WO2008123191A1 - Resin molded body and method for manufacturing the same - Google Patents
Resin molded body and method for manufacturing the same Download PDFInfo
- Publication number
- WO2008123191A1 WO2008123191A1 PCT/JP2008/055426 JP2008055426W WO2008123191A1 WO 2008123191 A1 WO2008123191 A1 WO 2008123191A1 JP 2008055426 W JP2008055426 W JP 2008055426W WO 2008123191 A1 WO2008123191 A1 WO 2008123191A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- die
- manufacturing
- same
- molded body
- cavity
- Prior art date
Links
- 239000011347 resin Substances 0.000 title abstract 4
- 229920005989 resin Polymers 0.000 title abstract 4
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/16—Making multilayered or multicoloured articles
- B29C45/1671—Making multilayered or multicoloured articles with an insert
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14336—Coating a portion of the article, e.g. the edge of the article
- B29C45/14418—Sealing means between mould and article
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14778—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the article consisting of a material with particular properties, e.g. porous, brittle
- B29C45/14811—Multilayered articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/30—Vehicles, e.g. ships or aircraft, or body parts thereof
- B29L2031/3055—Cars
- B29L2031/3061—Number plates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3431—Telephones, Earphones
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3431—Telephones, Earphones
- B29L2031/3437—Cellular phones
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
An insert film (17) is supplied between a common die (21) and a first replacing die (22), then a die (20) is closed, and a first molten resin is injected into a first cavity (28), while holding the insert film (17) in the first cavity (28), and the first molten resin and the base film (17) of the insert film are bonded. The first replacing die (22) is replaced with a second replacing die (23), then the die is closed so that the tip of a pin (31) is brought into contact with a circuit pattern (14) on the surface of the insert film (17). A second molten resin is injected into the second cavity (30), and an opening, which is formed by the pin (31) and reaches the circuit pattern, is used as a power feeding through hole (12a) for the circuit pattern.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007091743 | 2007-03-30 | ||
JP2007-091743 | 2007-03-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008123191A1 true WO2008123191A1 (en) | 2008-10-16 |
Family
ID=39830688
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/055426 WO2008123191A1 (en) | 2007-03-30 | 2008-03-24 | Resin molded body and method for manufacturing the same |
Country Status (2)
Country | Link |
---|---|
TW (1) | TW200905976A (en) |
WO (1) | WO2008123191A1 (en) |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010061840A1 (en) * | 2008-11-28 | 2010-06-03 | 日本写真印刷株式会社 | Mold device for two-color molding and two-color molded article |
WO2010089628A1 (en) * | 2009-02-08 | 2010-08-12 | Sony Ericsson Mobile Communications Ab | Injection molded solid mobile phone, machine, and method |
CN101820094A (en) * | 2009-02-27 | 2010-09-01 | 三星电机株式会社 | Antenna embeded mobile communication terminal case and method of manufacturing the same, mobile communication terminal |
EP2284947A1 (en) * | 2009-08-10 | 2011-02-16 | Samsung Electro-Mechanics Co., Ltd | Antenna pattern frame, method and mold for manufacturing the same, electronic device case having antenna pattern frame embedded therein, and method for manufacturing the same |
JP2011109546A (en) * | 2009-11-19 | 2011-06-02 | Nissha Printing Co Ltd | Method of manufacturing power receiving system housing in wireless charging system |
WO2011073854A1 (en) * | 2009-12-18 | 2011-06-23 | Sony Ericsson Mobile Communications Ab | Illuminated molded housing cover for mobile communication device |
WO2011020946A3 (en) * | 2009-08-20 | 2011-06-23 | Perlos Oyj | Cover comprising a flexible connecting element for an electronic device |
CN102756458A (en) * | 2011-04-28 | 2012-10-31 | 日本写真印刷株式会社 | Forming-and-decorative use die and method for making the same |
JP2013214909A (en) * | 2012-04-03 | 2013-10-17 | Denso Corp | Vehicle mobile equipment |
US8618989B2 (en) | 2009-04-23 | 2013-12-31 | Samsung Electro-Mechanics Co., Ltd. | Electronic device case, method and mold for manufacturing the same, and mobile communications terminal |
JP2014078058A (en) * | 2012-10-09 | 2014-05-01 | Kojima Press Industry Co Ltd | Touch panel |
US9425503B2 (en) | 2009-04-23 | 2016-08-23 | Samsung Electro-Mechanics Co., Ltd. | Antenna pattern frame, method and mold for manufacturing the same, and electronic device |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI493787B (en) * | 2012-06-25 | 2015-07-21 | Acer Inc | Electronic device |
CN104339531A (en) * | 2013-08-08 | 2015-02-11 | 青岛佳友模具科技有限公司 | A method for two-color injection molding of an insert |
DE102016103488A1 (en) * | 2016-02-26 | 2017-08-31 | Inotech Kunststofftechnik Gmbh | Method for producing a multi-component injection molded part |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6239857Y2 (en) * | 1982-08-31 | 1987-10-12 | ||
JPS6489604A (en) * | 1987-09-29 | 1989-04-04 | Nissha Printing | Manufacture of parabolic antenna reflector |
JPH1075086A (en) * | 1996-08-29 | 1998-03-17 | Nissha Printing Co Ltd | Circuit integrated electromagnetic wave shield body and its manufacture |
JP2003011103A (en) * | 2001-07-05 | 2003-01-15 | Hisashi Shigekusa | Method for manufacturing wooden tray |
JP2004002976A (en) * | 2002-03-25 | 2004-01-08 | Nissha Printing Co Ltd | Cover panel developing metallic color |
JP2004248114A (en) * | 2003-02-17 | 2004-09-02 | Nissha Printing Co Ltd | Mobile communication terminal device |
JP3717701B2 (en) * | 1999-04-19 | 2005-11-16 | 凸版印刷株式会社 | Manufacturing method of hybrid IC card |
WO2006106982A1 (en) * | 2005-04-01 | 2006-10-12 | Nissha Printing Co., Ltd. | Transparent antenna for display, light transmissive member for display, having antenna, and part for housing, having antenna |
-
2008
- 2008-03-24 WO PCT/JP2008/055426 patent/WO2008123191A1/en active Application Filing
- 2008-03-26 TW TW97110756A patent/TW200905976A/en unknown
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6239857Y2 (en) * | 1982-08-31 | 1987-10-12 | ||
JPS6489604A (en) * | 1987-09-29 | 1989-04-04 | Nissha Printing | Manufacture of parabolic antenna reflector |
JPH1075086A (en) * | 1996-08-29 | 1998-03-17 | Nissha Printing Co Ltd | Circuit integrated electromagnetic wave shield body and its manufacture |
JP3717701B2 (en) * | 1999-04-19 | 2005-11-16 | 凸版印刷株式会社 | Manufacturing method of hybrid IC card |
JP2003011103A (en) * | 2001-07-05 | 2003-01-15 | Hisashi Shigekusa | Method for manufacturing wooden tray |
JP2004002976A (en) * | 2002-03-25 | 2004-01-08 | Nissha Printing Co Ltd | Cover panel developing metallic color |
JP2004248114A (en) * | 2003-02-17 | 2004-09-02 | Nissha Printing Co Ltd | Mobile communication terminal device |
WO2006106982A1 (en) * | 2005-04-01 | 2006-10-12 | Nissha Printing Co., Ltd. | Transparent antenna for display, light transmissive member for display, having antenna, and part for housing, having antenna |
Cited By (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8247059B2 (en) | 2008-11-28 | 2012-08-21 | Nissha Printing Co., Ltd. | Two-color molded product |
US8113808B2 (en) | 2008-11-28 | 2012-02-14 | Nissha Printing Co., Ltd. | Two-color molding equipment and two-color molded product |
WO2010061840A1 (en) * | 2008-11-28 | 2010-06-03 | 日本写真印刷株式会社 | Mold device for two-color molding and two-color molded article |
EP2357073A4 (en) * | 2008-11-28 | 2012-07-04 | Nissha Printing | MOLDING DEVICE FOR TWO-COLOR MOLDING AND TWO-COLORED MOLDED ARTICLE |
KR101150062B1 (en) | 2008-11-28 | 2012-05-31 | 니폰샤신인사츠가부시키가이샤 | Mold device for two?color molding and two?color molded article |
EP2357073A1 (en) * | 2008-11-28 | 2011-08-17 | Nissha Printing Co., Ltd. | Mold device for two-color molding and two-color molded article |
US8180411B2 (en) | 2009-02-08 | 2012-05-15 | Sony Ericsson Mobile Communications Ab | Injection molded solid mobile phone, machine, and method |
WO2010089628A1 (en) * | 2009-02-08 | 2010-08-12 | Sony Ericsson Mobile Communications Ab | Injection molded solid mobile phone, machine, and method |
DE102009046679B4 (en) * | 2009-02-27 | 2017-05-24 | Samsung Electro - Mechanics Co., Ltd. | Method for producing a housing with an embedded antenna and associated mobile device |
US8289216B2 (en) | 2009-02-27 | 2012-10-16 | Samsung Electro-Mechanics Co., Ltd. | Antenna-embedded case for mobile communications terminal, method of manufacturing the same, and mobile communications terminal |
CN101820094A (en) * | 2009-02-27 | 2010-09-01 | 三星电机株式会社 | Antenna embeded mobile communication terminal case and method of manufacturing the same, mobile communication terminal |
US9096029B2 (en) | 2009-04-23 | 2015-08-04 | Samsung Electro-Mechanics Co., Ltd. | Electronic device case, method and mold for manufacturing the same, and mobile communications terminal |
US9425503B2 (en) | 2009-04-23 | 2016-08-23 | Samsung Electro-Mechanics Co., Ltd. | Antenna pattern frame, method and mold for manufacturing the same, and electronic device |
DE102009046936B4 (en) * | 2009-04-23 | 2019-05-29 | Samsung Electro - Mechanics Co., Ltd. | Housing for an electronic device, method and form for making the same and mobile device |
US8618989B2 (en) | 2009-04-23 | 2013-12-31 | Samsung Electro-Mechanics Co., Ltd. | Electronic device case, method and mold for manufacturing the same, and mobile communications terminal |
US8922439B2 (en) | 2009-04-23 | 2014-12-30 | Samsung Electro-Mechanics Co., Ltd. | Electronic device case, method and mold for manufacturing the same, and mobile communications terminal |
US8643547B2 (en) | 2009-08-10 | 2014-02-04 | Samsung Electro-Mechanics Co., Ltd. | Antenna pattern frame, method and mold for manufacturing the same, electronic device case having antenna pattern frame embedded therein, and method for manufacturing the same |
US9444133B2 (en) | 2009-08-10 | 2016-09-13 | Samsung Electro-Mechanics Co., Ltd. | Antenna pattern frame, method and mold for manufacturing the same, electronic device case having antenna pattern frame embedded therein, and method for manufacturing the same |
EP2284947A1 (en) * | 2009-08-10 | 2011-02-16 | Samsung Electro-Mechanics Co., Ltd | Antenna pattern frame, method and mold for manufacturing the same, electronic device case having antenna pattern frame embedded therein, and method for manufacturing the same |
WO2011020946A3 (en) * | 2009-08-20 | 2011-06-23 | Perlos Oyj | Cover comprising a flexible connecting element for an electronic device |
JP2011109546A (en) * | 2009-11-19 | 2011-06-02 | Nissha Printing Co Ltd | Method of manufacturing power receiving system housing in wireless charging system |
WO2011073854A1 (en) * | 2009-12-18 | 2011-06-23 | Sony Ericsson Mobile Communications Ab | Illuminated molded housing cover for mobile communication device |
JP2012236410A (en) * | 2011-04-28 | 2012-12-06 | Nissha Printing Co Ltd | Mold for simultaneous molding and decorating, method of manufacturing simultaneously molded and decorated article, and device of simultaneous molding and decorating |
CN102756458A (en) * | 2011-04-28 | 2012-10-31 | 日本写真印刷株式会社 | Forming-and-decorative use die and method for making the same |
JP2013214909A (en) * | 2012-04-03 | 2013-10-17 | Denso Corp | Vehicle mobile equipment |
JP2014078058A (en) * | 2012-10-09 | 2014-05-01 | Kojima Press Industry Co Ltd | Touch panel |
Also Published As
Publication number | Publication date |
---|---|
TW200905976A (en) | 2009-02-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2008123191A1 (en) | Resin molded body and method for manufacturing the same | |
US7780435B2 (en) | Injection molding apparatus having a sprue bushing for communication with a nozzle | |
WO2008141218A3 (en) | Composite component and method of manufacturing the same | |
WO2008084230A8 (en) | Injection mould and injection moulding method | |
WO2010101744A3 (en) | Tool sleeve for mold die and method of molding parts using the same | |
TW200802655A (en) | Conductive bonding material fill techniques | |
MY175748A (en) | In-mold molding method, in-mold transfer film and manufacturing method therefor | |
WO2008129480A3 (en) | An electronic component, and a method of manufacturing an electronic component | |
WO2007146217A3 (en) | Method and apparatus for molding and assembling plural-part plastic assemblies | |
WO2009129230A3 (en) | Methods for forming injected molded parts and in-mold sensors therefor | |
WO2008139554A1 (en) | Socket and header for connector | |
EP1391285A4 (en) | Resin forming method and injection molding apparatus | |
TW200713473A (en) | Method of resin-seal-molding electronic component and apparatus therefor | |
GB2432811A (en) | Moulded plastic components with anti-reflective and anti-glare properties and method for their manufacture | |
ATE520510T1 (en) | INJECTION MOLDING MACHINE FOR FUSTED CORE TECHNOLOGY | |
HK1087537A1 (en) | Contact socket and method for production of such a contact socket, socket, and electrical connection | |
WO2009001436A1 (en) | Process for manufacturing connector | |
WO2008139868A1 (en) | Injection molding die | |
SG131057A1 (en) | Method of resin-seal-molding electronic component and apparatus therefor | |
JP2004522624A5 (en) | ||
WO2008012694A3 (en) | Process for making a framed electrode | |
MX2007004544A (en) | Apparatus and method for manufacturing plastic products. | |
WO2008153336A3 (en) | Case for electronic apparatus and method of manufacturing case for electronic apparatus | |
US20080220113A1 (en) | Insert molding article and method for making the same | |
WO2006015208A3 (en) | Encapsulation mold assembly and interchangeable cartridge |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 08738765 Country of ref document: EP Kind code of ref document: A1 |
|
DPE1 | Request for preliminary examination filed after expiration of 19th month from priority date (pct application filed from 20040101) | ||
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 08738765 Country of ref document: EP Kind code of ref document: A1 |
|
NENP | Non-entry into the national phase |
Ref country code: JP |