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WO2009075079A1 - Carte de circuit imprimé, procédé de fabrication de carte de circuit imprimé, et film de protection photosensible - Google Patents

Carte de circuit imprimé, procédé de fabrication de carte de circuit imprimé, et film de protection photosensible Download PDF

Info

Publication number
WO2009075079A1
WO2009075079A1 PCT/JP2008/003612 JP2008003612W WO2009075079A1 WO 2009075079 A1 WO2009075079 A1 WO 2009075079A1 JP 2008003612 W JP2008003612 W JP 2008003612W WO 2009075079 A1 WO2009075079 A1 WO 2009075079A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
ray film
conductor
circuit
cover ray
Prior art date
Application number
PCT/JP2008/003612
Other languages
English (en)
Japanese (ja)
Inventor
Masatosi Mitomi
Original Assignee
Sumitomo Bakelite Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co., Ltd. filed Critical Sumitomo Bakelite Co., Ltd.
Priority to CN200880119966XA priority Critical patent/CN101897243A/zh
Priority to JP2009545337A priority patent/JPWO2009075079A1/ja
Publication of WO2009075079A1 publication Critical patent/WO2009075079A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3473—Plating of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

L'invention porte sur une carte de circuit imprimé (300) comprenant : un substrat de circuit (130) ayant une base (201) et un circuit conducteur (203) formé sur au moins l'une des surfaces de la base (201) ; et un film de protection photosensible (100) utilisé comme couche de protection isolante qui couvre le circuit conducteur (203). Le film de protection photosensible (100) est formé par un film de résine (101) et une couche d'adhésif (105). Une couche conductrice (103) est agencée entre le film de résine (101) et la couche d'adhésif (105), de sorte que la couche conductrice (103) est électriquement connectée au circuit conducteur (203). Cela améliore les caractéristiques de flexion et la fiabilité de la carte de circuit imprimé (300).
PCT/JP2008/003612 2007-12-11 2008-12-05 Carte de circuit imprimé, procédé de fabrication de carte de circuit imprimé, et film de protection photosensible WO2009075079A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN200880119966XA CN101897243A (zh) 2007-12-11 2008-12-05 电路板、电路板的制造方法及覆盖膜
JP2009545337A JPWO2009075079A1 (ja) 2007-12-11 2008-12-05 回路板、回路板の製造方法およびカバーレイフィルム

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007319127 2007-12-11
JP2007-319127 2007-12-11

Publications (1)

Publication Number Publication Date
WO2009075079A1 true WO2009075079A1 (fr) 2009-06-18

Family

ID=40755327

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/003612 WO2009075079A1 (fr) 2007-12-11 2008-12-05 Carte de circuit imprimé, procédé de fabrication de carte de circuit imprimé, et film de protection photosensible

Country Status (5)

Country Link
JP (2) JPWO2009075079A1 (fr)
KR (2) KR20100088628A (fr)
CN (2) CN101897243A (fr)
TW (1) TW200938015A (fr)
WO (1) WO2009075079A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2014192490A1 (ja) * 2013-05-28 2017-02-23 タツタ電線株式会社 形状保持フィルム、及びこの形状保持フィルムを備えた形状保持型フレキシブル配線板
CN115226326A (zh) * 2021-04-16 2022-10-21 群光电子股份有限公司 电子模块

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9716258B2 (en) 2011-04-26 2017-07-25 Samsung Sdi Co., Ltd. Battery pack
JP2017220516A (ja) 2016-06-06 2017-12-14 富士通株式会社 配線基板
JP7020942B2 (ja) * 2018-02-01 2022-02-16 日東電工株式会社 フィルム延伸装置および位相差フィルムの製造方法
CN110769670B (zh) * 2018-07-27 2023-12-05 广州方邦电子股份有限公司 电磁屏蔽膜、线路板及电磁屏蔽膜的制备方法
CN110769667B (zh) * 2018-07-27 2023-12-05 广州方邦电子股份有限公司 电磁屏蔽膜、线路板及电磁屏蔽膜的制备方法
CN110783017B (zh) * 2018-11-26 2024-03-19 广州方邦电子股份有限公司 导电胶膜、线路板及导电胶膜的制备方法
CN115151968B (zh) * 2020-12-28 2023-11-21 深圳清华大学研究院 显示结构以及显示器

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07106787A (ja) * 1993-09-29 1995-04-21 Fuji Xerox Co Ltd フレキシブル印刷配線板のシールド装置
JPH08236937A (ja) * 1995-02-27 1996-09-13 Sharp Corp 多層フレキシブルプリント配線板
JP2001160673A (ja) * 1999-12-02 2001-06-12 Sony Chem Corp フレキシブル配線板の製造方法
JP2004119445A (ja) * 2002-09-24 2004-04-15 Matsushita Electric Ind Co Ltd 薄型電磁シールドおよび薄型電磁シールドが用いられたフレキシブル回路基板

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001024323A (ja) * 1999-07-12 2001-01-26 Ibiden Co Ltd 導電性ペーストの充填方法および多層プリント配線板用の片面回路基板の製造方法
KR20080064872A (ko) * 2005-11-04 2008-07-09 스미토모 베이클리트 컴퍼니 리미티드 적층 회로 기판의 제조 방법, 회로판 및 그 제조 방법

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07106787A (ja) * 1993-09-29 1995-04-21 Fuji Xerox Co Ltd フレキシブル印刷配線板のシールド装置
JPH08236937A (ja) * 1995-02-27 1996-09-13 Sharp Corp 多層フレキシブルプリント配線板
JP2001160673A (ja) * 1999-12-02 2001-06-12 Sony Chem Corp フレキシブル配線板の製造方法
JP2004119445A (ja) * 2002-09-24 2004-04-15 Matsushita Electric Ind Co Ltd 薄型電磁シールドおよび薄型電磁シールドが用いられたフレキシブル回路基板

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2014192490A1 (ja) * 2013-05-28 2017-02-23 タツタ電線株式会社 形状保持フィルム、及びこの形状保持フィルムを備えた形状保持型フレキシブル配線板
CN115226326A (zh) * 2021-04-16 2022-10-21 群光电子股份有限公司 电子模块

Also Published As

Publication number Publication date
TW200938015A (en) 2009-09-01
KR20100096172A (ko) 2010-09-01
CN101909405A (zh) 2010-12-08
CN101897243A (zh) 2010-11-24
KR20100088628A (ko) 2010-08-09
KR101538186B1 (ko) 2015-07-20
JP2010219564A (ja) 2010-09-30
JPWO2009075079A1 (ja) 2011-04-28

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