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WO2016161703A1 - Dispositif permettant le montage puce retournée d'une puce - Google Patents

Dispositif permettant le montage puce retournée d'une puce Download PDF

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Publication number
WO2016161703A1
WO2016161703A1 PCT/CN2015/081754 CN2015081754W WO2016161703A1 WO 2016161703 A1 WO2016161703 A1 WO 2016161703A1 CN 2015081754 W CN2015081754 W CN 2015081754W WO 2016161703 A1 WO2016161703 A1 WO 2016161703A1
Authority
WO
WIPO (PCT)
Prior art keywords
chip
carrier
nozzle
wafer
mechanisms
Prior art date
Application number
PCT/CN2015/081754
Other languages
English (en)
Chinese (zh)
Inventor
蒋永新
陈民杰
朱玉萍
Original Assignee
嘉兴景焱智能装备技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 嘉兴景焱智能装备技术有限公司 filed Critical 嘉兴景焱智能装备技术有限公司
Publication of WO2016161703A1 publication Critical patent/WO2016161703A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions

Definitions

  • the present invention relates to the field of integrated circuit packaging and detection and sorting technology, and more particularly to a chip flip device.
  • the wafer After the wafer is diced into multiple chips, it needs to be flip-bonded or sorted according to its appearance characteristics.
  • the wafer carrier 101 of the conventional flip-chip device is arranged in parallel with the chip by the carrier 102.
  • the chip pick-up nozzles 104, 105 are mounted on the rotating disk 103, and the nozzle picks up the chip and then rotates to the top by the horizontal take-up arm.
  • the nozzle 106 on the 107 picks up the chip, and detects the position of the chip on the wafer and the position on the carrier through the camera 109 and the camera 110, and adjusts the state of the nozzle 106 in real time, and the horizontal take-up ratio 107 is moving. Movement over the shaft 108 causes the nozzle 106 to move horizontally to the chip to mount the chip above the carrier 102.
  • This structure is because the wafer carrier 101 and the chip are arranged in parallel by the carrier 102, occupying a large space, and the horizontal moving axis has a large movement stroke, resulting in a large error in motion and low production efficiency.
  • the present invention provides a chip flip device in which a wafer carrier and a chip are arranged face to face by a carrier, and two sets of rotating structures are used in the middle to realize picking, transferring and mounting of the chip.
  • a chip flip device comprising a wafer carrier and a chip carrier, wherein the wafer carrier and the chip are arranged face to face by a carrier, and two between the wafer carrier and the chip are supported by the carrier a rotating mechanism, a line connecting the rotation centers of the two rotating mechanisms is perpendicular to the wafer carrier and the chip, and at least two nozzle mechanisms are disposed on the rotating mechanism, and the nozzle of the nozzle mechanism can be Move settings.
  • a prism is further disposed on each of the rotating mechanisms, and the flip-chip device is disposed on the flip-chip device
  • the camera corresponding to the prism the camera performs imaging analysis on the chip on the wafer and the chip mounting position on the carrier through the prism to obtain position information, and can check defects on the surface of the chip.
  • the wafer carrier and the chip are arranged above and below the carrier, the wafer carrier is located above, the chip is positioned under the carrier, and the upper wafer of the wafer carrier is fixed by adhesive.
  • a camera is mounted at a horizontal position of the lower rotating mechanism, and the camera performs imaging analysis on the chip when the chip on the nozzle is rotated to a horizontal position, obtains position information before the chip is mounted, and inspects defects on the surface of the chip.
  • the nozzle mechanism includes an adjustment member that adjusts alignment of the chip on the nozzle with a corresponding nozzle or chip carrier, and a drive mechanism that drives the nozzle to move linearly.
  • the wafer carrier and the chip-receiving carrier are both disposed on respective motion mechanisms, and the moving mechanism moves the wafer and the carrier to the underside of the nozzle, and the movement of the motion mechanism passes through the prism and Image system control implementation of the camera.
  • the nozzle mechanism on each of the rotating mechanisms is 2 to 4.
  • the wafer carrier and the chip disposed face to face are compact in structure, short in motion stroke, reducing the source of error and improving the efficiency of packaging or sorting;
  • the nozzle mechanism and the visual mechanism can easily adjust the deviation of the chip and improve the quality of the package.
  • FIG. 1 is a schematic structural view of a flip chip mechanism of the prior art
  • FIG. 2 is a schematic structural view of a flip chip mechanism of the present invention.
  • the chip is supported by a carrier; 103. a rotating disk;
  • the flip chip device includes a wafer carrier 1 and a chip carrier 2, and the wafer carrier 1 and the chip are arranged face to face by the carrier 2, and the arrangement may be horizontal or vertical.
  • the wafer carrier 1 and the chip carrier 2 can be fixedly disposed on the table.
  • the chip is fixed on the table by the carrier 2, and the wafer carrier 1 is fixed above by the bracket.
  • the positions of the wafer carrier 1 and the chip by the carrier 2 can be interchanged.
  • Two rotating mechanisms 3, 4 are disposed between the wafer carrier 1 and the chip receiving carrier 2, and the wiring of the rotation centers of the two rotating mechanisms 3, 4 is perpendicular to the wafer carrier 1 and the chip by the carrier 2.
  • At least two nozzle mechanisms 9, 10, 11, 12 are provided on each of the rotating mechanisms 3, 4, and the number of the nozzle mechanisms 9, 10, 11, 12 is generally 2 to 4, and the two rotating mechanisms 3, 4 The position and number of the nozzle mechanisms 9, 10, 11, 12 are corresponding.
  • the nozzle mechanisms 9, 10, 11, 12 on the opposite sides are in the relative time during the cycle time.
  • the position meets and the nozzle mechanism on the two rotating mechanisms transfers the chip at the meeting point.
  • the wafer carrier and the chip disposed above are exemplified by the carrier.
  • the transfer process of the chip is: after the nozzle mechanism 9, 10 on the upper rotating mechanism 3 sucks the chip from the wafer carrier 1, The nozzle mechanisms 11, 12 on the lower rotating mechanism 4 meet to transfer the chips to the nozzle mechanisms 11, 12 below, and during the transfer process, the chips are flipped over.
  • the nozzles on the two nozzle mechanisms can be controlled to achieve axial movement and radial fine adjustment by adjusting the prior art and mechanical adjustment devices or numerically controlled adjustment devices.
  • prisms 7 and 8 are disposed on each of the rotating mechanisms, and cameras 5 and 6 corresponding to the prisms are disposed on the flip-chip device, and the cameras 5 and 6 image and analyze the position of the chips on the wafer through the prisms 7 and 8.
  • the flip-chip device is further provided with a camera 13 for performing image analysis on the position of the chip before mounting and inspecting defects on the surface of the chip.
  • the control unit of the flip-chip device controls the rotation mechanism and the nozzle mechanism to adjust the position and state of the chip in real time according to the positional imaging information of the camera.
  • the wafer carrier 1 and the chip-receiving carrier 2 are both disposed on the respective transport mechanisms, and the chips on the wafer are moved above the nozzle according to the movement of the transport mechanism, and the chip-mounted position on the carrier is moved below the nozzle.
  • the control unit controls the movement of the moving mechanism through the image system composed of the prism and the camera.
  • the wafer carrier and the chip disposed below are taken as an example.
  • the working process of the flip chip device of the present invention is as follows.
  • the wafer carrier moves at a certain rate, and the two rotating mechanisms are in the same direction or opposite directions.
  • Rotating the upper rotating mechanism sucks the chip from the wafer carrier through the nozzle mechanism, and continues to rotate to a position to meet the nozzle mechanism of the lower rotating mechanism, and the lower nozzle mechanism sucks the chip from the upper nozzle mechanism.
  • the chip is turned over, and the lower nozzle mechanism is turned to the chip receiving position, and the chip is mounted on the chip receiving carrier. After the chip in one position is full, the chip is transported by the carrier in the direction of the finished product.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

L'invention concerne un dispositif permettant le montage puce retournée d'une puce, comprenant un support de plaquette (1) et un porte-puce (2) qui sont disposés face à face, deux mécanismes rotatifs (3, 4) étant agencés entre le support de plaquette (1) et le porte-puce (2), une ligne reliant les centres de rotation des deux mécanismes rotatifs (3, 4) étant perpendiculaire au support de plaquette (1) et au porte-puce (2), au moins deux mécanismes à buse de pulvérisation (9, 10, 11, 12) étant agencés sur les mécanismes rotatifs (3, 4), et les mécanismes à buse de pulvérisation (9, 10, 11, 12) étant agencés d'une manière mobile. Au moyen des deux mécanismes rotatifs de la présente invention, l'opération de retournement de la puce dans un processus d'encapsulation ou de tri est réalisée. L'agencement face à face du support de plaquette et du porte-puce conduit à une structure compacte et une courte course de déplacement, de manière à réduire les sources d'erreur et à améliorer l'efficacité d'encapsulation ou de tri.
PCT/CN2015/081754 2015-04-07 2015-06-18 Dispositif permettant le montage puce retournée d'une puce WO2016161703A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201510159819.7A CN104752283B (zh) 2015-04-07 2015-04-07 芯片倒装装置
CN201510159819.7 2015-04-07

Publications (1)

Publication Number Publication Date
WO2016161703A1 true WO2016161703A1 (fr) 2016-10-13

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ID=53591772

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2015/081754 WO2016161703A1 (fr) 2015-04-07 2015-06-18 Dispositif permettant le montage puce retournée d'une puce

Country Status (2)

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CN (1) CN104752283B (fr)
WO (1) WO2016161703A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115440627A (zh) * 2022-09-02 2022-12-06 苏州策林智能科技有限公司 一种立式贴片机

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106783717A (zh) * 2016-12-23 2017-05-31 合肥矽迈微电子科技有限公司 芯片倒装贴片设备及方法
SG11201909436WA (en) 2017-04-11 2019-11-28 Muehlbauer Gmbh & Co Kg Component receiving device with optical sensor
CN108155124A (zh) * 2017-12-25 2018-06-12 北京中电科电子装备有限公司 一种芯片贴装装置及方法
CN110444498B (zh) * 2018-05-03 2022-01-04 苏州艾科瑞思智能装备股份有限公司 一种长距离、精准快速取装芯片装置
CN109588036A (zh) * 2018-11-30 2019-04-05 江门市三兴照明科技有限公司 一种灯珠贴装装置
TWI709727B (zh) * 2019-08-12 2020-11-11 京元電子股份有限公司 Ic晶片外觀檢驗模組
CN112394030A (zh) * 2019-08-15 2021-02-23 京元电子股份有限公司 Ic芯片外观检验模块
CN110718493A (zh) * 2019-11-14 2020-01-21 深圳源明杰科技股份有限公司 晶圆传送装置和晶圆封装机构
CN111524851A (zh) * 2020-04-30 2020-08-11 甬矽电子(宁波)股份有限公司 芯片倒装设备、系统和方法
CN114062382A (zh) * 2020-08-04 2022-02-18 深圳中科飞测科技股份有限公司 一种检测系统及检测方法
CN114678321B (zh) * 2022-05-27 2022-08-23 山东睿芯半导体科技有限公司 一种芯片贴装装置

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US20030224557A1 (en) * 2002-05-31 2003-12-04 Texas Instruments Incorporated Process and system to package residual quantities of wafer level packages
CN1613146A (zh) * 2002-01-07 2005-05-04 先进系统自动化有限公司 倒装芯片结合器及其方法
CN1625930A (zh) * 2002-01-30 2005-06-08 西门子公司 芯片取下装置、装配系统和从晶片上取下芯片的方法
CN1901148A (zh) * 2005-07-20 2007-01-24 富士通株式会社 Ic芯片安装方法
WO2008092798A1 (fr) * 2007-01-31 2008-08-07 Esec Ag Dispositif pour le montage d'une puce retournée sur un substrat
CN102201357A (zh) * 2011-04-19 2011-09-28 上海微松工业自动化有限公司 一种晶圆级封装微小芯片提取翻转置位设备

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DE102004007703B3 (de) * 2004-02-16 2005-06-23 Mühlbauer Ag Vorrichtung und Verfahren zum Überprüfen und Umdrehen elektronischer Bauelemente
CN204632732U (zh) * 2015-04-07 2015-09-09 嘉兴景焱智能装备技术有限公司 芯片倒装装置

Patent Citations (6)

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Publication number Priority date Publication date Assignee Title
CN1613146A (zh) * 2002-01-07 2005-05-04 先进系统自动化有限公司 倒装芯片结合器及其方法
CN1625930A (zh) * 2002-01-30 2005-06-08 西门子公司 芯片取下装置、装配系统和从晶片上取下芯片的方法
US20030224557A1 (en) * 2002-05-31 2003-12-04 Texas Instruments Incorporated Process and system to package residual quantities of wafer level packages
CN1901148A (zh) * 2005-07-20 2007-01-24 富士通株式会社 Ic芯片安装方法
WO2008092798A1 (fr) * 2007-01-31 2008-08-07 Esec Ag Dispositif pour le montage d'une puce retournée sur un substrat
CN102201357A (zh) * 2011-04-19 2011-09-28 上海微松工业自动化有限公司 一种晶圆级封装微小芯片提取翻转置位设备

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115440627A (zh) * 2022-09-02 2022-12-06 苏州策林智能科技有限公司 一种立式贴片机

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CN104752283A (zh) 2015-07-01

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