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WO2009041266A1 - Solar cell wafer manufacturing method - Google Patents

Solar cell wafer manufacturing method Download PDF

Info

Publication number
WO2009041266A1
WO2009041266A1 PCT/JP2008/066333 JP2008066333W WO2009041266A1 WO 2009041266 A1 WO2009041266 A1 WO 2009041266A1 JP 2008066333 W JP2008066333 W JP 2008066333W WO 2009041266 A1 WO2009041266 A1 WO 2009041266A1
Authority
WO
WIPO (PCT)
Prior art keywords
solar cell
cell wafer
wafer manufacturing
wafer
manufacturing
Prior art date
Application number
PCT/JP2008/066333
Other languages
French (fr)
Japanese (ja)
Inventor
Hiroshi Kumada
Eiji Kametani
Toshiaki Fukuyama
Kohichi Katohno
Original Assignee
Sharp Kabushiki Kaisha
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Kabushiki Kaisha filed Critical Sharp Kabushiki Kaisha
Publication of WO2009041266A1 publication Critical patent/WO2009041266A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0633—Grinders for cutting-off using a cutting wire
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Photovoltaic Devices (AREA)

Abstract

Provided is a solar cell wafer manufacturing method wherein groove processing is performed to a surface of a solar cell wafer by slicing a silicon ingot by reciprocating a wire, at the time of manufacturing the wafer by slicing the ingot with the moving wire. Surface reflectance of the wafer is reduced without productivity deterioration and production cost increase.
PCT/JP2008/066333 2007-09-28 2008-09-10 Solar cell wafer manufacturing method WO2009041266A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-255150 2007-09-28
JP2007255150 2007-09-28

Publications (1)

Publication Number Publication Date
WO2009041266A1 true WO2009041266A1 (en) 2009-04-02

Family

ID=40511155

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/066333 WO2009041266A1 (en) 2007-09-28 2008-09-10 Solar cell wafer manufacturing method

Country Status (1)

Country Link
WO (1) WO2009041266A1 (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011024910A1 (en) * 2009-08-28 2011-03-03 株式会社Sumco Silicon wafer for solar cells and production method therefor
WO2011093380A1 (en) * 2010-01-29 2011-08-04 三洋電機株式会社 Solar cell and solar cell module using said solar cell
WO2011145521A1 (en) * 2010-05-21 2011-11-24 シャープ株式会社 Semiconductor device, and method for producing semiconductor device
WO2012026440A1 (en) * 2010-08-24 2012-03-01 三洋電機株式会社 Solar cell and manufacturing method thereof
WO2012105441A1 (en) * 2011-01-31 2012-08-09 株式会社不二製作所 Method for fabricating substrate for solar cell and solar cell
WO2013002060A1 (en) * 2011-06-30 2013-01-03 シャープ株式会社 Wafer for solar cell, solar cell, and production method therefor
WO2013002061A1 (en) * 2011-06-30 2013-01-03 シャープ株式会社 Wafer for solar cell, solar cell, and production method therefor
CN104040721A (en) * 2011-11-11 2014-09-10 夏普株式会社 Semiconductor device and method for producing semiconductor device
JP2016174173A (en) * 2014-04-30 2016-09-29 ジルトロニック アクチエンゲゼルシャフトＳｉｌｔｒｏｎｉｃ ＡＧ Method of cutting large number of slices of especially uniform thickness from work piece simultaneously
CN110076669A (en) * 2019-05-14 2019-08-02 玉田县昌通电子有限公司 A kind of cutting method and its multi-line cutting machine of multi-line cutting machine

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0371677A (en) * 1989-08-10 1991-03-27 Sharp Corp Processing of substrate for photoelectric conversion device
JPH03276682A (en) * 1990-03-26 1991-12-06 Sharp Corp Semiconductor device
JPH07304029A (en) * 1994-05-11 1995-11-21 M Setetsuku Kk Wire saw device
JPH1044141A (en) * 1996-07-31 1998-02-17 Sharp Corp Multiple wire saw and manufacture of wafer for solar cell using therewith
JP2006202831A (en) * 2005-01-18 2006-08-03 Sharp Corp Crystal silicon wafer, crystal silicon solar cell, method for manufacturing crystal silicon wafer, and method for manufacturing crystal silicon solar cell
JP2007160431A (en) * 2005-12-12 2007-06-28 Takatori Corp Cutting method using wire saw and cut work receiving member of wire saw
JP2007180527A (en) * 2005-11-29 2007-07-12 Kyocera Corp Semiconductor substrate manufacturing method and semiconductor substrate manufacturing apparatus

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0371677A (en) * 1989-08-10 1991-03-27 Sharp Corp Processing of substrate for photoelectric conversion device
JPH03276682A (en) * 1990-03-26 1991-12-06 Sharp Corp Semiconductor device
JPH07304029A (en) * 1994-05-11 1995-11-21 M Setetsuku Kk Wire saw device
JPH1044141A (en) * 1996-07-31 1998-02-17 Sharp Corp Multiple wire saw and manufacture of wafer for solar cell using therewith
JP2006202831A (en) * 2005-01-18 2006-08-03 Sharp Corp Crystal silicon wafer, crystal silicon solar cell, method for manufacturing crystal silicon wafer, and method for manufacturing crystal silicon solar cell
JP2007180527A (en) * 2005-11-29 2007-07-12 Kyocera Corp Semiconductor substrate manufacturing method and semiconductor substrate manufacturing apparatus
JP2007160431A (en) * 2005-12-12 2007-06-28 Takatori Corp Cutting method using wire saw and cut work receiving member of wire saw

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011024910A1 (en) * 2009-08-28 2011-03-03 株式会社Sumco Silicon wafer for solar cells and production method therefor
WO2011093380A1 (en) * 2010-01-29 2011-08-04 三洋電機株式会社 Solar cell and solar cell module using said solar cell
CN102939664A (en) * 2010-05-21 2013-02-20 夏普株式会社 Semiconductor device and method for manufacturing semiconductor device
WO2011145521A1 (en) * 2010-05-21 2011-11-24 シャープ株式会社 Semiconductor device, and method for producing semiconductor device
JP2011243932A (en) * 2010-05-21 2011-12-01 Sharp Corp Semiconductor device and method of manufacturing semiconductor device
US9130101B2 (en) 2010-05-21 2015-09-08 Sharp Kabushiki Kaisha Semiconductor device and method for manufacturing semiconductor device
US20130153023A1 (en) * 2010-08-24 2013-06-20 Sanyo Electric Co., Ltd. Solar cell and method of manufacturing the same
WO2012026440A1 (en) * 2010-08-24 2012-03-01 三洋電機株式会社 Solar cell and manufacturing method thereof
JP2012160568A (en) * 2011-01-31 2012-08-23 National Institute Of Advanced Industrial & Technology Method of manufacturing substrate for solar cell and solar cell
WO2012105441A1 (en) * 2011-01-31 2012-08-09 株式会社不二製作所 Method for fabricating substrate for solar cell and solar cell
US20130306148A1 (en) * 2011-01-31 2013-11-21 Fuji Manufacturing Co., Ltd. Method for fabricating substrate for solar cell and solar cell
WO2013002060A1 (en) * 2011-06-30 2013-01-03 シャープ株式会社 Wafer for solar cell, solar cell, and production method therefor
WO2013002061A1 (en) * 2011-06-30 2013-01-03 シャープ株式会社 Wafer for solar cell, solar cell, and production method therefor
JP2013012668A (en) * 2011-06-30 2013-01-17 Sharp Corp Wafer for solar cell, solar cell and method for manufacturing the same
JP2013012667A (en) * 2011-06-30 2013-01-17 Sharp Corp Wafer for solar cell, solar cell and method for manufacturing the same
CN104040721A (en) * 2011-11-11 2014-09-10 夏普株式会社 Semiconductor device and method for producing semiconductor device
JP2016174173A (en) * 2014-04-30 2016-09-29 ジルトロニック アクチエンゲゼルシャフトＳｉｌｔｒｏｎｉｃ ＡＧ Method of cutting large number of slices of especially uniform thickness from work piece simultaneously
CN110076669A (en) * 2019-05-14 2019-08-02 玉田县昌通电子有限公司 A kind of cutting method and its multi-line cutting machine of multi-line cutting machine
CN110076669B (en) * 2019-05-14 2023-12-05 玉田县昌通电子有限公司 Cutting method of multi-wire cutting machine and multi-wire cutting machine

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