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WO2018190273A1 - Dispositif d'exposition, dispositif de traitement de substrat, procédé d'exposition de substrat, et procédé de traitement de substrat - Google Patents

Dispositif d'exposition, dispositif de traitement de substrat, procédé d'exposition de substrat, et procédé de traitement de substrat Download PDF

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Publication number
WO2018190273A1
WO2018190273A1 PCT/JP2018/014767 JP2018014767W WO2018190273A1 WO 2018190273 A1 WO2018190273 A1 WO 2018190273A1 JP 2018014767 W JP2018014767 W JP 2018014767W WO 2018190273 A1 WO2018190273 A1 WO 2018190273A1
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WO
WIPO (PCT)
Prior art keywords
unit
substrate
light source
mounting
exposure apparatus
Prior art date
Application number
PCT/JP2018/014767
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English (en)
Japanese (ja)
Inventor
靖博 福本
孝文 大木
友宏 松尾
正也 浅井
将彦 春本
田中　裕二
知佐世 中山
Original Assignee
株式会社Ｓｃｒｅｅｎホールディングス
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社Ｓｃｒｅｅｎホールディングス filed Critical 株式会社Ｓｃｒｅｅｎホールディングス
Publication of WO2018190273A1 publication Critical patent/WO2018190273A1/fr

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

Definitions

  • the present invention relates to an exposure apparatus that performs exposure processing on a substrate, a substrate processing apparatus, a substrate exposure method, and a substrate processing method.
  • Patent Document 1 describes an exposure apparatus that performs an exposure process on a film (DSA film) containing an induced self-assembled material on a substrate.
  • the exposure apparatus has a light emitting part capable of emitting a vacuum ultraviolet ray having a cross-sectional band shape, and is configured to be movable from the front position to the rear position of the light emitting part so that the substrate crosses the path of the vacuum ultraviolet ray from the light emitting part.
  • the illuminance of vacuum ultraviolet rays is detected in advance by an illuminance sensor, and the moving speed of the substrate is calculated based on the detected illuminance so that a desired amount of vacuum ultraviolet rays is irradiated.
  • the DSA film on the substrate is irradiated with a desired amount of vacuum ultraviolet light by moving the substrate at the calculated moving speed.
  • the substrate is heated by irradiating the substrate with vacuum ultraviolet rays, and the temperature of the substrate rises.
  • the temperature of the holding unit of the transfer apparatus rises.
  • the temperature of the other substrate conveyed by the holding unit of the exposure apparatus also rises. Variations in the temperature of the substrate affect the uniformity of substrate processing. Therefore, after the temperature of the substrate is lowered to a predetermined temperature (for example, 50 degrees) or less in the exposure apparatus, the substrate is unloaded from the exposure apparatus. However, since it takes time for the temperature of the substrate to fall below a predetermined temperature, the efficiency of the substrate exposure process is reduced.
  • An object of the present invention is to provide an exposure apparatus, a substrate processing apparatus, an exposure method, and a substrate processing method capable of improving the efficiency of the substrate exposure process.
  • An exposure apparatus includes a processing chamber that accommodates a substrate, a mounting portion on which the substrate is mounted, a light source that emits vacuum ultraviolet rays, and a substrate into the processing chamber.
  • the mounting portion When the substrate is carried out and the substrate is carried out of the processing chamber, the mounting portion is in the first position in the processing chamber, and when the light source unit irradiates the substrate with vacuum ultraviolet rays, the mounting portion is more than the first position.
  • a drive unit that moves the mounting unit to the first position and the second position so that the mounting unit is at the second position close to the light source unit, and the mounting unit when the mounting unit is at least in the first position.
  • a cooling unit for cooling for cooling.
  • a substrate is accommodated in a processing chamber.
  • the placement unit is moved to the first position by the drive unit so that the placement unit is in the first position in the processing chamber when the substrate is carried into the processing chamber.
  • the placement unit is cooled by the cooling unit.
  • the substrate is placed on the placement portion.
  • Vacuum ultraviolet rays are emitted from the light source unit.
  • the mounting unit is moved to the second position by the driving unit so that the mounting unit is in the second position closer to the light source unit than the first position.
  • the mounting portion is moved to the first position by the driving unit so that the mounting portion is at the first position in the processing chamber.
  • the substrate when the substrate is irradiated with vacuum ultraviolet rays by the light source unit, the substrate is brought close to the light source unit in a state of being mounted on the mounting unit.
  • the mounting unit is cooled in advance by the cooling unit, even when the substrate is irradiated with vacuum ultraviolet rays by the light source unit, the temperature of the substrate does not rise above a predetermined temperature. Therefore, it is not necessary to wait for the substrate in the processing chamber, and it is not necessary to separately perform a process for cooling the substrate.
  • the cooling of the placement unit by the cooling unit is performed in parallel with the process of loading the substrate into the processing chamber and the process of unloading the substrate to the outside of the processing chamber, and is performed during a period in which no substrate exists in the processing chamber. Therefore, it is not necessary to separately secure time for cooling the placement unit by the cooling unit. As a result, the efficiency of the substrate exposure process can be improved.
  • the exposure apparatus may further include a contact member that contacts the placement unit at the first position, and the cooling unit may be provided on the contact member so as to cool the contact member.
  • the placement unit is cooled by the cooling unit via the contact member by contacting the contact member at the first position. Therefore, it is not necessary to provide the cooling unit on the mounting unit, and it is not necessary to connect a driving device for driving the cooling unit to the cooling unit provided on the mounting unit. Thereby, the structure for moving a mounting part between a 1st position and a 2nd position can be simplified.
  • the mounting portion may have a lower surface
  • the contact member may have a contact surface that contacts the lower surface of the mounting portion when the mounting portion is cooled. In this case, heat is transferred from the placement unit to the contact member over a wide range. Thereby, a mounting part can be cooled efficiently.
  • the light source unit is disposed above the mounting unit, emits vacuum ultraviolet rays downward, the second position is below the light source unit, the first position is below the second position,
  • the drive unit may raise and lower the placement unit between the first position and the second position.
  • the substrate when the placement unit is lowered to the first position, the substrate can be easily carried into the processing chamber or the substrate can be easily carried out of the processing chamber without causing the substrate to interfere with the light source unit. it can.
  • the substrate and the light source unit can be easily brought close to each other by raising the placement unit to the second position in a state where the substrate is placed.
  • the cooling unit may be disposed below the mounting unit, and may contact the mounting unit when the mounting unit is in the first position. In this case, by lowering the placement portion to the first position, the placement portion can be brought into contact with the cooling portion and can be easily cooled.
  • the exposure apparatus further includes a plurality of support members extending upward from the contact member, the upper ends of the plurality of support members being higher than the first position and lower than the second position,
  • the plurality of support members may have a plurality of through holes, and the plurality of support members may pass through the plurality of through holes of the placement unit when the placement unit is in the first position.
  • the plurality of support members can support the substrate carried into the processing chamber at the upper end higher than the first position and lower than the second position. Therefore, the substrate can be easily placed on the placement unit by raising the placement unit from the first position. Moreover, the board
  • the cooling unit may be provided in the mounting unit.
  • the placement unit can be constantly cooled by the cooling unit. Thereby, a mounting part can be cooled more efficiently.
  • the drive unit may move the mounting unit from the first position to the second position after the emission of the vacuum ultraviolet rays by the light source unit is started.
  • the time when the placement unit moves from the first position to the second position is later than the time when the emission of the vacuum ultraviolet rays by the light source unit is started. Therefore, in the first position, the placement unit can be sufficiently cooled by the cooling unit.
  • the driving unit may move the mounting unit from the second position to the first position before the emission of the vacuum ultraviolet rays by the light source unit is stopped.
  • the time when the placement unit moves from the second position to the first position is before the time when the emission of the vacuum ultraviolet rays by the light source unit is stopped. Therefore, in the first position, the placement unit can be sufficiently cooled by the cooling unit.
  • the light source unit may be configured to emit vacuum ultraviolet rays having a planar cross section.
  • vacuum ultraviolet rays are emitted in a wide range. Therefore, the exposure of the substrate is completed in a shorter time. Thereby, the efficiency of the exposure process of a board
  • the emission area of the vacuum ultraviolet rays by the light source unit may be larger than the area of the substrate. In this case, since the entire surface of the substrate can be exposed, the exposure of the substrate is completed in a shorter time. Thereby, the efficiency of the exposure processing of the substrate can be further improved.
  • a substrate processing apparatus includes a coating processing unit that forms a film on a substrate by applying a processing liquid to the substrate, and a thermal processing unit that heat-treats the substrate on which the film is formed by the coating processing unit. And an exposure apparatus according to one aspect of the present invention that exposes the substrate heat-treated by the heat treatment unit, and a development processing unit that develops a film on the substrate by supplying a solvent to the substrate exposed by the exposure device.
  • a film is formed on the substrate by applying the processing liquid to the substrate by the coating processing unit.
  • the substrate on which the film is formed by the coating processing unit is heat-treated by the heat treatment unit.
  • the substrate heat-treated by the heat treatment unit is exposed by the exposure apparatus.
  • the film on the substrate is developed by supplying a solvent to the substrate exposed by the exposure apparatus by the development processing unit.
  • the mounting unit is cooled in advance by the cooling unit, the temperature of the substrate does not rise above a predetermined temperature even when the substrate is irradiated with vacuum ultraviolet rays by the light source unit. Therefore, it is not necessary to wait for the substrate in the processing chamber, and it is not necessary to separately perform a process for cooling the substrate.
  • the cooling of the placement unit by the cooling unit is performed in parallel with the process of loading the substrate into the processing chamber and the process of unloading the substrate to the outside of the processing chamber, and is performed during a period in which no substrate exists in the processing chamber. Therefore, it is not necessary to separately secure time for cooling the placement unit by the cooling unit. As a result, the efficiency of the substrate exposure process can be improved.
  • the treatment liquid may include an induced self-organizing material.
  • microphase separation occurs on one surface of the substrate by heat-treating the substrate coated with the treatment liquid containing the induced self-organizing material. Further, the substrate on which two types of polymer patterns are formed by microphase separation is exposed and developed. Thereby, one of the two types of polymers is removed, and a fine pattern can be formed.
  • the step of accommodating the substrate in the processing chamber, and the loading portion at the first position in the processing chamber when the substrate is carried into the processing chamber A step of moving the mounting unit to the first position by the driving unit, a step of cooling the mounting unit by the cooling unit when the mounting unit is at least at the first position, and a mounting unit in the processing chamber.
  • the step of moving the mounting unit to the second position by the driving unit so that the mounting unit is at the first position in the processing chamber when the substrate is carried out of the processing chamber. Moving the placement unit to the first position by the drive unit; No.
  • the mounting part is cooled in advance by the cooling part, even when the substrate is irradiated with vacuum ultraviolet rays by the light source part, the temperature of the substrate does not rise above a predetermined temperature. Therefore, it is not necessary to wait for the substrate in the processing chamber, and it is not necessary to separately perform a process for cooling the substrate.
  • the cooling of the placement unit by the cooling unit is performed in parallel with the process of loading the substrate into the processing chamber and the process of unloading the substrate to the outside of the processing chamber, and is performed during a period in which no substrate exists in the processing chamber. Therefore, it is not necessary to separately secure time for cooling the placement unit by the cooling unit. As a result, the efficiency of the substrate exposure process can be improved.
  • a film is formed on the substrate by applying a processing liquid to the surface to be processed of the substrate by the coating processing unit, and the coating processing unit.
  • the substrate after film formation and before development is exposed to vacuum ultraviolet rays.
  • the mounting unit is cooled in advance by the cooling unit, even when the substrate is irradiated with vacuum ultraviolet rays by the light source unit, the temperature of the substrate does not rise above a predetermined temperature. Therefore, it is not necessary to wait for the substrate in the processing chamber, and it is not necessary to separately perform a process for cooling the substrate.
  • the cooling of the placement unit by the cooling unit is performed in parallel with the process of loading the substrate into the processing chamber and the process of unloading the substrate to the outside of the processing chamber, and is performed during a period in which no substrate exists in the processing chamber. Therefore, it is not necessary to separately secure time for cooling the placement unit by the cooling unit. As a result, the efficiency of the substrate exposure process can be improved.
  • the efficiency of the substrate exposure process can be improved.
  • FIG. 1 is a schematic sectional view showing the arrangement of an exposure apparatus according to an embodiment of the present invention.
  • FIG. 2 is a plan view showing a support plate of the delivery unit.
  • FIG. 3 is a functional block diagram showing the configuration of the control unit of FIG.
  • FIG. 4 is a schematic diagram for explaining the operation of the exposure apparatus.
  • FIG. 5 is a schematic diagram for explaining the operation of the exposure apparatus.
  • FIG. 6 is a schematic diagram for explaining the operation of the exposure apparatus.
  • FIG. 7 is a schematic diagram for explaining the operation of the exposure apparatus.
  • FIG. 8 is a flowchart showing an example of exposure processing performed by the control unit of FIG.
  • FIG. 9 is a flowchart showing an example of an exposure process performed by the control unit of FIG.
  • FIG. 10 is a schematic block diagram showing the overall configuration of the substrate processing apparatus provided with the exposure apparatus of FIG.
  • FIG. 11 is a schematic view showing an example of substrate processing by the substrate processing apparatus of FIG.
  • FIG. 12 is a
  • the substrate refers to a semiconductor substrate, a liquid crystal display substrate, a plasma display substrate, an optical disk substrate, a magnetic disk substrate, a magneto-optical disk substrate, a photomask substrate, or the like.
  • FIG. 1 is a schematic cross-sectional view showing the configuration of an exposure apparatus according to an embodiment of the present invention.
  • the exposure apparatus 100 includes a control unit 110, a processing chamber 120, a closing unit 130, a delivery unit 140, an elevating unit 150, a light projecting unit 160, a replacement unit 170, and a measuring unit 180.
  • the control unit 110 acquires measurement values from the measurement unit 180 and controls operations of the blocking unit 130, the lifting unit 150, the light projecting unit 160, and the replacement unit 170. The function of the control unit 110 will be described later.
  • the processing chamber 120 includes a casing 121 having an upper opening and an internal space, an annular member 122, and a covering member 123.
  • a transport opening 121 a for transporting the substrate W to be processed is formed between the inside and the outside of the housing 121.
  • a film containing an induced self-organizing material hereinafter referred to as a DSA (Directed Self Assembly) film
  • a connecting member 152 of an elevating unit 150 described later passes is formed on the bottom surface of the housing 121.
  • the housing 161 of the light projecting unit 160 which will be described later, is disposed on the top of the housing 121 via the annular member 122, whereby the upper opening of the housing 121 is closed.
  • Seal members s1 and s2 are attached between the casing 121 and the annular member 122 and between the annular member 122 and the housing 161, respectively.
  • a covering member 123 is attached between the housing 121 and the housing 161 so as to cover the outer peripheral surface of the annular member 122.
  • the closing part 130 includes a shutter 131, a rod-shaped connecting member 132, and a driving device 133.
  • the connecting member 132 connects the shutter 131 and the driving device 133.
  • the drive device 133 is a stepping motor, for example.
  • the driving device 133 moves the shutter 131 between an open position where the shutter 131 opens the transport opening 121a and a closed position where the shutter 131 closes the transport opening 121a.
  • a seal member 131 a is attached to the shutter 131.
  • the inside of the housing 121 is hermetically sealed by the seal member 131a being in close contact with a portion of the housing 121 surrounding the transport opening 121a.
  • the driving device 133 moves the shutter 131 away from the casing 121 when moving the shutter 131 between the open position and the closed position. Move up and down in the state.
  • Position sensors 133a and 133b for detecting the upper limit position and the lower limit position of the shutter 131 are attached to the driving device 133.
  • the position sensors 133a and 133b give the detection result to the control unit 110.
  • the driving device 133 and a driving device 153 described later are provided outside the processing chamber 120. Therefore, even when dust is generated by driving the driving devices 133 and 153, the dust is prevented from directly entering the housing 121.
  • the delivery unit 140 includes, for example, a disk-shaped support plate 141, a plurality (three in this example) of support pins 142 and a cooling unit 143.
  • the support plate 141 is disposed in a horizontal posture within the housing 121.
  • an opening 141a is formed through which a connecting member 152 of an elevating unit 150 described later passes.
  • the plurality of support pins 142 extend upward from the upper surface of the support plate 141 so as to surround the opening 141a.
  • the substrate W to be processed can be placed on the upper ends 142 a of the plurality of support pins 142.
  • FIG. 2 is a plan view showing the support plate 141 of the delivery unit 140.
  • the cooling unit 143 includes a cooling pipe 143a and a medium supply source 143b.
  • the cooling pipe 143a is provided so as to circulate in the support plate 141 while meandering while being in contact with the support plate 141. Both ends of the cooling pipe 143a are connected to the medium supply source 143b.
  • the medium supply source 143b supplies the cooling medium into the cooling pipe 143a from one end of the cooling pipe 143a, and collects the cooling medium from the other end of the cooling pipe 143a. Thereby, a cooling medium is circulated in the cooling pipe 143a, and the support plate 141 is cooled.
  • the medium supply source 143b is a constant temperature water circulation device and supplies constant temperature pure water as a cooling medium, but the present invention is not limited to this.
  • the medium supply source 143b is a cooling water circulation device and may supply cooled pure water as a cooling medium.
  • the cooling pipe 143a is provided in the support plate 141, this invention is not limited to this.
  • the cooling pipe 143a may be provided outside the support plate 141 in contact with the lower surface of the support plate 141.
  • the mounting plate 151 is disposed in a horizontal posture above the support plate 141 of the delivery unit 140 in the housing 121.
  • a plurality of through holes 151 a corresponding to the plurality of support pins 142 of the support plate 141 are formed in the mounting plate 151.
  • the connecting member 152 is disposed to extend vertically through the opening 121 b of the housing 121 and the opening 141 a of the support plate 141, and the driving device 153 is disposed below the housing 121.
  • the connecting member 152 connects the mounting plate 151 and the driving device 153.
  • a seal member s3 is disposed between the outer peripheral surface of the connecting member 152 and the inner peripheral surface of the opening 121b so that the connecting member 152 can slide in the vertical direction.
  • the driving device 153 is, for example, a stepping motor, and moves the mounting plate 151 between a processing position above the upper ends 142a of the plurality of support pins 142 and a standby position below the upper ends 142a of the plurality of support pins 142. Move up and down.
  • Position sensors 153 a and 153 b for detecting the upper limit position and the lower limit position of the mounting plate 151 are attached to the driving device 153.
  • the position sensors 153a and 153b give the detection result to the control unit 110.
  • the plurality of support pins 142 are respectively inserted into the plurality of through holes 151a, and the lower surface 151b of the mounting plate 151 and the upper surface (contact surface) 141b of the support plate 141 are in contact with each other. To do. As a result, the mounting plate 151 is cooled by the cooling unit 143 via the support plate 141.
  • the light projecting unit 160 includes a housing 161 having a lower opening and an internal space, a translucent plate 162, a planar light source unit 163, and a power supply device 164.
  • translucent plate 162 is a quartz glass plate.
  • the housing 161 is disposed on the upper portion of the housing 121 so as to close the upper opening of the housing 121.
  • the translucent plate 162 is attached to the housing 161 so as to close the lower opening of the housing 161.
  • the internal space of the housing 121 and the internal space of the housing 161 are separated by a translucent plate 162 so as to be optically accessible.
  • the light source unit 163 and the power supply device 164 are accommodated in the housing 161.
  • the light source unit 163 is configured by horizontally arranging a plurality of rod-shaped light sources that emit vacuum ultraviolet rays having a wavelength of about 120 nm or more and about 230 nm or less at predetermined intervals.
  • Each light source may be, for example, a xenon excimer lamp, or another excimer lamp or a deuterium lamp.
  • the light source unit 163 emits vacuum ultraviolet rays having a substantially uniform light amount distribution in the housing 121 through the translucent plate 162.
  • the area of the emission surface of the vacuum ultraviolet ray in the light source unit 163 is larger than the area of the surface to be processed of the substrate W.
  • the power supply device 164 supplies power to the light source unit 163.
  • the replacement unit 170 includes pipes 171p, 172p, 173p, valves 171v, 172v, and a suction device 173.
  • the pipes 171p and 172p are connected between the air supply port of the housing 121 and the inert gas supply source.
  • the inert gas is, for example, nitrogen gas.
  • Valves 171v and 172v are inserted in the pipes 171p and 172p.
  • An inert gas is supplied into the housing 121 from the side of the support plate 141 through the pipe 171p.
  • An inert gas is supplied into the housing 121 from below the support plate 141 through the pipe 172p.
  • the flow rate of the inert gas is adjusted by valves 171v and 172v.
  • nitrogen gas is used as the inert gas.
  • the pipe 173p branches into a branch pipe 173a and a branch pipe 173b.
  • the branch pipe 173 a is connected to the exhaust port of the casing 121, and the end of the branch pipe 173 b is disposed between the casing 121 and the shutter 131.
  • a suction device 173 is inserted in the pipe 173p.
  • a valve 173v is inserted in the branch pipe 173b.
  • the suction device 173 is, for example, an ejector.
  • the pipe 173p is connected to the exhaust facility.
  • the suction device 173 discharges the atmosphere in the housing 121 through the branch pipe 173a and the pipe 173p.
  • the suction device 173 discharges the atmosphere between the housing 121 and the shutter 131 through the branch pipe 173b and the pipe 173p together with dust and the like generated by the movement of the shutter 131.
  • the gas discharged by the suction device 173 is rendered harmless by the exhaust facility.
  • the measuring unit 180 includes an oxygen concentration meter 181, an ozone concentration meter 182, and an illuminance meter 183.
  • the oxygen concentration meter 181, the ozone concentration meter 182, and the illuminance meter 183 are connected to the control unit 110 through connection ports p 1, p 2, and p 3 provided in the housing 121.
  • the oxygen concentration meter 181 is, for example, a galvanic cell type oxygen sensor or a zirconia type oxygen sensor, and measures the oxygen concentration in the housing 121.
  • the ozone concentration meter 182 measures the ozone concentration in the housing 121.
  • the illuminance meter 183 includes a light receiving element such as a photodiode, and measures the illuminance of vacuum ultraviolet rays from the light source unit 163 irradiated on the light receiving surface of the light receiving element.
  • the illuminance is a work rate of vacuum ultraviolet rays irradiated per unit area of the light receiving surface.
  • the unit of illuminance is represented by “W / m 2 ”, for example.
  • the atmosphere in the housing 121 is replaced with an inert gas by the replacement unit 170.
  • the oxygen concentration in the housing 121 is reduced.
  • the predetermined concentration is preferably an oxygen concentration (for example, 1%) at which ozone is not generated by the vacuum ultraviolet rays emitted from the light source unit 163.
  • the exposure amount of the vacuum ultraviolet rays applied to the substrate W reaches a predetermined set exposure amount, the irradiation of the vacuum ultraviolet rays is stopped and the exposure process is ended.
  • the exposure amount is the energy of vacuum ultraviolet rays irradiated per unit area of the surface to be processed of the substrate W during the exposure process.
  • the unit of the exposure amount is represented by “J / m 2 ”, for example. Therefore, the exposure amount of vacuum ultraviolet rays is acquired by integrating the illuminance of vacuum ultraviolet rays measured by the illuminance meter 183.
  • the substrate W is heated by irradiating the substrate W with vacuum ultraviolet rays.
  • a predetermined temperature for example, 50 degrees
  • the substrate W cannot be unloaded from the exposure apparatus, and waits until the temperature of the substrate W drops below the predetermined temperature. There is a need. For this reason, the efficiency of the exposure processing of the substrate W is reduced.
  • the mounting plate 151 is moved to the standby position before the exposure process, and is cooled in advance by coming into contact with the support plate 141.
  • the substrate W is placed on the placement plate 151.
  • the mounting plate 151 is moved to the processing position, and the substrate W is irradiated with vacuum ultraviolet rays in a state where the substrate W is close to the light source unit 163.
  • the temperature of the substrate W is prevented from rising above a predetermined temperature. This prevents the efficiency of the exposure processing of the substrate W from being lowered.
  • FIG. 3 is a functional block diagram showing the configuration of the control unit 110 in FIG.
  • the control unit 110 includes a block control unit 1, a lift control unit 2, an exhaust control unit 3, an air supply control unit 4, a concentration acquisition unit 5, a concentration comparison unit 6, an illuminance acquisition unit 7, and an exposure amount.
  • a calculation unit 8, an exposure amount comparison unit 9, and a light projection control unit 10 are included.
  • the control unit 110 includes, for example, a CPU (Central Processing Unit) and a memory.
  • a control program is stored in advance in the memory of the control unit 110.
  • the function of each unit of the control unit 110 is realized by the CPU of the control unit 110 executing the control program stored in the memory.
  • the closing control unit 1 controls the driving device 133 so that the shutter 131 moves between the closing position and the opening position based on the detection results of the position sensors 133a and 133b in FIG.
  • the elevation control unit 2 controls the driving device 153 so that the mounting plate 151 moves between the standby position and the processing position based on the detection results of the position sensors 153a and 153b in FIG.
  • the exhaust control unit 3 controls the suction device 173 and the valve 173v so as to exhaust the atmosphere in the casing 121 and the atmosphere between the casing 121 and the shutter 131 in FIG.
  • the air supply control unit 4 controls the valves 171v and 172v in FIG. 1 so as to supply an inert gas into the housing 121.
  • the concentration acquisition unit 5 acquires the value of the oxygen concentration measured by the oxygen concentration meter 181 of FIG.
  • the concentration comparison unit 6 compares the oxygen concentration measured by the concentration acquisition unit 5 with a predetermined concentration.
  • the illuminance acquisition unit 7 acquires the illuminance value of vacuum ultraviolet rays measured by the illuminometer 183 in FIG.
  • the exposure amount calculation unit 8 applies the vacuum ultraviolet ray irradiated to the substrate W based on the illuminance of the vacuum ultraviolet ray acquired by the illuminance acquisition unit 7 and the irradiation time of the vacuum ultraviolet ray from the light source unit 163 in FIG.
  • the exposure amount is calculated.
  • the exposure amount comparison unit 9 compares the exposure amount calculated by the exposure amount calculation unit 8 with a predetermined set exposure amount.
  • the light projection control unit 10 controls the supply of electric power from the power supply device 164 of FIG. 1 to the light source unit 163 so that the light source unit 163 emits vacuum ultraviolet rays based on the comparison result by the concentration comparison unit 6. Moreover, the light projection control unit 10 controls the power supply device 164 so that the light source unit 163 stops the emission of the vacuum ultraviolet rays based on the comparison result by the exposure amount comparison unit 9.
  • FIGS. 4 to 7 are schematic diagrams for explaining the operation of the exposure apparatus 100.
  • FIG. 4 to 7 in order to facilitate understanding of the configurations in the housing 121 and the housing 161, some components are not shown, and the outlines of the housing 121 and the housing 161 are only one point. Indicated by a chain line. 8 and 9 are flowcharts showing an example of the exposure process performed by the control unit 110 of FIG. Hereinafter, the exposure processing by the control unit 110 will be described with reference to FIGS.
  • the shutter 131 in the initial state of the exposure process, the shutter 131 is in the closed position and the mounting plate 151 is in the standby position. Therefore, the lower surface 151b of the mounting plate 151 and the upper surface 141b of the support plate 141 are in contact with each other. Thereby, the mounting plate 151 is cooled in advance by the cooling pipe 143a via the support plate 141. Further, the oxygen concentration in the housing 121 is constantly or periodically measured by the oxygen concentration meter 181 and acquired by the concentration acquisition unit 5. At this time, the oxygen concentration in the housing 121 measured by the oxygen concentration meter 181 is equal to the oxygen concentration in the atmosphere.
  • the closing control unit 1 moves the shutter 131 to the open position (step S1).
  • the substrate W to be processed can be placed on the upper ends 142a of the plurality of support pins 142 through the transport opening 121a.
  • the substrate W is placed on the upper ends 142a of the plurality of support pins 142 by the transfer device 220 shown in FIG.
  • the elevation controller 2 determines whether or not the substrate W is placed on the upper ends 142a of the plurality of support pins 142 (step S2). When the substrate W is not placed, the elevation control unit 2 stands by until the substrate W is placed on the upper ends 142a of the plurality of support pins 142. When the substrate W is placed, the elevation control unit 2 moves the shutter 131 to the closed position as shown in FIG. 6 (step S3).
  • step S4 discharges the atmosphere in the housing 121 by the suction device 173 of FIG. 1 (step S4). Further, the air supply control unit 4 causes the inert gas to be supplied into the housing 121 through the pipes 171p and 172p in FIG. 1 (step S5). Either of the processes of steps S4 and S5 may be started first, or may be started simultaneously.
  • the concentration comparison unit 6 determines whether or not the oxygen concentration in the housing 121 has decreased to a predetermined concentration (step S6). When the oxygen concentration has not decreased to the predetermined concentration, the concentration comparison unit 6 stands by until the oxygen concentration decreases to the predetermined concentration. When the oxygen concentration has decreased to a predetermined concentration, the light projection control unit 10 causes the light source unit 163 to emit vacuum ultraviolet rays (step S7).
  • the elevation controller 2 moves the mounting plate 151 to the processing position (step S8).
  • the substrate W is transferred from the plurality of support pins 142 to the mounting plate 151.
  • the substrate W is brought close to the light transmitting plate 162 while being cooled by the mounting plate 151.
  • vacuum ultraviolet rays are irradiated onto the substrate W from the light source unit 163 through the light transmitting plate 162, and the DSA film formed on the surface to be processed is exposed.
  • the illuminance acquisition unit 7 causes the illuminance meter 183 to start measuring the illuminance of vacuum ultraviolet rays, and acquires the measured illuminance from the illuminance meter 183 (step S9).
  • the exposure amount calculation unit 8 calculates the exposure amount of the vacuum ultraviolet ray irradiated to the substrate W by integrating the illuminance of the vacuum ultraviolet ray acquired by the illuminance acquisition unit 7 (step S10).
  • the exposure amount comparison unit 9 determines whether or not the exposure amount calculated by the exposure amount calculation unit 8 has reached the set exposure amount (step S11). When the exposure amount has not reached the set exposure amount, the exposure amount comparison unit 9 stands by until the exposure amount reaches the set exposure amount.
  • the elevation controller 2 moves the placement plate 151 to the standby position as shown in FIG. 6 (step S12).
  • the substrate W is transferred from the placement plate 151 to the plurality of support pins 142.
  • the lower surface 151b of the mounting plate 151 and the upper surface 141b of the support plate 141 are in contact with each other.
  • the mounting plate 151 is cooled in advance by the cooling pipe 143a in preparation for the exposure processing of the substrate W that is subsequently carried into the exposure apparatus 100.
  • the light projection control unit 10 stops the emission of the vacuum ultraviolet rays from the light source unit 163 (step S13).
  • the illuminance acquisition unit 7 stops the measurement of illuminance by the illuminometer 183 (step S14).
  • the exhaust control unit 3 stops the exhaust of the atmosphere in the housing 121 by the suction device 173 (step S15).
  • the air supply control unit 4 stops the supply of the inert gas from the pipes 171p and 172p into the housing 121 (Step S16). Any of the processes in steps S13 to S16 may be started first, or may be started simultaneously.
  • the closing control unit 1 moves the shutter 131 to the open position as shown in FIG. 5 (step S17).
  • the exposed substrate W can be carried out from the plurality of support pins 142 to the outside of the housing 121 through the transport opening 121a.
  • the substrate W is carried out from the plurality of support pins 142 to the outside of the housing 121 by the transfer device 220 in FIG.
  • the closing control unit 1 determines whether or not the substrate W has been unloaded from the plurality of support pins 142 (step S18). When the substrate W has not been unloaded, the closing control unit 1 stands by until the substrate W is unloaded from the plurality of support pins 142. When the substrate W is unloaded, the closing control unit 1 moves the shutter 131 to the closing position as shown in FIG. 4 (step S19), and ends the exposure process. By repeating the above operation, exposure processing can be sequentially performed on the plurality of substrates W.
  • the placement plate 151 is moved from the standby position to the processing position after the emission of the vacuum ultraviolet rays by the light source unit 163 is started. Further, the mounting plate 151 is moved from the processing position to the standby position before the emission of the vacuum ultraviolet rays by the light source unit 163 is stopped. Thereby, in the standby position, the mounting plate 151 can be sufficiently cooled by the cooling pipe 143a.
  • the mounting plate 151 when the mounting plate 151 can be sufficiently cooled, the mounting plate 151 may be moved from the standby position to the processing position before the emission of the vacuum ultraviolet rays by the light source unit 163 is started. Alternatively, the mounting plate 151 may be moved from the processing position to the standby position after the emission of the vacuum ultraviolet rays by the light source unit 163 is stopped. That is, the process of step S8 may be executed before the process of step S7, or the process of step S12 may be executed after the process of step S13.
  • FIG. 10 is a schematic block diagram showing the overall configuration of a substrate processing apparatus provided with the exposure apparatus 100 of FIG.
  • processing using block copolymer induced self-assembly is performed.
  • a processing liquid containing an induction self-organizing material is applied on the surface of the substrate W to be processed.
  • two types of polymer patterns are formed on the surface to be processed of the substrate W by microphase separation that occurs in the induced self-assembled material.
  • One of the two types of polymers is removed by the solvent.
  • the treatment liquid containing the induced self-organizing material is called DSA liquid.
  • DSA liquid a process for removing one of the two types of polymer patterns formed on the surface to be processed of the substrate W by microphase separation
  • a developer a solvent used for the development process
  • the substrate processing apparatus 200 includes a control device 210, a transport device 220, a heat treatment device 230, a coating device 240, and a developing device 250.
  • the control device 210 includes, for example, a CPU and a memory or a microcomputer, and controls operations of the transport device 220, the heat treatment device 230, the coating device 240, and the developing device 250. Further, the control device 210 gives a command for controlling the operations of the closing unit 130, the lifting unit 150, the light projecting unit 160, and the replacement unit 170 of the exposure apparatus 100 of FIG.
  • the transport apparatus 220 transports the substrate W between the exposure apparatus 100, the heat treatment apparatus 230, the coating apparatus 240, and the development apparatus 250 while holding the substrate W to be processed.
  • the heat treatment apparatus 230 heat-treats the substrate W before and after the coating process by the coating apparatus 240 and the development process by the developing apparatus 250.
  • the coating apparatus 240 performs a film coating process by supplying a DSA liquid to the surface of the substrate W to be processed.
  • a block copolymer composed of two types of polymers is used as the DSA liquid.
  • Examples of combinations of two types of polymers include polystyrene-polymethyl methacrylate (PS-PMMA), polystyrene-polydimethylsiloxane (PS-PDMS), polystyrene-polyferrocenyldimethylsilane (PS-PFS), and polystyrene-polyethylene oxide.
  • PS-PEO polystyrene-polyvinylpyridine
  • PS-PHOST polystyrene-polyhydroxystyrene
  • PMMA-PMAPOSS polymethyl methacrylate-polymethacrylate polyhedral oligomeric silsesquioxane
  • the developing device 250 supplies the developer to the surface to be processed of the substrate W, thereby developing the film.
  • a solvent for the developer for example, toluene, heptane, acetone, propylene glycol monomethyl ether acetate (PGMEA), propylene glycol monomethyl ether (PGME), cyclohexanone, acetic acid, tetrahydrofuran, isopropyl alcohol (IPA) or tetramethylammonium hydroxide (TMAH) ) And the like.
  • FIG. 11 is a schematic diagram showing an example of processing of the substrate W by the substrate processing apparatus 200 of FIG.
  • the state of the substrate W that changes each time processing is performed is shown in a cross-sectional view.
  • the base layer L1 is formed so as to cover the surface to be processed of the substrate W as shown in FIG.
  • a guide pattern L2 made of, for example, a photoresist is formed on L1.
  • the operation of the substrate processing apparatus 200 will be described with reference to FIGS. 10 and 11.
  • the transfer device 220 sequentially transfers the substrate W to be processed to the heat treatment device 230 and the coating device 240.
  • the temperature of the substrate W is adjusted to a temperature suitable for forming the DSA film.
  • the coating apparatus 240 the DSA liquid is supplied to the surface to be processed of the substrate W, and the coating process is performed.
  • a DSA film L3 composed of two types of polymers is formed in a region on the base layer L1 where the guide pattern L2 is not formed.
  • the transfer device 220 sequentially transfers the substrate W on which the DSA film L3 is formed to the heat treatment device 230 and the exposure device 100.
  • the heat treatment apparatus 230 performs the heat treatment of the substrate W, thereby causing microphase separation in the DSA film L3.
  • a pattern Q1 made of one polymer and a pattern Q2 made of the other polymer are formed.
  • the linear pattern Q1 and the linear pattern Q2 are directionally formed along the guide pattern L2.
  • the substrate W is cooled in the heat treatment apparatus 230. Further, in the exposure apparatus 100, the entire DSA film L3 after microphase separation is irradiated with vacuum ultraviolet rays for modifying the DSA film L3, and exposure processing is performed. Thereby, the bond between one polymer and the other polymer is cut, and the pattern Q1 and the pattern Q2 are separated.
  • the transport device 220 sequentially transports the substrate W after the exposure processing by the exposure device 100 to the heat treatment device 230 and the developing device 250.
  • the substrate W is cooled in the heat treatment apparatus 230.
  • a developer is supplied to the DSA film L3 on the substrate W, and development processing is performed.
  • the pattern Q1 is removed as shown in FIG. 11D, and finally the pattern Q2 remains on the substrate W.
  • the transport device 220 collects the substrate W after the development processing from the development device 250.
  • the mounting plate 151 is moved by the driving device 153 so that the mounting plate 151 is in the standby position when the substrate W is loaded into the processing chamber 120. Move to the standby position. In this state, when the mounting plate 151 comes into contact with the support plate 141, the mounting plate 151 is cooled by the cooling pipe 143 a via the support plate 141. Thereafter, when the mounting plate 151 moves upward, the substrate W is transferred from the upper ends 142 a of the plurality of support pins 142 to the mounting plate 151 and mounted on the mounting plate 151.
  • the driving device 153 is arranged such that the mounting plate 151 is at a processing position above the upper ends 142 a of the plurality of support pins 142 that are the delivery positions of the substrate W. As a result, the mounting plate 151 is moved to the processing position. The placement plate 151 is moved to the standby position by the driving device 153 so that the placement plate 151 is in the standby position when the substrate W is carried out of the processing chamber 120. Thus, the substrate W is transferred from the placement plate 151 to the plurality of support pins 142 and supported by the upper ends 142a of the plurality of support pins 142.
  • the substrate W it is possible to easily carry the substrate W into the processing chamber 120 or to carry the substrate W out of the processing chamber 120 without causing the light source unit 163 to interfere with the substrate W. Further, when the substrate W is irradiated with vacuum ultraviolet rays by the light source unit 163, the substrate W can be easily brought close to the light source unit 163 in a state where the substrate W is mounted on the mounting plate 151.
  • the mounting plate 151 is cooled in advance by the cooling pipe 143a, even when the substrate W is irradiated with vacuum ultraviolet rays by the light source unit 163, the temperature of the substrate W does not rise above a predetermined temperature. Therefore, it is not necessary to wait for the substrate W in the processing chamber 120, and it is not necessary to separately perform a process for cooling the substrate W.
  • the cooling of the placement plate 151 by the cooling pipe 143 a is performed in parallel with the process of loading the substrate W into the processing chamber 120 and the process of unloading the substrate W out of the processing chamber 120, and into the processing chamber 120. This is performed during a period in which the substrate W does not exist. Therefore, it is not necessary to separately secure time for cooling the mounting plate 151 by the cooling pipe 143a. As a result, the efficiency of the exposure processing of the substrate W can be improved.
  • the mounting plate 151 is indirectly cooled by the cooling pipe 143a via the support plate 141, it is not necessary to provide the cooling pipe 143a on the mounting plate 151. Therefore, it is not necessary to connect the medium supply source 143b to the cooling unit 143 on the mounting plate 151. Thereby, the structure for moving the mounting plate 151 between the standby position and the processing position can be simplified. Further, since the lower surface 151b of the mounting plate 151 and the upper surface 141b of the support plate 141 are in contact with each other over a wide range, heat is transferred from the mounting plate 151 to the support plate 141. It can be cooled efficiently.
  • the cooling unit 143 includes the cooling pipe 143a and the medium supply source 143b, but the present invention is not limited to this.
  • FIG. 12 is a plan view showing a support plate 141 according to another embodiment. As shown in FIG. 12, in another embodiment, the cooling unit 143 includes a plurality of (eight in the example of FIG. 12) cooling elements 143c and a power supply source 143d. Each cooling element 143c is, for example, a Peltier element having a cooling surface and a heating surface.
  • the plurality of cooling elements 143c are arranged at substantially equal intervals so as to surround the opening 141a in a state where the cooling surface is in contact with the support plate 141.
  • Each cooling element 143c is connected to a power supply source 143d.
  • FIG. 12 only the connection between one cooling element 143c and the power supply source 143d is shown, and the connection between the other plurality of cooling elements 143c and the power supply source 143d is omitted.
  • the support plate 141 is cooled by supplying power from the power supply source 143d to each cooling element 143c.
  • the support plate 141 is provided with the cooling pipe 143a, and the mounting plate 151 is indirectly cooled by the cooling pipe 143a through the support plate 141, but the present invention is not limited to this.
  • the mounting plate 151 may be provided with a cooling pipe 143a, and the mounting plate 151 may be directly cooled by the cooling pipe 143a.
  • the mounting plate 151 may be provided with the cooling element 143c of FIG. 12, and the mounting plate 151 may be directly cooled by the cooling element 143c. In these cases, the mounting plate 151 can be constantly cooled.
  • the DSA liquid is used as the processing liquid, but the present invention is not limited to this. Other processing liquids different from the DSA liquid may be used.
  • the exit surface of the vacuum ultraviolet ray is larger than the surface to be processed of the substrate W, and the entire surface of the substrate W is exposed.
  • the emission surface of the vacuum ultraviolet ray may be smaller than the surface to be processed of the substrate W, or the vacuum ultraviolet ray having a linear cross section may be emitted without having a planar cross section.
  • the vacuum ultraviolet ray is irradiated on the entire surface of the substrate W to be processed by relatively moving the vacuum ultraviolet ray emitting surface and the surface of the substrate W to be processed.
  • an inert gas is supplied into the housing 121 during the exposure process, but the present invention is not limited to this. If the oxygen concentration in the housing 121 can be sufficiently reduced during the exposure processing, the inert gas may not be supplied into the housing 121.
  • the substrate W is an example of a substrate
  • the processing chamber 120 is an example of a processing chamber
  • the mounting plate 151 is an example of a mounting unit
  • the light source unit 163 is an example of a light source unit.
  • the driving device 153 is an example of a driving unit
  • the cooling unit 143 is an example of a cooling unit.
  • the exposure apparatus 100 is an example of an exposure apparatus
  • the support plate 141 is an example of a contact member
  • the lower surface 151b is an example of a lower surface
  • the upper surface 141b is an example of a contact surface
  • the support pins 142 are examples of a support member.
  • the upper end 142a is an example of the upper end.
  • the through-hole 151a is an example of a through-hole
  • the coating device 240 is an example of a coating processing unit
  • the heat treatment device 230 is an example of a heat treatment unit
  • the developing device 250 is an example of a development processing unit
  • the substrate processing apparatus 200 Is an example of a substrate processing apparatus.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

Lorsqu'un substrat est amené dans une chambre de traitement, une plaque de montage est déplacée par un dispositif d'entraînement vers une position d'attente de telle sorte que la plaque de montage se trouve dans la position d'attente à l'intérieur de la chambre de traitement. Lorsque la plaque de montage est au moins en position d'attente, la plaque de montage est refroidie par une unité de refroidissement. Le substrat est monté sur la plaque de montage à l'intérieur de la chambre de traitement. Des rayons UV sous vide sont émis par une unité de source de lumière. Pendant l'irradiation des rayons UV sous vide sur le substrat par l'unité de source de lumière, la plaque de montage est déplacée par le dispositif d'entraînement vers une position de traitement de telle sorte que la plaque de montage se trouve dans la position de traitement, qui est plus proche de l'unité de source de lumière que la position d'attente. Lorsque le substrat est sorti de la chambre de traitement, la plaque de montage est déplacée par le dispositif d'entraînement vers la position d'attente de sorte que la plaque de montage se trouve dans la position d'attente à l'intérieur de la chambre de traitement.
PCT/JP2018/014767 2017-04-12 2018-04-06 Dispositif d'exposition, dispositif de traitement de substrat, procédé d'exposition de substrat, et procédé de traitement de substrat WO2018190273A1 (fr)

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CN111830790A (zh) * 2019-04-17 2020-10-27 上海微电子装备（集团）股份有限公司 一种气浴装置和光刻机
CN112526827A (zh) 2019-09-19 2021-03-19 株式会社斯库林集团 曝光装置

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JP2001319865A (ja) * 2000-05-11 2001-11-16 Canon Inc 基板ステージ装置、露光装置および半導体デバイス製造方法
JP2006332518A (ja) * 2005-05-30 2006-12-07 Nikon Corp 静電チャックおよび露光装置
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TW201839522A (zh) 2018-11-01

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