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WO2009118544A3 - An optical substrate and sensing chip - Google Patents

An optical substrate and sensing chip Download PDF

Info

Publication number
WO2009118544A3
WO2009118544A3 PCT/GB2009/000834 GB2009000834W WO2009118544A3 WO 2009118544 A3 WO2009118544 A3 WO 2009118544A3 GB 2009000834 W GB2009000834 W GB 2009000834W WO 2009118544 A3 WO2009118544 A3 WO 2009118544A3
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
optical substrate
sensing chip
optical
cured polymer
Prior art date
Application number
PCT/GB2009/000834
Other languages
French (fr)
Other versions
WO2009118544A2 (en
Inventor
Behnam Bastani
Nicholas John Goddard
Rolan Mansour
Original Assignee
The Secretary Of State For Defence
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by The Secretary Of State For Defence filed Critical The Secretary Of State For Defence
Publication of WO2009118544A2 publication Critical patent/WO2009118544A2/en
Publication of WO2009118544A3 publication Critical patent/WO2009118544A3/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/55—Specular reflectivity
    • G01N21/552—Attenuated total reflection
    • G01N21/553—Attenuated total reflection and using surface plasmons
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/04—Prisms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122—Basic optical elements, e.g. light-guiding paths
    • G02B6/1221—Basic optical elements, e.g. light-guiding paths made from organic materials
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/13—Integrated optical circuits characterised by the manufacturing method
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/13—Integrated optical circuits characterised by the manufacturing method
    • G02B6/138—Integrated optical circuits characterised by the manufacturing method by using polymerisation

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
  • Optical Measuring Cells (AREA)
  • Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)

Abstract

There is provided a method for the manufacture of an optical substrate (19) for optical sensing applications comprising curing a curable polymer in a mould (14) providing that the substrate (19) is wholly or partly formed from the cured polymer and that the cured polymer is shaped so as to be capable of directing light to an internal surface of the substrate (19), or of a layer (21,22) provided thereto, at an angle equal to or greater than the critical angle for total internal reflection thereat. Also provided are optical sensing chips (20) including the optical substrate (19).
PCT/GB2009/000834 2008-03-28 2009-03-27 An optical substrate and sensing chip WO2009118544A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GBGB0805728.3A GB0805728D0 (en) 2008-03-28 2008-03-28 An optical substrate and sensing chip
GB0805728.3 2008-03-28

Publications (2)

Publication Number Publication Date
WO2009118544A2 WO2009118544A2 (en) 2009-10-01
WO2009118544A3 true WO2009118544A3 (en) 2010-06-03

Family

ID=39386968

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/GB2009/000834 WO2009118544A2 (en) 2008-03-28 2009-03-27 An optical substrate and sensing chip

Country Status (2)

Country Link
GB (2) GB0805728D0 (en)
WO (1) WO2009118544A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013148630A1 (en) * 2012-03-27 2013-10-03 Corning Incorporated Low birefringent sensor substrate and methods thereof
US10086536B2 (en) * 2014-10-02 2018-10-02 United Technologies Corporation Metallographic sample preparation method and metallographic sample mold

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6579721B1 (en) * 1999-07-30 2003-06-17 Surromed, Inc. Biosensing using surface plasmon resonance
US20030180966A1 (en) * 2002-03-20 2003-09-25 Wisconsin Alumni Research Foundation Optical imaging of nanostructured substrates
JP2007071548A (en) * 2005-09-02 2007-03-22 Nippon Telegr & Teleph Corp <Ntt> Prism/liquid reservoir integrated type chip for measuring surface plasmon resonance spectrum, its manufacturing method and surface plasmon resonance measuring instrument using prism/liquid reservoir integrated type chip

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100541027B1 (en) * 2003-07-19 2006-01-11 주식회사 옵토메카 Image sensor and image sensor manufacturing method and mold for manufacturing micro light concentrating element array

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6579721B1 (en) * 1999-07-30 2003-06-17 Surromed, Inc. Biosensing using surface plasmon resonance
US20030180966A1 (en) * 2002-03-20 2003-09-25 Wisconsin Alumni Research Foundation Optical imaging of nanostructured substrates
JP2007071548A (en) * 2005-09-02 2007-03-22 Nippon Telegr & Teleph Corp <Ntt> Prism/liquid reservoir integrated type chip for measuring surface plasmon resonance spectrum, its manufacturing method and surface plasmon resonance measuring instrument using prism/liquid reservoir integrated type chip

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
DATABASE WPI Week 200745, Derwent World Patents Index; AN 2007-461843, XP002553527 *
MATSUSHITA ET AL: "Development of new single-mode waveguide surface plasmon resonance sensor using a polymer imprint process for high-throughput fabrication and improved design flexibility", SENSORS AND ACTUATORS B, ELSEVIER SEQUOIA S.A., LAUSANNE, CH, vol. 129, no. 2, 13 February 2008 (2008-02-13), pages 881 - 887, XP022479498, ISSN: 0925-4005 *
PAULA OBREJA ET AL: "Polymer-based chips for surface plasmon resonance sensors", JOURNAL OF OPTICS. A, PURE AND APPLIED OPTICS, INSTITUTE OF PHYSICS PUBLISHING, BRISTOL, GB, vol. 10, no. 6, 1 June 2008 (2008-06-01), pages 64010, XP020138067, ISSN: 1464-4258 *
ZHAO-XIN GENG ET AL.: "A surface plasmon resonance (SPR) sensor chip integrating prism array based on polymer microfabrication", 2008 9TH INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED-CIRCUIT TECHNOLOGY, 20 October 2008 (2008-10-20) - 23 October 2008 (2008-10-23), Piscataway, NJ, USA, pages 1 - 4, XP002553526 *

Also Published As

Publication number Publication date
WO2009118544A2 (en) 2009-10-01
GB0805728D0 (en) 2008-04-30
GB2458782A (en) 2009-10-07
GB0905274D0 (en) 2009-05-13

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