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WO2017002997A1 - Ensemble microphone - Google Patents

Ensemble microphone Download PDF

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Publication number
WO2017002997A1
WO2017002997A1 PCT/KR2015/006906 KR2015006906W WO2017002997A1 WO 2017002997 A1 WO2017002997 A1 WO 2017002997A1 KR 2015006906 W KR2015006906 W KR 2015006906W WO 2017002997 A1 WO2017002997 A1 WO 2017002997A1
Authority
WO
WIPO (PCT)
Prior art keywords
base substrate
coupling member
microphone package
transducer
present
Prior art date
Application number
PCT/KR2015/006906
Other languages
English (en)
Korean (ko)
Inventor
김재명
박두영
Original Assignee
(주)파트론
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주)파트론 filed Critical (주)파트론
Publication of WO2017002997A1 publication Critical patent/WO2017002997A1/fr

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones

Definitions

  • the present invention relates to a microphone package, and more particularly to a microphone package for converting an acoustic signal into an electrical signal.
  • the microphone package is installed in various electronic devices such as smartphones and tablet computers. In recent years, such electronic devices have become smaller and thinner. Accordingly, various components mounted thereon, including microphones, also tend to be miniaturized.
  • the microphone package has a structure in which a housing has an inner space and a transducer for converting an acoustic signal into an electrical signal is received in the inner space.
  • the acoustic signal is introduced into the interior space of the housing through the acoustic hole of the housing.
  • the introduced acoustic signal vibrates the diaphragm of the transducer, and the transducer detects the vibration to generate an electrical signal.
  • the back-chamber space means a space in which the acoustic signal flows in the transducer and a space in the opposite direction divided by the diaphragm.
  • Some conventional microphone packages employ a structure in which the transducer covers the acoustic hole in order to maximize the back-chamber space.
  • United States Patent No. 8,358,004 (registered Jan. 22, 2013) discloses a microphone package of this structure.
  • the problem to be solved by the present invention is to provide a microphone package that can improve the acoustic characteristics of the microphone.
  • Another object of the present invention is to provide a microphone package having a configuration that can facilitate mounting the microphone in an electronic device.
  • Another object of the present invention is to provide a microphone package capable of maximally suppressing damage to a transducer in mounting a microphone in an electronic device.
  • the microphone package of the present invention for solving the above problems, a base substrate with a sound hole, a transducer positioned to cover at least a portion of the sound hole on the upper surface of the base substrate, in combination with the base substrate to accommodate the transducer And a coupling member coupled to an edge portion of a lower surface of the base substrate and a cover forming an inner space.
  • the coupling member may form a closed curve on the lower surface of the base substrate.
  • At least one input and output terminal may be formed in the closed curve of the lower surface of the base substrate.
  • the coupling member may be formed of a solder (solder).
  • the sound hole may be formed of a plurality of fine holes.
  • the micro holes may have a diameter of 25 ⁇ m to 100 ⁇ m.
  • the portion in which the micro holes of the base substrate are formed may be formed to be thinner than other portions of the periphery.
  • it may further include a mounting substrate coupled to the base substrate by the coupling member, the inlet hole is formed in a position facing the sound hole.
  • the base substrate and the mounting substrate may be sealed by the coupling member.
  • the coupling member may transfer an electrical signal or power between the base substrate and the mounting substrate.
  • the coupling member may be electrically connected to a ground terminal formed on the mounting substrate.
  • the inlet hole may be formed of a plurality of fine holes.
  • the microphone package according to the embodiment of the present invention may improve the acoustic characteristics of the microphone.
  • the microphone package according to an embodiment of the present invention may facilitate mounting the microphone in the electronic device.
  • the microphone package according to an embodiment of the present invention can suppress damage of the transducer as much as possible in mounting the microphone in the electronic device.
  • FIG. 1 is a cross-sectional view of a microphone package according to an embodiment of the present invention.
  • FIG. 2 is a bottom view illustrating a bottom surface of a base substrate in a state in which a coupling member of a microphone package according to an exemplary embodiment of the present invention is coupled.
  • FIG 3 is a cross-sectional view of a microphone package according to another embodiment of the present invention.
  • FIG. 4 is a cross-sectional view of a microphone package according to another embodiment of the present invention.
  • FIGS. 1 and 2 a microphone package according to an exemplary embodiment of the present invention will be described with reference to FIGS. 1 and 2.
  • FIG. 1 is a cross-sectional view of a microphone package according to an embodiment of the present invention.
  • the microphone package of the present invention includes a base substrate 100, a transducer 200, and a cover 300.
  • the base substrate 100 is formed in a flat plate shape.
  • the base substrate 100 may be formed to have a rectangular upper and lower surface shape.
  • Terminals 101 and 102 may be formed on the top and bottom surfaces of the base substrate 100, respectively.
  • the terminal 101 on the upper surface of the base substrate 100 is connected to the transducer 200 and / or the ASIC 250 mounted on the upper surface of the base substrate 100 to transmit an electrical signal or supply power.
  • the terminal 102 on the bottom surface of the base substrate 100 may be an input / output terminal connected to the mounting substrate 400 to transmit an electrical signal or supply power.
  • the terminal 101 on the upper surface of the base substrate 100 and the terminal 102 on the lower surface may be electrically connected to each other by a via hole (not shown) passing through the base substrate 100.
  • the base substrate 100 may be formed of a printed circuit board (PCB).
  • PCB printed circuit board
  • An acoustic hole 110 is formed in the base substrate 100.
  • the sound hole 110 is formed to penetrate the upper and lower surfaces of the base substrate 100. External sound signals may be introduced into the microphone package through the sound holes 110.
  • the transducer 200 is a device that receives an acoustic signal and converts it into an electrical signal.
  • the transducer 200 may be an electret transducer, a MEMS transducer, or a piezoelectric transducer, but is not limited thereto.
  • the transducer 200 is mounted on the terminal 101 of the upper surface of the base substrate 100 and electrically connected thereto.
  • the transducer 200 is formed around the sound hole 110 of the base substrate 100.
  • the transducer 200 is positioned above the sound hole 110 of the base substrate 100 to cover at least a part of the sound hole 110.
  • the upper terminal 101 of the base substrate 100 connected to the lower terminal of the transducer 200 may be formed around the acoustic hole 110.
  • the transducer 200 may completely cover the sound hole 110.
  • the inner space S surrounded by the base substrate 100 and the cover 300 may be formed as a space separated from the outside of the sound hole 110 as the transducer 200 completely covers the sound hole 110. have.
  • the divided space S is divided by the external space and the transducer 200 therebetween.
  • the space S thus divided may be referred to as a back chamber.
  • transducer 200 In addition to the transducer 200, other elements such as the ASIC 250 and 250 may be mounted in the internal space S.
  • the cover 300 is combined with the base substrate 100 to form an internal space S.
  • the cover 300 may include an upper surface portion and a side portion.
  • the upper surface portion is disposed to face the upper surface of the base substrate 100 while being spaced apart, and the side portion extends downward from the outer side of the upper surface portion to connect the upper surface portion and the base substrate 100.
  • the lower end of the side portion may be formed in the flange portion to be in contact with the base substrate 100.
  • the upper surface portion and the side portion may be integrally formed, or in some cases, may be formed separately and then combined.
  • the cover 300 may be formed of a metal material.
  • the cover 300 may be formed of, for example, a material of one or two or more selected from brass, bronze, or phosphor bronze.
  • the microphone package including the base substrate 100, the transducer 200, and the cover 300 is mounted on the mounting substrate 400.
  • the mounting substrate 400 is coupled to the base substrate 100 and the bottom surface.
  • the mounting substrate 400 may be a substrate of an electronic device on which a microphone package is mounted.
  • the mounting substrate 400 may typically be formed in a larger size than the base substrate 100.
  • the mounting substrate 400 is formed in a flat plate like the base substrate 100.
  • An inflow hole 410 is formed in the mounting substrate 400.
  • the inflow hole 410 is formed at a position facing the sound hole 110 when the microphone package is mounted on the mounting substrate 400.
  • the inflow hole 410 is preferably formed to have the same or similar shape and size as the sound hole 110. As such, when the sound hole 110 and the inflow hole 410 are coupled to face each other, the sound signal passes through the inflow hole 410 and the sound hole 110 from the lower side of the mounting substrate 400 and flows into the internal space.
  • the base substrate 100 and the mounting substrate 400 are coupled by the coupling member 500.
  • the coupling member 500 is positioned between the bottom surface of the base substrate 100 and the top surface of the mounting substrate 400 to couple the two.
  • the coupling member 500 is coupled to the bottom surface of the base substrate 100.
  • 2 is a bottom view illustrating the bottom surface of the base substrate 100 in a state in which the coupling member 500 of the microphone package according to the embodiment of the present invention is coupled.
  • the coupling member 500 is coupled to an edge portion of a lower surface of the base substrate 100.
  • the coupling member 500 and the sound hole 110 may be spaced apart by a predetermined distance.
  • a gap G corresponding to the thickness of the coupling member 500 may be formed between the sound hole 110 of the base substrate 100 and the inflow hole 410 of the mounting substrate 400.
  • the coupling member 500 forms a closed curve on the bottom surface of the base substrate 100 to form a closed area surrounded by the coupling member 500.
  • the input / output terminal 102 is located in the closed space. Therefore, after the microphone package is mounted on the mounting substrate 400, the input / output terminal 102 may be suppressed to be damaged due to infiltration of foreign matter or the like.
  • the coupling member 500 couples the bottom surface of the base substrate 100 and the top surface of the mounting substrate 400 to be sealed.
  • a gap between the bottom surface of the base substrate 100 and the top surface of the mounting substrate 400 is sealed by the coupling member 500 to prevent air from being introduced.
  • the space between the lower surface of the base substrate 100 and the upper surface of the mounting substrate 400 communicates with other portions only by the inflow hole 410 and the sound hole 110, and the remaining portions are all formed as sealed spaces.
  • the acoustic signal introduced through the inlet hole 410 under the mounting substrate 400 may pass through the sealed space before proceeding to the acoustic hole 110 of the base substrate 100.
  • the frequency characteristics of the acoustic signal may be changed by changing the shape and volume of the sealed space. Accordingly, the characteristics of the acoustic signal received by the transducer 200 may be changed. By controlling such changes, the reception sensitivity and acoustic characteristics of the microphone can be adjusted.
  • the coupling member 500 may be formed of solder.
  • the coupling member 500 may be formed as the microphone package is mounted on the mounting substrate 400 using a surface mount technology (SMT).
  • SMT surface mount technology
  • the coupling member 500 may be melted in the process of being formed, and flux may be generated.
  • the coupling member 500 may damage the periphery.
  • the lower surface of the base substrate 100 around the coupling member 500 and the upper surface of the mounting substrate 400 are less likely to be damaged by heat.
  • the transducer 200 may be damaged by such heat.
  • flux generated while forming the coupling member 500 may be introduced through the sound hole 110 to damage the transducer 200.
  • the coupling member 500 is formed at the edge of the lower surface of the base substrate 100 so as to be spaced apart from the acoustic hole 110 as much as possible. Accordingly, damage to the transducer 200 due to flux or the like can be suppressed.
  • Coupling member 500 may be formed of a metal such as tin, copper, aluminum, as well as lead. In some cases, the coupling member 500 may be formed of a curable resin material.
  • the coupling member 500 may electrically connect the bottom surface of the base substrate 100 to the top surface of the mounting substrate 400 in some cases.
  • electrodes 510 and 520 may be formed on the lower surface portion of the base substrate 100 to which the coupling member 500 is coupled and the upper surface portion of the mounting substrate 400, respectively.
  • the coupling member 500 may be formed of a conductive material to be coupled to the respective electrodes 510 and 520 to electrically connect the respective electrodes 510 and 520.
  • the coupling member 500 may transmit an electrical signal or power between the base substrate 100 and the mounting substrate 400.
  • the coupling member 500 may be electrically connected to the ground terminal formed on the mounting substrate 400 to be connected to the base substrate 100.
  • FIG 3 is a cross-sectional view of a microphone package according to another embodiment of the present invention.
  • the acoustic hole 110 of the base substrate 100 is formed of a plurality of micro holes 111.
  • the micro holes 111 may be formed to be densely formed at one portion of the base substrate 100.
  • the microholes 111 may have a diameter of 25 ⁇ m to 100 ⁇ m.
  • a portion of the base substrate 100 formed by dense micro holes 111 may be formed as a thin portion 120 that is thinner than other portions of the base substrate 100.
  • a step may be formed at the boundary portion between the thin portion 120 and other portions of the periphery. The step may be formed on at least one of the upper and lower surfaces of the base substrate 100.
  • the micro holes 111 may be formed by laser drilling or punching, and when the micro holes 111 are formed in the thin part 120, it may be relatively easy to form the micro holes 111.
  • the frequency characteristic of the sound signal passing through the sound hole 110 may be changed by the fine hole 111.
  • the frequency characteristics of the acoustic signal may be changed by the diameter, shape, or number of the fine holes 111. Therefore, the designer can tune the acoustic characteristics of the microphone by adjusting the characteristics of the microholes 111.
  • the inside of the microphone may be protected by the microholes 111.
  • the acoustic hole 110 in which the plurality of micro holes 111 is formed may have a lower probability of infiltrating foreign matter, dust, moisture, etc. from the outside than the structure in which one relatively large opening is formed. This protects the internal space of the microphone package.
  • FIG. 4 is a cross-sectional view of a microphone package according to another embodiment of the present invention.
  • the inflow hole 410 of the mounting substrate 400 is formed of a plurality of micro holes 411.
  • the micro holes 411 may be formed to be densely formed in one portion of the mounting substrate 400.
  • the microholes may have a diameter of 25 ⁇ m to 100 ⁇ m.
  • a portion of the mounting substrate 400 formed by dense micro holes 411 may be formed as a thin portion 420 having a thickness thinner than other portions of the surrounding substrate.
  • a step may be formed at a boundary portion between the thin portion 420 and another portion around the periphery. The step may be formed on at least one of an upper surface and a lower surface of the mounting substrate 400.
  • the micro holes 411 may be formed by laser drilling or punching, and when the micro holes 411 are formed in the thin part 120, it may be relatively easy to form the micro holes 411.
  • the frequency characteristics of the sound signal passing through the sound hole 110 may be changed by the micro holes 411.
  • the frequency characteristics of the acoustic signal may be changed by the diameter, shape, or number of the fine holes 411. Therefore, the designer may tune the acoustic characteristics of the microphone by adjusting the characteristics of the microhole 411.
  • the inside of the microphone may be protected by the microhole 411.
  • the inflow hole 410 in which the plurality of micro holes 411 are formed may be less likely to penetrate foreign materials, dust, and moisture from the outside than the structure in which one relatively large opening is formed. This protects the internal space of the microphone package.

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)

Abstract

La présente invention concerne un ensemble microphone. L'ensemble microphone selon la présente invention comprend : un substrat de base ayant un orifice acoustique ; un transducteur positionné de sorte à couvrir au moins une partie de l'orifice acoustique sur la surface supérieure du substrat de base ; un couvercle accouplé au substrat de base de sorte à former un espace interne dans lequel le transducteur est logé ; et un élément d'accouplement accouplé à une partie de bord de la surface inférieure du substrat de base.
PCT/KR2015/006906 2015-07-02 2015-07-06 Ensemble microphone WO2017002997A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2015-0094761 2015-07-02
KR1020150094761A KR101681903B1 (ko) 2015-07-02 2015-07-02 마이크로폰 패키지

Publications (1)

Publication Number Publication Date
WO2017002997A1 true WO2017002997A1 (fr) 2017-01-05

Family

ID=57571663

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2015/006906 WO2017002997A1 (fr) 2015-07-02 2015-07-06 Ensemble microphone

Country Status (2)

Country Link
KR (1) KR101681903B1 (fr)
WO (1) WO2017002997A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090080682A1 (en) * 2004-03-09 2009-03-26 Panasonic Corporation Electret condenser microphone
US20120250925A1 (en) * 2011-04-04 2012-10-04 Analog Devices, Inc. Packages and methods for packaging microphone devices
US20120250897A1 (en) * 2011-04-02 2012-10-04 Mwm Acoustics, Llc Dual Cell MEMS Assembly
US20140299949A1 (en) * 2009-05-11 2014-10-09 Stmicroelectronics S.R.I. Assembly of a capacitive acoustic transducer of the microelectromechanical type and package thereof
US20150003659A1 (en) * 2013-06-26 2015-01-01 Infineon Technologies Ag Electronic device with large back volume for electromechanical transducer

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007060285A (ja) * 2005-08-24 2007-03-08 Matsushita Electric Works Ltd シリコンマイクロホンパッケージ
WO2012088688A1 (fr) * 2010-12-30 2012-07-05 Goertek Inc. Microphone mems et procédé associé de mise sous boîtier

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090080682A1 (en) * 2004-03-09 2009-03-26 Panasonic Corporation Electret condenser microphone
US20140299949A1 (en) * 2009-05-11 2014-10-09 Stmicroelectronics S.R.I. Assembly of a capacitive acoustic transducer of the microelectromechanical type and package thereof
US20120250897A1 (en) * 2011-04-02 2012-10-04 Mwm Acoustics, Llc Dual Cell MEMS Assembly
US20120250925A1 (en) * 2011-04-04 2012-10-04 Analog Devices, Inc. Packages and methods for packaging microphone devices
US20150003659A1 (en) * 2013-06-26 2015-01-01 Infineon Technologies Ag Electronic device with large back volume for electromechanical transducer

Also Published As

Publication number Publication date
KR101681903B1 (ko) 2016-12-02

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