WO2010125623A1 - Dispositif d'affichage - Google Patents
Dispositif d'affichage Download PDFInfo
- Publication number
- WO2010125623A1 WO2010125623A1 PCT/JP2009/007106 JP2009007106W WO2010125623A1 WO 2010125623 A1 WO2010125623 A1 WO 2010125623A1 JP 2009007106 W JP2009007106 W JP 2009007106W WO 2010125623 A1 WO2010125623 A1 WO 2010125623A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- display
- organic
- display device
- layer
- thickness
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims abstract description 47
- 239000004033 plastic Substances 0.000 claims abstract description 30
- 229920003023 plastic Polymers 0.000 claims abstract description 30
- 239000011521 glass Substances 0.000 claims description 22
- 239000012790 adhesive layer Substances 0.000 claims description 15
- 229910052751 metal Inorganic materials 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 13
- 229920002457 flexible plastic Polymers 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 63
- 239000010408 film Substances 0.000 description 37
- 239000000463 material Substances 0.000 description 18
- 238000004519 manufacturing process Methods 0.000 description 15
- 238000005401 electroluminescence Methods 0.000 description 13
- 239000011347 resin Substances 0.000 description 12
- 229920005989 resin Polymers 0.000 description 12
- 230000005525 hole transport Effects 0.000 description 11
- 238000000034 method Methods 0.000 description 11
- 239000011229 interlayer Substances 0.000 description 10
- 239000010409 thin film Substances 0.000 description 9
- 239000002585 base Substances 0.000 description 5
- 239000000411 inducer Substances 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- -1 for example Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 239000009719 polyimide resin Substances 0.000 description 4
- 239000004925 Acrylic resin Substances 0.000 description 3
- 229920000178 Acrylic resin Polymers 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 238000001020 plasma etching Methods 0.000 description 3
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910021417 amorphous silicon Inorganic materials 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 229910052744 lithium Inorganic materials 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 229920000620 organic polymer Polymers 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 239000002861 polymer material Substances 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- BCMCBBGGLRIHSE-UHFFFAOYSA-N 1,3-benzoxazole Chemical compound C1=CC=C2OC=NC2=C1 BCMCBBGGLRIHSE-UHFFFAOYSA-N 0.000 description 1
- 229910052684 Cerium Inorganic materials 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 229910006404 SnO 2 Inorganic materials 0.000 description 1
- FZWLAAWBMGSTSO-UHFFFAOYSA-N Thiazole Chemical compound C1=CSC=N1 FZWLAAWBMGSTSO-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001962 electrophoresis Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 125000005394 methallyl group Chemical group 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920002098 polyfluorene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- ZXZKYYHTWHJHFT-UHFFFAOYSA-N quinoline-2,8-diol Chemical compound C1=CC(=O)NC2=C1C=CC=C2O ZXZKYYHTWHJHFT-UHFFFAOYSA-N 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- ODHXBMXNKOYIBV-UHFFFAOYSA-N triphenylamine Chemical compound C1=CC=CC=C1N(C=1C=CC=CC=1)C1=CC=CC=C1 ODHXBMXNKOYIBV-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Definitions
- the deformation preventing member may be formed of one type selected from the group consisting of glass, hard plastic, and metal.
- the organic EL display device 1 includes a plastic substrate 2 having a film-like flexibility (flexibility) made of a colorless and transparent resin film deposited at room temperature.
- a material for forming the plastic substrate 2 for example, an organic material such as polyparaxylene resin, acrylic resin, or polyimide resin can be used.
- an organic EL layer 8 is formed on the first electrode 7.
- the organic EL layer 8 includes a hole transport layer and a light emitting layer.
- the hole transport layer is not limited as long as the hole injection efficiency is good.
- organic materials such as a triphenylamine inducer, a polyparaphenylene vinylene (PPV) inducer, and a polyfluorene derivative can be used.
- the organic EL display element 11 is formed by the first electrode 7, the organic EL layer 8 having a light emitting layer and the second electrode 10 formed on the organic EL layer 8 while being formed on the first electrode 7. It is configured.
- the removal of the glass substrate 50 may not be peeling by laser light irradiation.
- the glass substrate 50 may be removed using a polishing and etching apparatus.
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
L'invention se rapporte à un dispositif d'affichage EL organique (1) muni d'un substrat de plastique (2) souple et d'un élément d'affichage EL organique (11) formé sur le substrat de plastique (2). Le dispositif d'affichage EL organique (1) possède une région d'affichage (21) et une région d'armature (22) qui est située à la périphérie de la région d'affichage (21). Sur la région d'affichage (21) se trouve un élément empêchant la déformation (28) qui évite la déformation de la région d'affichage (21).
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009-111300 | 2009-04-30 | ||
| JP2009111300 | 2009-04-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2010125623A1 true WO2010125623A1 (fr) | 2010-11-04 |
Family
ID=43031790
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2009/007106 WO2010125623A1 (fr) | 2009-04-30 | 2009-12-22 | Dispositif d'affichage |
Country Status (1)
| Country | Link |
|---|---|
| WO (1) | WO2010125623A1 (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3404732A1 (fr) * | 2017-05-19 | 2018-11-21 | GIO Optoelectronics Corp. | Dispositif électronique et son procédé de fabrication |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002040474A (ja) * | 2000-07-20 | 2002-02-06 | Samsung Electronics Co Ltd | 可撓性印刷回路基板を有する液晶表示装置 |
| JP2004103526A (ja) * | 2002-09-13 | 2004-04-02 | Dainippon Printing Co Ltd | Ｅｌ素子 |
| JP2004103471A (ja) * | 2002-09-11 | 2004-04-02 | Dainippon Printing Co Ltd | Ｅｌ素子 |
| JP2004103525A (ja) * | 2002-09-13 | 2004-04-02 | Dainippon Printing Co Ltd | 表示体 |
| JP2005284252A (ja) * | 2004-03-29 | 2005-10-13 | Samsung Sdi Co Ltd | 平板ディスプレイ装置 |
| WO2007144995A1 (fr) * | 2006-06-15 | 2007-12-21 | Sharp Kabushiki Kaisha | Affichage et son procédé de production |
-
2009
- 2009-12-22 WO PCT/JP2009/007106 patent/WO2010125623A1/fr active Application Filing
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002040474A (ja) * | 2000-07-20 | 2002-02-06 | Samsung Electronics Co Ltd | 可撓性印刷回路基板を有する液晶表示装置 |
| JP2004103471A (ja) * | 2002-09-11 | 2004-04-02 | Dainippon Printing Co Ltd | Ｅｌ素子 |
| JP2004103526A (ja) * | 2002-09-13 | 2004-04-02 | Dainippon Printing Co Ltd | Ｅｌ素子 |
| JP2004103525A (ja) * | 2002-09-13 | 2004-04-02 | Dainippon Printing Co Ltd | 表示体 |
| JP2005284252A (ja) * | 2004-03-29 | 2005-10-13 | Samsung Sdi Co Ltd | 平板ディスプレイ装置 |
| WO2007144995A1 (fr) * | 2006-06-15 | 2007-12-21 | Sharp Kabushiki Kaisha | Affichage et son procédé de production |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3404732A1 (fr) * | 2017-05-19 | 2018-11-21 | GIO Optoelectronics Corp. | Dispositif électronique et son procédé de fabrication |
| CN108962914A (zh) * | 2017-05-19 | 2018-12-07 | 启耀光电股份有限公司 | 电子装置与其制造方法 |
| US10403650B2 (en) | 2017-05-19 | 2019-09-03 | Gio Optoelectronics Corp. | Electronic device and manufacturing method thereof |
| CN108962914B (zh) * | 2017-05-19 | 2021-07-30 | 启耀光电股份有限公司 | 电子装置与其制造方法 |
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