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WO2009008156A1 - Procédé de câblage, et dispositif de câblage - Google Patents

Procédé de câblage, et dispositif de câblage Download PDF

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Publication number
WO2009008156A1
WO2009008156A1 PCT/JP2008/001811 JP2008001811W WO2009008156A1 WO 2009008156 A1 WO2009008156 A1 WO 2009008156A1 JP 2008001811 W JP2008001811 W JP 2008001811W WO 2009008156 A1 WO2009008156 A1 WO 2009008156A1
Authority
WO
WIPO (PCT)
Prior art keywords
wiring
substrate
applied layer
conductive fine
laser beam
Prior art date
Application number
PCT/JP2008/001811
Other languages
English (en)
Japanese (ja)
Inventor
Satoru Miyanishi
Yasuhiro Notohara
Hisahiro Tanaka
Ryuuichi Yatsunami
Original Assignee
Panasonic Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corporation filed Critical Panasonic Corporation
Publication of WO2009008156A1 publication Critical patent/WO2009008156A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09045—Locally raised area or protrusion of insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0514—Photodevelopable thick film, e.g. conductive or insulating paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1131—Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1581—Treating the backside of the PCB, e.g. for heating during soldering or providing a liquid coating on the backside

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

L'invention concerne un procédé de câblage et un dispositif de câblage, qui peuvent former un spot de rayonnement d'un faisceau laser homogène sur une partie arbitraire d'une couche appliquée formée sur un substrat, même si le substrat n'est pas homogène dans sa forme de surface et/ou ses caractéristiques de transfert de chaleur, et qui peuvent assurer le contrôle d'une énergie thermique. Le procédé de câblage comprend l'étape consistant à appliquer une solution dispersée contenant de fines particules conductrices sur un substrat (1) hétérogène dans sa forme de surface et/ou ses caractéristiques, afin de former ainsi une couche appliquée (3), l'étape consistant à transmettre un faisceau laser (6) en continu à la région de câblage de la couche appliquée (3) sur la base des informations d'attributs du substrat indiquant la forme et/ou caractéristiques à chaque position de la surface du substrat (1), afin de former ainsi un câblage conducteur mince (4), et l'étape consistant à éliminer le matériau de la région dans la couche appliquée (3) autre que le câblage conducteur mince (4).
PCT/JP2008/001811 2007-07-09 2008-07-07 Procédé de câblage, et dispositif de câblage WO2009008156A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-179551 2007-07-09
JP2007179551A JP2009016724A (ja) 2007-07-09 2007-07-09 配線形成方法および配線形成装置

Publications (1)

Publication Number Publication Date
WO2009008156A1 true WO2009008156A1 (fr) 2009-01-15

Family

ID=40228348

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/001811 WO2009008156A1 (fr) 2007-07-09 2008-07-07 Procédé de câblage, et dispositif de câblage

Country Status (2)

Country Link
JP (1) JP2009016724A (fr)
WO (1) WO2009008156A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011165617A (ja) * 2010-02-15 2011-08-25 Panasonic Corp プラズマディスプレイパネルおよびその製造方法
WO2017066338A1 (fr) * 2015-10-12 2017-04-20 Te Connectivity Corporation Procédé de fabrication de composant électronique et composant électronique
JP7650746B2 (ja) 2020-07-22 2025-03-25 旭化成株式会社 金属配線の製造方法、製造装置、及び金属配線製造条件設定プログラム

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6032637B2 (ja) * 2012-07-05 2016-11-30 パナソニックＩｐマネジメント株式会社 部品実装基板の製造システム及び製造方法
JP6351938B2 (ja) * 2013-08-16 2018-07-04 国立大学法人大阪大学 接合構造体の製造方法、接合構造体および装置
WO2016072010A1 (fr) * 2014-11-07 2016-05-12 富士機械製造株式会社 Procédé de formation de câblage, et carte de circuit imprimé
JP6441954B2 (ja) * 2014-11-07 2018-12-19 株式会社Ｆｕｊｉ 配線形成方法
US9985344B2 (en) * 2014-12-23 2018-05-29 Te Connectivity Corporation Electronic article and process of producing an electronic article
JP2018129409A (ja) * 2017-02-09 2018-08-16 国立研究開発法人産業技術総合研究所 基材背面レーザ光照射による金属粉末低温融解に基くパターン配線回路形成方法とその形成された構造物
WO2019038879A1 (fr) * 2017-08-24 2019-02-28 株式会社Ｆｕｊｉ Procédé et dispositif de formation de fil
JP7061308B2 (ja) * 2018-01-22 2022-04-28 国立大学法人静岡大学 金属微細構造体の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006012057A1 (fr) * 2004-06-30 2006-02-02 Eastman Kodak Company Formation de conducteurs electriques sur un substrat
JP2006059942A (ja) * 2004-08-19 2006-03-02 Mamoru Onda 配線基板の製法およびそれを用いて製造した配線基板ならびに電子装置、電子機器

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006012057A1 (fr) * 2004-06-30 2006-02-02 Eastman Kodak Company Formation de conducteurs electriques sur un substrat
JP2006059942A (ja) * 2004-08-19 2006-03-02 Mamoru Onda 配線基板の製法およびそれを用いて製造した配線基板ならびに電子装置、電子機器

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011165617A (ja) * 2010-02-15 2011-08-25 Panasonic Corp プラズマディスプレイパネルおよびその製造方法
WO2017066338A1 (fr) * 2015-10-12 2017-04-20 Te Connectivity Corporation Procédé de fabrication de composant électronique et composant électronique
JP7650746B2 (ja) 2020-07-22 2025-03-25 旭化成株式会社 金属配線の製造方法、製造装置、及び金属配線製造条件設定プログラム

Also Published As

Publication number Publication date
JP2009016724A (ja) 2009-01-22

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