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WO2009008156A1 - Wiring method, and wiring apparatus - Google Patents

Wiring method, and wiring apparatus Download PDF

Info

Publication number
WO2009008156A1
WO2009008156A1 PCT/JP2008/001811 JP2008001811W WO2009008156A1 WO 2009008156 A1 WO2009008156 A1 WO 2009008156A1 JP 2008001811 W JP2008001811 W JP 2008001811W WO 2009008156 A1 WO2009008156 A1 WO 2009008156A1
Authority
WO
WIPO (PCT)
Prior art keywords
wiring
substrate
applied layer
conductive fine
laser beam
Prior art date
Application number
PCT/JP2008/001811
Other languages
French (fr)
Japanese (ja)
Inventor
Satoru Miyanishi
Yasuhiro Notohara
Hisahiro Tanaka
Ryuuichi Yatsunami
Original Assignee
Panasonic Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corporation filed Critical Panasonic Corporation
Publication of WO2009008156A1 publication Critical patent/WO2009008156A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09045—Locally raised area or protrusion of insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0514—Photodevelopable thick film, e.g. conductive or insulating paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1131—Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1581—Treating the backside of the PCB, e.g. for heating during soldering or providing a liquid coating on the backside

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

Provided are a wiring method and a wiring apparatus, which can form an irradiation spot of a homogeneous laser beam at an arbitrary portion of an applied layer formed on a substrate, even if the substrate is not homogeneous in its surface shape and/or heat transfer characteristics, and which can perform the control of a heat energy. The wiring method comprises the step of applying a dispersed solution containing conductive fine particles to a substrate (1) inhomogeneous in its surface shape and/or characteristics, thereby to form an applied layer (3), the step of feeding a laser beam (6) continuously to the wiring region of the applied layer (3) on the basis of the substrate attribute information indicating the shape and/or characteristics at each position of the surface of the substrate (1), thereby to form a conductive fine wiring (4), and the step of eliminating the material of the region in the applied layer (3) other than the conductive fine wiring (4).
PCT/JP2008/001811 2007-07-09 2008-07-07 Wiring method, and wiring apparatus WO2009008156A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-179551 2007-07-09
JP2007179551A JP2009016724A (en) 2007-07-09 2007-07-09 Wiring forming method and wiring forming device

Publications (1)

Publication Number Publication Date
WO2009008156A1 true WO2009008156A1 (en) 2009-01-15

Family

ID=40228348

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/001811 WO2009008156A1 (en) 2007-07-09 2008-07-07 Wiring method, and wiring apparatus

Country Status (2)

Country Link
JP (1) JP2009016724A (en)
WO (1) WO2009008156A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011165617A (en) * 2010-02-15 2011-08-25 Panasonic Corp Plasma display panel and method of producing the same
WO2017066338A1 (en) * 2015-10-12 2017-04-20 Te Connectivity Corporation Process of producting electronic component and an electronic component
JP7650746B2 (en) 2020-07-22 2025-03-25 旭化成株式会社 METAL WIRING MANUFACTURING METHOD, MANUFACTURING APPARATUS, AND METAL WIRING MANUFACTURING CONDITION SETTING PROGRAM

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6032637B2 (en) * 2012-07-05 2016-11-30 パナソニックＩｐマネジメント株式会社 Component mounting board manufacturing system and manufacturing method
JP6351938B2 (en) * 2013-08-16 2018-07-04 国立大学法人大阪大学 Manufacturing method of bonded structure, bonded structure and apparatus
WO2016072010A1 (en) * 2014-11-07 2016-05-12 富士機械製造株式会社 Wiring formation method, and circuit board
JP6441954B2 (en) * 2014-11-07 2018-12-19 株式会社Ｆｕｊｉ Wiring formation method
US9985344B2 (en) * 2014-12-23 2018-05-29 Te Connectivity Corporation Electronic article and process of producing an electronic article
JP2018129409A (en) * 2017-02-09 2018-08-16 国立研究開発法人産業技術総合研究所 Method for forming pattern wiring circuit on the basis of metal powder low temperature melting by irradiation with substrate back surface laser light and formed structure of the same
WO2019038879A1 (en) * 2017-08-24 2019-02-28 株式会社Ｆｕｊｉ Wire forming method and wire forming device
JP7061308B2 (en) * 2018-01-22 2022-04-28 国立大学法人静岡大学 Manufacturing method of metal microstructure

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006012057A1 (en) * 2004-06-30 2006-02-02 Eastman Kodak Company Forming electrical conductors on a substrate
JP2006059942A (en) * 2004-08-19 2006-03-02 Mamoru Onda Wiring board, manufacturing method thereof electronic equipment and electronic device using the same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006012057A1 (en) * 2004-06-30 2006-02-02 Eastman Kodak Company Forming electrical conductors on a substrate
JP2006059942A (en) * 2004-08-19 2006-03-02 Mamoru Onda Wiring board, manufacturing method thereof electronic equipment and electronic device using the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011165617A (en) * 2010-02-15 2011-08-25 Panasonic Corp Plasma display panel and method of producing the same
WO2017066338A1 (en) * 2015-10-12 2017-04-20 Te Connectivity Corporation Process of producting electronic component and an electronic component
JP7650746B2 (en) 2020-07-22 2025-03-25 旭化成株式会社 METAL WIRING MANUFACTURING METHOD, MANUFACTURING APPARATUS, AND METAL WIRING MANUFACTURING CONDITION SETTING PROGRAM

Also Published As

Publication number Publication date
JP2009016724A (en) 2009-01-22

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