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WO2004095093A1 - Guide d'onde optique, substrat hybride optoelectrique et procede de production d'un substrat hybride optoelectrique - Google Patents

Guide d'onde optique, substrat hybride optoelectrique et procede de production d'un substrat hybride optoelectrique Download PDF

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Publication number
WO2004095093A1
WO2004095093A1 PCT/JP2004/005615 JP2004005615W WO2004095093A1 WO 2004095093 A1 WO2004095093 A1 WO 2004095093A1 JP 2004005615 W JP2004005615 W JP 2004005615W WO 2004095093 A1 WO2004095093 A1 WO 2004095093A1
Authority
WO
WIPO (PCT)
Prior art keywords
refractive index
core
solder resist
cladding
optical waveguide
Prior art date
Application number
PCT/JP2004/005615
Other languages
English (en)
Japanese (ja)
Inventor
Gen Itokawa
Hideaki Kojima
Naoki Yoneda
Nobuhito Itoh
Original Assignee
Taiyo Ink Mfg. Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Ink Mfg. Co., Ltd. filed Critical Taiyo Ink Mfg. Co., Ltd.
Priority to JP2005505743A priority Critical patent/JPWO2004095093A1/ja
Publication of WO2004095093A1 publication Critical patent/WO2004095093A1/fr

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/13—Integrated optical circuits characterised by the manufacturing method
    • G02B6/138—Integrated optical circuits characterised by the manufacturing method by using polymerisation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12035—Materials
    • G02B2006/12069—Organic material

Definitions

  • the present invention relates to an optical waveguide, an opto-electric hybrid board provided with the optical waveguide, and a method for manufacturing the same. More specifically, the present invention is particularly useful as a waveguide that can be used in multi-mode at a communication wavelength of about 0.85 m. This is related to a simple optical waveguide.
  • optical waveguides are required to have the following conditions: (i) the refractive index difference between the core and the clad can be controlled; (ii) easy manufacture; and (i ii) small optical loss.
  • a core-cladding structure using a polymer with excellent transparency, such as polystyrene, as the core, and a polymer with a lower refractive index than the core material as the cladding material See, for example, Japanese Patent Application Laid-Open No. 3-188402).
  • a polyimide which is a transparent polymer having high heat resistance
  • reactive ion etching requires processing at wafer size and cannot be formed at a large size, and has a problem with mass productivity and cost reduction because the etching rate is low.
  • fluorine contained in polyfluoride has a problem that it has an environmental impact and is difficult to dispose.
  • a polymer film for photobleaching is formed on a substrate on which a polymer film having a lower refractive index is formed. Then, a photomask on which a desired core pattern is drawn is placed on the photobleaching polymer film and irradiated with ultraviolet light, and the photobleaching polymer film irradiated with ultraviolet light is irradiated.
  • the low refractive index of the polymer film for photobleaching is reduced by reducing the refractive index of the polymer to form side walls, and the area not exposed to ultraviolet light to the core layer without a decrease in the refractive index.
  • a method for realizing a polymer waveguide by forming a polymer film for a high-efficiency clad is disclosed (for example, Japanese Patent Application Laid-Open No. 2002-182502). See the gazette.).
  • the refractive index of the core and the cladding is controlled by the degree of photoreaction, the refractive index is unstable and the control is not easy. It was difficult to stably secure the difference in the refractive index between the core arcs.
  • the present invention has been made to solve the above-mentioned problems, and it is easy to adjust the refractive index difference between cores, and it is possible to stably secure a desired high refractive index difference. It is an object of the present invention to provide a waveguide, and to provide a method for easily and inexpensively manufacturing an opto-electric hybrid board provided with the optical waveguide.
  • a core portion and a cladding portion are formed on a base material, and the refractive index of the cladding portion is lower than that of the core portion.
  • An optical waveguide is provided, wherein the clad portion is formed of an active energy ray-curable / thermo-curable solder resist composition having alkaline developability.
  • the core portion and the clad portion are formed on the base material having the conductor for solder connection on the surface, and the refractive index of the clad portion is reduced by the refractive index of the core portion.
  • the cladding portion is formed of an active energy linear curable / thermocurable solder resist composition having a renewable developing property. Wave paths are provided.
  • the solder resist layer and the solder A core portion and a cladding portion are formed on a printed wiring board having a connecting conductor and an optical waveguide in which the refraction index of the cladding portion is lower than that of the core portion.
  • a hybrid board is provided.
  • an optical waveguide having an optical waveguide formed by forming a core portion and a clad portion on a printed wiring board having a solder resist layer and a solder connection conductor on the surface is provided.
  • a groove portion for embedding a core portion is formed at a predetermined position of the middle layer cladding portion.
  • the upper cladding can be provided to form the optical waveguide.
  • the optical waveguide can be formed by disposing the core portion at a predetermined position on the surface of the lower-layer cladding portion, and then providing the middle-layer and upper-layer cladding portions.
  • the refractive index of the cladding is lower than the refractive index of the core by 0.5% or more in a value measured by a prism power bra.
  • the active energy ray-curable / thermo-curable solder resist composition having alkaline developability includes a carboxylic acid group. It may contain a compound, a (meth) acryloyl group-containing compound, a cyclic ether and a photopolymerization initiator.
  • solder resist composition as a constituent material of the clad portion enables low-temperature curing, and also provides a light guide having a high refractive index difference between the core and the clad. It has become possible to provide a stable wave path. Further, by using the solder resist composition as a constituent material of the clad portion, it is possible to simultaneously form the solder resist layer and the clad portion. Therefore, the manufacturing process of the opto-electric hybrid board can be simplified and the cost can be reduced.
  • the reaction between the carboxylic acid group and the cyclic (thio) ether group is carried out.
  • the adhesion to the substrate is improved due to the resulting 1 OH group and 1 SH group, and it is possible to adhere to the substrate without an adhesive layer.
  • FIG. 1 is a cross-sectional view schematically showing one embodiment of the printed wiring board of the present invention.
  • FIG. 2 is a cross-sectional view schematically showing one embodiment of a manufacturing process of the opto-electric hybrid board of the present invention.
  • FIG. 3 is a cross-sectional view schematically showing another embodiment of the manufacturing process of the opto-electric hybrid board of the present invention.
  • the present invention relates to an optical waveguide having a core portion and a clad portion.
  • an active energy linear curable / thermocurable solder resist composition having developability is used as a material constituting the cladding part.
  • solder resist composition of the present invention which stably provides a high refractive index difference between the core and the clad. This is particularly useful as an optical waveguide that can be used in multimode using a communication wavelength near 0.85 ⁇ .
  • the number of modes increases and the light propagation improves as the width of the core increases and as the difference in the refractive index between the core and the clad increases.
  • the difference in the refractive index is generally obtained by the following equation.
  • the difference in the refractive index is preferably 0.5% or more, more preferably 1. 0% or more.
  • Refractive index difference ( ⁇ ⁇ - ⁇ 0 ) / n l X 1 0 0 (%)
  • the optical waveguide of the present invention can be multi-mode using a communication wavelength near 0.85 ⁇ m.
  • Adjust the refractive index of the core and cladding composition to adjust the core and cladding composition Obtain the refractive index difference of The refractive index of the composition can be adjusted from the refractive index of the molecule by changing the structure of the compound, in addition to the method of adjusting the refractive index of the bonding segment by changing the reaction system. The adjustment may be made using a method.
  • the refractive index is determined not by adjusting the amount of each reactive group but by adjusting the mother skeleton and the mixing ratio of the compound having each reactive group. It is easy to adjust and the effectiveness is high.
  • the clad composition (the solder resist composition of the present invention) and the core composition will be specifically described below.
  • the carboxyl group-containing compound (A) is a compound having one or more carboxyl groups in the molecule, and is a carboxyl group-containing compound containing only a carboxyl group, and further has a photosensitive ethylenic property.
  • Any of the carboxyl group-containing photosensitive resins having an unsaturated double bond can be used, and is not limited to a specific one. In particular, resins such as those listed below (polymer) And polymers may be used).
  • a carboxyl group-containing resin obtained by copolymerizing (a) an unsaturated carboxylic acid and (b) a compound having an unsaturated double bond,
  • a copolymer of (a) unsaturated carboxylic acid and (b) a compound having an unsaturated double bond may be added with an ethylenically unsaturated group (b ') as a pendant.
  • a carboxyl group-containing photosensitive resin obtained by reacting a compound having a bond, (5) (h) reacting a polyfunctional epoxy compound with (d) unsaturated monocarboxylic acid, and reacting the resulting hydroxyl group with (e) a saturated or unsaturated polybasic anhydride to obtain a hydroxyl group. Containing photosensitive resin,
  • carboxyl group-containing photosensitive resin having two or more photosensitive unsaturated double bonds in one molecule particularly the carboxyl group-containing photosensitive resin of the above (5) is preferable.
  • the carboxyl group-containing compound (A) as described above has a large number of free carboxyl groups in the side chain of the backbone polymer, and thus can be developed with a dilute aqueous solution.
  • the acid value of the carboxyl group-containing compound (A) is preferably usually in the range of 45 to 20 Omg KOH / g. If the acid value of the carboxyl group-containing compound is less than 45 mg KOHZ g, alkali development becomes difficult, while if it exceeds 200 mg KOH / g, dissolution of the exposed area by the developer proceeds. As a result, the line becomes thinner than necessary, and in some cases, it dissolves and peels off with the developer without distinguishing between the exposed and unexposed areas, making it difficult to draw a normal resist pattern. Not preferred.
  • the carboxyl group-containing resin (1) is obtained by copolymerizing (a) an unsaturated carboxylic acid and (b) a compound having an unsaturated double bond, and contains a carboxyl group. Therefore, it is soluble in aqueous alkaline solutions.
  • the unsaturated carboxylic acid (a) include acrylic acid, metaacrylic acid, itaconic acid, crotonic acid, maleic acid, and fumaric acid. Acids or their anhydrides, and acid anhydrides such as maleic anhydride, itaconic anhydride, pyromellitic anhydride, and 2—hydroxyxetil Hydroxyl-unsaturated compounds, such as hydroxyalkyl (meta) acrylates, such as hydroxypropyl (meta) acrylate, and 2-hydroxypropyl (meta) acrylate And ⁇ -carboxy-polyproteratomer which can be produced by adding ⁇ -proproratone to these unsaturated carboxylic acids.
  • Acids or their anhydrides, and acid anhydrides such as maleic anhydride, itaconic anhydride, pyromellitic anhydride, and 2—hydroxyxetil Hydroxyl-unsaturated compounds, such as hydroxyalkyl (meta) acrylates, such as
  • (meta) ata-relate is a general term for ata-relate and meth-a-relate, and the same applies to other similar expressions. .
  • the compound (b) having an unsaturated double bond include styrene, chlorostyrene, ⁇ ; —methylorethylene; and methyl, ethyl, n-propyl and i as substituents.
  • the carboxyl group-containing photosensitive resin (2) is preferably a compound (b) having the unsaturated carboxylic acid (a) and the unsaturated double bond.
  • Examples of the ethylenically unsaturated group (b ′) to be added as the pendant include a vinyl group, an aryl group, an atalylyl group, and a methacryloyl group.
  • Such a method of adding an ethylenically unsaturated group to the above-mentioned copolymer is carried out by adding an ethylenically unsaturated compound having an epoxy group to a carboxyl group of the copolymer or a (meth) acrylate.
  • Examples of the ethylenically unsaturated compound having an epoxy group or (meth) acrylic acid chloride include glycidyl (meth) acrylate, and arylglycidyl. Ether; 3-methylglycidyl (meta) acrylate, glycidyl ether crotonic acid, 3, 4-epoxysilicone hexylmethyl (meta) acrylate, ( (Meta) Acrylic acid chloride, crotonic acid chloride and the like. Of these, glycidyl (meta) acrylate is preferred.
  • the photosensitive resin having a carboxyl group of (3) is a copolymer of (c) a compound having an epoxy group and an unsaturated double bond in one molecule and a compound (b) having the unsaturated double bond in one molecule.
  • Epoxy group (D) reacting the carboxyl group of the unsaturated monocarboxylic acid at a rate that improves the photocurability to the extent that a sufficient photocuring depth can be obtained, and the unsaturated double bond of the unsaturated monocarboxylic acid Is a resin in which (e) a saturated or unsaturated polybasic acid anhydride is added to the secondary hydroxyl group generated by the above addition reaction, and a carboxyl group is introduced into the side chain. .
  • the compound (c) containing an epoxy group and an unsaturated double bond in one molecule described above include glycidyl (meth) atalylate and i3—methyl thiidyl ( Methacrylate), 3,4—epoxycyclohexylmethyl (meta) acrylate, etc. These can be used alone or in combination of two or more. You.
  • unsaturated monocarboxylic acid (d) examples include acrylic acid, metaacrylic acid, crotonic acid, ca-cinnamic acid, cyano-canoic acid, and ⁇ -carpoxy.
  • One polyprotonate mono (meta) acrylate is used, and these can be used alone or in combination of two or more.
  • saturated or unsaturated polybasic acid anhydride examples include succinic anhydride, maleic anhydride, phthalic anhydride, tetrahydrophthalic anhydride, and hexahydroanhydride.
  • the (4) carboxyl group-containing photosensitive resin is (f) unsaturated (G) a hydroxyl group and an unsaturated double bond in one molecule are added to the acid anhydride group of the copolymer of the acid anhydride having a double bond and the compound (b) having an unsaturated double bond.
  • This is a resin in which a hydroxyl group of a compound having the same is reacted to form a half ester, and the unsaturated double bond of the compound (g) is introduced into a side chain.
  • the acid anhydride (f) having an unsaturated double bond include maleic anhydride, itaconic anhydride, and pyromellitic anhydride.
  • 2-hydroxyalkyl (meta) acrylates such as hydroxypropyl (meta) acrylate and 2-hydroxypropyl (meta) acrylate Examples thereof include partial reaction products with an unsaturated compound having a hydroxyl group, and these can be used alone or in combination of two or more.
  • maleic anhydride which can stably synthesize a polymer, is preferable.
  • the compound ( g ) having a hydroxyl group and an unsaturated double bond in one molecule thereof include 2—hydroxyshetyl (meta) phthalate and 2—hydroxypropyl Hydroxyalkyl (meta) acrylates such as (meta) acrylate; ratatone-modified hydroxyxethyl (meta) acrylate and the like; Or two or more types can be used in combination.
  • the above-mentioned carboxyl group-containing photosensitive resins (2) to (4) are excellent in photocurability and contribute to dryness to the touch of the composition.
  • the carboxyl group-containing photosensitive resin according to (5) The epoxy group of the functional epoxy compound is reacted with the carboxyl group of the unsaturated monocarboxylic acid (d) to generate epoxy acrylate, and the secondary hydroxyl group generated by the addition reaction is reacted with the saturated hydroxyl group.
  • it is a resin in which a carboxyl group is introduced into a side chain by addition reaction of an unsaturated polybasic acid anhydride (e).
  • epoxy resins can be used. Typical examples are bisphenol A type, hydrogenated bisphenol A type, bisphenol F type, bisphenol A type, and phenol phenolic. And common types such as phenolic type, cresol-no-polax type, bisphenol A novolak type, biphenol type, bixylene type, N-glycidyl type, etc. Epoxy compounds and EHPE-3150 manufactured by Daicel Co., Ltd. are preferred as commercially available products. Furthermore, a polyfunctional bisphenol obtained by reacting an epihalohydrin such as epichlorohydrin with a hydroxyl group of a solid bisphenol-type epoxy resin to obtain a polyfunctional polyfunctional bisphenol. And epoxy resin.
  • an epihalohydrin such as epichlorohydrin
  • a phenolic novolak type epoxy resin a cresol novola type epoxy resin, or a polyfunctional bisphenol type epoxy resin which has many epoxy groups and is solid.
  • These polyfunctional epoxy compounds (h) can be used alone or in combination of two or more.
  • the reaction between the polyfunctional epoxy compound (h) and the unsaturated monocarboxylic acid (d) is carried out by an equivalent number of epoxy groups, an equivalent number of carboxyl groups, SO.8-1.2, preferably 0.9-0.9. It is preferable to do so at a rate of 1.05. Equivalent number of epoxy groups / carbo If the equivalent number of the xyl group is less than 0.8, the unsaturated monocarboxylic acid (d) will remain, causing a problem of odor.On the other hand, if the equivalent number exceeds 1.2, a large amount of epoxy groups will remain. However, it is not preferred because it becomes easy to gel at the stage of reacting a saturated or unsaturated polybasic acid anhydride (e).
  • the reaction ratio of the saturated or unsaturated polybasic anhydride (e) to the generated secondary hydroxyl group is preferably such that the acid value of the finally obtained resin is 45 to 16 Omg KOHZg. Adjust so that it is within the range.
  • the acid anhydride group is in the range of 0.3 to 0.9 equivalent, preferably 1 equivalent of the hydroxyl group generated by the reaction of the polyfunctional epoxy compound (h) and the unsaturated monocarboxylic acid (d). 0.5 to 0.7 equivalent.
  • the compound containing a hydroxyl group and a hydroxyl group of the above (6) is obtained by reacting (i) a polymer containing a hydroxyl group with the saturated or unsaturated polybasic anhydride (e), and A resin in which a photosensitive group is introduced by reacting a compound ( c ) having an unsaturated double bond with an epoxy group in one molecule.
  • Polyvinyl acetal, cellulose or the like is used as the hydroxyl group-containing polymer (i), and the composition is adjusted by adjusting the reaction amount of the saturated or unsaturated polybasic anhydride (e).
  • Water can be used as the diluent, and water can be used as the developer in addition to the dilute aqueous solution.
  • the reaction for synthesizing a photosensitive resin containing a carboxylic acid group is carried out by adding the unsaturated monocarboxylic acid (d) (or at least one alcohol per molecule) to the polyfunctional epoxy compound (h) A reactive hydroxyl group and a compound (j)) having one reactive group other than the alcoholic hydroxyl group that reacts with the epoxy group.
  • At least one alcoholic hydroxyl group and a compound (j) having one reactive group other than the alcoholic hydroxyl group that reacts with the epoxy group are simultaneously reacted, and then, the saturated or unsaturated polybasic anhydride is further reacted.
  • At least one hydroxyl group in one molecule and one reactive group other than the alcoholic hydroxyl group that reacts with the epoxy group include glycolic acid, dimethylolpropionic acid, dimethylolacetic acid, dimethylolbutyric acid, dimethylolvaleric acid, dimethylolcaproate, and the like.
  • the carboxyl group-containing photosensitive resin (8) is a polyfunctional resin which is a starting material of the carboxyl group-containing photosensitive resin (5).
  • K A resin using a polyfunctional oxetane compound instead of the oxy resin (h).
  • an unsaturated monocarboxylic acid (d) is reacted with a polyfunctional oxetane compound (k), and the resulting primary or primary hydroxyl group is further saturated or unsaturated polybasic acid.
  • It is a carboxyl group-containing photosensitive resin obtained by reacting an anhydride (d).
  • the bonding site between the primary hydroxyl group and the acid anhydride is a resin that is hardly thermally cleaved and has excellent thermal stability.
  • the (meth) atalyloyl group-containing compound known reactive diluents such as monofunctional (meth) atalylates and poly- or polyfunctional (meth) atalylates can be used. Can be used. Specific examples are methyl (meta) acrylate, ethyl (meta) 'acrylate, n-butyl (meta) acrylate, isobutyl
  • Metal atalylate 2-ethylhexyl (meta) atalylate, isodesyl (meta) atalylate, rauril (meta) atalylate, tri Decyl (meta) atalylate, stearyl (meta) atalylate, methoxypolyethylene recall
  • Metal atalylate cyclohexyl (meta) atalylate, tetrahydrofurfuryl (meta) atelylate, isoboroninole (meta) ately Rate, benzyl (meta) atalylate, 2 — hydrokishetil (meta) atalylate, 2 — hidden Loxypropyl (meta) acrylate, 2-hydroxypropyl (meta) acrylate, dimethylethylaminoethyl (meta) acrylate, ethylene glycol (Metal) atalylate, diethyl glycol (meta) acrylate, 1,4-butanediol di (meta) acrylate, 1, 6 1 Hexane diol (meta) acrylate, trimethylol propane (meta) acrylate, grease rendition (meta) acrylate, pen Terythry tri (meta) acrylate, pentaerythry tetra (meta)
  • the compounding amount is 100 parts by mass or less, more preferably 10 to 70 parts by mass, based on 10 parts by mass of the compound containing the propyloxyl group. It is.
  • the content of the (meth) acryloyl group-containing compound exceeds 100 parts by mass, it becomes difficult to obtain the dryness to the touch required for contact exposure, and the coating film has heat resistance and the like. It is not preferable because the characteristics are deteriorated.
  • Examples of the cyclic (thio) ether group-containing compound include compounds having an oxirane ring, an oxetane ring, a thiirane ring, and the like, which are subjected to ring-opening addition polymerization with the above-mentioned carboxyl group-containing compound.
  • a cyclic (thio) ether group-containing is a general term for a compound containing a cyclic ether group, a compound containing a cyclic thioether group, and a mixture thereof.
  • Examples of the compound having an oxirane ring include bisphenol A, bisphenol F, bisphenol S, phenolic / phenolic resin, and cresolanolic resin.
  • Active hydrogen-containing compounds such as polyphenols such as fats, polycarboxylic acids such as telephthalic acid, and polyamines such as diaminodiphenylmethane, and epichlorophyll Dalicidyl ethers, glycidyl esters, and glycidyl amins obtained by reacting water and z or methyl chlorohydrin are exemplified.
  • rubber epoxy compounds and alicyclic compounds obtained by reacting perforacetic acid, etc. with cyclic compounds such as polybutadiene and cyclic olefin compounds such as polyhexene derivatives. Examples include epoxy compounds.
  • Examples of the compound having an oxetane ring include oxetane alcohols, polycarboxylic acids such as terephthalic acid, or bisphenol A, bisphenol A, bisphenol A, and bisphenol A. Examples thereof include esterified products with polyphenols such as S, phenol-no-polak resin and cresol-no-polak resin.
  • Examples of the compound having a thiirane ring include a reaction product of a compound having a thiirane ring such as] 3-epitipropylmercaptane and a polyfunctional thiosocyanate compound.
  • cyclic (thio) ether group-containing compounds may be used alone or in combination of two or more.
  • the compounding amount thereof is preferably 0.5 with respect to 1 equivalent of the carboxyl group of the carboxyl group-containing compound. ⁇ 4.0 equivalents, more preferably 1.2 ⁇ 1.0. 6 equivalents.
  • photopolymerization initiator examples include benzophenone-based, acetate phenone-based, benzoin ether, benzoin olethanol, monoacrylphosphinoxide, polyester, and titanium. It is a radical photopolymerization initiator such as a nosene type.
  • photopolymerization initiators include benzoin and benzoin alkyl ethers such as benzoin, benzoin methyl ether, benzoin ethyl enoate ether, and benzoin isopropinole ether; Set phenonone, 2, 2—Dimethoxy 2—Phenylacet phenone, 2, 2—Jetoxy 1 2—Pheninoleaset phenonone, 2, 2—Jet xy 2 —Acetatophenones such as phenylacetophenone and 1,1 dichloroacetophenonone; 2—Methylthio 1- [4- (methylthio) phene 2-morpholino-propane-one-one, 2-benzene-one 2-dimethylamino- 1-(4-mono-refino-phenyl) -butanone-one Setophenones; 2 — methyl Anthraquinones such as luantraquinone, 2-ethylent
  • Photosensitizers such as tertiary amines such as lithilamin and triethanolamine can be used alone or in combination of two or more.
  • titanocene-based photopolymerization initiator such as Ciba Specialty Chemicals Inc. Inoregacure 784, which initiates radical polymerization in the visible region, and a leuco dye are used as curing assistants. Can be used in combination.
  • the solder resist composition used in the present invention may further include, for example, an elastomer, an elastomer, for the purpose of relieving stress, preventing halation, imparting adhesion, and improving characteristics such as applicability.
  • an organic compound not having a carboxyl group, a (meth) acryloyl group and a cyclic (thio) ether group is used so as not to impair the effects of the present invention. May be blended.
  • the solder resist composition of the present invention comprises the above-mentioned carboxyl group-containing compound, (meth) acryloyl group-containing compound, cyclic (thio) ether group-containing compound, and a photopolymerization initiator as essential components. But containing both a carboxyl group and a (meth) acryloyl group, and containing both a Z or cyclic (thio) ether group and a (meth) atalyloyl group It may contain a compound.
  • thermoplastic resin composition As long as the composition serving as the core satisfies that the refractive index is lower than the refractive index of the cladding portion, a thermoplastic resin composition, a thermosetting resin composition, a photocurable resin composition, Any of a curable / thermosetting resin composition and a developable resin composition may be used, but it is preferable to use a composition which satisfies a refractive index measured by a prismatic power brush of at least 0.5%.
  • thermoplastic resin examples include polycarbonate resin and polycarbonate resin.
  • thermosetting resin composition is, for example, a resin composition comprising a reaction system of epoxy, phenols, thiophenols, carboxylic acids, amines, and active esters.
  • a resin composition comprising a reaction system of oxetane and phenols, thiophenols, carboxylic acids, amines, and active esters.
  • Reaction system of thiirane with phenols, thiophenols, carboxylic acids, amines and active esters Reaction system of thiirane with phenols, thiophenols, carboxylic acids, amines and active esters.
  • Resin compositions comprising a reaction system of ginan and phenols, thiophenols, carboxylic acids, amines, and active esters are exemplified.
  • Photocurable resin compositions include, for example, radically polymerizable compositions such as (meta) acrylates, epoxies, vinyl ethers, oxetanes, spirol orthoesters, thiiras. And cationically polymerizable compositions of thiethanes.
  • Examples of the photocurable and thermosetting resin composition include a system using both the photocurable composition and the thermosetting composition described above.
  • the developable resin composition uses a difference in solubility between a photosensitive site irradiated with active energy and a non-photosensitive site to develop a resin composition capable of developing a pattern with an aqueous alkali solution or an organic solvent to form a pattern. If the refractive index satisfies that the refractive index is lower than the refractive index of the cladding part (preferably, it is lower than 0.5% in the refractive index measured by a prism power bra), A solder resist composition having a composition different from that of the pad composition can be used.
  • the skeleton contained in the above-described thermoplastic resin composition, thermosetting resin composition, photocurable resin composition, photocurable / thermosetting resin composition, and developable resin composition includes Bisphenol A skeleton, Bisphenol F skeleton, Bisphenol S skeleton and its hydrogenated and fluorinated skeleton.
  • Sulfur-containing and nitrogen-heterocyclic skeletons such as isocyanuric acid, triazine ring and benzoxazine ring.
  • FIG. 1 is a cross-sectional view schematically showing one embodiment of the printed wiring board of the present invention.
  • a substrate (printed wiring board) 100 having conductor pads 101a and 101b on the surface, an active energy linear curing / thermosetting solder is placed.
  • Solder resist layer formed using resist composition 110a, 110 b, a clad part 102 a, 102 b, 102 c formed using the solder resist composition and a core part having a higher refractive index than the clad part
  • An optical waveguide 104 having 103 and is formed.
  • FIG. 2 is a cross-sectional view schematically showing one embodiment of a manufacturing process of the opto-electric hybrid board of the present invention.
  • an active energy ray-curable and thermosetting solder resist composition was placed on a substrate 200 having a conductor pad 201 on the surface.
  • the required parts are irradiated with active energy rays (see Fig. 2 (c)), and the parts (unnecessary parts) that have not been irradiated with the active energy rays are washed with an aqueous alkali solution.
  • the lower layer 202a and the solder resist layer 210 are formed (see FIG. 2 (d)).
  • the necessary parts are irradiated with active energy rays.
  • the part (unnecessary part) that was not irradiated with the active energy was developed and removed with an aqueous alkali solution, cured by heat, and cured to form an upper layer layer. Is formed to obtain the opto-electric hybrid board 230 of the present invention (see FIG. 2 (i)).
  • 204 is an optical waveguide.
  • the upper cladding layer 202c can be formed by pattern printing without exposure and development, and curing by irradiation with active energy or heat.
  • laminating the solder resist composition means that the composition is provided in liquid or film form, and in the case of liquid form, it is necessary at the time of coating or after coating. Perform more defoaming, drying, pressing and flattening. If the film is in the form of a film, after laminating it, heat-press it and perform vacuum pressing if necessary. Exposure can also be performed by drawing active energy rays through a mask or directly and curing the required portions. Further, development can be performed at 10 to 50 ° C. using an aqueous solution containing 0.1 to 30% by mass of a basic compound.
  • FIG. 3 is a cross-sectional view schematically showing another embodiment of the manufacturing process of the opto-electric hybrid board of the present invention.
  • an active energy ray curable * thermosetting solder resist composition was placed on the substrate 300.
  • the required parts are irradiated with active energy rays (see Fig. 3 (c)), and the parts not exposed to the active energy rays (unnecessary parts) are developed with an aqueous alkali solution. Removed to form the lower cladding layer 302a and the solder resist layer 310 (see Fig. 3 (d)).
  • a composition for forming a core (for example, an optical fiber) is formed on the substrate on which the lower-layer clad 302 a is formed.
  • the core pattern is irradiated with active energy rays (see Fig. 3 (e)), and the core is left (alkaline) developed and removed, and cured by heat.
  • a core 303 is formed (see FIG. 3 (f)).
  • a necessary portion is irradiated with active energy rays (see FIG. 3 (g)), and the active energy line is formed.
  • the non-irradiated portion (unnecessary portion) is removed by development with an alkali and cured by heat to form the middle and upper clad layers 302 d, thereby providing the present invention.
  • An opto-electric hybrid board 330 is obtained (see Fig. 3 (h)).
  • reference numeral 304 denotes an optical waveguide.
  • This cladding layer 302d can be formed by pattern printing without development and curing by irradiation with active energy or heat.
  • Two members of the clad and solder resist or three members of the clad, adhesive and solder resist can be formed by one member of the solder resist clad. it can.
  • solder resist composition is three-dimensionally crosslinked by light and heat curing, it is not necessary to use an expensive thermoplastic polymer having a high Tg such as polyimide. Heat resistance can be realized, and the refractive index does not change even by heat treatment around 250 ° C.
  • the refractive index of the solder resist composition can be widely adjusted (for example, 1.523 to 1.559) by changing the composition and the composition ratio, and the obtained refractive index is Manufacturing process of optical waveguide It is stable without being affected by the chemical reaction.
  • a soldering conductor or the like on the substrate can be used as a target mark for positioning and photolithography.
  • the positional accuracy between the light or light-to-electricity converter and the optical waveguide is high, and the optical coupling loss can be suppressed.
  • thermosetting temperature of the solder resist composition is about 150 ° C, and the carboxyl group and cyclic (thio) ether are thermoset at 100 to 250 ° C.
  • the substrate does not require high heat resistance, and the range of usable substrates is wide.
  • the present invention is not limited to the above (each) embodiment, but can be variously modified in an implementation stage without departing from the gist of the invention.
  • the above embodiments include inventions at various stages, and various inventions can be extracted by appropriate combinations of a plurality of disclosed constituent features. example For example, even if some components are deleted from all the components shown in the embodiment, the problem (at least one) described in the section of the problem to be solved by the invention can be solved. If (at least one of) the effects of the invention is obtained, a configuration in which this component is removed can be extracted as an invention. (Example)
  • the reaction was continued for about 6 hours until the absorption peak (178 cm-) of the acid anhydride disappeared.
  • the resin compound (A) thus obtained having two or more acryloyl groups and a carboxyl group, has a non-volatile content of 65% and an acid value of solid of 78 mg KOH / g.
  • Resin C a light and thermosetting resin solution having image properties, was obtained.
  • EP5.54 manufactured by Japan Epoxy Resin Co., Ltd. to which a resin solution having a solid content of 90% was previously added by adding carbitol acetate to 35.5.
  • 20 g of DPHA manufactured by Nippon Kayaku Co., Ltd. are weighed, mixed, dispersed and filtered, and used as active-energy linear curable / thermo-curable, which has an alkali-defining property.
  • a resist composition was obtained.
  • a solder resist composition formed on a wafer with a film thickness of 10 ⁇ m was used at a temperature of 25 ° C and a wavelength of 83
  • the refractive index measured at a binding pressure of 30 PSI at 0 nm was as shown in Table 1 below.
  • the core composition 1 formed on the wafer with a film thickness of 10 ⁇ m was manufactured by using Metricon's PC-2010 prismatic plastic at 25 ° C and a wavelength of 830 ° C.
  • the refractive index measured at nm and a bonding pressure of 30 PSI was as shown in Table 1 below. Gu's production>
  • a 50 ⁇ m film obtained by applying the solder resist composition on a PET film and drying at 80 ° C for 60 minutes is applied to the lower layer using a vacuum laminator at 70 ° C. C, and La Mine preparative at 60 seconds, 50 mu m through the Negafu Irumu to shield line, and UV irradiation at 150 mJ / cm 2 using a main Taruharai de the light source, 30 ° C for l% Na 2 C0 3 the aqueous solution was 60 seconds scan flop rate at a pressure of 0.2Mpa development, after Tsu rows 180 ° C, 60 min heat curing reaction, a high pressure mercury lamp UV have use 1000 mJ / cm 2 was irradiated to the light source, X-direction and Y An intermediate layer with a core groove of 50 ⁇ formed in the direction was formed on the lower layer.
  • the core composition 1 was buried with a squeegee into the groove for the core of the obtained middle layer clad, and dried at 80 ° C for 30 minutes. Fill seen write, and after the operation of the dried et to repeat twice, 5 0 ⁇ m a line on the core groove using Ficoll Lum exposing the main Taruharai de of 600m J / cm 2 have use in the light source UV irradiation was performed.
  • solder resist composition After drying the solder resist composition to a thickness of 20 ⁇ m on the middle-layer cladding and core, use a metal halide as a light source through a negative film that shields unnecessary areas from light using a negative light source of 600 mJ / cm.
  • a coating was applied to the obtained opto-electric hybrid board, dried, and floated on solder at 260 ° C for 10 seconds.After cooling, tape peeling was performed. Was not found. Solder adhesion to the conductor node was also confirmed.
  • the obtained opto-electric hybrid board was once passed through a reflow furnace set to a maximum temperature of 275 ° C. After cooling, tape peeling was performed, but no peeling of the waveguide was observed.
  • the obtained opto-electric hybrid board was subjected to electroless nickel plating, electroless plating, and tape peeling, but no peeling of the waveguide was observed. In addition, adhesion to the conductor pad was confirmed.
  • the loss was 0.81 dB / cm.
  • the refractive index difference between the core and the clad was 2.1%.
  • Core composition 2 which is a thermosetting composition, which is prepared by weighing and mixing 100 g of EP 828 made by Jianno Epoxy Resin Co., Ltd. Got.
  • the core composition 2 was formed with a thickness of 10 m on the wafer and subjected to a thermosetting reaction at 150 ° C for 60 minutes.
  • the refractive index measured at 25 ° C., a wavelength of 830 nm, and a coupling pressure of 30 PSI was 1.577.
  • main Taruharai de were UV irradiated with 600 mJ / cm 2 using a light source, 60 seconds scan the l% Na 2 C0 3 aqueous solution 30 ° C at a pressure of 0.2Mpa flop array developed, after 180 ° C, 60 min heat curing reaction, a high-pressure mercury lamp was lOOOmJ / cm 2 irradiated with UV using a light source, a solder registry conductor pad isolation portion is developed A smooth underlayer was removed that formed.
  • a 50 ⁇ m film obtained by applying the solder resist composition on a PET film and drying at 80 ° C for 60 minutes was applied to the lower layer using a vacuum laminator. 70 ° C, and La Mi Natick preparative 60 seconds, 50 m line through Negafu I Lum to shield, and UV irradiation at 1 50 mJ / cm 2 using a main Taruharai de the light source, the 30 ° C l% Na 2 C0 3 aqueous solution for 60 seconds scan flop rate at a pressure of 0.2Mpa development, 1 80 ° C, after 60 minutes heat curing reaction was Tsu row, the UV have use a high-pressure mercury lamp as a light source l O OOmJ / cm 2 Irradiation was performed to form a middle layer having a core groove of 50 / xm in the X and Y directions on the lower layer.
  • the core composition 2 was embedded in the groove for the core of the obtained middle layer using a squeegee, and a thermosetting reaction was performed at 150 ° C. for 60 minutes to cure the core composition 2.
  • the solder registry compositions 2 0 mu m and by bovine printing becomes dried, at 600 mJ / cm 2 using the light source of the main Taruharai de via Negafu Ilm for blocking unnecessary portion exposure, l% Na 2 C 0 3 aqueous developer removing unnecessary portion not 60 seconds spray and core periphery at a pressure of 0.2 Mpa, rows 1 80 ° C, 60 min heat hardening reaction of 30 ° C
  • UV irradiation was performed at l OOOmJ / cm 2 , and the solder pad was developed and removed using a solder resist.
  • An opto-electric hybrid board having a waveguide formed on a printed wiring board was obtained.
  • the obtained opto-electric hybrid board was once passed through a reflow furnace set to a maximum temperature of 275 ° C, and after cooling, tape peeling was performed, but no peeling of the waveguide was observed.
  • the obtained opto-electric hybrid board was subjected to electroless nickel plating after electroless nickel plating and tape peeling, but no peeling of the waveguide was observed. In addition, the adhesion to the conductor pad was confirmed.
  • the loss was 0.43 dB / cm as a result of measuring the waveguide formed by the above procedure using the cut-pack method after replacing the substrate with a wafer.
  • the core composition 3 was formed on the wafer with a dry film thickness of 10 ⁇ m, using a Metricon PC-210 prism power bra, at 25 ° C.
  • the refractive index measured at a wavelength of 830 nm and a bonding pressure of 30 PSI was 1.585.
  • the 30 ⁇ m film obtained by applying the solder resist composition on a PET film and drying at 80 ° C. for 60 minutes was applied to form a 18 ⁇ m conductor pad on the surface.
  • the laminate was laminated on a printed wiring board at 70 ° C for 60 seconds using a vacuum laminator.
  • a 50 ⁇ m film obtained by applying the solder resist composition on a PET film and drying at 80 ° C for 60 minutes was applied to the lower layer using a vacuum laminator at 70 ° C. , and La Mine preparative at 60 seconds, 50 m line through Negafu I Lum for blocking, UV-irradiated at 150 mJ / cm 2 using a main Taruharai de the light source, l% Na 2 C0 3 aqueous solution 30 ° C was 60 seconds scan flop rate at a pressure of 0.2Mpa development, after Tsu rows 180 ° C, 60 min heat curing reaction, a high pressure mercury lamp UV have use lOOOmJ / cm 2 was irradiated to the light source, X-direction ⁇ Pi Y An intermediate layer having a core groove of 50 ⁇ in the direction was formed on the lower layer.
  • the core composition 3 was embedded in a core groove of the obtained middle layer using a squeegee, and dried at 80 ° C. for 30 minutes. The embedding and drying were repeated, and the solid content of the core composition 3 was filled in the grooves.
  • a coating flux was applied to the obtained opto-electric hybrid board, dried, floated on solder at 260 ° C for 10 seconds, and tape-peeled after cooling, but no peeling of the waveguide was observed. Solder adhesion to the conductor pad was also confirmed.
  • the obtained opto-electric hybrid board was passed once through a reflow furnace set to a maximum temperature of 275 ° C, and after cooling, tape peeling was performed, but no peeling of the waveguide was observed. .
  • the obtained opto-electric hybrid board was subjected to electroless nickel plating, electroless plating, and tape peeling, but no peeling of the waveguide was observed. In addition, adhesion to the conductor pad was confirmed.
  • the loss was 0.47 dB / cm as a result of measuring the waveguide formed by the above procedure using the cut-pack method after replacing the substrate with a wafer.
  • the 30 ⁇ m film obtained by applying the above solder resist composition on a PET film and drying at 80 ° C. for 60 minutes was replaced with a 18 ⁇ m conductive pad formed on the surface. Using a vacuum laminator, lamination was performed at 70 ° C for 60 seconds.
  • main Taruharai de were UV irradiated with 600 mJ / cm 2 using a light source, 60 seconds scan the l% Na 2 C0 3 aqueous solution 30 ° C at a pressure of 0.2Mpa flop array developed, 180 ° C, 60 min heat curing reaction a high-pressure mercury lamp after UV with a light source lOOOmJ / cm 2 was irradiated, smooth lower click the solder registry conductor pad isolation portion is developed and removed A lad was formed.
  • the core composition 1 was applied on PET and dried at 80 ° C. for 60 minutes to obtain a 50 ⁇ m film.
  • the film of the core composition 1 was laminated on the obtained lower layer clad at 70 ° C. for 60 seconds using a vacuum laminator.
  • a rosin flux was applied to the obtained opto-electric hybrid board, dried and floated on solder at 260 ° C for 10 seconds.After cooling, tape peeling was performed. I was not able to admit. Solder adhesion to the conductor pad was also confirmed.
  • the obtained opto-electric hybrid board was passed once through a reflow furnace set to a maximum temperature of 275 ° C, and after cooling, tape peeling was performed, but no peeling of the waveguide was observed.
  • the obtained opto-electric hybrid board was subjected to electroless gold plating after electroless nickel plating and tape peeling, but no peeling of the waveguide was observed. In addition, adhesion to the conductor pad was confirmed.
  • the substrate was replaced with a wafer, and the waveguide formed by the above procedure was measured using the cutback method. As a result, the loss was 0.86 dB / cm.
  • UV after heat curing 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000
  • Tatsuri (mJ / cm 2 ) 200 200 200 100 100 600 600 Thermosetting temperature (° C) 150 150 150 150 150 180 180 Thermosetting time (min) 60 ; 60 60 60 60 60 60 60 60 Sample history

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials For Photolithography (AREA)
  • Optical Integrated Circuits (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

L'invention porte sur un guide d'onde optique dans lequel une section centrale et une section de gainage sont formées sur un substrat, ce guide d'onde étant caractérisé en ce que la section de gainage est fabriquée dans un composé de résine de soudure thermodurcissable aux rayons d'énergie par activation apte à développer des alcalis.
PCT/JP2004/005615 2003-04-23 2004-04-20 Guide d'onde optique, substrat hybride optoelectrique et procede de production d'un substrat hybride optoelectrique WO2004095093A1 (fr)

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WO2008035658A1 (fr) * 2006-09-22 2008-03-27 Hitachi Chemical Company, Ltd. Procédé de fabrication de guide de lumière
JP2008266608A (ja) * 2007-03-24 2008-11-06 Daicel Chem Ind Ltd ナノインプリント用硬化性樹脂組成物
EP2045635A1 (fr) * 2006-07-20 2009-04-08 Hitachi Chemical Company, Ltd. Substrat de montage mixte optique/électrique
JP2009145882A (ja) * 2007-11-22 2009-07-02 Dainippon Printing Co Ltd 異種部材一括形成用ネガ型レジスト組成物
WO2009116421A1 (fr) * 2008-03-18 2009-09-24 日立化成工業株式会社 Procédé de fabrication d'un guide d'ondes optique
JP2011066376A (ja) * 2009-09-16 2011-03-31 Korea Electronics Telecommun プラスチック基板及びその製造方法
JP2013060553A (ja) * 2011-09-14 2013-04-04 Sekisui Chem Co Ltd エピスルフィド樹脂材料及び多層基板

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JP2010256877A (ja) 2009-03-31 2010-11-11 Panasonic Electric Works Co Ltd 光導波路コアの製造方法、光導波路の製造方法、光導波路、及び光電気複合配線板
CN102316662A (zh) * 2010-06-29 2012-01-11 欣兴电子股份有限公司 光电线路板及其制造方法

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Publication number Priority date Publication date Assignee Title
EP2045635A1 (fr) * 2006-07-20 2009-04-08 Hitachi Chemical Company, Ltd. Substrat de montage mixte optique/électrique
EP2045635A4 (fr) * 2006-07-20 2010-07-21 Hitachi Chemical Co Ltd Substrat de montage mixte optique/électrique
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WO2008035658A1 (fr) * 2006-09-22 2008-03-27 Hitachi Chemical Company, Ltd. Procédé de fabrication de guide de lumière
JP2008266608A (ja) * 2007-03-24 2008-11-06 Daicel Chem Ind Ltd ナノインプリント用硬化性樹脂組成物
JP2009145882A (ja) * 2007-11-22 2009-07-02 Dainippon Printing Co Ltd 異種部材一括形成用ネガ型レジスト組成物
WO2009116421A1 (fr) * 2008-03-18 2009-09-24 日立化成工業株式会社 Procédé de fabrication d'un guide d'ondes optique
JP2011066376A (ja) * 2009-09-16 2011-03-31 Korea Electronics Telecommun プラスチック基板及びその製造方法
JP2013060553A (ja) * 2011-09-14 2013-04-04 Sekisui Chem Co Ltd エピスルフィド樹脂材料及び多層基板

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JPWO2004095093A1 (ja) 2006-07-13
TWI340262B (fr) 2011-04-11
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KR20050109628A (ko) 2005-11-21
CN100346184C (zh) 2007-10-31
TW200502606A (en) 2005-01-16

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