WO2016000353A1 - Substrat et dispositif d'affichage - Google Patents
Substrat et dispositif d'affichage Download PDFInfo
- Publication number
- WO2016000353A1 WO2016000353A1 PCT/CN2014/088686 CN2014088686W WO2016000353A1 WO 2016000353 A1 WO2016000353 A1 WO 2016000353A1 CN 2014088686 W CN2014088686 W CN 2014088686W WO 2016000353 A1 WO2016000353 A1 WO 2016000353A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- film transistor
- thin film
- ground line
- driving circuit
- layer structure
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 61
- 239000010409 thin film Substances 0.000 claims abstract description 88
- 238000000034 method Methods 0.000 claims abstract description 17
- 230000008569 process Effects 0.000 claims abstract description 12
- 239000000463 material Substances 0.000 claims description 20
- 238000000059 patterning Methods 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 abstract description 17
- 239000011799 hole material Substances 0.000 description 19
- 238000007590 electrostatic spraying Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- 238000005507 spraying Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000005684 electric field Effects 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 230000006698 induction Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
Definitions
- Embodiments of the present invention relate to a display substrate and a display device.
- OLED Organic Light Emitting Diode
- AMOLED Active Matrix/Organic Light Emitting Diode
- the company introduced a 55-inch AMOLED TV and even introduced a curved AMOLED TV for better visual effects.
- White OLEDs for lighting will be a strong contender for next-generation solid-state lighting.
- the solution-type hole injecting material needs to be coated by electrostatic spraying, and a strong electric field is required due to the electrostatic spraying method, so that a solution-type hole injecting material sprayed onto the thin film transistor substrate may occur.
- the charging causes charge to accumulate on the thin film transistor to affect the thin film transistor, resulting in electrical drift.
- Embodiments of the present invention provide a display substrate and a display device, which solve the problem that the threshold voltage in the thin film transistor changes and the electrical drift occurs when the organic electroluminescent display is fabricated in the prior art, and the thin film transistor is avoided.
- the electrical influence increases the stability of the performance of the product and reduces the production cost.
- a display substrate comprising a thin film transistor and a ground line, wherein:
- ground line One end of the ground line is connected to the thin film transistor, and the other end of the ground line is grounded.
- the ground line is formed simultaneously with the conductive layer structure of the thin film transistor during fabrication of the thin film transistor.
- the conductive layer structure of the thin film transistor includes a gate layer structure, a source layer structure, and a drain layer structure, the ground line and the gate layer structure, the source layer structure, and the drain layer structure At least one of them is disposed on the same layer and formed using the same material.
- one end of the ground line is connected to the source driving circuit or the drain driving circuit, and the source driving circuit or the drain driving circuit is connected to the thin film transistor to make One end of the ground line is connected to the thin film transistor;
- the ground line is formed by the one-time patterning process with the source layer structure or the drain layer structure.
- one end of the ground line is connected to the gate driving circuit, and the gate driving circuit is connected to the thin film transistor such that one end of the ground line is connected to the thin film transistor;
- the ground line is formed by the one-time patterning process with the gate layer structure.
- a portion of the source driving circuit or the drain driving circuit that is connected to the ground line is exposed.
- a portion of the gate drive circuit that is connected to the ground line is exposed.
- the ground line is used to protect an electrical signal on the thin film transistor from external electrical signals.
- a display device comprising the display substrate of any of the first aspects.
- the display substrate and the display device thereof provided by the embodiments of the present invention solve the problem that the threshold value in the thin film transistor occurs in the prior art when the organic electroluminescent display is fabricated by grounding the thin film transistor on the display substrate in the display device.
- the voltage changes, causing the problem of electrical drift, avoiding the influence on the electrical properties of the thin film transistor, improving the stability of the performance of the product, and reducing the growth. Production cost.
- FIG. 1 is a schematic structural view of a thin film transistor in a display substrate having a ground line according to an embodiment of the present invention
- FIG. 2 is a schematic structural diagram of another thin film transistor in a display substrate having a ground line according to an embodiment of the present invention
- FIG. 3 is a schematic structural view of a thin film transistor in a display substrate having a grounding line according to an embodiment of the present invention
- FIG. 4 is a schematic structural diagram of a thin film transistor in a display substrate having a ground line according to another embodiment of the present invention.
- FIG. 5 is a schematic diagram showing the effect of electrostatically spraying a hole injecting material on the electrical properties of a thin film transistor when no grounding treatment is performed on a thin film transistor substrate according to an embodiment of the present invention
- FIG. 6 is a schematic diagram showing the effect of electrostatically spraying a hole injection material on the electrical properties of a thin film transistor after a grounding treatment on a thin film transistor substrate according to an embodiment of the present invention.
- the display substrate includes: a thin film transistor 1 and a ground line 2, wherein:
- ground line 2 One end of the ground line 2 is connected to the thin film transistor 1, and the other end of the ground line 2 is grounded.
- the grounding line is a conductive layer structure of the thin film transistor in the process of forming a thin film transistor Formed at the same time.
- a location on a thin film transistor suitable for connecting a ground line without affecting other layer structures on the display substrate can be selected to connect the ground line.
- the ground line may be formed simultaneously with the corresponding layer structure in the process of forming the gate layer structure, the source layer structure, and the drain layer structure of the thin film transistor.
- the ground line is disposed in the same layer as at least one of the gate layer structure, the source layer structure, and the drain layer structure and is formed using the same material.
- the ground line and at least one of the gate layer structure, the source layer structure, and the drain layer structure are formed in the same process step or patterning step.
- the display substrate provided by the embodiment of the present invention performs grounding treatment on the thin film transistor on the display substrate in the display device, so that when the hole injecting material is coated on the substrate by electrostatic spraying in a high electric field environment, even if it is sprayed
- the solution-type hole injecting material on the thin film transistor substrate is charged, and the charge generated by the induction on the thin film transistor can be derived through the grounding line connected to the thin film transistor, so that the threshold voltage and the current value remain unchanged, and the prior art is solved.
- the threshold voltage in the thin film transistor changes, causing electrical drift, avoiding the influence on the electrical properties of the thin film transistor, improving the stability of the performance of the product, and reducing the production cost.
- ground line 2 is used to protect the electrical signal on the thin film transistor 1 from external electrical signals.
- the display substrate further includes: a source driving circuit 3 and a drain driving circuit 5, wherein:
- one end of the ground line 2 is connected to the source driving circuit 3, and the source driving circuit 3 is connected to the thin film transistor 1.
- one end of a ground line 2 is connected to the source driving circuit 3
- the source driving circuit 3 is connected to the thin film transistor 1
- the other end of the grounding line 2 is connected to the drain driving circuit 5, and the drain driving circuit is connected.
- 5 is connected to the thin film transistor 1.
- the ground line 2 is formed by a patterning process with a source electrode (source layer structure) or a drain electrode (drain layer structure).
- the ground line may be formed by a patterning process using exposure, development, and etching using a mask when fabricating the source and drain electrodes of the thin film transistor. In this way, there is no additional production process in the production process, and thus the production cost is not increased.
- a portion of the source driving circuit 3 or the drain driving circuit 5 that is connected to the ground line 2 is exposed.
- the portion of the source drive circuit or the drain drive circuit on the display substrate that is exposed outside is connected to the ground line.
- the source driving circuit or the drain driving circuit is connected to the thin film transistor on the display substrate.
- the wiring is still connected to the thin film transistor. Selecting the portion of the source driving circuit or the drain driving circuit that is exposed outside is connected to the grounding line, which makes it more convenient in practical applications and facilitates grounding treatment at the other end of the wiring line.
- the hole injecting material is still coated on the substrate by electrostatic spraying. At this time, although the hole injecting material sprayed onto the substrate of the thin film transistor is charged, the source driving circuit or the drain is used. A ground line is connected to the pole drive circuit. Therefore, the electric charge accumulated on the substrate when the electrostatic spray coating of the hole material can be derived through the ground line connected to the source driving circuit or the drain driving circuit, thereby avoiding the electrical drift of the accumulated charge on the thin film transistor, effectively The effect on the electrical properties of the thin film transistor is reduced.
- the display substrate further includes: a gate driving circuit 4, wherein:
- ground line 2 is connected to the gate drive circuit 4, and the gate drive circuit 4 is connected to the thin film transistor 1.
- the ground line 2 is formed by a patterning process with a gate electrode (gate layer structure).
- the ground line and the gate electrode may be formed by using a mask plate when forming a gate electrode of the thin film transistor, and performing a patterning process by exposure, development, and etching. In this way, there is no additional production process in the production process, and thus the production cost is not increased.
- a portion of the gate driving circuit 4 that is connected to the ground line 2 is exposed.
- the portion of the gate drive circuit on the display substrate that is exposed to the outside of the circuit structure is connected to the ground line.
- the gate driving circuit is connected to the thin film transistor on the display substrate.
- the wiring is still connected to the thin film transistor.
- the circuit portion of the gate driving circuit that is exposed to the outside is connected to the ground line, which makes it more convenient in practical applications and facilitates grounding treatment at the other end of the wiring line.
- the hole injecting material is still coated on the substrate by electrostatic spraying. At this time, although the hole injecting material sprayed onto the substrate of the thin film transistor is charged, the connection is made on the gate driving circuit. There is a ground line. Therefore, the electric charge accumulated on the substrate when the electrostatic spray coating of the hole material can be derived through the ground line connected to the gate driving circuit, thereby The electrical drift caused by the accumulated charge on the thin film transistor is avoided, and the influence on the electrical properties of the thin film transistor is effectively reduced.
- the grounding circuit when the grounding circuit is not connected to the display substrate in the prior art solution, as shown in FIG. 5, the influence of the electrical properties of the thin film transistor can be obtained, and the gate voltage and the source current are severely affected by the hole. The change in the effect of the injected material.
- a ground line is connected to the thin film transistor, as shown in FIG. 6, which is an influence on the electrical properties of the thin film transistor, and a change in the gate voltage and the source current can be obtained.
- the threshold voltage is shifted by 2 volts positively, and the off current is increased by 1 to 2 orders of magnitude.
- the threshold voltage is shifted to a negative offset of 0.3 volts, and the off current remains unchanged. Therefore, it can be clearly obtained that after adding a grounding setting to the thin film transistor substrate, the influence on the electrical properties of the thin film transistor is small, and within an acceptable error range, the influence on the electrical properties of the thin film transistor is negligible.
- the grounding circuit is only connected to the drain driving circuit or the gate driving circuit.
- the specific manufacturing method of the grounding line is the same as that in the embodiment, and the grounding circuit and the drain driving circuit or the gate are used.
- the connection structure of the driving circuit is also the same as the corresponding structure in this embodiment, and details are not described herein again.
- grounding treatment of the other end of the grounding line in the embodiment of the present invention is generally implemented by connecting the other end of the grounding line to the outer casing of the entire device.
- the grounding function can be realized only by the outer casing of the connecting device, and any design that can realize the grounding function and is easy to implement can be applied in practical applications.
- the display substrate provided by the embodiment of the present invention performs grounding treatment on the thin film transistor on the display substrate in the display device, so that when the hole injecting material is coated on the substrate by electrostatic spraying in a high electric field environment, even if it is sprayed
- the solution-type hole injecting material on the thin film transistor substrate is charged, and the charge generated by the induction on the thin film transistor can be derived through the grounding line connected to the thin film transistor, so that the threshold voltage and the current value remain unchanged, and the prior art is solved.
- the threshold voltage in the thin film transistor changes, causing electrical drift, avoiding the influence on the electrical properties of the thin film transistor, improving the stability of the performance of the product, and reducing the production cost.
- Embodiments of the present invention provide a display device including any of the display substrates in the embodiments corresponding to FIGS. 1 to 4.
- the display device can be: a smartphone, a tablet, a tablet Any product or component that has a display function, such as a television, a notebook computer, a digital photo frame, and a navigator.
- the display device provided by the embodiment of the present invention performs grounding treatment on the thin film transistor on the display substrate in the display device, so that when the hole injecting material is coated on the substrate by electrostatic spraying in a high electric field environment, even if the spraying
- the solution-type hole injecting material on the thin film transistor substrate is charged, and the charge generated by the induction on the thin film transistor can be derived through the ground line connected to the thin film transistor, so that the threshold voltage and the current value remain unchanged, and the prior art is solved.
- the threshold voltage in the thin film transistor changes, and the electrical drift occurs, which avoids the influence on the electrical properties of the thin film transistor, improves the stability of the performance of the product, and reduces the production cost.
- the foregoing program may be stored in a computer readable storage medium, and the program is executed when executed.
- the foregoing steps include the steps of the foregoing method embodiments; and the foregoing storage medium includes: a medium that can store program codes, such as a ROM, a RAM, a magnetic disk, or an optical disk.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
L'invention concerne un substrat d'affichage et un dispositif d'affichage. Le substrat d'affichage comporte un transistor (1) en film mince et un ligne (2) de mise à la terre, une extrémité de la ligne (2) de mise à la terre étant reliée au transistor (1) en film mince, et un traitement de mise à la terre étant effectué sur l'autre extrémité de la ligne (2) de mise à la terre. La ligne (2) de mise à la terre est formée conjointement avec une structure de couche de conduction du transistor (1) en film mince au cours du processus de fabrication et de formation du transistor (1) en film mince.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410307881.1 | 2014-06-30 | ||
| CN201410307881.1A CN104091819B (zh) | 2014-06-30 | 2014-06-30 | 一种显示基板及显示装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2016000353A1 true WO2016000353A1 (fr) | 2016-01-07 |
Family
ID=51639519
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/CN2014/088686 WO2016000353A1 (fr) | 2014-06-30 | 2014-10-15 | Substrat et dispositif d'affichage |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN104091819B (fr) |
| WO (1) | WO2016000353A1 (fr) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104091819B (zh) * | 2014-06-30 | 2018-02-13 | 京东方科技集团股份有限公司 | 一种显示基板及显示装置 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101101385A (zh) * | 2006-07-05 | 2008-01-09 | 群康科技(深圳)有限公司 | 放电电路及采用该放电电路的液晶显示装置 |
| US20080165301A1 (en) * | 2007-01-08 | 2008-07-10 | Wintek Corporation | Liquid crystal display panel with an electrostatic discharge protection capability |
| CN102655148A (zh) * | 2012-03-20 | 2012-09-05 | 京东方科技集团股份有限公司 | Tft基板及其制备方法、液晶显示装置、及电子纸显示装置 |
| CN102760404A (zh) * | 2011-04-28 | 2012-10-31 | 瀚宇彩晶股份有限公司 | 发光二极管显示器像素电路及其驱动方法 |
| CN103064225A (zh) * | 2013-01-29 | 2013-04-24 | 京东方科技集团股份有限公司 | 阵列基板及其制造方法、显示装置 |
| CN104091819A (zh) * | 2014-06-30 | 2014-10-08 | 京东方科技集团股份有限公司 | 一种显示基板及显示装置 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7321672B2 (en) * | 2004-03-26 | 2008-01-22 | Casio Computer Co., Ltd. | Image reading apparatus and image reading system equipped with the image reading apparatus |
| CN100403151C (zh) * | 2005-09-05 | 2008-07-16 | 中华映管股份有限公司 | 薄膜晶体管阵列基板、其静电放电保护元件及其制造方法 |
| KR101373386B1 (ko) * | 2006-12-27 | 2014-03-14 | 엘지디스플레이 주식회사 | 유기 전계 발광 표시 장치 및 그 제조 방법 |
| CN103513459A (zh) * | 2013-10-14 | 2014-01-15 | 北京京东方光电科技有限公司 | 阵列基板及其制备方法、显示装置及其制备方法 |
-
2014
- 2014-06-30 CN CN201410307881.1A patent/CN104091819B/zh active Active
- 2014-10-15 WO PCT/CN2014/088686 patent/WO2016000353A1/fr active Application Filing
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101101385A (zh) * | 2006-07-05 | 2008-01-09 | 群康科技(深圳)有限公司 | 放电电路及采用该放电电路的液晶显示装置 |
| US20080165301A1 (en) * | 2007-01-08 | 2008-07-10 | Wintek Corporation | Liquid crystal display panel with an electrostatic discharge protection capability |
| CN102760404A (zh) * | 2011-04-28 | 2012-10-31 | 瀚宇彩晶股份有限公司 | 发光二极管显示器像素电路及其驱动方法 |
| CN102655148A (zh) * | 2012-03-20 | 2012-09-05 | 京东方科技集团股份有限公司 | Tft基板及其制备方法、液晶显示装置、及电子纸显示装置 |
| CN103064225A (zh) * | 2013-01-29 | 2013-04-24 | 京东方科技集团股份有限公司 | 阵列基板及其制造方法、显示装置 |
| CN104091819A (zh) * | 2014-06-30 | 2014-10-08 | 京东方科技集团股份有限公司 | 一种显示基板及显示装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104091819B (zh) | 2018-02-13 |
| CN104091819A (zh) | 2014-10-08 |
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