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WO2008133229A1 - ケイ素含有化合物、硬化性組成物及び硬化物 - Google Patents

ケイ素含有化合物、硬化性組成物及び硬化物 Download PDF

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Publication number
WO2008133229A1
WO2008133229A1 PCT/JP2008/057665 JP2008057665W WO2008133229A1 WO 2008133229 A1 WO2008133229 A1 WO 2008133229A1 JP 2008057665 W JP2008057665 W JP 2008057665W WO 2008133229 A1 WO2008133229 A1 WO 2008133229A1
Authority
WO
WIPO (PCT)
Prior art keywords
silicon
containing compound
curable composition
general formula
compound represented
Prior art date
Application number
PCT/JP2008/057665
Other languages
English (en)
French (fr)
Inventor
Takashi Sueyoshi
Ken-Ichiro Hiwatari
Tadashi Janado
Yoshikazu Shoji
Seiichi Saito
Yoshitaka Sugawara
Original Assignee
Adeka Corporation
The Kansai Electric Power Company, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Adeka Corporation, The Kansai Electric Power Company, Inc. filed Critical Adeka Corporation
Priority to US12/596,933 priority Critical patent/US8003736B2/en
Priority to KR1020097021058A priority patent/KR101437664B1/ko
Priority to EP08740710.2A priority patent/EP2141188B1/en
Priority to CN2008800122001A priority patent/CN101657491B/zh
Publication of WO2008133229A1 publication Critical patent/WO2008133229A1/ja

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/50—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/14—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2237—Oxides; Hydroxides of metals of titanium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2296—Oxides; Hydroxides of metals of zinc

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Polymers (AREA)

Abstract

　本発明のケイ素含有化合物は、下記一般式（１）で表されるものである。本発明の硬化性組成物は、下記一般式（１）におけるＺが水素原子である該ケイ素含有化合物、ＺがＣ2-4アルケニル基又はアルキニル基である該ケイ素含有化合物、及びヒドロシリル化反応触媒を含有してなるものであり、ハンドリング性及び硬化性に優れ、得られる硬化物が耐熱性及び可撓性に優れる。 （式中、Ｒa～ＲgはＣ1-12飽和脂肪族炭化水素基又はＣ6-12芳香族炭化水素基であり（但し、Ｒe及びＲfは同時にＣ1-12飽和脂肪族炭化水素基となることはない）、ＹはＣ2-4アルキレン基であり、Ｚは水素原子又はＣ2-4アルケニル基若しくはアルキニル基であり、Ｋは２～７の数であり、Ｔは１～７の数であり、Ｐは０～３の数である。Ｍ及びＮは、Ｎ：Ｍ＝１：１～１：１００且つ全てのＭと全てのＮの合計が１５以上となる数であって、且つ質量平均分子量を３０００～１００万とする数である。）
PCT/JP2008/057665 2007-04-23 2008-04-21 ケイ素含有化合物、硬化性組成物及び硬化物 WO2008133229A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US12/596,933 US8003736B2 (en) 2007-04-23 2008-04-21 Silicon-containing compound, curable composition and cured product
KR1020097021058A KR101437664B1 (ko) 2007-04-23 2008-04-21 규소함유 화합물, 경화성 조성물 및 경화물
EP08740710.2A EP2141188B1 (en) 2007-04-23 2008-04-21 Silicon-containing compound, curable composition and cured product
CN2008800122001A CN101657491B (zh) 2007-04-23 2008-04-21 含硅化合物、固化性组合物及固化物

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-112738 2007-04-23
JP2007112738A JP5248033B2 (ja) 2007-04-23 2007-04-23 ケイ素含有化合物、硬化性組成物及び硬化物

Publications (1)

Publication Number Publication Date
WO2008133229A1 true WO2008133229A1 (ja) 2008-11-06

Family

ID=39925680

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/057665 WO2008133229A1 (ja) 2007-04-23 2008-04-21 ケイ素含有化合物、硬化性組成物及び硬化物

Country Status (7)

Country Link
US (1) US8003736B2 (ja)
EP (1) EP2141188B1 (ja)
JP (1) JP5248033B2 (ja)
KR (1) KR101437664B1 (ja)
CN (1) CN101657491B (ja)
TW (1) TWI424005B (ja)
WO (1) WO2008133229A1 (ja)

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WO2012014560A1 (ja) * 2010-07-27 2012-02-02 株式会社Adeka 半導体封止用硬化性組成物
WO2012133432A1 (ja) * 2011-03-30 2012-10-04 旭化成ケミカルズ株式会社 オルガノポリシロキサン、その製造方法、及びオルガノポリシロキサンを含有する硬化性樹脂組成物
WO2012153821A1 (ja) * 2011-05-10 2012-11-15 住友電気工業株式会社 光ファイバ
JP2012237801A (ja) * 2011-05-10 2012-12-06 Sumitomo Electric Ind Ltd 光ファイバ
JP2013057732A (ja) * 2011-09-07 2013-03-28 Adeka Corp 光ファイバ
JPWO2012133432A1 (ja) * 2011-03-30 2014-07-28 旭化成ケミカルズ株式会社 オルガノポリシロキサン、その製造方法、及びオルガノポリシロキサンを含有する硬化性樹脂組成物
JP2014208826A (ja) * 2009-11-09 2014-11-06 ダウ コーニング コーポレーションＤｏｗｃｏｒｎｉｎｇ Ｃｏｒｐｏｒａｔｉｏｎ クラスタ化官能性ポリオルガノシロキサンの調製プロセス、及びそれらの使用方法
WO2015012141A1 (ja) * 2013-07-24 2015-01-29 株式会社Adeka 硬化性樹脂組成物

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JP5393373B2 (ja) * 2009-09-16 2014-01-22 関西電力株式会社 半導体装置
JP2011222869A (ja) * 2010-04-13 2011-11-04 Kansai Electric Power Co Inc:The 半導体装置
US8809478B2 (en) * 2010-06-11 2014-08-19 Adeka Corporation Silicon-containing curable composition, cured product of the silicon-containing curable composition and lead frame substrate formed of the silicon-containing curable composition
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WO2012105103A1 (ja) * 2011-02-04 2012-08-09 株式会社Adeka ヒンダードアミン骨格を有する化合物及び樹脂組成物
WO2013021717A1 (ja) 2011-08-10 2013-02-14 株式会社Adeka ケイ素含有硬化性組成物及びその硬化物
TWI575062B (zh) 2011-12-16 2017-03-21 拜歐菲樂Ｉｐ有限責任公司 低溫注射組成物，用於低溫調節導管中流量之系統及方法
US8481626B1 (en) 2012-01-16 2013-07-09 Itron, Inc. Wax-based encapsulant/moisture barrier for use with electronics received in water meter pits
US8728568B2 (en) 2012-01-16 2014-05-20 Itron, Inc. Method for encapsulation of electronics received in water meter pits with an improved wax-based encapsulant/moisture barrier
KR20150021099A (ko) * 2012-06-06 2015-02-27 헨켈 아이피 앤드 홀딩 게엠베하 비닐 카르보실록산 수지
US9530946B2 (en) * 2013-04-12 2016-12-27 Milliken & Company Light emitting diode
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US9388284B2 (en) * 2013-04-12 2016-07-12 Milliken & Company Cross-linked silicone polymer and process for producing the same
US9518073B2 (en) 2013-04-12 2016-12-13 Milliken & Company Siloxane compound and process for producing the same
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WO2015190644A1 (ko) * 2014-06-10 2015-12-17 한국과학기술원 세포배양 기판, 이의 제조방법 및 용도
US10626221B2 (en) 2015-11-04 2020-04-21 Dow Silicones Corporation Method of preparing organosiloxane
KR102590498B1 (ko) * 2016-02-19 2023-10-19 삼성디스플레이 주식회사 플렉서블 표시장치, 윈도우 부재의 제조방법 및 하드 코팅 조성물
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Cited By (16)

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Publication number Priority date Publication date Assignee Title
JP2016153512A (ja) * 2009-11-09 2016-08-25 ダウ コーニング コーポレーションＤｏｗ Ｃｏｒｎｉｎｇ Ｃｏｒｐｏｒａｔｉｏｎ クラスタ化官能性ポリオルガノシロキサンの調製プロセス、及びそれらの使用方法
JP2014208826A (ja) * 2009-11-09 2014-11-06 ダウ コーニング コーポレーションＤｏｗｃｏｒｎｉｎｇ Ｃｏｒｐｏｒａｔｉｏｎ クラスタ化官能性ポリオルガノシロキサンの調製プロセス、及びそれらの使用方法
JPWO2012014560A1 (ja) * 2010-07-27 2013-09-12 株式会社Adeka 半導体封止用硬化性組成物
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JP5801208B2 (ja) * 2010-07-27 2015-10-28 株式会社Adeka 半導体封止用硬化性組成物
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JPWO2012133432A1 (ja) * 2011-03-30 2014-07-28 旭化成ケミカルズ株式会社 オルガノポリシロキサン、その製造方法、及びオルガノポリシロキサンを含有する硬化性樹脂組成物
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WO2012133432A1 (ja) * 2011-03-30 2012-10-04 旭化成ケミカルズ株式会社 オルガノポリシロキサン、その製造方法、及びオルガノポリシロキサンを含有する硬化性樹脂組成物
JP2012237801A (ja) * 2011-05-10 2012-12-06 Sumitomo Electric Ind Ltd 光ファイバ
WO2012153821A1 (ja) * 2011-05-10 2012-11-15 住友電気工業株式会社 光ファイバ
US9297950B2 (en) 2011-05-10 2016-03-29 Sumitomo Electric Industries, Ltd. Optical fiber
JP2013057732A (ja) * 2011-09-07 2013-03-28 Adeka Corp 光ファイバ
WO2015012141A1 (ja) * 2013-07-24 2015-01-29 株式会社Adeka 硬化性樹脂組成物
JPWO2015012141A1 (ja) * 2013-07-24 2017-03-02 株式会社Adeka 硬化性樹脂組成物

Also Published As

Publication number Publication date
CN101657491B (zh) 2012-05-23
KR20090130035A (ko) 2009-12-17
EP2141188B1 (en) 2014-04-23
EP2141188A4 (en) 2010-08-04
JP2008266484A (ja) 2008-11-06
TW200911885A (en) 2009-03-16
CN101657491A (zh) 2010-02-24
KR101437664B1 (ko) 2014-09-04
JP5248033B2 (ja) 2013-07-31
US8003736B2 (en) 2011-08-23
EP2141188A1 (en) 2010-01-06
US20100179283A1 (en) 2010-07-15
TWI424005B (zh) 2014-01-21

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