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WO2009116421A1 - Procédé de fabrication d'un guide d'ondes optique - Google Patents

Procédé de fabrication d'un guide d'ondes optique Download PDF

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Publication number
WO2009116421A1
WO2009116421A1 PCT/JP2009/054499 JP2009054499W WO2009116421A1 WO 2009116421 A1 WO2009116421 A1 WO 2009116421A1 JP 2009054499 W JP2009054499 W JP 2009054499W WO 2009116421 A1 WO2009116421 A1 WO 2009116421A1
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WO
WIPO (PCT)
Prior art keywords
core
clad layer
optical waveguide
film
forming resin
Prior art date
Application number
PCT/JP2009/054499
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English (en)
Japanese (ja)
Inventor
正利 山口
智章 柴田
敦之 高橋
Original Assignee
日立化成工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 日立化成工業株式会社 filed Critical 日立化成工業株式会社
Priority to JP2010503838A priority Critical patent/JPWO2009116421A1/ja
Priority to CN2009801087565A priority patent/CN101971065A/zh
Publication of WO2009116421A1 publication Critical patent/WO2009116421A1/fr

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122—Basic optical elements, e.g. light-guiding paths
    • G02B6/1221—Basic optical elements, e.g. light-guiding paths made from organic materials
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/13—Integrated optical circuits characterised by the manufacturing method
    • G02B6/138—Integrated optical circuits characterised by the manufacturing method by using polymerisation

Definitions

  • the present invention relates to a method for manufacturing an optical waveguide having a uniform core and excellent productivity.
  • optical interconnection technology that uses optical signals not only for communication fields such as trunk lines and access systems but also for information processing in routers and servers is underway.
  • an opto-electric hybrid board in which an optical transmission line is combined with an optical transmission path has been developed.
  • an optical transmission line it is desirable to use an optical waveguide that has a higher degree of freedom of wiring and can be densified than an optical fiber, and in particular, an optical waveguide that uses a polymer material with excellent workability and economy. Is promising.
  • an optical waveguide coexists with an electric wiring board, high transparency and high heat resistance are required.
  • an optical waveguide material fluorinated polyimide (for example, Non-Patent Document 1) or epoxy resin (for example, Patent Document 1). ) has been proposed.
  • fluorinated polyimide has a high heat resistance of 300 ° C. or higher and a high transparency of 0.3 dB / cm at a wavelength of 850 nm
  • film formation requires heating conditions of 300 ° C. or more for several tens of minutes to several hours. For this reason, it is difficult to form a film on an electric wiring board.
  • fluorinated polyimide has no photosensitivity, the optical waveguide production method by photosensitivity / development cannot be applied, and the productivity and the area increase are inferior.
  • an optical waveguide is produced using a method of applying a liquid material on a substrate and forming a film
  • the film thickness management is complicated, and the resin applied on the substrate is liquid before curing, There was a problem caused by the material form being liquid, for example, it was difficult to maintain the uniformity of the film thickness because the resin flowed on the substrate.
  • the epoxy resin for forming an optical waveguide in which a photopolymerization initiator is added to a liquid epoxy resin can form a core pattern by a photosensitive / developing method, and some of the materials have high transparency and high heat resistance. There was a similar problem caused by being liquid.
  • a dry film containing a radiation-polymerizable component is laminated on the substrate, and a predetermined amount of light is irradiated to cure the radiation at a predetermined location to form a clad, and develop an unexposed portion as necessary.
  • a method of forming an optical waveguide having excellent transmission characteristics by forming a core portion and the like and further forming a cladding for embedding the core portion is useful. When this method is used, it is easy to ensure the flatness of the clad after embedding the core. It is also suitable for manufacturing a large-area optical waveguide.
  • a vacuum type having a vacuum chamber formed by a pair of block bodies relatively movable up and down as disclosed in FIGS.
  • FIGS. There are known a so-called vacuum laminating method in which lamination is performed under a reduced pressure using a laminator, and a so-called roll laminating method in which lamination is performed while thermocompression bonding is performed with upper and lower heat rolls.
  • Patent Document 3 A method of manufacturing an optical waveguide using the vacuum laminating method as described above is disclosed in, for example, Patent Document 3, and a method of manufacturing an optical waveguide using a roll laminating method is described in, for example, Patent Document 4. It is disclosed.
  • Patent Document 3 there is a description that it is preferable to use a vacuum pressurization laminator when forming the core layer and the upper cladding layer (Patent Document 3, paragraph 0064, and In the example, a vacuum pressurization type laminator is used (see Patent Document 3 and Example 1).
  • a lower clad layer and a core layer are produced by a roll laminating method using a radiation curable dry film, and an upper clad layer is produced before producing the dry film. Is formed by a spin coating method (see Patent Document 4, paragraphs 0017 to 0019).
  • JP-A-6-228274 Japanese Patent Laid-Open No. 11-320682 International Publication No. 2007/091596 Japanese Patent No. 4186462 Journal of Japan Institute of Electronics Packaging, Vol. 7, no. 3, pp. 213-218, 2004
  • the roll laminating method has few problems with the vacuum laminating method, but it has also been found that there is a problem in the embedding property such that air remains at the base of the convex portion and voids are generated on a substrate with unevenness.
  • a coating method such as spin coating as disclosed in Patent Document 4
  • the present invention has been made in view of such problems, and an object thereof is to provide a method for manufacturing an optical waveguide having a uniform core with high productivity.
  • the present invention (1) A step of curing a resin for forming a cladding layer formed on a substrate to form a lower cladding layer, a step of forming a core layer by laminating a resin film for forming a core layer on the lower cladding layer, A method of manufacturing an optical waveguide, comprising: a step of exposing and developing the core layer to form a core pattern; and a step of curing a resin for forming a cladding layer formed so as to embed the core pattern to form an upper cladding layer
  • the step of forming the core layer is to heat-press the core layer-forming resin film on the lower clad layer using a roll laminator, and the step of forming the upper clad layer is a flat plate laminator.
  • the lower clad layer has a step formed on the surface on the core layer lamination side, characterized in that Characterized in that no method of manufacturing an optical waveguide according to (1), Is to provide.
  • the optical waveguide manufactured according to the present invention includes, for example, an optical waveguide having a lower clad layer 2, a core pattern 8, and an upper clad layer 9 on a substrate 1, as shown in FIGS. 1 (f) and 2 (g).
  • the type of the substrate 1 is not particularly limited.
  • an FR-4 substrate, polyimide, a semiconductor substrate, a silicon substrate, a glass substrate, or the like can be used.
  • a film as the substrate 1 flexibility and toughness can be imparted to the optical waveguide.
  • the material of the film is not particularly limited, but from the viewpoint of flexibility and toughness, polyesters such as polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate, polyethylene, polypropylene, polyamide, polycarbonate, polyphenylene ether, polyether Preferred examples include sulfide, polyarylate, liquid crystal polymer, polysulfone, polyethersulfone, polyetheretherketone, polyetherimide, polyamideimide, and polyimide.
  • the thickness of the film may be appropriately changed depending on the intended flexibility, but is preferably 5 to 250 ⁇ m. If it is 5 ⁇ m or more, there is an advantage that toughness is easily obtained, and if it is 250 ⁇ m or less, sufficient flexibility can be obtained.
  • a support film 10 used in the process of manufacturing a clad layer forming resin film 200 described later can be used as the substrate 1 shown in FIG. 1.
  • the clad layer forming resin film 200 as shown in FIG. 3, it is preferable that the clad layer forming resin 20 is formed on the support film 10 subjected to the adhesion treatment.
  • the adhesive force of the lower clad layer 2 and the base material 1 can be improved, and the peeling defect of the lower clad layer 2 and the base material 1 can be suppressed.
  • the adhesion treatment is a treatment for improving the adhesion force between the support film 10 and the clad layer forming resin 20 formed thereon by easy adhesion resin coating, corona treatment, mat processing by sandblasting, or the like.
  • a base material different from the support film 10 is used as the base material 1
  • the film 200 may be transferred onto the substrate 1 by a laminating method or the like. In this case, it is preferable that an adhesive treatment is not performed on the support film 10.
  • a base material on the outer side of an upper clad layer As a kind of this base material, the thing similar to the base material 1 mentioned above is mentioned, for example, as shown in FIG.1 (f) Examples thereof include a support film 10 used in the production process of a clad layer forming resin film 200 described later.
  • a multilayer optical waveguide may be produced by laminating a plurality of polymer layers having a core pattern and a clad layer on one or both surfaces of the substrate 1 described above. Furthermore, an electrical wiring may be provided on the above-described base material 1, and in this case, a material provided with an electrical wiring in advance can be used as the base material 1. Alternatively, electrical wiring can be formed on the substrate 1 after manufacturing the optical waveguide. Thereby, both the signal transmission line of the metal wiring and the signal transmission line of the optical waveguide are provided on the base material 1 and both can be used properly, and signal transmission at a high speed and a long distance can be easily performed. Can do.
  • the clad layer forming resin used in the present invention is not particularly limited as long as it is a resin composition that has a lower refractive index than the core layer and is cured by light or heat, and a thermosetting resin composition or a photosensitive resin composition is used. It can be preferably used. More preferably, the clad layer forming resin is preferably composed of a resin composition containing (A) a base polymer, (B) a photopolymerizable compound, and (C) a photopolymerization initiator.
  • the resin composition used for the cladding layer forming resin may be the same or different in the components contained in the resin composition in the upper cladding layer 9 and the lower cladding layer 2.
  • the refractive indexes may be the same or different.
  • the (A) base polymer used here is for forming a clad layer and ensuring the strength of the clad layer, and is not particularly limited as long as the object can be achieved, phenoxy resin, epoxy resin, (Meth) acrylic resin, polycarbonate resin, polyarylate resin, polyether amide, polyether imide, polyether sulfone, etc., or derivatives thereof. These base polymers may be used alone or in combination of two or more.
  • the main chain has an aromatic skeleton from the viewpoint of high heat resistance, and a phenoxy resin is particularly preferable.
  • an epoxy resin particularly an epoxy resin that is solid at room temperature is preferable.
  • compatibility with the photopolymerizable compound (B) described in detail later is important for ensuring the transparency of the resin for forming the cladding layer.
  • the phenoxy resin and the (meth) acrylic resin are used. Is preferred.
  • (meth) acrylic resin means acrylic resin and methacrylic resin.
  • phenoxy resins those containing bisphenol A, bisphenol A-type epoxy compounds or derivatives thereof, and bisphenol F, bisphenol F-type epoxy compounds or derivatives thereof as constituent units of copolymer components are heat resistant, adhesive and soluble. It is preferable because of its excellent properties.
  • Preferred examples of the bisphenol A or bisphenol A type epoxy compound include tetrabromobisphenol A and tetrabromobisphenol A type epoxy compounds.
  • tetrabromobisphenol F, a tetrabromobisphenol F type epoxy compound, etc. are mentioned suitably.
  • Specific examples of the bisphenol A / bisphenol F copolymer type phenoxy resin include “Phenotote YP-70” (trade name) manufactured by Toto Kasei Co., Ltd.
  • epoxy resin that is solid at room temperature examples include, for example, “Epototo YD-7020, Epototo YD-7019, Epototo YD-7007” (all trade names) manufactured by Toto Chemical Co., Ltd., and “Epicoat 1010” manufactured by Japan Epoxy Resins Co., Ltd. Bisphenol A type epoxy resin such as “Epicoat 1009, Epicoat 1008” (both trade names).
  • the photopolymerizable compound is not particularly limited as long as it is polymerized by irradiation with light such as ultraviolet rays, and the compound having an ethylenically unsaturated group in the molecule or two or more in the molecule.
  • examples thereof include compounds having an epoxy group.
  • examples of the compound having an ethylenically unsaturated group in the molecule include (meth) acrylate, vinylidene halide, vinyl ether, vinyl pyridine, vinyl phenol, etc., among these, from the viewpoint of transparency and heat resistance, (Meth) acrylate is preferred.
  • As the (meth) acrylate any of monofunctional, bifunctional, trifunctional or higher polyfunctional ones can be used.
  • (meth) acrylate means acrylate and methacrylate.
  • Examples of the compound having two or more epoxy groups in the molecule include bifunctional or polyfunctional aromatic glycidyl ethers such as bisphenol A type epoxy resins, bifunctional or polyfunctional aliphatic glycidyl ethers such as polyethylene glycol type epoxy resins, and water.
  • Bifunctional alicyclic glycidyl ether such as bisphenol A type epoxy resin, bifunctional aromatic glycidyl ester such as diglycidyl phthalate, bifunctional alicyclic glycidyl ester such as tetrahydrophthalic acid diglycidyl ester, N, N- Bifunctional or polyfunctional aromatic glycidylamine such as diglycidylaniline, bifunctional alicyclic epoxy resin such as alicyclic diepoxycarboxylate, bifunctional heterocyclic epoxy resin, polyfunctional heterocyclic epoxy resin, bifunctional Or polyfunctional silicon-containing epoxy tree And the like.
  • These (B) photopolymerizable compounds can be used alone or in combination of two or more.
  • the photopolymerization initiator of the component (C) is not particularly limited.
  • an aryldiazonium salt, diaryliodonium salt, triarylsulfonium salt, triaryl Examples include selenonium salts, dialkylphenazylsulfonium salts, dialkyl-4-hydroxyphenylsulfonium salts, and sulfonate esters.
  • aromatic ketones such as benzophenone, quinones such as 2-ethylanthraquinone, and benzoin ethers such as benzoin methyl ether
  • benzoin compounds such as benzoin, benzyl derivatives such as benzyldimethyl ketal, 2,4,5-triarylimidazole dimers such as 2- (o-chlorophenyl) -4,5-diphenylimidazole dimer, 2- Benzimidazoles such as mercaptobenzimidazole, phosphine oxides such as bis (2,4,6-trimethylbenzoyl) phenylphosphine oxide, acridine derivatives such as 9-phenylacridine, N-phenylglycine, N-phenylglycine derivatives , Coumarin system Things and the like.
  • thioxanthone type compound and a tertiary amine compound like the combination of diethyl thioxanthone and dimethylaminobenzoic acid.
  • aromatic ketones and phosphine oxides are preferred from the viewpoint of improving the transparency of the core layer and the cladding layer.
  • These (C) photopolymerization initiators can be used alone or in combination of two or more.
  • the blending amount of the (A) base polymer is preferably 5 to 80% by mass with respect to the total amount of the components (A) and (B).
  • the blending amount of the (B) photopolymerizable compound is preferably 95 to 20% by mass with respect to the total amount of the components (A) and (B).
  • the component (A) when the component (A) is 80% by mass or less and the component (B) is 20% by mass or more, the (A) base polymer can be easily entangled and cured, and an optical waveguide is formed. Furthermore, the pattern formability is improved and the photocuring reaction proceeds sufficiently.
  • the blending amounts of the component (A) and the component (B) are more preferably 10 to 85% by mass of the component (A) and 90 to 15% by mass of the component (B). More preferably, the content is 80% by mass and the component (B) is 80-30% by mass.
  • the blending amount of the (C) photopolymerization initiator is preferably 0.1 to 10 parts by mass with respect to 100 parts by mass of the total amount of the components (A) and (B).
  • the blending amount is 0.1 parts by mass or more, the photosensitivity is sufficient, while when it is 10 parts by mass or less, the absorption in the surface layer of the photosensitive resin composition does not increase during exposure, and the internal Is sufficiently cured.
  • the propagation loss does not increase due to the light absorption effect of the polymerization initiator itself. From the above viewpoint, the blending amount of the (C) photopolymerization initiator is more preferably 0.2 to 5 parts by mass.
  • an antioxidant in the cladding layer forming resin, an antioxidant, an anti-yellowing agent, an ultraviolet absorber, a visible light absorber, a colorant, a plasticizer, a stabilizer, a filler, etc. You may add what is called an additive in the ratio which does not have a bad influence on the effect of this invention.
  • the resin film for forming a clad layer (FIGS. 3 and 200) is obtained by dissolving the resin composition containing the components (A) to (C) in a solvent and applying the solution to the support film 10 to remove the solvent. Can be manufactured more easily.
  • the support film 10 used in the manufacturing process of the clad layer forming resin film 200 is not particularly limited with respect to the material thereof, and various films can be used. From the viewpoints of flexibility and toughness as the support film, those exemplified as the film material of the substrate 1 described above can be similarly mentioned.
  • the thickness of the support film 10 may be appropriately changed depending on the intended flexibility, but is preferably 5 to 250 ⁇ m.
  • the protective film 11 may be bonded to the clad layer forming resin film 200 as necessary from the viewpoints of protection of the clad layer forming resin film 200 and winding property when manufacturing in a roll shape.
  • the protective film 11 the thing similar to what was mentioned as an example as the support body film 10 can be used, and the mold release process and the antistatic process may be performed as needed.
  • the solvent used here is not particularly limited as long as it can dissolve the resin composition.
  • a solvent such as glycol monomethyl ether acetate, cyclohexanone, N-methyl-2-pyrrolidone, or a mixed solvent thereof can be used.
  • the solid concentration in the resin solution is preferably about 30 to 80% by mass.
  • the thickness after drying is preferably in the range of 5 to 500 ⁇ m.
  • the thickness is 5 ⁇ m or more, a clad thickness necessary for light confinement can be secured, and when the thickness is 500 ⁇ m or less, it is easy to control the film thickness uniformly.
  • the thickness of the cladding layers 2 and 9 is more preferably in the range of 10 to 100 ⁇ m.
  • the thickness of the clad layers 2 and 9 may be the same or different in the lower clad layer 2 formed first and the upper clad layer 9 for embedding the core pattern, but the core pattern is buried. Therefore, the thickness of the upper clad layer 9 is preferably thicker than the thickness of the core layer 3.
  • the core layer forming resin 30 constituting the core layer forming resin film 300 is a resin that is designed such that the core layer 3 has a higher refractive index than the clad layers 2 and 9 and can form the core pattern 8 by actinic rays.
  • a composition can be used, and a photosensitive resin composition is preferred.
  • the core layer-forming resin film 300 can be easily manufactured by dissolving the resin composition containing the components (A) to (C) in a solvent, applying the resin composition to the support film 4, and removing the solvent. it can.
  • the solvent used here is not particularly limited as long as it can dissolve the resin composition, and those exemplified as the solvent used in the production of the above-described resin film for forming a clad can be used.
  • the solid content concentration in the resin solution is usually preferably 30 to 80% by mass.
  • the thickness of the core layer forming resin film 300 is not particularly limited, and the thickness of the dried core layer 3 is usually adjusted to be 10 to 100 ⁇ m. If the thickness of the film is 10 ⁇ m or more, there is an advantage that the alignment tolerance can be increased in the coupling with the light emitting / receiving element or the optical fiber after the optical waveguide is formed. There is an advantage that coupling efficiency is improved in coupling with a light emitting element or an optical fiber. From the above viewpoint, the thickness of the film is preferably in the range of 30 to 70 ⁇ m.
  • the support film 4 used in the manufacturing process of the core layer forming resin film 300 is a support film that supports the core layer forming resin 30 and the material thereof is not particularly limited. From the viewpoint that it is easy to peel off and has heat resistance and solvent resistance, polyesters such as polyethylene terephthalate, polypropylene, polyethylene and the like are preferable.
  • the thickness of the support film 4 is preferably 5 to 50 ⁇ m. When it is 5 ⁇ m or more, there is an advantage that the strength as the support film 4 is easily obtained, and when it is 50 ⁇ m or less, there is an advantage that a gap with the mask at the time of pattern formation becomes small and a finer pattern can be formed. .
  • the thickness of the support film 4 is more preferably in the range of 10 to 40 ⁇ m, particularly preferably 15 to 30 ⁇ m.
  • the protective film 11 may be bonded to the core layer forming resin film 300 as necessary.
  • the protective film 11 the thing similar to what was mentioned as the example as the support body film 4 can be used, and the mold release process and the antistatic process may be performed as needed.
  • FIGS. 1 and 2 Optical waveguide manufacturing method
  • a clad layer forming resin film FIGS. 3 and 200
  • a core layer forming resin film FIGS. 4 and 300
  • the clad layer forming resin 20 FIG. 3, 200
  • the support film 10 is used to light or heat the clad layer forming resin 20.
  • the support film 10 becomes the base material 1 of the lower cladding layer 2 shown in FIG.
  • the lower cladding layer 2 is preferably flat without a step on the surface on the core layer lamination side, from the viewpoint of adhesion to the core layer described later. Moreover, the surface flatness of the clad layer 2 can be ensured by using the resin film for forming the clad layer.
  • the clad layer forming resin 20 is lighted or heated after the protective film is peeled off.
  • the clad layer 2 is formed by curing. At this time, it is preferable that the clad layer forming resin 20 is formed on the support film 10 subjected to the adhesion treatment.
  • the protective film 11 is preferably not subjected to an adhesive treatment in order to facilitate peeling from the clad layer forming resin film 200, and may be subjected to a release treatment as necessary.
  • a substrate 1 different from the support film 10 can be used as the substrate 1.
  • the protective layer 11 is present on the clad layer forming resin film 200, the protective layer 11 is peeled off, and then the clad layer forming resin film 200 is applied to the substrate 1 as shown in FIG. Transfer is performed by a laminating method using a roll laminator 5 or the like, and the support film 10 is peeled off.
  • the clad layer forming resin 20 is cured by light or heating to form the lower clad layer 2.
  • the clad layer forming resin film 200 may be composed of the clad layer forming resin 20 alone.
  • the core layer 3 is formed on the lower clad layer 2 by the second and third processes described in detail below.
  • the core layer forming resin film 300 is laminated on the lower cladding layer 2 to form the core layer 3 having a higher refractive index than that of the lower cladding layer 2.
  • the core layer forming resin film 300 is thermocompression-bonded using the roll laminator 5 on the lower clad layer 2 to laminate the core layer 3 (FIG. 1B, FIG. 2 (c)). Adhesion and followability are improved by thermocompression bonding.
  • the laminating temperature is preferably in the range of 30 ° C to 100 ° C.
  • the adhesion between the lower cladding layer and the core layer is improved, and when the temperature is 40 ° C. or higher, the adhesion can be further improved.
  • the required film thickness can be obtained without the core layer flowing during roll lamination. From the above viewpoint, the range of 40 to 70 ° C is more preferable, and the range of 50 to 60 ° C is more preferable.
  • the pressure is preferably 0.2 to 0.9 MPa.
  • the laminating speed is preferably 0.1 to 3 m / min, but these conditions are not particularly limited.
  • the core layer forming resin film 300 is preferably composed of the core layer forming resin 30 and the support film 4 from the viewpoint of handleability.
  • the core layer forming resin 30 is disposed on the lower clad layer 2 side. And laminate.
  • the core layer forming resin film 300 may be composed of the core layer forming resin 30 alone.
  • the protective film 11 is provided on the opposite side of the base material of the core layer forming resin film 300 as shown in FIG. 4, the core layer forming resin film 300 is laminated after the protective film 11 is peeled off. At this time, it is preferable that the protective film 11 and the support film 4 have not been subjected to an adhesive treatment in order to facilitate peeling from the core layer-forming resin film 300, and may be subjected to a release treatment as necessary. Good.
  • the core layer 3 is exposed and developed to form the optical waveguide core pattern 8 (FIGS. 1C, 1D, 2D, and 2E).
  • actinic rays are irradiated in an image form through the photomask pattern 7.
  • the active light source include known light sources that effectively emit ultraviolet rays, such as carbon arc lamps, mercury vapor arc lamps, ultrahigh pressure mercury lamps, high pressure mercury lamps, and xenon lamps.
  • those that effectively emit visible light such as a photographic flood bulb and a solar lamp, can be used.
  • the support film 4 of the resin film 300 for core layer formation remains, the support film 4 is peeled off, and the unexposed portion is removed and developed by wet development or the like to form the core pattern 8.
  • wet development development is performed by a known method such as spraying, rocking dipping, brushing, scraping, or the like, using an organic solvent developer suitable for the composition of the film.
  • organic solvent developers examples include N-methylpyrrolidone, N, N-dimethylformamide, N, N-dimethylacetamide, cyclohexanone, methyl ethyl ketone, methyl isobutyl ketone, ⁇ -butyrolactone, methyl cellosolve, ethyl cellosolve, propylene glycol monomethyl
  • organic solvent developers include N-methylpyrrolidone, N, N-dimethylformamide, N, N-dimethylacetamide, cyclohexanone, methyl ethyl ketone, methyl isobutyl ketone, ⁇ -butyrolactone, methyl cellosolve, ethyl cellosolve, propylene glycol monomethyl
  • examples include ether and propylene glycol monomethyl ether acetate. Moreover, you may use together 2 or more types of image development methods as needed.
  • the development method examples include a dip method, a paddle method, a spray method such as a high-pressure spray method, brushing, and scraping.
  • the high-pressure spray method is most suitable for improving the resolution.
  • the core pattern 8 may be further cured by heating at about 60 to 250 ° C. or exposure at about 0.1 to 1000 mJ / cm 2 as necessary.
  • Step 4 is performed (FIGS. 1E, 1F, 2F, and 2G).
  • the clad layer forming resin film 200 is heat-pressed in a reduced pressure atmosphere on the core pattern 8 using a vacuum pressure laminator (FIGS. 1E and 2F). )).
  • the fourth step is thermocompression bonding using a flat plate laminator 6 in a reduced pressure atmosphere from the viewpoint of improving adhesion and followability.
  • the flat plate laminator refers to a laminator in which a laminated material is sandwiched between a pair of flat plates and pressed by pressing the flat plates.
  • a vacuum pressurizing laminator described in Patent Document 2 can be suitably used.
  • the upper limit of the degree of vacuum which is a measure of pressure reduction, is preferably 10,000 Pa or less, and more preferably 1000 Pa or less.
  • the degree of vacuum is preferably low from the viewpoint of adhesion and followability.
  • the lower limit of the degree of vacuum is preferably about 10 Pa from the viewpoint of productivity (the time required for evacuation).
  • the heating temperature is preferably 40 to 130 ° C.
  • the pressure is preferably 0.1 to 1.0 MPa (1 to 10 kgf / cm 2 ), but these conditions are not particularly limited.
  • the laminating is performed with the clad layer forming resin 20 facing the core pattern 8.
  • the thickness of the clad layer 9 is preferably larger than the thickness of the core layer 3 as described above. Curing is performed as described above by light or heating.
  • the protective film 11 is provided on the opposite side of the support film 10 of the clad layer forming resin film 200, the clad layer forming resin film 200 is removed after the protective film 11 is peeled off.
  • the clad layer 9 is formed by laminating and curing by light or heating.
  • the clad layer forming resin 20 is formed on the support film 10 subjected to the adhesion treatment.
  • the protective film 11 is preferably not subjected to an adhesive treatment in order to facilitate peeling from the clad layer forming resin film 200, and may be subjected to a release treatment as necessary.
  • the core thickening, chipping, and the like which are conventional problems, are performed.
  • An optical waveguide (FIG. 1 (f), FIG. 2 (g)) having a uniform core free from core deformation and foreign matter adhesion can be manufactured with high productivity.
  • Production Example 1 (Preparation of a resin film for forming a core layer and a resin film for forming a cladding layer) Prepare the core layer and clad layer forming resin composition with the formulation shown in Table 1, and add 40 parts by mass of ethyl cellosolve as a solvent to the total amount to prepare the core layer and clad layer forming resin varnish. did.
  • the blending amounts of (A) the base polymer and (B) the photopolymerizable compound are mass% based on the total amount of the (A) component and the (B) component, and (C) photopolymerization is started.
  • the compounding quantity of an agent is a ratio (mass part) with respect to 100 mass parts of total amounts of (A) component and (B) component.
  • Phenototo YP-70 manufactured by Tohto Kasei Co., Ltd., bisphenol A / bisphenol F copolymer phenoxy resin * 2 A-BPEF; manufactured by Shin-Nakamura Chemical Co., Ltd., 9,9-bis [4- (2 -Acryloyloxyethoxy) phenyl] fluorene * 3 EA-1020; manufactured by Shin-Nakamura Chemical Co., Ltd., bisphenol A type epoxy acrylate * 4 KRM-2110; manufactured by Shin-Nakamura Chemical Co., Ltd., alicyclic diepoxycarboxylate * 5 2,2-bis (2-chlorophenyl) -4,4 ', 5,5'-tetraphenyl-1,2'-biimidazole; manufactured by Tokyo Chemical Industry Co., Ltd.
  • the obtained resin varnish for forming the core layer and the clad layer was applied to a PET film (manufactured by Toyobo Co., Ltd., trade name “Cosmo Shine A1517”, thickness 16 ⁇ m) and an applicator (Yoshimi Seiki Co., Ltd., “YBA-4”). )) (Resin film for forming a clad layer: use of an adhesive-treated surface in a winding, use of a resin film for forming a core layer: a non-treated surface outside of a winding), 80 ° C., 10 minutes, then 100 ° C., 10 The solvent was dried in minutes to obtain a resin film for forming a core layer and a clad layer.
  • the thickness of the film at this time can be arbitrarily adjusted between 5 and 100 ⁇ m by adjusting the gap of the applicator.
  • the film thickness after curing is 40 ⁇ m for the core layer and the lower cladding layer.
  • the thickness was adjusted to 20 ⁇ m and the upper cladding layer to 70 ⁇ m.
  • Production Example 2 (Preparation of a resin film for forming a cladding layer)
  • a resin film for forming a cladding layer was produced.
  • Example 1 (Production of optical waveguide)
  • the ultraviolet ray exposure machine (Dainippon Screen Mfg. Co., Ltd., MAP-1200) was irradiated with 1000 mJ / cm 2 of ultraviolet rays (wavelength 365 nm), and the clad layer forming resin film obtained in Production Example 1 was photocured. Thus, the lower cladding layer 2 was formed (see FIG. 1A).
  • a roll laminator (HLM-1500, manufactured by Hitachi Chemical Co., Ltd.) is used, under the conditions of pressure 0.4 MPa, temperature 50 ° C., laminating speed 0.2 m / min.
  • the core layer-forming resin film obtained in 1 was laminated (see FIG. 1B).
  • the refractive index of the core layer and the clad layer was measured with a prism coupler (Model 2010) manufactured by Metricon.
  • the core layer was 1.584 and the clad layer was 1.537 at a wavelength of 850 nm.
  • the optical waveguide manufactured by the above method there is no core deformation such as core thickening or chipping and contamination with foreign matter, and the yield of 200 optical waveguides with a length of 10 cm is 80%, and the propagation loss is 855 nm for the light source.
  • LED manufactured by Advantest Co., Ltd., Q81201
  • light receiving sensor manufactured by Advantest Co., Ltd., Q82214
  • incident light 1.5 to 1.7 dB / cm as measured by an effective core diameter of 26 ⁇ m.
  • Example 2 (Production of optical waveguide)
  • the clad layer forming resin film 200 obtained in Production Example 2 was transferred onto the FR-4 as the base material 1 by the roll laminator method, and the PET film was After peeling, an optical waveguide was produced in the same manner as in Example 1 except that the lower clad layer 2 was formed by curing with ultraviolet rays from the clad layer forming resin side.
  • the thus produced optical waveguide was free from core deformation such as core thickening and chipping, and contamination with foreign matter, and the yield of 200 optical waveguides with a length of 10 cm was 90%.
  • Comparative Example 1 (Production of optical waveguide)
  • the vacuum clad laminator is used under the same conditions as those for forming the upper clad layer in Example 1.
  • An optical waveguide was produced in the same manner as in Example 1 except that the core layer-forming resin film was laminated on the layer.
  • the yield of 200 optical waveguides with a length of 10 cm was 15%, and the propagation loss was 855 nm LED (manufactured by Advantest Corporation) as the light source.
  • Comparative Example 2 (Production of optical waveguide) Instead of forming the upper clad layer on the core pattern using the vacuum pressure laminator in Example 1, the thermocompression bonding step is performed using the same method and conditions as those used for forming the core layer in Example 1 using a roll laminator. An optical waveguide was produced in the same manner as in Example 1 except that the above was performed. In this case, many voids occur in the upper clad due to insufficient filling, the yield of 200 optical waveguides with a length of 10 cm is 0%, and the propagation loss is 855 nm LED (manufactured by Advantest Co., Ltd., Q81201).
  • optical waveguide having a uniform core with no deformation, less defects due to foreign matters, excellent adhesion between the core pattern and the clad, and having no voids in the clad with high productivity. It is.
  • the optical waveguide obtained by the manufacturing method of the present invention is excellent in optical transmission characteristics and can be applied to a wide range of fields such as optical interconnection between boards or within boards.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Integrated Circuits (AREA)

Abstract

L'invention concerne un procédé de fabrication d'un guide d'ondes optique, qui comprend les étapes consistant à: former une couche de gaine inférieure en traitant une résine formant une couche de gaine et qui est appliquée sur un substrat; former une couche de cœur en appliquant un film de résine formant une couche de cœur sur la couche de gaine inférieure; former un motif de cœur en exposant et en développant la couche de cœur; et former une couche de gaine supérieure en traitant une résine formant une couche de gaine et qui est appliquée de manière à enfouir le motif de coeur. Le procédé de fabrication du guide d'ondes optique est caractérisé en ce que l'étape de formation de la couche de cœur est mise en œuvre par liaison par compression thermique du film de résine formant la couche de cœur sur la couche de gaine inférieure au moyen d'un poste de laminage à cylindre, et l'étape de formation de la couche de gaine supérieure est mise en œuvre par liaison par compression thermique dans une atmosphère à pression réduite au moyen d'un poste de laminage à plaque. Ce procédé permet de fabriquer un guide d'ondes optique à cœur uniforme avec une productivité élevée.
PCT/JP2009/054499 2008-03-18 2009-03-10 Procédé de fabrication d'un guide d'ondes optique WO2009116421A1 (fr)

Priority Applications (2)

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JP2010503838A JPWO2009116421A1 (ja) 2008-03-18 2009-03-10 光導波路の製造方法
CN2009801087565A CN101971065A (zh) 2008-03-18 2009-03-10 光波导的制造方法

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JP2008070130 2008-03-18
JP2008-070130 2008-03-18

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9535216B2 (en) 2013-09-27 2017-01-03 Panasonic Intellectual Property Management Co., Ltd. Optical waveguide dry film, and optical waveguide manufacturing method and optical waveguide using optical waveguide dry film

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI633348B (zh) * 2016-09-21 2018-08-21 中華學校財團法人中華科技大學 Polymer optical wavelength filter element with surface relief Bragg grating structure and manufacturing method thereof

Citations (5)

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WO2004095093A1 (fr) * 2003-04-23 2004-11-04 Taiyo Ink Mfg. Co., Ltd. Guide d'onde optique, substrat hybride optoelectrique et procede de production d'un substrat hybride optoelectrique
WO2005080458A1 (fr) * 2004-02-25 2005-09-01 Kansai Paint Co., Ltd. Composition de résine durcissable pour guide de lumière, film sec durcissable pour guide de lumière, guide de lumière et méthode pour former la partie centrale d'un guide de lumière
JP2006022317A (ja) * 2004-06-07 2006-01-26 Matsushita Electric Works Ltd エポキシ樹脂フィルム、光導波路、光電気複合基板、光通信モジュール
WO2007091596A1 (fr) * 2006-02-08 2007-08-16 Hitachi Chemical Company, Ltd. Guide d'ondes optiques souple et module optique
WO2008013140A1 (fr) * 2006-07-25 2008-01-31 Hitachi Chemical Company, Ltd. Composition de résine pour matériau optique, film à base de résine pour matériau optique, et guide d'ondes optique

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004095093A1 (fr) * 2003-04-23 2004-11-04 Taiyo Ink Mfg. Co., Ltd. Guide d'onde optique, substrat hybride optoelectrique et procede de production d'un substrat hybride optoelectrique
WO2005080458A1 (fr) * 2004-02-25 2005-09-01 Kansai Paint Co., Ltd. Composition de résine durcissable pour guide de lumière, film sec durcissable pour guide de lumière, guide de lumière et méthode pour former la partie centrale d'un guide de lumière
JP2006022317A (ja) * 2004-06-07 2006-01-26 Matsushita Electric Works Ltd エポキシ樹脂フィルム、光導波路、光電気複合基板、光通信モジュール
WO2007091596A1 (fr) * 2006-02-08 2007-08-16 Hitachi Chemical Company, Ltd. Guide d'ondes optiques souple et module optique
WO2008013140A1 (fr) * 2006-07-25 2008-01-31 Hitachi Chemical Company, Ltd. Composition de résine pour matériau optique, film à base de résine pour matériau optique, et guide d'ondes optique

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9535216B2 (en) 2013-09-27 2017-01-03 Panasonic Intellectual Property Management Co., Ltd. Optical waveguide dry film, and optical waveguide manufacturing method and optical waveguide using optical waveguide dry film

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CN101971065A (zh) 2011-02-09
TW200951521A (en) 2009-12-16
JPWO2009116421A1 (ja) 2011-07-21
TWI457625B (zh) 2014-10-21

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