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WO2018008365A1 - Dispositif de traitement à la lumière - Google Patents

Dispositif de traitement à la lumière Download PDF

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Publication number
WO2018008365A1
WO2018008365A1 PCT/JP2017/022318 JP2017022318W WO2018008365A1 WO 2018008365 A1 WO2018008365 A1 WO 2018008365A1 JP 2017022318 W JP2017022318 W JP 2017022318W WO 2018008365 A1 WO2018008365 A1 WO 2018008365A1
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WO
WIPO (PCT)
Prior art keywords
template
window member
processing chamber
light
heating
Prior art date
Application number
PCT/JP2017/022318
Other languages
English (en)
Japanese (ja)
Inventor
啓太 吉原
廣瀬　賢一
Original Assignee
ウシオ電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ウシオ電機株式会社 filed Critical ウシオ電機株式会社
Priority to JP2018525998A priority Critical patent/JP6888624B2/ja
Priority to CN201780041541.0A priority patent/CN109414849B/zh
Priority to KR1020187036577A priority patent/KR102162392B1/ko
Publication of WO2018008365A1 publication Critical patent/WO2018008365A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/70—Maintenance
    • B29C33/72—Cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • B08B7/0057—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by ultraviolet radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/002—Component parts, details or accessories; Auxiliary operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like

Definitions

  • the present invention relates to an optical cleaning apparatus for cleaning a surface of a template made of quartz glass used for nanoimprinting with ultraviolet rays.
  • optical nanoimprint technology has attracted attention as a method that can be manufactured at a lower cost than conventional pattern formation methods using photolithography and etching.
  • pattern formation method using this optical nanoimprint technology if a foreign substance such as a resist residue exists on the surface of the template made of quartz glass used, a defect is generated in the resulting pattern. is required.
  • an optical cleaning processing apparatus that decomposes and removes foreign matters adhering to the template surface by irradiating the template surface with ultraviolet rays (see Patent Document 1). ).
  • the above optical cleaning processing apparatus has a problem that it takes a considerably long time to sufficiently clean the surface of the template, and as a result, the productivity is reduced in the manufacture of semiconductor chips and the like.
  • an object of the present invention is to provide an optical cleaning processing apparatus capable of executing the cleaning processing of the surface of the template made of quartz glass in a short time.
  • the optical cleaning processing apparatus of the present invention is an optical cleaning processing apparatus for cleaning the surface of a template made of quartz glass used for nanoimprinting with ultraviolet rays, A processing chamber forming material for forming a processing chamber in which a template to be processed is arranged and a processing gas is supplied; A housing having a window member that transmits ultraviolet light, provided facing the template disposed in the processing chamber via a gap; An ultraviolet light source disposed in the housing for irradiating the template with ultraviolet light through the window member; And heating means for heating the template.
  • the heating means is disposed in the processing chamber.
  • the processing chamber forming material may include an infrared transmission window member provided to face the window member, and the heating unit may be disposed to face an outer surface of the infrared transmission window member.
  • the said heating means consists of a carbon heater or a halogen heater which irradiates infrared rays.
  • the heating means may be a heating element provided on the window member and generating heat by resistance heating.
  • the template can be heated by the heating means, so that foreign matters such as a resist residue adhering to the surface of the template are heated through the template. For this reason, the decomposition reaction of the foreign matter adhering to the template surface is promoted, and as a result, the cleaning process of the template surface can be executed in a short time.
  • FIG. 1 is an explanatory cross-sectional view showing a configuration of an optical cleaning processing apparatus according to the first embodiment of the present invention.
  • the optical cleaning processing apparatus shown in FIG. 1 is for optical cleaning processing of the surface of a template used for nanoimprinting.
  • the template to be processed is made of, for example, quartz glass.
  • This optical cleaning processing apparatus has a rectangular parallelepiped box-shaped processing chamber forming material 10 that forms a processing chamber 11 in which a template 1 to be processed is placed. Since ozone is generated in the processing chamber 11 during the optical cleaning process of the template 1, it is preferable to use a material having ultraviolet resistance and ozone resistance as the material forming the processing chamber forming material 10. .
  • the material constituting the processing chamber forming material 10 include stainless steel, aluminum subjected to hard alumite treatment, and the like.
  • An opening 12 is formed in the bottom wall portion of the processing chamber forming material 10, and a light source unit 20 is disposed so as to close the opening 12.
  • holding members (not shown) for holding the four corners of the template 1 are fixed to the inner surface of the bottom wall portion or the top wall portion of the processing chamber forming material 10.
  • the processing chamber forming material 10 is formed with a gas supply port (not shown) for supplying a processing gas to the processing chamber 11 and a gas discharge port (not shown) for discharging the gas in the processing chamber 11. Yes.
  • the light source unit 20 has a rectangular parallelepiped box-shaped housing 21.
  • a material having ultraviolet resistance and specific examples thereof include hard anodized aluminum.
  • an excimer lamp 25 is disposed as an ultraviolet light source.
  • a window member 22 that transmits ultraviolet rays from the excimer lamp 25 is fixed to the upper surface of the housing 21 by a frame-shaped fixing plate 23.
  • synthetic quartz glass can be used as a material constituting the window member 22, for example.
  • the casing 21 is provided with a purge gas supply pipe (not shown) for supplying a purge gas such as nitrogen gas in the casing 21.
  • the light source unit 20 is disposed such that the window member 22 faces the template 1 disposed in the processing chamber 11 with a gap therebetween.
  • the separation distance between the outer surface of the window member 22 and the pattern surface of the template 1 is, for example, 0.3 to 10.0 mm.
  • the excimer lamp 25 is arranged in the housing 21 so that the template 1 can be irradiated with ultraviolet rays via the window member 22.
  • 2 is a perspective view of the excimer lamp 25
  • FIG. 3 is a sectional view for explaining the excimer lamp 25 shown in FIG.
  • the excimer lamp 25 has a flat plate-like discharge vessel 26 in which a discharge space S is formed. Bases 29 are provided at both ends of the discharge vessel 26. Further, the excimer gas is hermetically sealed in the discharge space S of the discharge vessel 26.
  • a mesh-like high-voltage side electrode 27 is disposed on one surface of the discharge vessel 26, and a mesh-like ground-side electrode 28 is disposed on the other surface of the discharge vessel 26.
  • Each of the high voltage side electrode 27 and the ground side electrode 28 is electrically connected to a high frequency power source (not shown).
  • the excimer lamp 25 is disposed such that one surface of the discharge vessel 26 on which the high voltage side electrode 27 is disposed is opposed to the window member 22 in the housing 21.
  • a material that can transmit vacuum ultraviolet rays satisfactorily specifically, silica glass such as synthetic quartz glass, sapphire glass, or the like can be used.
  • silica glass such as synthetic quartz glass, sapphire glass, or the like
  • a metal material such as aluminum, nickel, gold or the like can be used.
  • the high voltage side electrode 27 and the ground side electrode 28 can also be formed by screen printing a conductive paste containing the above metal material, or by vacuum vapor deposition of the above metal material.
  • the excimer gas sealed in the discharge space S of the discharge vessel 26 can generate an excimer that emits vacuum ultraviolet rays, specifically, a rare gas such as xenon, argon, krypton, or a rare gas , Bromine, chlorine, iodine, a mixed gas mixed with a halogen gas such as fluorine, and the like can be used. Among these, xenon is preferable.
  • a specific example of the excimer gas is shown together with the wavelength of emitted ultraviolet light, it is 172 nm for xenon gas, 191 nm for a mixed gas of argon and iodine, and 193 nm for a mixed gas of argon and fluorine.
  • the sealing pressure of the excimer gas is, for example, 10 to 100 kPa.
  • an infrared transmission window member 13 that transmits infrared rays is provided on the upper wall portion of the processing chamber forming material 10.
  • a lamp heater 30 for irradiating the template 1 with infrared rays through the infrared transmission window member 13 is disposed outside the processing chamber forming material 10 as a heating unit for heating the template 1 so as to face the infrared transmission window member 13.
  • a material constituting the infrared transmitting window member 13 it is preferable to use a material that has heat resistance and does not transmit vacuum ultraviolet rays.
  • the infrared transmissive window member 13 transmits vacuum ultraviolet rays
  • ozone is generated outside the processing chamber forming material 10 by the vacuum ultraviolet rays from the excimer lamp 25 passing through the infrared transmissive window member 13.
  • the material constituting the infrared transmission window member 13 include heat-resistant glass such as Pyrex (registered trademark) glass and Tempax glass (registered trademark), fused silica glass, germanium, and silicon.
  • the window member 13 may transmit vacuum ultraviolet rays.
  • a material that transmits vacuum ultraviolet rays for example, sapphire, calcium fluoride, barium fluoride, or the like can be used.
  • the lamp heater 30 for example, a lamp that emits infrared rays having a wavelength of 0.8 to 1000 ⁇ m can be used.
  • Specific examples of the lamp heater 30 include a halogen heater and a carbon heater. Among these, a halogen heater is preferable.
  • the halogen heater a single-end type with a reflecting mirror, a double-end type, or the like can be used.
  • the lamp heater 30 may be provided with a reflection mirror for condensing infrared rays on the template 1.
  • the infrared rays radiated from the lamp heater 30 such as a halogen heater
  • specific examples of the material of the infrared transmitting window member 13 include heat-resistant glass such as Pyrex (registered trademark) glass and Tempax glass (registered trademark), fused quartz. Glass is mentioned.
  • the template 1 When the template 1 is irradiated with infrared rays from the near infrared region to the mid infrared region, sapphire is given as a specific example of the material of the infrared transmitting window member 13.
  • specific examples of the material of the infrared transmission window member 13 include germanium, silicon, calcium fluoride, and barium fluoride.
  • the infrared transmitting window member 13 is a member that transmits far infrared rays or a member that absorbs far infrared rays depending on whether the template 1 itself is heated.
  • the template 1 to be processed is held by a holding member (not shown) provided in the processing chamber forming material 10.
  • the lamp heater 30 is turned on, and a processing gas is supplied to the processing chamber 11 from a gas supply port (not shown) formed in the processing chamber forming material 10.
  • the infrared rays from the lamp heater 30 are irradiated to foreign matters such as resist residues attached to the surface of the template 1 through the infrared transmitting window member 13 and the template 1, thereby heating the foreign matters.
  • the processing chamber 11 is replaced with a processing gas.
  • the infrared transmission window member 13 when a material that absorbs far-infrared rays is selected as the material of the infrared transmission window member 13, near infrared rays having a wavelength of 0.8 to 2 ⁇ m out of infrared rays emitted from the lamp heater 30 are infrared transmission windows. As a result of passing through each of the member 13 and the template 1 and irradiating and absorbing the foreign matter adhering to the surface of the template 1, the foreign matter is heated. On the other hand, far infrared rays having a wavelength of 4 to 1000 ⁇ m are absorbed by the infrared transmitting window member 13.
  • the far infrared rays are irradiated and absorbed on the template 1 and the foreign matter attached to the surface of the template 1, so that the template together with the foreign matter is absorbed. 1 itself can be heated.
  • the processing gas a gas containing oxygen such as clean dry air, nitrogen gas, or a mixed gas of clean dry air and nitrogen gas can be used.
  • the flow rate of the processing gas supplied to the processing chamber 11 is, for example, 0 to 100 L / min.
  • the preheating time from when the lamp heater 30 is turned on to when the light cleaning process is started (when the excimer lamp 25 is turned on) is, for example, 5 to 60 seconds.
  • the temperature of the foreign matter adhering to the surface of the template 1 is, for example, 50 to 200 ° C.
  • the processing time of the light cleaning processing that is, the ultraviolet irradiation time is, for example, 3 to 600 seconds.
  • the template 1 can be heated by the lamp heater 30, so that foreign matters such as a resist residue attached to the surface of the template 1 are heated through the template 1. Therefore, the decomposition reaction of the foreign matter adhering to the surface of the template 1 is promoted, and as a result, the cleaning process of the surface of the template 1 can be executed in a short time.
  • FIG. 4 is an explanatory cross-sectional view showing a configuration of an optical cleaning treatment apparatus according to the second embodiment of the present invention.
  • the optical cleaning processing apparatus shown in FIG. 4 is for performing optical cleaning processing on the surface of a template used for nanoimprinting.
  • the lamp heater 30 is disposed behind the excimer lamp 25 in the housing 21 of the light source unit 20.
  • the window member 22 is made of a material that transmits infrared rays.
  • the high voltage side electrode 27 and the ground side electrode 28 in the excimer lamp 25 are each net-like (see FIGS. 2 and 3), and therefore, the high voltage side electrode 27 and the ground side electrode 28 in the discharge vessel 26 are formed.
  • the part where there is no light becomes the infrared ray transmitting part that transmits the infrared ray from the lamp heater 30.
  • Other configurations of the light cleaning processing apparatus according to the second embodiment are the same as those of the light cleaning processing apparatus according to the first embodiment except that the processing chamber forming material 11 is not provided with an infrared transmission window member. It is the same.
  • the lamp heater 30 is turned on while the template 1 is held by a holding member (not shown) provided in the processing chamber forming material 10, and the processing chamber forming material 10 is also turned on.
  • a processing gas is supplied to the processing chamber 11 from a gas supply port (not shown) formed in the processing chamber.
  • infrared rays from the lamp heater 30 are irradiated to foreign matters such as resist resist residue attached to the surface of the template 1 through the discharge vessel 26 and the window member 22 of the excimer lamp 25, so that the foreign matters are Heated.
  • the processing chamber 11 is replaced with a processing gas.
  • near infrared rays are infrared ray transmitting portions in the excimer lamp 25, that is, portions where the high voltage side electrode 27 and the ground side electrode 28 are not formed in the discharge vessel 26, and windows.
  • the foreign matter is heated.
  • far infrared rays are absorbed by the discharge vessel 26 or the window member 22.
  • the optical cleaning process of the template 1 is achieved similarly to the optical cleaning processing apparatus which concerns on 1st Embodiment, and the template 1 is taken out from the process chamber 11.
  • FIG. In the above, the preheating time by the lamp heater 30 and other light cleaning processing conditions are the same as those of the light cleaning processing apparatus according to the first embodiment.
  • the template 1 can be heated by the lamp heater 30, so that foreign matters such as a resist residue attached to the surface of the template 1 are heated through the template 1. Therefore, the decomposition reaction of the foreign matter adhering to the surface of the template 1 is promoted, and as a result, the cleaning process of the surface of the template 1 can be executed in a short time.
  • FIG. 5 is an explanatory cross-sectional view showing a configuration of an optical cleaning processing apparatus according to the third embodiment of the present invention.
  • the optical cleaning processing apparatus shown in FIG. 5 is for performing optical cleaning processing on the surface of a template used for nanoimprinting.
  • a heating element 35 made of a strip-like film that generates heat by resistance heating is provided as a heating means on the inner surface of the window member 22 in the light source unit 20.
  • Such a heating element 35 can be formed by printing and baking a conductive paste on the window member 22.
  • the amount of heat generated by the heating element 35 is, for example, 0.5 to 10 kW.
  • Other configurations of the light cleaning processing apparatus according to the third embodiment are the same as those of the light cleaning processing apparatus according to the second embodiment except that the lamp heater 30 is not provided.
  • the heating element 35 is energized while the template 1 is held by a holding member (not shown) provided in the processing chamber forming material 10, and the processing chamber forming material 10 is energized.
  • a processing gas is supplied to the processing chamber 11 from a gas supply port (not shown) formed in the processing chamber.
  • the heating element 35 generates heat due to resistance heating, and the radiant heat heats foreign matters such as a resist residue attached to the surface of the template 1.
  • the processing chamber 11 is replaced with a processing gas.
  • the optical cleaning process of the template 1 is achieved similarly to the optical cleaning processing apparatus which concerns on 1st Embodiment, and the template 1 is taken out from the process chamber 11.
  • the preheating time from when the heating element 35 is energized until the start of the light cleaning process (lighting of the excimer lamp 25) is, for example, 5 to 60 seconds.
  • Other optical cleaning processing conditions are the same as those of the optical cleaning processing apparatus according to the first embodiment.
  • the template 1 can be heated by the heating element 35, so that foreign matters such as a resist residue adhering to the surface of the template 1 are heated through the template 1. Therefore, the decomposition reaction of the foreign matter adhering to the surface of the template 1 is promoted, and as a result, the cleaning process of the surface of the template 1 can be executed in a short time.
  • FIG. 6 is a cross-sectional view illustrating the structure of an optical cleaning processing apparatus according to the fourth embodiment of the present invention.
  • the optical cleaning processing apparatus shown in FIG. 6 is for performing optical cleaning processing on the surface of a template used for nanoimprinting.
  • a lamp heater 30 that irradiates the template 1 with infrared rays is opposed to the back surface of the template 1 as a heating means for heating the template 1 in the processing chamber 11.
  • Other configurations of the light cleaning processing apparatus according to the fourth embodiment are the same as those according to the second embodiment except that the lamp heater 30 is not provided behind the excimer lamp 25 in the housing 21. This is the same as the cleaning processing apparatus.
  • a carbon heater is preferably used as the lamp heater 30 .
  • the carbon heater is formed by arranging a heating element made of carbon fiber in a quartz tube filled with an inert gas.
  • the infrared rays emitted from the carbon heater have a peak in the mid-infrared region having a wavelength of 2.0 to 4.0 ⁇ m, for example. Since this mid-infrared light is absorbed by the quartz glass constituting the template 1, the template 1 can be efficiently heated.
  • the lamp heater 30 is turned on while the template 1 is held by a holding member (not shown) provided in the processing chamber forming material 10, and the processing chamber forming material 10 is also turned on.
  • a processing gas is supplied to the processing chamber 11 from a gas supply port (not shown) formed in the processing chamber.
  • the infrared rays from the lamp heater 30 are irradiated to foreign matters such as resist residues attached to the surface of the template 1 to heat the foreign matters.
  • the processing chamber 11 is replaced with a processing gas.
  • the near infrared rays pass through the template 1 and are irradiated and absorbed by the foreign matter attached to the surface of the template 1.
  • the foreign matter is heated.
  • the mid-infrared ray and the far-infrared ray are absorbed by the template 1, so that the template 1 is heated and transferred to the foreign matter.
  • the optical cleaning process of the template 1 is achieved similarly to the optical cleaning processing apparatus which concerns on 1st Embodiment, and the template 1 is taken out from the process chamber 11.
  • FIG. In the above, the preheating time by the lamp heater 30 and other light cleaning processing conditions are the same as those of the light cleaning processing apparatus according to the first embodiment.
  • the template 1 can be heated by the lamp heater 30, so that foreign matters such as a resist residue attached to the surface of the template 1 are heated through the template 1. Therefore, the decomposition reaction of the foreign matter adhering to the surface of the template 1 is promoted, and as a result, the cleaning process of the surface of the template 1 can be executed in a short time.
  • a heating means that heats the processing gas supplied to the processing chamber can be used.
  • the lamp heater 30 is turned on while being held by a holding member (not shown) provided in the processing chamber forming material 10, and the processing chamber forming material is also turned on.
  • the heated processing gas is supplied to the processing chamber 11 from a gas supply port (not shown) formed in 10
  • the processing chamber 11 is replaced with the heated processing gas.
  • the optical cleaning process of the template 1 is achieved similarly to the optical cleaning processing apparatus which concerns on 1st Embodiment, and the template 1 is taken out from the process chamber 11.
  • the temperature of the heated processing gas is, for example, 50 to 200 ° C.
  • the processing gas since the processing gas is heated by the heating means, the processing gas heats foreign matters such as resist residues attached to the surface of the template 1 and promotes the decomposition reaction of the foreign matters. As a result, the surface of the template 1 can be cleaned in a short time.
  • the heating element 35 may be provided on the outer surface of the window member 22 (the surface facing the template 1). However, in such a configuration, the heating element 22 is exposed to the processing chamber 11, and dust due to the material constituting the heating element 35 may be mixed in the processing chamber 11. Is preferably provided on the inner surface of the window member 22.
  • Example 1 An ultraviolet treatment apparatus was produced according to the configuration shown in FIG. The specifications of this ultraviolet treatment apparatus are as follows. This is referred to as an ultraviolet treatment device [1].
  • ⁇ Heater lamp Carbon heater
  • Power of carbon heater 3kW
  • Size of carbon heater 100mm x 200mm -Diameter of carbon heater: 5mm
  • Distance from the bottom surface of the carbon heater to the top surface of the template 50mm
  • Example 2 An ultraviolet treatment apparatus was produced according to the configuration shown in FIG. The specifications of this ultraviolet treatment apparatus are as follows. This is referred to as an ultraviolet treatment device [2].
  • ⁇ Infrared transmitting window member Tempax Glass (registered trademark)
  • Size of infrared transmission window member ⁇ 50mm
  • Thickness of infrared transmitting window member 2mm
  • Distance from the lower surface of the infrared transmitting window member to the upper surface of the window member 80 mm
  • Lamp heater Halogen heater ⁇ Halogen heater power: 500W
  • the light washing process was performed.
  • ⁇ Processing gas type CDA
  • Process gas supply rate 1 L / min
  • Process gas purge time 60 seconds
  • the speed for removing the resist was 2 nm / s. Note that, with the power under the conditions of this example, the heating time by the halogen heater takes about 600 seconds, but the speed of removing the resist was equivalent to that of the ultraviolet processing apparatus of Example 1.
  • a resist coated with a specific thickness similar to that of the example was applied under the following optical cleaning treatment conditions (processing gas supply conditions, ultraviolet irradiation conditions and heating conditions).
  • the processed product (template) was subjected to a light cleaning treatment.
  • Processing gas type CDA
  • Process gas supply rate 1 L / min
  • Process gas purge time 60 seconds
  • UV light illuminance at window member 70 mW / cm 2
  • UV irradiation time 100 seconds
  • the resist removal speed was 0.7 nm / s.
  • the heating means including the carbon heater or the halogen heater is provided. It was confirmed that the removal speed can be greatly increased, and therefore the template cleaning process time can be shortened.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Optics & Photonics (AREA)
  • Cleaning In General (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning By Liquid Or Steam (AREA)

Abstract

Dispositif de traitement de lavage à la lumière pouvant effectuer un traitement de lavage sur une surface d'un gabarit composé de verre de quartz en une courte période de temps. Un dispositif de traitement de lavage à la lumière selon la présente invention est un dispositif de traitement de lavage à la lumière qui effectue un traitement de lavage sur une surface d'un gabarit composé de verre de quartz utilisé en nano-impression avec des rayons ultraviolets, le dispositif de traitement de lavage à la lumière étant caractérisé en ce qu'il comprend : un matériau de formation de chambre de traitement qui forme une chambre de traitement dans laquelle le gabarit à traiter est agencé et dans laquelle est apporté du gaz de traitement ; un boîtier disposé en regard du gabarit agencé dans la chambre de traitement avec un espace formé entre eux et ayant un élément de fenêtre permettant aux rayons ultraviolets de passer à travers celui-ci ; une source de lumière à rayons ultraviolets disposée dans le boîtier et irradiant le gabarit avec les rayons ultraviolets par l'intermédiaire de l'élément de fenêtre ; et un moyen de chauffage pour chauffer le gabarit.
PCT/JP2017/022318 2016-07-08 2017-06-16 Dispositif de traitement à la lumière WO2018008365A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2018525998A JP6888624B2 (ja) 2016-07-08 2017-06-16 光洗浄処理装置
CN201780041541.0A CN109414849B (zh) 2016-07-08 2017-06-16 光清洗处理装置
KR1020187036577A KR102162392B1 (ko) 2016-07-08 2017-06-16 광 세정 처리 장치

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-135648 2016-07-08
JP2016135648 2016-07-08

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WO2018008365A1 true WO2018008365A1 (fr) 2018-01-11

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JP (1) JP6888624B2 (fr)
KR (1) KR102162392B1 (fr)
CN (1) CN109414849B (fr)
TW (1) TWI712480B (fr)
WO (1) WO2018008365A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6949191B1 (ja) * 2020-12-18 2021-10-13 ホッティーポリマー株式会社 ３ｄプリンタ

Citations (3)

* Cited by examiner, † Cited by third party
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