WO2008136500A1 - シリコンウエハ及びその製造方法 - Google Patents
シリコンウエハ及びその製造方法 Download PDFInfo
- Publication number
- WO2008136500A1 WO2008136500A1 PCT/JP2008/058359 JP2008058359W WO2008136500A1 WO 2008136500 A1 WO2008136500 A1 WO 2008136500A1 JP 2008058359 W JP2008058359 W JP 2008058359W WO 2008136500 A1 WO2008136500 A1 WO 2008136500A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- silicon wafer
- manufacturing
- density
- bmd
- same
- Prior art date
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title abstract 5
- 229910052710 silicon Inorganic materials 0.000 title abstract 5
- 239000010703 silicon Substances 0.000 title abstract 5
- 238000004519 manufacturing process Methods 0.000 title abstract 3
- 238000000034 method Methods 0.000 title abstract 2
- 201000006935 Becker muscular dystrophy Diseases 0.000 abstract 4
- 208000037663 Best vitelliform macular dystrophy Diseases 0.000 abstract 4
- 208000020938 vitelliform macular dystrophy 2 Diseases 0.000 abstract 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract 1
- 229910052760 oxygen Inorganic materials 0.000 abstract 1
- 239000001301 oxygen Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/322—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/322—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections
- H01L21/3221—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections of silicon bodies, e.g. for gettering
- H01L21/3225—Thermally inducing defects using oxygen present in the silicon body for intrinsic gettering
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
- C30B29/06—Silicon
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B33/00—After-treatment of single crystals or homogeneous polycrystalline material with defined structure
- C30B33/02—Heat treatment
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Thermal Sciences (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2008800144138A CN101675507B (zh) | 2007-05-02 | 2008-05-01 | 硅晶片及其制造方法 |
EP08740998A EP2144280B1 (en) | 2007-05-02 | 2008-05-01 | Silicon wafer and method for manufacturing the same |
AT08740998T ATE493755T1 (de) | 2007-05-02 | 2008-05-01 | Siliciumwafer und herstellungsverfahren dafür |
DE602008004237T DE602008004237D1 (de) | 2007-05-02 | 2008-05-01 | Siliciumwafer und herstellungsverfahren dafür |
JP2009513022A JP5256195B2 (ja) | 2007-05-02 | 2008-05-01 | シリコンウエハ及びその製造方法 |
US12/605,926 US8382894B2 (en) | 2007-05-02 | 2009-10-26 | Process for the preparation of silicon wafer with reduced slip and warpage |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-121773 | 2007-05-02 | ||
JP2007121773 | 2007-05-02 | ||
JP2007338842 | 2007-12-28 | ||
JP2007-338842 | 2007-12-28 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/605,926 Continuation-In-Part US8382894B2 (en) | 2007-05-02 | 2009-10-26 | Process for the preparation of silicon wafer with reduced slip and warpage |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008136500A1 true WO2008136500A1 (ja) | 2008-11-13 |
Family
ID=39943605
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/058359 WO2008136500A1 (ja) | 2007-05-02 | 2008-05-01 | シリコンウエハ及びその製造方法 |
Country Status (8)
Country | Link |
---|---|
US (1) | US8382894B2 (ja) |
EP (1) | EP2144280B1 (ja) |
JP (1) | JP5256195B2 (ja) |
KR (1) | KR101043011B1 (ja) |
CN (1) | CN101675507B (ja) |
AT (1) | ATE493755T1 (ja) |
DE (1) | DE602008004237D1 (ja) |
WO (1) | WO2008136500A1 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010153706A (ja) * | 2008-12-26 | 2010-07-08 | Siltronic Ag | シリコンウエハ及びその製造方法 |
WO2013168371A1 (ja) * | 2012-05-11 | 2013-11-14 | サンケン電気株式会社 | エピタキシャル基板、半導体装置及び半導体装置の製造方法 |
JP2014229872A (ja) * | 2013-05-27 | 2014-12-08 | シャープ株式会社 | 窒化物半導体エピタキシャルウェハ |
JP2020526472A (ja) * | 2017-07-10 | 2020-08-31 | ジルトロニック アクチエンゲゼルシャフトSiltronic AG | 単結晶シリコンから作られる半導体ウェハおよびその製造プロセス |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010140323A1 (ja) * | 2009-06-03 | 2010-12-09 | コバレントマテリアル株式会社 | シリコンウェーハ及びシリコンウェーハの熱処理方法 |
US8357939B2 (en) | 2009-12-29 | 2013-01-22 | Siltronic Ag | Silicon wafer and production method therefor |
JP2012001379A (ja) * | 2010-06-15 | 2012-01-05 | Sharp Corp | 太陽電池モジュール、シリコンリボンの製造方法および球状シリコンの製造方法 |
DE102010034002B4 (de) * | 2010-08-11 | 2013-02-21 | Siltronic Ag | Siliciumscheibe und Verfahren zu deren Herstellung |
JP5764937B2 (ja) * | 2011-01-24 | 2015-08-19 | 信越半導体株式会社 | シリコン単結晶ウェーハの製造方法 |
JP5997552B2 (ja) * | 2011-09-27 | 2016-09-28 | グローバルウェーハズ・ジャパン株式会社 | シリコンウェーハの熱処理方法 |
JP6260100B2 (ja) * | 2013-04-03 | 2018-01-17 | 株式会社Sumco | エピタキシャルシリコンウェーハの製造方法 |
KR101472349B1 (ko) * | 2013-05-21 | 2014-12-12 | 주식회사 엘지실트론 | 반도체용 실리콘 단결정 잉곳 및 웨이퍼 |
WO2015003022A1 (en) * | 2013-07-01 | 2015-01-08 | Solexel, Inc. | High-throughput thermal processing methods for producing high-efficiency crystalline silicon solar cells |
US9425063B2 (en) | 2014-06-19 | 2016-08-23 | Infineon Technologies Ag | Method of reducing an impurity concentration in a semiconductor body, method of manufacturing a semiconductor device and semiconductor device |
JP6100226B2 (ja) * | 2014-11-26 | 2017-03-22 | 信越半導体株式会社 | シリコン単結晶ウェーハの熱処理方法 |
CN105316767B (zh) * | 2015-06-04 | 2019-09-24 | 上海超硅半导体有限公司 | 超大规模集成电路用硅片及其制造方法、应用 |
CN105280491A (zh) * | 2015-06-17 | 2016-01-27 | 上海超硅半导体有限公司 | 硅片及制造方法 |
JP6413952B2 (ja) * | 2015-06-26 | 2018-10-31 | 株式会社Sumco | シリコンウェーハの良否判定方法、該方法を用いたシリコンウェーハの製造方法およびシリコンウェーハ |
KR20170119155A (ko) * | 2016-04-18 | 2017-10-26 | 주식회사 스탠딩에그 | 벌크 실리콘 멤스의 제조 방법 |
US10032663B1 (en) * | 2017-05-24 | 2018-07-24 | Texas Instruments Incorporated | Anneal after trench sidewall implant to reduce defects |
JP6717267B2 (ja) * | 2017-07-10 | 2020-07-01 | 株式会社Sumco | シリコンウェーハの製造方法 |
US11515158B2 (en) | 2020-03-11 | 2022-11-29 | Globalfoundries U.S. Inc. | Semiconductor structure with semiconductor-on-insulator region and method |
US11695048B2 (en) | 2020-04-09 | 2023-07-04 | Sumco Corporation | Silicon wafer and manufacturing method of the same |
EP3929335A1 (en) * | 2020-06-25 | 2021-12-29 | Siltronic AG | Semiconductor wafer made of single-crystal silicon and process for the production thereof |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07508613A (ja) * | 1992-03-31 | 1995-09-21 | ミテル・コーポレーション | 良好なイントリンシックゲッタ作用を有する半導体の製造方法 |
JPH08213403A (ja) | 1995-02-07 | 1996-08-20 | Sumitomo Metal Ind Ltd | 半導体基板及びその製造方法 |
JPH1098047A (ja) | 1996-09-12 | 1998-04-14 | Wacker Siltronic G Fuer Halbleitermaterialien Ag | 低欠陥密度を有するシリコン半導体ウエハの製造方法 |
JPH10303208A (ja) * | 1997-04-30 | 1998-11-13 | Toshiba Corp | 半導体基板およびその製造方法 |
JP2005086195A (ja) * | 2003-09-05 | 2005-03-31 | Hynix Semiconductor Inc | シリコンウェーハ及びその製造方法 |
JP2005203575A (ja) * | 2004-01-15 | 2005-07-28 | Sumitomo Mitsubishi Silicon Corp | シリコンウェーハおよびその製造方法 |
WO2006003812A1 (ja) * | 2004-06-30 | 2006-01-12 | Sumitomo Mitsubishi Silicon Corporation | シリコンウェーハの製造方法及びこの方法により製造されたシリコンウェーハ |
JP2006032799A (ja) * | 2004-07-20 | 2006-02-02 | Shin Etsu Handotai Co Ltd | シリコンエピタキシャルウェーハおよびその製造方法 |
JP2006040980A (ja) | 2004-07-22 | 2006-02-09 | Sumco Corp | シリコンウェーハおよびその製造方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0198047A (ja) | 1987-10-09 | 1989-04-17 | Nec Corp | 割込み処理方式 |
DE19983188T1 (de) * | 1998-05-01 | 2001-05-10 | Nippon Steel Corp | Siliziumhalbleitersubstrat und Verfahren zu dessen Herstellung |
KR100685161B1 (ko) * | 2002-07-17 | 2007-02-22 | 가부시키가이샤 섬코 | 고저항 실리콘 웨이퍼 및 이의 제조방법 |
JP5537802B2 (ja) * | 2008-12-26 | 2014-07-02 | ジルトロニック アクチエンゲゼルシャフト | シリコンウエハの製造方法 |
-
2008
- 2008-05-01 CN CN2008800144138A patent/CN101675507B/zh active Active
- 2008-05-01 JP JP2009513022A patent/JP5256195B2/ja active Active
- 2008-05-01 KR KR1020097020004A patent/KR101043011B1/ko active Active
- 2008-05-01 EP EP08740998A patent/EP2144280B1/en active Active
- 2008-05-01 WO PCT/JP2008/058359 patent/WO2008136500A1/ja active Application Filing
- 2008-05-01 AT AT08740998T patent/ATE493755T1/de not_active IP Right Cessation
- 2008-05-01 DE DE602008004237T patent/DE602008004237D1/de active Active
-
2009
- 2009-10-26 US US12/605,926 patent/US8382894B2/en active Active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07508613A (ja) * | 1992-03-31 | 1995-09-21 | ミテル・コーポレーション | 良好なイントリンシックゲッタ作用を有する半導体の製造方法 |
JPH08213403A (ja) | 1995-02-07 | 1996-08-20 | Sumitomo Metal Ind Ltd | 半導体基板及びその製造方法 |
JPH1098047A (ja) | 1996-09-12 | 1998-04-14 | Wacker Siltronic G Fuer Halbleitermaterialien Ag | 低欠陥密度を有するシリコン半導体ウエハの製造方法 |
JPH10303208A (ja) * | 1997-04-30 | 1998-11-13 | Toshiba Corp | 半導体基板およびその製造方法 |
JP2005086195A (ja) * | 2003-09-05 | 2005-03-31 | Hynix Semiconductor Inc | シリコンウェーハ及びその製造方法 |
JP2005203575A (ja) * | 2004-01-15 | 2005-07-28 | Sumitomo Mitsubishi Silicon Corp | シリコンウェーハおよびその製造方法 |
WO2006003812A1 (ja) * | 2004-06-30 | 2006-01-12 | Sumitomo Mitsubishi Silicon Corporation | シリコンウェーハの製造方法及びこの方法により製造されたシリコンウェーハ |
JP2006032799A (ja) * | 2004-07-20 | 2006-02-02 | Shin Etsu Handotai Co Ltd | シリコンエピタキシャルウェーハおよびその製造方法 |
JP2006040980A (ja) | 2004-07-22 | 2006-02-09 | Sumco Corp | シリコンウェーハおよびその製造方法 |
Non-Patent Citations (1)
Title |
---|
See also references of EP2144280A4 |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010153706A (ja) * | 2008-12-26 | 2010-07-08 | Siltronic Ag | シリコンウエハ及びその製造方法 |
EP2204476A3 (en) * | 2008-12-26 | 2010-08-25 | Siltronic AG | Silicon wafer and method of manufacturing the same |
KR101116949B1 (ko) * | 2008-12-26 | 2012-03-14 | 실트로닉 아게 | 실리콘 웨이퍼 및 실리콘 웨이퍼 제조 방법 |
US8343618B2 (en) | 2008-12-26 | 2013-01-01 | Siltronic Ag | Silicon wafer and method of manufacturing the same |
TWI398927B (zh) * | 2008-12-26 | 2013-06-11 | Siltronic Ag | 矽晶圓及其製造方法 |
USRE45238E1 (en) | 2008-12-26 | 2014-11-11 | Siltronic Ag | Silicon wafer and method of manufacturing the same |
WO2013168371A1 (ja) * | 2012-05-11 | 2013-11-14 | サンケン電気株式会社 | エピタキシャル基板、半導体装置及び半導体装置の製造方法 |
JP2013239474A (ja) * | 2012-05-11 | 2013-11-28 | Sanken Electric Co Ltd | エピタキシャル基板、半導体装置及び半導体装置の製造方法 |
JP2014229872A (ja) * | 2013-05-27 | 2014-12-08 | シャープ株式会社 | 窒化物半導体エピタキシャルウェハ |
JP2020526472A (ja) * | 2017-07-10 | 2020-08-31 | ジルトロニック アクチエンゲゼルシャフトSiltronic AG | 単結晶シリコンから作られる半導体ウェハおよびその製造プロセス |
Also Published As
Publication number | Publication date |
---|---|
KR20090129443A (ko) | 2009-12-16 |
JPWO2008136500A1 (ja) | 2010-07-29 |
EP2144280B1 (en) | 2010-12-29 |
US8382894B2 (en) | 2013-02-26 |
EP2144280A4 (en) | 2010-04-21 |
JP5256195B2 (ja) | 2013-08-07 |
KR101043011B1 (ko) | 2011-06-21 |
ATE493755T1 (de) | 2011-01-15 |
EP2144280A1 (en) | 2010-01-13 |
CN101675507B (zh) | 2011-08-03 |
CN101675507A (zh) | 2010-03-17 |
DE602008004237D1 (de) | 2011-02-10 |
US20100047563A1 (en) | 2010-02-25 |
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