WO2016000353A1 - Display substrate and display device - Google Patents
Display substrate and display device Download PDFInfo
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- WO2016000353A1 WO2016000353A1 PCT/CN2014/088686 CN2014088686W WO2016000353A1 WO 2016000353 A1 WO2016000353 A1 WO 2016000353A1 CN 2014088686 W CN2014088686 W CN 2014088686W WO 2016000353 A1 WO2016000353 A1 WO 2016000353A1
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- Prior art keywords
- film transistor
- thin film
- ground line
- driving circuit
- layer structure
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- 239000000758 substrate Substances 0.000 title claims abstract description 61
- 239000010409 thin film Substances 0.000 claims abstract description 88
- 238000000034 method Methods 0.000 claims abstract description 17
- 230000008569 process Effects 0.000 claims abstract description 12
- 239000000463 material Substances 0.000 claims description 20
- 238000000059 patterning Methods 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 abstract description 17
- 239000011799 hole material Substances 0.000 description 19
- 238000007590 electrostatic spraying Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- 238000005507 spraying Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000005684 electric field Effects 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 230000006698 induction Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
Definitions
- Embodiments of the present invention relate to a display substrate and a display device.
- OLED Organic Light Emitting Diode
- AMOLED Active Matrix/Organic Light Emitting Diode
- the company introduced a 55-inch AMOLED TV and even introduced a curved AMOLED TV for better visual effects.
- White OLEDs for lighting will be a strong contender for next-generation solid-state lighting.
- the solution-type hole injecting material needs to be coated by electrostatic spraying, and a strong electric field is required due to the electrostatic spraying method, so that a solution-type hole injecting material sprayed onto the thin film transistor substrate may occur.
- the charging causes charge to accumulate on the thin film transistor to affect the thin film transistor, resulting in electrical drift.
- Embodiments of the present invention provide a display substrate and a display device, which solve the problem that the threshold voltage in the thin film transistor changes and the electrical drift occurs when the organic electroluminescent display is fabricated in the prior art, and the thin film transistor is avoided.
- the electrical influence increases the stability of the performance of the product and reduces the production cost.
- a display substrate comprising a thin film transistor and a ground line, wherein:
- ground line One end of the ground line is connected to the thin film transistor, and the other end of the ground line is grounded.
- the ground line is formed simultaneously with the conductive layer structure of the thin film transistor during fabrication of the thin film transistor.
- the conductive layer structure of the thin film transistor includes a gate layer structure, a source layer structure, and a drain layer structure, the ground line and the gate layer structure, the source layer structure, and the drain layer structure At least one of them is disposed on the same layer and formed using the same material.
- one end of the ground line is connected to the source driving circuit or the drain driving circuit, and the source driving circuit or the drain driving circuit is connected to the thin film transistor to make One end of the ground line is connected to the thin film transistor;
- the ground line is formed by the one-time patterning process with the source layer structure or the drain layer structure.
- one end of the ground line is connected to the gate driving circuit, and the gate driving circuit is connected to the thin film transistor such that one end of the ground line is connected to the thin film transistor;
- the ground line is formed by the one-time patterning process with the gate layer structure.
- a portion of the source driving circuit or the drain driving circuit that is connected to the ground line is exposed.
- a portion of the gate drive circuit that is connected to the ground line is exposed.
- the ground line is used to protect an electrical signal on the thin film transistor from external electrical signals.
- a display device comprising the display substrate of any of the first aspects.
- the display substrate and the display device thereof provided by the embodiments of the present invention solve the problem that the threshold value in the thin film transistor occurs in the prior art when the organic electroluminescent display is fabricated by grounding the thin film transistor on the display substrate in the display device.
- the voltage changes, causing the problem of electrical drift, avoiding the influence on the electrical properties of the thin film transistor, improving the stability of the performance of the product, and reducing the growth. Production cost.
- FIG. 1 is a schematic structural view of a thin film transistor in a display substrate having a ground line according to an embodiment of the present invention
- FIG. 2 is a schematic structural diagram of another thin film transistor in a display substrate having a ground line according to an embodiment of the present invention
- FIG. 3 is a schematic structural view of a thin film transistor in a display substrate having a grounding line according to an embodiment of the present invention
- FIG. 4 is a schematic structural diagram of a thin film transistor in a display substrate having a ground line according to another embodiment of the present invention.
- FIG. 5 is a schematic diagram showing the effect of electrostatically spraying a hole injecting material on the electrical properties of a thin film transistor when no grounding treatment is performed on a thin film transistor substrate according to an embodiment of the present invention
- FIG. 6 is a schematic diagram showing the effect of electrostatically spraying a hole injection material on the electrical properties of a thin film transistor after a grounding treatment on a thin film transistor substrate according to an embodiment of the present invention.
- the display substrate includes: a thin film transistor 1 and a ground line 2, wherein:
- ground line 2 One end of the ground line 2 is connected to the thin film transistor 1, and the other end of the ground line 2 is grounded.
- the grounding line is a conductive layer structure of the thin film transistor in the process of forming a thin film transistor Formed at the same time.
- a location on a thin film transistor suitable for connecting a ground line without affecting other layer structures on the display substrate can be selected to connect the ground line.
- the ground line may be formed simultaneously with the corresponding layer structure in the process of forming the gate layer structure, the source layer structure, and the drain layer structure of the thin film transistor.
- the ground line is disposed in the same layer as at least one of the gate layer structure, the source layer structure, and the drain layer structure and is formed using the same material.
- the ground line and at least one of the gate layer structure, the source layer structure, and the drain layer structure are formed in the same process step or patterning step.
- the display substrate provided by the embodiment of the present invention performs grounding treatment on the thin film transistor on the display substrate in the display device, so that when the hole injecting material is coated on the substrate by electrostatic spraying in a high electric field environment, even if it is sprayed
- the solution-type hole injecting material on the thin film transistor substrate is charged, and the charge generated by the induction on the thin film transistor can be derived through the grounding line connected to the thin film transistor, so that the threshold voltage and the current value remain unchanged, and the prior art is solved.
- the threshold voltage in the thin film transistor changes, causing electrical drift, avoiding the influence on the electrical properties of the thin film transistor, improving the stability of the performance of the product, and reducing the production cost.
- ground line 2 is used to protect the electrical signal on the thin film transistor 1 from external electrical signals.
- the display substrate further includes: a source driving circuit 3 and a drain driving circuit 5, wherein:
- one end of the ground line 2 is connected to the source driving circuit 3, and the source driving circuit 3 is connected to the thin film transistor 1.
- one end of a ground line 2 is connected to the source driving circuit 3
- the source driving circuit 3 is connected to the thin film transistor 1
- the other end of the grounding line 2 is connected to the drain driving circuit 5, and the drain driving circuit is connected.
- 5 is connected to the thin film transistor 1.
- the ground line 2 is formed by a patterning process with a source electrode (source layer structure) or a drain electrode (drain layer structure).
- the ground line may be formed by a patterning process using exposure, development, and etching using a mask when fabricating the source and drain electrodes of the thin film transistor. In this way, there is no additional production process in the production process, and thus the production cost is not increased.
- a portion of the source driving circuit 3 or the drain driving circuit 5 that is connected to the ground line 2 is exposed.
- the portion of the source drive circuit or the drain drive circuit on the display substrate that is exposed outside is connected to the ground line.
- the source driving circuit or the drain driving circuit is connected to the thin film transistor on the display substrate.
- the wiring is still connected to the thin film transistor. Selecting the portion of the source driving circuit or the drain driving circuit that is exposed outside is connected to the grounding line, which makes it more convenient in practical applications and facilitates grounding treatment at the other end of the wiring line.
- the hole injecting material is still coated on the substrate by electrostatic spraying. At this time, although the hole injecting material sprayed onto the substrate of the thin film transistor is charged, the source driving circuit or the drain is used. A ground line is connected to the pole drive circuit. Therefore, the electric charge accumulated on the substrate when the electrostatic spray coating of the hole material can be derived through the ground line connected to the source driving circuit or the drain driving circuit, thereby avoiding the electrical drift of the accumulated charge on the thin film transistor, effectively The effect on the electrical properties of the thin film transistor is reduced.
- the display substrate further includes: a gate driving circuit 4, wherein:
- ground line 2 is connected to the gate drive circuit 4, and the gate drive circuit 4 is connected to the thin film transistor 1.
- the ground line 2 is formed by a patterning process with a gate electrode (gate layer structure).
- the ground line and the gate electrode may be formed by using a mask plate when forming a gate electrode of the thin film transistor, and performing a patterning process by exposure, development, and etching. In this way, there is no additional production process in the production process, and thus the production cost is not increased.
- a portion of the gate driving circuit 4 that is connected to the ground line 2 is exposed.
- the portion of the gate drive circuit on the display substrate that is exposed to the outside of the circuit structure is connected to the ground line.
- the gate driving circuit is connected to the thin film transistor on the display substrate.
- the wiring is still connected to the thin film transistor.
- the circuit portion of the gate driving circuit that is exposed to the outside is connected to the ground line, which makes it more convenient in practical applications and facilitates grounding treatment at the other end of the wiring line.
- the hole injecting material is still coated on the substrate by electrostatic spraying. At this time, although the hole injecting material sprayed onto the substrate of the thin film transistor is charged, the connection is made on the gate driving circuit. There is a ground line. Therefore, the electric charge accumulated on the substrate when the electrostatic spray coating of the hole material can be derived through the ground line connected to the gate driving circuit, thereby The electrical drift caused by the accumulated charge on the thin film transistor is avoided, and the influence on the electrical properties of the thin film transistor is effectively reduced.
- the grounding circuit when the grounding circuit is not connected to the display substrate in the prior art solution, as shown in FIG. 5, the influence of the electrical properties of the thin film transistor can be obtained, and the gate voltage and the source current are severely affected by the hole. The change in the effect of the injected material.
- a ground line is connected to the thin film transistor, as shown in FIG. 6, which is an influence on the electrical properties of the thin film transistor, and a change in the gate voltage and the source current can be obtained.
- the threshold voltage is shifted by 2 volts positively, and the off current is increased by 1 to 2 orders of magnitude.
- the threshold voltage is shifted to a negative offset of 0.3 volts, and the off current remains unchanged. Therefore, it can be clearly obtained that after adding a grounding setting to the thin film transistor substrate, the influence on the electrical properties of the thin film transistor is small, and within an acceptable error range, the influence on the electrical properties of the thin film transistor is negligible.
- the grounding circuit is only connected to the drain driving circuit or the gate driving circuit.
- the specific manufacturing method of the grounding line is the same as that in the embodiment, and the grounding circuit and the drain driving circuit or the gate are used.
- the connection structure of the driving circuit is also the same as the corresponding structure in this embodiment, and details are not described herein again.
- grounding treatment of the other end of the grounding line in the embodiment of the present invention is generally implemented by connecting the other end of the grounding line to the outer casing of the entire device.
- the grounding function can be realized only by the outer casing of the connecting device, and any design that can realize the grounding function and is easy to implement can be applied in practical applications.
- the display substrate provided by the embodiment of the present invention performs grounding treatment on the thin film transistor on the display substrate in the display device, so that when the hole injecting material is coated on the substrate by electrostatic spraying in a high electric field environment, even if it is sprayed
- the solution-type hole injecting material on the thin film transistor substrate is charged, and the charge generated by the induction on the thin film transistor can be derived through the grounding line connected to the thin film transistor, so that the threshold voltage and the current value remain unchanged, and the prior art is solved.
- the threshold voltage in the thin film transistor changes, causing electrical drift, avoiding the influence on the electrical properties of the thin film transistor, improving the stability of the performance of the product, and reducing the production cost.
- Embodiments of the present invention provide a display device including any of the display substrates in the embodiments corresponding to FIGS. 1 to 4.
- the display device can be: a smartphone, a tablet, a tablet Any product or component that has a display function, such as a television, a notebook computer, a digital photo frame, and a navigator.
- the display device provided by the embodiment of the present invention performs grounding treatment on the thin film transistor on the display substrate in the display device, so that when the hole injecting material is coated on the substrate by electrostatic spraying in a high electric field environment, even if the spraying
- the solution-type hole injecting material on the thin film transistor substrate is charged, and the charge generated by the induction on the thin film transistor can be derived through the ground line connected to the thin film transistor, so that the threshold voltage and the current value remain unchanged, and the prior art is solved.
- the threshold voltage in the thin film transistor changes, and the electrical drift occurs, which avoids the influence on the electrical properties of the thin film transistor, improves the stability of the performance of the product, and reduces the production cost.
- the foregoing program may be stored in a computer readable storage medium, and the program is executed when executed.
- the foregoing steps include the steps of the foregoing method embodiments; and the foregoing storage medium includes: a medium that can store program codes, such as a ROM, a RAM, a magnetic disk, or an optical disk.
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Abstract
Description
本发明的实施例涉及一种显示基板及显示装置。Embodiments of the present invention relate to a display substrate and a display device.
有机发光二极管(Organic Light Emitting Diode，简称OLED)具有主动发光、全固态、驱动电压低、效率高、响应速度快、视角宽、制作工艺简单及可实现大面积和柔性显示等优点，在平板显示及照明方面有着广阔的应用前景，从诞生之日起就引起了学术界及工业界的强烈关注。经过技术的不断发展，小尺寸的主动矩阵有机发光二极管(Active Matrix/Organic Light Emitting Diode，简称AMOLED)显示屏已经在高端手机及平板电脑上率先获得应用；在大尺寸的应用上，三星电子等公司推出了55英寸的AMOLED电视，甚至于推出了曲面的AMOLED电视以获得更好的视觉效果。白光OLED用于照明将成为下一代固态照明的有力竞争者。但是，由于OLED的效率和寿命还有待改善，OLED在照明应用上的规模量产还没有实现。现有的制造有机电致发光显示器时，由于溶液型空穴注入材料对颗粒的包覆效果较好，因此一般采用在薄膜晶体管基板上涂布溶液型空穴注入材料来降低器件短路，提高产品的寿命和生产率。Organic Light Emitting Diode (OLED) has the advantages of active illumination, all solid state, low driving voltage, high efficiency, fast response, wide viewing angle, simple manufacturing process, large area and flexible display, etc. And lighting has a broad application prospects, which has aroused strong attention from academia and industry since its birth. Through the continuous development of technology, the small-size Active Matrix/Organic Light Emitting Diode (AMOLED) display has been first used in high-end mobile phones and tablets; in large-size applications, Samsung Electronics, etc. The company introduced a 55-inch AMOLED TV and even introduced a curved AMOLED TV for better visual effects. White OLEDs for lighting will be a strong contender for next-generation solid-state lighting. However, due to the improvement in the efficiency and longevity of OLEDs, the mass production of OLEDs in lighting applications has not yet been realized. In the prior art for manufacturing an organic electroluminescent display, since the solution-type hole injecting material has a good coating effect on the particles, a solution-type hole injecting material is generally coated on the thin film transistor substrate to reduce the short circuit of the device and improve the product. Life and productivity.
但是，现有技术方案中涂布溶液型空穴注入材料需要利用静电喷洒的方式涂布，由于静电喷洒方式需要较强的电场，这样会出现喷洒到薄膜晶体管基板上的溶液型空穴注入材料带电，使得电荷累积在薄膜晶体管上从而对薄膜晶体管造成影响，产生电性漂移。However, in the prior art, the solution-type hole injecting material needs to be coated by electrostatic spraying, and a strong electric field is required due to the electrostatic spraying method, so that a solution-type hole injecting material sprayed onto the thin film transistor substrate may occur. The charging causes charge to accumulate on the thin film transistor to affect the thin film transistor, resulting in electrical drift.
发明内容Summary of the invention
本发明的实施例提供一种显示基板及显示装置，解决了现有技术在制作有机电致发光显示器时会出现薄膜晶体管中的阈值电压发生变化，产生电性漂移的问题，避免了对薄膜晶体管的电性的影响，提高了产品的性能的稳定性，降低了生产成本。 Embodiments of the present invention provide a display substrate and a display device, which solve the problem that the threshold voltage in the thin film transistor changes and the electrical drift occurs when the organic electroluminescent display is fabricated in the prior art, and the thin film transistor is avoided. The electrical influence increases the stability of the performance of the product and reduces the production cost.
本发明的实施例包括如下技术方案：Embodiments of the present invention include the following technical solutions:
第一方面，提供一种显示基板，所述显示基板包括薄膜晶体管以及接地线路，其中：In a first aspect, a display substrate is provided, the display substrate comprising a thin film transistor and a ground line, wherein:
所述接地线路的一端连接在所述薄膜晶体管上，所述接地线路的另一端进行接地处理。One end of the ground line is connected to the thin film transistor, and the other end of the ground line is grounded.
在一个示例中，所述接地线路是在制作形成所述薄膜晶体管的过程中与所述薄膜晶体管的导电层结构同时形成的。In one example, the ground line is formed simultaneously with the conductive layer structure of the thin film transistor during fabrication of the thin film transistor.
在一个示例中，所述薄膜晶体管的导电层结构包括栅极层结构、源极层结构和漏极层结构，所述接地线路与所述栅极层结构、源极层结构和漏极层结构中的至少之一设置在同一层且使用相同的材料形成。In one example, the conductive layer structure of the thin film transistor includes a gate layer structure, a source layer structure, and a drain layer structure, the ground line and the gate layer structure, the source layer structure, and the drain layer structure At least one of them is disposed on the same layer and formed using the same material.
在一个示例中，所述接地线路的一端与所述源极驱动电路或所述漏极驱动电路连接，所述源极驱动电路或所述漏极驱动电路与所述薄膜晶体管连接，以使所述接地线路的一端连接在所述薄膜晶体管上；In one example, one end of the ground line is connected to the source driving circuit or the drain driving circuit, and the source driving circuit or the drain driving circuit is connected to the thin film transistor to make One end of the ground line is connected to the thin film transistor;
所述接地线路是与所述源极层结构或所述漏极层结构通过一次构图工艺形成的。The ground line is formed by the one-time patterning process with the source layer structure or the drain layer structure.
在一个示例中，所述接地线路的一端与所述栅极驱动电路连接，所述栅极驱动电路与所述薄膜晶体管连接，以使所述接地线路的一端连接在所述薄膜晶体管上；In one example, one end of the ground line is connected to the gate driving circuit, and the gate driving circuit is connected to the thin film transistor such that one end of the ground line is connected to the thin film transistor;
所述接地线路是与所述栅极层结构通过一次构图工艺形成的。The ground line is formed by the one-time patterning process with the gate layer structure.
在一个示例中，所述源极驱动电路或所述漏极驱动电路中与所述接地线路连接的部分裸露。In one example, a portion of the source driving circuit or the drain driving circuit that is connected to the ground line is exposed.
在一个示例中，所述栅极驱动电路中与所述接地线路连接的部分裸露。In one example, a portion of the gate drive circuit that is connected to the ground line is exposed.
在一个示例中，所述接地线路，用于保护所述薄膜晶体管上的电信号不受外界电信号的影响。In one example, the ground line is used to protect an electrical signal on the thin film transistor from external electrical signals.
第二方面，提供一种显示装置，所述显示装置包括第一方面中任一所述的显示基板。In a second aspect, a display device is provided, the display device comprising the display substrate of any of the first aspects.
本发明的实施例提供的显示基板及其显示装置，通过对显示装置中的显示基板上的薄膜晶体管进行接地处理，解决了现有技术在制作有机电致发光显示器时会出现薄膜晶体管中的阈值电压发生变化，产生电性漂移的问题，避免了对薄膜晶体管的电性的影响，提高了产品的性能的稳定性，降低了生 产成本。The display substrate and the display device thereof provided by the embodiments of the present invention solve the problem that the threshold value in the thin film transistor occurs in the prior art when the organic electroluminescent display is fabricated by grounding the thin film transistor on the display substrate in the display device. The voltage changes, causing the problem of electrical drift, avoiding the influence on the electrical properties of the thin film transistor, improving the stability of the performance of the product, and reducing the growth. Production cost.
为了更清楚地说明本发明实施例的技术方案，下面将对实施例的附图作简单地介绍，显而易见地，下面描述中的附图仅仅涉及本发明的一些实施例，而非对本发明的限制。In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings of the embodiments will be briefly described below. It is obvious that the drawings in the following description relate only to some embodiments of the present invention, and are not intended to limit the present invention. .
图1为本发明的实施例提供的一种显示基板中的薄膜晶体管上具有接地线路的结构示意图；1 is a schematic structural view of a thin film transistor in a display substrate having a ground line according to an embodiment of the present invention;
图2为本发明的实施例提供的另一种显示基板中的薄膜晶体管上具有接地线路的结构示意图；FIG. 2 is a schematic structural diagram of another thin film transistor in a display substrate having a ground line according to an embodiment of the present invention; FIG.
图3为本发明的实施例提供的又一种显示基板中的薄膜晶体管上具有接地线路的结构示意图；3 is a schematic structural view of a thin film transistor in a display substrate having a grounding line according to an embodiment of the present invention;
图4为本发明的另一实施例提供的一种显示基板中的薄膜晶体管上具有接地线路的结构示意图；4 is a schematic structural diagram of a thin film transistor in a display substrate having a ground line according to another embodiment of the present invention;
图5为本发明的实施例提供的薄膜晶体管基板上无接地处理时静电喷洒方式涂布空穴注入材料对薄膜晶体管的电性的影响示意图；FIG. 5 is a schematic diagram showing the effect of electrostatically spraying a hole injecting material on the electrical properties of a thin film transistor when no grounding treatment is performed on a thin film transistor substrate according to an embodiment of the present invention; FIG.
图6为本发明的实施例提供的薄膜晶体管基板上有接地处理后静电喷洒方式涂布空穴注入材料对薄膜晶体管的电性的影响示意图。FIG. 6 is a schematic diagram showing the effect of electrostatically spraying a hole injection material on the electrical properties of a thin film transistor after a grounding treatment on a thin film transistor substrate according to an embodiment of the present invention.
为使本发明实施例的目的、技术方案和优点更加清楚，下面将结合本发明实施例的附图，对本发明实施例的技术方案进行清楚、完整地描述。显然，所描述的实施例是本发明的一部分实施例，而不是全部的实施例。基于所描述的本发明的实施例，本领域普通技术人员在无需创造性劳动的前提下所获得的所有其他实施例，都属于本发明保护的范围。The technical solutions of the embodiments of the present invention will be clearly and completely described in the following with reference to the accompanying drawings. It is apparent that the described embodiments are part of the embodiments of the invention, and not all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the described embodiments of the present invention without departing from the scope of the invention are within the scope of the invention.
本发明的实施例提供一种显示基板，参照图1所示，该显示基板包括：薄膜晶体管1和接地线路2，其中：An embodiment of the present invention provides a display substrate. Referring to FIG. 1, the display substrate includes: a
接地线路2的一端连接在薄膜晶体管1上，接地线路2的另一端进行接地处理。One end of the
接地线路是在制作形成薄膜晶体管的过程中与薄膜晶体管的导电层结构 同时形成的。The grounding line is a conductive layer structure of the thin film transistor in the process of forming a thin film transistor Formed at the same time.
例如，在实际的应用中可以选择薄膜晶体管上的适合连接接地线路但不影响显示基板上的其它层结构的位置来连接接地线路。接地线路具体的可以是在形成薄膜晶体管的栅极层结构、源极层结构、漏极层结构的过程中与对应的层结构同时形成的。例如，所述接地线路与所述栅极层结构、源极层结构和漏极层结构中的至少之一设置在同一层且使用相同的材料形成。例如，所述接地线路与所述栅极层结构、源极层结构和漏极层结构中的至少之一为在同一工艺步骤或图案化步骤中形成。For example, in a practical application, a location on a thin film transistor suitable for connecting a ground line without affecting other layer structures on the display substrate can be selected to connect the ground line. Specifically, the ground line may be formed simultaneously with the corresponding layer structure in the process of forming the gate layer structure, the source layer structure, and the drain layer structure of the thin film transistor. For example, the ground line is disposed in the same layer as at least one of the gate layer structure, the source layer structure, and the drain layer structure and is formed using the same material. For example, the ground line and at least one of the gate layer structure, the source layer structure, and the drain layer structure are formed in the same process step or patterning step.
本发明的实施例提供的显示基板，通过将显示装置中的显示基板上的薄膜晶体管进行接地处理，这样在高电场环境下采用静电喷洒方式给基板上涂布空穴注入材料时，即使喷洒到薄膜晶体管基板上的溶液型空穴注入材料带电，通过薄膜晶体管上连接的接地线路可以将薄膜晶体管上因感应生成的电荷导出，使得阈值电压和电流值保持不变，解决了现有技术在制作有机电致发光显示器时会出现薄膜晶体管中的阈值电压发生变化，产生电性漂移的问题，避免了对薄膜晶体管的电性的影响，提高了产品的性能的稳定性，降低了生产成本。The display substrate provided by the embodiment of the present invention performs grounding treatment on the thin film transistor on the display substrate in the display device, so that when the hole injecting material is coated on the substrate by electrostatic spraying in a high electric field environment, even if it is sprayed The solution-type hole injecting material on the thin film transistor substrate is charged, and the charge generated by the induction on the thin film transistor can be derived through the grounding line connected to the thin film transistor, so that the threshold voltage and the current value remain unchanged, and the prior art is solved. In the organic electroluminescent display, there is a problem that the threshold voltage in the thin film transistor changes, causing electrical drift, avoiding the influence on the electrical properties of the thin film transistor, improving the stability of the performance of the product, and reducing the production cost.
进一步，接地线路2，用于保护薄膜晶体管1上的电信号不受外界电信号的影响。Further, the
例如，显示基板上还包括：源极驱动电路3和漏极驱动电路5，其中：For example, the display substrate further includes: a
参照图2所示，接地线路2的一端与源极驱动电路3连接，源极驱动电路3与薄膜晶体管1连接。Referring to FIG. 2, one end of the
参照图3所示，一条接地线路2的一端与源极驱动电路3连接，源极驱动电路3与薄膜晶体管1连接；另一条接地线路2的一端与漏极驱动电路5连接，漏极驱动电路5与薄膜晶体管1连接。Referring to FIG. 3, one end of a
接地线路2是与源电极(源极层结构)或漏电极(漏极层结构)通过一次构图工艺形成的。The
例如，接地线路可以是在制作形成薄膜晶体管的源电极和漏电极时使用掩模板，采用曝光、显影、刻蚀通过一次构图工艺形成的。这样，在制作工艺上并没有额外的增加生产工艺，进而不会增加生产成本。For example, the ground line may be formed by a patterning process using exposure, development, and etching using a mask when fabricating the source and drain electrodes of the thin film transistor. In this way, there is no additional production process in the production process, and thus the production cost is not increased.
源极驱动电路3或漏极驱动电路5中与接地线路2连接的部分裸露。
A portion of the
具体的，可以选择显示基板与封装基板对盒完成后，显示基板上的源极驱动电路或漏极驱动电路中裸露在外部的电路结构的部分与接地线路连接。同时，源极驱动电路或漏极驱动电路与显示基板上的薄膜晶体管连接。这样，接线线路仍然是与薄膜晶体管连接的。选择源极驱动电路或漏极驱动电路中裸露在外部的电路部分与接地线路连接，使得在实际应用中更加方便，便于接线线路的另一端进行接地处理。Specifically, after the display substrate and the package substrate are completed, the portion of the source drive circuit or the drain drive circuit on the display substrate that is exposed outside is connected to the ground line. At the same time, the source driving circuit or the drain driving circuit is connected to the thin film transistor on the display substrate. Thus, the wiring is still connected to the thin film transistor. Selecting the portion of the source driving circuit or the drain driving circuit that is exposed outside is connected to the grounding line, which makes it more convenient in practical applications and facilitates grounding treatment at the other end of the wiring line.
在制作有机电致发光显示器时，仍然采用静电喷洒的方式在基板上涂布空穴注入材料，此时虽然喷洒到薄膜晶体管的基板上的空穴注入材料带电，但是由于源极驱动电路或漏极驱动电路上连接有接地线路。因此，可以通过源极驱动电路或漏极驱动电路上连接的接地线路将静电喷洒涂布空穴材料时在基板上累积的电荷导出，从而避免累积的电荷对薄膜晶体管造成的电性飘移，有效的降低了对薄膜晶体管的电性的影响。When the organic electroluminescent display is fabricated, the hole injecting material is still coated on the substrate by electrostatic spraying. At this time, although the hole injecting material sprayed onto the substrate of the thin film transistor is charged, the source driving circuit or the drain is used. A ground line is connected to the pole drive circuit. Therefore, the electric charge accumulated on the substrate when the electrostatic spray coating of the hole material can be derived through the ground line connected to the source driving circuit or the drain driving circuit, thereby avoiding the electrical drift of the accumulated charge on the thin film transistor, effectively The effect on the electrical properties of the thin film transistor is reduced.
进一步可选的，参照图4所示，显示基板上还包括：栅极驱动电路4，其中：Further optionally, referring to FIG. 4, the display substrate further includes: a
接地线路2的一端与栅极驱动电路4连接，栅极驱动电路4与薄膜晶体管1连接。One end of the
接地线路2是与栅电极(栅极层结构)通过一次构图工艺形成的。The
具体的，接地线路和栅电极可以是在制作形成薄膜晶体管的栅电极时使用掩模板，采用曝光、显影、刻蚀通过一次构图工艺形成的。这样，在制作工艺上并没有额外的增加生产工艺，进而不会增加生产成本。Specifically, the ground line and the gate electrode may be formed by using a mask plate when forming a gate electrode of the thin film transistor, and performing a patterning process by exposure, development, and etching. In this way, there is no additional production process in the production process, and thus the production cost is not increased.
栅极驱动电路4中与接地线路2连接的部分裸露。A portion of the
例如，可以选择显示基板与封装基板对盒完成后，显示基板上的栅极驱动电路中裸露在外部的电路结构的部分与接地线路连接。同时，栅极驱动电路与显示基板上的薄膜晶体管连接。这样，接线线路仍然是与薄膜晶体管连接的。选择栅极驱动电路中裸露在外部的电路部分与接地线路连接，使得在实际应用中更加方便，便于接线线路的另一端进行接地处理。For example, after the display substrate and the package substrate are completed, the portion of the gate drive circuit on the display substrate that is exposed to the outside of the circuit structure is connected to the ground line. At the same time, the gate driving circuit is connected to the thin film transistor on the display substrate. Thus, the wiring is still connected to the thin film transistor. The circuit portion of the gate driving circuit that is exposed to the outside is connected to the ground line, which makes it more convenient in practical applications and facilitates grounding treatment at the other end of the wiring line.
在制作有机电致发光显示器时，仍然采用静电喷洒的方式在基板上涂布空穴注入材料，此时虽然喷洒到薄膜晶体管的基板上的空穴注入材料带电，但是由于栅极驱动电路上连接有接地线路。因此，可以通过栅极驱动电路上连接的接地线路将静电喷洒涂布空穴材料时在基板上累积的电荷导出，从而 避免累积的电荷对薄膜晶体管造成的电性飘移，有效的降低了对薄膜晶体管的电性的影响。When the organic electroluminescent display is fabricated, the hole injecting material is still coated on the substrate by electrostatic spraying. At this time, although the hole injecting material sprayed onto the substrate of the thin film transistor is charged, the connection is made on the gate driving circuit. There is a ground line. Therefore, the electric charge accumulated on the substrate when the electrostatic spray coating of the hole material can be derived through the ground line connected to the gate driving circuit, thereby The electrical drift caused by the accumulated charge on the thin film transistor is avoided, and the influence on the electrical properties of the thin film transistor is effectively reduced.
例如，采用现有技术方案中的显示基板即薄膜晶体管上没有连接接地线路时，如图5中所示为对薄膜晶体管的电性的影响，可以得到栅极电压与源极电流严重受到空穴注入材料的影响的变化情况。采用本发明中提供的显示基板，在薄膜晶体管上连接有接地线路，如图6中所示为对薄膜晶体管的电性的影响，可以得到栅极电压和源极电流的变化情况。通过对图5进行分析可知，阈值电压向正偏移2伏，截止电流增加了1～2个数量级；通过对图5进行分析可知，阈值电压向负偏移0.3伏，截止电流保持不变。因此，可以明显的得到给薄膜晶体管基板上增加接地设置之后，对薄膜晶体管的电性的影响很小，在可以接受的误差范围内，因此对薄膜晶体管的电性的影响可以忽略不计。For example, when the grounding circuit is not connected to the display substrate in the prior art solution, as shown in FIG. 5, the influence of the electrical properties of the thin film transistor can be obtained, and the gate voltage and the source current are severely affected by the hole. The change in the effect of the injected material. With the display substrate provided by the present invention, a ground line is connected to the thin film transistor, as shown in FIG. 6, which is an influence on the electrical properties of the thin film transistor, and a change in the gate voltage and the source current can be obtained. By analyzing Fig. 5, the threshold voltage is shifted by 2 volts positively, and the off current is increased by 1 to 2 orders of magnitude. By analyzing Fig. 5, the threshold voltage is shifted to a negative offset of 0.3 volts, and the off current remains unchanged. Therefore, it can be clearly obtained that after adding a grounding setting to the thin film transistor substrate, the influence on the electrical properties of the thin film transistor is small, and within an acceptable error range, the influence on the electrical properties of the thin film transistor is negligible.
当然，本实施例中还包括接地线路只与漏极驱动电路或者栅极驱动电路连接的情况，接地线路的具体制作方法与实施例中的制作方法相同，接地线路与漏极驱动电路或者栅极驱动电路的连接结构也与本实施例中对应的结构相同，此处不再赘述。Of course, in this embodiment, the grounding circuit is only connected to the drain driving circuit or the gate driving circuit. The specific manufacturing method of the grounding line is the same as that in the embodiment, and the grounding circuit and the drain driving circuit or the gate are used. The connection structure of the driving circuit is also the same as the corresponding structure in this embodiment, and details are not described herein again.
需要说明的是，本发明实施例中的接地线路的另一端的接地处理，一般都是通过将接地线路的另一端连接到整个装置的外壳上实现的。当然，此处并不限定只能是通过连接装置的外壳来实现接地功能，在实际的应用中任何可以实现接地功能且易于实现的设计均可以应用。It should be noted that the grounding treatment of the other end of the grounding line in the embodiment of the present invention is generally implemented by connecting the other end of the grounding line to the outer casing of the entire device. Of course, it is not limited here that the grounding function can be realized only by the outer casing of the connecting device, and any design that can realize the grounding function and is easy to implement can be applied in practical applications.
本发明的实施例提供的显示基板，通过将显示装置中的显示基板上的薄膜晶体管进行接地处理，这样在高电场环境下采用静电喷洒方式给基板上涂布空穴注入材料时，即使喷洒到薄膜晶体管基板上的溶液型空穴注入材料带电，通过薄膜晶体管上连接的接地线路可以将薄膜晶体管上因感应生成的电荷导出，使得阈值电压和电流值保持不变，解决了现有技术在制作有机电致发光显示器时会出现薄膜晶体管中的阈值电压发生变化，产生电性漂移的问题，避免了对薄膜晶体管的电性的影响，提高了产品的性能的稳定性，降低了生产成本。The display substrate provided by the embodiment of the present invention performs grounding treatment on the thin film transistor on the display substrate in the display device, so that when the hole injecting material is coated on the substrate by electrostatic spraying in a high electric field environment, even if it is sprayed The solution-type hole injecting material on the thin film transistor substrate is charged, and the charge generated by the induction on the thin film transistor can be derived through the grounding line connected to the thin film transistor, so that the threshold voltage and the current value remain unchanged, and the prior art is solved. In the organic electroluminescent display, there is a problem that the threshold voltage in the thin film transistor changes, causing electrical drift, avoiding the influence on the electrical properties of the thin film transistor, improving the stability of the performance of the product, and reducing the production cost.
本发明的实施例提供一种显示装置，该显示装置中包括附图1～4对应的实施例中的任一显示基板。该显示装置可以为：智能手机、平板电脑、平板 电视机、笔记本电脑、数码相框、导航仪等任何具有显示功能的产品或部件。Embodiments of the present invention provide a display device including any of the display substrates in the embodiments corresponding to FIGS. 1 to 4. The display device can be: a smartphone, a tablet, a tablet Any product or component that has a display function, such as a television, a notebook computer, a digital photo frame, and a navigator.
本发明的实施例提供的显示装置，通过将该显示装置中的显示基板上的薄膜晶体管进行接地处理，这样在高电场环境下采用静电喷洒方式给基板上涂布空穴注入材料时，即使喷洒到薄膜晶体管基板上的溶液型空穴注入材料带电，通过薄膜晶体管上连接的接地线路可以将薄膜晶体管上因感应生成的电荷导出，使得阈值电压和电流值保持不变，解决了现有技术在制作有机电致发光显示器时会出现薄膜晶体管中的阈值电压发生变化，产生电性漂移的问题，避免了对薄膜晶体管的电性的影响，提高了产品的性能的稳定性，降低了生产成本。The display device provided by the embodiment of the present invention performs grounding treatment on the thin film transistor on the display substrate in the display device, so that when the hole injecting material is coated on the substrate by electrostatic spraying in a high electric field environment, even if the spraying The solution-type hole injecting material on the thin film transistor substrate is charged, and the charge generated by the induction on the thin film transistor can be derived through the ground line connected to the thin film transistor, so that the threshold voltage and the current value remain unchanged, and the prior art is solved. When the organic electroluminescent display is fabricated, the threshold voltage in the thin film transistor changes, and the electrical drift occurs, which avoids the influence on the electrical properties of the thin film transistor, improves the stability of the performance of the product, and reduces the production cost.
本领域普通技术人员可以理解：实现上述方法实施例的全部或部分步骤可以通过程序指令相关的硬件来完成，前述的程序可以存储于一计算机可读取存储介质中，该程序在执行时，执行包括上述方法实施例的步骤；而前述的存储介质包括：ROM、RAM、磁碟或者光盘等各种可以存储程序代码的介质。A person skilled in the art can understand that all or part of the steps of implementing the above method embodiments may be completed by using hardware related to the program instructions. The foregoing program may be stored in a computer readable storage medium, and the program is executed when executed. The foregoing steps include the steps of the foregoing method embodiments; and the foregoing storage medium includes: a medium that can store program codes, such as a ROM, a RAM, a magnetic disk, or an optical disk.
以上所述仅是本发明的示范性实施方式，而非用于限制本发明的保护范围，本发明的保护范围由所附的权利要求确定。The above is only an exemplary embodiment of the present invention, and is not intended to limit the scope of the present invention. The scope of the present invention is defined by the appended claims.
本申请要求于2014年6月30日递交的中国专利申请第201410307881.1号的优先权，在此全文引用上述中国专利申请公开的内容以作为本申请的一部分。 The present application claims the priority of the Chinese Patent Application No. 201410307881.1 filed on Jun. 30, 2014, the entire disclosure of which is hereby incorporated by reference.
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| CN102655148A (en) * | 2012-03-20 | 2012-09-05 | 京东方科技集团股份有限公司 | Thin film transistor (TFT) substrate, preparation method of TFT substrate, liquid crystal display (LCD) device and electronic paper display device |
| CN103064225A (en) * | 2013-01-29 | 2013-04-24 | 京东方科技集团股份有限公司 | Array substrate and manufacturing method thereof as well as display device |
| CN104091819A (en) * | 2014-06-30 | 2014-10-08 | 京东方科技集团股份有限公司 | Display substrate and display device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104091819B (en) | 2018-02-13 |
| CN104091819A (en) | 2014-10-08 |
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