+

WO2013008567A1 - Circuit imprimé souple, procédé de fabrication de ce circuit imprimé, courbure et dispositif électronique - Google Patents

Circuit imprimé souple, procédé de fabrication de ce circuit imprimé, courbure et dispositif électronique Download PDF

Info

Publication number
WO2013008567A1
WO2013008567A1 PCT/JP2012/064865 JP2012064865W WO2013008567A1 WO 2013008567 A1 WO2013008567 A1 WO 2013008567A1 JP 2012064865 W JP2012064865 W JP 2012064865W WO 2013008567 A1 WO2013008567 A1 WO 2013008567A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
insulating layer
terminal
connection pad
base
Prior art date
Application number
PCT/JP2012/064865
Other languages
English (en)
Japanese (ja)
Inventor
辰珠 朴
上田　宏
正也 柿本
Original Assignee
住友電工プリントサーキット株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 住友電工プリントサーキット株式会社 filed Critical 住友電工プリントサーキット株式会社
Publication of WO2013008567A1 publication Critical patent/WO2013008567A1/fr

Links

Images

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
    • G11B5/4846—Constructional details of the electrical connection between arm and support
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
    • G11B5/4853—Constructional details of the electrical connection between head and arm
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
    • G11B5/486—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives with provision for mounting or arranging electrical conducting means or circuits on or along the arm assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks

Definitions

  • the present invention relates to a flexible printed circuit (FPC), a manufacturing method thereof, a flexure, and an electronic device. More specifically, the present invention relates to a flexible printed wiring board having connection pads in which connection terminals are arranged at high density, a manufacturing method thereof, a flexure for transmitting signals of magnetic elements of a hard disk drive, and an electronic device. It is.
  • FPC flexible printed circuit
  • flexures which are flexible printed wiring boards that are used in hard disk drives (HDDs) and transmit signals from magnetic heads (for example, Patent Documents 1 to 3).
  • the flexure is required to have not only electrical properties, but also delicate elastic properties such as mechanical properties for using an airflow flowing through a minute space between a magnetic head and a CD.
  • the HDD is always required to be downsized in the electronic device. For this reason, the arrangement of magnetic heads is constantly increasing in density.
  • the flexure is composed of a suspension metal plate that is supported with a predetermined elasticity, a base insulating layer, a conductive layer that forms wiring and terminals, and a cover insulating layer.
  • an opening is formed in the connection pad to expose the terminal.
  • the terminal is exposed, and a two-layered plating layer including an Ni layer and an Au layer is formed on the exposed terminal, and is soldered to a terminal such as a head slider on which the magnetic head is disposed.
  • FIG. 5A is a plan view
  • FIG. 5B is a cross-sectional view taken along line VB-VB.
  • connection pad portion K all the terminals 103 are exposed from the insulating cover layer 104 and extend in parallel on the metal plate 101 / base insulating layer 102 toward the terminals on the head slider side.
  • the cover insulating layer 104 covers only the wiring pattern 111 connected to the terminal 103 in an extreme case.
  • the Ni / Au two-layer plating 103 a is formed on the entire terminal 103 exposed from the cover insulating layer 104.
  • 6A to 6C show a method of manufacturing the flexure shown in FIGS. 5A and 5B.
  • the base insulating layer 102 and the cover insulating layer 104 are in contact with each other. At that location, as shown in FIG.
  • connection structure of the flexible printed wiring board In electronic devices, there is always a demand for downsizing the connection structure of the flexible printed wiring board, and it is important to ensure insulation between the wirings in the connection pad portion, not limited to the above flexure. That is, generally, a flexible printed wiring board is required to have a structure that can reliably maintain insulation between terminals of the connection pad portion.
  • the present invention provides a flexible printed wiring board, a manufacturing method thereof, a flexure, and an electronic device that can ensure insulation between terminals in a connection pad portion in which a plurality of terminals are arranged at high density. Objective.
  • the flexible printed wiring board of the present invention includes a connection pad portion.
  • the flexible printed wiring board includes a metal plate, a base insulating layer, a wiring pattern for forming a wiring or the like in contact with the base insulating layer, and a cover insulating layer covering the wiring pattern.
  • a plurality of terminals extending from the wiring pattern and terminating on the base insulating layer are arranged.
  • the insulating cover layer covers the terminal end of the terminal and the wiring pattern on the base side of the terminal together with the surrounding insulating base layer, and the insulating cover layer corresponds to the terminal.
  • the terminal is exposed only in the opening that is opened at, and the bottom surface of the opening is constituted only by the upper surface of the terminal. Further, the end face of the insulating cover layer and the end face of the insulating base layer are aligned to form the end face of the connection pad portion.
  • connection pad part there is no common opening part in a connection pad part, and an opening part (window) is provided for every terminal. For this reason, one terminal is located in one opening, and the upper surface of the one terminal forms the bottom of the opening.
  • the connection partner is soldered to the bottom surface of the opening for each electrode, for example. Therefore, in the connection pad part, the opening part provided in one terminal is located in a line. As a result, even if the distance between the terminals is reduced to form a high-density array, it is possible to prevent a short circuit from occurring between adjacent terminals. Moreover, the durability of the entire connection pad portion can be improved.
  • the insulating cover layer is different from the insulating base layer in the cross-linked state (polymerization progress state), for example, so that it is not necessary to pattern only the insulating cover layer by development. That is, the insulating base layer need not be a removal (development) stopper for the removal (patterning) of the insulating cover layer.
  • the end of the connection pad portion may be removed by etching the cover insulating layer and the base insulating layer together. For this reason, it is not necessary to use photosensitive polyimide or a special developer for patterning the insulating cover layer, and the cost of the material can be reduced. A great man-hour reduction can be obtained in terms of man-hours.
  • the end of the metal plate is preferably located away from the end surface of the connection pad portion, and the back surface of the base insulating layer is exposed at the end of the back surface of the connection pad portion.
  • the openings may have an arrangement pitch of 150 ⁇ m or less and a length along the extending direction of the wiring of the openings of 75 ⁇ m or less.
  • the terminal arrangement of the connection pad portion is also increased in density, and the terminals are also miniaturized.
  • a flexible printed wiring board including the connection pad portion having the above-described structure is extremely effective in securing insulation between terminals. That is, in the case of the connection pads having the above arrangement pitch and terminal length, good insulation is secured in the flexible printed wiring board of the present invention, which is preferably applied.
  • the main component of the resin layer forming the cover insulating layer can be a non-photosensitive resin.
  • the insulating base layer as a stopper for removing the insulating cover layer with a developer in patterning the insulating cover layer.
  • a photosensitive resin for the cover insulating layer it is not necessary to use a photosensitive resin for the cover insulating layer.
  • the cover insulating layer and the base insulating layer can be patterned by etching in a simple and clear process using a non-photosensitive resin for the cover insulating layer. As a result, it is not necessary to use an expensive photosensitive resin or a developer thereof, and the manufacturing process can be simplified, so that material costs, man-hours, and manufacturing time can be reduced.
  • the insulating cover layer contains a non-photosensitive polyimide precursor ink as a non-photosensitive resin liquid.
  • the insulating cover layer contains 3,3 ′, 4,4′-biphenyltetracarboxylic anhydride (BPDA) as a main component, pyromellitic dianhydride (PMDA) as an acid component.
  • BPDA 4,4′-biphenyltetracarboxylic anhydride
  • PMDA pyromellitic dianhydride
  • the insulating cover layer has p-phenylenediamine (PDA), 2,2′-dimethyl-4,4′-diaminobiphenyl (mTBHG), and 2,2′-bis (trifluoromethyl) -4, as diamine components.
  • 4'-diaminobiphenyl (TFMB) can be included.
  • etching properties essential in the present manufacturing method by using a flexible polyimide resin and setting the thermal expansion coefficient within a predetermined range (15 ppm / ° C. to 20 ppm / ° C.).
  • Any property is a property of the polyimide resin after the curing treatment.
  • Etchability is very important because, at the same etching opportunity, an opening is provided in the insulating cover layer and the end face of the insulating cover layer / base insulating layer is formed. In particular, the opening can be formed on the terminal with high accuracy by ensuring good etching properties by the monomer composition and an etching stopper by metal (terminal).
  • the non-photosensitive polyimide precursor ink can include 1,3-bis (3-aminopropyl) tetramethyldisiloxane (APDS).
  • APDS 1,3-bis (3-aminopropyl) tetramethyldisiloxane
  • the flexure of the present invention is any one of the above-described flexible printed wiring boards, and is characterized in that it is connected to a magnetic head of a hard disk drive (HDD) at a connection pad portion.
  • HDD hard disk drive
  • the connection pads of the magnetic head and the connection pads of the flexure that are arranged in a high density are connected to each other by the corresponding terminals. It can be connected while securing. Moreover, it can be set as the flexure excellent in economical efficiency.
  • An electronic apparatus includes any one of the flexible printed wiring boards described above.
  • any of the flexible printed wiring boards described above good durability can be obtained while maintaining insulation between terminals arranged at high density. Moreover, since the structure of the connection pad portion itself and the manufacturing process are simplified, high economic efficiency can be obtained.
  • the method for producing a printed wiring board of the present invention produces a flexible printed wiring board having a connection pad portion.
  • the manufacturing method includes a step of preparing a base sheet having a base insulating layer on a metal plate, a step of forming a wiring pattern including a terminal in contact with the base insulating layer, and a cover insulation covering the wiring pattern including the terminal. Forming a layer, applying a non-photosensitive resin liquid so as to overlap the base insulating layer, drying the coated non-photosensitive resin liquid, and then thermally curing the base insulating layer and Etching the heat-cured insulating cover layer.
  • an opening is formed in the insulating cover layer so that the terminal serves as an etching stopper, the terminal forms the bottom surface of the opening, and the end surface of the insulating cover layer and the end surface of the insulating base layer are aligned.
  • the cover insulating layer and the base insulating layer are etched so that the metal plate serves as an etching stopper so as to form the end face of the connection pad portion.
  • the opening on the terminal with respect to the insulating cover layer and the patterning of the insulating base layer / cover insulating layer are performed by etching in parallel.
  • the opening etching stopper is in charge of the terminal, and the base insulating layer / cover insulating layer etching stopper is in charge of the metal plate. Since these stoppers are made of metal and the etching metal / resin selectivity is high, the base insulating layer and the cover insulating layer can be patterned with high accuracy. For this reason, it becomes possible to carry out fine processing (fine patterning) for forming an opening in the insulating cover layer for each terminal with high accuracy.
  • connection pad portion having an arrangement pitch of 200 ⁇ m or less and each terminal length of 75 ⁇ m or less as described above, the desired connection pad portion is obtained unless patterning is performed using such an etching method having high metal / resin selectivity. It ’s difficult.
  • the above etching method it is not necessary to pattern only the cover insulating layer in a region where the base insulating layer and the cover insulating layer are in contact with each other as in the conventional case. That is, the insulating cover layer is formed of a photosensitive resin to be a precursor that is not completely polymerized, the insulating base layer is kept in a stable state after completion of the polymerization, and it is not necessary to pattern only the insulating cover layer by development.
  • the base insulating layer functions as a development stopper.
  • photosensitive resin such as photosensitive polyimide is expensive, and the developer is also expensive.
  • the time restriction of the process is strong and the number of processes increases.
  • the conventional flexible printed wiring board having the structure of the connection pad portion has to be expensive.
  • etching with high metal / resin selectivity it is possible to reduce the material cost, the manufacturing cost, the manufacturing period, and the like while accurately forming the fine and high-density array of openings.
  • the flexible printed wiring board or the like of the present invention it is possible to ensure insulation between terminals in a connection pad portion in which a plurality of terminals are arranged with high density. Further, the material cost and the manufacturing cost can be reduced, and the manufacturing period can be shortened.
  • FIG. 2 is a plan view showing a connection pad portion on the head slider side of the flexure of FIG. 1.
  • FIG. 2 is a cross-sectional view taken along the line IIB-IIB, showing a connection pad portion on the head slider side of the flexure of FIG.
  • It is a perspective view showing the connection pads of the head slider and the flexure, and showing the positional relationship of the connection pads of the head slider and the flexure.
  • It is sectional drawing which shows the connection pad of a head slider and a flexure, and shows the state electrically connected by dripping a solder drop.
  • A is a cross-sectional view showing a state in which a wiring pattern is formed on a metal plate / base insulating layer
  • B is a non-photosensitive polyimide ink for forming a cover insulating layer.
  • Sectional drawing which shows the processed state C is sectional drawing which shows the state which patterned the cover insulating layer and the base insulating layer from the same etching process
  • D is sectional drawing which shows the state which etched the metal plate. It is a top view which shows the connection pad part of the conventional flexure.
  • FIG. 10 is a cross-sectional view taken along line VB-VB, showing a connection pad portion of a conventional flexure.
  • a conventional manufacturing method is shown, A is a cross-sectional view showing a state where a photosensitive polyimide ink for forming a cover insulating layer is applied, B is a cross-sectional view showing a state where the cover insulating layer is patterned by exposure and development, C FIG. 3 is a cross-sectional view showing a state where a base insulating layer is patterned by etching.
  • FIG. 1 is a diagram showing a flexure 10 and a head suspension assembly 50 including the flexure according to an embodiment of the present invention.
  • a head suspension assembly 50 is attached to a carriage arm 19 that rotates the magnetic head along a track of the HDD.
  • the flexure 10 that is a flexible printed wiring board is used to transmit a signal that is input and electromagnetically converted by a magnetic head. For this reason, the flexure 10 is provided from the head slider 20 on which the magnetic head is disposed to the outer peripheral surface of the support shaft at the base of the carriage arm (not shown), and is disposed over the connection substrate unit for connection to the outside.
  • a metal plate 1 having a certain spring elasticity is used for the flexure 10, and a wiring pattern 11 for signal transmission described above is included in an insulating layer.
  • the flexure 10 and other components of the head suspension assembly 50 are provided with a metal material having a certain elasticity so that the head slider 20 floats stably at a predetermined height when a magnetic disk (not shown) rotates and an air current flows. Yes.
  • the flexure 10 includes a connection pad portion K for connecting to an electrode in the magnetic head at an end facing the head slider 20.
  • the feature of this embodiment is the structure and manufacturing method of the connection pad portion K on the magnetic head side of the flexure 10.
  • FIG. 2A and 2B show the connection pad portion K of the flexure 10 in the present embodiment
  • FIG. 2A is a plan view
  • FIG. 2B is a cross-sectional view taken along the line IIB-IIB.
  • the connection pad portion K is covered with the insulating cover layer 4 except for the opening 7. That is, except for the small window 7, it is covered with the insulating cover layer 4.
  • a terminal 3 having an enlarged width is located at the tip of the wiring 11. Although one terminal 3 has one opening (window) 7, the entire area of the opening 7 is set within the area of the terminal 3 in plan view. This is because the terminal 3 is used as an etching stopper when the cover insulating layer 4 is etched, as will be described later in the manufacturing method.
  • connection pad part K is illustrated as follows. This is just an example. A higher density array may be used.
  • Pitch of the openings 7 The same pitch as the terminals, 150 ⁇ m or less, for example, about 100 ⁇ m.
  • Terminal 3 The length in the longitudinal (extending) direction, which is a direction orthogonal to the pitch direction, is, for example, about 100 ⁇ m and the width is about 50 ⁇ m.
  • Opening 7 The length in the longitudinal direction is about 50 ⁇ m, and the length in the width direction is 40 ⁇ m.
  • the arrangement of the terminals 3 and the openings 7 with a pitch of 150 ⁇ m or less is very high density, and is rare as a connection between connection pads of an electronic device that is conductively connected with solder. As can be seen from FIG.
  • connection pad portion K itself can be significantly improved as compared with the conventional connection pad portion shown in FIG.
  • the end surface E can also be made the end surface E by aligning the end surfaces of the cover insulating layer 4 and the base insulating layer 2 by etching using the metal plate 1 as an etching stopper.
  • the formation of the end surface E and the formation of the opening 7 can be performed simultaneously in the same etching opportunity. This etching process will be described in detail later.
  • (F3) As shown in FIG. 2B, the Ni / Au two-layer plating is limited to the bottom surface 7 b of the opening 7. For this reason, the material cost of expensive gold plating can be reduced significantly.
  • the flexure 10 of the present embodiment has many advantages as a manufacturing method including the above (F1) to (F3).
  • FIG. 3A and 3B are diagrams for explaining an example of conductive connection between the connection pad portion K of the flexure 10 and the connection pad 20k of the head slider 20.
  • FIG. FIG. 3A is a perspective view showing the relationship between the position and posture of the connection pad 20k of the head slider 20 and the connection pad portion K of the flexure 10
  • FIG. 3B is a conductive connection between the terminals 3 and 23 by solder 25. It is sectional drawing of the state which carried out.
  • FIGS. 3A and 3B show an example only.
  • the connection pad 20 k of the head slider 20 in the present embodiment is provided on a side surface facing the connection pad portion K of the flexure 10.
  • the terminal 23 of the connection pad 20k of the head slider 20 and the bottom surface 7b of the opening 7 of the flexure 10 or the terminal 3 (3a) are preferably arranged so as to form an intersection angle close to a right angle. As shown in FIG. 3B, when the solder droplets are dropped, the corner concave portion forming the crossing angle is set to the top side, and the molten solder droplet is dropped into the corner concave portion, so that the terminal 3 (3a) and the head slider are dropped.
  • the terminals 23 of the 20 connection pads 20k are conductively connected.
  • FIG. 4 is a diagram showing a method of manufacturing the flexure of the present embodiment, particularly a method of forming the connection pad portion K.
  • a laminate in which the base insulating layer 2 is disposed on the metal plate 1 is prepared, and a wiring pattern layer including the terminals 3 is formed on the base insulating layer 2.
  • a metal foil or a metal thin plate is used, for example, stainless steel, 42 alloy (Fe—Ni alloy) is preferably used.
  • the thickness of the metal plate 1 is preferably, for example, 10 ⁇ m to 60 ⁇ m, particularly 15 ⁇ m to 30 ⁇ m.
  • the base insulating layer 2 it is preferable to use a polyimide resin such as polyimide or polyamideimide, or a polyamide resin in consideration of flexibility, thermal expansion coefficient, and the like.
  • the insulating base layer 2 has a thickness of, for example, 2 ⁇ m to 30 ⁇ m, preferably 5 ⁇ m to 20 ⁇ m.
  • copper, nickel (Ni), gold, solder, or an alloy thereof is used as the conductor layer for forming the wiring pattern layer including the terminals 3, and copper is preferably used.
  • a subtractive method or an additive method may be used, but in order to form a fine pattern with high accuracy, it is preferable to form by an additive method.
  • a seed film made of a conductive thin film (not shown) is formed on the base insulating film 2 by a sputtering method or the like.
  • the seed film is preferably made of chromium or copper.
  • a chromium thin film and a copper thin film are preferably laminated sequentially by sputtering.
  • the thickness of the chromium thin film is preferably about 10 to 60 nm, for example, and the thickness of the copper thin film is preferably about 50 to 200 nm, for example.
  • a resist pattern for plating having a pattern opposite to the wiring pattern is formed on the seed film.
  • the plating resist is formed as a resist pattern by a known method using, for example, a dry film resist.
  • a wiring pattern including the terminals 3 is formed by plating in a region where the plating resist is not formed.
  • the plating may be electrolytic plating or electroless plating, but electrolytic plating is preferable, and electrolytic copper plating is particularly preferable.
  • the thickness of the wiring pattern layer including the terminal by plating, that is, the copper layer is, for example, 2 ⁇ m to 25 ⁇ m, preferably 5 ⁇ m to 20 ⁇ m.
  • the width of the wiring is, for example, 10 ⁇ m to 500 ⁇ m, preferably 30 ⁇ m to 300 ⁇ m.
  • the gap between the wirings is, for example, 10 ⁇ m to 1000 ⁇ m, preferably 10 ⁇ m to 500 ⁇ m.
  • the conventional flexure manufacturing method shown in FIG. 6 is the same as the manufacturing method of the present embodiment until this stage.
  • a cover insulating layer 4 for covering the wiring pattern layer is formed.
  • photosensitive polyimide has been used for the cover insulating layer 4.
  • non-photosensitive polyimide is used for the cover insulating layer 4.
  • the non-photosensitive polyimide ink is applied to the wiring pattern including the terminals 3 and the base insulating layer (polyimide layer) 2.
  • a polyimide layer (cover insulating layer 4) formed from this non-photosensitive polyimide ink through a drying and curing (heating) process has the following characteristics.
  • Diamine component PDA (p-phenylenediamine) and mTBHG (2,2'-dimethyl-4,4'-diaminobiphenyl), TFMB (2,2'-bis (trifluoromethyl) -4,4 ' -Diaminobiphenyl).
  • Component for improving adhesion APDS (1,3-bis (3-aminopropyl) tetramethyldisiloxane) was added.
  • the polyimide ink is coated and then dried and subjected to a thermosetting treatment. The thermal effect treatment is performed by heating to 250 ° C. or higher, for example, heating to 350 ° C.
  • the opening 7 is opened by the same etching, and the end surface E of the connection pad portion K is formed.
  • plasma etching, RIE (Reactive Ion Etching), dry etching such as sputtering, wet etching using a chemical solution, and laser processing can be used.
  • a photosensitive polyimide ink is applied and dried to form the cover insulating layer 104.
  • heating is performed at about 130 ° C. to 150 ° C. so that polyimide crosslinking (polymerization) is not completed in a predetermined region to be removed.
  • the region to be removed is removed and the cover insulating layer 104 is patterned (B in FIG. 6). By this exposure / development, the cover insulating layer 104 is almost removed except for the wiring pattern 111 as shown in FIG. 5A. All of the terminals 103 are exposed.
  • the developer it is preferable to use an organic one and adjust the blending so that the sharpness of patterning becomes high.
  • the insulating base layer 102 is a stable polyimide layer that has been polymerized, whereas the insulating cover layer 104 is an unstable precursor, Pattern.
  • the selectivity of the insulating base layer 102 functioning as a development stopper and the insulating cover layer 104 to be removed is not sufficiently high as the etching selectivity between the metal and the resin.
  • a sufficiently high dimensional accuracy could not be pursued in patterning. In other words, it has been difficult to cope with the recent trend of high-density terminal arrangement by this conventional method.
  • the photosensitive polyimide ink and the developer are considerably more expensive than the non-photosensitive polyimide ink and the etching liquid in the present embodiment, and in the method of the present embodiment, the material cost is in the cover insulating layer and the like. If limited, it can be reduced to about a fraction of the conventional material cost.
  • the base insulating layer 102 is patterned by etching using the metal plate 101 as an etching stopper.
  • the patterning of the base insulating layer 102 using the metal plate 101 as an etching stopper is the same as the patterning of the base insulating layer 2 in the present embodiment.
  • patterning of the insulating cover layer 104 by exposure / development and patterning of the insulating base layer 102 by etching are performed in two stages.
  • the base insulating layer 2 is also etched at the same etching opportunity as the patterning of the cover insulating layer 4 for forming the opening 7 to form the end surface E. Therefore, according to the present embodiment, not only the material cost but also the manufacturing process can be reduced and the manufacturing period can be shortened.
  • opening (window) 7 is formed by opening, for example, an opening (window) 7 having a width of 40 ⁇ m on terminal 3 having a width of 50 ⁇ m. That is, even if the opening 7 is opened without error, the allowable deviation in the width direction is only 5 ⁇ m.
  • Such high-accuracy patterning of the insulating cover layer 4 is impossible by conventional development using a base insulating layer as a stopper. This is possible only by etching using a metal as an etching stopper.
  • the excessively extending metal plate 1 is removed by etching.
  • the end surface 1 e of the metal plate 1 is positioned closer to the opening 7 than the end surface E of the base insulating layer 2 and the cover insulating layer 4.
  • the flexure is exemplified as the flexible printed wiring board.
  • the present invention is not limited to a flexure as long as it has constituent requirements, and may be any other flexible printed wiring board.
  • the flexible printed wiring board and the like of the present invention it is possible to secure insulation between the terminals and enhance the durability of the connection pad part itself in the connection pad part in which a plurality of terminals are arranged with high density.
  • a normal non-photosensitive polyimide or etching method is used without using photosensitive polyimide or a corresponding developer, the material cost can be greatly reduced.
  • the manufacturing process can be omitted, the manufacturing cost can be reduced and the manufacturing period can be shortened.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
  • Supporting Of Heads In Record-Carrier Devices (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)

Abstract

Une couche isolante de protection (4) recouvre la partie bord de chaque borne (3) dans une pastille d'interconnexion (K) et un schéma de câblage (11) du côté base de la borne, une couche isolante de base (2) étant placée autour. La borne est mise à nu uniquement à l'emplacement d'une ouverture (7) qui est pratiquée à l'endroit où la couche isolante de protection (4) se trouve en regard de la borne, et la surface inférieure (7b) de cette ouverture (7) ne comprend que la surface supérieure (3a) de ladite borne. La face terminale de la couche isolante de protection (4) et la face terminale de la couche isolante de base (2) sont alignées de manière à former une face terminale (E) de la pastille d'interconnexion (K).
PCT/JP2012/064865 2011-07-08 2012-06-11 Circuit imprimé souple, procédé de fabrication de ce circuit imprimé, courbure et dispositif électronique WO2013008567A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011151974A JP2013020667A (ja) 2011-07-08 2011-07-08 フレキシブルプリント配線板、その製造方法、フレキシャ、および電子機器
JP2011-151974 2011-07-08

Publications (1)

Publication Number Publication Date
WO2013008567A1 true WO2013008567A1 (fr) 2013-01-17

Family

ID=47505865

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2012/064865 WO2013008567A1 (fr) 2011-07-08 2012-06-11 Circuit imprimé souple, procédé de fabrication de ce circuit imprimé, courbure et dispositif électronique

Country Status (2)

Country Link
JP (1) JP2013020667A (fr)
WO (1) WO2013008567A1 (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000195032A (ja) * 1998-12-28 2000-07-14 Sony Chem Corp 磁気ヘッド用サスペンションの製造方法
JP2008172012A (ja) * 2007-01-11 2008-07-24 Nitto Denko Corp 回路付サスペンション基板
JP2009088209A (ja) * 2007-09-28 2009-04-23 Dainippon Printing Co Ltd 電子回路部品、及びハードディスクドライブ用サスペンション
JP2011129175A (ja) * 2009-12-15 2011-06-30 Dainippon Printing Co Ltd サスペンション用基板、サスペンション、ヘッド付サスペンション、およびハードディスクドライブ、並びにサスペンション用基板の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000195032A (ja) * 1998-12-28 2000-07-14 Sony Chem Corp 磁気ヘッド用サスペンションの製造方法
JP2008172012A (ja) * 2007-01-11 2008-07-24 Nitto Denko Corp 回路付サスペンション基板
JP2009088209A (ja) * 2007-09-28 2009-04-23 Dainippon Printing Co Ltd 電子回路部品、及びハードディスクドライブ用サスペンション
JP2011129175A (ja) * 2009-12-15 2011-06-30 Dainippon Printing Co Ltd サスペンション用基板、サスペンション、ヘッド付サスペンション、およびハードディスクドライブ、並びにサスペンション用基板の製造方法

Also Published As

Publication number Publication date
JP2013020667A (ja) 2013-01-31

Similar Documents

Publication Publication Date Title
US10034368B2 (en) Flying tail type rigid-flexible printed circuit board
JP4841272B2 (ja) 配線回路基板および配線回路基板の接続構造
US7649144B2 (en) Connection structure between wired circuit boards
JP2004363205A (ja) 配線回路基板
US8049111B2 (en) Printed circuit board and method of manufacturing the same
US7851706B2 (en) Flexible printed circuit and manufacturing method thereof
JP6129465B2 (ja) サスペンション用基板、サスペンション、ヘッド付サスペンション、およびハードディスクドライブ、並びにサスペンション用基板の製造方法
JP4019068B2 (ja) 回路付サスペンション基板
US20060087011A1 (en) Wired circuit board
JP2011198402A (ja) サスペンション用フレキシャー基板、サスペンション、ヘッド付サスペンション、およびハードディスクドライブ
JP6048797B2 (ja) サスペンション用基板、サスペンション、ヘッド付サスペンションおよびハードディスクドライブ
JP5098767B2 (ja) サスペンション用基板、サスペンション、ヘッド付サスペンションおよびハードディスク
JP5974824B2 (ja) サスペンション用基板、サスペンション、ヘッド付サスペンション、ハードディスクドライブおよびサスペンション用基板の製造方法
JP2006040414A (ja) 配線回路基板
WO2013008567A1 (fr) Circuit imprimé souple, procédé de fabrication de ce circuit imprimé, courbure et dispositif électronique
JP6024225B2 (ja) サスペンション用フレキシャー基板
JP4128998B2 (ja) 配線回路基板およびその製造方法
US10475476B2 (en) Flexure of hard disk drive
US20120257307A1 (en) Electronic component and electronic device
JP2007133929A (ja) 回路付サスペンション基板
JP5849386B2 (ja) サスペンション用基板、サスペンション用基板の製造方法、サスペンション、素子付サスペンションおよびハードディスクドライブ
JP5966296B2 (ja) サスペンション用フレキシャー基板、サスペンション、ヘッド付サスペンション、およびハードディスクドライブ
JP2013254550A (ja) サスペンション用フレキシャー基板
JP6132007B2 (ja) サスペンション用基板、サスペンション用基板の製造方法、サスペンション、素子付サスペンションおよびハードディスクドライブ
JP2006005228A (ja) 配線基板、磁気ディスク装置、配線基板の製造方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 12810707

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 12810707

Country of ref document: EP

Kind code of ref document: A1

点击 这是indexloc提供的php浏览器服务，不要输入任何密码和下载