+

WO2008123191A1 - Resin molded body and method for manufacturing the same - Google Patents

Resin molded body and method for manufacturing the same Download PDF

Info

Publication number
WO2008123191A1
WO2008123191A1 PCT/JP2008/055426 JP2008055426W WO2008123191A1 WO 2008123191 A1 WO2008123191 A1 WO 2008123191A1 JP 2008055426 W JP2008055426 W JP 2008055426W WO 2008123191 A1 WO2008123191 A1 WO 2008123191A1
Authority
WO
WIPO (PCT)
Prior art keywords
die
manufacturing
same
molded body
cavity
Prior art date
Application number
PCT/JP2008/055426
Other languages
French (fr)
Japanese (ja)
Inventor
Shuzo Okumura
Ryomei Omote
Takao Hashimoto
Yuki Matsui
Original Assignee
Nissha Printing Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissha Printing Co., Ltd. filed Critical Nissha Printing Co., Ltd.
Publication of WO2008123191A1 publication Critical patent/WO2008123191A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/16—Making multilayered or multicoloured articles
    • B29C45/1671—Making multilayered or multicoloured articles with an insert
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14336—Coating a portion of the article, e.g. the edge of the article
    • B29C45/14418—Sealing means between mould and article
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14778—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the article consisting of a material with particular properties, e.g. porous, brittle
    • B29C45/14811—Multilayered articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/30—Vehicles, e.g. ships or aircraft, or body parts thereof
    • B29L2031/3055—Cars
    • B29L2031/3061—Number plates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3431—Telephones, Earphones
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3431—Telephones, Earphones
    • B29L2031/3437—Cellular phones

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

An insert film (17) is supplied between a common die (21) and a first replacing die (22), then a die (20) is closed, and a first molten resin is injected into a first cavity (28), while holding the insert film (17) in the first cavity (28), and the first molten resin and the base film (17) of the insert film are bonded. The first replacing die (22) is replaced with a second replacing die (23), then the die is closed so that the tip of a pin (31) is brought into contact with a circuit pattern (14) on the surface of the insert film (17). A second molten resin is injected into the second cavity (30), and an opening, which is formed by the pin (31) and reaches the circuit pattern, is used as a power feeding through hole (12a) for the circuit pattern.
PCT/JP2008/055426 2007-03-30 2008-03-24 Resin molded body and method for manufacturing the same WO2008123191A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007091743 2007-03-30
JP2007-091743 2007-03-30

Publications (1)

Publication Number Publication Date
WO2008123191A1 true WO2008123191A1 (en) 2008-10-16

Family

ID=39830688

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/055426 WO2008123191A1 (en) 2007-03-30 2008-03-24 Resin molded body and method for manufacturing the same

Country Status (2)

Country Link
TW (1) TW200905976A (en)
WO (1) WO2008123191A1 (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010061840A1 (en) * 2008-11-28 2010-06-03 日本写真印刷株式会社 Mold device for two-color molding and two-color molded article
WO2010089628A1 (en) * 2009-02-08 2010-08-12 Sony Ericsson Mobile Communications Ab Injection molded solid mobile phone, machine, and method
CN101820094A (en) * 2009-02-27 2010-09-01 三星电机株式会社 Antenna embeded mobile communication terminal case and method of manufacturing the same, mobile communication terminal
EP2284947A1 (en) * 2009-08-10 2011-02-16 Samsung Electro-Mechanics Co., Ltd Antenna pattern frame, method and mold for manufacturing the same, electronic device case having antenna pattern frame embedded therein, and method for manufacturing the same
JP2011109546A (en) * 2009-11-19 2011-06-02 Nissha Printing Co Ltd Method of manufacturing power receiving system housing in wireless charging system
WO2011020946A3 (en) * 2009-08-20 2011-06-23 Perlos Oyj Cover comprising a flexible connecting element for an electronic device
WO2011073854A1 (en) * 2009-12-18 2011-06-23 Sony Ericsson Mobile Communications Ab Illuminated molded housing cover for mobile communication device
CN102756458A (en) * 2011-04-28 2012-10-31 日本写真印刷株式会社 Forming-and-decorative use die and method for making the same
JP2013214909A (en) * 2012-04-03 2013-10-17 Denso Corp Vehicle mobile equipment
US8618989B2 (en) 2009-04-23 2013-12-31 Samsung Electro-Mechanics Co., Ltd. Electronic device case, method and mold for manufacturing the same, and mobile communications terminal
JP2014078058A (en) * 2012-10-09 2014-05-01 Kojima Press Industry Co Ltd Touch panel
US9425503B2 (en) 2009-04-23 2016-08-23 Samsung Electro-Mechanics Co., Ltd. Antenna pattern frame, method and mold for manufacturing the same, and electronic device

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI493787B (en) * 2012-06-25 2015-07-21 Acer Inc Electronic device
CN104339531A (en) * 2013-08-08 2015-02-11 青岛佳友模具科技有限公司 A method for two-color injection molding of an insert
DE102016103488A1 (en) * 2016-02-26 2017-08-31 Inotech Kunststofftechnik Gmbh Method for producing a multi-component injection molded part

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6239857Y2 (en) * 1982-08-31 1987-10-12
JPS6489604A (en) * 1987-09-29 1989-04-04 Nissha Printing Manufacture of parabolic antenna reflector
JPH1075086A (en) * 1996-08-29 1998-03-17 Nissha Printing Co Ltd Circuit integrated electromagnetic wave shield body and its manufacture
JP2003011103A (en) * 2001-07-05 2003-01-15 Hisashi Shigekusa Method for manufacturing wooden tray
JP2004002976A (en) * 2002-03-25 2004-01-08 Nissha Printing Co Ltd Cover panel developing metallic color
JP2004248114A (en) * 2003-02-17 2004-09-02 Nissha Printing Co Ltd Mobile communication terminal device
JP3717701B2 (en) * 1999-04-19 2005-11-16 凸版印刷株式会社 Manufacturing method of hybrid IC card
WO2006106982A1 (en) * 2005-04-01 2006-10-12 Nissha Printing Co., Ltd. Transparent antenna for display, light transmissive member for display, having antenna, and part for housing, having antenna

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6239857Y2 (en) * 1982-08-31 1987-10-12
JPS6489604A (en) * 1987-09-29 1989-04-04 Nissha Printing Manufacture of parabolic antenna reflector
JPH1075086A (en) * 1996-08-29 1998-03-17 Nissha Printing Co Ltd Circuit integrated electromagnetic wave shield body and its manufacture
JP3717701B2 (en) * 1999-04-19 2005-11-16 凸版印刷株式会社 Manufacturing method of hybrid IC card
JP2003011103A (en) * 2001-07-05 2003-01-15 Hisashi Shigekusa Method for manufacturing wooden tray
JP2004002976A (en) * 2002-03-25 2004-01-08 Nissha Printing Co Ltd Cover panel developing metallic color
JP2004248114A (en) * 2003-02-17 2004-09-02 Nissha Printing Co Ltd Mobile communication terminal device
WO2006106982A1 (en) * 2005-04-01 2006-10-12 Nissha Printing Co., Ltd. Transparent antenna for display, light transmissive member for display, having antenna, and part for housing, having antenna

Cited By (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8247059B2 (en) 2008-11-28 2012-08-21 Nissha Printing Co., Ltd. Two-color molded product
US8113808B2 (en) 2008-11-28 2012-02-14 Nissha Printing Co., Ltd. Two-color molding equipment and two-color molded product
WO2010061840A1 (en) * 2008-11-28 2010-06-03 日本写真印刷株式会社 Mold device for two-color molding and two-color molded article
EP2357073A4 (en) * 2008-11-28 2012-07-04 Nissha Printing MOLDING DEVICE FOR TWO-COLOR MOLDING AND TWO-COLORED MOLDED ARTICLE
KR101150062B1 (en) 2008-11-28 2012-05-31 니폰샤신인사츠가부시키가이샤 Mold device for two?color molding and two?color molded article
EP2357073A1 (en) * 2008-11-28 2011-08-17 Nissha Printing Co., Ltd. Mold device for two-color molding and two-color molded article
US8180411B2 (en) 2009-02-08 2012-05-15 Sony Ericsson Mobile Communications Ab Injection molded solid mobile phone, machine, and method
WO2010089628A1 (en) * 2009-02-08 2010-08-12 Sony Ericsson Mobile Communications Ab Injection molded solid mobile phone, machine, and method
DE102009046679B4 (en) * 2009-02-27 2017-05-24 Samsung Electro - Mechanics Co., Ltd. Method for producing a housing with an embedded antenna and associated mobile device
US8289216B2 (en) 2009-02-27 2012-10-16 Samsung Electro-Mechanics Co., Ltd. Antenna-embedded case for mobile communications terminal, method of manufacturing the same, and mobile communications terminal
CN101820094A (en) * 2009-02-27 2010-09-01 三星电机株式会社 Antenna embeded mobile communication terminal case and method of manufacturing the same, mobile communication terminal
US9096029B2 (en) 2009-04-23 2015-08-04 Samsung Electro-Mechanics Co., Ltd. Electronic device case, method and mold for manufacturing the same, and mobile communications terminal
US9425503B2 (en) 2009-04-23 2016-08-23 Samsung Electro-Mechanics Co., Ltd. Antenna pattern frame, method and mold for manufacturing the same, and electronic device
DE102009046936B4 (en) * 2009-04-23 2019-05-29 Samsung Electro - Mechanics Co., Ltd. Housing for an electronic device, method and form for making the same and mobile device
US8618989B2 (en) 2009-04-23 2013-12-31 Samsung Electro-Mechanics Co., Ltd. Electronic device case, method and mold for manufacturing the same, and mobile communications terminal
US8922439B2 (en) 2009-04-23 2014-12-30 Samsung Electro-Mechanics Co., Ltd. Electronic device case, method and mold for manufacturing the same, and mobile communications terminal
US8643547B2 (en) 2009-08-10 2014-02-04 Samsung Electro-Mechanics Co., Ltd. Antenna pattern frame, method and mold for manufacturing the same, electronic device case having antenna pattern frame embedded therein, and method for manufacturing the same
US9444133B2 (en) 2009-08-10 2016-09-13 Samsung Electro-Mechanics Co., Ltd. Antenna pattern frame, method and mold for manufacturing the same, electronic device case having antenna pattern frame embedded therein, and method for manufacturing the same
EP2284947A1 (en) * 2009-08-10 2011-02-16 Samsung Electro-Mechanics Co., Ltd Antenna pattern frame, method and mold for manufacturing the same, electronic device case having antenna pattern frame embedded therein, and method for manufacturing the same
WO2011020946A3 (en) * 2009-08-20 2011-06-23 Perlos Oyj Cover comprising a flexible connecting element for an electronic device
JP2011109546A (en) * 2009-11-19 2011-06-02 Nissha Printing Co Ltd Method of manufacturing power receiving system housing in wireless charging system
WO2011073854A1 (en) * 2009-12-18 2011-06-23 Sony Ericsson Mobile Communications Ab Illuminated molded housing cover for mobile communication device
JP2012236410A (en) * 2011-04-28 2012-12-06 Nissha Printing Co Ltd Mold for simultaneous molding and decorating, method of manufacturing simultaneously molded and decorated article, and device of simultaneous molding and decorating
CN102756458A (en) * 2011-04-28 2012-10-31 日本写真印刷株式会社 Forming-and-decorative use die and method for making the same
JP2013214909A (en) * 2012-04-03 2013-10-17 Denso Corp Vehicle mobile equipment
JP2014078058A (en) * 2012-10-09 2014-05-01 Kojima Press Industry Co Ltd Touch panel

Also Published As

Publication number Publication date
TW200905976A (en) 2009-02-01

Similar Documents

Publication Publication Date Title
WO2008123191A1 (en) Resin molded body and method for manufacturing the same
WO2008084230A3 (en) Injection mould and injection moulding method
US20090017155A1 (en) Apparatus for injection molding
WO2010101744A3 (en) Tool sleeve for mold die and method of molding parts using the same
TW200733326A (en) Method of resin sealing electronic part
TW200802655A (en) Conductive bonding material fill techniques
MY175748A (en) In-mold molding method, in-mold transfer film and manufacturing method therefor
WO2008129480A3 (en) An electronic component, and a method of manufacturing an electronic component
WO2007146217A3 (en) Method and apparatus for molding and assembling plural-part plastic assemblies
WO2009129230A3 (en) Methods for forming injected molded parts and in-mold sensors therefor
WO2008139554A1 (en) Socket and header for connector
EP1391285A4 (en) Resin forming method and injection molding apparatus
GB2432811A (en) Moulded plastic components with anti-reflective and anti-glare properties and method for their manufacture
EP1768168A3 (en) Method of resin seal moulding electronic component and apparatus therefor
ATE520510T1 (en) INJECTION MOLDING MACHINE FOR FUSTED CORE TECHNOLOGY
HK1087537A1 (en) Contact socket and method for production of such a contact socket, socket, and electrical connection
WO2009001436A1 (en) Process for manufacturing connector
WO2008139868A1 (en) Injection molding die
SG131057A1 (en) Method of resin-seal-molding electronic component and apparatus therefor
WO2008012694A3 (en) Process for making a framed electrode
MX2007004544A (en) Apparatus and method for manufacturing plastic products.
WO2008153336A3 (en) Case for electronic apparatus and method of manufacturing case for electronic apparatus
US20080220113A1 (en) Insert molding article and method for making the same
WO2006015208A3 (en) Encapsulation mold assembly and interchangeable cartridge
CN103817855A (en) Hard rubber-in-soft rubber structure capable of eliminating outer joint line

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08738765

Country of ref document: EP

Kind code of ref document: A1

DPE1 Request for preliminary examination filed after expiration of 19th month from priority date (pct application filed from 20040101)
NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08738765

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: JP

点击 这是indexloc提供的php浏览器服务，不要输入任何密码和下载