WO2009118544A3 - Substrat optique et puce de détection optique - Google Patents
Substrat optique et puce de détection optique Download PDFInfo
- Publication number
- WO2009118544A3 WO2009118544A3 PCT/GB2009/000834 GB2009000834W WO2009118544A3 WO 2009118544 A3 WO2009118544 A3 WO 2009118544A3 GB 2009000834 W GB2009000834 W GB 2009000834W WO 2009118544 A3 WO2009118544 A3 WO 2009118544A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- substrate
- optical substrate
- sensing chip
- optical
- cured polymer
- Prior art date
Links
- 230000003287 optical effect Effects 0.000 title abstract 5
- 239000000758 substrate Substances 0.000 title abstract 5
- 229920000642 polymer Polymers 0.000 abstract 3
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/55—Specular reflectivity
- G01N21/552—Attenuated total reflection
- G01N21/553—Attenuated total reflection and using surface plasmons
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/04—Prisms
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/122—Basic optical elements, e.g. light-guiding paths
- G02B6/1221—Basic optical elements, e.g. light-guiding paths made from organic materials
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/13—Integrated optical circuits characterised by the manufacturing method
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/13—Integrated optical circuits characterised by the manufacturing method
- G02B6/138—Integrated optical circuits characterised by the manufacturing method by using polymerisation
Landscapes
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Organic Chemistry (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Life Sciences & Earth Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating Or Analysing Materials By Optical Means (AREA)
- Optical Measuring Cells (AREA)
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
Abstract
L'invention concerne un procédé de fabrication d'un substrat optique pour des applications de détection optique, qui comprend le durcissement d'un polymère durcissable dans un moule, avec la condition que le substrat soit complètement ou partiellement formé en polymère durci et que le polymère durci soit façonné de manière à pouvoir diriger la lumière vers une surface intérieure du substrat ou d'une couche qui y est prévue, à un angle égal ou supérieur à l'angle critique de la réflexion interne totale à cet emplacement. L'invention concerne également des puces de détection optique qui contiennent le substrat optique.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0805728.3 | 2008-03-28 | ||
GBGB0805728.3A GB0805728D0 (en) | 2008-03-28 | 2008-03-28 | An optical substrate and sensing chip |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2009118544A2 WO2009118544A2 (fr) | 2009-10-01 |
WO2009118544A3 true WO2009118544A3 (fr) | 2010-06-03 |
Family
ID=39386968
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/GB2009/000834 WO2009118544A2 (fr) | 2008-03-28 | 2009-03-27 | Substrat optique et puce de détection optique |
Country Status (2)
Country | Link |
---|---|
GB (2) | GB0805728D0 (fr) |
WO (1) | WO2009118544A2 (fr) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013148630A1 (fr) * | 2012-03-27 | 2013-10-03 | Corning Incorporated | Substrat de capteur à faible biréfringence et procédés associés |
US10086536B2 (en) | 2014-10-02 | 2018-10-02 | United Technologies Corporation | Metallographic sample preparation method and metallographic sample mold |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6579721B1 (en) * | 1999-07-30 | 2003-06-17 | Surromed, Inc. | Biosensing using surface plasmon resonance |
US20030180966A1 (en) * | 2002-03-20 | 2003-09-25 | Wisconsin Alumni Research Foundation | Optical imaging of nanostructured substrates |
JP2007071548A (ja) * | 2005-09-02 | 2007-03-22 | Nippon Telegr & Teleph Corp <Ntt> | 表面プラズモン共鳴スペクトル測定用のプリズム・液溜め一体型チップ、その製造方法、およびそれを用いた表面プラズモン共鳴測定装置 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100541027B1 (ko) * | 2003-07-19 | 2006-01-11 | 주식회사 옵토메카 | 이미지 센서 및 이미지 센서 제작방법과 이에 이용되는마이크로 광집속 소자 어레이 제작용 몰드 |
-
2008
- 2008-03-28 GB GBGB0805728.3A patent/GB0805728D0/en not_active Ceased
-
2009
- 2009-03-27 GB GB0905274A patent/GB2458782A/en not_active Withdrawn
- 2009-03-27 WO PCT/GB2009/000834 patent/WO2009118544A2/fr active Application Filing
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6579721B1 (en) * | 1999-07-30 | 2003-06-17 | Surromed, Inc. | Biosensing using surface plasmon resonance |
US20030180966A1 (en) * | 2002-03-20 | 2003-09-25 | Wisconsin Alumni Research Foundation | Optical imaging of nanostructured substrates |
JP2007071548A (ja) * | 2005-09-02 | 2007-03-22 | Nippon Telegr & Teleph Corp <Ntt> | 表面プラズモン共鳴スペクトル測定用のプリズム・液溜め一体型チップ、その製造方法、およびそれを用いた表面プラズモン共鳴測定装置 |
Non-Patent Citations (4)
Title |
---|
DATABASE WPI Week 200745, Derwent World Patents Index; AN 2007-461843, XP002553527 * |
MATSUSHITA ET AL: "Development of new single-mode waveguide surface plasmon resonance sensor using a polymer imprint process for high-throughput fabrication and improved design flexibility", SENSORS AND ACTUATORS B, ELSEVIER SEQUOIA S.A., LAUSANNE, CH, vol. 129, no. 2, 13 February 2008 (2008-02-13), pages 881 - 887, XP022479498, ISSN: 0925-4005 * |
PAULA OBREJA ET AL: "Polymer-based chips for surface plasmon resonance sensors", JOURNAL OF OPTICS. A, PURE AND APPLIED OPTICS, INSTITUTE OF PHYSICS PUBLISHING, BRISTOL, GB, vol. 10, no. 6, 1 June 2008 (2008-06-01), pages 64010, XP020138067, ISSN: 1464-4258 * |
ZHAO-XIN GENG ET AL.: "A surface plasmon resonance (SPR) sensor chip integrating prism array based on polymer microfabrication", 2008 9TH INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED-CIRCUIT TECHNOLOGY, 20 October 2008 (2008-10-20) - 23 October 2008 (2008-10-23), Piscataway, NJ, USA, pages 1 - 4, XP002553526 * |
Also Published As
Publication number | Publication date |
---|---|
WO2009118544A2 (fr) | 2009-10-01 |
GB0805728D0 (en) | 2008-04-30 |
GB0905274D0 (en) | 2009-05-13 |
GB2458782A (en) | 2009-10-07 |
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