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WO2008133228A1 - ケイ素含有化合物、硬化性組成物及び硬化物 - Google Patents

ケイ素含有化合物、硬化性組成物及び硬化物 Download PDF

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Publication number
WO2008133228A1
WO2008133228A1 PCT/JP2008/057664 JP2008057664W WO2008133228A1 WO 2008133228 A1 WO2008133228 A1 WO 2008133228A1 JP 2008057664 W JP2008057664 W JP 2008057664W WO 2008133228 A1 WO2008133228 A1 WO 2008133228A1
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WO
WIPO (PCT)
Prior art keywords
group
silicon
curable composition
containing compound
cured product
Prior art date
Application number
PCT/JP2008/057664
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English (en)
French (fr)
Inventor
Takashi Sueyoshi
Kenji Hara
Seiichi Saito
Original Assignee
Adeka Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Adeka Corporation filed Critical Adeka Corporation
Priority to KR1020097017297A priority Critical patent/KR101526862B1/ko
Publication of WO2008133228A1 publication Critical patent/WO2008133228A1/ja

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/50—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/306—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3254—Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/42—Block-or graft-polymers containing polysiloxane sequences
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/14—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Silicon Polymers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)

Abstract

　本発明のケイ素含有化合物は、下記一般式（０）で表されるものである。本発明の硬化性組成物は、該ケイ素含有化合物１００質量部に対し、エポキシ硬化性化合物０．０１～２０質量部を含有するものであり、得られる硬化物が耐熱性及び可撓性に優れる。 （一般式（０）中、Ｒa～ＲgはＣ1-12飽和脂肪族炭化水素基又はＣ1-12芳香族炭化水素基であり、ＹはＣ2-4アルキレン基であり、Ｚは式（２）～（６）のいずれかで表される基であり、Ｋは２～７の数であり、Ｔは１～７の数であり、Ｐは０～３の数である。Ｍ及びＮは、Ｎ：Ｍ＝１：１～１：１００且つ全てのＭと全てのＮの合計が１５以上となる数であって、該化合物の質量平均分子量を３０００～１００万とする数である；式（２）～（６）中、Ｘa～ＸcはＣ1-8アルカンジイル基、－ＣＯＯ－又は単結合を表し、Ｒh～Ｒjは、水素原子又はメチル基を表し、ｒは０又は１を表す。）
PCT/JP2008/057664 2007-04-23 2008-04-21 ケイ素含有化合物、硬化性組成物及び硬化物 WO2008133228A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020097017297A KR101526862B1 (ko) 2007-04-23 2008-04-21 규소 함유 화합물, 경화성 조성물 및 경화물

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007112742A JP5248034B2 (ja) 2007-04-23 2007-04-23 ケイ素含有化合物、硬化性組成物及び硬化物
JP2007-112742 2007-04-23

Publications (1)

Publication Number Publication Date
WO2008133228A1 true WO2008133228A1 (ja) 2008-11-06

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ID=39925679

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Country Link
JP (1) JP5248034B2 (ja)
KR (1) KR101526862B1 (ja)
CN (2) CN103936999B (ja)
TW (1) TWI425028B (ja)
WO (1) WO2008133228A1 (ja)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011001911A1 (ja) * 2009-07-01 2011-01-06 協立化学産業株式会社 速硬化性に優れたエネルギー線硬化型エポキシ樹脂組成物
JP2012144678A (ja) * 2011-01-14 2012-08-02 Adeka Corp ケイ素含有硬化性樹脂組成物
WO2012153821A1 (ja) * 2011-05-10 2012-11-15 住友電気工業株式会社 光ファイバ
JP2012237801A (ja) * 2011-05-10 2012-12-06 Sumitomo Electric Ind Ltd 光ファイバ
JP2013057732A (ja) * 2011-09-07 2013-03-28 Adeka Corp 光ファイバ
WO2013140601A1 (ja) * 2012-03-23 2013-09-26 株式会社Adeka ケイ素含有硬化性樹脂組成物
JP2014208826A (ja) * 2009-11-09 2014-11-06 ダウ コーニング コーポレーションＤｏｗｃｏｒｎｉｎｇ Ｃｏｒｐｏｒａｔｉｏｎ クラスタ化官能性ポリオルガノシロキサンの調製プロセス、及びそれらの使用方法
WO2015012141A1 (ja) * 2013-07-24 2015-01-29 株式会社Adeka 硬化性樹脂組成物
US9593209B2 (en) 2009-10-22 2017-03-14 Dow Corning Corporation Process for preparing clustered functional polyorganosiloxanes, and methods for their use
US9670392B2 (en) 2013-02-11 2017-06-06 Dow Corning Corporation Stable thermal radical curable silicone adhesive compositions
US9718925B2 (en) 2013-02-11 2017-08-01 Dow Corning Corporation Curable silicone compositions comprising clustered functional polyorganosiloxanes and silicone reactive diluents
US10370572B2 (en) 2013-02-11 2019-08-06 Dow Silicones Corporation Moisture-curable hot melt silicone adhesive compositions including an alkoxy-functional siloxane reactive resin
US10370574B2 (en) 2013-02-11 2019-08-06 Dow Silicones Corporation Method for forming thermally conductive thermal radical cure silicone compositions
US10493723B2 (en) 2015-11-05 2019-12-03 Dow Silicones Corporation Branched polyorganosiloxanes and related curable compositions, methods, uses, and devices

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US20120019938A1 (en) 2009-03-23 2012-01-26 Fujifilm Corporation Curable resin composition for cemented lens, imaging lens, and method for manufacturing imaging lens
JP5762876B2 (ja) * 2011-08-03 2015-08-12 株式会社Adeka エポキシ樹脂用硬化剤、及び該エポキシ樹脂用硬化剤を含有するエポキシ樹脂組成物
US9453105B2 (en) * 2012-09-18 2016-09-27 Jnc Corporation Epoxy and alkoxysilyl group-containing silsesquioxane and composition thereof
KR101768310B1 (ko) * 2015-04-30 2017-08-16 삼성에스디아이 주식회사 윈도우 필름용 조성물, 이로부터 형성된 플렉시블 윈도우 필름 및 이를 포함하는 플렉시블 디스플레이 장치
WO2019244531A1 (ja) * 2018-06-21 2019-12-26 株式会社Adeka 表面処理窒化アルミニウムの製造方法、表面処理窒化アルミニウム、樹脂組成物、及び硬化物
JP7021046B2 (ja) * 2018-10-22 2022-02-16 信越化学工業株式会社 付加硬化型シリコーン組成物、シリコーン硬化物、及び、光学素子
CN117777455B (zh) * 2024-02-28 2024-05-10 山东同益光刻胶材料科技有限公司 一种含氟聚硅氧烷及其制备方法、光刻胶组合物及其应用

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JPH04226525A (ja) * 1990-07-05 1992-08-17 General Electric Co <Ge> 熱変形温度が高いエポキシシロキサン／有機エポキシ組成物
JP2005133073A (ja) * 2003-10-10 2005-05-26 Shin Etsu Chem Co Ltd 硬化性組成物
JP2005523980A (ja) * 2002-05-01 2005-08-11 ダウ・コーニング・コーポレイション オルガノハイドロジェンシリコン化合物
JP2005529989A (ja) * 2002-05-01 2005-10-06 ダウ・コーニング・コーポレイション 向上したバス・ライフを持つ組成物
JP2006511645A (ja) * 2002-12-20 2006-04-06 ダウ・コーニング・コーポレイション 有機水素シリコン化合物由来の分岐ポリマー
JP2006213762A (ja) * 2005-02-01 2006-08-17 Asahi Kasei Corp 発光素子封止用樹脂組成物、発光部品及び該発光部品を用いた表示機器
WO2007105556A1 (ja) * 2006-03-10 2007-09-20 Adeka Corporation 光学材料用硬化性組成物及び光導波路

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JP5225528B2 (ja) * 2001-05-30 2013-07-03 株式会社Ａｄｅｋａ ケイ素含有重合体の製造方法
JP5132027B2 (ja) * 2004-05-12 2013-01-30 株式会社Ａｄｅｋａ ケイ素含有硬化性組成物、及びこれを熱硬化させた硬化物

Patent Citations (7)

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Publication number Priority date Publication date Assignee Title
JPH04226525A (ja) * 1990-07-05 1992-08-17 General Electric Co <Ge> 熱変形温度が高いエポキシシロキサン／有機エポキシ組成物
JP2005523980A (ja) * 2002-05-01 2005-08-11 ダウ・コーニング・コーポレイション オルガノハイドロジェンシリコン化合物
JP2005529989A (ja) * 2002-05-01 2005-10-06 ダウ・コーニング・コーポレイション 向上したバス・ライフを持つ組成物
JP2006511645A (ja) * 2002-12-20 2006-04-06 ダウ・コーニング・コーポレイション 有機水素シリコン化合物由来の分岐ポリマー
JP2005133073A (ja) * 2003-10-10 2005-05-26 Shin Etsu Chem Co Ltd 硬化性組成物
JP2006213762A (ja) * 2005-02-01 2006-08-17 Asahi Kasei Corp 発光素子封止用樹脂組成物、発光部品及び該発光部品を用いた表示機器
WO2007105556A1 (ja) * 2006-03-10 2007-09-20 Adeka Corporation 光学材料用硬化性組成物及び光導波路

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011001911A1 (ja) * 2009-07-01 2011-01-06 協立化学産業株式会社 速硬化性に優れたエネルギー線硬化型エポキシ樹脂組成物
KR101671047B1 (ko) * 2009-07-01 2016-10-31 교리쯔 가가꾸 산교 가부시키가이샤 속경화성이 우수한 에너지선 경화형 에폭시 수지 조성물
JP5736568B2 (ja) * 2009-07-01 2015-06-17 協立化学産業株式会社 速硬化性に優れたエネルギー線硬化型エポキシ樹脂組成物
US9593209B2 (en) 2009-10-22 2017-03-14 Dow Corning Corporation Process for preparing clustered functional polyorganosiloxanes, and methods for their use
JP2016153512A (ja) * 2009-11-09 2016-08-25 ダウ コーニング コーポレーションＤｏｗ Ｃｏｒｎｉｎｇ Ｃｏｒｐｏｒａｔｉｏｎ クラスタ化官能性ポリオルガノシロキサンの調製プロセス、及びそれらの使用方法
JP2014208826A (ja) * 2009-11-09 2014-11-06 ダウ コーニング コーポレーションＤｏｗｃｏｒｎｉｎｇ Ｃｏｒｐｏｒａｔｉｏｎ クラスタ化官能性ポリオルガノシロキサンの調製プロセス、及びそれらの使用方法
JP2012144678A (ja) * 2011-01-14 2012-08-02 Adeka Corp ケイ素含有硬化性樹脂組成物
WO2012153821A1 (ja) * 2011-05-10 2012-11-15 住友電気工業株式会社 光ファイバ
JP2012237801A (ja) * 2011-05-10 2012-12-06 Sumitomo Electric Ind Ltd 光ファイバ
US9297950B2 (en) 2011-05-10 2016-03-29 Sumitomo Electric Industries, Ltd. Optical fiber
JP2013057732A (ja) * 2011-09-07 2013-03-28 Adeka Corp 光ファイバ
WO2013140601A1 (ja) * 2012-03-23 2013-09-26 株式会社Adeka ケイ素含有硬化性樹脂組成物
US9670392B2 (en) 2013-02-11 2017-06-06 Dow Corning Corporation Stable thermal radical curable silicone adhesive compositions
US9718925B2 (en) 2013-02-11 2017-08-01 Dow Corning Corporation Curable silicone compositions comprising clustered functional polyorganosiloxanes and silicone reactive diluents
US10370572B2 (en) 2013-02-11 2019-08-06 Dow Silicones Corporation Moisture-curable hot melt silicone adhesive compositions including an alkoxy-functional siloxane reactive resin
US10370574B2 (en) 2013-02-11 2019-08-06 Dow Silicones Corporation Method for forming thermally conductive thermal radical cure silicone compositions
WO2015012141A1 (ja) * 2013-07-24 2015-01-29 株式会社Adeka 硬化性樹脂組成物
JPWO2015012141A1 (ja) * 2013-07-24 2017-03-02 株式会社Adeka 硬化性樹脂組成物
US10493723B2 (en) 2015-11-05 2019-12-03 Dow Silicones Corporation Branched polyorganosiloxanes and related curable compositions, methods, uses, and devices

Also Published As

Publication number Publication date
TWI425028B (zh) 2014-02-01
KR20090129990A (ko) 2009-12-17
KR101526862B1 (ko) 2015-06-08
CN101616962A (zh) 2009-12-30
TW200911886A (en) 2009-03-16
CN103936999B (zh) 2016-08-17
JP5248034B2 (ja) 2013-07-31
CN103936999A (zh) 2014-07-23
JP2008266485A (ja) 2008-11-06

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