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WO2018142577A1 - Procédé et dispositif de formation de circuit - Google Patents

Procédé et dispositif de formation de circuit Download PDF

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Publication number
WO2018142577A1
WO2018142577A1 PCT/JP2017/003972 JP2017003972W WO2018142577A1 WO 2018142577 A1 WO2018142577 A1 WO 2018142577A1 JP 2017003972 W JP2017003972 W JP 2017003972W WO 2018142577 A1 WO2018142577 A1 WO 2018142577A1
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WO
WIPO (PCT)
Prior art keywords
wiring
resin
metal
conductive
forming
Prior art date
Application number
PCT/JP2017/003972
Other languages
English (en)
Japanese (ja)
Inventor
謙磁 塚田
明宏 川尻
良崇 橋本
克明 牧原
佑 竹内
Original Assignee
株式会社Ｆｕｊｉ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社Ｆｕｊｉ filed Critical 株式会社Ｆｕｊｉ
Priority to JP2018565200A priority Critical patent/JP6714109B2/ja
Priority to PCT/JP2017/003972 priority patent/WO2018142577A1/fr
Publication of WO2018142577A1 publication Critical patent/WO2018142577A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73267—Layer and HDI connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
    • H01L2224/9222—Sequential connecting processes
    • H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
    • H01L2224/92244—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a build-up interconnect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device

Definitions

  • the present invention relates to a circuit forming method and a circuit forming apparatus for forming a wiring by discharging a metal-containing liquid containing metal fine particles in a linear shape and irradiating the metal-containing liquid with a laser.
  • Patent Document 1 there are various circuits such as a circuit including an electronic component and a multilayer circuit.
  • a circuit as described in Patent Document 2 below, it is possible to form a wiring by irradiating a metal-containing liquid containing fine metal particles with a laser.
  • JP 2014-225504 A JP-A 63-209194
  • An object is to appropriately form a circuit including wiring formed by laser irradiation of a metal-containing liquid.
  • the present specification includes a first wiring forming step of forming a wiring by discharging a metal-containing liquid containing metal fine particles in a linear shape and irradiating the metal-containing liquid with a laser.
  • a circuit forming method including a conductive portion and a wiring step of connecting the wiring formed in the first wiring forming step with a conductive cured resin is disclosed.
  • the present specification includes a discharge device for discharging a metal-containing liquid containing metal fine particles, a coating device for applying a conductive curable resin, the discharge device, A control device that controls the operation of the coating device, and the control device discharges the metal-containing liquid linearly and forms a wiring by irradiating the metal-containing liquid with a laser.
  • a circuit forming apparatus comprising: a wiring forming unit; and a connecting unit that connects the conductive unit and the wiring by applying the conductive cured resin so that the coating unit connects the conductive unit and the wiring. Is disclosed.
  • FIG. 4 is a cross-sectional view showing a circuit in a state where electronic components are mounted inside the cavity of FIG. 3. It is sectional drawing which shows the circuit of the state in which the resin laminated body was formed between the cavity and electronic component of FIG. It is sectional drawing which shows the circuit of the state by which the wiring was formed in the upper surface of the resin laminated body of FIG. 5, and an electronic component. It is sectional drawing which shows the circuit of the state in which the wiring was formed in the upper surface of the resin laminated body of FIG. FIG.
  • FIG. 8 is a cross-sectional view showing a circuit in a state where electronic components are mounted inside the cavity of FIG. 7. It is sectional drawing which shows the circuit of the state in which the resin laminated body was formed between the cavity and electronic component of FIG. It is sectional drawing which shows the circuit of the state by which the wiring of FIG. 9 and the electrode of the electronic component were connected by electroconductive ultraviolet curing resin. It is sectional drawing which shows the circuit of the state by which wiring was formed in the upper surface of a board
  • substrate. 12 is a cross-sectional view showing a circuit in a state where a resin laminate having via holes is formed on the upper surface of the substrate of FIG. FIG.
  • FIG. 13 is a cross-sectional view showing a circuit in a state where metal ink is ejected onto the upper surface of the resin laminate of FIG. 12. It is a top view which shows the circuit of the state by which the metal ink was discharged to the upper surface of the resin laminated body of FIG. It is sectional drawing which shows the circuit of the state by which the metal ink was discharged on the upper surface of the resin laminated body of FIG. It is sectional drawing which shows the circuit of the state in which the two wirings of FIG. 14 were connected by electroconductive ultraviolet curing resin. It is sectional drawing which shows the circuit of the state in which two wiring formed on the board
  • FIG. 1 shows a circuit forming device 10.
  • the circuit forming apparatus 10 includes a transport device 20, a first modeling unit 22, a second modeling unit 24, a mounting unit 26, and a control device (see FIG. 2) 27.
  • the conveying device 20, the first modeling unit 22, the second modeling unit 24, and the mounting unit 26 are disposed on the base 28 of the circuit forming device 10.
  • the base 28 has a generally rectangular shape.
  • the longitudinal direction of the base 28 is orthogonal to the X-axis direction
  • the short direction of the base 28 is orthogonal to both the Y-axis direction, the X-axis direction, and the Y-axis direction.
  • the direction will be described as the Z-axis direction.
  • the transport device 20 includes an X-axis slide mechanism 30 and a Y-axis slide mechanism 32.
  • the X-axis slide mechanism 30 has an X-axis slide rail 34 and an X-axis slider 36.
  • the X-axis slide rail 34 is disposed on the base 28 so as to extend in the X-axis direction.
  • the X-axis slider 36 is held by an X-axis slide rail 34 so as to be slidable in the X-axis direction.
  • the X-axis slide mechanism 30 has an electromagnetic motor (see FIG. 2) 38, and the X-axis slider 36 moves to an arbitrary position in the X-axis direction by driving the electromagnetic motor 38.
  • the Y axis slide mechanism 32 includes a Y axis slide rail 50 and a stage 52.
  • the Y-axis slide rail 50 is disposed on the base 28 so as to extend in the Y-axis direction, and is movable in the X-axis direction.
  • One end of the Y-axis slide rail 50 is connected to the X-axis slider 36.
  • a stage 52 is held on the Y-axis slide rail 50 so as to be slidable in the Y-axis direction.
  • the Y-axis slide mechanism 32 has an electromagnetic motor (see FIG. 2) 56, and the stage 52 moves to an arbitrary position in the Y-axis direction by driving the electromagnetic motor 56.
  • the stage 52 moves to an arbitrary position on the base 28 by driving the X-axis slide mechanism 30 and the Y-axis slide mechanism 32.
  • the stage 52 has a base 60, a holding device 62, and a lifting device 64.
  • the base 60 is formed in a flat plate shape, and a substrate is placed on the upper surface.
  • the holding device 62 is provided on both sides of the base 60 in the X-axis direction. The both edges in the X-axis direction of the substrate placed on the base 60 are sandwiched between the holding devices 62, so that the substrate is fixedly held.
  • the lifting device 64 is disposed below the base 60 and lifts the base 60.
  • the first modeling unit 22 is a unit that models wiring on a substrate (see FIG. 3) 70 placed on the base 60 of the stage 52, and includes a first printing unit 72 and a firing unit 74. ing.
  • the first printing unit 72 has an inkjet head (see FIG. 2) 76, and ejects metal ink in a linear manner onto the substrate 70 placed on the base 60.
  • the metal ink is obtained by dispersing metal fine particles in a solvent.
  • the inkjet head 76 ejects metal ink from a plurality of nozzles by, for example, a piezo method using a piezoelectric element.
  • the firing unit 74 has a laser irradiation device (see FIG. 2) 78.
  • the laser irradiation device 78 is a device that irradiates a metal ink discharged onto the substrate 70 with a laser, and the metal ink irradiated with the laser is baked to form a wiring.
  • the firing of the metal ink is a phenomenon in which, by applying energy, the solvent is vaporized, the metal particulate protective film is decomposed, etc., and the metal particulates are brought into contact with or fused to increase the conductivity. is there.
  • metal wiring is formed by baking metal ink.
  • the second modeling unit 24 is a unit that models a resin layer on the substrate 70 placed on the base 60 of the stage 52, and includes a second printing unit 84, a discharge unit 85, and a curing unit 86. have.
  • the second printing unit 84 has an inkjet head (see FIG. 2) 88 and discharges an ultraviolet curable resin onto the substrate 70 placed on the base 60.
  • the ultraviolet curable resin is a resin that is cured by irradiation with ultraviolet rays.
  • the inkjet head 88 may be, for example, a piezo method using a piezoelectric element, or a thermal method in which bubbles are generated by heating a resin to be discharged from a plurality of nozzles.
  • the discharge unit 85 has a dispense head (see FIG. 2) 89 and discharges a conductive ultraviolet curable resin onto the substrate 70 placed on the base 60.
  • the conductive ultraviolet curable resin is obtained by dispersing metal fine particles in a resin that is cured by irradiation with ultraviolet rays. Then, the resin is cured and contracted by the irradiation of ultraviolet rays, whereby the metal fine particles adhere to each other, and the conductive ultraviolet curable resin exhibits conductivity.
  • the dispense head 89 is configured to remove the conductive ultraviolet curable resin from one nozzle having a diameter larger than the diameter of the nozzle of the inkjet head 76. Discharge.
  • the curing unit 86 includes a flattening device (see FIG. 2) 90 and an irradiation device (see FIG. 2) 92.
  • the flattening device 90 is for flattening the upper surface of the ultraviolet curable resin discharged onto the substrate 70 by the inkjet head 88. By scraping with a blade, the thickness of the UV curable resin is made uniform.
  • the irradiation device 92 includes a mercury lamp or LED as a light source, and irradiates the ultraviolet curable resin discharged on the substrate 70 or the conductive ultraviolet curable resin with ultraviolet rays. As a result, the ultraviolet curable resin discharged onto the substrate 70 is cured to form a resin layer, and the conductive ultraviolet curable resin discharged onto the substrate 70 is cured to form a wiring.
  • the mounting unit 26 is a unit that mounts an electronic component (see FIG. 4) 96 on a substrate 70 placed on the base 60 of the stage 52, and includes a supply unit 100 and a mounting unit 102. ing.
  • the supply unit 100 includes a plurality of tape feeders 110 (see FIG. 2) that send out the taped electronic components 96 one by one, and supplies the electronic components 96 at the supply position.
  • the supply unit 100 is not limited to the tape feeder 110, and may be a tray-type supply device that picks up and supplies the electronic component 96 from the tray.
  • the supply unit 100 may be configured to include both a tape type and a tray type, or other supply devices.
  • the mounting unit 102 includes a mounting head (see FIG. 2) 112 and a moving device (see FIG. 2) 114.
  • the mounting head 112 has a suction nozzle (see FIG. 4) 118 for holding the electronic component 96 by suction.
  • the suction nozzle 118 sucks and holds the electronic component 96 by sucking air when negative pressure is supplied from a positive / negative pressure supply device (not shown). Then, the electronic component 96 is detached by supplying a slight positive pressure from the positive / negative pressure supply device.
  • the moving device 114 moves the mounting head 112 between the supply position of the electronic component 96 by the tape feeder 110 and the substrate 70 placed on the base 60. Thereby, in the mounting unit 102, the electronic component 96 supplied from the tape feeder 110 is held by the suction nozzle 118, and the electronic component 96 held by the suction nozzle 118 is mounted on the substrate 70.
  • the control device 27 includes a controller 120 and a plurality of drive circuits 122 as shown in FIG.
  • the plurality of drive circuits 122 include the electromagnetic motors 38 and 56, the holding device 62, the lifting device 64, the ink jet head 76, the laser irradiation device 78, the ink jet head 88, the dispense head 89, the flattening device 90, the irradiation device 92, and the tape feeder. 110, the mounting head 112, and the moving device 114.
  • the controller 120 includes a CPU, a ROM, a RAM, and the like, is mainly a computer, and is connected to a plurality of drive circuits 122. Thereby, the operation of the transport device 20, the first modeling unit 22, the second modeling unit 24, and the mounting unit 26 is controlled by the controller 120.
  • the circuit is formed by mounting the electronic component 96 on the substrate 70 and forming the wiring by the above-described configuration. With this method, there is a possibility that a circuit cannot be formed appropriately.
  • the substrate 70 is set on the base 60 of the stage 52, and the stage 52 is moved below the second modeling unit 24. And in the 2nd modeling unit 24, as shown in FIG. 3, the resin laminated body 130 is formed on the board
  • the resin laminate 130 has a cavity 132 for mounting the electronic component 96, and discharge of the ultraviolet curable resin from the inkjet head 88 and irradiation of ultraviolet rays by the irradiation device 92 to the discharged ultraviolet curable resin. Is formed by repeating.
  • the inkjet head 88 discharges an ultraviolet curable resin onto the upper surface of the substrate 70 in a thin film shape.
  • the inkjet head 88 discharges the ultraviolet curable resin so that a predetermined portion of the upper surface of the substrate 70 is exposed in a generally rectangular shape.
  • the ultraviolet curable resin is flattened by the flattening device 90 so that the film thickness of the ultraviolet curable resin becomes uniform in the curing unit 86.
  • the irradiation device 92 irradiates the thin film ultraviolet curable resin with ultraviolet rays. Thereby, a thin resin layer 133 is formed on the substrate 70.
  • the inkjet head 88 discharges the ultraviolet curable resin into a thin film only on the portion above the thin resin layer 133. That is, the inkjet head 88 discharges the ultraviolet curable resin in a thin film shape onto the thin resin layer 133 so that a predetermined portion of the upper surface of the substrate 70 is exposed in a generally rectangular shape. Then, the thin film ultraviolet curable resin is flattened by the flattening device 90, and the irradiation device 92 irradiates the ultraviolet curable resin discharged in the thin film shape with ultraviolet rays, so that the thin film resin layer 133 is formed on the thin film resin layer 133. A thin resin layer 133 is laminated.
  • the discharge of the ultraviolet curable resin onto the thin resin layer 133 excluding the generally rectangular portion on the upper surface of the substrate 70 and the irradiation with the ultraviolet rays are repeated, and a plurality of resin layers 133 are laminated. Thereby, the resin laminate 130 having the cavity 132 is formed.
  • the stage 52 is moved below the mounting unit 26.
  • the electronic component 96 is supplied by the tape feeder 110, and the electronic component 96 is held by the suction nozzle 118 of the mounting head 112.
  • the mounting head 112 is moved by the moving device 114, and the electronic component 96 held by the suction nozzle 118 is mounted inside the cavity 132 of the resin laminate 130 as shown in FIG. Note that the height dimension of the resin laminate 130 and the height dimension of the electronic component 96 are substantially the same.
  • the stage 52 When the electronic component 96 is mounted inside the cavity 132, the stage 52 is moved below the second modeling unit 24, and as shown in FIG. 5, the gap between the cavities 132, that is, the inner wall surface defining the cavity 132 A resin laminate 150 is formed between the electronic component 96. Similar to the resin laminate 130, the resin laminate 150 is formed by repeating the discharge of the ultraviolet curable resin by the inkjet head 88 and the irradiation of the ultraviolet rays by the irradiation device 92. The height of the resin laminate 150 is substantially the same as the height of the resin laminate 130 and the electronic component 96. Thereby, the upper surface of the resin laminate 130, the upper surface of the resin laminate 150, and the upper surface of the electronic component 96 are flush with each other.
  • the stage 52 is moved below the first modeling unit 22.
  • the metal ink is ejected linearly on the resin laminates 130 and 150 by the inkjet head 76 according to the circuit pattern.
  • the metal ink 160 is ejected linearly so as to connect the electrode 162 of the electronic component 96 to another electrode (not shown).
  • the firing unit 74 the laser is irradiated to the discharged metal ink 160 by the laser irradiation device 78. Thereby, the metal ink 160 is baked, and the wiring 166 that connects the electrodes is formed.
  • the laser applied to the metal ink 160 discharged onto the electronic component 96 is applied to not only the metal ink 160 but also the electronic component 96.
  • the laser since the laser is absorbed by the electronic component 96, particularly the electrode 162, the electronic component 96 may be damaged.
  • the laser is absorbed by the electronic component 96, the metal ink 160 discharged onto the electronic component 96 is not properly baked, and there is a possibility that poor connection occurs.
  • the conventional method there is a possibility that a circuit cannot be formed properly due to damage to the electronic component 96, poor connection, or the like.
  • the electrode 162 of the electronic component 96 and the wiring 166 formed by laser irradiation are connected by a conductive ultraviolet curable resin.
  • a resin laminate 130 having a cavity 132 is formed on the substrate 70.
  • the formation method of the resin laminated body 130 is the same as the conventional method.
  • the metal ink 160 is ejected linearly on the resin laminate 130 according to the circuit pattern by the inkjet head 76. At this time, the metal ink 160 is discharged until just before the edge of the cavity 132. In the firing unit 74, the laser is irradiated to the discharged metal ink 160 by the laser irradiation device 78. Thereby, the metal ink 160 is baked and the wiring 166 is formed.
  • the electronic component 96 is mounted inside the cavity 132 of the resin laminate 130.
  • a resin laminate 150 is formed between the gaps of the cavities 132, that is, between the inner wall surfaces that define the cavities 132 and the electronic components 96.
  • the mounting method of the electronic component 96 and the forming method of the resin laminate 150 are the same as the conventional method.
  • the dispensing head 89 connects the electrode 162 of the electronic component 96 and the wiring 166, as shown in FIG.
  • the conductive ultraviolet curable resin 170 is discharged. Then, by irradiating the conductive ultraviolet curable resin 170 with ultraviolet rays by the irradiation device 92, the conductive ultraviolet curable resin 170 exhibits conductivity, and the electrode 162 of the electronic component 96 and the wiring 166 are electrically connected. Connected.
  • the metal ink 160 is not ejected onto the electronic component 96, but is ejected to a location excluding the electronic component 96, and a laser is applied to the metal ink 160 ejected to a location excluding the electronic component 96.
  • the wiring 166 is formed by irradiation.
  • the electrode 162 of the electronic component 96 and the wiring 166 are connected by the conductive ultraviolet curable resin 170. .
  • the metal ink 160 is discharged onto the resin laminate 130 and is not discharged onto the resin laminate 150 as well as the electronic component 96. For this reason, the laser is not irradiated not only on the electronic component 96 but also in the vicinity of the electronic component 96. As a result, it is possible to appropriately prevent laser irradiation of the electronic component 96.
  • the wiring 166 is formed on the upper surface of the resin laminate 130 before the electronic component 96 is mounted in the cavity 132 of the resin laminate 130. That is, before the electronic component 96 is mounted in the cavity 132 of the resin laminate 130, the laser is irradiated on the upper surface of the resin laminate 130. Thereby, it is possible to reliably prevent laser irradiation of the electronic component 96.
  • (C) Multilayer Circuit Forming Method In the circuit forming apparatus 10, a multilayer circuit pattern is formed on the substrate 70 with the above-described configuration.
  • the conventional method cannot form a circuit properly.
  • the stage 52 on which the substrate 70 is set is moved below the first modeling unit 22.
  • the metal ink 180 is ejected linearly on the substrate 70 according to the circuit pattern by the inkjet head 76.
  • the firing unit 74 the metal ink 180 is irradiated with laser by the laser irradiation device 78. As a result, the metal ink 180 is baked, and the wiring 181 is formed on the substrate 70.
  • a resin laminate 182 is formed on the substrate 70 so as to cover the wiring 181.
  • the resin laminate 182 has a via hole 190 for exposing a part of the wiring 181.
  • the resin laminate 182 discharges the ultraviolet curable resin from the inkjet head 88 and the ultraviolet rays emitted from the irradiation device 92 to the discharged ultraviolet curable resin. And the irradiation is repeated.
  • the inkjet head 88 discharges an ultraviolet curable resin onto the substrate 70 so as to cover the wiring 181.
  • the ultraviolet curable resin is discharged to a portion excluding a circular portion centered on a part of the wiring 181. That is, the inkjet head 88 discharges the ultraviolet curable resin in a thin film shape on the substrate 70 so that a part of the wiring 181 is exposed in a circular shape and the wiring 181 other than the part is covered.
  • the ultraviolet curable resin is discharged in the form of a thin film, the ultraviolet curable resin is flattened by the flattening device 90 in the curing unit 86 so that the film thickness becomes uniform.
  • the irradiation device 92 irradiates the thin film ultraviolet curable resin with ultraviolet rays. As a result, a thin resin layer is formed on the substrate 70.
  • the inkjet head 88 discharges the ultraviolet curable resin into a thin film only on the upper part of the thin resin layer. Then, the thin film-like ultraviolet curable resin is flattened by the flattening device 90, and the irradiation device 92 irradiates the ultraviolet curable resin with ultraviolet rays, whereby the thin film resin layer is laminated on the thin film resin layer. Is done. In this manner, by repeating the discharge of the ultraviolet curable resin onto the thin resin layer excluding the portion where the part of the wiring 181 is exposed in a circular shape and the irradiation with the ultraviolet rays, the via hole 190 is obtained. A resin laminate 182 having the structure is formed.
  • the inner peripheral surface of the via hole 190 is tapered. It becomes a shape. That is, the via hole 190 has a mortar shape, and the inner peripheral surface of the via hole 190 is an inclined surface 192.
  • the metal ink 196 is ejected linearly onto the upper surface of the resin laminate 182 by the inkjet head 76 as shown in FIG. 13. At this time, the metal ink 196 is discharged from the wiring 181 exposed inside the via hole 190 to the upper surface of the resin laminate 182 excluding the via hole 190 via the inclined surface 192 of the via hole 190.
  • the laser irradiation device 78 irradiates the metal ink 196 discharged from the wiring 181 to the upper surface of the resin laminate 182 in the firing unit 74. Thereby, the metal ink 196 is baked, and the wiring 197 extending from the wiring 181 to the upper surface of the resin laminate 182 is formed.
  • the metal ink 196 since the thickness of the metal ink 196 is different on the inclined surface 192 when the metal ink 196 is baked, the metal ink 196 may not be baked appropriately. Specifically, since the viscosity of the metal ink 196 is relatively low, the metal ink 196 discharged on the inclined surface 192 flows downward. For this reason, the thickness of the metal ink 196 discharged onto the inclined surface 192 is thicker toward the lower side and thinner toward the upper side. Further, the amount of laser irradiation necessary for firing the thick metal ink 196 is different from the amount of laser irradiation necessary for firing the thin metal ink 196.
  • the metal ink 196 flows downward on the inclined surface 192, the metal ink 196 moves along the lower end of the inclined surface 192, that is, along the boundary between the substrate 70 and the via hole 190, as shown in FIG.
  • the ink 196 flows.
  • the wiring 197 formed by baking the metal ink 196 has a shape different from a preset shape. As described above, in the conventional method, there is a possibility that a circuit cannot be appropriately formed due to a connection failure, a wiring shape failure, or the like.
  • the wiring 197 is formed on the upper surface of the resin laminate 182 halfway through the inclined surface 192 of the via hole 190. Then, the wiring 197 formed on the upper surface of the resin laminate 182 and the wiring 181 formed on the upper surface of the substrate 70 are connected by a conductive ultraviolet curable resin. Specifically, as illustrated in FIG. 12, the wiring 181 is formed on the upper surface of the substrate 70, and the resin laminate 182 is formed so that a part of the wiring 181 is exposed. In addition, the formation method of the wiring 181 and the formation method of the resin laminate 182 are the same as the conventional method.
  • the metal ink 196 is ejected linearly on the upper surface of the resin laminate 182 according to the circuit pattern by the inkjet head 76.
  • the metal ink 160 is discharged from the middle of the inclined surface 192 of the via hole 190 over the upper surface of the resin laminate 182 excluding the via hole 190 without reaching the wiring 181 formed on the substrate 70.
  • the metal ink 196 discharged onto the inclined surface 192 flows downward, but the amount of discharge onto the inclined surface 192 is smaller than that of the conventional method, so the difference in thickness of the metal ink 196 is small.
  • the laser is irradiated to the discharged metal ink 196 by the laser irradiation device 78. Thereby, the metal ink 196 is baked, and the wiring 197 is formed.
  • the dispensing head 89 connects the wiring 197 formed on the upper surface of the resin laminate 182 and the wiring 181 formed on the upper surface of the substrate 70 as shown in FIG. Then, the conductive ultraviolet curable resin 198 is discharged.
  • the conductive ultraviolet curable resin 198 exhibits conductivity by irradiating the conductive ultraviolet curable resin 198 with ultraviolet rays by the irradiation device 92, and the wiring 197 formed on the upper surface of the resin laminate 182 and the substrate
  • the wiring 181 formed on the upper surface of 70 is electrically connected.
  • the metal ink 196 is discharged only partway along the inclined surface 192, and the discharge amount of the metal ink 196 onto the inclined surface 192 is suppressed, thereby reducing the thickness of the metal ink 196.
  • the difference can be reduced.
  • the metal ink 196 can be appropriately baked and the wiring 197 can be formed on the upper surface of the resin laminate 182 without adjusting the irradiation conditions such as the laser irradiation amount.
  • the wiring 197 formed on the upper surface of the resin laminate 182 and the wiring 181 formed on the upper surface of the substrate 70 are connected by the conductive ultraviolet curable resin 198.
  • the metal ink 196 discharged to the inclined surface 192 is not discharged until reaching the lower end of the inclined surface 192, that is, the boundary between the substrate 70 and the via hole 190. For this reason, it is possible to prevent the metal ink 196 from flowing along the boundary between the substrate 70 and the via hole 190.
  • the conductive ultraviolet curable resin is discharged up to the boundary between the substrate 70 and the via hole 190 in order to connect the wiring 181 and the wiring 197, but since the viscosity of the conductive ultraviolet curable resin is high, the boundary is reached. Is prevented from flowing. As a result, it is possible to prevent the shape defect of the wiring 197 and appropriately form a circuit.
  • the viscosity of the conductive ultraviolet curable resin is about 1 Pa ⁇ sec
  • the viscosity of the metal ink is about 0.01 Pa ⁇ sec.
  • the controller 120 of the control device 27 includes a first wiring forming unit 200, a second wiring forming unit 202, a resin layer forming unit 204, and a connection unit 206, as shown in FIG.
  • the first wiring forming unit 200 is a functional unit for forming the wiring 166 on the upper surface of the resin laminate 130, and is a functional unit for forming the wiring 181 on the upper surface of the substrate 70.
  • the second wiring forming unit 202 is a functional unit for forming the wiring 197 on the upper surface of the resin laminate 182.
  • the resin layer forming unit 204 is a functional unit for forming the resin laminate 182.
  • the connection part 206 is a function for connecting the wiring 166 and the electrode 162 with a conductive ultraviolet curable resin, and is a functional part for connecting the wiring 181 and the wiring 197 with a conductive ultraviolet curable resin.
  • the circuit forming apparatus 10 is an example of a circuit forming apparatus.
  • the control device 27 is an example of a control device.
  • the ink jet head 76 is an example of an ejection device.
  • the dispense head 89 is an example of a coating apparatus.
  • the electronic component 96 is an example of an electronic component.
  • the electrode 162 is an example of a conductive part.
  • the wiring 166 is an example of wiring.
  • the wiring 181 is an example of wiring.
  • the resin laminate 182 is an example of a resin layer.
  • the inclined surface 192 is an example of an inclined surface.
  • the wiring 197 is an example of a wiring and a conductive part.
  • the first wiring forming unit 200 is an example of a wiring forming unit.
  • the connection part 206 is an example of a connection part.
  • the process executed by the first wiring forming unit 200 is an example of a first wiring forming process.
  • the process executed by the second wiring forming unit 202 is an example of a second wiring forming process.
  • the process executed by the resin layer forming unit 204 is an example of a resin layer forming process.
  • the process executed by the connection unit 206 is an example of a connection process.
  • the wiring 197 formed on the upper surface of the resin laminate 182 and the wiring 181 formed on the upper surface of the substrate 70 are conductive UV cured on the inclined surface 192. Wired by resin 198. That is, two wirings formed on different surfaces in the vertical direction are connected by the conductive ultraviolet curable resin 198 on the inclined surface 192.
  • two wirings formed on the same surface may be connected by a conductive ultraviolet curable resin. That is, as shown in FIG. 17, for example, two wirings 210 may be formed on the upper surface of the substrate 70 in a separated state, and the two wirings 210 may be connected by the conductive ultraviolet curable resin 212. .
  • the wiring 197 is formed up to the middle of the inclined surface 192 of the via hole 190, but the resin laminate 182 is not ejected to the inclined surface 192.
  • the wiring 197 may be formed only on the upper surface excluding the inclined surface 192. In such a case, the conductive ultraviolet curable resin 198 is discharged from the upper end to the lower end of the inclined surface 192, and the wiring 181 and the wiring 197 are connected.
  • the conductive ultraviolet curable resin is applied by being ejected by the dispense head 89, but the conductive ultraviolet curable resin may be applied by other methods.
  • a conductive ultraviolet curable resin is attached to the tip of a transfer pin or the like, By bringing the tip of the transfer pin into contact with a predetermined location, the conductive ultraviolet curable resin adhering to the tip may be transferred to the predetermined location and applied.
  • Circuit forming device 27 Control device 76: Inkjet head (discharge device) 89: Dispensing head (coating device) 96: Electronic component (component) 162: Electrode (conductive portion) 166: Wiring 181: Wiring 182: Resin laminate (Resin layer) 192: Inclined surface 197: Wiring (conductive portion) 200: First wiring forming portion (wiring forming portion) (first wiring forming step) 202: Second wiring forming portion (second wiring forming step) 204: Resin layer forming part (resin layer forming process) 206: Connecting part (connecting process)

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

Procédé de formation de circuit, comprenant : une première étape de formation de câblage pour former un câblage par déversement sous forme linéaire d'un liquide contenant du métal qui renferme des microparticules métalliques, et par exposition de ce liquide contenant du métal à un rayonnement laser ; et une étape de connexion pour connecter une partie électroconductrice avec le câblage formé dans la première étape de formation de câblage à l'aide d'une résine de durcissement électroconductrice.
PCT/JP2017/003972 2017-02-03 2017-02-03 Procédé et dispositif de formation de circuit WO2018142577A1 (fr)

Priority Applications (2)

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JP2018565200A JP6714109B2 (ja) 2017-02-03 2017-02-03 回路形成方法、および回路形成装置
PCT/JP2017/003972 WO2018142577A1 (fr) 2017-02-03 2017-02-03 Procédé et dispositif de formation de circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2017/003972 WO2018142577A1 (fr) 2017-02-03 2017-02-03 Procédé et dispositif de formation de circuit

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WO2018142577A1 true WO2018142577A1 (fr) 2018-08-09

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WO2021019675A1 (fr) * 2019-07-30 2021-02-04 株式会社Ｆｕｊｉ Procédé de production de circuit électronique faisant appel à la mise en forme de couches tridimensionnelles
WO2021176498A1 (fr) * 2020-03-02 2021-09-10 株式会社Ｆｕｊｉ Procédé de formation de câblage
WO2021199421A1 (fr) * 2020-04-03 2021-10-07 株式会社Ｆｕｊｉ Procédé et dispositif de formation de circuit
EP4475168A4 (fr) * 2022-02-03 2025-03-26 Fuji Corp Procédé de formation de circuit électrique et appareil de formation de circuit électrique

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JP2006165506A (ja) * 2004-11-11 2006-06-22 Seiko Epson Corp 実装基板及び電子機器
JP2010528428A (ja) * 2007-05-18 2010-08-19 アプライド・ナノテック・ホールディングス・インコーポレーテッド 金属インク
JP2011527089A (ja) * 2008-07-02 2011-10-20 アプライド・ナノテック・ホールディングス・インコーポレーテッド 金属ペーストおよびインク

Cited By (12)

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Publication number Priority date Publication date Assignee Title
WO2021019675A1 (fr) * 2019-07-30 2021-02-04 株式会社Ｆｕｊｉ Procédé de production de circuit électronique faisant appel à la mise en forme de couches tridimensionnelles
JPWO2021019675A1 (fr) * 2019-07-30 2021-02-04
JP7145334B2 (ja) 2019-07-30 2022-09-30 株式会社Fuji ３次元積層造形による電子回路製造方法
US12048102B2 (en) 2019-07-30 2024-07-23 Fuji Corporation Electronic circuit production method using 3D layer shaping
WO2021176498A1 (fr) * 2020-03-02 2021-09-10 株式会社Ｆｕｊｉ Procédé de formation de câblage
JPWO2021176498A1 (fr) * 2020-03-02 2021-09-10
JP7455953B2 (ja) 2020-03-02 2024-03-26 株式会社Fuji 配線形成方法
US12096570B2 (en) 2020-03-02 2024-09-17 Fuji Corporation Wiring formation method
WO2021199421A1 (fr) * 2020-04-03 2021-10-07 株式会社Ｆｕｊｉ Procédé et dispositif de formation de circuit
JPWO2021199421A1 (fr) * 2020-04-03 2021-10-07
JP7230276B2 (ja) 2020-04-03 2023-02-28 株式会社Fuji 回路形成方法および回路形成装置
EP4475168A4 (fr) * 2022-02-03 2025-03-26 Fuji Corp Procédé de formation de circuit électrique et appareil de formation de circuit électrique

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