-voltage drive power to a motor drive circuit using a battery as a power source.
  • a resin-sealed power semiconductor device is used for an inverter device for driving a motor.
  • resin-encapsulated semiconductor devices are becoming increasingly important as key devices.
  • a power semiconductor element is resin-sealed together with other components.
  • a resin-encapsulated semiconductor device when power is supplied from a battery, a short circuit failure occurs in a power semiconductor element or a short circuit failure occurs in a snubber circuit electronic component such as a smoothing capacitor. Current flows. More specifically, for example, when the upper and lower arms of the inverter are short-circuited due to a malfunction of the gate drive circuit in the inverter control circuit, an overcurrent flows through the power semiconductor element, causing a short-circuit failure.
  • the resin-encapsulated semiconductor device emits smoke and fires due to a large current. Moreover, it is conceivable that the battery connected to the inverter device is damaged due to an overcurrent exceeding the rating. In order to avoid such a situation, usually, a sensor that detects an excessive current is used to control the switching element at a high speed when the excessive current flows to interrupt the current. However, in order to prevent failures such as smoke as described above more reliably, it is also beneficial to take further measures to cope with unexpected situations.
  • Patent Document 1 Conventional semiconductor devices provided with a fuse portion are described in, for example, Patent Document 1 and Patent Document 2.
  • the conventional semiconductor device described in Patent Document 1 includes a power lead connected to the main electrode of the power element.
  • the power element is sealed with a mold resin, and the power lead protrudes outward from the mold resin portion.
  • a fuse portion is provided at one location of the projecting power lead. At this time, if an overcurrent flows through the power lead, the temperature of the power lead rises and the fuse portion is broken. Thereby, an overcurrent is interrupted.
  • the conventional semiconductor device described in Patent Document 2 has a main circuit wiring having one end and the other end, joined to the surface of the semiconductor element on one end side, and having an external connection terminal portion on the other end side. It has.
  • the semiconductor element and one end of the main circuit wiring are sealed with a sealing resin.
  • the external connection terminal portion is exposed to the outside from the sealing resin.
  • the external connection terminal portion is attached to the bus bar so that a spring force acts on the main circuit wiring in a direction away from the surface of the semiconductor element.
  • the main circuit wiring is easily detached from the sealing resin and separated from the semiconductor element.
  • the conventional semiconductor device described in Patent Document 1 has the following problems.
  • the semiconductor device described in Patent Document 1 when the semiconductor device described in Patent Document 1 is mounted on a semiconductor module, power leads of the semiconductor device are soldered to bus bars of the semiconductor module. At this time, if an overcurrent flows through the power lead, the fuse portion provided in the power lead is torn. In this way, the overcurrent can be temporarily interrupted, but the torn fuse portion may be melted at a higher temperature and may be in electrical contact with a solder joint or the like. In that case, there existed a subject that the fuse part did not play the role as a fuse function. Further, in Patent Document 1, since the fuse portion is provided outside the semiconductor module, the mounting area of components is increased and the semiconductor device is enlarged.
  • the conventional semiconductor device described in Patent Document 2 has the following problems.
  • the sealing resin is broken by a spring force to separate the main circuit wiring from the semiconductor element. Therefore, since a member and a mounting area for securing the spring force are necessary, the semiconductor device is increased in size.
  • the joint since a force is constantly applied to the joint between the semiconductor element and the main circuit wiring due to the spring force, the joint may be damaged, and it is difficult to ensure long-term reliability.
  • the present invention has been made in order to solve such a problem, and it is possible to obtain a power conversion device that can cut off an overcurrent with a simple configuration when the overcurrent flows. It is aimed.
  • the present invention is a power conversion device including a power conversion module, wherein the power conversion module includes at least one lead frame provided in a wiring pattern, a semiconductor element provided on the lead frame, A wiring member that connects the lead frame and the semiconductor element; and a mold resin that seals the lead frame, the semiconductor element, and the wiring member.
  • the thickness of the mold resin provided on the upper side of the part is thinner than the thickness of the mold resin provided on the lower side of the fuse part.
  • the fuse portion is formed in the wiring member, and the thickness of the mold resin provided on the upper side of the fuse portion is reduced, so that when the overcurrent flows, the fuse portion is blown together with the broken fuse portion. Since the mold resin on the upper side of the part pops off, the overcurrent can be reliably interrupted with a simple configuration.
  • FIG. 2 is a cross-sectional view taken along the line AA in FIG.
  • FIG. 3 is a cross-sectional view taken along the line BB in FIG.
  • It is a top view of the fuse part provided in the power converter device which concerns on Embodiment 1 of this invention.
  • It is a schematic diagram of the current density of the fuse part provided in the power converter device according to Embodiment 1 of the present invention. It is the figure which showed the analysis result of the fuse part provided in the power converter device which concerns on Embodiment 1 of this invention.
  • It is the top view which showed the example of the shape of the fuse part provided in the power converter device which concerns on Embodiment 1 of this invention.
  • FIG. 1 is a front view of a power conversion apparatus according to Embodiment 1 of the present invention.
  • 2 and FIG. 3 are an AA cross-sectional view and a BB cross-sectional view of FIG. 1, respectively.
  • the power conversion apparatus includes a power conversion module 100, an external connection terminal 10, an insulating case 11, and a heat sink 12.
  • the power conversion module 100 includes a lead frame 13 formed in a wiring pattern, a switchable semiconductor element 14, a wiring member 15, a conductive bonding material 17, and a mold resin 20.
  • the wiring member 15 electrically connects between the terminals of the lead frame 13 and between the lead frame 13 and the semiconductor element 14.
  • the wiring member 15 includes a large current wiring member 15a and a control wiring member 15b. These wiring members 15a and 15b will be described later.
  • the conductive bonding material 17 bonds the lead frame 13, the semiconductor element 14, and the wiring member 15.
  • the mold resin 20 seals the lead frame 13, the semiconductor element 14, the wiring member 15, the conductive bonding material 17, and other mounting components (not shown).
  • the power conversion module 100 is provided with a heat sink 12 with an insulating material 18 interposed therebetween. Since the insulating material 18 is provided between the heat sink 12 and the semiconductor element 14, the semiconductor element 14 and the heat sink 12 are electrically insulated. On the other hand, the heat generated in the semiconductor element 14 is conducted to the heat sink 12 through the insulating material 18. Therefore, the semiconductor element 14 and the heat sink 12 are thermally connected. The heat sink 12 efficiently radiates heat generated in the semiconductor element 14 to the outside air.
  • the power conversion module 100 is electrically insulated from the heat sink 12 via the insulating material 18 and fixed in a thermally connected state.
  • the heat sink 12 may have an insulating layer on the surface facing the fixed portion of the power conversion module 100 and be fixed to the power conversion module 100 via soldering, heat dissipation grease, or the like.
  • the lead frame 13 is made of a metal such as copper or copper alloy having good conductivity and high thermal conductivity.
  • the control terminal 21 and the power terminal 22 of the power conversion module 100 protrude to the outside of the mold resin 20.
  • the control terminal 21 is a gate signal line and a sensor signal line of the semiconductor element 14.
  • the control terminal 21 is connected to a control board (not shown) mounted on the power converter.
  • the power terminal 22 is provided at the tip of the lead frame 13. A large current of several amperes to several hundred amperes flows through the power terminal 22.
  • the power terminal 22 is joined to the external connection terminal 10 inserted and outsert in the insulating case 11 by welding or soldering.
  • the power terminal 22 is connected to an external power supply device or a power source such as a battery via the external connection terminal 10.
  • the semiconductor element 14 is configured by a power field effect transistor (Power MOSFET: Power Metal-Oxide-Semiconductor Field-Effect Transistor) or an insulated gate bipolar transistor (IGBT: Insulated Gate Bipolar Transistor). These are used in inverter circuits that drive devices such as motors, and control a rated current of several amperes to several hundred amperes.
  • Power MOSFET Power Metal-Oxide-Semiconductor Field-Effect Transistor
  • IGBT Insulated Gate Bipolar Transistor
  • the conductive bonding material 17 is made of a material having good conductivity and high thermal conductivity, such as solder, silver paste, or conductive adhesive.
  • the conductive bonding material 17 is used for electrically and thermally connecting and fixing the semiconductor element 14, the lead frame 13, and the wiring member 15.
  • silicon (Si), silicon carbide (SiC), gallium nitride (GaN), or the like may be used as a material of the semiconductor element 14.
  • the insulating material 18 interposed between the lead frame 13 and the heat sink 12 is made of a material having high thermal conductivity and high electrical insulation. Therefore, the insulating material 18 is, for example, an adhesive made of a resin material such as a silicone resin, an epoxy resin, or a urethane resin having a thermal conductivity of 1 W / mK to several tens of W / mK and having an insulating property, grease, Or it is comprised with an insulation sheet. Furthermore, the insulating material 18 can be configured by combining other resin materials having low thermal resistance such as a ceramic substrate or a metal substrate and having an insulating property and those resin materials.
  • a resin material such as a silicone resin, an epoxy resin, or a urethane resin having a thermal conductivity of 1 W / mK to several tens of W / mK and having an insulating property, grease, Or it is comprised with an insulation sheet.
  • the insulating material 18 can be configured by combining other resin materials having low
  • a protrusion is provided on the lower surface side of the mold resin 20, that is, on the heat sink 12 side.
  • the thickness corresponding to the height of the protrusion can be defined, so that the insulating property of the insulating material 18 can be ensured.
  • a creepage distance required to ensure a predetermined withstand voltage is about 10 ⁇ m. Therefore, in the case of a low withstand voltage automobile, the thickness necessary for insulation can be reduced, so that the protrusion of the mold resin 20 can be further shortened, and the power conversion module 100 can be made thinner.
  • the heat sink 12 has a role of radiating heat generated in the semiconductor element 14 to the outside air when a current flows through the semiconductor element 14 sealed with the mold resin 20.
  • the heat sink 12 is configured using a material having a thermal conductivity of 90 W / m ⁇ K or more, such as aluminum or an aluminum alloy.
  • a plurality of fins 19 are arranged on the lower surface of the heat sink 12. These fins 19 are in contact with the outside air, and the heat sink 12 radiates heat from these fins 19 toward the outside air.
  • the wiring member 15 includes a large current wiring member 15a for large current and a control wiring member 15b for control.
  • the control wiring member 15 b is used, for example, to connect the gate and sensor unit of the semiconductor element 14 and the control terminal 21.
  • the control wiring member 15b can be formed by, for example, a wire bond such as gold, copper, or aluminum, or a ribbon bond of aluminum. However, it is not limited to these.
  • the large current wiring member 15 a is used for connecting between the terminals of the lead frame 13 or between the semiconductor element 14 and the power terminal 22 of the lead frame 13. As shown in FIG. 3, a fuse portion 16 is formed in the large current wiring member 15a.
  • the fuse portion 16 is provided in the energization path of the large current wiring member 15a.
  • the fuse portion 16 may be provided at any location as long as it is within the energization path of the large current wiring member 15a. However, the fuse portion 16 is not provided at the junction with the lead frame 13 and the junction with the semiconductor element 14 even in the energization path of the large current wiring member 15a.
  • the thickness of the joint portion of the large current wiring member 15a is thicker than the thickness of the fuse portion 16. However, the thickness is not limited to this case, and may be the same. Alternatively, the thickness of the junction portion of the large current wiring member 15 a may be made thinner than the thickness of the fuse portion 16.
  • the large current wiring member 15a is made of a metal having good conductivity such as copper, copper alloy, aluminum, and aluminum alloy.
  • the large current wiring member 15a can be formed, for example, by punching a metal plate having a thickness of about 0.1 mm to 2 mm.
  • the soldering of the joint portion is improved by plating the aluminum with tin or nickel.
  • the lower surface side of the fuse portion 16 of the large current wiring member 15a that is, the area on the semiconductor element 14 side
  • area R2 the upper surface side of the fuse portion 16
  • FIG. 4 is a top view of the high-current wiring member 15a.
  • the fuse portion 16 is formed by providing a notch portion 33 in the energization path excluding the joint portion of the large current wiring member 15a.
  • the notch 33 is configured by a round hole.
  • the fuse part 16 is formed by forming a round hole as the notch 33 in the metal plate constituting the large current wiring member 15a. Is done.
  • the fuse part 16 is comprised from a part of large current wiring member 15a. Accordingly, the fuse portion 16 is produced by being integrated with the high current wiring member 15a using the same material. Therefore, it is not necessary to add a new fuse member. Therefore, the number of parts is not added and the cost is not increased.
  • the cross-sectional area of the fuse portion 16 is smaller than the other portion of the large current wiring member 15a by the notch portion 33. Therefore, as indicated by the thick arrow C2 in FIG. 5, the current density is locally increased only in the fuse portion 16 as compared with the current C1 flowing in other portions. As a result, when a current flows through the large current wiring member 15a, the temperature of the fuse portion 16 only rises locally due to deterioration in heat dissipation and increase in heat generation density.
  • the temperature of the fuse part 16 rises rapidly in a short time.
  • the fuse portion 16 is broken by heat and flies away.
  • the fuse portion 16 blows away the mold resin 20 in the area R2 where the thickness of the mold resin 20 is thin to the upper surface side, and the fuse portion 16 bounces off the outside of the mold resin 20, whereby the large current wiring member 15a.
  • the fuse portion 16 can be separated from each other, thereby preventing the large current wiring member 15a and the fuse portion 16 from coming into contact with each other and energizing again.
  • the fuse portion 16 is likely to jump to the outside of the mold resin 20, the separation distance of the tearing portion of the high current wiring member 15 a can be increased, and the overcurrent flowing through the high current wiring member 15 a can be reliably cut off. it can.
  • the mold resin 20 has an area R2 on the upper surface side of the wiring member 15 thinner than the area R1 on the lower surface side. Therefore, when the fuse part 16 is torn, the mold resin 20 on the upper surface side together with the fuse part 16 is a power conversion module. Blow away toward the outside of 100. As in the conventional semiconductor device, if the fuse portion 16 is not blown away and remains in the power conversion module 100, the metal of the torn fuse portion 16 is melted by heat, and the lead frame 13 or The semiconductor element 14 is electrically connected, and as a result, the current flows again.
  • the mold resin 20 on the upper side of the fuse portion 16 is thinned, and the fuse portion 16 is blown off together with the mold resin 20 so that the current flows again due to the adhesion of the melted fuse portion 16. It can be prevented from flowing. Furthermore, in a low withstand voltage system using a 12V battery for automobiles, when a large current flows, the battery voltage drops to below 10V, so that no arc is generated when the fuse portion 16 is broken, and the structure can be further simplified. Further, the power conversion device can be further reduced in size and cost.
  • the cross-sectional area of the fuse portion 16 is reduced by making a round hole in the metal plate, but the cross-sectional area of the fuse portion 16 can also be reduced by locally reducing the thickness of the metal plate by pressing or the like. Needless to say, similar effects can be obtained. Further, the fuse portion 16 may be formed by combining the formation of the round hole and the reduction of the thickness.
  • FIG. 6 shows a temperature distribution when a current is passed through the large current wiring member 15a.
  • FIG. 6 is a temperature distribution of the large current wiring member 15a when an excessive current flows through the large current wiring member 15a shown in FIG. 4 and the fuse portion 16 reaches the melting point.
  • the fuse portion 16 As shown in FIG. 6, in the large current wiring member 15a, only the fuse portion 16 is locally heated, but at this time, there is a temperature gradient toward the joint at both ends of the large current wiring member 15a. I understand that. Therefore, even if the fuse part 16 is torn, the joint part is not destroyed. Further, by changing the size of the round hole constituting the notch 33, it is possible to adjust the current when the melting point is reached and the time until the melting point 16 is reached when the melting point is reached.
  • the fuse portion 16 is formed by providing the cutout portion 33 in the large current wiring member 15a used in the power conversion module 100 to locally reduce the cross-sectional area.
  • the fuse portion 16 since a part of the large current wiring member 15a is used as the fuse portion 16, it is not necessary to newly add a fuse member. Therefore, the number of parts is not added and the number of mounting steps is not increased, so that productivity is high. In addition, the power converter is not increased in size.
  • the thickness of the mold resin 20 is changed between the upper surface side and the lower surface side of the fuse portion 16 of the large current wiring member 15a, and the thickness of the mold resin 20 on the upper surface side is reduced.
  • the separation distance of the tearing portion of the high current wiring member 15a can be increased, so that the high current wiring member 15a can be prevented from conducting again, and the overcurrent can be reliably cut off. can do. As a result, smoke and ignition of the power converter can be prevented.
  • the fuse portion 16 the cross-sectional area of the high-current wiring member 15a is at least partially reduced and the rigidity is lowered. Therefore, thermal stress due to a temperature change is alleviated, and the reliability of the joint portion is expected to be improved. it can.
  • the shape of the notch 33 is a round hole, but other shapes may be used. That is, the shape of the notch 33 may be an ellipse as shown in the examples (a), (b), and (d) shown in FIG. 7, or a triangle as shown in the example (c) shown in FIG. Alternatively, as shown in the example (e) shown in FIG. 7, it may be a rectangle such as a rectangle or a square, or another polygon such as a pentagon and a hexagon. Furthermore, it may be trapezoidal as in example (i) shown in FIG. 7, or may be rhombus or parallelogram as in example (h) shown in FIG.
  • the number of notches 33 only one notch 33 is provided as in the examples (a) to (c), (e), (h), and (i) shown in FIG.
  • a plurality of notches 33 may be provided as in the examples (d), (f), and (g) shown in FIG.
  • the cutout portions 33 may be arranged in the width direction of the large current wiring member 15a as in the example (d) shown in FIG.
  • they may be arranged in the length direction, may be arranged alternately such as a staggered arrangement, or may be arranged irregularly.
  • the notch 33 is provided at the center position in the width direction of the large current wiring member 15a.
  • the present invention is not limited to this example.
  • the example (j), ( l), a notch 33 may be provided on one side in the width direction of the large current wiring member 15a, or a large current wiring as in the examples (k) and (m) shown in FIG.
  • the notches 33 may be provided on both sides in the width direction of the member 15a. In any case, since the cross-sectional area of the high-current wiring member 15a is reduced by the notch 33, the same effect can be obtained.
  • the shape of the cutout portion 33 is not limited to the examples (j) to (m) of FIG. 8, and is a quadrangle such as an ellipse, a rectangle, and a rectangle. Other polygons such as pentagons and hexagons, trapezoids, rhombuses, parallelograms, etc. may be used.
  • the number of the notches 33 may be one or plural. That is, the shape and the number of the notches 33 may be any shape and number that locally reduce the cross-sectional area in the high-current wiring member 15a, and are not limited to the shape and number described above.
  • FIG. 9 is a cross-sectional view of the power conversion device according to the second embodiment. 9, parts that are the same as or correspond to those in the configuration shown in FIG. 3 are given the same reference numerals, and descriptions thereof are omitted here.
  • the second embodiment is basically based on the idea described in the first embodiment.
  • the height of the large current wiring member 15a is compared with the height of the control wiring member 15b and other electronic components. Then, the height of the control wiring member 15b and other electronic components is higher than that of the large current wiring member 15a. Therefore, the mold resin 20 has a thickness corresponding to the height of the control wiring member 15b and other electronic components. As a result, there is a limit in reducing the thickness of the mold resin 20 provided on the upper side of the fuse portion 16, which is a design constraint for the fuse portion 16.
  • the recess 24 is provided on the upper surface of the mold resin 20 in the area R2 provided on the upper side of the fuse portion 16 of the high current wiring member 15a.
  • the position of the recessed portion 24 corresponds to the position of the fuse portion 16 so that it is just above the fuse portion 16. Thereby, the thickness of the mold resin 20 can be partially reduced, and the tall wiring member 15 and the electronic component can be used as they are.
  • the number of the recessed parts 24 may be one or plural.
  • the recess 24 may be formed at the same time when the power conversion module 100 is sealed with the mold resin 20 using a mold, or after the power conversion module 100 is sealed with the mold resin 20
  • the recess 24 may be formed by cutting out a part of the resin 20.
  • the power conversion module 100 can be configured by providing the recess 24 so that the mold resin 20 is thinned only on the upper side of the fuse portion 16.
  • the temperature of the fuse portion 16 rapidly increases in a short time. Then, when the temperature reaches the melting point of the metal constituting the fuse part 16, the fuse part 16 is torn and flies off. At that time, together with the fuse part 16, the mold resin 20 in the area R2 on the upper side of the fuse part 16 is also simultaneously blown off. In this way, the overcurrent can be surely interrupted by blowing away the fuse portion 16 and the mold resin 20 on the upper side to gain a separation distance.
  • the fuse part 16 blows off at the time of the rupture, the remains of the ruptured fuse part 16 do not remain in the power conversion module 100. If it remains, the metal of the torn fuse portion 16 is melted and electrically contacts the lead frame 13, the semiconductor element 14, the control wiring member 15 b, etc. May flow. However, in the second embodiment, since the fuse portion 16 does not remain, it is possible to reliably prevent the current from flowing again.
  • the mold resin 20 is present in the area R ⁇ b> 2 above the fuse portion 16.
  • the present invention is not limited to this, and as shown in FIG. 10, the depth of the recessed portion 24 is increased.
  • the fuse portion 16 may be exposed to the outside. That is, in FIG. 10, the recessed portion 24 is a through hole reaching the upper surface of the fuse portion 16, and the fuse portion 16 is exposed to the outside through the through hole. Therefore, the mold resin 20 is not provided above the fuse portion 16. In the example of FIG. 10, not only the fuse portion 16 part but also a part of the large current wiring member 15 a in the vicinity of the fuse portion 16 is exposed to the outside.
  • the recess 24 in FIG. 10 may be filled with a sealing material 26 having a low thermal conductivity and sealed.
  • the sealing material 26 is filled in the recess 24 of FIG. 10, but the sealing material 26 may be filled in the recess 24 of FIG. 9.
  • the sealing material 26 is made of a material having a thermal conductivity smaller than that of the mold resin 20. For example, if the thermal conductivity of the mold resin 20 is about 0.5 to several W / mK, the thermal conductivity of the sealing material 26 is preferably about 0.2 to 0.5 W / mK.
  • the sealing material 26 is made of, for example, a silicone resin having a thermal conductivity in such a range.
  • the heat dissipation of the fuse part 16 is deteriorated, and when an overcurrent flows through the fuse part 16, the temperature easily rises, and the fuse part 16. This has the effect of shortening the time until tearing. Furthermore, when the sealing material 26 is made of a silicone resin, an arc extinguishing action can be expected. Further, there is a silencing effect when the fuse portion 16 is broken.
  • a lid 25 may be provided on the upper surface of the mold resin 20.
  • the lid 25 is added to the configuration of FIG. 10, but the lid 25 may be added to the configuration of FIG. 9 or FIG.
  • air is shut off from the power conversion module 100, so that it is difficult for ignition or smoke to occur in the power conversion module 100.
  • a material of the lid 25 it is desirable to use a metal having a high melting point such as iron or ceramic.
  • the lid 25 is bonded to the mold resin 20 with an adhesive or the like. Note that the material of the lid 25 and the method of creating the gap are not limited to these.
  • the large current wiring member 15a has the fuse portion 16 and the thickness of the mold resin 20 on the upper side of the fuse portion 16 is the same as in the first embodiment.
  • the mold resin 20 on the upper side of the fuse portion 16 is blown off at the same time to increase the separation distance.
  • the debris of the fuse portion 16 contacts other parts. By doing so, it is possible to suppress conduction again, and it is possible to prevent smoke and ignition of the power converter.
  • the thickness of the mold resin 20 is further reduced by providing the recess 24 in the mold resin 20 on the upper side of the fuse portion 16. Therefore, regardless of the height of the control wiring member 15b and other electronic components, only the height of the mold resin 20 above the fuse portion 16 can be made thin independently. As a result, the choice of the shape of the fuse portion 16 is widened, and since a tall wiring member and electronic component can be used, the degree of design freedom can be increased. Further, since it is only necessary to provide the recess 24 in the mold resin 20, there is no additional number of parts and the number of mounting steps does not increase, so that productivity is high.
  • FIG. 13 is a cross-sectional view of the power conversion device according to the third embodiment.
  • the same or corresponding parts as those in the configuration shown in FIG. 3 are denoted by the same reference numerals, and the description thereof is omitted here.
  • the third embodiment basically assumes the idea described in the first embodiment.
  • the height of the control wiring member 15b and other electronic components is higher than the height of the large current wiring member 15a.
  • the height of the control wiring member 15b and other electronic components is configured to be lower than that of the large current wiring member 15a. Therefore, the thickness of the mold resin 20 of the fuse portion 16 can be reduced without providing the recessed portion 24 as in the second embodiment.
  • the fuse portion 16 breaks. Then, fly away. At that time, the overcurrent can be surely interrupted by blowing away the thin portion of the mold resin 20 on the upper side of the fuse portion 16 at the same time and increasing the separation distance.
  • the mold resin 20 is blown off at the same time when the fuse portion 16 is torn, the torn metal of the fuse portion 16 is electrically connected to the lead frame 13, the semiconductor element 14, or the control wiring member 15b, and again, It is possible to reliably prevent a current from flowing.
  • the thickness of the mold resin 20 is reduced as a whole, leading to miniaturization of the power converter.
  • the amount of the resin of the mold resin 20 is reduced, the thermal stress due to the temperature change is alleviated, and the reliability of the joint portion between the components can be improved.
  • the high-current wiring member 15a has the fuse portion 16 and the mold resin 20 on the upper side of the fuse portion 16 Since the thickness is reduced, it is possible to blow away the upper surface side at the time of the rupture to increase the separation distance, and to suppress the conduction of the fuse portion 16 again after the rupture, thereby preventing smoke and ignition of the power converter.
  • the thickness of the mold resin 20 is reduced as a whole, leading to the miniaturization of the power converter. Moreover, since the upper surface of the mold resin 20 can be flattened, the mold used for molding can be simplified.
  • the mold resin 20 is present on the upper side of the large current wiring member 15 a provided with the fuse portion 16.
  • the present invention is not limited to this, and as shown in FIG.
  • the large current wiring member 15a provided with 16 may be exposed to the outside.
  • the mold resin 20 is not provided on the upper side of the large current wiring member 15a. Note that only the fuse portion 16 may be exposed to the outside without exposing the entire large-current wiring member 15a.
  • the mold resin 20 on the upper side of the large current wiring member 15a and exposing at least a part of the large current wiring member 15a to the outside the heat dissipation of the fuse portion 16 deteriorates, and the fuse portion When an overcurrent flows through 16, the temperature is likely to rise, and there is an effect that it is possible to shorten the time until the fuse portion 16 breaks. Also in this case, since the upper surface of the mold resin 20 can be flattened, the mold used for molding can be simplified.
  • External connection terminal 11 Insulation case, 12 Heat sink, 13 Lead frame, 14 Semiconductor element, 15 Wiring member, 15a Wiring member for large current, 15b Wiring member for control, 16 Fuse part, 17 Conductive bonding material, 18 Insulating material , 19 fin, 20 mold resin, 21 control terminal, 22 power terminal, 24 dent, 25 lid, 26 sealing material, 100 power conversion module.

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  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Inverter Devices (AREA)

Abstract

This power conversion device is equipped with a power conversion module 100. The power conversion module 100 comprises a lead frame 13, a semiconductor element 14 provided above the lead frame 13, a wiring member 15 establishing a connection between the lead frame 13 and the semiconductor element 14, and a molded resin 20 sealing the lead frame 13, the semiconductor element 14, and the wiring member 15. The wiring member 15 is provided with a fuse section 16, the thickness of the molded resin 20 on the upper side of the fuse section 16 being thinner than that of the molded resin 20 on the lower side of the fuse section 16.

Description

電力変換装置Power converter
　この発明は電力変換装置に関し、特に、構成部品が短絡故障した際の短絡電流を遮断する機能を有する電力変換装置に関するものである。 The present invention relates to a power converter, and more particularly to a power converter having a function of cutting off a short-circuit current when a component is short-circuited.
　自動車業界において、ハイブリッド自動車および電気自動車のように、モータを用いて駆動する車両が近年さかんに開発されている。そのような車両は、モータ駆動用インバータ装置を有している。モータ駆動用インバータ装置は、バッテリを電源として、モータの駆動回路に高電圧の駆動電力を供給する。一般的に、モータ駆動用インバータ装置には、樹脂封止型の電力用半導体装置が用いられている。パワーエレクトロニクスの分野において、樹脂封止型の半導体装置は、キーデバイスとしての重要性がますます高まっている。 In the automobile industry, vehicles driven by motors such as hybrid cars and electric cars have been developed in recent years. Such a vehicle has an inverter device for driving a motor. The motor drive inverter device supplies high-voltage drive power to a motor drive circuit using a battery as a power source. In general, a resin-sealed power semiconductor device is used for an inverter device for driving a motor. In the field of power electronics, resin-encapsulated semiconductor devices are becoming increasingly important as key devices.
　モータ駆動用インバータ装置に用いられている半導体装置においては、電力用半導体素子が、他の構成部品と共に樹脂封止されている。そのような樹脂封止型の半導体装置において、バッテリから電力が供給された状態で、電力用半導体素子が短絡故障、または、平滑コンデンサなどのスナバ回路用の電子部品が短絡故障すると、過大な短絡電流が流れる。具体的に説明すると、例えば、インバータ制御回路におけるゲート駆動回路の誤動作で、インバータの上下アームが短絡すると、電力用半導体素子に過電流が流れ、短絡故障が発生する。 In a semiconductor device used for an inverter device for driving a motor, a power semiconductor element is resin-sealed together with other components. In such a resin-encapsulated semiconductor device, when power is supplied from a battery, a short circuit failure occurs in a power semiconductor element or a short circuit failure occurs in a snubber circuit electronic component such as a smoothing capacitor. Current flows. More specifically, for example, when the upper and lower arms of the inverter are short-circuited due to a malfunction of the gate drive circuit in the inverter control circuit, an overcurrent flows through the power semiconductor element, causing a short-circuit failure.
　短絡状態で、バッテリと駆動回路とを繋ぐリレーを接続するかまたは接続を継続すると、大電流により樹脂封止型の半導体装置が発煙および発火する。また、定格を超える過電流が流れることにより、インバータ装置に接続されているバッテリが損害を受けることも考えられる。こうした事態を回避するために、通常は、過大な電流を検知するセンサーを用いて、過大な電流が流れたときにスイッチング素子を高速に制御して電流を遮断している。しかしながら、上述のような発煙などの故障をより確実に防ぐために、不測の事態に対応するための更なる対策を施しておくことも有益と考えられる。 When the relay that connects the battery and the drive circuit is connected in the short circuit state or the connection is continued, the resin-encapsulated semiconductor device emits smoke and fires due to a large current. Moreover, it is conceivable that the battery connected to the inverter device is damaged due to an overcurrent exceeding the rating. In order to avoid such a situation, usually, a sensor that detects an excessive current is used to control the switching element at a high speed when the excessive current flows to interrupt the current. However, in order to prevent failures such as smoke as described above more reliably, it is also beneficial to take further measures to cope with unexpected situations.
　たとえば、電力用半導体装置とバッテリとの間に過電流遮断用ヒューズを挿入すれば、インバータとバッテリとの間に流れる過電流を阻止することができる。しかしながら、チップ型の過電流遮断用ヒューズは、非常に高価である。そのため、電力用半導体素子が短絡故障した際に、バッテリに流れ得る過電流を確実に遮断できる簡便且つ安価な過電流遮断機構が必要とされている。 For example, if an overcurrent cutoff fuse is inserted between the power semiconductor device and the battery, the overcurrent flowing between the inverter and the battery can be prevented. However, the chip-type overcurrent breaking fuse is very expensive. Therefore, there is a need for a simple and inexpensive overcurrent interrupt mechanism that can reliably interrupt an overcurrent that can flow to a battery when a power semiconductor element has a short circuit failure.
　ヒューズ部が設けられた従来の半導体装置は、例えば、特許文献１および特許文献２に記載されている。 Conventional semiconductor devices provided with a fuse portion are described in, for example, Patent Document 1 and Patent Document 2.
　特許文献１に記載の従来の半導体装置は、パワー素子の主電極に接続されたパワーリードを備えている。特許文献１では、パワー素子をモールド樹脂で封止すると共に、パワーリードをモールド樹脂部から外部に向けて突設させている。また、突設させたパワーリードの一箇所にヒューズ部を設けている。このとき、パワーリードに過電流が流れると、パワーリードの温度が上昇して、ヒューズ部が断裂する。これにより、過電流が遮断される。 The conventional semiconductor device described in Patent Document 1 includes a power lead connected to the main electrode of the power element. In Patent Document 1, the power element is sealed with a mold resin, and the power lead protrudes outward from the mold resin portion. Also, a fuse portion is provided at one location of the projecting power lead. At this time, if an overcurrent flows through the power lead, the temperature of the power lead rises and the fuse portion is broken. Thereby, an overcurrent is interrupted.
　特許文献２に記載の従来の半導体装置は、一方端と他方端とを有し、一方端側にて半導体素子の表面に接合され、かつ、他方端側に外部接続端子部を有する主回路配線を備えている。半導体素子と主回路配線の一方端とは、封止樹脂により封止されている。外部接続端子部は、封止樹脂から外部に露出している。外部接続端子部は、主回路配線に対して半導体素子の表面から離れる方向にバネ力が作用するように、バスバーに取り付けられている。このとき、半導体装置に過電流が流れると、温度が上昇し、封止樹脂が軟らかくなって脆くなるため、上記のバネ力により、封止樹脂が断裂する。その結果、主回路配線が封止樹脂から容易に外れて半導体素子から分離される。 The conventional semiconductor device described in Patent Document 2 has a main circuit wiring having one end and the other end, joined to the surface of the semiconductor element on one end side, and having an external connection terminal portion on the other end side. It has. The semiconductor element and one end of the main circuit wiring are sealed with a sealing resin. The external connection terminal portion is exposed to the outside from the sealing resin. The external connection terminal portion is attached to the bus bar so that a spring force acts on the main circuit wiring in a direction away from the surface of the semiconductor element. At this time, if an overcurrent flows through the semiconductor device, the temperature rises and the sealing resin becomes soft and brittle, so that the sealing resin is broken by the spring force. As a result, the main circuit wiring is easily detached from the sealing resin and separated from the semiconductor element.
特開２００３－６８９６７号公報JP 2003-68967 A 特許第４６１５５０６号公報Japanese Patent No. 4615506
　しかしながら、特許文献１に記載の従来の半導体装置においては、以下のような課題がある。例えば、特許文献１に記載の半導体装置を半導体モジュールに実装する場合、半導体装置のパワーリードは、半導体モジュールのバスバーに半田接合される。このとき、パワーリードに過電流が流れると、パワーリードに設けられたヒューズ部が断裂する。こうして、一時的に過電流を遮断することができるが、断裂したヒューズ部がさらに高温になって溶融され、半田接合部などに電気的に接触してしまう可能性がある。その場合、ヒューズ部がヒューズ機能としての役目を果たしていないという課題があった。さらに、特許文献１では、半導体モジュールの外部にヒューズ部を設けているため、部品の実装面積が増え、半導体装置が大型化している。 However, the conventional semiconductor device described in Patent Document 1 has the following problems. For example, when the semiconductor device described in Patent Document 1 is mounted on a semiconductor module, power leads of the semiconductor device are soldered to bus bars of the semiconductor module. At this time, if an overcurrent flows through the power lead, the fuse portion provided in the power lead is torn. In this way, the overcurrent can be temporarily interrupted, but the torn fuse portion may be melted at a higher temperature and may be in electrical contact with a solder joint or the like. In that case, there existed a subject that the fuse part did not play the role as a fuse function. Further, in Patent Document 1, since the fuse portion is provided outside the semiconductor module, the mounting area of components is increased and the semiconductor device is enlarged.
　また、特許文献２に記載の従来の半導体装置においては、以下のような課題がある。特許文献２に記載の従来の半導体装置においては、バネ力で封止樹脂を断裂させて、主回路配線を半導体素子から分離させる。そのため、バネ力を確保するための部材および実装面積が必要であるため、半導体装置が大型化する。また、バネ力により半導体素子と主回路配線との接合部に常に力が加わり続けるため、接合部が破損する可能性があり、長期信頼性を確保するのが困難であった。 Further, the conventional semiconductor device described in Patent Document 2 has the following problems. In the conventional semiconductor device described in Patent Document 2, the sealing resin is broken by a spring force to separate the main circuit wiring from the semiconductor element. Therefore, since a member and a mounting area for securing the spring force are necessary, the semiconductor device is increased in size. In addition, since a force is constantly applied to the joint between the semiconductor element and the main circuit wiring due to the spring force, the joint may be damaged, and it is difficult to ensure long-term reliability.
　この発明は、かかる課題を解決するためになされたものであり、簡易な構成で、過電流が流れたときに、当該過電流を確実に遮断することが可能な、電力変換装置を得ることを目的としている。 The present invention has been made in order to solve such a problem, and it is possible to obtain a power conversion device that can cut off an overcurrent with a simple configuration when the overcurrent flows. It is aimed.
　この発明は、電力変換モジュールを備えた電力変換装置であって、前記電力変換モジュールは、配線パターン状に設けられた１以上のリードフレームと、前記リードフレーム上に設けられた半導体素子と、前記リードフレームと前記半導体素子との間を接続する配線部材と、前記リードフレームと前記半導体素子と前記配線部材とを封止するモールド樹脂とを有し、前記配線部材にヒューズ部を設け、前記ヒューズ部の上側に設けられた前記モールド樹脂の厚さは、前記ヒューズ部の下側に設けられた前記モールド樹脂の厚さより薄い、電力変換装置である。 The present invention is a power conversion device including a power conversion module, wherein the power conversion module includes at least one lead frame provided in a wiring pattern, a semiconductor element provided on the lead frame, A wiring member that connects the lead frame and the semiconductor element; and a mold resin that seals the lead frame, the semiconductor element, and the wiring member. In the power conversion device, the thickness of the mold resin provided on the upper side of the part is thinner than the thickness of the mold resin provided on the lower side of the fuse part.
　この発明に係る電力変換装置は、配線部材にヒューズ部を形成し、ヒューズ部の上側に設けられたモールド樹脂の厚さを薄くしたので、過電流が流れたときに、断裂したヒューズ部とともにヒューズ部の上側のモールド樹脂がはじけ飛ぶため、簡易な構成で、確実に過電流を遮断することができる。 In the power conversion device according to the present invention, the fuse portion is formed in the wiring member, and the thickness of the mold resin provided on the upper side of the fuse portion is reduced, so that when the overcurrent flows, the fuse portion is blown together with the broken fuse portion. Since the mold resin on the upper side of the part pops off, the overcurrent can be reliably interrupted with a simple configuration.
この発明の実施の形態１に係る電力変換装置の構成を示した正面図である。It is the front view which showed the structure of the power converter device which concerns on Embodiment 1 of this invention. 図１のＡ－Ａ断面図である。FIG. 2 is a cross-sectional view taken along the line AA in FIG. 図１のＢ－Ｂ断面図である。FIG. 3 is a cross-sectional view taken along the line BB in FIG. この発明の実施の形態１に係る電力変換装置に設けられたヒューズ部の上面図である。It is a top view of the fuse part provided in the power converter device which concerns on Embodiment 1 of this invention. この発明の実施の形態１に係る電力変換装置に設けられたヒューズ部の電流密度の模式図である。It is a schematic diagram of the current density of the fuse part provided in the power converter device according to Embodiment 1 of the present invention. この発明の実施の形態１に係る電力変換装置に設けられたヒューズ部の解析結果を示した図である。It is the figure which showed the analysis result of the fuse part provided in the power converter device which concerns on Embodiment 1 of this invention. この発明の実施の形態１に係る電力変換装置に設けられたヒューズ部の形状の例を示した上面図である。It is the top view which showed the example of the shape of the fuse part provided in the power converter device which concerns on Embodiment 1 of this invention. この発明の実施の形態１に係る電力変換装置に設けられたヒューズ部の形状の例を示した上面図である。It is the top view which showed the example of the shape of the fuse part provided in the power converter device which concerns on Embodiment 1 of this invention. この発明の実施の形態２に係る電力変換装置の構成を示した断面図である。It is sectional drawing which showed the structure of the power converter device which concerns on Embodiment 2 of this invention. この発明の実施の形態２に係る電力変換装置の変形例の構成を示した断面図である。It is sectional drawing which showed the structure of the modification of the power converter device which concerns on Embodiment 2 of this invention. この発明の実施の形態２に係る電力変換装置の変形例の構成を示した断面図である。It is sectional drawing which showed the structure of the modification of the power converter device which concerns on Embodiment 2 of this invention. この発明の実施の形態２に係る電力変換装置の変形例の構成を示した断面図である。It is sectional drawing which showed the structure of the modification of the power converter device which concerns on Embodiment 2 of this invention. この発明の実施の形態３に係る電力変換装置の構成を示した断面図である。It is sectional drawing which showed the structure of the power converter device which concerns on Embodiment 3 of this invention. この発明の実施の形態３に係る電力変換装置の変形例の構成を示した断面図である。It is sectional drawing which showed the structure of the modification of the power converter device which concerns on Embodiment 3 of this invention.
　この発明の実施の形態に係る電力変換装置について、図を参照しながら、以下に説明する。なお、各図において、同一または対応する構成部分については、同じ符号を付している。また、各図において、同一または対応する構成部分のサイズおよび縮尺は共通しておらず、それぞれ互いに独立している。 The power conversion device according to the embodiment of the present invention will be described below with reference to the drawings. In each figure, the same or corresponding components are denoted by the same reference numerals. Moreover, in each figure, the size of the same or corresponding component and the scale are not common, but are mutually independent.
　実施の形態１．
　図１は、この発明の実施の形態１に係る電力変換装置の正面図である。また、図２及び図３は、それぞれ、図１のＡ－Ａ断面図、および、Ｂ－Ｂ断面図である。 Embodiment 1 FIG.
1 is a front view of a power conversion apparatus according to Embodiment 1 of the present invention. 2 and FIG. 3 are an AA cross-sectional view and a BB cross-sectional view of FIG. 1, respectively.
　図１～図３に示されるように、実施の形態１の電力変換装置は、電力変換モジュール１００と、外部接続端子１０と、絶縁ケース１１と、ヒートシンク１２とで構成される。 As shown in FIGS. 1 to 3, the power conversion apparatus according to the first embodiment includes a power conversion module 100, an external connection terminal 10, an insulating case 11, and a heat sink 12.
　電力変換モジュール１００は、配線パターン状に形成されたリードフレーム１３と、スイッチング可能な半導体素子１４と、配線部材１５と、導電性接合材１７と、モールド樹脂２０とを備えている。配線部材１５は、リードフレーム１３の端子間およびリードフレーム１３と半導体素子１４との間を電気的に接続する。配線部材１５には、大電流用配線部材１５ａと制御用配線部材１５ｂとが含まれる。これらの配線部材１５ａ，１５ｂについては後述する。導電性接合材１７は、リードフレーム１３と半導体素子１４と配線部材１５とを接合する。モールド樹脂２０は、リードフレーム１３と半導体素子１４と配線部材１５と導電性接合材１７とその他の実装部品（図示せず）を封止する。 The power conversion module 100 includes a lead frame 13 formed in a wiring pattern, a switchable semiconductor element 14, a wiring member 15, a conductive bonding material 17, and a mold resin 20. The wiring member 15 electrically connects between the terminals of the lead frame 13 and between the lead frame 13 and the semiconductor element 14. The wiring member 15 includes a large current wiring member 15a and a control wiring member 15b. These wiring members 15a and 15b will be described later. The conductive bonding material 17 bonds the lead frame 13, the semiconductor element 14, and the wiring member 15. The mold resin 20 seals the lead frame 13, the semiconductor element 14, the wiring member 15, the conductive bonding material 17, and other mounting components (not shown).
　電力変換モジュール１００には、絶縁材１８を介在させて、ヒートシンク１２が設けられている。ヒートシンク１２と半導体素子１４との間に絶縁材１８を設けているため、半導体素子１４とヒートシンク１２とは電気的に絶縁されている。一方で、半導体素子１４で発生する熱は、絶縁材１８を介して、ヒートシンク１２に伝導する。従って、半導体素子１４とヒートシンク１２とは熱的に接続されている。ヒートシンク１２は、半導体素子１４で発生した熱を、外気へ効率よく放熱する。 The power conversion module 100 is provided with a heat sink 12 with an insulating material 18 interposed therebetween. Since the insulating material 18 is provided between the heat sink 12 and the semiconductor element 14, the semiconductor element 14 and the heat sink 12 are electrically insulated. On the other hand, the heat generated in the semiconductor element 14 is conducted to the heat sink 12 through the insulating material 18. Therefore, the semiconductor element 14 and the heat sink 12 are thermally connected. The heat sink 12 efficiently radiates heat generated in the semiconductor element 14 to the outside air.
　このように、電力変換モジュール１００は、絶縁材１８を介して、ヒートシンク１２に対して、電気的に絶縁され、熱的に接続された状態で固定されている。あるいは、ヒートシンク１２が、電力変換モジュール１００の被固定部に対向する面に絶縁層を持ち、はんだ付けや放熱グリスなどを介して、電力変換モジュール１００に固定されるようにしてもよい。 Thus, the power conversion module 100 is electrically insulated from the heat sink 12 via the insulating material 18 and fixed in a thermally connected state. Alternatively, the heat sink 12 may have an insulating layer on the surface facing the fixed portion of the power conversion module 100 and be fixed to the power conversion module 100 via soldering, heat dissipation grease, or the like.
　リードフレーム１３には、導電性が良好で熱伝導率の高い銅または銅合金などの金属を用いる。 The lead frame 13 is made of a metal such as copper or copper alloy having good conductivity and high thermal conductivity.
　図１及び図２に示されるように、電力変換モジュール１００の制御用端子２１とパワー端子２２とは、モールド樹脂２０の外部に突出している。制御用端子２１は、半導体素子１４のゲート信号線およびセンサー信号線などである。制御用端子２１は、電力変換装置に搭載された制御基板（図示せず）へ接続される。パワー端子２２は、リードフレーム１３の先端に設けられている。パワー端子２２には、数アンペアから数百アンペア程度の大電流が流れる。パワー端子２２は、絶縁ケース１１にインサートおよびアウトサートされた外部接続端子１０に、溶接または半田付けなどにより接合される。パワー端子２２は、外部接続端子１０を介して、外部に設けられた電力供給装置またはバッテリなどの電源と接続される。 1 and 2, the control terminal 21 and the power terminal 22 of the power conversion module 100 protrude to the outside of the mold resin 20. The control terminal 21 is a gate signal line and a sensor signal line of the semiconductor element 14. The control terminal 21 is connected to a control board (not shown) mounted on the power converter. The power terminal 22 is provided at the tip of the lead frame 13. A large current of several amperes to several hundred amperes flows through the power terminal 22. The power terminal 22 is joined to the external connection terminal 10 inserted and outsert in the insulating case 11 by welding or soldering. The power terminal 22 is connected to an external power supply device or a power source such as a battery via the external connection terminal 10.
　半導体素子１４は、電力用電界効果トランジスタ（パワーＭＯＳＦＥＴ：Power Metal-Oxide-Semiconductor Field-Effect Transistor）、または、絶縁ゲートバイポーラトランジスタ（ＩＧＢＴ：Insulated Gate Bipolar Transistor）などで構成される。これらは、モータなどの機器を駆動するインバータ回路に用いられるもので、数アンペアから数百アンペアの定格電流を制御するものである。 The semiconductor element 14 is configured by a power field effect transistor (Power MOSFET: Power Metal-Oxide-Semiconductor Field-Effect Transistor) or an insulated gate bipolar transistor (IGBT: Insulated Gate Bipolar Transistor). These are used in inverter circuits that drive devices such as motors, and control a rated current of several amperes to several hundred amperes.
　導電性接合材１７は、例えば、半田、銀ペースト、あるいは、導電性接着剤などの、導電性が良好で熱伝導率の高い材料から構成される。導電性接合材１７は、半導体素子１４とリードフレーム１３と配線部材１５とを電気的及び熱的に接続し、固着させるために用いられる。 The conductive bonding material 17 is made of a material having good conductivity and high thermal conductivity, such as solder, silver paste, or conductive adhesive. The conductive bonding material 17 is used for electrically and thermally connecting and fixing the semiconductor element 14, the lead frame 13, and the wiring member 15.
　半導体素子１４の材料として、シリコン（Ｓｉ）、シリコンカーバイド（ＳｉＣ）、ガリウムナイトライド（ＧａＮ）などを用いてよい。 As a material of the semiconductor element 14, silicon (Si), silicon carbide (SiC), gallium nitride (GaN), or the like may be used.
　リードフレーム１３とヒートシンク１２との間に介在する絶縁材１８は、高い熱伝導性を有し、且つ、電気的絶縁性が高い材料から構成される。従って、絶縁材１８は、例えば、熱伝導率が１Ｗ／ｍＫ～数十Ｗ／ｍＫで、且つ、絶縁性のある、シリコーン樹脂、エポキシ樹脂、ウレタン樹脂などの樹脂材料から成る接着剤、グリス、または、絶縁シートで構成される。さらに、絶縁材１８は、セラミック基板または金属基板などの熱抵抗が低く、且つ、絶縁性を有する他の材料と、それらの樹脂材料とを、組み合わせて構成することも可能である。 The insulating material 18 interposed between the lead frame 13 and the heat sink 12 is made of a material having high thermal conductivity and high electrical insulation. Therefore, the insulating material 18 is, for example, an adhesive made of a resin material such as a silicone resin, an epoxy resin, or a urethane resin having a thermal conductivity of 1 W / mK to several tens of W / mK and having an insulating property, grease, Or it is comprised with an insulation sheet. Furthermore, the insulating material 18 can be configured by combining other resin materials having low thermal resistance such as a ceramic substrate or a metal substrate and having an insulating property and those resin materials.
　また、図１～図３では図示していないが、絶縁材１８の厚さを規定するために、モールド樹脂２０の下面側、すなわち、ヒートシンク１２側には、突起が設けられている。モールド樹脂２０の突起をヒートシンク１２に押し当てることで、突起の高さに相当する厚さを規定できるため、絶縁材１８の絶縁性を担保することができる。特に１２Ｖバッテリを使用する低耐圧系の自動車では、予め定められた絶縁耐圧を確保するのに必要な沿面距離は、１０μｍ程度である。従って、低耐圧系の自動車の場合には、絶縁に必要な厚さを薄くできるため、モールド樹脂２０の突起をより短くすることができ、電力変換モジュール１００の薄型化が可能である。 Although not shown in FIGS. 1 to 3, in order to define the thickness of the insulating material 18, a protrusion is provided on the lower surface side of the mold resin 20, that is, on the heat sink 12 side. By pressing the protrusion of the mold resin 20 against the heat sink 12, the thickness corresponding to the height of the protrusion can be defined, so that the insulating property of the insulating material 18 can be ensured. In particular, in a low withstand voltage vehicle using a 12V battery, a creepage distance required to ensure a predetermined withstand voltage is about 10 μm. Therefore, in the case of a low withstand voltage automobile, the thickness necessary for insulation can be reduced, so that the protrusion of the mold resin 20 can be further shortened, and the power conversion module 100 can be made thinner.
　ヒートシンク１２は、モールド樹脂２０に封止された半導体素子１４に電流が流れるときに半導体素子１４に発生する熱を外気へ放熱する役割を有する。ヒートシンク１２は、例えば、アルミニウム、アルミニウム合金などの９０Ｗ／ｍ・Ｋ以上の熱伝導率を有する材料を用いて構成される。ヒートシンク１２の下面には、図３に示すように、複数のフィン１９が配列している。これらのフィン１９は外気に接触しており、ヒートシンク１２はこれらのフィン１９から外気に向かって熱を放熱する。 The heat sink 12 has a role of radiating heat generated in the semiconductor element 14 to the outside air when a current flows through the semiconductor element 14 sealed with the mold resin 20. The heat sink 12 is configured using a material having a thermal conductivity of 90 W / m · K or more, such as aluminum or an aluminum alloy. As shown in FIG. 3, a plurality of fins 19 are arranged on the lower surface of the heat sink 12. These fins 19 are in contact with the outside air, and the heat sink 12 radiates heat from these fins 19 toward the outside air.
　配線部材１５には、上述したように、大電流用の大電流用配線部材１５ａと制御用の制御用配線部材１５ｂとが含まれる。 As described above, the wiring member 15 includes a large current wiring member 15a for large current and a control wiring member 15b for control.
　制御用配線部材１５ｂは、例えば、半導体素子１４のゲート及びセンサー部と、制御用端子２１とを接続するために使用される。なお、制御用配線部材１５ｂは、例えば、金・銅・アルミニウムなどのワイヤボンド、または、アルミニウムのリボンボンドで形成することができる。但し、これらに限定されない。 The control wiring member 15 b is used, for example, to connect the gate and sensor unit of the semiconductor element 14 and the control terminal 21. The control wiring member 15b can be formed by, for example, a wire bond such as gold, copper, or aluminum, or a ribbon bond of aluminum. However, it is not limited to these.
　大電流用配線部材１５ａは、リードフレーム１３の端子間、または、半導体素子１４とリードフレーム１３のパワー端子２２との間などを接続するために使用される。大電流用配線部材１５ａには、図３に示すように、ヒューズ部１６が形成されている。ヒューズ部１６は、大電流用配線部材１５ａの通電経路内に設けられている。ヒューズ部１６は、大電流用配線部材１５ａの通電経路内であれば、いずれの箇所に設けてもよい。但し、大電流用配線部材１５ａの通電経路であっても、リードフレーム１３との接合部、及び、半導体素子１４との接合部には、ヒューズ部１６は設けない。図３では、大電流用配線部材１５ａの接合部の厚さがヒューズ部１６の厚さよりも厚くなっているが、この場合に限らず、同じ厚さにしてもよい。あるいは、大電流用配線部材１５ａの接合部の厚さを、ヒューズ部１６の厚さよりも薄くしてもよい。 The large current wiring member 15 a is used for connecting between the terminals of the lead frame 13 or between the semiconductor element 14 and the power terminal 22 of the lead frame 13. As shown in FIG. 3, a fuse portion 16 is formed in the large current wiring member 15a. The fuse portion 16 is provided in the energization path of the large current wiring member 15a. The fuse portion 16 may be provided at any location as long as it is within the energization path of the large current wiring member 15a. However, the fuse portion 16 is not provided at the junction with the lead frame 13 and the junction with the semiconductor element 14 even in the energization path of the large current wiring member 15a. In FIG. 3, the thickness of the joint portion of the large current wiring member 15a is thicker than the thickness of the fuse portion 16. However, the thickness is not limited to this case, and may be the same. Alternatively, the thickness of the junction portion of the large current wiring member 15 a may be made thinner than the thickness of the fuse portion 16.
　大電流用配線部材１５ａには、数アンペアから数百アンペア程度の大電流が流れるため、電流値に合わせた断面積を有する必要がある。また、通電時のジュール発熱を抑えるために、大電流用配線部材１５ａは、例えば、銅、銅合金、アルミニウム、アルミニウム合金などの導電性の良好な金属で構成される。大電流用配線部材１５ａは、例えば、０．１ｍｍ～２ｍｍ程度の厚みを有する金属プレートを打ち抜き加工することにより形成することができる。なお、大電流用配線部材１５ａをアルミニウムで構成する場合、アルミニウムに対し、スズまたはニッケルでメッキを施すことで、接合部の半田付けが良好になる。 Since a large current of about several amperes to several hundred amperes flows through the large current wiring member 15a, it is necessary to have a cross-sectional area corresponding to the current value. Further, in order to suppress Joule heat generation during energization, the large current wiring member 15a is made of a metal having good conductivity such as copper, copper alloy, aluminum, and aluminum alloy. The large current wiring member 15a can be formed, for example, by punching a metal plate having a thickness of about 0.1 mm to 2 mm. In the case where the high-current wiring member 15a is made of aluminum, the soldering of the joint portion is improved by plating the aluminum with tin or nickel.
　図３に示すように、大電流用配線部材１５ａのヒューズ部１６の下面側、すなわち、半導体素子１４側のエリアを「エリアＲ１」とし、ヒューズ部１６の上面側を「エリアＲ２」とする。このとき、エリアＲ１におけるモールド樹脂２０の厚さとエリアＲ２におけるモールド樹脂２０の厚さとは互いに異なり、エリアＲ２におけるモールド樹脂２０の厚さの方が、エリアＲ１よりも薄くなるように構成されている。 3, the lower surface side of the fuse portion 16 of the large current wiring member 15a, that is, the area on the semiconductor element 14 side is referred to as “area R1”, and the upper surface side of the fuse portion 16 is referred to as “area R2”. At this time, the thickness of the mold resin 20 in the area R1 and the thickness of the mold resin 20 in the area R2 are different from each other, and the thickness of the mold resin 20 in the area R2 is configured to be thinner than the area R1. .
　次に、大電流用配線部材１５ａに形成したヒューズ部１６について説明する。図４は、大電流用配線部材１５ａの上面図である。 Next, the fuse part 16 formed in the high-current wiring member 15a will be described. FIG. 4 is a top view of the high-current wiring member 15a.
　図４に示すように、ヒューズ部１６は、大電流用配線部材１５ａの接合部を除いた通電経路内に、切り欠き部３３を設けることで形成される。図４の例では、切り欠き部３３は、丸穴から構成されている。ヒューズ部１６の形成方法は、図４に示すように、大電流用配線部材１５ａを構成している金属プレートに対して、切り欠き部３３としての丸穴を空けることで、ヒューズ部１６は形成される。このように、ヒューズ部１６は、大電流用配線部材１５ａの一部から構成される。従って、ヒューズ部１６は、大電流用配線部材１５ａと、同一材料で、一体化して、生成される。従って、新たにヒューズ用の部材を追加する必要がない。そのため、部品点数の追加が無く、コストもかからない。また、切り欠き部３３を設けたことで、ヒューズ部１６の断面積は、切り欠き部３３の分だけ、大電流用配線部材１５ａの他の部分に比べて、小さくなる。そのため、図５の太線の矢印Ｃ２で示すように、他の部分に流れる電流Ｃ１に比べて、ヒューズ部１６のみ局所的に電流密度が増加する。これにより、大電流用配線部材１５ａに電流が流れた時に、ヒューズ部１６のみ、放熱性の悪化と発熱密度の増加とにより、局所的に温度が上昇することとなる。 As shown in FIG. 4, the fuse portion 16 is formed by providing a notch portion 33 in the energization path excluding the joint portion of the large current wiring member 15a. In the example of FIG. 4, the notch 33 is configured by a round hole. As shown in FIG. 4, the fuse part 16 is formed by forming a round hole as the notch 33 in the metal plate constituting the large current wiring member 15a. Is done. Thus, the fuse part 16 is comprised from a part of large current wiring member 15a. Accordingly, the fuse portion 16 is produced by being integrated with the high current wiring member 15a using the same material. Therefore, it is not necessary to add a new fuse member. Therefore, the number of parts is not added and the cost is not increased. Further, by providing the notch portion 33, the cross-sectional area of the fuse portion 16 is smaller than the other portion of the large current wiring member 15a by the notch portion 33. Therefore, as indicated by the thick arrow C2 in FIG. 5, the current density is locally increased only in the fuse portion 16 as compared with the current C1 flowing in other portions. As a result, when a current flows through the large current wiring member 15a, the temperature of the fuse portion 16 only rises locally due to deterioration in heat dissipation and increase in heat generation density.
　ヒューズ部１６に過大な電流が流れた場合、短時間のうちに急激にヒューズ部１６の温度が上昇する。そして、大電流用配線部材１５ａを構成する金属の溶点まで温度が上昇すると、ヒューズ部１６が熱により断裂してはじけ飛ぶ。このとき、ヒューズ部１６は、モールド樹脂２０の厚さが薄いエリアＲ２部分のモールド樹脂２０を上面側に吹き飛ばし、ヒューズ部１６がモールド樹脂２０の外側に弾け飛ぶことで、大電流用配線部材１５ａとヒューズ部１６の離間距離を大きくすることができ、大電流用配線部材１５ａとヒューズ部１６が接触して再度通電することを防ぐ。さらにヒューズ部１６がモールド樹脂２０の外側に弾け飛びやすいことから、大電流用配線部材１５ａの断裂部の離間距離を大きくすることができ、大電流用配線部材１５ａに流れる過電流を確実に遮断できる。 When an excessive current flows through the fuse part 16, the temperature of the fuse part 16 rises rapidly in a short time. When the temperature rises to the melting point of the metal constituting the large current wiring member 15a, the fuse portion 16 is broken by heat and flies away. At this time, the fuse portion 16 blows away the mold resin 20 in the area R2 where the thickness of the mold resin 20 is thin to the upper surface side, and the fuse portion 16 bounces off the outside of the mold resin 20, whereby the large current wiring member 15a. And the fuse portion 16 can be separated from each other, thereby preventing the large current wiring member 15a and the fuse portion 16 from coming into contact with each other and energizing again. Further, since the fuse portion 16 is likely to jump to the outside of the mold resin 20, the separation distance of the tearing portion of the high current wiring member 15 a can be increased, and the overcurrent flowing through the high current wiring member 15 a can be reliably cut off. it can.
　モールド樹脂２０は、配線部材１５の上面側のエリアＲ２が、下面側のエリアＲ１よりも厚さが薄いため、ヒューズ部１６の断裂時には、上面側のモールド樹脂２０がヒューズ部１６と共に電力変換モジュール１００の外部に向かって吹き飛ぶ。従来の半導体装置のように、もし、ヒューズ部１６が吹き飛ばずに、電力変換モジュール１００内に残留していると、断裂したヒューズ部１６の金属が熱で溶解して、再度、リードフレーム１３または半導体素子１４と電気的に接続してしまい、その結果、電流が再度流れてしまうことになる。そのため、実施の形態１では、ヒューズ部１６の上側のモールド樹脂２０を薄くしておき、ヒューズ部１６をモールド樹脂２０と共に外部に向かって吹き飛ばすことで、溶解したヒューズ部１６の付着により電流が再び流れることを防ぐことができる。さらに、自動車向けの１２Ｖバッテリを使用する低耐圧系では、大電流が流れると、バッテリ電圧が低下して１０Ｖを下回るため、ヒューズ部１６の断裂時にアークが発生しないため、構造をより簡素化でき、電力変換装置のさらなる小型化および低コスト化が可能である。 The mold resin 20 has an area R2 on the upper surface side of the wiring member 15 thinner than the area R1 on the lower surface side. Therefore, when the fuse part 16 is torn, the mold resin 20 on the upper surface side together with the fuse part 16 is a power conversion module. Blow away toward the outside of 100. As in the conventional semiconductor device, if the fuse portion 16 is not blown away and remains in the power conversion module 100, the metal of the torn fuse portion 16 is melted by heat, and the lead frame 13 or The semiconductor element 14 is electrically connected, and as a result, the current flows again. For this reason, in the first embodiment, the mold resin 20 on the upper side of the fuse portion 16 is thinned, and the fuse portion 16 is blown off together with the mold resin 20 so that the current flows again due to the adhesion of the melted fuse portion 16. It can be prevented from flowing. Furthermore, in a low withstand voltage system using a 12V battery for automobiles, when a large current flows, the battery voltage drops to below 10V, so that no arc is generated when the fuse portion 16 is broken, and the structure can be further simplified. Further, the power conversion device can be further reduced in size and cost.
　なお、図４の例では、金属プレートに丸穴をあけることでヒューズ部１６の断面積を減らしたが、プレス加工などにより局所的に金属プレートの厚さを減らすことでもヒューズ部１６の断面積を減らすことができるため、同様の効果が得られることは言うまでもない。また、丸穴の形成と厚さを減らすこととを組み合わせて、ヒューズ部１６を形成してもよい。 In the example of FIG. 4, the cross-sectional area of the fuse portion 16 is reduced by making a round hole in the metal plate, but the cross-sectional area of the fuse portion 16 can also be reduced by locally reducing the thickness of the metal plate by pressing or the like. Needless to say, similar effects can be obtained. Further, the fuse portion 16 may be formed by combining the formation of the round hole and the reduction of the thickness.
　図６に、大電流用配線部材１５ａに電流を流した時の温度分布を示す。 FIG. 6 shows a temperature distribution when a current is passed through the large current wiring member 15a.
　図６は、図４に示す大電流用配線部材１５ａに過大な電流が流れてヒューズ部１６が融点に達した時の大電流用配線部材１５ａの温度分布である。図６に示すように、大電流用配線部材１５ａにおいて、ヒューズ部１６のみが局所的に高温になるが、このとき、大電流用配線部材１５ａの両端の接合部に向かって、温度勾配がついていることがわかる。従って、ヒューズ部１６が断裂しても、接合部が破壊することはない。また、切り欠き部３３を構成する丸穴の大きさを変えることで、融点に達した時の電流と、融点に達してヒューズ部１６が断裂するまでの時間とを調整することができる。 FIG. 6 is a temperature distribution of the large current wiring member 15a when an excessive current flows through the large current wiring member 15a shown in FIG. 4 and the fuse portion 16 reaches the melting point. As shown in FIG. 6, in the large current wiring member 15a, only the fuse portion 16 is locally heated, but at this time, there is a temperature gradient toward the joint at both ends of the large current wiring member 15a. I understand that. Therefore, even if the fuse part 16 is torn, the joint part is not destroyed. Further, by changing the size of the round hole constituting the notch 33, it is possible to adjust the current when the melting point is reached and the time until the melting point 16 is reached when the melting point is reached.
　以上のように、実施の形態１では、電力変換モジュール１００に用いる大電流用配線部材１５ａに切り欠き部３３を設けて局所的に断面積を減らすことで、ヒューズ部１６を形成している。このように、大電流用配線部材１５ａの一部をヒューズ部１６として用いているため、新たにヒューズ用の部材を追加する必要がない。そのため、部品点数の追加が無く、実装工数も増加しないため、生産性が高い。また、電力変換装置が大型化することもない。 As described above, in the first embodiment, the fuse portion 16 is formed by providing the cutout portion 33 in the large current wiring member 15a used in the power conversion module 100 to locally reduce the cross-sectional area. As described above, since a part of the large current wiring member 15a is used as the fuse portion 16, it is not necessary to newly add a fuse member. Therefore, the number of parts is not added and the number of mounting steps is not increased, so that productivity is high. In addition, the power converter is not increased in size.
　また、実施の形態１では、大電流用配線部材１５ａのヒューズ部１６の上面側と下面側とでモールド樹脂２０の厚さを変え、上面側のモールド樹脂２０の厚さを薄くしている。これにより、過電流によりヒューズ部１６が断裂した時に、上面側のモールド樹脂２０を吹き飛ばすことが可能である。これにより、断裂したヒューズ部１６も、モールド樹脂２０とともに、外側に吹き飛ぶ。その結果、断裂したヒューズ部１６の金属が溶解して、ヒューズ部１６の下側にあるリードフレーム１３と接触し短絡することを防ぐことができる。また、ヒューズ部１６を吹き飛ばすことで、大電流用配線部材１５ａの断裂部の離間距離が稼げるため、大電流用配線部材１５ａが再び導通するのを抑制することができ、確実に過電流を遮断することができる。その結果、電力変換装置の発煙および発火が防止できる。 In the first embodiment, the thickness of the mold resin 20 is changed between the upper surface side and the lower surface side of the fuse portion 16 of the large current wiring member 15a, and the thickness of the mold resin 20 on the upper surface side is reduced. Thereby, when the fuse part 16 is torn by an overcurrent, it is possible to blow off the mold resin 20 on the upper surface side. As a result, the torn fuse part 16 is also blown out together with the mold resin 20. As a result, it is possible to prevent the broken metal of the fuse part 16 from melting and coming into contact with the lead frame 13 under the fuse part 16 and short-circuiting. Further, by blowing away the fuse portion 16, the separation distance of the tearing portion of the high current wiring member 15a can be increased, so that the high current wiring member 15a can be prevented from conducting again, and the overcurrent can be reliably cut off. can do. As a result, smoke and ignition of the power converter can be prevented.
　また、ヒューズ部１６を設けることで、大電流用配線部材１５ａの断面積が少なくとも部分的に減り、剛性が低くなるため、温度変化による熱応力が緩和され、接合部の信頼性の向上が期待できる。 Further, by providing the fuse portion 16, the cross-sectional area of the high-current wiring member 15a is at least partially reduced and the rigidity is lowered. Therefore, thermal stress due to a temperature change is alleviated, and the reliability of the joint portion is expected to be improved. it can.
　また、図４の例では、切り欠き部３３の形状を丸穴としたが、他の形状でもよい。すなわち、切り欠き部３３の形状は、図７に示す例（ａ），（ｂ），（ｄ）のように、楕円形でもよく、あるいは、図７に示す例（ｃ）のように、三角形でもよく、あるいは、図７に示す例（ｅ）のように、長方形または正方形などの四角形でもよく、あるいは、五角形および六角形などの他の多角形でもよい。さらに、図７に示す例（ｉ）のように、台形でもよく、あるいは、図７に示す例（ｈ）のように、ひし形でもよく、あるいは、平行四辺形などでもよい。 In the example of FIG. 4, the shape of the notch 33 is a round hole, but other shapes may be used. That is, the shape of the notch 33 may be an ellipse as shown in the examples (a), (b), and (d) shown in FIG. 7, or a triangle as shown in the example (c) shown in FIG. Alternatively, as shown in the example (e) shown in FIG. 7, it may be a rectangle such as a rectangle or a square, or another polygon such as a pentagon and a hexagon. Furthermore, it may be trapezoidal as in example (i) shown in FIG. 7, or may be rhombus or parallelogram as in example (h) shown in FIG.
　また、切り欠き部３３の個数については、図７に示す例（ａ）～（ｃ），（ｅ），（ｈ），（ｉ）のように、１個の切り欠き部３３のみを設けてもよく、あるいは、図７に示す例（ｄ），（ｆ），（ｇ）のように、複数個の切り欠き部３３を設けるようにしてもよい。さらに、切り欠き部３３を複数個設ける場合は、それらの切り欠き部３３を、図７に示す例（ｄ）のように、大電流用配線部材１５ａの幅方向に配置しても、あるいは、図７に示す例（ｆ）のように、長さ方向に配置してもよく、あるいは、千鳥配置など互い違いに配置してもよく、あるいは、不規則に配置してもよい。 As for the number of notches 33, only one notch 33 is provided as in the examples (a) to (c), (e), (h), and (i) shown in FIG. Alternatively, a plurality of notches 33 may be provided as in the examples (d), (f), and (g) shown in FIG. Further, when a plurality of cutout portions 33 are provided, the cutout portions 33 may be arranged in the width direction of the large current wiring member 15a as in the example (d) shown in FIG. As in the example (f) shown in FIG. 7, they may be arranged in the length direction, may be arranged alternately such as a staggered arrangement, or may be arranged irregularly.
　また、図７に示す例（ｇ）のように、丸と楕円というように形状が異なる複数の切り欠き部３３を組み合わせることも可能である。さらに、図７に示す例（ｇ）では、丸穴の方が、楕円の穴よりも大きいが、このように、大きさの異なる複数の切り欠き部３３を組み合わせることも可能である。 Further, as in the example (g) shown in FIG. 7, it is possible to combine a plurality of cutout portions 33 having different shapes such as a circle and an ellipse. Further, in the example (g) shown in FIG. 7, the round hole is larger than the elliptical hole, but it is also possible to combine a plurality of cutout portions 33 having different sizes.
　また、図４の例においては、大電流用配線部材１５ａの幅方向の中央位置に切り欠き部３３を設けているが、この場合に限らず、例えば、図８に示す例（ｊ），（ｌ）のように、大電流用配線部材１５ａの幅方向の片側に切り欠き部３３を設けてもよく、あるいは、図８に示す例（ｋ），（ｍ）のように、大電流用配線部材１５ａの幅方向の両側に切り欠き部３３を設けてもよい。いずれの場合も、大電流用配線部材１５ａの断面積が切り欠き部３３により低減されているため、同様の効果が得られる。また、片側および両側に切り欠き部３３を設ける場合のいずれにおいても、切り欠き部３３の形状は、図８の例（ｊ）～（ｍ）に限らず、楕円形、長方形および長方形などの四角形、五角形および六角形などの他の多角形、台形、ひし形、平行四辺形などでもよい。また、それらの切り欠き部３３の個数は、１個でも、複数個でもよい。すなわち、切り欠き部３３の形状および個数は、大電流用配線部材１５ａにおいて局所的に断面積を減らす形状および個数であれば何でもよく、上述した形状および個数に限定されるものではない。 In the example of FIG. 4, the notch 33 is provided at the center position in the width direction of the large current wiring member 15a. However, the present invention is not limited to this example. For example, the example (j), ( l), a notch 33 may be provided on one side in the width direction of the large current wiring member 15a, or a large current wiring as in the examples (k) and (m) shown in FIG. The notches 33 may be provided on both sides in the width direction of the member 15a. In any case, since the cross-sectional area of the high-current wiring member 15a is reduced by the notch 33, the same effect can be obtained. Further, in both cases where the cutout portions 33 are provided on one side and both sides, the shape of the cutout portion 33 is not limited to the examples (j) to (m) of FIG. 8, and is a quadrangle such as an ellipse, a rectangle, and a rectangle. Other polygons such as pentagons and hexagons, trapezoids, rhombuses, parallelograms, etc. may be used. Further, the number of the notches 33 may be one or plural. That is, the shape and the number of the notches 33 may be any shape and number that locally reduce the cross-sectional area in the high-current wiring member 15a, and are not limited to the shape and number described above.
　実施の形態２．
　この発明の実施の形態２に係る電力変換装置を、図９を参照して説明する。図９は、実施の形態２における電力変換装置の断面図である。なお、図９においては、図３に示した構成と同一または対応する部分については、同一の符号を付し、ここでは、その説明を省略する。また、実施の形態２は、基本的に実施の形態１で説明した思想を前提とするものである。 Embodiment 2. FIG.
A power conversion apparatus according to Embodiment 2 of the present invention will be described with reference to FIG. FIG. 9 is a cross-sectional view of the power conversion device according to the second embodiment. 9, parts that are the same as or correspond to those in the configuration shown in FIG. 3 are given the same reference numerals, and descriptions thereof are omitted here. The second embodiment is basically based on the idea described in the first embodiment.
　上記の実施の形態１の電力変換装置では、図３に示すように、電力変換モジュール１００において、大電流用配線部材１５ａの高さと、制御用配線部材１５ｂおよび他の電子部品の高さとを比較すると、制御用配線部材１５ｂおよび他の電子部品の高さの方が、大電流用配線部材１５ａよりも高い。そのため、モールド樹脂２０は、制御用配線部材１５ｂ及び他の電子部品の高さに応じた厚みとなっている。その結果、ヒューズ部１６の上側に設けられたモールド樹脂２０の厚さを薄くするには限界があり、ヒューズ部１６の設計制約となっていた。 In the power conversion device of the first embodiment, as shown in FIG. 3, in the power conversion module 100, the height of the large current wiring member 15a is compared with the height of the control wiring member 15b and other electronic components. Then, the height of the control wiring member 15b and other electronic components is higher than that of the large current wiring member 15a. Therefore, the mold resin 20 has a thickness corresponding to the height of the control wiring member 15b and other electronic components. As a result, there is a limit in reducing the thickness of the mold resin 20 provided on the upper side of the fuse portion 16, which is a design constraint for the fuse portion 16.
　そこで、実施の形態２では、図９に示すように、大電流用配線部材１５ａのヒューズ部１６の上側に設けられたエリアＲ２のモールド樹脂２０の上面に凹み部２４を設けている。凹み部２４の位置は、図９に示すように、ちょうどヒューズ部１６の真上になるように、ヒューズ部１６の位置に対応している。これにより、部分的にモールド樹脂２０の厚さを薄くするが可能となり、背の高い配線部材１５や電子部品をそのまま使用できる。 Therefore, in the second embodiment, as shown in FIG. 9, the recess 24 is provided on the upper surface of the mold resin 20 in the area R2 provided on the upper side of the fuse portion 16 of the high current wiring member 15a. As shown in FIG. 9, the position of the recessed portion 24 corresponds to the position of the fuse portion 16 so that it is just above the fuse portion 16. Thereby, the thickness of the mold resin 20 can be partially reduced, and the tall wiring member 15 and the electronic component can be used as they are.
　なお、凹み部２４の個数は、１個であっても、複数個であってもよい。また、凹み部２４は、成形型を用いてモールド樹脂２０で電力変換モジュール１００を封止するときに同時に形成してもよく、あるいは、モールド樹脂２０で電力変換モジュール１００を封止した後に、モールド樹脂２０の一部を切り欠くことで、凹み部２４を形成するようにしてもよい。 In addition, the number of the recessed parts 24 may be one or plural. The recess 24 may be formed at the same time when the power conversion module 100 is sealed with the mold resin 20 using a mold, or after the power conversion module 100 is sealed with the mold resin 20 The recess 24 may be formed by cutting out a part of the resin 20.
　実施の形態２においては、凹み部２４を設けることで、ヒューズ部１６の上側のみモールド樹脂２０を薄くして、電力変換モジュール１００を構成することができる。これにより、ヒューズ部１６に過大な電流が流れた場合、短時間のうちに、急激に、ヒューズ部１６の温度が上昇する。そうして、ヒューズ部１６を構成している金属の溶点に温度が達すると、ヒューズ部１６が断裂して、はじけ飛ぶ。その時に、ヒューズ部１６と共に、ヒューズ部１６の上側のエリアＲ２部分のモールド樹脂２０も同時にはじけ飛ぶ。このように、ヒューズ部１６とその上側のモールド樹脂２０とをはじけ飛ばして離間距離を稼ぐことで、過電流を確実に遮断できる。ヒューズ部１６は断裂時に吹き飛ぶため、断裂したヒューズ部１６の残骸が、電力変換モジュール１００内に残留しない。もし、残留している場合には、断裂したヒューズ部１６の金属が溶解して、リードフレーム１３、半導体素子１４、または、制御用配線部材１５ｂなどに電気的に接触してしまい、再度、電流が流れる可能性がある。しかしながら、実施の形態２では、ヒューズ部１６が残留しないので、電流が再度流れることを確実に防ぐことができる。 In the second embodiment, the power conversion module 100 can be configured by providing the recess 24 so that the mold resin 20 is thinned only on the upper side of the fuse portion 16. As a result, when an excessive current flows through the fuse portion 16, the temperature of the fuse portion 16 rapidly increases in a short time. Then, when the temperature reaches the melting point of the metal constituting the fuse part 16, the fuse part 16 is torn and flies off. At that time, together with the fuse part 16, the mold resin 20 in the area R2 on the upper side of the fuse part 16 is also simultaneously blown off. In this way, the overcurrent can be surely interrupted by blowing away the fuse portion 16 and the mold resin 20 on the upper side to gain a separation distance. Since the fuse part 16 blows off at the time of the rupture, the remains of the ruptured fuse part 16 do not remain in the power conversion module 100. If it remains, the metal of the torn fuse portion 16 is melted and electrically contacts the lead frame 13, the semiconductor element 14, the control wiring member 15 b, etc. May flow. However, in the second embodiment, since the fuse portion 16 does not remain, it is possible to reliably prevent the current from flowing again.
　なお、図９の例では、ヒューズ部１６の上側のエリアＲ２に、モールド樹脂２０が存在しているが、その場合に限らず、図１０に示すように、凹み部２４の深さを深くして、ヒューズ部１６を外部に露出させてもよい。すなわち、図１０においては、凹み部２４が、ヒューズ部１６の上面まで達する貫通穴となっており、ヒューズ部１６は、貫通穴を通して外部に露出している。従って、ヒューズ部１６の上側には、モールド樹脂２０が設けられていない。また、図１０の例では、ヒューズ部１６部分だけでなく、ヒューズ部１６の近傍の大電流用配線部材１５ａの一部も外部に露出している。このように、ヒューズ部１６の上側のエリアＲ２のモールド樹脂２０を無くした場合には、ヒューズ部１６の放熱性が悪化し、ヒューズ部１６に過電流が流れたときに、温度が上昇しやすくなり、ヒューズ部１６が断裂するまでの時間を短くすることができる効果がある。 In the example of FIG. 9, the mold resin 20 is present in the area R <b> 2 above the fuse portion 16. However, the present invention is not limited to this, and as shown in FIG. 10, the depth of the recessed portion 24 is increased. Thus, the fuse portion 16 may be exposed to the outside. That is, in FIG. 10, the recessed portion 24 is a through hole reaching the upper surface of the fuse portion 16, and the fuse portion 16 is exposed to the outside through the through hole. Therefore, the mold resin 20 is not provided above the fuse portion 16. In the example of FIG. 10, not only the fuse portion 16 part but also a part of the large current wiring member 15 a in the vicinity of the fuse portion 16 is exposed to the outside. Thus, when the mold resin 20 in the upper area R2 of the fuse part 16 is eliminated, the heat dissipation of the fuse part 16 deteriorates, and the temperature easily rises when an overcurrent flows through the fuse part 16. Thus, there is an effect that the time until the fuse portion 16 is broken can be shortened.
　あるいは、図１１に示すように、図１０の凹み部２４部分に対して、熱伝導率の小さい封止材２６を充填させて封止してもよい。図１１は、図１０の凹み部２４に対して封止材２６を充填させているが、図９の凹み部２４に対して封止材２６を充填させてもよい。封止材２６は、モールド樹脂２０の熱伝導率よりも熱伝導率が小さい材料から構成する。例えば、モールド樹脂２０の熱伝導率が０．５～数Ｗ／ｍＫ程度とすると、封止材２６の熱伝導率は、０．２～０．５Ｗ／ｍＫ程度であることが望ましい。封止材２６は、例えば、そのような範囲の熱伝導率を有するシリコーン樹脂などから構成する。このように、凹み部２４に封止材２６を充填させることで、ヒューズ部１６の放熱性が悪化し、ヒューズ部１６に過電流が流れたときに、温度が上昇しやすくなり、ヒューズ部１６が断裂するまでの時間を短くできる効果がある。さらに、封止材２６をシリコーン樹脂で構成した場合には、消弧作用が期待できる。また、ヒューズ部１６の断裂時の消音効果がある。 Alternatively, as shown in FIG. 11, the recess 24 in FIG. 10 may be filled with a sealing material 26 having a low thermal conductivity and sealed. In FIG. 11, the sealing material 26 is filled in the recess 24 of FIG. 10, but the sealing material 26 may be filled in the recess 24 of FIG. 9. The sealing material 26 is made of a material having a thermal conductivity smaller than that of the mold resin 20. For example, if the thermal conductivity of the mold resin 20 is about 0.5 to several W / mK, the thermal conductivity of the sealing material 26 is preferably about 0.2 to 0.5 W / mK. The sealing material 26 is made of, for example, a silicone resin having a thermal conductivity in such a range. Thus, by filling the recess 24 with the sealing material 26, the heat dissipation of the fuse part 16 is deteriorated, and when an overcurrent flows through the fuse part 16, the temperature easily rises, and the fuse part 16. This has the effect of shortening the time until tearing. Furthermore, when the sealing material 26 is made of a silicone resin, an arc extinguishing action can be expected. Further, there is a silencing effect when the fuse portion 16 is broken.
　あるいは、図１２に示すように、モールド樹脂２０の上面に、フタ２５を設けるようにしてもよい。図１２は、図１０の構成に対してフタ２５を追加しているが、図９または図１１の構成に対してフタ２５を追加してもよい。このように、フタ２５を設けることで、電力変換モジュール１００から空気を遮断するので、電力変換モジュール１００内で発火または発煙がおきにくい。また、たとえ、電力変換モジュール１００内で発火または発煙がおきても、電力変換モジュール１００の外部が延焼するのを防ぐことができる。フタ２５の材料としては、融点の高い例えば鉄などの金属またはセラミックを用いることが望ましい。また、モールド樹脂２０とフタ２５との隙間を無くすため、フタ２５はモールド樹脂２０に対して接着剤などで接合される。なお、フタ２５の材料および隙間を生める方法は、これらに限定されるものではない。 Alternatively, as shown in FIG. 12, a lid 25 may be provided on the upper surface of the mold resin 20. In FIG. 12, the lid 25 is added to the configuration of FIG. 10, but the lid 25 may be added to the configuration of FIG. 9 or FIG. Thus, by providing the lid 25, air is shut off from the power conversion module 100, so that it is difficult for ignition or smoke to occur in the power conversion module 100. Moreover, even if ignition or smoke occurs in the power conversion module 100, it is possible to prevent the outside of the power conversion module 100 from spreading. As a material of the lid 25, it is desirable to use a metal having a high melting point such as iron or ceramic. Further, in order to eliminate the gap between the mold resin 20 and the lid 25, the lid 25 is bonded to the mold resin 20 with an adhesive or the like. Note that the material of the lid 25 and the method of creating the gap are not limited to these.
　以上のように、実施の形態２においても、上記の実施の形態１と同様に、大電流用配線部材１５ａがヒューズ部１６を有し、かつ、ヒューズ部１６の上側のモールド樹脂２０の厚さを薄くしたので、ヒューズ部１６の断裂時に、ヒューズ部１６の上側のモールド樹脂２０を同時に吹き飛ばして、離間距離を稼ぎ、ヒューズ部１６が断裂した後に、ヒューズ部１６の残骸が他の部品に接触することで再度導通してしまうことを抑制することができ、電力変換装置の発煙および発火が防止できる。 As described above, also in the second embodiment, the large current wiring member 15a has the fuse portion 16 and the thickness of the mold resin 20 on the upper side of the fuse portion 16 is the same as in the first embodiment. When the fuse portion 16 is torn, the mold resin 20 on the upper side of the fuse portion 16 is blown off at the same time to increase the separation distance. After the fuse portion 16 is torn, the debris of the fuse portion 16 contacts other parts. By doing so, it is possible to suppress conduction again, and it is possible to prevent smoke and ignition of the power converter.
　さらに、実施の形態２では、ヒューズ部１６の上側のモールド樹脂２０に凹み部２４を設けることで、モールド樹脂２０の厚さをさらに薄くしている。そのため、制御用配線部材１５ｂおよび他の電子部品の高さに係わらず、ヒューズ部１６の上側のモールド樹脂２０の高さのみを独立して薄くすることができる。これにより、ヒューズ部１６の形状の選択肢が広がるとともに、背の高い配線部材および電子部品も使用することができるため、設計自由度を上げることができる。また、モールド樹脂２０に単に凹み部２４を設けるだけでよいため、部品点数の追加が無く、実装工数も増加しないため、生産性が高い。 Furthermore, in Embodiment 2, the thickness of the mold resin 20 is further reduced by providing the recess 24 in the mold resin 20 on the upper side of the fuse portion 16. Therefore, regardless of the height of the control wiring member 15b and other electronic components, only the height of the mold resin 20 above the fuse portion 16 can be made thin independently. As a result, the choice of the shape of the fuse portion 16 is widened, and since a tall wiring member and electronic component can be used, the degree of design freedom can be increased. Further, since it is only necessary to provide the recess 24 in the mold resin 20, there is no additional number of parts and the number of mounting steps does not increase, so that productivity is high.
　実施の形態３．
　この発明の実施の形態３に係る電力変換装置を、図１３を参照して説明する。図１３は、実施の形態３における電力変換装置の断面図である。なお、図１３においては、図３に示した構成と同一または対応する部分については、同一の符号を付し、ここでは、その説明を省略する。また、実施の形態３は、基本的に実施の形態１で説明した思想を前提とするものである。 Embodiment 3 FIG.
A power conversion apparatus according to Embodiment 3 of the present invention will be described with reference to FIG. FIG. 13 is a cross-sectional view of the power conversion device according to the third embodiment. In FIG. 13, the same or corresponding parts as those in the configuration shown in FIG. 3 are denoted by the same reference numerals, and the description thereof is omitted here. Further, the third embodiment basically assumes the idea described in the first embodiment.
　上記の実施の形態１，２に係る電力変換装置では、電力変換モジュール１００において、大電流用配線部材１５ａの高さよりも、制御用配線部材１５ｂ及び他の電子部品の高さの方が高いため、モールド樹脂２０の厚さを薄くするには限界があり、ヒューズ部１６の設計制約となっていた。 In the power conversion device according to the first and second embodiments, in the power conversion module 100, the height of the control wiring member 15b and other electronic components is higher than the height of the large current wiring member 15a. There is a limit to reducing the thickness of the mold resin 20, which is a design constraint for the fuse portion 16.
　そこで、実施の形態３では、図１３に示すように、制御用配線部材１５ｂおよび他の電子部品の高さが、大電流用配線部材１５ａよりも低くなるように構成している。これにより、上記の実施の形態２のように凹み部２４を設けなくても、ヒューズ部１６のモールド樹脂２０の厚さを薄くできる。 Therefore, in the third embodiment, as shown in FIG. 13, the height of the control wiring member 15b and other electronic components is configured to be lower than that of the large current wiring member 15a. Thereby, the thickness of the mold resin 20 of the fuse portion 16 can be reduced without providing the recessed portion 24 as in the second embodiment.
　これにより、ヒューズ部１６に過大な電流が流れた場合、短時間のうちに急激にヒューズ部１６の温度が上昇し、ヒューズ部１６を構成する金属の溶点に達すると、ヒューズ部１６が断裂して、はじけ飛ぶ。その時に、ヒューズ部１６の上側の厚さの薄い部分のモールド樹脂２０を同時に吹き飛ばし、離間距離を稼ぐことで、過電流を確実に遮断できる。また、ヒューズ部１６の断裂時に、モールド樹脂２０が同時に吹き飛ぶため、断裂したヒューズ部１６の金属が、リードフレーム１３、半導体素子１４、あるいは、制御用配線部材１５ｂと電気的に接続し、再度、電流が流れることを確実に防ぐことができる。 As a result, when an excessive current flows through the fuse portion 16, the temperature of the fuse portion 16 suddenly rises within a short time, and when the melting point of the metal constituting the fuse portion 16 is reached, the fuse portion 16 breaks. Then, fly away. At that time, the overcurrent can be surely interrupted by blowing away the thin portion of the mold resin 20 on the upper side of the fuse portion 16 at the same time and increasing the separation distance. In addition, since the mold resin 20 is blown off at the same time when the fuse portion 16 is torn, the torn metal of the fuse portion 16 is electrically connected to the lead frame 13, the semiconductor element 14, or the control wiring member 15b, and again, It is possible to reliably prevent a current from flowing.
　また、制御用配線部材１５ｂおよび他の電子部品の高さを低くすることで、全体的に、モールド樹脂２０の厚さが減り、電力変換装置の小型化につながる。加えて、モールド樹脂２０の樹脂量が減るため、温度変化による熱応力が緩和され、部品どうしの接合部の信頼性の向上が見込める。 In addition, by reducing the height of the control wiring member 15b and other electronic components, the thickness of the mold resin 20 is reduced as a whole, leading to miniaturization of the power converter. In addition, since the amount of the resin of the mold resin 20 is reduced, the thermal stress due to the temperature change is alleviated, and the reliability of the joint portion between the components can be improved.
　以上のように、実施の形態３においても、上記の実施の形態１，２と同様に、大電流用配線部材１５ａがヒューズ部１６を有し、かつ、ヒューズ部１６の上側のモールド樹脂２０の厚さを薄くしたので、断裂時に上面側を吹き飛ばして離間距離を稼ぎ、ヒューズ部１６が断裂後に再度、導通するのを抑制することができ、電力変換装置の発煙および発火が防止できる。 As described above, also in the third embodiment, as in the first and second embodiments, the high-current wiring member 15a has the fuse portion 16 and the mold resin 20 on the upper side of the fuse portion 16 Since the thickness is reduced, it is possible to blow away the upper surface side at the time of the rupture to increase the separation distance, and to suppress the conduction of the fuse portion 16 again after the rupture, thereby preventing smoke and ignition of the power converter.
　さらに、実施の形態３においては、制御用配線部材１５ｂおよび他の電子部品の高さを低くすることで、全体的にモールド樹脂２０の厚さが減り、電力変換装置の小型化につながる。また、モールド樹脂２０の上面を平らにできるため、モールド時に使用する成形型を簡素化できる。 Furthermore, in the third embodiment, by reducing the height of the control wiring member 15b and other electronic components, the thickness of the mold resin 20 is reduced as a whole, leading to the miniaturization of the power converter. Moreover, since the upper surface of the mold resin 20 can be flattened, the mold used for molding can be simplified.
　なお、図１３の例においては、ヒューズ部１６が設けられた大電流用配線部材１５ａの上側にモールド樹脂２０が存在しているが、その場合に限らず、図１４に示すように、ヒューズ部１６が設けられた大電流用配線部材１５ａを外部に露出させてもよい。図１４の例においては、大電流用配線部材１５ａの上側には、モールド樹脂２０が設けられていない。なお、大電流用配線部材１５ａ全体を露出させずに、ヒューズ部１６部分だけを外部に露出するようにしてもよい。このように、大電流用配線部材１５ａの上側のモールド樹脂２０を無くして、大電流用配線部材１５ａの少なくとも一部を外部に露出することで、ヒューズ部１６の放熱性が悪化し、ヒューズ部１６に過電流が流れたときに、温度が上昇しやすくなり、ヒューズ部１６が断裂するまでの時間を短くできる効果がある。また、この場合においても、モールド樹脂２０の上面を平らにできるため、モールド時に使用する成形型を簡素化できる。 In the example of FIG. 13, the mold resin 20 is present on the upper side of the large current wiring member 15 a provided with the fuse portion 16. However, the present invention is not limited to this, and as shown in FIG. The large current wiring member 15a provided with 16 may be exposed to the outside. In the example of FIG. 14, the mold resin 20 is not provided on the upper side of the large current wiring member 15a. Note that only the fuse portion 16 may be exposed to the outside without exposing the entire large-current wiring member 15a. Thus, by eliminating the mold resin 20 on the upper side of the large current wiring member 15a and exposing at least a part of the large current wiring member 15a to the outside, the heat dissipation of the fuse portion 16 deteriorates, and the fuse portion When an overcurrent flows through 16, the temperature is likely to rise, and there is an effect that it is possible to shorten the time until the fuse portion 16 breaks. Also in this case, since the upper surface of the mold resin 20 can be flattened, the mold used for molding can be simplified.
　１０　外部接続端子、１１　絶縁ケース、１２　ヒートシンク、１３　リードフレーム、１４　半導体素子、１５　配線部材、１５ａ　大電流用配線部材、１５ｂ　制御用配線部材、１６　ヒューズ部、１７　導電性接合材、１８　絶縁材、１９　フィン、２０　モールド樹脂、２１　制御用端子、２２　パワー端子、２４　凹み部、２５　フタ、２６　封止材、１００　電力変換モジュール。 10 External connection terminal, 11 Insulation case, 12 Heat sink, 13 Lead frame, 14 Semiconductor element, 15 Wiring member, 15a Wiring member for large current, 15b Wiring member for control, 16 Fuse part, 17 Conductive bonding material, 18 Insulating material , 19 fin, 20 mold resin, 21 control terminal, 22 power terminal, 24 dent, 25 lid, 26 sealing material, 100 power conversion module.

Claims (8)

  1. 　電力変換モジュールを備えた電力変換装置であって、
    　前記電力変換モジュールは、
    　配線パターン状に設けられた１以上のリードフレームと、
    　前記リードフレーム上に設けられた半導体素子と、
    　前記リードフレームと前記半導体素子との間を接続する配線部材と、
    　前記リードフレームと前記半導体素子と前記配線部材とを封止するモールド樹脂と
    　を有し、
    　前記配線部材にヒューズ部を設け、
    　前記ヒューズ部の上側に設けられた前記モールド樹脂の厚さは、前記ヒューズ部の下側に設けられた前記モールド樹脂の厚さより薄い、
    　電力変換装置。     A power conversion device including a power conversion module,
    The power conversion module includes:
    One or more lead frames provided in a wiring pattern,
    A semiconductor element provided on the lead frame;
    A wiring member for connecting between the lead frame and the semiconductor element;
    A mold resin for sealing the lead frame, the semiconductor element, and the wiring member;
    A fuse portion is provided in the wiring member,
    The thickness of the mold resin provided on the upper side of the fuse portion is thinner than the thickness of the mold resin provided on the lower side of the fuse portion,
    Power conversion device.
  2. 　前記ヒューズ部は、
    　前記配線部材の少なくとも１箇所以上に設けられ、前記配線部材の他の部位よりも断面積が小さくなるように形成された部位から構成されている、
    　請求項１に記載の電力変換装置。     The fuse portion is
    It is provided in at least one place of the wiring member, and is composed of a portion formed so that a cross-sectional area is smaller than other portions of the wiring member
    The power conversion device according to claim 1.
  3. 　前記ヒューズ部の上側に設けられた前記モールド樹脂の上面に凹み部を設けた、
    　請求項１または２に記載の電力変換装置。     A recess was provided on the upper surface of the mold resin provided on the upper side of the fuse part,
    The power converter according to claim 1 or 2.
  4. 　前記凹み部は、前記ヒューズ部の上面に達する貫通穴から構成され、
    　前記ヒューズ部は、前記貫通穴を通して外部に露出している、
    　請求項３に記載の電力変換装置。     The recessed portion is composed of a through hole reaching the upper surface of the fuse portion,
    The fuse portion is exposed to the outside through the through hole,
    The power conversion device according to claim 3.
  5. 　前記凹み部は、前記モールド樹脂の熱伝導率よりも小さい熱伝導率を有する封止材が充填され封止されている、
    　請求項３または４に記載の電力変換装置。     The recess is filled and sealed with a sealing material having a thermal conductivity smaller than that of the mold resin,
    The power converter according to claim 3 or 4.
  6. 　前記モールド樹脂の上面に、前記凹み部を覆うフタを設けた、
    　請求項３から５までのいずれか１項に記載の電力変換装置。     On the upper surface of the mold resin, a lid that covers the recess is provided.
    The power converter according to any one of claims 3 to 5.
  7. 　前記モールド樹脂で封止される部品のうち、前記配線部材の高さが最も高い、
    　請求項１または２に記載の電力変換装置。     Of the components sealed with the mold resin, the wiring member has the highest height,
    The power converter according to claim 1 or 2.
  8. 　前記ヒューズ部が設けられた前記配線部材の上面の少なくとも一部が、前記モールド樹脂から外部に露出している、
    　請求項７に記載の電力変換装置。     At least a part of the upper surface of the wiring member provided with the fuse portion is exposed to the outside from the mold resin,
    The power conversion device according to claim 7.
PCT/JP2017/015897 2017-04-20 2017-04-20 Power conversion device WO2018193581A1 (en)

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