WO2016161703A1

WO2016161703A1 - Device for flip-chip mounting chip

Info

Publication number: WO2016161703A1
Application number: PCT/CN2015/081754
Authority: WO
Inventors: 蒋永新; 陈民杰; 朱玉萍
Original assignee: 嘉兴景焱智能装备技术有限公司
Priority date: 2015-04-07
Filing date: 2015-06-18
Publication date: 2016-10-13
Also published as: CN104752283B; CN104752283A

Abstract

Disclosed is a device for flip-chip mounting a chip, comprising a wafer support (1) and a chip carrier (2) which are arranged face to face, wherein two rotary mechanisms (3, 4) are arranged between the wafer support (1) and the chip carrier (2), a connecting line of rotation centres of the two rotary mechanisms (3, 4) is perpendicular to the wafer support (1) and the chip carrier (2), at least two spray nozzle mechanisms (9, 10, 11, 12) are arranged on the rotary mechanisms (3, 4), and the spray nozzle mechanisms (9, 10, 11, 12) are arranged movably. By means of the two rotary mechanisms of the present invention, the flipping operation of the chip in a packaging or sorting process is realized. The wafer support and the chip carrier being arranged face to face leads to a compact structure and a short movement stroke, so that error sources are reduced, and the packaging or sorting efficiency is improved.

Description

Chip flip device

Technical field

The present invention relates to the field of integrated circuit packaging and detection and sorting technology, and more particularly to a chip flip device.

Background technique

After the wafer is diced into multiple chips, it needs to be flip-bonded or sorted according to its appearance characteristics.

Referring to Figure 1, the wafer carrier 101 of the conventional flip-chip device is arranged in parallel with the chip by the carrier 102. The chip pick-

up nozzles

104, 105 are mounted on the rotating disk 103, and the nozzle picks up the chip and then rotates to the top by the horizontal take-up arm. The nozzle 106 on the 107 picks up the chip, and detects the position of the chip on the wafer and the position on the carrier through the camera 109 and the camera 110, and adjusts the state of the nozzle 106 in real time, and the horizontal take-up ratio 107 is moving. Movement over the shaft 108 causes the nozzle 106 to move horizontally to the chip to mount the chip above the carrier 102.

This structure is because the wafer carrier 101 and the chip are arranged in parallel by the carrier 102, occupying a large space, and the horizontal moving axis has a large movement stroke, resulting in a large error in motion and low production efficiency.

Summary of the invention

In order to solve the above technical problem, the present invention provides a chip flip device in which a wafer carrier and a chip are arranged face to face by a carrier, and two sets of rotating structures are used in the middle to realize picking, transferring and mounting of the chip.

The technical solution adopted by the invention is:

A chip flip device comprising a wafer carrier and a chip carrier, wherein the wafer carrier and the chip are arranged face to face by a carrier, and two between the wafer carrier and the chip are supported by the carrier a rotating mechanism, a line connecting the rotation centers of the two rotating mechanisms is perpendicular to the wafer carrier and the chip, and at least two nozzle mechanisms are disposed on the rotating mechanism, and the nozzle of the nozzle mechanism can be Move settings.

Further, a prism is further disposed on each of the rotating mechanisms, and the flip-chip device is disposed on the flip-chip device The camera corresponding to the prism, the camera performs imaging analysis on the chip on the wafer and the chip mounting position on the carrier through the prism to obtain position information, and can check defects on the surface of the chip.

Further, the wafer carrier and the chip are arranged above and below the carrier, the wafer carrier is located above, the chip is positioned under the carrier, and the upper wafer of the wafer carrier is fixed by adhesive.

Further, a camera is mounted at a horizontal position of the lower rotating mechanism, and the camera performs imaging analysis on the chip when the chip on the nozzle is rotated to a horizontal position, obtains position information before the chip is mounted, and inspects defects on the surface of the chip.

Further, the nozzle mechanism includes an adjustment member that adjusts alignment of the chip on the nozzle with a corresponding nozzle or chip carrier, and a drive mechanism that drives the nozzle to move linearly.

Further, the wafer carrier and the chip-receiving carrier are both disposed on respective motion mechanisms, and the moving mechanism moves the wafer and the carrier to the underside of the nozzle, and the movement of the motion mechanism passes through the prism and Image system control implementation of the camera.

Further, the nozzle mechanism on each of the rotating mechanisms is 2 to 4.

The beneficial effects of the invention are:

(1) Two sets of rotating mechanisms realize the turning operation during the dispensing process of the chip;

(2) The wafer carrier and the chip disposed face to face are compact in structure, short in motion stroke, reducing the source of error and improving the efficiency of packaging or sorting;

(3) The nozzle mechanism and the visual mechanism can easily adjust the deviation of the chip and improve the quality of the package.

DRAWINGS

1 is a schematic structural view of a flip chip mechanism of the prior art;

2 is a schematic structural view of a flip chip mechanism of the present invention.

The numbers in the drawings are:

1. a wafer carrier; 2. a chip is supported by a carrier;

3. Rotating mechanism; 4. Rotating mechanism;

5. camera; 6. camera;

7. Prism; 8. Prism;

9. Nozzle mechanism; 10. Nozzle mechanism;

11. nozzle mechanism; 12. nozzle mechanism;

13. camera; 101. wafer carrier;

102. The chip is supported by a carrier; 103. a rotating disk;

104. a nozzle; 105. a nozzle;

106. a nozzle; 107. a take-up arm;

108. Horizontal movement axis; 109. camera;

110. Camera.

detailed description

The chip flip device of the present invention will be described in detail below with reference to the accompanying drawings.

Referring to FIG. 2, the flip chip device includes a wafer carrier 1 and a chip carrier 2, and the wafer carrier 1 and the chip are arranged face to face by the carrier 2, and the arrangement may be horizontal or vertical. When arranged horizontally, the wafer carrier 1 and the chip carrier 2 can be fixedly disposed on the table. When vertically arranged, the chip is fixed on the table by the carrier 2, and the wafer carrier 1 is fixed above by the bracket. The positions of the wafer carrier 1 and the chip by the carrier 2 can be interchanged.

Two

rotating mechanisms

3, 4 are disposed between the wafer carrier 1 and the chip receiving carrier 2, and the wiring of the rotation centers of the two

rotating mechanisms

3, 4 is perpendicular to the wafer carrier 1 and the chip by the carrier 2. At least two

nozzle mechanisms

9, 10, 11, 12 are provided on each of the

rotating mechanisms

3, 4, and the number of the

nozzle mechanisms

9, 10, 11, 12 is generally 2 to 4, and the two

rotating mechanisms

3, 4 The position and number of the

nozzle mechanisms

9, 10, 11, 12 are corresponding. When the two

rotating mechanisms

3, 4 are rotated, the

nozzle mechanisms

9, 10, 11, 12 on the opposite sides are in the relative time during the cycle time. The position meets and the nozzle mechanism on the two rotating mechanisms transfers the chip at the meeting point. The wafer carrier and the chip disposed above are exemplified by the carrier. The transfer process of the chip is: after the

nozzle mechanism

9, 10 on the upper rotating mechanism 3 sucks the chip from the wafer carrier 1, The

nozzle mechanisms

11, 12 on the lower rotating mechanism 4 meet to transfer the chips to the

nozzle mechanisms

11, 12 below, and during the transfer process, the chips are flipped over.

The nozzles on the two nozzle mechanisms can be controlled to achieve axial movement and radial fine adjustment by adjusting the prior art and mechanical adjustment devices or numerically controlled adjustment devices.

Further,

prisms

7 and 8 are disposed on each of the rotating mechanisms, and

cameras

5 and 6 corresponding to the prisms are disposed on the flip-chip device, and the

cameras

5 and 6 image and analyze the position of the chips on the wafer through the

prisms

7 and 8. The flip-chip device is further provided with a camera 13 for performing image analysis on the position of the chip before mounting and inspecting defects on the surface of the chip. The control unit of the flip-chip device controls the rotation mechanism and the nozzle mechanism to adjust the position and state of the chip in real time according to the positional imaging information of the camera.

The wafer carrier 1 and the chip-receiving carrier 2 are both disposed on the respective transport mechanisms, and the chips on the wafer are moved above the nozzle according to the movement of the transport mechanism, and the chip-mounted position on the carrier is moved below the nozzle. The control unit controls the movement of the moving mechanism through the image system composed of the prism and the camera.

The wafer carrier and the chip disposed below are taken as an example. The working process of the flip chip device of the present invention is as follows. The wafer carrier moves at a certain rate, and the two rotating mechanisms are in the same direction or opposite directions. Rotating, the upper rotating mechanism sucks the chip from the wafer carrier through the nozzle mechanism, and continues to rotate to a position to meet the nozzle mechanism of the lower rotating mechanism, and the lower nozzle mechanism sucks the chip from the upper nozzle mechanism. At this time, the chip is turned over, and the lower nozzle mechanism is turned to the chip receiving position, and the chip is mounted on the chip receiving carrier. After the chip in one position is full, the chip is transported by the carrier in the direction of the finished product.

The above is only a preferred embodiment of the present invention, and it should be noted that those skilled in the art can also make several improvements and refinements without departing from the principles of the present invention. These improvements and retouchings should also be regarded as The scope of protection of the invention.

Claims

A chip flip device comprising a wafer carrier and a chip carrier, wherein the wafer carrier and the chip are arranged face to face by a carrier, and two between the wafer carrier and the chip are supported by the carrier a rotating mechanism, a line connecting the rotation centers of the two rotating mechanisms is perpendicular to the wafer carrier and the chip, and at least two nozzle mechanisms are disposed on the rotating mechanism, and the nozzle of the nozzle mechanism can be Move settings.
The chip flip device according to claim 1, wherein a prism is further disposed on each of the rotating mechanisms, and a camera corresponding to the prism is disposed on the flip device, and the camera passes through The prism performs imaging analysis on the chip on the wafer and the chip mounting position on the carrier to obtain position information, and can check for defects on the surface of the chip.
The flip chip device according to claim 1 or 2, wherein the wafer carrier and the chip are arranged above and below the carrier, the wafer carrier is located above, and the chip is positioned under the carrier, The upper wafer of the wafer carrier is fixed by glue.
The chip flip device according to claim 3, wherein a camera is mounted at a horizontal position of the lower rotating mechanism, and the camera performs imaging analysis on the chip when the chip on the nozzle rotates to a horizontal position to obtain chip mounting. Front position information and check for defects on the chip surface.
The chip flip device according to claim 1 or 2, wherein the nozzle mechanism includes an adjustment member that adjusts alignment of the chip on the nozzle with the corresponding nozzle or chip carrier And there is a drive mechanism to drive the nozzle to move linearly.
The chip flip device according to claim 1 or 2, wherein the wafer carrier and the chip carrier are disposed on respective moving mechanisms, and the moving mechanism moves the wafer and the carrier to Below the nozzle, the motion of the motion mechanism is controlled by the image system of the prism and camera.
A flip chip device according to claim 1 or 2, wherein each of said rotating mechanisms There are 2 to 4 nozzle mechanisms on the top.