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WO2012007992A1 - Carte de câblage souple, film sec pour couche protectrice, et procédé de production de carte de câblage souple - Google Patents

Carte de câblage souple, film sec pour couche protectrice, et procédé de production de carte de câblage souple Download PDF

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Publication number
WO2012007992A1
WO2012007992A1 PCT/JP2010/004569 JP2010004569W WO2012007992A1 WO 2012007992 A1 WO2012007992 A1 WO 2012007992A1 JP 2010004569 W JP2010004569 W JP 2010004569W WO 2012007992 A1 WO2012007992 A1 WO 2012007992A1
Authority
WO
WIPO (PCT)
Prior art keywords
wiring board
flexible wiring
coverlay
dry film
film
Prior art date
Application number
PCT/JP2010/004569
Other languages
English (en)
Japanese (ja)
Inventor
前澤英樹
福川弘
Original Assignee
京セラケミカル株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京セラケミカル株式会社 filed Critical 京セラケミカル株式会社
Priority to CN2010800679864A priority Critical patent/CN102986310A/zh
Priority to PCT/JP2010/004569 priority patent/WO2012007992A1/fr
Priority to KR1020127031143A priority patent/KR20130037205A/ko
Publication of WO2012007992A1 publication Critical patent/WO2012007992A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H05K2201/10136—Liquid Crystal display [LCD]

Definitions

  • the present invention relates to a flexible wiring board useful for thinning devices such as a liquid crystal display module and an imaging module, a dry film for coverlay, and a method for manufacturing a flexible wiring board.
  • a liquid crystal display module having a small liquid crystal display panel for example, a TFT liquid crystal display panel, is used as a display unit of a cellular phone or the like.
  • a semiconductor chip constituting a driver for driving each subpixel is mounted on one side of the liquid crystal display panel, and a flexible wiring board is connected for connection with a control unit. It is stored in.
  • the flexible wiring board is bent in the vicinity of the liquid crystal display panel, and is disposed on the back side of the frame with the other end sandwiching the backlight.
  • an imaging module equipped with an imaging device such as a CCD image sensor is housed in a mobile phone or the like as a camera component by bending a flexible wiring board and connecting it to a main board via a connector or the like.
  • ⁇ Flexible wiring boards used in such liquid crystal display modules and imaging modules tend to have a smaller bending radius as the electronic equipment mounted becomes smaller and thinner.
  • a flexible wiring board is covered with a cover lay film in which an adhesive is applied to a polyimide film for the purpose of protecting or insulating a wiring pattern formed on the surface of the substrate.
  • the polyimide film has a high elastic modulus, and therefore, when the flexible wiring board is bent, a repulsive force (hereinafter also referred to as a springback force) is generated on the flexible wiring board, and the liquid crystal display There is a problem that the module and the imaging module are lifted.
  • a repulsive force hereinafter also referred to as a springback force
  • the flexible wiring A method of suppressing the springback force of the plate (for example, see Patent Document 1) and a method of preventing the liquid crystal panel from being lifted by the repulsive force of the flexible wiring board by forming a through hole in a portion where the bending curvature is maximized (See, for example, Patent Document 2).
  • a method is known in which a notched portion is provided in a bent portion of an insulating substrate constituting a flexible wiring board, and a protective resin made of silicone resin or the like is applied to this portion to facilitate bending of the flexible wiring board.
  • a protective resin made of silicone resin or the like is applied to this portion to facilitate bending of the flexible wiring board.
  • Patent Document 3 For example, see Patent Document 3
  • a flexible piece that is convex toward the circuit part side is formed by cutting between the circuit part and the terminal forming part.
  • a method is known in which the bent portion is eliminated by using for connection (see, for example, Patent Document 4).
  • Patent Document 5 From the viewpoint of thinning, it is also known to use a film made of an aramid resin as a coverlay film (see, for example, Patent Document 5).
  • Non-halogen flame retardancy Various methods for imparting non-halogen flame retardancy have been proposed so far.
  • Representative methods include hydrated metal compounds such as aluminum hydroxide and magnesium hydroxide, phosphorus-based flame retardants such as phosphate esters and polyphosphate compounds, and non-halogen-based compounds such as nitrogen-based flame retardants such as melamine compounds.
  • This method uses a flame retardant.
  • flame retardants when these flame retardants are used, it is difficult to achieve both the properties required for the coverlay, such as electrical insulation, solder heat resistance, and bend resistance, and flame retardancy. There were problems such as bleeding out.
  • the flexible wiring board used for a device that may cause a malfunction due to light leakage such as a liquid crystal display module or an imaging module has a low surface reflectance.
  • black ink may be printed on the surface of the polyimide cover lay film, but the spring back force is further increased by this ink layer, and cracking may occur when the ink is folded.
  • liquid crystal display modules and imaging element mounting modules are becoming thinner, and the flexible wiring board used therefor has a small springback force even when the bending radius is reduced, and is excellent in bending resistance. It is demanded.
  • the present invention has been made to solve the above problems, and provides a flexible wiring board having a small springback force, excellent bending resistance, and good flame resistance without using a halogen-based flame retardant.
  • the purpose is to do.
  • this invention aims at providing the manufacturing method of the dry film for coverlays useful for manufacture of such a flexible wiring board, and a flexible wiring board.
  • a flexible wiring board includes a base material made of a polyimide film, a circuit provided on one main surface of the base material, and a coverlay that covers the surface of the circuit,
  • the cover lay is formed of a cover lay dry film and has a thickness of 10 to 50 ⁇ m.
  • a flexible wiring board is provided.
  • A an epoxy resin
  • B an epoxy resin curing agent
  • C a curing accelerator
  • D a synthetic rubber
  • E a phosphazene compound
  • F a polyphosphate
  • a dry film for coverlay comprising a layer made of a non-halogen flame retardant resin composition containing a compound and (G) an inorganic filler as essential components on a support film.
  • a step of forming a circuit on one main surface of a substrate made of a polyimide film, and the coverlay dry film on the surface of the circuit, the non-halogen flame retardant Providing a method for manufacturing a flexible wiring board, comprising: superposing and heating the conductive resin composition layer side toward the circuit side and forming a coverlay by removing the support film Is done.
  • the present invention it is possible to obtain a flexible wiring board having a small springback force, excellent bending resistance, and good flame resistance without using a halogen flame retardant.
  • the obtained flexible wiring board is suitably used for devices that are required to be thin, such as liquid crystal display modules and imaging element modules.
  • FIG. 8 is a cross-sectional view illustrating a manufacturing process of the flexible wiring board following FIG. 7.
  • FIG. 1 It is sectional drawing which shows the manufacturing process of the flexible wiring board following FIG. It is sectional drawing which shows an example of the imaging module using the flexible wiring board of other embodiment. It is sectional drawing which shows an example of the dry film for coverlays. It is a figure which shows the measurement result of the transmittance
  • FIG. 1 is a cross-sectional view showing a first embodiment of the flexible wiring board of the present invention.
  • the flexible wiring board 1 of this embodiment has a flexible wiring board body 2 and a coverlay dry film formed on one main surface of the flexible wiring board body 2 with a thickness of 10 to 50 ⁇ m, preferably 20 to 20 ⁇ m. And a coverlay 3 of 35 ⁇ m.
  • the other main surface of the flexible wiring board body is covered with another cover lay 4 made of a polyimide film, a photosensitive resin, or the like, and a mounting component 5 is mounted (hereinafter referred to as a cover).
  • the lay 3 and the other cover lay 4 are referred to as a first cover lay 3 and a second cover lay 4, respectively).
  • the material which forms the 2nd coverlay 4 is not specifically limited, Like the 1st coverlay 3, you may form with the dry film for coverlays. From the viewpoint of suppressing the springback force and improving the bending resistance, it is preferable to use a photosensitive resin or a dry film for coverlay. As will be described later, the flexible wiring board 1 is used by being bent so that the main surface side on which the first cover lay 3 is formed becomes the inner side.
  • the flexible wiring board body 2 connects, for example, a base material 2a made of a polyimide film, circuits 2b and 2c provided on both main surfaces of the base material 2a, and these circuits 2b and 2c, respectively. It has a through hole 2d and a connection terminal 2e that electrically connects the circuit 2b and the circuit 2c to the liquid crystal display panel.
  • the first coverlay 3 is formed on substantially the entire surface of the flexible wiring board main body 2 except for the end where the connection terminal 2e is provided.
  • the second coverlay 4 is formed so as to cover the circuit 2c excluding, for example, a portion where the mounting component 5 of the flexible wiring board body 2 is mounted.
  • Such a flexible wiring board 1 is electrically connected to a liquid crystal display panel 12 to form a liquid crystal display module 11 as shown in FIGS.
  • the liquid crystal display panel 12 includes a connection terminal 13 and a semiconductor chip 14 on one main surface side.
  • the main surface side on which the first cover lay 3 is formed that is, the main surface side on which the connection terminals 2 e are formed faces the main surface side on which the connection terminals 13 of the liquid crystal display panel 12 are formed.
  • the connection terminals 2e and the connection terminals 13 are electrically connected to each other.
  • the flexible wiring board 1 is folded so as to enclose the liquid crystal display panel 12, that is, the flexible wiring board 1 so that the main surface side on which the first cover lay 3 is formed is inside.
  • the liquid crystal display module 11 is configured by bending and arranging.
  • the first cover lay 3 is formed to a thickness of 10 to 50 ⁇ m using a cover lay dry film, the spring back force is suppressed as compared with the conventional one. It can be easily bent without using protrusions and tape as fixing means, and the problem of the liquid crystal display panel 12 and the liquid crystal display module 11 being lifted can be solved.
  • the flexible wiring board 1 of the present embodiment can be manufactured as follows, for example.
  • a flexible metal-clad plate 42 in which metal foils 41 and 41 such as copper foil are bonded to both main surfaces of a base material 2a made of a polyimide film is prepared.
  • the flexible metal tension plate 42 can be selected and used from a metal tension plate for a two-layer type flexible wiring board and a metal tension plate for a three-layer type flexible wiring board, which are generally marketed as flexible metal tension plates.
  • a metal-clad board for a two-layer type flexible wiring board for example, ESPANEX (trade name, manufactured by Nippon Steel Chemical Co., Ltd.), NEOFLEX (trade name, manufactured by Mitsui Chemicals), UPISEL (trade name, manufactured by Ube Nitto Kasei Co., Ltd.), etc. Is mentioned.
  • the three-layer type flexible wiring board metal tension plate include TLF-521 and TLF-530 (trade name, manufactured by Kyocera Chemical Co., Ltd.). In either case, copper foil is used as the metal foil.
  • these metal foils 41, 41 are etched to form the circuit 2 b and the circuit 2 c to form the flexible wiring board main body 2, and then one of the flexible wiring board main bodies 2 (circuit The coverlay dry film 43 is overlaid and heated and pressed so as to cover the main surface of the 2b formation side.
  • the coverlay dry film 43 includes a support film on one side, and the support film is peeled off in advance during the heating and pressurization. Thereby, the flexible wiring board main body 2 in which the 1st cover lay 3 was formed in one main surface of the flexible wiring board main body 2 as shown in FIG. 7 is obtained.
  • the first coverlay 3 is formed on substantially the entire surface of one side of the flexible wiring board main body 2 excluding the end portion that becomes the connection terminal 2e.
  • a liquid photosensitive resin 44 is applied to substantially the entire surface of the other main surface (circuit 2c forming side) of the flexible wiring board body 2 as shown in FIG.
  • the second coverlay 4 is formed so as to cover the circuit 2c excluding the mounting component mounting portion by developing and post-curing.
  • the flexible wiring 1 in which the first cover lay 3 is formed on one main surface of the flexible wiring board main body 2 and the second cover lay 4 is formed on the other main surface is obtained.
  • the mounting component 5 is mounted on the flexible wiring 1 (FIG. 2).
  • FIG. 10 is a cross-sectional view showing a second embodiment of the flexible wiring board of the present invention. While the first embodiment is a flexible wiring board used in a liquid crystal display module, the flexible wiring board of this embodiment is a flexible wiring board used in an imaging module. FIG. 10 shows the flexible wiring board of this embodiment. The state which connected the wiring board 10 to the imaging module is shown. In addition, in order to avoid overlapping description, description is abbreviate
  • the flexible wiring board 10 of the present embodiment has a thickness of 10-50 ⁇ m, preferably 20-20, formed by a flexible wiring board body 2 and a coverlay dry film on one main surface of the flexible wiring board body 2. And a coverlay 3 of 35 ⁇ m. As shown in FIG. 10, the flexible wiring board 1 is used by being bent so that the main surface side on which the cover lay 3 is formed becomes the outside.
  • the flexible wiring board body 2 includes, for example, a base material 2a made of a polyimide film and a circuit 2b provided on one main surface of the base material 2a.
  • the cover lay 3 is formed on substantially the entire surface of one main surface of the flexible wiring board body 2 except for both ends where the connection terminals 2e and 2e are provided.
  • Such a flexible wiring board 10 is electrically connected to the imaging module main body 15 to form an imaging module 16 as shown in FIG.
  • the imaging module main body 15 includes a lens unit 17 and an imaging element 18.
  • one connection terminal 2e is electrically connected to an imaging board (not shown) on which the imaging element 18 of the imaging module body 15 is mounted, and the other connection terminal 2e is a connector (not shown). Is electrically connected.
  • the imaging module 16 is configured by being bent so that the main surface side on which the cover lay 3 is formed is on the outside.
  • a reinforcing plate 19 for reinforcing the connection with the connector is provided at the end of the main surface opposite to the circuit 2b surface of the substrate 2a on the connector side.
  • the cover lay 3 is formed to a thickness of 10 to 50 ⁇ m using a cover lay dry film, the spring back force can be suppressed as compared with the conventional one. Further, it can be easily bent without using a protrusion or a tape as a fixing means, and the problem of floating of the imaging module 16 can be solved.
  • the flexible wiring board 10 of the present embodiment is, for example, a flexible metal-clad board in which a metal foil such as a copper foil (to be a circuit 2b) is bonded to one side of a base material 2a made of a polyimide film.
  • a metal foil such as a copper foil (to be a circuit 2b) is bonded to one side of a base material 2a made of a polyimide film.
  • the cover foil dry film is overlaid and heated and pressed so as to cover the metal foil.
  • FIG. 11 is a cross-sectional view showing an example of a dry film for a coverlay that is preferably used in the present invention.
  • this coverlay dry film 50 has (A) an epoxy resin, (B) an epoxy resin curing agent, (C) a curing accelerator, (D) a synthetic rubber, ( A layer 52 made of a non-halogen flame retardant resin composition containing E) a phosphazene compound, (F) a polyphosphate compound, and (G) an inorganic filler as essential components is provided.
  • the epoxy resin of component (A) is non-halogen and has two or more epoxy groups in one molecule. Any material satisfying such conditions can be used without being limited by the molecular structure, molecular weight and the like. Specific examples include, for example, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, biphenyl type epoxy resin, phenol novolac type resin, cresol novolac type epoxy resin, glycidyl ether type epoxy resin, and alicyclic type. Examples thereof include epoxy resins, heterocyclic epoxy resins, and glycidyl ether-based modified epoxy resins. These can be used alone or in combination of two or more.
  • the (B) component epoxy resin curing agent a phenol resin curing agent, an acid anhydride curing agent, an amine curing agent or the like generally known as an epoxy resin curing agent is used.
  • the phenol resin-based curing agent include novolak type phenol resins such as phenol novolak resin and cresol novolak resin, amino-modified novolak type phenol resin, polyvinyl phenol resin, and phenol aralkyl resin.
  • acid anhydride curing agents include phthalic anhydride, maleic anhydride, trimellitic anhydride, pyromellitic anhydride, hexahydrophthalic anhydride, 3-methyl-hexahydrophthalic anhydride, 4-methyl-hexahydro anhydride Examples thereof include phthalic acid, tetrahydrophthalic anhydride, and nadic anhydride.
  • amine curing agent include diethylenetriamine, triethylenetetramine, tetraethylenetetramine, tetraethylenepentamine, diethylaminopropylamine, isophoronediamine, diaminodiphenylmethane, metaphenylenediamine and the like.
  • organic acid hydrazide, diaminomaleonitrile and derivatives thereof, melamine and derivatives thereof, polyamide resin, amine imide, polyamine salt, and the like are also used. These can be used alone or in combination of two or more.
  • the blending amount of the epoxy resin curing agent of the component (B) is preferably an equivalent ratio of the epoxy resin of the component (A) and the epoxy resin curing agent of the component (B) (for example, in the case of a phenol resin curing agent, the epoxy resin
  • the molar ratio of the epoxy group and the phenolic hydroxyl group of the phenol resin-based curing agent is in the range of 0.7 to 1.3, more preferably in the range of 0.9 to 1.1.
  • the equivalent ratio is more than 1.3, moisture resistance and the like are lowered.
  • epoxy resin curing accelerator those generally known as epoxy resin curing accelerators are used. Specific examples include 2-heptadecylimidazole, 2-methylimidazole, 2-ethylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 4-methylimidazole, 4-ethylimidazole, 2-phenyl.
  • the blending amount of the curing accelerator of component (C) is preferably 0.01 with respect to 100 parts by mass of the epoxy resin of component (A) from the viewpoint of the balance between curing acceleration and physical properties of the resin after curing. Is 5 parts by mass, and more preferably 0.3-2 parts by mass.
  • Examples of the synthetic rubber (D) include acrylic rubber, acrylonitrile butadiene rubber, styrene butadiene rubber, butadiene methyl acrylate acrylonitrile rubber, butadiene rubber, carboxyl group-containing acrylonitrile butadiene rubber, vinyl group-containing acrylonitrile butadiene rubber, silicone rubber, urethane. Rubber, polyvinyl butyral, etc. are used. These can be used alone or in combination of two or more.
  • the blending amount of the synthetic rubber of the component (D) is preferably 10 to 30% by mass, more preferably 15 to 25% by mass with respect to the total components (A) to (D). If the blending amount is less than 10% by mass, there is a possibility that sufficient adhesion with a substrate made of a polyimide film may not be obtained. Conversely, if it exceeds 30% by mass, the electrical characteristics and the like deteriorate.
  • the phosphazene compound as the component (E) is used without particular limitation as long as it has substantially no halogen. From the viewpoint of flame retardancy, heat resistance, moisture resistance, chemical resistance, etc., those having a melting point of 80 ° C. or higher are preferred, and those having a melting point of 90 ° C. or higher are more preferred. Specific examples of preferred phosphazene compounds include phosphazene compounds represented by the following general formula (1) or (2).
  • X 1 is a group —N ⁇ P (OPh) 3 or a group —N ⁇ P (O) OPh
  • Ph is a phenyl group
  • m is an integer of 3 to 25
  • n is an integer of 3 to 10,000.
  • the blending amount of the phosphazene compound as the component (E) is preferably 3 to 10 parts by mass, more preferably 5 to 7 parts by mass with respect to 100 parts by mass of the total amount of the components (A) to (D). . If the blending amount is less than 3 parts by mass, the desired flame retardancy may not be obtained. Conversely, if it exceeds 10 parts by mass, bleeding may occur on the surface of the dry film or coverlay.
  • Examples of the (F) component polyphosphate compound include amine salts and ammonium salts of polyphosphoric acid.
  • polyphosphoric acid include linear condensed phosphoric acid represented by the general formula: HO (HPO3) nH (wherein n is an integer of 2 or more) (for example, pyrophosphoric acid, tripolyphosphoric acid, tetrapolyphosphoric acid). , Pentapolyphosphoric acid, etc.), cyclic condensed phosphoric acid (trimetaphosphoric acid, tetrametaphosphoric acid, hexametaphosphoric acid, etc.) represented by the general formula: (HPO3) m (where m is an integer of 2 or more), etc. It is done.
  • melamine polyphosphate As the polyphosphate compound of component (F), melamine polyphosphate, melam polyphosphate, and melem polyphosphate are particularly preferable.
  • melam is a 1,3,5-triazine derivative in which one molecule of ammonia is desorbed from two melamine molecules
  • melem is a 1,3,5-triazine derivative in which two molecules of ammonia are desorbed and condensed. It is a triazine derivative.
  • These polyphosphate compounds can be used alone or in combination of two or more.
  • the blending amount of the polyphosphate compound of the component (F) is preferably 5 to 30 parts by weight, more preferably 15 to 25 parts by weight with respect to 100 parts by weight of the total amount of the components (A) to (D). It is. If the blending amount is less than 5 parts by mass, the desired flame retardancy may not be obtained. Conversely, if it exceeds 30 parts by mass, the bending resistance of the dry film or coverlay may be reduced.
  • any conventional filler used in coverlays can be used without any particular limitation.
  • Specific examples include metal hydrates such as aluminum hydroxide and magnesium hydroxide, talc, silica, alumina and the like.
  • These inorganic fillers can be used alone or in combination of two or more. Further, these inorganic fillers preferably have an average particle diameter of 0.1 to 10 ⁇ m, more preferably 0.5 to 5 ⁇ m, from the viewpoint of crack resistance during bending.
  • the average particle diameter of the inorganic filler can be measured using, for example, a laser diffraction / scattering particle size distribution apparatus.
  • the blending amount of the inorganic filler as the component (G) is preferably in the range of 5 to 30% by mass, more preferably in the range of 10 to 20% by mass based on the total solid content in the composition. If the blending amount is less than 5% by mass, sufficient flame retardancy may not be obtained. Conversely, if it exceeds 30% by weight, crack resistance may decrease.
  • the non-halogen flame retardant resin composition contains (H) colorants such as inorganic pigments, organic pigments, organic dyes, etc., for coloring the coverlay. Can be blended.
  • inorganic pigments include carbon black, cobalt dyes, iron dyes, chromium dyes, titanium dyes, vanadium dyes, zirconium dyes, molybdenum dyes, ruthenium dyes, platinum dyes, ITO (indium) Tin oxide) dyes, ATO (antimony tin oxide) dyes, and the like.
  • organic pigments and organic dyes include aminium dyes, cyanine dyes, merocyanine dyes, croconium dyes, squalium dyes, azurenium dyes, polymethine dyes, naphthoquinone dyes, pyrylium dyes, and phthalocyanine dyes.
  • Dye Naphthalocyanine dye, Naphlactam dye, Azo dye, Condensed azo dye, Indigo dye, Perinone dye, Perylene dye, Dioxazine dye, Quinacridone dye, Indanthrene blue dye, Isoindolinone Dyes, watching dyes, permanent dyes, quinophthalone dyes, pyrrole dyes, thioindigo dyes, metal complex dyes, dithiol metal complex dyes, indolephenol dyes, triallylmethane dyes, anthraquinone dyes, Dioqui Jin dyes, naphthol dyes, azomethine dyes, benzimidazolone pigments, pyranthrone pigments and threne pigments, and the like.
  • colorants can be used by appropriately selecting one or more kinds in order to adjust to a target hue.
  • carbon black, etc. for black coloring phthalocyanine dyes, indanthrene blue dyes, etc. for blue coloring, quinacridone dyes, watching dyes, permanent dyes, anthraquinone dyes for red coloring, etc.
  • Perylene dyes, condensed azo dyes, and the like are used.
  • a black pigment as the (H) colorant.
  • preferable black pigments include, for example, carbon black, aniline black, carbon black, titanium black, inorganic pigment hematite, perylene black, or a mixture of two or more thereof. Among these, carbon black, titanium black, or a mixture thereof is more preferable.
  • carbon black furnace black, channel black, acetylene black, etc. can be used.
  • Carbon black having a small primary particle diameter is suitable because it generally has excellent blackness and coloring power.
  • the primary particle diameter is preferably 1 ⁇ m or less, preferably 0.5 ⁇ m or less. Is more preferable.
  • Titanium black is obtained by oxidation of titanium or reduction of titanium dioxide.
  • titanium black is a black pigment containing titanium dioxide and titanium monoxide and / or titanium nitride as constituent components.
  • the blending amount of the colorant as the component (H) is preferably in the range of 0.1 to 10% by mass, more preferably in the range of 0.5 to 3% by mass, based on the total solid content in the composition. If the blending amount is less than 0.1% by mass, a sufficient coloring effect may not be obtained. Conversely, if it exceeds 10% by weight, the adhesion with the flexible wiring board may be reduced.
  • the pigment is disperse
  • the dispersant for example, a silane coupling agent, a titanium coupling agent, a resin into which various functional groups are introduced, or the like is used.
  • a flexible wiring board using a dry film for coverlay using a non-halogen flame retardant resin composition containing a black pigment is used for a liquid crystal display module, an imaging module, etc. where light shielding properties are required.
  • the printing process of the black ink for light shielding after formation can be omitted. As a result, the productivity and environmental compatibility are excellent, and the plate thickness can be reduced, which leads to a reduction in springback force and good bending properties.
  • the non-halogen flame retardant resin composition includes various additives, such as organic fillers, deterioration, as necessary and within the range not impairing the effects of the present invention.
  • An inhibitor or the like can be further blended.
  • a solvent can be added to the non-halogen flame retardant resin composition in order to obtain a viscosity suitable for the processing method.
  • the solvent include alcohol solvents such as methanol, ethanol and isopropanol, ketone solvents such as acetone and methyl ethyl ketone, aromatic hydrocarbon solvents such as benzene, toluene and xylene, 1,4-dioxane and 1,3-dioxane.
  • ether solvents such as propylene glycol monomethyl ether, N-methylpyrrolidone, dimethylformamide and the like. These can be used alone or in combination of two or more.
  • the non-halogen flame retardant resin composition can be prepared by applying a known method.
  • the above components (A) to (G) and various components to be blended as necessary are mixed using a known kneader such as a pot mill, a ball mill, a bead mill, a roll mill, a homogenizer, a super mill, or a reika machine. It can be prepared by kneading at room temperature or under heating.
  • the component insoluble in the solvent, at least the polyphosphate compound of component (F) is to have a particle size of 10 ⁇ m or less by kneading from the viewpoint of preventing a decrease in crack resistance. Is preferred.
  • the dry film for coverlay 50 is obtained by applying the non-halogen flame retardant resin composition, which is adjusted to an appropriate viscosity with a solvent as required, onto the support film 51 by a known method and drying. Specifically, it is applied onto the support film 51 by a known coating method such as a bar coating method, a knife coating method, a roll coating method, a blade coating method, a die coating method, or a gravure coating method, followed by drying treatment, and a semi-cured state. Is obtained.
  • a plastic film such as polyethylene, polypropylene, polyester, polycarbonate, polyarylate, polyacrylonitrile, etc., having a release agent layer on one side is used.
  • the thickness of the support film 51 is usually 10 to 50 ⁇ m, preferably 25 to 38 ⁇ m, from the viewpoint of handling properties.
  • the non-halogen flame retardant resin composition is preferably applied so that the thickness after drying is 10 to 50 ⁇ m. More preferably, it is 20 to 35 ⁇ m.
  • the non-halogen flame retardant resin composition coated surface side of the support film 51 may have a surface roughness (Ra: arithmetic average roughness) of 0.3 to 5.0 ⁇ m by surface treatment.
  • the thickness is 0.5 to 3.0 ⁇ m.
  • the surface treatment method for example, methods such as sand blast treatment, chemical mat treatment, kneading mat treatment and the like can be used.
  • the non-halogen flame retardant resin composition is applied onto the support film 51 having a surface roughness (Ra) of 0.3 to 5.0 ⁇ m as described above and a release agent layer provided on the surface, and dried.
  • a coverlay dry film 50 obtained by the treatment a coverlay is formed by a method as described later, and then the support film 51 is peeled off, whereby the surface roughness (Ra) of the support film 51 is increased.
  • a transferred coverlay surface can be obtained.
  • the coverlay having such a roughened surface has a significantly lower light reflectance than a coverlay having a smooth surface (see FIG. 13). . Therefore, the dry film for coverlay 50 having the support film 51 that is black and has a surface roughness (Ra) of 0.3 to 5.0 ⁇ m is very large due to light leakage from a liquid crystal display module, an imaging module, or the like. It is suitable for the use of the flexible wiring board of the affected electronic component module.
  • the reason why the reflectance of light is greatly reduced by roughening is that incident light is absorbed and diffusely reflected on the coverlay surface, and as a result, the amount of light reflected from the coverlay surface and returning to the light receiving portion is small. It is thought that it became. On the other hand, the effect of roughening is hardly observed on the light transmittance (see FIG. 12).
  • the flexible wiring board of the present invention can be manufactured by forming a coverlay using the above-mentioned dry film for coverlay.
  • the above-mentioned coverlay in which a metal foil such as a copper foil is bonded to one side or both sides of a polyimide film with a hot roll to form a circuit, and then a hole is previously drilled in a predetermined place on the circuit forming surface.
  • the dry film is overlaid with the non-halogen flame retardant resin composition layer side facing the circuit forming surface, and by hot pressing, a temperature of 130 to 180 ° C., preferably 150 to 170 ° C., and 5 to 50 MPa, preferably 15 Heat and pressurize at a pressure of ⁇ 35 MPa.
  • a flexible printed wiring board with a reinforcing plate can be produced by a normal method of superposing a reinforcing plate on the flexible wiring board via a thermosetting resin composition and performing heat-press molding.
  • a flexible copper-clad laminate and the like are superimposed on the flexible wiring board of the present invention via a thermosetting resin composition, heated and pressed, formed through-holes, plated through-holes,
  • a multilayer flexible printed wiring board can be manufactured by the usual method of forming a circuit.
  • the resin composition is kneaded with three rolls and prepared so that the particle size of the component insoluble in the solvent is 10 ⁇ m or less, and then this preparation is formed into a single-side matte type 25 ⁇ m thick biaxially oriented polypropylene.
  • Production Example 2 A resin composition was prepared in the same manner as in Production Example 1, except that 65 parts of SPE-100 (trade name, phosphorous content 13%, manufactured by Otsuka Chemical Co., Ltd.) was used as the phenoxyphosphazene oligomer instead of SPB-100 (trade name). Further, using this, a coverlay dry film B having a thickness of 25 ⁇ m was produced.
  • SPE-100 trade name, phosphorous content 13%, manufactured by Otsuka Chemical Co., Ltd.
  • Production Example 3 A resin composition was prepared in the same manner as in Production Example 1 except that the blending amount of PHOSMEL 200 (trade name) of melamine polyphosphate was 200 parts and SPB-100 (trade name) of phenoxyphosphazene oligomer was not blended. Further, using this, a coverlay dry film C having a thickness of 25 ⁇ m was produced.
  • Production Example 4 A resin composition was prepared in the same manner as in Production Example 1 except that 163 parts of MPP-B (trade name, phosphorous content 13%, manufactured by Sanwa Chemical Co., Ltd.) was used as melamine polyphosphate instead of PHOSMEL200 (trade name). Further, using this, a dry film D for coverlay having a thickness of 25 ⁇ m was produced.
  • MPP-B trade name, phosphorous content 13%, manufactured by Sanwa Chemical Co., Ltd.
  • Production Example 5 A resin composition was prepared in the same manner as in Production Example 1, except that the amount of SPB-100 (trade name) of the phenoxyphosphazene oligomer was 200 parts and PHOSMEL 200 (trade name) of melamine polyphosphate was not blended. Further, using this, a coverlay dry film E having a thickness of 25 ⁇ m was produced.
  • Trefan YM17S (trade name)
  • Production Example 7 Polyethylene terephthalate (PET) with a release agent of 38 ⁇ m thickness with a release agent layer provided on one side instead of Trefan YM17S (trade name) which is a biaxially stretched polypropylene film with a thickness of 25 ⁇ m on one side.
  • a dry film G for coverlay having a thickness of 25 ⁇ m was produced.
  • a dry film H for coverlay was prepared by applying the film to a mat (surface treatment) surface of ( ⁇ 1.2 ⁇ m) with a roll coater so that the thickness after drying was 75 ⁇ m, and drying by heating.
  • Table 1 shows the compositions (excluding the solvent) of the resin compositions used in the production of the coverlay dry films of Production Examples 1 to 8.
  • Example 1 A flexible double-sided copper-clad Espanex MB 18-25-18 FRG (trade name, manufactured by Nippon Steel Chemical Co., Ltd.) with a 18 ⁇ m thick copper foil on both sides of a 25 ⁇ m thick polyimide film is used to form circuits on both sides. After that, the coverlay dry film A and the coverlay dry film F previously produced are superimposed on each circuit formation surface (first and second circuit formation surfaces), respectively, and heated at 160 ° C. under pressure. Adhesion was performed by heating and pressing at 4 MPa for 1 hour to produce a flexible wiring board for evaluation.
  • Example 2 A flexible wiring board for evaluation was produced in the same manner as in Example 1 except that the coverlay dry film B was superposed on one circuit forming surface instead of the coverlay dry film A.
  • Example 3 A flexible wiring board for evaluation was produced in the same manner as in Example 1 except that the coverlay dry film C was superposed on one circuit formation surface instead of the coverlay dry film A.
  • Example 4 A flexible wiring board for evaluation was produced in the same manner as in Example 1 except that the coverlay dry film D was superposed on one circuit forming surface instead of the coverlay dry film A.
  • Example 5 A flexible wiring board for evaluation was produced in the same manner as in Example 1 except that the coverlay dry film E was superposed on one circuit formation surface instead of the coverlay dry film A.
  • Example 6 After using Epanex MB 18-25-18 FRG (trade name), a flexible double-sided copper-clad board, after forming circuits on both sides, overlay the coverlay dry film A on one circuit-forming surface, Adhesion was carried out by heating and pressing at a temperature of 160 ° C. and a pressure of 4 MPa for 1 hour. Next, a photosensitive liquid coverlay KSR-800 (trade name, manufactured by Kyocera Chemical Co., Ltd.) was applied to the other circuit formation surface by screen printing using a 150 mesh polyester screen to a thickness of 20 to 30 ⁇ m, and 80 ° C. A coating film was formed by drying with a hot air dryer for 30 minutes.
  • Epanex MB 18-25-18 FRG trade name
  • a flexible double-sided copper-clad board after forming circuits on both sides, overlay the coverlay dry film A on one circuit-forming surface
  • Adhesion was carried out by heating and pressing at a temperature of 160 ° C. and a pressure of 4 MPa for 1 hour.
  • a negative film of a resist pattern was brought into contact with this coating film and irradiated with ultraviolet rays using an ultraviolet irradiation exposure apparatus (exposure amount: 400 mJ / cm 2 ), and then a 1% sodium carbonate aqueous solution was added at about 0.10 to 0.15 MPa.
  • the film was developed by spraying for 1 minute at a pressure of 1 to dissolve and remove the unexposed portion, and further thermally cured at 150 ° C. for 60 minutes to form a photosensitive resin layer, and a flexible wiring board for evaluation was produced.
  • Example 7 After using Epanex MB 18-25-18 FRG (trade name), a flexible double-sided copper-clad board, after forming circuits on both sides, overlay the coverlay dry film A on one circuit-forming surface, Adhesion was carried out by heating and pressing at a temperature of 160 ° C. and a pressure of 4 MPa for 1 hour. Next, a polyimide film coverlay TFA-560-1215 (trade name, manufactured by Kyocera Chemical Co., Ltd.) was laminated on the other circuit forming surface and integrated to produce a flexible wiring board for evaluation.
  • Epanex MB 18-25-18 FRG trade name
  • Adhesion was carried out by heating and pressing at a temperature of 160 ° C. and a pressure of 4 MPa for 1 hour.
  • a polyimide film coverlay TFA-560-1215 (trade name, manufactured by Kyocera Chemical Co., Ltd.) was laminated on the other circuit forming surface and integrated to produce a flexible wiring board for evaluation.
  • Example 8 A flexible wiring board for evaluation was produced in the same manner as in Example 1 except that the coverlay dry film G was superposed on one circuit formation surface instead of the coverlay dry film A.
  • Example 9 A flexible wiring board for evaluation was produced in the same manner as in Example 1 except that the coverlay dry film F was superposed on one circuit formation surface instead of the coverlay dry film A.
  • Comparative Example 1 A flexible wiring board for evaluation was produced in the same manner as in Example 7, except that the coverlay dry film H was superposed on one circuit formation surface instead of the coverlay dry film A.
  • Comparative Example 2 A flexible double-sided copper-clad Espanex MB 18-25-18 FRG (trade name) was used to form circuits on both sides, and polyimide film coverlay TFA-560-1215 (manufactured by Kyocera Chemical Co., Ltd.) Product name) were laminated and integrated to produce a flexible wiring board for evaluation.
  • Comparative Example 3 Except for laminating polyimide film coverlay TFA-560-1215 (trade name) and further printing thermosetting printing ink black ink CCR-1200B (trade name, manufactured by Asahi Kaken Co., Ltd.) to a thickness of 15 ⁇ m, A flexible wiring board for evaluation was produced in the same manner as in Comparative Example 2.
  • Comparative Example 4 A polyimide film coverlay TFA-560-1215 (trade name) is laminated, and a thermosetting printing ink black ink CCR-1200B (trade name, manufactured by Asahi Kaken Co., Ltd.) is further printed to a thickness of 15 ⁇ m.
  • a thermosetting printing ink black ink CCR-1200B trade name, manufactured by Asahi Kaken Co., Ltd.
  • photosensitive liquid cover lay KSR-800 trade name 20 to 20 by screen printing using a 150 mesh polyester screen. The whole surface is applied to a thickness of 30 ⁇ m, dried with a hot air dryer at 80 ° C.
  • Example 1 as an example in which a roughened black coverlay is arranged on the light incident surface side
  • Example 8 as an example in which a smooth black coverlay is arranged
  • a polyimide film coverlay is further arranged Comparative Example 2 was prepared as above, and the results of measuring the transmittance and the reflectance with respect to the incident light are shown in FIGS.
  • the evaluation flexible wiring board was repeatedly bent 180 ° by goby folding, and the number of times until a crack was generated in the coverlay by visual observation and observation with an optical microscope (200 times) was measured.
  • Flame retardancy was measured according to the UL94VTM-0 flame retardancy standard and evaluated according to the following criteria. ⁇ ... Satisfies the UL94VTM-0 standard ⁇ ... Does not meet the UL94VTM-0 standard (sample burns)
  • the flexible wiring board of the present invention is excellent in flexibility and folding resistance, and is particularly suitable for the use of a flexible wiring board that is required to be thin and have low springback properties.
  • SYMBOLS 1, 10 Flexible wiring board, 2 ... Flexible wiring board main body, 2a ... Base material, 2b, 2c ... Circuit, 3 ... (1st) coverlay, 4 ... (2nd) coverlay, 5 ... Mounting components, 11 DESCRIPTION OF SYMBOLS ... Liquid crystal display module, 12 ... Liquid crystal display panel, 16 ... Imaging module, 50 ... Dry film for coverlays, 51 ... Support film, 52 ... Layer which consists of a non-halogen flame-retardant resin composition.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

L'invention porte sur une carte de câblage souple possédant de bonnes propriétés ignifuges sans utiliser d'ignifugeants halogénés, une excellente résistance à la flexion, et une force de retour élastique minimale. La carte de câblage souple (1) comprend : un substrat (2a) comprenant un film de polyimide ; un circuit (2b) agencé sur une surface principale du substrat (2a) ; et une couche protectrice (3) qui couvre la surface du circuit (2b). La couche protectrice (3) est formée par un film sec pour couches protectrices, et a une épaisseur de 10 à 50μm.
PCT/JP2010/004569 2010-07-14 2010-07-14 Carte de câblage souple, film sec pour couche protectrice, et procédé de production de carte de câblage souple WO2012007992A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN2010800679864A CN102986310A (zh) 2010-07-14 2010-07-14 柔性布线板、覆盖层用干膜及柔性布线板的制造方法
PCT/JP2010/004569 WO2012007992A1 (fr) 2010-07-14 2010-07-14 Carte de câblage souple, film sec pour couche protectrice, et procédé de production de carte de câblage souple
KR1020127031143A KR20130037205A (ko) 2010-07-14 2010-07-14 플렉시블 배선판, 커버레이용 드라이 필름 및 플렉시블 배선판의 제조방법

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PCT/JP2010/004569 WO2012007992A1 (fr) 2010-07-14 2010-07-14 Carte de câblage souple, film sec pour couche protectrice, et procédé de production de carte de câblage souple

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CN103333466B (zh) * 2013-06-20 2015-08-26 天津凯华绝缘材料股份有限公司 一种具有互穿网络结构的高柔性环氧树脂及其合成方法
JP6361102B2 (ja) * 2013-09-04 2018-07-25 三菱電機株式会社 半導体装置およびフレキシブル回路基板
KR20160110861A (ko) * 2015-03-13 2016-09-22 삼성디스플레이 주식회사 연성 회로 기판 및 이를 포함하는 표시 장치
CN105992467B (zh) * 2016-07-01 2019-03-05 广东三泰迈高光电科技有限公司 一种柔性电路板的压边工艺
CN106102335B (zh) * 2016-07-01 2018-12-28 广东三泰迈高光电科技有限公司 一种柔性电路板的喷胶工艺
CN106195695B (zh) * 2016-07-01 2019-03-05 广东三泰迈高光电科技有限公司 一种led软灯条的生产工艺
CN108806509B (zh) * 2018-05-31 2022-01-25 昆山国显光电有限公司 柔性基板、封装连接件及显示屏

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