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WO2018179261A1 - Procédé de collage et dispositif de collage - Google Patents

Procédé de collage et dispositif de collage Download PDF

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Publication number
WO2018179261A1
WO2018179261A1 PCT/JP2017/013347 JP2017013347W WO2018179261A1 WO 2018179261 A1 WO2018179261 A1 WO 2018179261A1 JP 2017013347 W JP2017013347 W JP 2017013347W WO 2018179261 A1 WO2018179261 A1 WO 2018179261A1
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WO
WIPO (PCT)
Prior art keywords
film
guide film
pasting
cover glass
stage
Prior art date
Application number
PCT/JP2017/013347
Other languages
English (en)
Japanese (ja)
Inventor
勝寛 山口
忠司 西岡
Original Assignee
シャープ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by シャープ株式会社 filed Critical シャープ株式会社
Priority to PCT/JP2017/013347 priority Critical patent/WO2018179261A1/fr
Publication of WO2018179261A1 publication Critical patent/WO2018179261A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers

Definitions

  • the present invention relates to a method for manufacturing a display device such as an EL device including an EL element (electroluminescence element), and particularly to a method for attaching the display device.
  • Japanese Published Patent Publication Japanese Patent Laid-Open No. 2016-42121 (Publication Date: March 31, 2016)
  • An object of the present invention is to satisfactorily adhere to a substrate having a curved surface.
  • the attaching method according to one embodiment of the present invention is a method of attaching a film to a substrate having a curved surface, the film being supported by the guide film, and the guide film being in a direction along the curved direction of the curved surface. Tension is applied.
  • FIG. 1 It is a flowchart which shows an example of the manufacturing method of EL device.
  • (A) is sectional drawing which shows the structural example in the middle of formation of the EL device of this embodiment
  • (b) is sectional drawing which shows the structural example of the EL device of this embodiment.
  • (A) is a figure which shows the guide film in planar view
  • (c) is a figure which shows the outline
  • FIG. 1 is a flowchart showing an example of an EL device manufacturing method.
  • FIG. 2A is a cross-sectional view showing a configuration example during the formation of the EL device of the present embodiment.
  • FIG. 2B is a cross-sectional view illustrating a configuration example of the EL device of the present embodiment.
  • the resin layer 12 is formed on a light-transmitting mother substrate (for example, a glass substrate) 50 (step S1).
  • the inorganic barrier film 3 is formed (step S2).
  • the TFT layer 4 including the plurality of inorganic insulating films 16, 18, 20 and the planarizing film 21 is formed (step S3).
  • the light emitting element layer for example, OLED element layer. Display body
  • the sealing layer 6 including the inorganic sealing films 26 and 28 and the organic sealing film 27 is formed (step S5).
  • the protective material 9 for example, PET film
  • the protective material 9 is affixed on the sealing layer 6 through the adhesive layer 8 (step S6).
  • the resin layer 12 is irradiated with a laser (step S7).
  • the resin layer 12 absorbs the irradiated laser, so that the lower surface of the resin layer 12 (interface with the mother substrate 50) is altered by ablation to form a release layer 13 (see FIG. 3B described later).
  • the mother substrate 50 is peeled from the resin layer 12 (step S8). Thereby, the laminated body 7 and the mother board
  • a support material 10 for example, a PET film
  • the mother substrate 50 is divided and the protective material 9 is cut to cut out a plurality of EL devices (step S10).
  • the protective material 9 on the terminal portion of the TFT layer 4 is peeled off, and the terminal is taken out (step S11).
  • the EL device 2 shown in FIG. 2B is obtained.
  • the functional film 39 is attached (Step S12), and an electronic circuit board is mounted on the terminal portion using ACF or the like (Step S13).
  • the step S12 is not limited to the attachment of the functional film 39, and widely includes, for example, attachment of the laminate 7 and other members such as attachment of a cover glass. Each step is performed by an EL device manufacturing apparatus.
  • Examples of the material for the resin layer 12 include polyimide, epoxy, and polyamide. Of these, polyimide is preferably used.
  • the inorganic barrier film 3 is a film that prevents moisture and impurities from reaching the TFT layer 4 and the light emitting element layer 5 when the EL device is used.
  • a silicon oxide film or a silicon nitride film formed by CVD is used.
  • the thickness of the inorganic barrier film 3 is, for example, 50 nm to 1500 nm.
  • the TFT layer 4 includes a semiconductor film 15, an inorganic insulating film 16 (gate insulating film) formed on the upper side of the semiconductor film 15, a gate electrode G formed on the upper side of the gate insulating film 16, and an upper side of the gate electrode G. Formed on the upper side of the inorganic insulating film 20, the source electrode S, the drain electrode D and the terminal TM, and the planarization formed on the upper side of the source electrode S and the drain electrode D. A film 21.
  • the semiconductor film 15, the inorganic insulating film 16, the gate electrode G, the inorganic insulating films 18 and 20, the source electrode S, and the drain electrode D constitute a thin layer transistor (TFT).
  • a terminal portion including a plurality of terminals TM and terminal wirings TW used for connection to an electronic circuit substrate such as an IC chip or FPC is formed at an end portion (inactive area NA) of the TFT layer 4.
  • the terminal TM is connected to various wirings of the TFT layer 4 through the terminal wiring TW.
  • the semiconductor film 15 is made of, for example, low temperature polysilicon (LPTS) or an oxide semiconductor.
  • the gate insulating film 16 can be constituted by, for example, a silicon oxide (SiOx) film, a silicon nitride (SiNx) film, or a stacked film thereof formed by a CVD method.
  • the gate electrode G, the source electrode S, the drain electrode D, and the terminal are, for example, aluminum (Al), tungsten (W), molybdenum (Mo), tantalum (Ta), chromium (Cr), titanium (Ti), copper ( It is comprised by the metal single layer film or laminated film containing at least 1 of Cu).
  • the TFT having the semiconductor film 15 as a channel is shown as a top gate structure, but a bottom gate structure may be used (for example, when the TFT channel is an oxide semiconductor).
  • the inorganic insulating films 18 and 20 can be composed of, for example, a silicon oxide (SiOx) film, a silicon nitride (SiNx) film, or a laminated film thereof formed by a CVD method.
  • the planarizing film 21 is an organic insulating film, and can be made of a photosensitive organic material that can be applied, such as polyimide or acrylic.
  • the light emitting element layer 5 (for example, an organic light emitting diode layer) is formed in the anode electrode 22 formed on the upper side of the planarizing film 21, the partition wall 23c defining the subpixel of the active area DA, and the inactive area NA. It includes a bank 23b, an EL (electroluminescence) layer 24 formed above the anode electrode 22, and a cathode electrode 25 formed above the EL layer 24. The anode electrode 22, the EL layer 24, and the cathode electrode 25 are included.
  • a light emitting element (for example, an organic light emitting diode) is configured.
  • the partition wall 23c and the bank 23b can be formed, for example, in the same process using a photosensitive organic material such as polyimide, epoxy, or acrylic.
  • the bank 23 b of the inactive area NA is formed on the inorganic insulating film 20.
  • the bank 23 b defines the edge of the organic sealing film 27.
  • the EL layer 24 is formed in a region (subpixel region) surrounded by the partition wall 23c by an evaporation method or an ink jet method.
  • the light emitting element layer 5 is an organic light emitting diode (OLED) layer
  • the EL layer 24 includes a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer in order from the lower layer side. It is composed by doing.
  • the anode electrode (anode) 22 is composed of, for example, a laminate of ITO (Indium Tin Oxide) and an alloy containing Ag, and has light reflectivity.
  • the cathode electrode 25 can be made of a transparent metal such as ITO (Indium Tin Oxide) or IZO (Indium Zincum Oxide).
  • the light emitting element layer 5 is an OLED layer
  • holes and electrons are recombined in the EL layer 24 by the driving current between the anode electrode 22 and the cathode electrode 25, and the exciton generated thereby falls to the ground state. Light is emitted.
  • the light emitting element layer 5 is not limited to constituting an OLED element, and may constitute an inorganic light emitting diode or a quantum dot light emitting diode.
  • the sealing layer 6 includes a first inorganic sealing film 26 that covers the partition wall 23 c and the cathode electrode 25, an organic sealing film 27 that covers the first inorganic sealing film 26, and a second inorganic sealing film that covers the organic sealing film 27. And a stop film 28.
  • Each of the first inorganic sealing film 26 and the second inorganic sealing film 28 may be composed of, for example, a silicon oxide film, a silicon nitride film, a silicon oxynitride film, or a laminated film formed by CVD. it can.
  • the organic sealing film 27 is a light-transmitting organic insulating film that is thicker than the first inorganic sealing film 26 and the second inorganic sealing film 28, and is made of a photosensitive organic material that can be applied, such as polyimide or acrylic. can do.
  • an ink containing such an organic material is applied onto the first inorganic sealing film 26 by inkjet and then cured by UV irradiation.
  • the sealing layer 6 covers the light emitting element layer 5 and prevents penetration of foreign matters such as water and oxygen into the light emitting element layer 5.
  • the protective material 9 is affixed on the sealing layer 6 via the adhesive layer 8 and functions as a support material when the mother substrate 50 is peeled off.
  • Examples of the material of the protective material 9 include PET (polyethylene terephthalate).
  • the support material 10 is for manufacturing an EL device having excellent flexibility by being attached to the lower surface of the resin layer 12 after the mother substrate 50 is peeled off.
  • the material is, for example, polyethylene terephthalate (PET). Etc.
  • the functional film has, for example, an optical compensation function, a touch sensor function, a protection function, and the like.
  • the electronic circuit board is, for example, an IC chip or a flexible printed board mounted on the plurality of terminals TM.
  • the method for manufacturing an EL device according to an aspect of the present invention is particularly characterized in step S12 among the above steps.
  • Step 12 Attachment of a functional film, a cover glass, etc.
  • a plurality of configurations and methods can be considered for the pasting and pasting related thereto.
  • pasting (1) pasting of laminated body 7 and cover glass, (2) pasting of laminated body 7 and functional film, (3) laminated body 7, functional film and cover glass It is conceivable to attach it to an integrated product.
  • the affixing of a cover glass and a functional film, the affixing of a cover glass and an adhesive layer, etc. are also included.
  • the laminate 7 is used for the pasting after the adhesive layer 8 and the protective material 9 are removed as necessary.
  • a method of pasting for example, there are a case where it is performed in a vacuum and a case where it is performed in the atmosphere. Furthermore, there are a case where the laminate is directly attached to the cover glass and the functional film, and a case where the laminate is attached to an integrated product in which the functional film is attached to the cover glass.
  • Embodiment 1 demonstrates the case where the contact bonding layer 41 is affixed on the cover glass 40 as a base material in step 12 based on Fig.3 (a) and (b).
  • OCA Optical Clear Adhesive, adhesive tape, adhesive film
  • a laminated body 7 including the light emitting element layer 5 and a functional film 39 such as TSP (Touch Screen Panel, touch panel) are attached to the cover glass 40 through OCA.
  • the cover glass 40 is attached to the laminate 7 and the functional film 39 by bringing the cover glass 40 and the laminate 7 and the functional film 39 into close contact under vacuum.
  • TSP Touch Screen Panel, touch panel
  • FIG. 3A shows the guide film 43 in plan view.
  • the OCA 41 attached to the cover glass 40 is integrated with the guide film 43 in advance.
  • guide holes 43 (1) for fitting into tension pins 44 (1) provided in a guide film tension mechanism 44 described later are provided at both ends of the guide film 43.
  • FIG. 3B is a diagram showing an outline of the process of attaching the OCA 41 to the cover glass 40, and shows a state where the attaching device 47 (1) is viewed from the side.
  • FIG. 3B shows a case where the cover glass 40 has a curved surface and the OCA 41 is attached to the inner side surface 40 (1).
  • the attaching device 47 (1) includes a hard stage 46 made of hard rubber and guide film tension mechanisms 44 provided on both sides of the stage 46 as main components. .
  • the guide film tension mechanism 44 is for applying tension to the guide film 43.
  • the guide film 43 integrated with the OCA 41 is disposed on the upper surface of the stage 46 with the OCA 41 as the upper surface.
  • the cover glass 40, the OCA 41, the guide film 31, and the stage 46 are arranged in this order from above.
  • the upper surface of the stage 46 has a curved shape along the inner side surface 40 (1) of the cover glass 40.
  • the guide film tension mechanism 44 is moved in the direction of arrow a shown in FIG. 3B, whereby tension is applied to the guide film 43 downward (minus direction of the Z axis).
  • tension is applied to the guide film 43 that supports the OCA that is the attaching member in the direction along the bending direction of the inner side surface 40 (1) of the cover glass 40 that is the attaching surface.
  • air bubbles are applied between the inner surface 40 (1) of the cover glass 40 and the OCA 41 while applying a downward tension to the guide film 43 and increasing or decreasing the tension as appropriate.
  • the cover glass 40 and the OCA 41 are brought into contact with each other so as not to occur.
  • a flexible display such as an EL device is attached to the cover glass 40 to which the OCA 41 is attached in the same manner as the above attachment.
  • a flexible display is used instead of the OCA 41 in the pasting. Thereby, a flexible display whose surface is protected by the cover glass 40 is obtained.
  • the specific configuration of the guide film tension mechanism 44 is not particularly limited, and for example, a spring type, an air cylinder type, a motor torque type, or the like is used.
  • FIG. 3C is a diagram showing an outline of the process of attaching the OCA 41 to the cover glass 40, and shows a state where the attaching device 47 (2) is viewed from the side.
  • FIG. 3C shows a case where the cover glass 40 has a curved surface and the OCA 41 is attached to the outer side surface 40 (2).
  • the attaching device 47 (2) includes an upper stage 46 (1) (first stage) made of aluminum and a hard lower stage 46 (2) (second stage) made of hard rubber.
  • the main component is a stay) and guide film tension mechanisms 44 provided on both sides of the stage 46.
  • the guide film 43 integrated with the OCA 41 is disposed between the upper stage 46 (1) and the lower stage 46 (2) with the OCA 41 as an upper surface.
  • the upper stage 46 (1), the cover glass 40, the OCA 41, the guide film 31, and the lower stage 46 (2) are arranged in this order from the top.
  • tip part of the upper stage 46 becomes a shape curved along the inner surface 40 (1) of the cover glass 40
  • the upper surface of the lower stage 46 (2) is the outer surface of the cover glass 40 40 (2) has a curved shape.
  • the guide film tension mechanism 44 moves in the direction of the arrow b shown in FIG. 3C, so that the guide film 43 is tensioned upward (the positive direction of the Z axis).
  • tension is applied to the guide film 43 that supports the OCA that is the attaching member in the direction along the bending direction of the outer side surface 40 (2) of the cover glass 40 that is the attaching surface.
  • air bubbles are applied between the outer surface 40 (2) of the cover glass 40 and the OCA 41 while applying an upward tension to the guide film 43 and increasing or decreasing the tension as appropriate.
  • the cover glass 40 and the OCA 41 are brought into contact with each other so as not to occur. Specifically, the cover glass 40 is brought into close contact with the upper stage 46 (1), a guide film 43 integrated with the adhesive layer 41 is applied thereto, stress is applied from the end, and the lower stage 46 (2) is fitted. Paste with.
  • a flexible display such as an EL device is attached to the cover glass 40 to which the OCA 41 is attached in the same manner as the above attachment.
  • a flexible display is used instead of the OCA 41 in the pasting. Thereby, a flexible display whose surface is protected by the cover glass 40 is obtained.
  • the specific configuration of the guide film tension mechanism 44 is not particularly limited, and, for example, a spring type, an air cylinder type, a motor torque type, or the like is used as in the first embodiment.
  • the adhesive layer 41 is not limited to an adhesive tape such as OCA, but may be constituted by an adhesive layer formed by coating or an adhesive.
  • the pasting is preferably performed under vacuum, but can also be performed under other environments such as the atmosphere.
  • each stage is not limited to the above example, and various materials can be used.
  • the light emitting element layer 5 is not limited to the case where the OLED element is configured as described above, and may be an inorganic light emitting diode or a quantum dot light emitting diode. Further, a liquid crystal display element may be used.
  • Embodiment 3 demonstrates the case where OCA as the contact bonding layer 41 is affixed on the outer surface 40 (2) of the convex-shaped cover glass 40 based on Fig.4 (a)-FIG.4 (c).
  • the difference from the first embodiment is that the affixing device 47 (3) of the present embodiment can be affixed even in the air, not in a vacuum.
  • the difference from the above embodiments will be mainly described.
  • FIG. 4 (a) to 4 (c) are diagrams showing an outline of the attaching process of the present embodiment, and the process proceeds in the order of FIG. 4 (a) to FIG. 4 (c).
  • the affixing device 47 (3) of this embodiment includes a stage 46, a guide film tension mechanism 44, and a tension pin 44 (1), as in the above embodiments.
  • a guide film 43 is provided between the pair of guide film tension mechanisms 44, and tension is applied to the guide film 43 through the guide holes 43 (1) and the tension pins 44 (1). (In the direction of arrow c in FIG. 4A).
  • An OCA 41 is provided on the lower surface of the guide film 43 (the surface facing the stage 46).
  • a cover glass 40 is set on the stage 46.
  • the cover glass 40 has a convex shape
  • the stage 46 also has a shape according to the convex shape. And it installs so that the convex-shaped outer side surface 40 (2) of the cover glass 40 may oppose OCA41 with which the guide film 43 is equipped. At that time, the convex inner surface 40 (1) of the cover glass 40 is in close contact with the stage 46.
  • the guide film 43 is pulled in the horizontal direction.
  • the horizontal direction is the X-axis direction shown in FIG.
  • a tension is applied to the guide film 43 by pulling the guide film 43 with guide film tension mechanisms 44 disposed at both ends thereof.
  • the cover glass 40 and the OCA 41 are brought into contact with each other at a part (one portion of the curved surface).
  • the substantially apex portion of the convex shape of the cover glass 40 is in contact with the OCA 41.
  • tension is applied to the guide film 43 in the horizontal direction (arrow e in FIG. 4B).
  • the guide film tension mechanism 44 is moved from the horizontal direction to the cover glass so that the tension direction of the guide film 43 matches the curvature of the cover glass 40 (tangential inclination). It is moved downward while being inclined in the bending direction of 40. Specifically, the guide film tension mechanism 44 is tilted so that its tilt (angle V1 in FIG. 4C) is substantially equal to the tilt of the tangent line at the point of contact with the OCA 41 of the cover glass 40. Thereby, tension is applied to the guide film 43 in the vicinity of the guide film tension mechanism 44 in the direction inclined from the horizontal direction (arrow f in FIG. 4C).
  • the guide film tension mechanism 44 tilted, the guide film tension mechanism 44 is moved downward (arrow g in FIG. 4C). Then, as the contact location between the cover glass 46 and the OCA 41 moves and expands, the guide film tension mechanism 44 is sequentially moved downward while changing the inclination. As a result, the cover glass 46 and the OCA 41 are bonded together.
  • a flexible display such as an EL device is attached to the cover glass 40 to which the OCA 41 is attached in the same manner as the above attachment.
  • a flexible display is used instead of the OCA 41 in the pasting. Thereby, a flexible display whose surface is protected by the cover glass 40 is obtained.
  • the OCA 41 or the like can be attached to the cover glass 40 while suppressing the entrapment of bubbles not only in a vacuum but also in the atmosphere.
  • the guide film tension mechanism 44 that is moved downward while being tilted does not necessarily need to be the guide film tension mechanism 44 on both sides thereof, and may be only one guide film tension mechanism 44.
  • the position where the cover glass 40 and the OCA 41 contact is not limited to the vicinity of the apex, for example, about ⁇ 2 mm from the apex, and may be a position other than the vicinity of the apex.
  • Embodiment 4 demonstrates the case where OCA as the contact bonding layer 41 is affixed on the outer surface 40 (2) of the convex-shaped cover glass 40 based on Fig.5 (a)-FIG.5 (d).
  • the main difference from the third embodiment is that the sticking device 47 (4) of the present embodiment sticks using a desired position on the cover glass 40 as a starting point.
  • the difference from the above embodiments will be mainly described.
  • FIG. 5A to FIG. 5D are diagrams showing an outline of the attaching process of the present embodiment, and the process proceeds in the order of FIG. 5A to FIG. 5D.
  • the attachment device 47 (4) of this embodiment includes a stage 46, a guide film tension mechanism 44, and a tension pin 44 (1), as in the above embodiments.
  • a guide film 43 is provided between the pair of guide film tension mechanisms 44, and tension is applied to the guide film 43 through the guide holes 43 (1) and the tension pins 44 (1). (In the direction of arrow h in FIG. 5A).
  • An OCA 41 is provided on the lower surface of the guide film 43 (the surface facing the stage 46).
  • the specific position of the cover glass 40 is defined as a desired position P1.
  • the desired position means a position where positioning is important.
  • the predetermined portion when the terminal portion located at the end thereof needs to be attached to the predetermined portion of the cover glass 40 can be exemplified as the desired position.
  • the predetermined position can be exemplified as the desired position.
  • a cover glass 40 is set on the stage 46.
  • the cover glass 40 is installed so that the desired position P1 matches the corresponding position of the stage 46.
  • the cover glass 40 has a convex shape
  • the stage 46 also has a shape according to the convex shape.
  • it installs so that the convex-shaped outer side surface 40 (2) of the cover glass 40 may oppose OCA41 with which the guide film 43 is equipped.
  • the convex inner surface 40 (1) of the cover glass 40 is in close contact with the stage 46.
  • the guide film 43 is pulled in the horizontal direction.
  • the horizontal direction is the X-axis direction shown in FIG.
  • a tension is applied to the guide film 43 by pulling the guide film 43 with guide film tension mechanisms 44 disposed at both ends thereof.
  • the guide film 43 is tilted while the guide film 43 is being tensioned. At that time, the guide film 43 is inclined to the same inclination as the inclination of the tangent at the desired position P1 of the cover glass 40. In the example of FIG. 5 (b), the guide film 43 is applied with a diagonally upward (arrow i1) tension on one end and a diagonally downward (arrow i2) tension on the other end, while the guide film 43 is at an angle V2 from the horizontal direction. 43 is tilted.
  • the guide film 43 and the stage 46 are brought close to each other while being inclined from the horizontal direction by the angle V2.
  • the guide film 43 may be moved closer to the stage 46 (arrow j in FIG. 5B), and conversely, the stage 46 may be moved closer to the guide film 43.
  • both of them may be brought close together.
  • the guide film tension mechanism 44 is moved from the horizontal direction to the cover glass so that the tension direction of the guide film 43 matches the curvature (tangential slope) of the cover glass 40. It is moved downward while being inclined in the bending direction of 40.
  • the guide film tension mechanism 44 is arranged so that the tension direction of the guide film 43 (arrows 11 and 12 in FIG. 5D) is obliquely downward along the curve direction of the cover glass 40. , Move downward (arrow m).
  • the contact position between the cover glass 46 and the OCA 41 sequentially moves and expands from the desired position P1 of the cover glass 46, and the cover glass 46 and the OCA 41 are bonded together.
  • a flexible display such as an EL device is attached to the cover glass 40 to which the OCA 41 is attached in the same manner as the above attachment.
  • a flexible display is used instead of the OCA 41 in the pasting. Thereby, a flexible display whose surface is protected by the cover glass 40 is obtained.
  • the OCA 41 or the like is pasted on the cover glass 40 while suppressing the entrapment of bubbles, not only in the vacuum but also in the atmosphere, based on the desired installation point (desired position) and the desired installation surface. Can be attached.
  • the guide film tension mechanism 44 that is moved downward while being tilted does not necessarily need to be the guide film tension mechanism 44 on both sides thereof, and may be only one guide film tension mechanism 44.
  • the adhesive layer 41 is formed on the outer surface 40 (2) of the convex cover glass 40 based on FIGS. 6 (a) to 6 (c) and FIGS. 7 (a) to 7 (b).
  • the squeegee 48 is provided in the attaching device (5), and that the stage 46 and the cover glass 40 have a plurality of convex shapes. is there.
  • the difference from the above embodiments will be mainly described.
  • FIGS. 7 (a) to 7 (b) are diagrams showing an outline of the attaching process of the present embodiment, and FIG. 6 (a) to FIG. c) Subsequently to FIG. 6C, the process proceeds in the order of FIG. 7A and FIG. 7B.
  • the pasting device 47 (5) of this embodiment includes a stage 46, a guide film tension mechanism 44, a tension pin 44 (1), and a squeegee 48, as in the above embodiments.
  • the squeegee 48 is located above the guide film 43 supported by the guide film tension mechanism 44 (in the positive direction of the Z axis). That is, the squeegee 48 and the stage 46 are disposed to face each other with the guide film 43 interposed therebetween.
  • the stage 46 has two convex portions 46A and 46B. This is because the cover glass 40 of the present embodiment has two convex portions 40A and 40B.
  • the shape of the stage 46 corresponds to the shape of the cover glass 40, and the cover glass 40 can be stably installed on the stage 46.
  • a guide film 43 is provided between the pair of guide film tension mechanisms 44, and tension is applied to the guide film 43 through the guide holes 43 (1) and the tension pins 44 (1). (In the direction of arrow n in FIG. 6A).
  • An OCA 41 is provided on the lower surface of the guide film 43 (the surface facing the stage 46).
  • the specific position of the cover glass 40 is defined as a desired position P2.
  • a cover glass 40 is set on the stage 46.
  • the cover glass 40 and the stage 46 each have two convex portions 40A and 40B and convex portions 46A and 46B. Therefore, when the cover glass 40 is installed on the stage 46, the cover glass 40 is installed so that the convex portions 40A and 40B of the cover glass 40 extend along the convex portions 46A and 46B of the stage 46. Moreover, when installing, the desired position P2 of the cover glass 40 is installed so that the position corresponding to the stage 46 may correspond.
  • the convex outer surface 40 (2) of the cover glass 40 is attached to the OCA 41 provided in the guide film 43.
  • the convex inner surface 40 (1) of the cover glass 40 is in close contact with the stage 46.
  • the desired position P2 in this embodiment is the desired position when the guide film 43 is brought into contact with the desired position P2 of the cover glass 40 in addition to the condition of the desired position P1 in the previous embodiment. It is determined at a position where the guide film 43 does not come into contact with a convex portion different from the convex portion including P2.
  • the guide film 43 is pulled in the horizontal direction.
  • the horizontal direction is the X-axis direction shown in FIG.
  • a tension is applied to the guide film 43 by pulling the guide film 43 with guide film tension mechanisms 44 disposed at both ends thereof.
  • the squeegee 48 is brought into contact with the guide film 43 so that the positioning is in a desired position.
  • a squeegee 48 above the guide film 43 is provided.
  • the squeegee 48 is brought into contact with a position corresponding to the desired position P2 of the guide film 43. This corresponding position is a position where the guide film 43 contacts the desired position P2 on the cover glass 40 via the OCA 41 when the OCA 41 and the cover glass 40 are attached.
  • the guide film 43 is tilted while tension is applied to the guide film 43. At that time, the guide film 43 is inclined to the same inclination as the inclination of the tangent at the desired position P2 of the cover glass 40. In the example of FIG. 6 (b), the guide film 43 is tilted upward (arrow o1) at one end, and tilted downward (arrow o2) at the other end, while the guide film 43 is angled V3 from the horizontal direction. 43 is tilted.
  • the guide film 43 and the stage 46 are brought close to each other while being inclined by the angle V3 from the horizontal direction.
  • the guide film 43 may be moved closer to the stage 46 (arrow j in FIG. 6B), and conversely, the stage 46 may be moved closer to the guide film 43.
  • both of them may be brought close together.
  • the guide film 43 and the stage 46 are brought close to each other while the squeegee 48 is kept in contact with the guide film 43 in [2-1-1].
  • the [4-1] squeegee 48 is run. Specifically, the squeegee 48 moves on the surface of the guide film 43 while pressing the guide film 43 so that the adhesive layer 41 contacts the cover glass 40.
  • the direction of movement is the direction from the desired position P2 toward the end face having the longer distance from the desired position P2 among the both end faces in the X-axis direction of the cover glass 40 (example shown in FIG. 7A). Then, the negative direction of the X-axis).
  • two convex portions 40A and 40B are provided on the cover glass 40. From the convex portion including the desired position P2 (in the example shown in FIG. 7A, the convex portion 40B), The squeegee 48 is run toward one convex part (in the example shown in FIG. 7B, convex part 40A).
  • the inclination of the squeegee 48 is perpendicular to the inclination of the contact surface of the cover glass 40 with which the squeegee 48 is in contact. That is, the squeegee 48 is inclined in the normal direction of the contact surface, and the inclination angle of the squeegee 48 also changes as the angle of the contact surface changes as the squeegee 48 moves.
  • the movement of the guide film tension mechanism 44 while the squeegee 48 is moving is as follows. First, the guide film tension mechanism 44 closer to the desired position P2 maintains the inclination (arrow q2 in FIG. 6C) when the guide film 44 abuts on the desired position P2 of the cover glass 40. (Arrow r2 in FIG. 7A). On the other hand, the guide film tension mechanism 44 at the other end arbitrarily changes the inclination so that the guide film 43 does not hit the other mountain when the squeegee 48 is running. In the example shown in FIG.
  • the guide film tension mechanism 44 is appropriately tilted upward (so that the guide film 43 does not contact the convex portion 40A while the squeegee 48 moves on the convex portion 40B.
  • the angle is changed by an arrow r1) shown in FIG. At that time, the tension of the guide film 43 is kept constant.
  • the one end portion refers to an end portion of the convex portion 40A that is not continuous with the convex portion 40B, and the other end is an end portion of the convex portion 40B that is not continuous with the convex portion 40A. Point to.
  • the OCA 41 is pasted on the cover glass 40 by the movement of the guide film tension mechanism 44, as described in the previous embodiment, without using the squeegee 48.
  • the guide film tension mechanism 44 is moved downward while being inclined from the horizontal direction to the bending direction of the cover glass 40 so that the tension direction of the guide film 43 is matched with the curvature (tangential inclination) of the cover glass 40.
  • the guide film tension mechanism 44 is tilted downward such that the tension direction of the guide film 43 (arrow r2 in FIG. 7A) is along the curve direction of the cover glass 40. Lower it so that As a result, the contact location between the cover glass 46 and the OCA 41 sequentially moves and expands starting from the desired position P2 of the cover glass 46, and the cover glass 46 and the OCA 41 are bonded to each other.
  • a flexible display such as an EL device is attached to the cover glass 40 to which the OCA 41 is attached in the same manner as the above attachment.
  • a flexible display is used instead of the OCA 41 in the pasting. Thereby, a flexible display whose surface is protected by the cover glass 40 is obtained.
  • the cover glass 40 has a plurality of convex portions, not only under vacuum, but based on a desired installation point (desired position) and a desired installation surface, Even in the atmosphere, the OCA 41 or the like can be attached to the cover glass 40 while suppressing the entrapment of bubbles.
  • the material of the squeegee 48 is not particularly limited, and various materials such as rubber, plastic and metal can be used.
  • the inclination angle of the squeegee 48 is not limited to being substantially perpendicular to the contact surface (about 90 ° ⁇ 5 °), but depending on the shape of the squeegee 48, the degree of sliding of the squeegee 48 on the guide film 43, It can be set appropriately.
  • the pasting [5] can also be performed by running the squeegee 48 as described in [4-1].
  • the contact bonding layer 41 is not limited to this,
  • it is a coating liquid (adhesive coating liquid and adhesion) by an inkjet etc.
  • the adhesive layer 41 may be provided by applying an agent coating liquid). This can be suitably used when an adhesive layer is formed on a flexible display in a flat state.
  • the flexible display according to each of the embodiments is not particularly limited as long as it is a display panel having a flexible and bendable light emitting element.
  • the light emitting element includes a light emitting element whose luminance and transmittance are controlled by current and a light emitting element whose luminance and transmittance are controlled by voltage.
  • a current-controlled light emitting element an organic EL (Electro Luminescence) display provided with an OLED (Organic Light Emitting Diode) or an EL display QLED such as an inorganic EL display provided with an inorganic light emitting diode (Quantum)
  • QLED displays equipped with dot-light-emitting diodes There are QLED displays equipped with dot-light-emitting diodes.
  • examples of the voltage-controlled light emitting element include a liquid crystal display element.
  • the pasting method according to aspect 1 of the present invention includes: A method of attaching a film to a substrate having a curved surface, wherein the film is supported by a guide film, and tension is applied to the guide film in a direction along a curved direction of the curved surface.
  • the guide film is bent in a direction along the bending direction, and the film is disposed on an inner side surface in the bending of the guide film.
  • the film is attached to the outer surface of the curved surface of the base material.
  • the sticking method which concerns on aspect 4 of this invention is arrange
  • the film is attached to the substrate.
  • the surface of the first stage facing the base material and the surface of the second stage facing the base material are curved of the base material that face each other. Is curved along.
  • the pasting is performed under vacuum.
  • the attaching is performed by sequentially enlarging the contact part.
  • the one place is near the vertex of the curved surface.
  • the one place is a positioning position of the base material and the film on the curved surface.
  • the attaching is performed by changing the direction of the tension along the bending direction.
  • the attaching is performed by moving a squeegee along the curved surface in a state of being in contact with the guide film.
  • the squeegee is moved along the curved surface in a state where the guide film is in contact with the guide film from the one place to one end of the base material.
  • the sticking is carried out by moving the tape, and the sticking is carried out by changing the direction of the tension along the bending direction from the one place to the other end of the base material.
  • the base material has a plurality of convex portions formed of curved surfaces, and the single squeegee is pasted while the squeegee is moved. During this time, the guide film is tensioned in such a direction that the film does not come into contact with the other protrusions that are not attached.
  • the sticking method according to the fourteenth aspect of the present invention keeps the squeegee substantially perpendicular to the curved surface during the movement.
  • the direction of the tension is the tangential direction of the curved surface in contact with the contact.
  • the pasting is performed in the atmosphere.
  • the substrate is a cover glass of a display body.
  • the film is an adhesive film.
  • the film is a flexible display.
  • An affixing device includes a stage, a guide film, and a guide film tension mechanism, and is an affixing device that affixes a film to a base material, wherein the base material has a curved surface.
  • the film is disposed on the guide film, and the guide film tension mechanism applies tension to the guide film in a direction along the curved direction of the curved surface.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

Selon l'invention, un film (41) est porté par un film de guidage (43), et une tension est appliquée sur le film de guidage (43), ladite tension étant appliquée dans la direction de courbure de la surface incurvée d'un matériau de base (40).
PCT/JP2017/013347 2017-03-30 2017-03-30 Procédé de collage et dispositif de collage WO2018179261A1 (fr)

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CN111681539A (zh) * 2020-06-24 2020-09-18 Oppo广东移动通信有限公司 显示模组及其制作方法、电子设备
CN111792825A (zh) * 2020-07-20 2020-10-20 河北光兴半导体技术有限公司 张紧装置、热弯机构及热弯机
CN111792822A (zh) * 2020-07-20 2020-10-20 河北光兴半导体技术有限公司 热弯机
CN111792826A (zh) * 2020-07-20 2020-10-20 河北光兴半导体技术有限公司 张紧装置、热弯机构及热弯机
CN111807687A (zh) * 2020-07-20 2020-10-23 河北光兴半导体技术有限公司 玻璃热弯机构
CN111908775A (zh) * 2020-07-20 2020-11-10 河北光兴半导体技术有限公司 张紧装置、热弯机构及热弯机
CN114999325A (zh) * 2022-06-17 2022-09-02 昆山国显光电有限公司 贴合装置及贴合方法
CN115959329A (zh) * 2023-02-17 2023-04-14 歌尔股份有限公司 贴膜机构
CN116280428A (zh) * 2023-02-17 2023-06-23 歌尔股份有限公司 贴膜机构

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CN111681539A (zh) * 2020-06-24 2020-09-18 Oppo广东移动通信有限公司 显示模组及其制作方法、电子设备
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CN111792826A (zh) * 2020-07-20 2020-10-20 河北光兴半导体技术有限公司 张紧装置、热弯机构及热弯机
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CN111908775A (zh) * 2020-07-20 2020-11-10 河北光兴半导体技术有限公司 张紧装置、热弯机构及热弯机
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CN111908775B (zh) * 2020-07-20 2022-07-05 河北光兴半导体技术有限公司 张紧装置、热弯机构及热弯机
CN111792822B (zh) * 2020-07-20 2022-08-30 河北光兴半导体技术有限公司 热弯机
CN114999325A (zh) * 2022-06-17 2022-09-02 昆山国显光电有限公司 贴合装置及贴合方法
CN114999325B (zh) * 2022-06-17 2023-10-31 昆山国显光电有限公司 贴合装置及贴合方法
CN115959329A (zh) * 2023-02-17 2023-04-14 歌尔股份有限公司 贴膜机构
CN116280428A (zh) * 2023-02-17 2023-06-23 歌尔股份有限公司 贴膜机构

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