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WO2012061740A3 - Touch fingerprint sensor using 1-3 piezo composites and acoustic impediography principle - Google Patents

Touch fingerprint sensor using 1-3 piezo composites and acoustic impediography principle Download PDF

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Publication number
WO2012061740A3
WO2012061740A3 PCT/US2011/059382 US2011059382W WO2012061740A3 WO 2012061740 A3 WO2012061740 A3 WO 2012061740A3 US 2011059382 W US2011059382 W US 2011059382W WO 2012061740 A3 WO2012061740 A3 WO 2012061740A3
Authority
WO
WIPO (PCT)
Prior art keywords
principle
fingerprint sensor
touch fingerprint
acoustic impediography
piezo
Prior art date
Application number
PCT/US2011/059382
Other languages
French (fr)
Other versions
WO2012061740A2 (en
Inventor
Louis Regniere
Yakub Aliyu
Rainer M. Schmitt
Theodore M. Johnson
Ronald A. Kropp
Christian Liautaud
Deda Diatezua
Isaac R. Abothu
De Liufu
Richard Irving
Patrick D. Brown
Walter C. Mick
William H. Tanubrata
Omid S. Jahromi
John Boudreaux
David B. Clarke
Jack S. Chorpenning
Bryce M. Barbato
Honorio R. Ulep
William R. Robinson
Original Assignee
Sonavation, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sonavation, Inc. filed Critical Sonavation, Inc.
Publication of WO2012061740A2 publication Critical patent/WO2012061740A2/en
Publication of WO2012061740A3 publication Critical patent/WO2012061740A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/54—Contact plating, i.e. electroless electrochemical plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces

Landscapes

  • Chemical & Material Sciences (AREA)
  • Electrochemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Image Input (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

Provided herein is a method of making an integrated circuit device using copper metallization on 1-3 PZT composite. The method includes providing an overlay of electroplated immersion of gold (Au) to cover copper metal traces, the overlay preventing oxidation on 1 :3 PZT composite with material. Also included is the formation of immersion Au nickel electrodes on the 1-3 PZT composite to achieve pad metallization for external connections.
PCT/US2011/059382 2010-11-04 2011-11-04 Touch fingerprint sensor using 1-3 piezo composites and acoustic impediography principle WO2012061740A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US41023610P 2010-11-04 2010-11-04
US61/410,236 2010-11-04

Publications (2)

Publication Number Publication Date
WO2012061740A2 WO2012061740A2 (en) 2012-05-10
WO2012061740A3 true WO2012061740A3 (en) 2012-06-28

Family

ID=46025138

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2011/059382 WO2012061740A2 (en) 2010-11-04 2011-11-04 Touch fingerprint sensor using 1-3 piezo composites and acoustic impediography principle

Country Status (2)

Country Link
US (1) US20120279865A1 (en)
WO (1) WO2012061740A2 (en)

Families Citing this family (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9526180B2 (en) * 2011-12-09 2016-12-20 Intel Corporation Reducing dielectric loss in solder masks
US9618405B2 (en) 2014-08-06 2017-04-11 Invensense, Inc. Piezoelectric acoustic resonator based sensor
US9114977B2 (en) 2012-11-28 2015-08-25 Invensense, Inc. MEMS device and process for RF and low resistance applications
US10726231B2 (en) 2012-11-28 2020-07-28 Invensense, Inc. Integrated piezoelectric microelectromechanical ultrasound transducer (PMUT) on integrated circuit (IC) for fingerprint sensing
US10497747B2 (en) 2012-11-28 2019-12-03 Invensense, Inc. Integrated piezoelectric microelectromechanical ultrasound transducer (PMUT) on integrated circuit (IC) for fingerprint sensing
US9511994B2 (en) 2012-11-28 2016-12-06 Invensense, Inc. Aluminum nitride (AlN) devices with infrared absorption structural layer
US9665763B2 (en) * 2014-08-31 2017-05-30 Qualcomm Incorporated Finger/non-finger determination for biometric sensors
US9582705B2 (en) 2014-08-31 2017-02-28 Qualcomm Incorporated Layered filtering for biometric sensors
US9195879B1 (en) 2014-08-31 2015-11-24 Qualcomm Incorporated Air/object determination for biometric sensors
WO2016036046A1 (en) * 2014-09-03 2016-03-10 크루셜텍(주) Fingerprint sensor module and manufacturing method therefor
US9928398B2 (en) 2015-08-17 2018-03-27 Invensense, Inc. Always-on sensor device for human touch
US10670716B2 (en) 2016-05-04 2020-06-02 Invensense, Inc. Operating a two-dimensional array of ultrasonic transducers
US10325915B2 (en) 2016-05-04 2019-06-18 Invensense, Inc. Two-dimensional array of CMOS control elements
US10445547B2 (en) 2016-05-04 2019-10-15 Invensense, Inc. Device mountable packaging of ultrasonic transducers
US10315222B2 (en) 2016-05-04 2019-06-11 Invensense, Inc. Two-dimensional array of CMOS control elements
US10656255B2 (en) 2016-05-04 2020-05-19 Invensense, Inc. Piezoelectric micromachined ultrasonic transducer (PMUT)
US10408797B2 (en) 2016-05-10 2019-09-10 Invensense, Inc. Sensing device with a temperature sensor
US10539539B2 (en) 2016-05-10 2020-01-21 Invensense, Inc. Operation of an ultrasonic sensor
US10441975B2 (en) 2016-05-10 2019-10-15 Invensense, Inc. Supplemental sensor modes and systems for ultrasonic transducers
US11673165B2 (en) 2016-05-10 2023-06-13 Invensense, Inc. Ultrasonic transducer operable in a surface acoustic wave (SAW) mode
US10562070B2 (en) 2016-05-10 2020-02-18 Invensense, Inc. Receive operation of an ultrasonic sensor
US10706835B2 (en) 2016-05-10 2020-07-07 Invensense, Inc. Transmit beamforming of a two-dimensional array of ultrasonic transducers
US10600403B2 (en) 2016-05-10 2020-03-24 Invensense, Inc. Transmit operation of an ultrasonic sensor
US10452887B2 (en) 2016-05-10 2019-10-22 Invensense, Inc. Operating a fingerprint sensor comprised of ultrasonic transducers
US10632500B2 (en) 2016-05-10 2020-04-28 Invensense, Inc. Ultrasonic transducer with a non-uniform membrane
US10846501B2 (en) 2017-04-28 2020-11-24 The Board Of Trustees Of The Leland Stanford Junior University Acoustic biometric touch scanner
US9953205B1 (en) 2017-04-28 2018-04-24 The Board Of Trustees Of The Leland Stanford Junior University Acoustic biometric touch scanner
US10489627B2 (en) 2017-04-28 2019-11-26 The Board Of Trustees Of The Leland Stanford Junior University Acoustic biometric touch scanner
US10891461B2 (en) 2017-05-22 2021-01-12 Invensense, Inc. Live fingerprint detection utilizing an integrated ultrasound and infrared sensor
US10474862B2 (en) 2017-06-01 2019-11-12 Invensense, Inc. Image generation in an electronic device using ultrasonic transducers
US10643052B2 (en) 2017-06-28 2020-05-05 Invensense, Inc. Image generation in an electronic device using ultrasonic transducers
JP7089020B2 (en) 2017-08-09 2022-06-21 ザ ボード オブ トラスティーズ オブ ザ レランド スタンフォード ジュニア ユニバーシティー Ultrasonic biosensing device integrated with optical equipment
US10984209B2 (en) 2017-12-01 2021-04-20 Invensense, Inc. Darkfield modeling
US10997388B2 (en) 2017-12-01 2021-05-04 Invensense, Inc. Darkfield contamination detection
WO2019109010A1 (en) 2017-12-01 2019-06-06 Invensense, Inc. Darkfield tracking
CN109972188A (en) * 2017-12-28 2019-07-05 亚硕企业股份有限公司 Active protection mechanism for electroplating equipment
US11151355B2 (en) 2018-01-24 2021-10-19 Invensense, Inc. Generation of an estimated fingerprint
US10755067B2 (en) 2018-03-22 2020-08-25 Invensense, Inc. Operating a fingerprint sensor comprised of ultrasonic transducers
US10936843B2 (en) 2018-12-28 2021-03-02 Invensense, Inc. Segmented image acquisition
WO2020263875A1 (en) 2019-06-24 2020-12-30 Invensense, Inc. Fake finger detection using ridge features
FR3097668B1 (en) * 2019-06-24 2021-07-02 Commissariat Energie Atomique TOUCH SURFACE DEVICE
WO2020264046A1 (en) 2019-06-25 2020-12-30 Invensense, Inc. Fake finger detection based on transient features
US11216632B2 (en) 2019-07-17 2022-01-04 Invensense, Inc. Ultrasonic fingerprint sensor with a contact layer of non-uniform thickness
US11176345B2 (en) 2019-07-17 2021-11-16 Invensense, Inc. Ultrasonic fingerprint sensor with a contact layer of non-uniform thickness
US11232549B2 (en) 2019-08-23 2022-01-25 Invensense, Inc. Adapting a quality threshold for a fingerprint image
US11392789B2 (en) 2019-10-21 2022-07-19 Invensense, Inc. Fingerprint authentication using a synthetic enrollment image
CN115551650A (en) 2020-03-09 2022-12-30 应美盛公司 Ultrasonic fingerprint sensor with contact layer of non-uniform thickness
US11243300B2 (en) 2020-03-10 2022-02-08 Invensense, Inc. Operating a fingerprint sensor comprised of ultrasonic transducers and a presence sensor
KR20210121976A (en) * 2020-03-31 2021-10-08 엘지디스플레이 주식회사 Vibration generation device and display apparatus having the same
US11328165B2 (en) 2020-04-24 2022-05-10 Invensense, Inc. Pressure-based activation of fingerprint spoof detection
US11995909B2 (en) 2020-07-17 2024-05-28 Tdk Corporation Multipath reflection correction
US12174295B2 (en) 2020-08-07 2024-12-24 Tdk Corporation Acoustic multipath correction
CN112450984A (en) * 2020-11-20 2021-03-09 深圳先进技术研究院 Ultrasonic endoscope system and ultrasonic transducer thereof
US12260050B2 (en) 2021-08-25 2025-03-25 Tdk Corporation Differential receive at an ultrasonic transducer

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050156362A1 (en) * 2003-11-29 2005-07-21 Joe Arnold Piezoelectric device and method of manufacturing same
US20090279747A1 (en) * 2008-05-08 2009-11-12 Sonavation, Inc. Method and System for Acoustic Impediography Biometric Sensing
US20110269307A1 (en) * 2010-04-30 2011-11-03 Sonavation, Inc. Method for Making Integrated Circuit Device Using Copper Metallization on 1-3 PZT Composite

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2001245936A1 (en) * 2000-03-23 2001-10-03 Cross Match Technologies, Inc. Piezoelectric identification device and applications thereof
US7724359B2 (en) * 2008-05-27 2010-05-25 Agere Systems Inc. Method of making electronic entities

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050156362A1 (en) * 2003-11-29 2005-07-21 Joe Arnold Piezoelectric device and method of manufacturing same
US20090279747A1 (en) * 2008-05-08 2009-11-12 Sonavation, Inc. Method and System for Acoustic Impediography Biometric Sensing
US20110269307A1 (en) * 2010-04-30 2011-11-03 Sonavation, Inc. Method for Making Integrated Circuit Device Using Copper Metallization on 1-3 PZT Composite

Also Published As

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WO2012061740A2 (en) 2012-05-10
US20120279865A1 (en) 2012-11-08

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