WO2008102585A1 - Substrate bonding method, microchip manufacturing method and microchip - Google Patents
Substrate bonding method, microchip manufacturing method and microchip Download PDFInfo
- Publication number
- WO2008102585A1 WO2008102585A1 PCT/JP2008/050675 JP2008050675W WO2008102585A1 WO 2008102585 A1 WO2008102585 A1 WO 2008102585A1 JP 2008050675 W JP2008050675 W JP 2008050675W WO 2008102585 A1 WO2008102585 A1 WO 2008102585A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- substrate
- microchip
- manufacturing
- substrate bonding
- bonding method
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title abstract 10
- 238000004519 manufacturing process Methods 0.000 title abstract 3
- 238000000034 method Methods 0.000 title abstract 3
- 239000011358 absorbing material Substances 0.000 abstract 1
- 239000012530 fluid Substances 0.000 abstract 1
- 230000009477 glass transition Effects 0.000 abstract 1
- 229920005992 thermoplastic resin Polymers 0.000 abstract 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C3/00—Assembling of devices or systems from individually processed components
- B81C3/001—Bonding of two components
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/1429—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface
- B29C65/1435—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface at least passing through one of the parts to be joined, i.e. transmission welding
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- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/16—Laser beams
- B29C65/1629—Laser beams characterised by the way of heating the interface
- B29C65/1635—Laser beams characterised by the way of heating the interface at least passing through one of the parts to be joined, i.e. laser transmission welding
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- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/16—Laser beams
- B29C65/1629—Laser beams characterised by the way of heating the interface
- B29C65/1654—Laser beams characterised by the way of heating the interface scanning at least one of the parts to be joined
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- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C65/168—Laser beams making use of an absorber or impact modifier placed at the interface
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- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
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- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C65/72—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by combined operations or combined techniques, e.g. welding and stitching
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- B29C66/112—Single lapped joints
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- B29C66/112—Single lapped joints
- B29C66/1122—Single lap to lap joints, i.e. overlap joints
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- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C66/114—Single butt joints
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- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C66/53461—Joining single elements to open ends of tubular or hollow articles or to the ends of bars said single elements being substantially flat joining substantially flat covers and/or substantially flat bottoms to open ends of container bodies
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- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C66/00—General aspects of processes or apparatus for joining preformed parts
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- B29C66/7336—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the optical properties of the material of the parts to be joined, e.g. fluorescence, phosphorescence at least one of the parts to be joined being opaque, transparent or translucent to visible light
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C66/731—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the intensive physical properties of the material of the parts to be joined
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B29C66/91413—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the temperature of the parts to be joined, e.g. the joining process taking the temperature of the parts to be joined into account the parts to be joined having different temperatures
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B29C66/91423—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the temperature of the joining tools using joining tools having different temperature zones or using several joining tools with different temperatures
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B29K2069/00—Use of PC, i.e. polycarbonates or derivatives thereof, as moulding material
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- B29K2309/00—Use of inorganic materials not provided for in groups B29K2303/00 - B29K2307/00, as reinforcement
- B29K2309/08—Glass
-
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- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
- B29K2995/0037—Other properties
- B29K2995/0072—Roughness, e.g. anti-slip
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/756—Microarticles, nanoarticles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/05—Microfluidics
- B81B2201/058—Microfluidics not provided for in B81B2201/051 - B81B2201/054
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/03—Bonding two components
- B81C2203/032—Gluing
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Automatic Analysis And Handling Materials Therefor (AREA)
- Micromachines (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
Abstract
Provided are a substrate bonding method, a microchip manufacturing method and a microchip obtained by the microchip manufacturing method. The substrate bonding method includes a step of adjusting the temperature of a substrate bonding surface of at least one of a light transmitting first substrate (101) and a second substrate (102) having a light absorbing material dispersed on the bonding surface to be close to the glass transition temperature of a thermoplastic resin constituting the substrate; a step of placing the first substrate (101) and the second substrate (102) one over another and applying a pressure; and a step of applying light from the side of the first substrate (101). In the microchip, deformation of a fluid circuit is suppressed.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-042182 | 2007-02-22 | ||
JP2007042182A JP2008203186A (en) | 2007-02-22 | 2007-02-22 | Substrate laminating method, manufacturing method of microchip, and the microchip |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008102585A1 true WO2008102585A1 (en) | 2008-08-28 |
Family
ID=39709864
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/050675 WO2008102585A1 (en) | 2007-02-22 | 2008-01-21 | Substrate bonding method, microchip manufacturing method and microchip |
Country Status (2)
Country | Link |
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JP (1) | JP2008203186A (en) |
WO (1) | WO2008102585A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2930740A1 (en) * | 2008-04-30 | 2009-11-06 | Jean Claude Rene Vandevoorde | METHOD AND PLANT FOR WELDING PLASTIC MATERIAL LAYERS |
EP2441518A3 (en) * | 2010-10-18 | 2013-12-04 | Sony Corporation | Method and device for thermocompression bonding |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101882078B1 (en) * | 2016-06-27 | 2018-07-27 | 한국기계연구원 | Micro_channel device |
KR101914395B1 (en) | 2017-12-29 | 2018-11-01 | 한국기계연구원 | Micro_channel device of locally pressurizing type |
KR101864556B1 (en) * | 2017-12-29 | 2018-06-05 | 한국기계연구원 | Micro_channel device with fastener |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000233448A (en) * | 1998-12-16 | 2000-08-29 | Sumitomo Chem Co Ltd | Method for heat fusion between molten liquid crystalline polyester resin molded article and metal |
JP2007038484A (en) * | 2005-08-02 | 2007-02-15 | Ushio Inc | Microchip substrate bonding equipment |
-
2007
- 2007-02-22 JP JP2007042182A patent/JP2008203186A/en not_active Withdrawn
-
2008
- 2008-01-21 WO PCT/JP2008/050675 patent/WO2008102585A1/en active Application Filing
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000233448A (en) * | 1998-12-16 | 2000-08-29 | Sumitomo Chem Co Ltd | Method for heat fusion between molten liquid crystalline polyester resin molded article and metal |
JP2007038484A (en) * | 2005-08-02 | 2007-02-15 | Ushio Inc | Microchip substrate bonding equipment |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2930740A1 (en) * | 2008-04-30 | 2009-11-06 | Jean Claude Rene Vandevoorde | METHOD AND PLANT FOR WELDING PLASTIC MATERIAL LAYERS |
EP2441518A3 (en) * | 2010-10-18 | 2013-12-04 | Sony Corporation | Method and device for thermocompression bonding |
US8691039B2 (en) | 2010-10-18 | 2014-04-08 | Sony Corporation | Method and device for thermocompression bonding |
US9956722B2 (en) | 2010-10-18 | 2018-05-01 | STRATEC CONSUMABLES GmbH | Method and device for thermocompression bonding |
Also Published As
Publication number | Publication date |
---|---|
JP2008203186A (en) | 2008-09-04 |
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