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WO2012005434A2 - Microphone - Google Patents

Microphone Download PDF

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Publication number
WO2012005434A2
WO2012005434A2 PCT/KR2011/002566 KR2011002566W WO2012005434A2 WO 2012005434 A2 WO2012005434 A2 WO 2012005434A2 KR 2011002566 W KR2011002566 W KR 2011002566W WO 2012005434 A2 WO2012005434 A2 WO 2012005434A2
Authority
WO
WIPO (PCT)
Prior art keywords
printed circuit
circuit board
microphone
case
sound hole
Prior art date
Application number
PCT/KR2011/002566
Other languages
English (en)
Korean (ko)
Other versions
WO2012005434A3 (fr
Inventor
이상호
심용현
허형용
Original Assignee
주식회사 비에스이
톈진 비에스이 일렉트로닉스 컴퍼니 리미티드
동관 바오싱 일렉트로닉스 컴퍼니 리미티드
롱쳉 바오싱 일렉트로닉 컴퍼니 리미티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 비에스이, 톈진 비에스이 일렉트로닉스 컴퍼니 리미티드, 동관 바오싱 일렉트로닉스 컴퍼니 리미티드, 롱쳉 바오싱 일렉트로닉 컴퍼니 리미티드 filed Critical 주식회사 비에스이
Publication of WO2012005434A2 publication Critical patent/WO2012005434A2/fr
Publication of WO2012005434A3 publication Critical patent/WO2012005434A3/fr

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09072—Hole or recess under component or special relationship between hole and component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10083—Electromechanical or electro-acoustic component, e.g. microphone

Definitions

  • the present invention relates to a microphone, and more particularly, to a microphone having two printed circuit boards and a spacer supporting member between two printed circuit boards, so that the structure can be simplified while improving acoustic characteristics.
  • a condenser microphone widely used in a mobile communication terminal or an audio device includes a voltage bias element, a diaphragm / back plate pair forming a capacitor C that changes in response to sound pressure, and an electric field for buffering an output signal.
  • Effect transistor JFET
  • the diaphragm, spacer ring, insulation ring, back plate, and conduction ring are sequentially inserted in one case, and finally, a printed circuit board having circuit components mounted thereon, and the end of the case is printed circuit. It was bent to the substrate side to complete one assembly.
  • MEMS Micro Electro Mechanical System
  • MEMS chip microphone fabricated using this micromachining technology is stable by miniaturization, high performance, multifunctionalization, integration of conventional diaphragm and traditional microphone parts such as spacer ring, insulation ring, back plate, energizing ring through ultra-precision micro machining. And there is an advantage that can improve the reliability.
  • the silicon condenser microphone 100 includes a printed circuit board 110, an amplifier 130 mounted on the printed circuit board 110, an amplifier 130, also called a special purpose semiconductor (ASIC) chip, and a sound hole 140.
  • the case 150 is formed.
  • the MEMS chip 120 has a structure in which a back plate 121 is formed on a silicon wafer by using MEMS technology, and then a vibrating membrane 123 is formed with a spacer 122 interposed therebetween. A sound hole 124 is formed in the back plate 121.
  • a sound hole 140 is provided in an upper part of a case, and a MEMS chip 120 is mounted on a lower single printed circuit board.
  • the lower side of the printed circuit board is provided with a connection terminal for electrical coupling with an external device.
  • the internal space of the MEMS chip indicated by reference numeral 126 is a back chmber space.
  • the back chamber space refers to a space opposite to the side on which the external sound is introduced based on the vibration membrane.
  • the MEMS chip 120 when the MEMS chip 120 is mounted on the substrate 110 as in the microphone 100 illustrated in FIG. 1, the external sound is introduced through the sound hole 140 and transferred to the vibrating membrane 123 of the MEMS chip.
  • the space 126 defined on the opposite side of the vibrating membrane to be transmitted is the back chamber space.
  • the present invention has been proposed in order to solve the above problems, and provided with two printed circuit boards in order to secure a sufficient back chamber space, provided with a spaced apart supporting member between the two printed circuit boards, It is an object of the present invention to provide a microphone which can be mounted on a printed circuit board close to an acoustic hole and which can be easily assembled and have high specification acoustic characteristics.
  • the microphone of the present invention includes a case in which external sound holes are formed; A first printed circuit board coupled to an inside of the case and having an inner sound hole communicating with the outer sound hole; A MEMS chip mounted on an inner surface of the first printed circuit board and mounted at a position where the internal sound hole is formed; A second printed circuit board coupled to the inside of the case and coupled to be spaced apart from the first printed circuit board, and having a plurality of connection terminals formed on an outer surface thereof; A plurality of conductive connection members electrically connecting the first printed circuit board and the second printed circuit board; And a spaced apart support member provided between the first printed circuit board and the second printed circuit board so that the first printed circuit board and the second printed circuit board can be supported while maintaining a distance therebetween. do.
  • the space supporting member it is preferably made to include an inner space penetrated up and down and the edge forming the inner space.
  • the spaced support member it is preferable that the receiving portion that can accommodate each of the conductive connection member is provided.
  • the spaced support member includes an inner space penetrated up and down and an edge portion forming the inner space, and the accommodation portion is provided at a corner of the edge portion.
  • the conductive connecting member is a conductive spring in the form of a coil.
  • the conductive connecting member is preferably a columnar shape.
  • the conductive connecting member has elasticity.
  • the conductive connecting member is preferably plated with an outer surface of the conductive material.
  • one side of the case is open, the external sound hole is formed on the other side of the case, the first printed circuit board, the spaced apart supporting member and the second printed circuit board is sequentially stacked inside the case, An end portion of the side surface extending from the other side toward one side is bent inwardly to fix the first printed circuit board, the spaced support member and the second printed circuit board stacked therein, and to connect the conductive connection.
  • the member is elastic and is preferably coupled in an elastically deformed state.
  • two printed circuit boards are provided, and spaced apart supporting members are provided between the two printed circuit boards, so that the assembly can be easily performed and high acoustic characteristics can be provided.
  • the space secured by the spaced support member as the back chamber space between the two printed circuit boards, so that the acoustic characteristics of the microphone can be improved.
  • the electrical connection between the two printed circuit boards can be easily achieved.
  • 1 is a schematic cross-sectional view of a conventional microphone
  • FIG. 2 is a perspective view of a microphone of one embodiment according to the present invention.
  • FIG. 3 is an exploded perspective view of the microphone of FIG. 2;
  • FIG. 6 is a schematic cross-sectional view of the microphone of FIG. 2;
  • connection terminal 50 ... conductive connection member
  • the microphone 1 of the present embodiment is a device for converting sound waves such as voice, sound, sound, etc. into electrical signals, and includes a case 10, a first printed circuit board 20, a MEMS chip 30, and a second printed circuit. It comprises a substrate 40, a conductive connecting member 50 and the spaced apart support member 60.
  • the microphone 1 is mainly used for personal mobile communication terminals, such as a mobile phone, a PDA, and a smart phone.
  • the case 10 forms an external form of the microphone 1. Inside, various parts necessary for operation are mounted. One side of the case 10 is open, and the other side 11 is formed with an external sound hole 12. Since the external sound hole 12 is penetrated, external sound flows into the case.
  • the case 10 is a hexahedron whose surface is rectangular.
  • the overall shape of the case may be variously modified. That is, the case may have a cylindrical shape, or may have a columnar shape having an elliptical cross section in the horizontal direction.
  • the case 10 has four side surfaces 14 extending downward from the other side 11.
  • the lower end of each side 14 is provided with a curling portion 16.
  • Curing portion 16 is in the same plane as the side as shown in the state shown in Figures 3 and 5, as shown in Figures 4 and 6 after the other components are inserted into the case, By folding (curing), the internal parts are fixed.
  • the interior parts are fixed and assembled by curing the curling portion 16 at the lower end of the case side. Therefore, there is no need for a fixing means such as a separate adhesive for fixing between internal parts.
  • the conductive connecting member 50 is elastic and is coupled in an elastically deformed state, the electrical connection and fixing between the first and second printed circuit boards 20 and 40 are firm. .
  • the case 10 is formed of a conductive material such as nickel, copper, aluminum, copper, or an alloy thereof having excellent noise blocking characteristics.
  • the first printed circuit board 20 is coupled to the inside of the other side 11 of the case 10.
  • electrical components such as the MEMS chip 30 and the amplifier 70 are mounted on the lower surface of the first printed circuit board 20 based on the directions of FIGS. 2 and 4.
  • the first printed circuit board 20 is also called a die (DIE) printed circuit board because various electrical components are mounted thereon.
  • DIE die
  • the first printed circuit board may be spaced apart from the other side of the case and fixed as necessary.
  • a separate configuration may be provided between the first printed circuit board and the other side surface of the case, or a protrusion may be provided on the inner wall of the case.
  • the outer sound hole 12 and the inner sound hole 22 are configured not to face each other as shown in FIG. That is, the outer sound hole 12 and the inner sound hole 22 are positioned so as to shift from each other. Therefore, the external sound introduced through the external sound hole 12 passes through the sound path 24 formed between the case 10 and the first printed circuit board, and then through the internal sound hole 22 to the MEMS chip 30. Delivered.
  • the inner sound hole and the outer sound hole may be configured to face each other.
  • an outer surface of the first printed circuit board 20 is provided with a copper plating layer 26.
  • the central portion of the plating layer 26 is removed by corrosion to form the acoustic path 24.
  • the length, direction, shape, or height of the sound path may be variously modified according to the needs of the user.
  • the method of cutting, mold, injection, or the like can be used in addition to the method of corroding and forming the copper layer as in the present embodiment.
  • the acoustic path is not limited to that formed in the first printed circuit board as in the present embodiment, and may be formed in the case as long as the external sound hole and the internal sound hole communicate with each other. You may.
  • the MEMS chip 30 is mounted on the inner surface of the first printed circuit board.
  • the inner surface refers to the surface facing the inner space 62.
  • the MEMS chip 30 is mounted to face the internal sound hole 22.
  • the MEMS chip 30 is mounted to face the internal sound hole so that the MEMS chip 30 can receive the sound signal introduced through the internal sound hole 22. 22) includes a formed portion and is mounted on a substrate.
  • the MEMS chip 30 converts the received acoustic signal into an electrical signal.
  • the MEMS chip 30 includes a configuration such as a vibration membrane, a spacer, and a back plate.
  • the amplifier 70 is mounted on the inner surface of the first printed circuit board 20 together with the MEMS chip 30.
  • the amplifier 70 receives and amplifies the electrical signal received from the MEMS chip 30.
  • the amplifier 70 is also called a special purpose semiconductor (ASIC) chip. Meanwhile, in another embodiment, the amplifier 70 may be mounted on the second printed circuit board 20 as necessary.
  • ASIC special purpose semiconductor
  • the second printed circuit board 40 is coupled to one open side of the case 10. While coupled to the open side of the case 10, it defines an inner space 62 with the case 10. The second printed circuit board 40 is spaced apart from the first printed circuit board 20.
  • connection terminals 42 are provided on the outer surface of the second printed circuit board 40.
  • connection terminal is also called a connection terminal or pad.
  • the second printed circuit board 40 is also called a pad printed circuit board.
  • the connection terminal 42 is electrically connected to the MEMS chip 30 and the amplifier 70 inside, and is configured to connect with an external device.
  • the number of connection terminals 42 can be increased or decreased as needed, and the provided position can be changed as needed.
  • first and second printed circuit boards may be made of a hard general material or may be made of a flexible material.
  • the conductive connection member 50 is provided in plural and serves to electrically connect the first printed circuit board 20 and the second printed circuit board 40.
  • each conductive connecting member 50 is a spring in which a conductive metal wire is bent in a coil form. Because of the spring, even if the assembly tolerance is not precise, the electrical connection between the first and second printed circuit boards 20, 40 is made simple and reliable.
  • the conductive connection member may be modified in various shapes by only electrically connecting the first and second printed circuit boards in addition to the spring shape formed by bending the conductive metal wire in shape and material.
  • the conductive connecting member 50 does not necessarily need to be made of metal in its entirety, or may be made of conductive silicon, or may be made of a non-conductive material in an external shape, but by plating or the like on the outer surface thereof.
  • a conductive layer may also be provided.
  • the conductive connecting member may also be a simple cylinder or pin shape instead of a spring.
  • each of the first and second printed circuit boards includes a groove portion capable of fixing both ends of the conductive connecting member, and the conductive connecting member is directly connected to the first and second printed circuit boards without assistance of other configurations. It may be fixed to a printed circuit board.
  • the spaced support member 60 is provided between the first printed circuit board 20 and the second printed circuit board 40, and the first printed circuit board 20 and the second printed circuit board 40 are provided. Support with space between each other.
  • the spaced support member 60 has a rectangular frame shape so as to correspond to the shapes of the first printed circuit board 20 and the second printed circuit board 40.
  • the spaced apart supporting member 60 has an empty center portion to define the inner space 62 together with the first and second printed circuit boards 20 and 40.
  • the portion surrounding the inner space 62 is the edge portion 64.
  • the spaced apart supporting member 60 has a thickness equal to a distance from which the first and second printed circuit boards 20 and 40 are spaced apart from each other.
  • the spaced support member 60 is provided with an accommodation portion 66 in which each of the plurality of conductive connection members 50 is accommodated and supported. Since the accommodating part 66 has a cylindrical shape in which a part of the side surface is open, the spring-shaped conductive connecting member 50 is easily coupled in the up and down direction, and thus is not separated from the horizontal direction.
  • the receiving portion may be formed to be located at another portion, for example, the center portion, not the corner of the spaced apart support member, may be formed in the middle portion, not the corner along the outer circumference, and some of the remaining portion in the corner May be formed in the center portion.
  • the spaced apart support member 60 is a quadrangular as a whole, in the case of other embodiments can be variously modified. That is, it may be in the form of a circle, a polygon other than square, oval, or the like as a whole.
  • the inner space 62 is a back chamber space. That is, the back chamber means a space on the opposite side to the external sound is transmitted on the basis of the vibration membrane configuration of the MEMS chip 30, as in this embodiment, the MEMS chip 30 is opposed to the internal sound hole 22 When mounted so that the inner space is located on the opposite side to the external sound is transmitted on the basis of the vibration membrane provided in the MEMS chip 30 will be a back chamber.
  • the thickness of the spaced support member 60 and the volume of the edge portion 64 is adjusted, the size and shape of the back chamber space can be adjusted.
  • the microphone 1 of the present embodiment is provided with a spaced apart supporting member 60 between the first printed circuit board 20 and the second printed circuit board 40 arranged to be spaced apart from each other. 30 is provided so as to face the inner sound hole 22 of the first printed circuit board 20, so that the inner space formed between the first and second printed circuit boards 20 and 40 can be used as the back chamber space. do. Therefore, according to the present invention, the back chamber space can be sufficiently secured, and thus, the acoustic characteristic of the microphone is improved.
  • the spaced apart support member 60 has the advantage that the first and second printed circuit boards 20 and 40 can be stably fixed in a spaced apart state.
  • the spaced support member 60 includes the receiving portion 66, there is an advantage that the assembly of the conductive connection member 50 is made simple and robust.
  • the MEMS chip 120 used in the conventional microphone 100 illustrated in FIG. 1 is a type in which sound holes are formed in a case and mounted on a substrate, a back chamber space must be provided therein.
  • the MEMS chip 120 has a configuration different from that of MEMS chips used in a microphone (not shown) having a configuration in which sound holes are formed in a substrate and mounted in the sound holes.
  • the structure of the MEMS chip to be used depends on where the sound holes of the microphone are formed.
  • the MEMS chip is provided in close proximity to the external sound holes formed in the case, thereby sufficiently securing the back chamber space.
  • the product of the same configuration as the MEMS chip used in the type of microphone formed in the sound hole can be used.
  • the outer sound hole 12 formed in the case 10 and the inner sound hole 22 formed in the first printed circuit board 20 are configured to shift without facing each other, and these are displaced so that the sound path 24 Since it is communicated through, there is an advantage that it is possible to diversify the acoustic path 24.
  • the printed circuit boards are physically separated and used as two, it is possible to use a single layer instead of a structure in which a plurality of layers are laminated and bonded. Therefore, there is an advantage that the manufacturing of the printed circuit board is simple and the cost is reduced compared to the conventional.
  • Figure 7 and Figure 8 shows the results of experiments with the acoustic characteristics of the microphone 1 of the present embodiment and the conventional microphone 100 as illustrated in FIG. Looking at the high frequency range on the right side of each graph, it can be seen that the microphone 1 of the present embodiment has a significant improvement in acoustic characteristics due to the sufficient securing of the back chamber space as compared with the prior art.
  • the present invention is not limited thereto. That is, even without a spaced support member, the first and second printed circuit boards may be configured to be spaced apart from each other using only the conductive connection members.
  • the outer sound hole and the inner sound hole do not face each other, but the present invention is not limited thereto. That is, the external sound hole and the internal sound hole may be configured to face each other, but the embodiment of this configuration may obtain all of the remaining effects described above, except for effects obtained by the two sound holes not facing each other. .

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)
  • Micromachines (AREA)

Abstract

La présente invention porte sur un microphone qui comprend : un boîtier ayant une rosace externe ; une première carte de circuit imprimé couplée à la partie interne du boîtier et ayant une rosace interne communiquant avec la rosace externe ; une puce de circuit micro-électromécanique (MEMS) montée sur la surface interne de la carte de circuit imprimé et disposée au niveau de la rosace interne ; une seconde carte de circuit imprimé couplée à la partie interne du boîtier et espacée de la première carte de circuit imprimé, et qui comprend des bornes de connexion sur la surface externe de celle-ci ; une pluralité d'éléments de connexion conducteurs, connectant électriquement la première carte de circuit imprimé à la seconde carte de circuit imprimé ; et un support d'espacement disposé entre les première et seconde cartes de circuit imprimé pour supporter les première et seconde cartes de circuit imprimé avec un espace entre elles. Le microphone peut fournir un espace de chambre arrière suffisant et être assemblé de manière efficace, et la forme et le volume de celui-ci peuvent varier de manière commode si nécessaire.
PCT/KR2011/002566 2010-07-09 2011-04-12 Microphone WO2012005434A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020100066414A KR101130335B1 (ko) 2010-07-09 2010-07-09 마이크로폰
KR10-2010-0066414 2010-07-09

Publications (2)

Publication Number Publication Date
WO2012005434A2 true WO2012005434A2 (fr) 2012-01-12
WO2012005434A3 WO2012005434A3 (fr) 2012-03-01

Family

ID=45429155

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2011/002566 WO2012005434A2 (fr) 2010-07-09 2011-04-12 Microphone

Country Status (4)

Country Link
KR (1) KR101130335B1 (fr)
CN (2) CN102316402A (fr)
TW (1) TW201208394A (fr)
WO (1) WO2012005434A2 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9485560B2 (en) 2012-02-01 2016-11-01 Knowles Electronics, Llc Embedded circuit in a MEMS device
US8995694B2 (en) 2012-02-01 2015-03-31 Knowles Electronics, Llc Embedded circuit in a MEMS device
CN102790940A (zh) * 2012-07-25 2012-11-21 中山市天键电声有限公司 防风传声器
EP2901714A4 (fr) * 2012-09-27 2016-06-08 Knowles Electronics Llc Circuit intégré dans un dispositif mems
CN108235832B (zh) * 2017-03-09 2021-01-05 华为技术有限公司 一种消费电子产品的主板及终端
CN115767948B (zh) * 2022-11-14 2024-04-02 北京自动化控制设备研究所 Mems惯性系统高密度低应力集成方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007288669A (ja) * 2006-04-19 2007-11-01 Hosiden Corp エレクトレットコンデンサマイクロホン
KR100737732B1 (ko) 2006-04-21 2007-07-10 주식회사 비에스이 멤스 마이크로폰의 패키징 구조
KR100797443B1 (ko) * 2006-07-10 2008-01-23 주식회사 비에스이 멤스 마이크로폰 패키징 구조
KR100737726B1 (ko) * 2006-07-10 2007-07-10 주식회사 비에스이 멤스 마이크로폰 패키징 구조체
CN101282594B (zh) * 2008-04-10 2013-06-05 苏州敏芯微电子技术有限公司 具有双面贴装电极的微机电传声器的封装结构

Also Published As

Publication number Publication date
WO2012005434A3 (fr) 2012-03-01
KR20120005768A (ko) 2012-01-17
TW201208394A (en) 2012-02-16
KR101130335B1 (ko) 2012-03-26
CN202135313U (zh) 2012-02-01
CN102316402A (zh) 2012-01-11

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