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WO2008136181A1 - ウエーハ支持治具およびこれを備えた縦型熱処理用ボートならびにウエーハ支持治具の製造方法 - Google Patents

ウエーハ支持治具およびこれを備えた縦型熱処理用ボートならびにウエーハ支持治具の製造方法 Download PDF

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Publication number
WO2008136181A1
WO2008136181A1 PCT/JP2008/000977 JP2008000977W WO2008136181A1 WO 2008136181 A1 WO2008136181 A1 WO 2008136181A1 JP 2008000977 W JP2008000977 W JP 2008000977W WO 2008136181 A1 WO2008136181 A1 WO 2008136181A1
Authority
WO
WIPO (PCT)
Prior art keywords
wafer
supporting jig
supporting
wafer supporting
heat treatment
Prior art date
Application number
PCT/JP2008/000977
Other languages
English (en)
French (fr)
Inventor
Takeshi Kobayashi
Original Assignee
Shin-Etsu Handotai Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin-Etsu Handotai Co., Ltd. filed Critical Shin-Etsu Handotai Co., Ltd.
Priority to DE112008001108.7T priority Critical patent/DE112008001108B4/de
Priority to US12/450,663 priority patent/US8506712B2/en
Publication of WO2008136181A1 publication Critical patent/WO2008136181A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H01L21/67309—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterized by the substrate support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H01L21/67306—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterized by a material, a roughness, a coating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y10T29/49885—Assembling or joining with coating before or during assembling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y10T29/49947—Assembling or joining by applying separate fastener
    • Y10T29/49966—Assembling or joining by applying separate fastener with supplemental joining
    • Y10T29/4997—At least one part nonmetallic

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

　本発明は、少なくとも、熱処理するときに被処理ウエーハを載置して支持する支持面を有するウエーハ支持治具であって、前記被処理ウエーハを支持する支持面におけるスキューネスＲｓｋが０＜Ｒｓｋ＜１０であるとともに、前記支持面全域に高さ３０μｍ以上の突起状物が無くかつ任意の１ｍｍ２内に高さが２μｍ以上３０μｍ未満の突起状物を１００個以上１０５個以下有するものであるウエーハ支持治具である。これにより、縦型熱処理炉により半導体ウエーハ等の被処理ウエーハを熱処理する際、ウエーハ支持治具の支持面／ウエーハの摩擦や固着を低減できるとともに、支持面における突起状物のサイズ分布が適切であり、スリップ転位の発生を抑制することができるウエーハ支持治具、これを備えた縦型熱処理用ボート、さらにはウエーハ支持治具の製造方法が提供される。
PCT/JP2008/000977 2007-05-01 2008-04-14 ウエーハ支持治具およびこれを備えた縦型熱処理用ボートならびにウエーハ支持治具の製造方法 WO2008136181A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE112008001108.7T DE112008001108B4 (de) 2007-05-01 2008-04-14 Wafer-Halterung, vertikales Wärmebehandlungsschiffchen, welches eine Wafer-Halterung einschliesst, sowie Verfahren für die Herstellung einer Wafer-Halterung
US12/450,663 US8506712B2 (en) 2007-05-01 2008-04-14 Wafer support jig, vertical heat treatment boat including wafer support jig, and method for manufacturing wafer support jig

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-120922 2007-05-01
JP2007120922A JP5211543B2 (ja) 2007-05-01 2007-05-01 ウエーハ支持治具およびこれを備えた縦型熱処理用ボートならびにウエーハ支持治具の製造方法

Publications (1)

Publication Number Publication Date
WO2008136181A1 true WO2008136181A1 (ja) 2008-11-13

Family

ID=39943302

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/000977 WO2008136181A1 (ja) 2007-05-01 2008-04-14 ウエーハ支持治具およびこれを備えた縦型熱処理用ボートならびにウエーハ支持治具の製造方法

Country Status (6)

Country Link
US (1) US8506712B2 (ja)
JP (1) JP5211543B2 (ja)
KR (1) KR101376489B1 (ja)
DE (1) DE112008001108B4 (ja)
TW (1) TWI471970B (ja)
WO (1) WO2008136181A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114823441A (zh) * 2022-06-28 2022-07-29 深圳市星国华先进装备科技有限公司 一种针测机传输机构晶圆防滑出保护装置及其保护方法

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5071217B2 (ja) * 2008-04-17 2012-11-14 信越半導体株式会社 縦型熱処理用ボートおよびそれを用いたシリコンウエーハの熱処理方法
KR101039151B1 (ko) 2008-12-23 2011-06-07 주식회사 테라세미콘 보트
JP5527902B2 (ja) * 2010-09-30 2014-06-25 グローバルウェーハズ・ジャパン株式会社 シリコンウェーハの熱処理方法
JP6086056B2 (ja) * 2013-11-26 2017-03-01 信越半導体株式会社 熱処理方法
CN105070677A (zh) * 2015-09-11 2015-11-18 南通皋鑫电子股份有限公司 一种硅片pn扩散用碳化硅舟
JP6469046B2 (ja) * 2016-07-15 2019-02-13 クアーズテック株式会社 縦型ウエハボート
JP7545940B2 (ja) 2020-12-25 2024-09-05 クアーズテック合同会社 半導体熱処理部材及びその製造方法
CN113564719B (zh) * 2021-07-26 2023-04-21 河北天达晶阳半导体技术股份有限公司 一种碳化硅晶体的二次退火方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH046826A (ja) * 1990-04-24 1992-01-10 Tokyo Electron Ltd 熱処理装置
JP2004063617A (ja) * 2002-07-26 2004-02-26 Sumitomo Mitsubishi Silicon Corp シリコンウエーハの熱処理用治具
JP2007073923A (ja) * 2005-08-12 2007-03-22 Sumco Corp 半導体シリコン基板用熱処理治具およびその製作方法
JP2007077421A (ja) * 2005-09-12 2007-03-29 Tocalo Co Ltd プラズマ処理装置用部材およびその製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
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JP3328763B2 (ja) 1995-10-30 2002-09-30 エヌティティエレクトロニクス株式会社 縦型ウエハボートのウエハ支持構造
JPH09283455A (ja) 1996-04-17 1997-10-31 Tekunisuko:Kk 縦型ウエーハボート
JP3511466B2 (ja) * 1998-05-22 2004-03-29 東芝セラミックス株式会社 半導体ウェーハ熱処理用部材およびこれを用いた治具
JP4003906B2 (ja) 1999-03-19 2007-11-07 コバレントマテリアル株式会社 シリコン単結晶半導体ウエハ加熱処理用治具及びこれを用いたシリコン単結晶半導体ウエハ加熱処理用装置
JP2002043239A (ja) * 2000-07-24 2002-02-08 Toshiba Ceramics Co Ltd 半導体ウェーハ熱処理用治具およびその製造方法
JP5177944B2 (ja) 2005-05-12 2013-04-10 信越石英株式会社 シリカガラス物品の製造方法。

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH046826A (ja) * 1990-04-24 1992-01-10 Tokyo Electron Ltd 熱処理装置
JP2004063617A (ja) * 2002-07-26 2004-02-26 Sumitomo Mitsubishi Silicon Corp シリコンウエーハの熱処理用治具
JP2007073923A (ja) * 2005-08-12 2007-03-22 Sumco Corp 半導体シリコン基板用熱処理治具およびその製作方法
JP2007077421A (ja) * 2005-09-12 2007-03-29 Tocalo Co Ltd プラズマ処理装置用部材およびその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114823441A (zh) * 2022-06-28 2022-07-29 深圳市星国华先进装备科技有限公司 一种针测机传输机构晶圆防滑出保护装置及其保护方法

Also Published As

Publication number Publication date
DE112008001108T5 (de) 2010-04-01
DE112008001108B4 (de) 2022-03-31
KR101376489B1 (ko) 2014-03-25
JP5211543B2 (ja) 2013-06-12
KR20100016158A (ko) 2010-02-12
US20100129761A1 (en) 2010-05-27
TWI471970B (zh) 2015-02-01
TW200908199A (en) 2009-02-16
US8506712B2 (en) 2013-08-13
JP2008277619A (ja) 2008-11-13

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