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WO2018138755A1 - Procédé et dispositif de formation de circuit - Google Patents

Procédé et dispositif de formation de circuit Download PDF

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Publication number
WO2018138755A1
WO2018138755A1 PCT/JP2017/002241 JP2017002241W WO2018138755A1 WO 2018138755 A1 WO2018138755 A1 WO 2018138755A1 JP 2017002241 W JP2017002241 W JP 2017002241W WO 2018138755 A1 WO2018138755 A1 WO 2018138755A1
Authority
WO
WIPO (PCT)
Prior art keywords
cavity
wall
curable resin
resin
ultraviolet curable
Prior art date
Application number
PCT/JP2017/002241
Other languages
English (en)
Japanese (ja)
Inventor
謙磁 塚田
明宏 川尻
良崇 橋本
克明 牧原
佑 竹内
亮二郎 富永
Original Assignee
株式会社Ｆｕｊｉ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社Ｆｕｊｉ filed Critical 株式会社Ｆｕｊｉ
Priority to PCT/JP2017/002241 priority Critical patent/WO2018138755A1/fr
Priority to JP2018563952A priority patent/JP6663516B2/ja
Publication of WO2018138755A1 publication Critical patent/WO2018138755A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73267—Layer and HDI connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
    • H01L2224/9222—Sequential connecting processes
    • H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
    • H01L2224/92244—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a build-up interconnect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H01L2924/15155—Shape the die mounting substrate comprising a recess for hosting the device the shape of the recess being other than a cuboid
    • H01L2924/15156—Side view
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H01L2924/15155—Shape the die mounting substrate comprising a recess for hosting the device the shape of the recess being other than a cuboid
    • H01L2924/15157—Top view

Definitions

  • the present invention relates to a circuit forming method for forming a resin laminate having a cavity for housing a component by laminating a plurality of resin layers obtained by curing a curable resin discharged in a thin film shape, and circuit formation Relates to the device.
  • the goal is to form a cavity that can properly accommodate parts.
  • the present specification provides a resin laminate having a cavity for housing a component by laminating a plurality of resin layers obtained by curing a curable resin discharged in a thin film shape.
  • the resin laminate is formed by discharging the curable resin so that the wall surface of the cavity facing the corner of the component is recessed in a direction away from the corner of the component.
  • a circuit forming method is disclosed.
  • the present specification laminates a discharge device that discharges a curable resin and a plurality of resin layers obtained by curing the curable resin discharged in a thin film by the discharge device.
  • a discharge device that discharges a curable resin and a plurality of resin layers obtained by curing the curable resin discharged in a thin film by the discharge device.
  • FIG. 1 It is a figure which shows a circuit formation apparatus. It is a block diagram which shows a control apparatus. It is sectional drawing which shows an ideal resin laminated body. It is sectional drawing which shows the circuit of the state by which the electronic component was mounted
  • FIG. 1 shows a circuit forming device 10.
  • the circuit forming apparatus 10 includes a transport device 20, a first modeling unit 22, a second modeling unit 24, a mounting unit 26, and a control device (see FIG. 2) 27.
  • the conveying device 20, the first modeling unit 22, the second modeling unit 24, and the mounting unit 26 are disposed on the base 28 of the circuit forming device 10.
  • the base 28 has a generally rectangular shape.
  • the longitudinal direction of the base 28 is orthogonal to the X-axis direction
  • the short direction of the base 28 is orthogonal to both the Y-axis direction, the X-axis direction, and the Y-axis direction.
  • the direction will be described as the Z-axis direction.
  • the transport device 20 includes an X-axis slide mechanism 30 and a Y-axis slide mechanism 32.
  • the X-axis slide mechanism 30 has an X-axis slide rail 34 and an X-axis slider 36.
  • the X-axis slide rail 34 is disposed on the base 28 so as to extend in the X-axis direction.
  • the X-axis slider 36 is held by an X-axis slide rail 34 so as to be slidable in the X-axis direction.
  • the X-axis slide mechanism 30 has an electromagnetic motor (see FIG. 2) 38, and the X-axis slider 36 moves to an arbitrary position in the X-axis direction by driving the electromagnetic motor 38.
  • the Y axis slide mechanism 32 includes a Y axis slide rail 50 and a stage 52.
  • the Y-axis slide rail 50 is disposed on the base 28 so as to extend in the Y-axis direction, and is movable in the X-axis direction.
  • One end of the Y-axis slide rail 50 is connected to the X-axis slider 36.
  • a stage 52 is held on the Y-axis slide rail 50 so as to be slidable in the Y-axis direction.
  • the Y-axis slide mechanism 32 has an electromagnetic motor (see FIG. 2) 56, and the stage 52 moves to an arbitrary position in the Y-axis direction by driving the electromagnetic motor 56.
  • the stage 52 moves to an arbitrary position on the base 28 by driving the X-axis slide mechanism 30 and the Y-axis slide mechanism 32.
  • the stage 52 has a base 60, a holding device 62, and a lifting device 64.
  • the base 60 is formed in a flat plate shape, and a substrate is placed on the upper surface.
  • the holding device 62 is provided on both sides of the base 60 in the X-axis direction. The both edges in the X-axis direction of the substrate placed on the base 60 are sandwiched between the holding devices 62, so that the substrate is fixedly held.
  • the lifting device 64 is disposed below the base 60 and lifts the base 60.
  • the first modeling unit 22 is a unit that models wiring on a substrate (see FIG. 3) 70 placed on the base 60 of the stage 52, and includes a first printing unit 72 and a firing unit 74. ing.
  • the first printing unit 72 has an inkjet head (see FIG. 2) 76, and ejects metal ink in a linear manner onto the substrate 70 placed on the base 60.
  • the metal ink is obtained by dispersing metal fine particles in a solvent.
  • the inkjet head 76 discharges a conductive material from a plurality of nozzles by, for example, a piezo method using a piezoelectric element.
  • the firing unit 74 has a laser irradiation device (see FIG. 2) 78.
  • the laser irradiation device 78 is a device that irradiates a metal ink discharged onto the substrate 70 with a laser, and the metal ink irradiated with the laser is baked to form a wiring.
  • the firing of the metal ink is a phenomenon in which, by applying energy, the solvent is vaporized, the metal particulate protective film is decomposed, etc., and the metal particulates are brought into contact with or fused to increase the conductivity. is there.
  • metal wiring is formed by baking metal ink.
  • the second modeling unit 24 is a unit that models a resin layer on the substrate 70 placed on the base 60 of the stage 52, and includes a second printing unit 84 and a curing unit 86. .
  • the second printing unit 84 has an inkjet head (see FIG. 2) 88 and discharges an ultraviolet curable resin onto the substrate 70 placed on the base 60.
  • the ink jet head 88 may be, for example, a piezo method using a piezoelectric element, or a thermal method in which a resin is heated to generate bubbles and ejected from a nozzle.
  • the curing unit 86 includes a flattening device (see FIG. 2) 90 and an irradiation device (see FIG. 2) 92.
  • the flattening device 90 is for flattening the upper surface of the ultraviolet curable resin discharged onto the substrate 70 by the inkjet head 88. By scraping with a blade, the thickness of the UV curable resin is made uniform.
  • the irradiation device 92 includes a mercury lamp or LED as a light source, and irradiates the ultraviolet curable resin discharged onto the substrate 70 with ultraviolet rays. Thereby, the ultraviolet curable resin discharged on the board
  • the mounting unit 26 is a unit that mounts an electronic component (see FIG. 4) 96 on a substrate 70 placed on the base 60 of the stage 52, and includes a supply unit 100 and a mounting unit 102. ing.
  • the supply unit 100 includes a plurality of tape feeders 110 (see FIG. 2) that send out the taped electronic components 96 one by one, and supplies the electronic components 96 at the supply position.
  • the supply unit 100 is not limited to the tape feeder 110, and may be a tray-type supply device that picks up and supplies the electronic component 96 from the tray.
  • the supply unit 100 may be configured to include both a tape type and a tray type, or other supply devices.
  • the mounting unit 102 includes a mounting head (see FIG. 2) 112 and a moving device (see FIG. 2) 114.
  • the mounting head 112 has a suction nozzle (see FIG. 4) 118 for holding the electronic component 96 by suction.
  • the suction nozzle 118 sucks and holds the electronic component 96 by sucking air when negative pressure is supplied from a positive / negative pressure supply device (not shown). Then, the electronic component 96 is detached by supplying a slight positive pressure from the positive / negative pressure supply device.
  • the moving device 114 moves the mounting head 112 between the supply position of the electronic component 96 by the tape feeder 110 and the substrate 70 placed on the base 60. Thereby, in the mounting unit 102, the electronic component 96 supplied from the tape feeder 110 is held by the suction nozzle 118, and the electronic component 96 held by the suction nozzle 118 is mounted on the substrate 70.
  • the control device 27 includes a controller 120 and a plurality of drive circuits 122 as shown in FIG.
  • the plurality of drive circuits 122 include the electromagnetic motors 38 and 56, the holding device 62, the lifting device 64, the inkjet head 76, the laser irradiation device 78, the inkjet head 88, the flattening device 90, the irradiation device 92, the tape feeder 110, and the mounting head. 112, connected to the moving device 114.
  • the controller 120 includes a CPU, a ROM, a RAM, and the like, is mainly a computer, and is connected to a plurality of drive circuits 122. Thereby, the operation of the transport device 20, the first modeling unit 22, the second modeling unit 24, and the mounting unit 26 is controlled by the controller 120.
  • a circuit is formed by mounting the electronic component 96 on the substrate 70 with the above-described configuration. Specifically, the substrate 70 is set on the base 60 of the stage 52, and the stage 52 is moved below the second modeling unit 24. And in the 2nd modeling unit 24, as shown in FIG. 3, the resin laminated body 130 is formed on the board
  • the inkjet head 88 discharges an ultraviolet curable resin onto the upper surface of the substrate 70 in a thin film shape.
  • the inkjet head 88 discharges the ultraviolet curable resin so that a predetermined portion of the upper surface of the substrate 70 is exposed in a generally rectangular shape.
  • the ultraviolet curable resin is flattened by the flattening device 90 so that the film thickness of the ultraviolet curable resin becomes uniform in the curing unit 86.
  • the irradiation device 92 irradiates the thin film ultraviolet curable resin with ultraviolet rays. Thereby, a thin resin layer 133 is formed on the substrate 70.
  • the inkjet head 88 discharges the ultraviolet curable resin into a thin film only on the portion above the thin resin layer 133. That is, the inkjet head 88 discharges the ultraviolet curable resin in a thin film shape onto the thin resin layer 133 so that a predetermined portion of the upper surface of the substrate 70 is exposed in a generally rectangular shape. Then, the thin film ultraviolet curable resin is flattened by the flattening device 90, and the irradiation device 92 irradiates the ultraviolet curable resin discharged in the thin film shape with ultraviolet rays, so that the thin film resin layer 133 is formed on the thin film resin layer 133. A thin resin layer 133 is laminated.
  • the discharge of the ultraviolet curable resin onto the thin resin layer 133 excluding the generally rectangular portion on the upper surface of the substrate 70 and the irradiation with the ultraviolet rays are repeated, and a plurality of resin layers 133 are laminated. Thereby, the resin laminate 130 having the cavity 132 is formed.
  • the stage 52 is moved below the mounting unit 26.
  • the electronic component 96 is supplied by the tape feeder 110, and the electronic component 96 is held by the suction nozzle 118 of the mounting head 112.
  • the mounting head 112 is moved by the moving device 114, and the electronic component 96 held by the suction nozzle 118 is placed inside the cavity 132 of the resin laminate 130 as shown in FIGS. .
  • the height dimension of the resin laminate 130 and the height dimension of the electronic component 96 are substantially the same.
  • the electronic component 96 is mounted inside the cavity 132 of the resin laminate 130.
  • the cavity 132 of the resin laminate 130 shown in FIGS. 3 to 5 has an ideal shape, and the cavity 132 of the actual resin laminate 130 is generally shaped like a bowl as shown in FIGS. 6 and 7. Become. That is, the wall surface 136 of the ideally shaped cavity 132 is perpendicular to the substrate 70 as shown in FIG.
  • the wall surface 136 of the cavity 132 of the actual resin laminate 130 becomes a tapered surface that inclines toward the inside of the cavity 132 as it goes downward, as shown in FIG.
  • the ultraviolet curable resin when the ultraviolet curable resin is discharged onto the resin layer 133 during the formation of the resin laminate 130, the discharged ultraviolet curable resin flows into the cavity 132.
  • the ultraviolet curable resin is cured while flowing into the cavity 132, so that the actual wall surface 136 of the cavity 132 becomes a tapered surface that inclines toward the inside of the cavity 132 as it goes downward.
  • the wall surface of the cavity 132 that faces the corner portion of the side surface of the electronic component 96 is generally at a right angle, like the corner portion of the electronic component 96.
  • the wall surface of the cavity 132 (hereinafter referred to as a corner-corresponding wall surface) facing the corner portion of the cavity is arcuate. The corner-corresponding side faces enter the cavity 132.
  • the electronic component 96 can be mounted on the substrate 70 inside the cavity 132 without interfering with the wall surface 136 of the cavity 132.
  • the formation area of the cavity becomes large, and a compact circuit cannot be formed. Therefore, in the circuit forming apparatus 10, the flow of the ultraviolet curable resin into the cavity 132 during the formation of the resin laminate 130 is suppressed, and the entry of the corner-corresponding wall surface into the cavity 132 is suppressed.
  • the inkjet head 88 discharges an ultraviolet curable resin onto the upper surface of the substrate 70 in a thin film shape.
  • the inkjet head 88 discharges the ultraviolet curable resin 150 with a predetermined width, for example, a width of 50 to 100 ⁇ m so as to surround a generally rectangular portion of the upper surface of the substrate 70. That is, the ultraviolet curable resin 150 is generally discharged in a frame shape. The ultraviolet curable resin 150 is discharged so that the corners of the frame shape protrude in an arc shape toward the outside.
  • the ultraviolet curable resin 150 is discharged in a generally frame shape, the ultraviolet curable resin 150 is flattened by the flattening device 90 so that the film thickness of the ultraviolet curable resin 150 becomes uniform in the curing unit 86. .
  • the irradiation device 92 irradiates the frame-shaped ultraviolet curable resin 150 with ultraviolet rays. As a result, a frame-shaped resin layer 133 is formed on the substrate 70.
  • the inkjet head 88 discharges the ultraviolet curable resin 150 in a thin film shape only on the portion above the frame-shaped resin layer 133.
  • the ultraviolet curable resin 150 is flattened by the flattening device 90, and the irradiation device 92 irradiates the ultraviolet curable resin 150 discharged into the frame shape with ultraviolet rays, so that the frame is formed on the frame-shaped resin layer 133.
  • a resin layer 133 having a shape is laminated.
  • the discharge of the ultraviolet curable resin 150 onto the frame-shaped resin layer 133 surrounding the generally rectangular portion of the upper surface of the substrate 70 and the irradiation with ultraviolet rays are repeated, so that a plurality of frame-shaped resin layers 133 are formed.
  • a first wall 160 surrounding the cavity 132 is formed. Note that the height dimension of the first wall portion 160 is about half of the height dimension of the electronic component 96 to be mounted inside the cavity 132.
  • the wall surface 162 of the cavity 132 is a tapered surface that inclines toward the inside of the cavity 132 as it goes downward due to the flow of the ultraviolet curable resin 150 into the cavity 132 when the first wall 160 is formed. .
  • the ultraviolet curable resin 150 is discharged in a frame shape, so that the ultraviolet curable resin 150 is discharged over the entire surface other than the cavity 132 as shown in FIG. Therefore, the discharge amount of the ultraviolet curable resin 150 is very small.
  • the inclination angle of the wall surface 162 of the cavity 132 is large.
  • the inclination angle of the wall surface 136 of the cavity 132 formed by the conventional method is about 40 degrees, but the cavity formed by this method is shown in FIG.
  • the inclination angle of the wall surface 162 of 132 is about 80 degrees.
  • the ultraviolet curable resin 150 is discharged so that the corners of the frame shape protrude in an arc shape toward the outside. For this reason, even if the ultraviolet curable resin 150 discharged so as to protrude outward in an arc shape flows into the cavity 132, the protrusion amount into the cavity 132 is suppressed. As a result, as shown in FIG. 7, the corner-corresponding wall surface of the cavity 132 formed by the conventional method has entered greatly toward the inside of the cavity 132, but is formed by this method as shown in FIG. 10. The corner-corresponding wall surface of the cavity 132 hardly enters the cavity 132.
  • the first main body 170 is formed on the upper surface of the substrate 70 so as to surround the first wall 160 as shown in FIG.
  • the inkjet head 88 discharges an ultraviolet curable resin to the upper surface of the board
  • the inkjet head 88 discharges an ultraviolet curable resin onto the upper surface of the substrate 70 excluding the first wall 160 and the cavity 132.
  • the resin layer 133 is formed on the upper surface of the substrate 70 so as to surround the first wall portion 160 by flattening the ultraviolet curable resin and irradiating the ultraviolet curable resin with ultraviolet rays.
  • the inkjet head 88 discharges the ultraviolet curable resin into a thin film only on the portion of the resin layer 133 surrounding the first wall portion 160.
  • the resin layer 133 is laminated on the resin layer 133 surrounding the first wall portion 160 by flattening the ultraviolet curable resin and irradiating the ultraviolet curable resin with ultraviolet rays.
  • the discharge of the ultraviolet curable resin 150 onto the resin layer 133 surrounding the first wall 160 and the irradiation with the ultraviolet rays are repeated, and the plurality of resin layers 133 are stacked, whereby the first A first main body portion 170 is formed so as to surround the wall portion 160.
  • the ultraviolet curable resin is discharged so as to surround the first wall portion 160, so that the first wall portion 160 cures the ultraviolet rays to the inside of the cavity 132. Inflow of resin is prevented.
  • the height of the first main body 170 is the same as the height of the first wall 160.
  • the inkjet head 88 discharges the ultraviolet curable resin onto the upper surface of the first wall portion 160 in the same frame shape as when the first wall portion 160 is formed. That is, the inkjet head 88 discharges the ultraviolet curable resin 150 having the shape shown in FIG. 8 on the upper surface of the first wall portion 160.
  • the discharge position of the ultraviolet curable resin at the time of forming the second wall portion 172 is a position away from the cavity 132 by a predetermined distance ⁇ from the discharge position of the ultraviolet curable resin at the time of forming the first wall portion 160. Yes.
  • the inkjet head 88 has a frame shape of the ultraviolet curable resin not only on the upper surface of the first wall portion 160 but also on the upper surface of the edge portion of the first main body portion 170 continuous with the first wall portion 160. Discharge. Then, the upper surface of the first wall portion 160 and the upper surface of the edge portion of the first main body portion 170 continuous with the first wall portion 160 are obtained by flattening the ultraviolet curable resin and irradiating the ultraviolet curable resin with ultraviolet rays. In addition, a frame-shaped resin layer 133 is formed.
  • the predetermined distance ⁇ is set so that the inner edge of the upper surface of the first wall portion 160 and the inner edge of the resin layer 133 formed on the wall portion 160 coincide with each other in the vertical direction.
  • the resin layer 133 that defines the cavity 132 is formed on the first wall 160 that defines the cavity 132, and is continuous from the wall 160.
  • the inkjet head 88 discharges the ultraviolet curable resin in a thin film shape only on the upper portion of the frame-shaped resin layer 133 formed on the first wall portion 160.
  • the frame-shaped resin layer 133 is laminated on the frame-shaped resin layer 133 by flattening the ultraviolet-curable resin and irradiating the ultraviolet-curable resin with ultraviolet rays. In this manner, the discharge of the ultraviolet curable resin 150 and the irradiation of the ultraviolet rays are repeated, and the plurality of resin layers 133 are stacked, so that the second wall portion 172 is formed on the first wall portion 160.
  • the discharge position of the ultraviolet curable resin when the second wall portion 172 is formed is a predetermined distance ⁇ from the cavity 132 from the discharge position of the ultraviolet curable resin when the first wall portion 160 is formed. It is considered as a remote location. For this reason, the second wall portion 172 is formed at a position shifted from the cavity 132 by a predetermined distance ⁇ from the first wall portion 160.
  • the inclination angle of the wall surface of the second wall portion 172 is substantially the same as the inclination angle of the wall surface of the first wall portion 160 that defines the cavity 132.
  • the height dimension of the second wall portion 172 includes the height dimension from the upper surface of the substrate 70 to the upper surface of the second wall portion 172, and the height dimension of the electronic component 96 to be mounted inside the cavity 132. Are set to match. That is, the total dimension of the height dimension of the second wall part 172 and the height dimension of the first wall part 160 is the same as the height dimension of the electronic component 96 to be mounted inside the cavity 132. ing.
  • a second main body portion 176 is formed on the upper surface of the first main body portion 170 so as to surround the second wall portion 172, as shown in FIG. Is done.
  • the inkjet head 88 discharges the ultraviolet curable resin onto the upper surface of the first main body 170 in a thin film shape.
  • the inkjet head 88 discharges an ultraviolet curable resin onto the upper surface of the first main body 170 excluding the second wall 172 and the cavity 132.
  • the resin layer 133 is formed on the upper surface of the first main body 170 so as to surround the second wall 172 by flattening the ultraviolet curable resin and irradiating the ultraviolet curable resin with ultraviolet rays.
  • the inkjet head 88 discharges the ultraviolet curable resin in a thin film shape only on the portion above the resin layer 133 surrounding the second wall portion 172. Then, the resin layer 133 is laminated on the resin layer 133 surrounding the second wall portion 172 by flattening the ultraviolet curable resin and irradiating the ultraviolet curable resin with ultraviolet rays. As described above, the discharge of the ultraviolet curable resin 150 onto the resin layer 133 surrounding the second wall portion 172 and the irradiation with the ultraviolet rays are repeated, and the plurality of resin layers 133 are stacked, whereby the second A second main body 176 is formed so as to surround the wall 172.
  • the second wall portion. 172 prevents the UV curable resin from flowing into the cavity 132.
  • the height dimension of the second main body 176 is the same as the height dimension of the second wall 172.
  • the first wall 160 is formed on the substrate 70, and the first main body 170 surrounding the first wall 160 is formed.
  • a second wall portion 172 is formed on the first wall portion 160, and a second main body portion 176 surrounding the second wall portion 172 is formed.
  • the resin laminate 180 having the cavity 132 is formed on the substrate 70. That is, the resin laminate 180 is formed by the first wall portion 160, the first main body portion 170, the second wall portion 172, and the second main body portion 176.
  • the stage 52 is moved below the mounting unit 26. Then, the electronic component 96 is held by the mounting head 112, and the electronic component 96 is placed inside the cavity 132 of the resin laminate 180. Subsequently, when the electronic component 96 is placed inside the cavity 132, as shown in FIG. 14, a resin laminate 190 is formed in a gap other than where the electronic component 96 is placed in the cavity 132.
  • the formation method of the resin laminated body 190 is the same as the 1st wall part 160, the 1st main-body part 170 grade
  • the height dimension of the resin laminate 190 is substantially the same as the height dimension of the resin laminate 180.
  • the stage 52 is moved below the first modeling unit 22. And in the 1st printing part 72, the inkjet head 76 discharges a metal ink linearly according to a circuit pattern. At this time, the metal ink is ejected linearly so as to connect the electrode 200 of the electronic component 96 and the other electrode (not shown). Subsequently, in the firing unit 74, the ejected metal ink is irradiated with a laser by the laser irradiation device 78, so that the metal ink is fired, and as shown in FIG. A wiring 202 connecting the electrodes is formed. Thereby, a circuit in which the electronic component 96 is mounted on the substrate 70 is formed.
  • the flow of the ultraviolet curable resin into the cavity 132 is suppressed when the resin laminate 180 is formed. Further, the ultraviolet curable resin 150 is discharged so that the wall surface of the cavity 132 facing the corner portion of the side surface of the electronic component 96 to be placed, that is, the corner corresponding wall surface protrudes in an arc shape toward the outside. For this reason, in the resin laminate 180, the inclination angle of the wall surface of the cavity 132 is increased, and in particular, the corner-corresponding wall surface of the cavity 132 hardly enters the inside of the cavity 132. As a result, the electronic component 96 can be appropriately placed in the cavity 132 without causing interference between the wall surface of the cavity 132 and the electronic component 96.
  • the second wall 172 and the second main body 176 are formed after the first wall 160 and the first main body 170 are formed. This is to prevent interference between the inkjet head 88 that discharges the ultraviolet curable resin and the discharged ultraviolet curable resin.
  • the distance between the tip of the discharge nozzle and the planned discharge position is 1 mm or less in order to appropriately discharge the ultraviolet curable resin to the planned discharge location.
  • the ink jet head 88 approaches the expected discharge position. For this reason, for example, when the height dimension of the electronic component 96 scheduled to be placed in the cavity 132 exceeds 1 mm, the height dimension of the wall portion defining the cavity 132 exceeds 1 mm.
  • the inkjet head 88 and the wall portion interfere with each other when the main body portion is formed. Therefore, as described above, the first wall portion 160 and the first main body portion 170 of 1 mm or less are formed, and the first wall portion 160 and the first main body portion 170 are formed on the first wall portion 160 and the first main body portion 170. Two wall portions 172 and a second body portion 176 are formed. Accordingly, it is possible to form a wall portion having a height dimension exceeding 1 mm without causing the inkjet head 88 and the wall portion to interfere with each other.
  • the resin laminate 180 having the cavity 132 is shaped according to the dimensions of the electronic component 96 mounted in the cavity 132. That is, when the dimension of the electronic component 96 at the time of mounting is large, a large cavity 132 is formed in the left-right direction, and when the dimension of the electronic component 96 at the time of mounting is small, it is small in the left-right direction. A cavity 132 is formed. In addition, the cavity 132 having a depth corresponding to the vertical dimension, that is, the height dimension of the electronic component 96 at the time of mounting is formed.
  • the horizontal dimension of the cavity 132 is set according to the horizontal dimension of the electronic component 96, and the vertical dimension of the cavity 132 is set to the height dimension of the electronic component 96.
  • the wall surface of the cavity 132 is a tapered surface. The larger the vertical dimension of the cavity 132, the smaller the bottom surface of the cavity 132. The smaller the vertical dimension of the cavity 132, the larger the bottom surface of the cavity 132. Become. That is, when the horizontal dimension of the cavity 132 is set considering only the horizontal dimension of the electronic component 96, the electronic component 96 may not be mounted in the cavity 132. Therefore, in the circuit forming apparatus 10, the horizontal dimension of the cavity 132 is set in consideration of not only the horizontal dimension of the electronic component 96 but also the vertical dimension of the electronic component 96.
  • the horizontal dimension of the cavity 132 is determined according to the shape of the ultraviolet curable resin discharged when the resin layer 133 of the resin laminate 180 is formed, that is, the discharge pattern of the ultraviolet curable resin. For this reason, the discharge pattern of the ultraviolet curable resin is set so that the location of the cavity 132 is larger than the dimensions of the left and right methods of the electronic component 96. At this time, the discharge pattern of the ultraviolet curable resin is set so that the portion that becomes the cavity 132 becomes larger as the height dimension of the electronic component 96 is larger.
  • FIG. 16 includes an ultraviolet curable resin discharge pattern of each of the electronic component 96a, the electronic component 96b, and the electronic component 96c, and a cavity 132 in which each of the electronic component 96a, the electronic component 96b, and the electronic component 96c is mounted.
  • a plan view and a cross-sectional view of the resin laminate 180 are shown.
  • the electronic components 96a, 96b, and 96c have the same horizontal dimension, but the height of the electronic component 96b is larger than the height of the electronic component 96a, and the height of the electronic component 96c is equal to the electronic component 96c. It is larger than the height dimension of 96b.
  • the black coating portion 210 indicates a portion where the ultraviolet curable resin is discharged
  • the white portion 212 indicates a portion where the ultraviolet curable resin is not discharged, that is, the cavity 132.
  • the part which becomes is shown.
  • the reason why the white portion 212 has a shape that is recessed in an arc shape toward the black coating portion 210 has been described above, and is omitted.
  • the first wall 160, the first main body 170, the second wall 172, and the second main body 176 are distinguished from each other. .
  • the first wall portion 160, the first main body portion 170, the second wall portion 172, and the second main body portion 176 are integrally formed with the resin laminate 180. Will be described.
  • the white portion 212 is made larger than the discharge pattern of the ultraviolet curable resin corresponding to the electronic component 96a.
  • the white portion 212 is made larger than the discharge pattern of the ultraviolet curable resin corresponding to the electronic component 96b. That is, the discharge pattern of the ultraviolet curable resin is set so that the portion that becomes the cavity 132 becomes larger as the height dimension of the electronic component 96 is larger.
  • the wall surface of the cavity 132 is a tapered surface that is inclined toward the inside of the cavity 132 as it goes downward, the size of the bottom surface of the cavity 132 for mounting each of the electronic components 96a, 96b, and 96c. It is almost the same.
  • each of the electronic components 96a, 96b, and 96c having different height dimensions is appropriately disposed inside the cavity 132. It becomes possible to attach to.
  • the controller 120 of the control device 27 includes a first wall portion forming portion 220, a first body portion forming portion 222, a second wall portion forming portion 224, and a second body portion forming portion. 226.
  • the first wall part forming part 220 is a functional part for forming the first wall part 160.
  • the first main body forming part 222 is a functional part for forming the first main body 170.
  • the second wall part forming part 224 is a functional part for forming the second wall part 172.
  • the second main body forming unit 226 is a functional unit for forming the second main body 176.
  • the circuit forming apparatus 10 is an example of a circuit forming apparatus.
  • the control device 27 is an example of a control device.
  • the inkjet head 88 is an example of a discharge device.
  • the electronic component 96 is an example of a component.
  • the cavity 132 is an example of a cavity.
  • the resin layer 133 is an example of a resin layer.
  • the resin laminate 180 is an example of a resin laminate.
  • the first wall portion 160 is an example of a first wall portion.
  • the first main body 170 is an example of a first main body.
  • the second wall portion 172 is an example of a second wall portion.
  • the second main body 176 is an example of a second main body.
  • the process performed by the 1st wall part formation part 220 is an example of a 1st wall part formation process.
  • the process executed by the first body part forming unit 222 is an example of a first body part forming process.
  • the process executed by the second wall part forming part 224 is an example of a second wall part forming process.
  • the process executed by the second body part forming unit 226 is an example of a second body part forming process.
  • the whitened portion 212 in the discharge pattern of the ultraviolet curable resin, has a concave shape in an arc shape toward the blackened portion 210, but is shown in FIG. 17.
  • the white portion 232 may be recessed in a triangular shape toward the black coating portion 230. That is, when the ultraviolet curable resin is discharged so that the side surface corresponding to the corner is recessed in the direction away from the cavity 132 when the resin laminate 180 is formed, the recessed shape is an arc shape or a triangular shape.
  • various shapes can be used.
  • the resin laminated body 180 is the 1st laminated part comprised by the 1st wall part 160 and the 1st main body part 170, the 2nd wall part 172, and the 2nd main body. And a second layered portion formed by the portion 176.
  • the third wall portion and the third main body portion may be formed on the second wall portion 172 and the second main body portion 176, and the resin laminate may be formed of three or more laminated portions. Good.
  • Circuit forming device 27 Control device 88: Inkjet head (discharge device) 96: Electronic component (component) 132: Cavity 133: Resin layer 180: Resin laminate 160: First wall 170: First main body 172: Second wall portion 176: Second body portion 220: First wall portion forming portion (first wall portion forming step) 222: First body portion forming portion (first body portion forming step) 224: Second Wall part forming part (second wall part forming process) 226: Second body part forming part (second body part forming process)

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

L'invention concerne un procédé de formation de circuit dans lequel, au moment de la formation d'un corps stratifié de résine par stratification d'une pluralité de couches de résine formées par durcissement d'une résine durcissable éjectée sous forme de couche mince, ledit corps stratifié de résine ayant une cavité pour loger un composant, le corps stratifié de résine est formé par éjection de la résine durcissable de telle sorte que des surfaces de paroi de cavité faisant face aux parties de coin du composant sont dans un état en retrait dans la direction s'éloignant des parties de coin du composant.
PCT/JP2017/002241 2017-01-24 2017-01-24 Procédé et dispositif de formation de circuit WO2018138755A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/JP2017/002241 WO2018138755A1 (fr) 2017-01-24 2017-01-24 Procédé et dispositif de formation de circuit
JP2018563952A JP6663516B2 (ja) 2017-01-24 2017-01-24 回路形成方法、および回路形成装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2017/002241 WO2018138755A1 (fr) 2017-01-24 2017-01-24 Procédé et dispositif de formation de circuit

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WO2018138755A1 true WO2018138755A1 (fr) 2018-08-02

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021181561A1 (fr) * 2020-03-11 2021-09-16 株式会社Ｆｕｊｉ Procédé de fabrication de substrat de montage par moulage de stratifié tridimensionnel
WO2024057474A1 (fr) * 2022-09-15 2024-03-21 株式会社Fuji Dispositif de formation de stratifié de résine, carte de circuit imprimé et procédé de formation de carte de circuit imprimé

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JP2004055965A (ja) * 2002-07-23 2004-02-19 Seiko Epson Corp 配線基板及び半導体装置並びにこれらの製造方法、回路基板並びに電子機器
JP2006287008A (ja) * 2005-04-01 2006-10-19 Seiko Epson Corp 多層構造基板の製造方法
JP2007027527A (ja) * 2005-07-20 2007-02-01 Shinko Electric Ind Co Ltd 基板及びその製造方法
JP2011071417A (ja) * 2009-09-28 2011-04-07 Murata Mfg Co Ltd 配線基板の製造方法
JP2015079776A (ja) * 2013-09-12 2015-04-23 太陽誘電株式会社 部品内蔵基板及び部品内蔵基板用コア基材

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Publication number Priority date Publication date Assignee Title
JP2004055965A (ja) * 2002-07-23 2004-02-19 Seiko Epson Corp 配線基板及び半導体装置並びにこれらの製造方法、回路基板並びに電子機器
JP2006287008A (ja) * 2005-04-01 2006-10-19 Seiko Epson Corp 多層構造基板の製造方法
JP2007027527A (ja) * 2005-07-20 2007-02-01 Shinko Electric Ind Co Ltd 基板及びその製造方法
JP2011071417A (ja) * 2009-09-28 2011-04-07 Murata Mfg Co Ltd 配線基板の製造方法
JP2015079776A (ja) * 2013-09-12 2015-04-23 太陽誘電株式会社 部品内蔵基板及び部品内蔵基板用コア基材

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021181561A1 (fr) * 2020-03-11 2021-09-16 株式会社Ｆｕｊｉ Procédé de fabrication de substrat de montage par moulage de stratifié tridimensionnel
JPWO2021181561A1 (fr) * 2020-03-11 2021-09-16
JP7316742B2 (ja) 2020-03-11 2023-07-28 株式会社Fuji ３次元積層造形による実装基板の製造方法
WO2024057474A1 (fr) * 2022-09-15 2024-03-21 株式会社Fuji Dispositif de formation de stratifié de résine, carte de circuit imprimé et procédé de formation de carte de circuit imprimé

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JPWO2018138755A1 (ja) 2019-11-07

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