+

WO2008123191A1 - Corps moulé en résine et son procédé de fabrication - Google Patents

Corps moulé en résine et son procédé de fabrication Download PDF

Info

Publication number
WO2008123191A1
WO2008123191A1 PCT/JP2008/055426 JP2008055426W WO2008123191A1 WO 2008123191 A1 WO2008123191 A1 WO 2008123191A1 JP 2008055426 W JP2008055426 W JP 2008055426W WO 2008123191 A1 WO2008123191 A1 WO 2008123191A1
Authority
WO
WIPO (PCT)
Prior art keywords
die
manufacturing
same
molded body
cavity
Prior art date
Application number
PCT/JP2008/055426
Other languages
English (en)
Japanese (ja)
Inventor
Shuzo Okumura
Ryomei Omote
Takao Hashimoto
Yuki Matsui
Original Assignee
Nissha Printing Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissha Printing Co., Ltd. filed Critical Nissha Printing Co., Ltd.
Publication of WO2008123191A1 publication Critical patent/WO2008123191A1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/16—Making multilayered or multicoloured articles
    • B29C45/1671—Making multilayered or multicoloured articles with an insert
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14336—Coating a portion of the article, e.g. the edge of the article
    • B29C45/14418—Sealing means between mould and article
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14778—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the article consisting of a material with particular properties, e.g. porous, brittle
    • B29C45/14811—Multilayered articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/30—Vehicles, e.g. ships or aircraft, or body parts thereof
    • B29L2031/3055—Cars
    • B29L2031/3061—Number plates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3431—Telephones, Earphones
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3431—Telephones, Earphones
    • B29L2031/3437—Cellular phones

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

Selon l'invention, un film d'insert (17) est alimenté entre une matrice commune (21) et une première matrice de remplacement (22), puis une matrice (20) est fermée, et une première résine fondue est injectée à l'intérieur d'une première cavité (28) tout en maintenant le film d'insert (17) dans la première cavité (28), et la première résine fondue et le film de base (17) du film d'insert sont liés. La première matrice de remplacement (22) est remplacée par une seconde matrice de remplacement (23), puis la matrice est fermée de telle sorte que la pointe d'une broche (31) est amenée en contact avec un motif de circuit (14) sur la surface du film d'insert (17). Une seconde résine fondue est injectée à l'intérieur de la seconde cavité (30), et une ouverture, qui est formée par la broche (31) et atteint le motif de circuit, est utilisée en tant que trou traversant d'alimentation de puissance (12a) pour le motif de circuit.
PCT/JP2008/055426 2007-03-30 2008-03-24 Corps moulé en résine et son procédé de fabrication WO2008123191A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007091743 2007-03-30
JP2007-091743 2007-03-30

Publications (1)

Publication Number Publication Date
WO2008123191A1 true WO2008123191A1 (fr) 2008-10-16

Family

ID=39830688

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/055426 WO2008123191A1 (fr) 2007-03-30 2008-03-24 Corps moulé en résine et son procédé de fabrication

Country Status (2)

Country Link
TW (1) TW200905976A (fr)
WO (1) WO2008123191A1 (fr)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010061840A1 (fr) * 2008-11-28 2010-06-03 日本写真印刷株式会社 Dispositif de moulage pour moulage bicolore et article moulé bicolore
WO2010089628A1 (fr) * 2009-02-08 2010-08-12 Sony Ericsson Mobile Communications Ab Téléphone portable monobloc moulé par injection, machine et procédé
CN101820094A (zh) * 2009-02-27 2010-09-01 三星电机株式会社 移动通信终端的天线嵌入壳体、制造方法和移动通信终端
EP2284947A1 (fr) * 2009-08-10 2011-02-16 Samsung Electro-Mechanics Co., Ltd Cadre de motif d'antenne, procédé et moule pour sa fabrication, boîtier de dispositif électronique doté du cadre de motif d'antenne intégré et son procédé de fabrication
JP2011109546A (ja) * 2009-11-19 2011-06-02 Nissha Printing Co Ltd 無線充電システムにおける受電系筐体の製造方法
WO2011020946A3 (fr) * 2009-08-20 2011-06-23 Perlos Oyj Dispositif électronique
WO2011073854A1 (fr) * 2009-12-18 2011-06-23 Sony Ericsson Mobile Communications Ab Couvercle de boîtier moulé éclairé pour un dispositif de communication mobile
CN102756458A (zh) * 2011-04-28 2012-10-31 日本写真印刷株式会社 成形同时装饰用模具和成形同时装饰品的制造方法
JP2013214909A (ja) * 2012-04-03 2013-10-17 Denso Corp 車両用携帯機
US8618989B2 (en) 2009-04-23 2013-12-31 Samsung Electro-Mechanics Co., Ltd. Electronic device case, method and mold for manufacturing the same, and mobile communications terminal
JP2014078058A (ja) * 2012-10-09 2014-05-01 Kojima Press Industry Co Ltd タッチパネル
US9425503B2 (en) 2009-04-23 2016-08-23 Samsung Electro-Mechanics Co., Ltd. Antenna pattern frame, method and mold for manufacturing the same, and electronic device

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI493787B (zh) * 2012-06-25 2015-07-21 Acer Inc 電子裝置
CN104339531A (zh) * 2013-08-08 2015-02-11 青岛佳友模具科技有限公司 一种内嵌件双色注塑的方法
DE102016103488A1 (de) * 2016-02-26 2017-08-31 Inotech Kunststofftechnik Gmbh Verfahren zum Herstellen eines Mehrkomponenten-Spritzguss-Formteiles

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6239857Y2 (fr) * 1982-08-31 1987-10-12
JPS6489604A (en) * 1987-09-29 1989-04-04 Nissha Printing Manufacture of parabolic antenna reflector
JPH1075086A (ja) * 1996-08-29 1998-03-17 Nissha Printing Co Ltd 回路一体型電磁波シールド体及びその製造方法
JP2003011103A (ja) * 2001-07-05 2003-01-15 Hisashi Shigekusa 木製トレイの製造方法
JP2004002976A (ja) * 2002-03-25 2004-01-08 Nissha Printing Co Ltd 金属発色を有するカバーパネル
JP2004248114A (ja) * 2003-02-17 2004-09-02 Nissha Printing Co Ltd 移動体通信端末装置
JP3717701B2 (ja) * 1999-04-19 2005-11-16 凸版印刷株式会社 ハイブリッド型ｉｃカードの製造方法
WO2006106982A1 (fr) * 2005-04-01 2006-10-12 Nissha Printing Co., Ltd. Antenne transparente pour affichage, organe phototransmetteur pour affichage possedant une antenne, et element pour boitier, dote d’une antenne

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6239857Y2 (fr) * 1982-08-31 1987-10-12
JPS6489604A (en) * 1987-09-29 1989-04-04 Nissha Printing Manufacture of parabolic antenna reflector
JPH1075086A (ja) * 1996-08-29 1998-03-17 Nissha Printing Co Ltd 回路一体型電磁波シールド体及びその製造方法
JP3717701B2 (ja) * 1999-04-19 2005-11-16 凸版印刷株式会社 ハイブリッド型ｉｃカードの製造方法
JP2003011103A (ja) * 2001-07-05 2003-01-15 Hisashi Shigekusa 木製トレイの製造方法
JP2004002976A (ja) * 2002-03-25 2004-01-08 Nissha Printing Co Ltd 金属発色を有するカバーパネル
JP2004248114A (ja) * 2003-02-17 2004-09-02 Nissha Printing Co Ltd 移動体通信端末装置
WO2006106982A1 (fr) * 2005-04-01 2006-10-12 Nissha Printing Co., Ltd. Antenne transparente pour affichage, organe phototransmetteur pour affichage possedant une antenne, et element pour boitier, dote d’une antenne

Cited By (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8247059B2 (en) 2008-11-28 2012-08-21 Nissha Printing Co., Ltd. Two-color molded product
US8113808B2 (en) 2008-11-28 2012-02-14 Nissha Printing Co., Ltd. Two-color molding equipment and two-color molded product
WO2010061840A1 (fr) * 2008-11-28 2010-06-03 日本写真印刷株式会社 Dispositif de moulage pour moulage bicolore et article moulé bicolore
EP2357073A4 (fr) * 2008-11-28 2012-07-04 Nissha Printing Dispositif de moulage pour moulage bicolore et article moulé bicolore
KR101150062B1 (ko) 2008-11-28 2012-05-31 니폰샤신인사츠가부시키가이샤 2색 성형용 금형 장치 및 2색 성형품
EP2357073A1 (fr) * 2008-11-28 2011-08-17 Nissha Printing Co., Ltd. Dispositif de moulage pour moulage bicolore et article moulé bicolore
US8180411B2 (en) 2009-02-08 2012-05-15 Sony Ericsson Mobile Communications Ab Injection molded solid mobile phone, machine, and method
WO2010089628A1 (fr) * 2009-02-08 2010-08-12 Sony Ericsson Mobile Communications Ab Téléphone portable monobloc moulé par injection, machine et procédé
DE102009046679B4 (de) * 2009-02-27 2017-05-24 Samsung Electro - Mechanics Co., Ltd. Verfahren zum Herstellen eines Gehäuses mit einer eingebetteten Antenne und zugehöriges Mobilfunkgerät
US8289216B2 (en) 2009-02-27 2012-10-16 Samsung Electro-Mechanics Co., Ltd. Antenna-embedded case for mobile communications terminal, method of manufacturing the same, and mobile communications terminal
CN101820094A (zh) * 2009-02-27 2010-09-01 三星电机株式会社 移动通信终端的天线嵌入壳体、制造方法和移动通信终端
US9096029B2 (en) 2009-04-23 2015-08-04 Samsung Electro-Mechanics Co., Ltd. Electronic device case, method and mold for manufacturing the same, and mobile communications terminal
US9425503B2 (en) 2009-04-23 2016-08-23 Samsung Electro-Mechanics Co., Ltd. Antenna pattern frame, method and mold for manufacturing the same, and electronic device
DE102009046936B4 (de) * 2009-04-23 2019-05-29 Samsung Electro - Mechanics Co., Ltd. Gehäuse für ein elektronisches Gerät, Verfahren und Form zum Herstellen desselben und Mobilfunkgerät
US8618989B2 (en) 2009-04-23 2013-12-31 Samsung Electro-Mechanics Co., Ltd. Electronic device case, method and mold for manufacturing the same, and mobile communications terminal
US8922439B2 (en) 2009-04-23 2014-12-30 Samsung Electro-Mechanics Co., Ltd. Electronic device case, method and mold for manufacturing the same, and mobile communications terminal
US8643547B2 (en) 2009-08-10 2014-02-04 Samsung Electro-Mechanics Co., Ltd. Antenna pattern frame, method and mold for manufacturing the same, electronic device case having antenna pattern frame embedded therein, and method for manufacturing the same
US9444133B2 (en) 2009-08-10 2016-09-13 Samsung Electro-Mechanics Co., Ltd. Antenna pattern frame, method and mold for manufacturing the same, electronic device case having antenna pattern frame embedded therein, and method for manufacturing the same
EP2284947A1 (fr) * 2009-08-10 2011-02-16 Samsung Electro-Mechanics Co., Ltd Cadre de motif d'antenne, procédé et moule pour sa fabrication, boîtier de dispositif électronique doté du cadre de motif d'antenne intégré et son procédé de fabrication
WO2011020946A3 (fr) * 2009-08-20 2011-06-23 Perlos Oyj Dispositif électronique
JP2011109546A (ja) * 2009-11-19 2011-06-02 Nissha Printing Co Ltd 無線充電システムにおける受電系筐体の製造方法
WO2011073854A1 (fr) * 2009-12-18 2011-06-23 Sony Ericsson Mobile Communications Ab Couvercle de boîtier moulé éclairé pour un dispositif de communication mobile
JP2012236410A (ja) * 2011-04-28 2012-12-06 Nissha Printing Co Ltd 成形同時加飾用金型、成形同時加飾品の製造方法、及び成形同時加飾装置
CN102756458A (zh) * 2011-04-28 2012-10-31 日本写真印刷株式会社 成形同时装饰用模具和成形同时装饰品的制造方法
JP2013214909A (ja) * 2012-04-03 2013-10-17 Denso Corp 車両用携帯機
JP2014078058A (ja) * 2012-10-09 2014-05-01 Kojima Press Industry Co Ltd タッチパネル

Also Published As

Publication number Publication date
TW200905976A (en) 2009-02-01

Similar Documents

Publication Publication Date Title
WO2008123191A1 (fr) Corps moulé en résine et son procédé de fabrication
WO2008084230A3 (fr) Moule à injection et procédé de moulage par injection
US20090017155A1 (en) Apparatus for injection molding
WO2010101744A3 (fr) Manchon d'outil pour matrice de moulage et procédé de moulage de pièces utilisant celui-ci
TW200733326A (en) Method of resin sealing electronic part
TW200802655A (en) Conductive bonding material fill techniques
MY175748A (en) In-mold molding method, in-mold transfer film and manufacturing method therefor
WO2008129480A3 (fr) Composant électronique, et procédé de fabrication d'un composant électronique
WO2007146217A3 (fr) Procédé et appareil permettant de mouler et d'assembler des assemblages en plastique de pièces multiples
WO2009129230A3 (fr) Procédés pour former des parties moulées par injection et capteurs placés dans le moule à cet effet
WO2008139554A1 (fr) Support et embase pour connecteur
EP1391285A4 (fr) Procede de moulage d'element en resine et dispositif de moulage par injection
GB2432811A (en) Moulded plastic components with anti-reflective and anti-glare properties and method for their manufacture
EP1768168A3 (fr) Méthode de moulage par résine de dispositifs électroniques et appareil correspondant
ATE520510T1 (de) Spritzgiessmaschine für schmelzkerntechnik
HK1087537A1 (en) Contact socket and method for production of such a contact socket, socket, and electrical connection
WO2009001436A1 (fr) Procédé de fabrication d'un connecteur
WO2008139868A1 (fr) Matrice de moulage par injection
SG131057A1 (en) Method of resin-seal-molding electronic component and apparatus therefor
WO2008012694A3 (fr) Processus de fabrication d'une électrode encadrée
MX2007004544A (es) Aparato y metodo para manufacturar productos de plastico.
WO2008153336A3 (fr) Boîtier pour appareil électronique et procédé de fabrication de ce boîtier
US20080220113A1 (en) Insert molding article and method for making the same
WO2006015208A3 (fr) Systeme de moule d'encapsulation et cartouche interchangeable
CN103817855A (zh) 除外观结合线软胶包硬胶结构

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08738765

Country of ref document: EP

Kind code of ref document: A1

DPE1 Request for preliminary examination filed after expiration of 19th month from priority date (pct application filed from 20040101)
NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08738765

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: JP

点击 这是indexloc提供的php浏览器服务，不要输入任何密码和下载