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WO2009038950A3 - Carte de circuits imprimés souple, son procédé de fabrication et dispositif électronique l'utilisant - Google Patents

Carte de circuits imprimés souple, son procédé de fabrication et dispositif électronique l'utilisant Download PDF

Info

Publication number
WO2009038950A3
WO2009038950A3 PCT/US2008/074798 US2008074798W WO2009038950A3 WO 2009038950 A3 WO2009038950 A3 WO 2009038950A3 US 2008074798 W US2008074798 W US 2008074798W WO 2009038950 A3 WO2009038950 A3 WO 2009038950A3
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
flexible circuit
manufacturing
electronic device
same
Prior art date
Application number
PCT/US2008/074798
Other languages
English (en)
Other versions
WO2009038950A2 (fr
Inventor
Yoshiyuki Ohkura
Tatsunori Koyanagi
Original Assignee
3M Innovative Properties Co
Yoshiyuki Ohkura
Tatsunori Koyanagi
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co, Yoshiyuki Ohkura, Tatsunori Koyanagi filed Critical 3M Innovative Properties Co
Publication of WO2009038950A2 publication Critical patent/WO2009038950A2/fr
Publication of WO2009038950A3 publication Critical patent/WO2009038950A3/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

Un aspect de la présente invention concerne une carte de circuits imprimés souple comprenant : un substrat présentant deux parties séparées par une partie pouvant être courbée, ledit substrat comportant une pluralité de parties minces sur une surface de ladite partie pouvant être courbée, et lesdites parties minces s'étendant dans une direction qui coupe la direction de la courbure, et comportant une partie de support entre les parties de ladite pluralité de parties minces mutuellement adjacentes, et la largeur de ladite partie mince dans la direction de la courbure est plus grande que la largeur de ladite partie de support dans ladite direction de courbure ; un circuit comprenant un matériau conducteur formé sur ledit substrat et mis à adhérer à celui-ci ; et une couche de recouvrement sur ladite première surface couvrant au moins une partie de la surface dudit circuit.
PCT/US2008/074798 2007-09-20 2008-08-29 Carte de circuits imprimés souple, son procédé de fabrication et dispositif électronique l'utilisant WO2009038950A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-244012 2007-09-20
JP2007244012A JP2009076663A (ja) 2007-09-20 2007-09-20 可撓性回路基板、その製造方法およびそれを使用した電子機器

Publications (2)

Publication Number Publication Date
WO2009038950A2 WO2009038950A2 (fr) 2009-03-26
WO2009038950A3 true WO2009038950A3 (fr) 2009-06-04

Family

ID=40468719

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2008/074798 WO2009038950A2 (fr) 2007-09-20 2008-08-29 Carte de circuits imprimés souple, son procédé de fabrication et dispositif électronique l'utilisant

Country Status (2)

Country Link
JP (1) JP2009076663A (fr)
WO (1) WO2009038950A2 (fr)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6067782B2 (ja) * 2010-06-28 2017-01-25 住友化学株式会社 積層基材の製造方法、積層基材およびプリント配線板
DE102010027149A1 (de) * 2010-07-14 2012-01-19 Fela Hilzinger Gmbh Verbiegbare Metallkernleiterplatte
KR102049985B1 (ko) * 2012-12-19 2019-11-28 엘지디스플레이 주식회사 백라이트 유닛 및 이를 포함하는 디스플레이 장치
CN103152977B (zh) * 2013-03-27 2016-03-02 深圳索瑞德电子有限公司 一体化电路板及其制作方法
JP6259813B2 (ja) * 2013-07-11 2018-01-10 株式会社村田製作所 樹脂多層基板、および樹脂多層基板の製造方法
KR102136392B1 (ko) * 2013-09-05 2020-07-22 삼성디스플레이 주식회사 플렉서블 표시장치 및 터치 스크린 패널의 제조 방법
JP2020140220A (ja) * 2017-06-22 2020-09-03 パナソニックＩｐマネジメント株式会社 タッチセンサ
KR102535784B1 (ko) * 2018-02-02 2023-05-24 삼성디스플레이 주식회사 표시 장치 및 그것의 제조 방법
JP2019179178A (ja) * 2018-03-30 2019-10-17 株式会社ジャパンディスプレイ 表示装置、及び、表示装置の製造方法
JP7094837B2 (ja) * 2018-08-29 2022-07-04 株式会社ジャパンディスプレイ 表示装置、フレキシブル配線基板、及び、表示装置の製造方法
JP2020088331A (ja) * 2018-11-30 2020-06-04 株式会社ジャパンディスプレイ フレキシブル基板
CN113766769B (zh) * 2021-11-09 2022-02-01 四川英创力电子科技股份有限公司 一种多层梯形盲槽印制板的制作方法
KR20230130203A (ko) 2022-03-02 2023-09-12 삼성디스플레이 주식회사 표시 장치

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03157984A (ja) * 1989-11-15 1991-07-05 Matsushita Electric Ind Co Ltd 部品実装用金属基板
JPH03157985A (ja) * 1989-11-15 1991-07-05 Matsushita Electric Ind Co Ltd 部品実装用金属基板
JPH0575218A (ja) * 1991-06-19 1993-03-26 Hitachi Ltd 成形基板
JP2003243779A (ja) * 2002-02-18 2003-08-29 Matsushita Electric Ind Co Ltd フレキシブル配線板
US6927344B1 (en) * 2004-02-27 2005-08-09 Motorola, Inc. Flexible circuit board assembly

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03157984A (ja) * 1989-11-15 1991-07-05 Matsushita Electric Ind Co Ltd 部品実装用金属基板
JPH03157985A (ja) * 1989-11-15 1991-07-05 Matsushita Electric Ind Co Ltd 部品実装用金属基板
JPH0575218A (ja) * 1991-06-19 1993-03-26 Hitachi Ltd 成形基板
JP2003243779A (ja) * 2002-02-18 2003-08-29 Matsushita Electric Ind Co Ltd フレキシブル配線板
US6927344B1 (en) * 2004-02-27 2005-08-09 Motorola, Inc. Flexible circuit board assembly

Also Published As

Publication number Publication date
WO2009038950A2 (fr) 2009-03-26
JP2009076663A (ja) 2009-04-09

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