WO2008149772A1 - Film stratifié pour un montage de composant électronique, bande porteuse de film pour un montage de composant électronique, et dispositif semi-conducteur - Google Patents
Film stratifié pour un montage de composant électronique, bande porteuse de film pour un montage de composant électronique, et dispositif semi-conducteur Download PDFInfo
- Publication number
- WO2008149772A1 WO2008149772A1 PCT/JP2008/059908 JP2008059908W WO2008149772A1 WO 2008149772 A1 WO2008149772 A1 WO 2008149772A1 JP 2008059908 W JP2008059908 W JP 2008059908W WO 2008149772 A1 WO2008149772 A1 WO 2008149772A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- electronic component
- component mounting
- film
- conductor layer
- insulating film
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title 1
- 239000004020 conductor Substances 0.000 abstract 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 2
- 238000000059 patterning Methods 0.000 abstract 2
- 238000002834 transmittance Methods 0.000 abstract 2
- 239000004642 Polyimide Substances 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 239000011889 copper foil Substances 0.000 abstract 1
- 239000013078 crystal Substances 0.000 abstract 1
- 239000002245 particle Substances 0.000 abstract 1
- 229920001721 polyimide Polymers 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F99/00—Subject matter not provided for in other groups of this subclass
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0108—Transparent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/804—Containers or encapsulations
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Laminated Bodies (AREA)
- Wire Bonding (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008532529A JPWO2008149772A1 (ja) | 2007-06-08 | 2008-05-29 | 電子部品実装用積層フィルム、電子部品実装用フィルムキャリアテープ及び半導体装置 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-153294 | 2007-06-08 | ||
JP2007153294 | 2007-06-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008149772A1 true WO2008149772A1 (fr) | 2008-12-11 |
Family
ID=40093588
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/059908 WO2008149772A1 (fr) | 2007-06-08 | 2008-05-29 | Film stratifié pour un montage de composant électronique, bande porteuse de film pour un montage de composant électronique, et dispositif semi-conducteur |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPWO2008149772A1 (fr) |
KR (1) | KR20100006575A (fr) |
TW (1) | TW200908272A (fr) |
WO (1) | WO2008149772A1 (fr) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015108191A1 (fr) * | 2014-01-17 | 2015-07-23 | Jx日鉱日石金属株式会社 | Feuillard de cuivre à traitement de surface, feuillard de cuivre avec support, carte de circuit imprimé, stratifié cuivré, stratifié et procédé de fabrication de carte de circuit imprimé |
JP2015172250A (ja) * | 2015-05-11 | 2015-10-01 | Jx日鉱日石金属株式会社 | 表面処理銅箔、キャリア付銅箔、プリント配線板、プリント回路板、銅張積層板及びプリント配線板の製造方法 |
JP2016157752A (ja) * | 2015-02-23 | 2016-09-01 | 住友金属鉱山株式会社 | フレキシブル配線用基板およびフレキシブル配線板 |
WO2016208609A1 (fr) * | 2015-06-26 | 2016-12-29 | 住友金属鉱山株式会社 | Substrat conducteur |
WO2018012553A1 (fr) * | 2016-07-12 | 2018-01-18 | 大日本印刷株式会社 | Conducteur à motifs, feuille à conducteur, plaque de génération de chaleur, véhicule et procédé de production de conducteur à motifs |
CN108728874A (zh) * | 2017-04-18 | 2018-11-02 | 长春石油化学股份有限公司 | 具有低反弹力的电解铜箔、其制造方法及其应用 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI755773B (zh) * | 2014-06-30 | 2022-02-21 | 日商半導體能源研究所股份有限公司 | 發光裝置,模組,及電子裝置 |
KR101866901B1 (ko) * | 2016-10-12 | 2018-06-14 | 한국기계연구원 | 다층형 캐리어 필름 및 이를 이용한 소자 전사 방법과 이 방법을 이용하여 전자제품을 제조하는 전자제품 제조방법 |
GB2595291A (en) * | 2020-05-21 | 2021-11-24 | Mcmahon Raymond | A putter head and a putter |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05301958A (ja) * | 1992-04-28 | 1993-11-16 | Japan Synthetic Rubber Co Ltd | ポリイミドおよびその製造法 |
JPH09328545A (ja) * | 1996-06-10 | 1997-12-22 | Toyobo Co Ltd | 共重合ポリイミド樹脂 |
JP2006066814A (ja) * | 2004-08-30 | 2006-03-09 | Kyocera Chemical Corp | 電子部品 |
JP2006199945A (ja) * | 2004-12-24 | 2006-08-03 | Mitsubishi Gas Chem Co Inc | 低吸水性ポリイミド樹脂およびその製造方法 |
JP2007059892A (ja) * | 2005-07-27 | 2007-03-08 | Nippon Steel Chem Co Ltd | 高屈曲性フレキシブル銅張積層板の製造方法 |
JP2007131946A (ja) * | 2005-10-14 | 2007-05-31 | Mitsui Mining & Smelting Co Ltd | フレキシブル銅張積層板、そのフレキシブル銅張積層板を用いて得られるフレキシブルプリント配線板、そのフレキシブル銅張積層板を用いて得られるフィルムキャリアテープ、そのフレキシブル銅張積層板を用いて得られる半導体装置、フレキシブル銅張積層板の製造方法及びフィルムキャリアテープの製造方法 |
-
2008
- 2008-05-29 WO PCT/JP2008/059908 patent/WO2008149772A1/fr active Application Filing
- 2008-05-29 JP JP2008532529A patent/JPWO2008149772A1/ja active Pending
- 2008-05-29 KR KR1020097024451A patent/KR20100006575A/ko not_active Ceased
- 2008-06-03 TW TW097120556A patent/TW200908272A/zh unknown
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05301958A (ja) * | 1992-04-28 | 1993-11-16 | Japan Synthetic Rubber Co Ltd | ポリイミドおよびその製造法 |
JPH09328545A (ja) * | 1996-06-10 | 1997-12-22 | Toyobo Co Ltd | 共重合ポリイミド樹脂 |
JP2006066814A (ja) * | 2004-08-30 | 2006-03-09 | Kyocera Chemical Corp | 電子部品 |
JP2006199945A (ja) * | 2004-12-24 | 2006-08-03 | Mitsubishi Gas Chem Co Inc | 低吸水性ポリイミド樹脂およびその製造方法 |
JP2007059892A (ja) * | 2005-07-27 | 2007-03-08 | Nippon Steel Chem Co Ltd | 高屈曲性フレキシブル銅張積層板の製造方法 |
JP2007131946A (ja) * | 2005-10-14 | 2007-05-31 | Mitsui Mining & Smelting Co Ltd | フレキシブル銅張積層板、そのフレキシブル銅張積層板を用いて得られるフレキシブルプリント配線板、そのフレキシブル銅張積層板を用いて得られるフィルムキャリアテープ、そのフレキシブル銅張積層板を用いて得られる半導体装置、フレキシブル銅張積層板の製造方法及びフィルムキャリアテープの製造方法 |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015108191A1 (fr) * | 2014-01-17 | 2015-07-23 | Jx日鉱日石金属株式会社 | Feuillard de cuivre à traitement de surface, feuillard de cuivre avec support, carte de circuit imprimé, stratifié cuivré, stratifié et procédé de fabrication de carte de circuit imprimé |
JP2016157752A (ja) * | 2015-02-23 | 2016-09-01 | 住友金属鉱山株式会社 | フレキシブル配線用基板およびフレキシブル配線板 |
JP2015172250A (ja) * | 2015-05-11 | 2015-10-01 | Jx日鉱日石金属株式会社 | 表面処理銅箔、キャリア付銅箔、プリント配線板、プリント回路板、銅張積層板及びプリント配線板の製造方法 |
JPWO2016208609A1 (ja) * | 2015-06-26 | 2018-04-26 | 住友金属鉱山株式会社 | 導電性基板 |
WO2016208609A1 (fr) * | 2015-06-26 | 2016-12-29 | 住友金属鉱山株式会社 | Substrat conducteur |
JP6341456B1 (ja) * | 2016-07-12 | 2018-06-13 | 大日本印刷株式会社 | パターン導電体、導電体付きシート、発熱板、乗り物及びパターン導電体の製造方法 |
WO2018012553A1 (fr) * | 2016-07-12 | 2018-01-18 | 大日本印刷株式会社 | Conducteur à motifs, feuille à conducteur, plaque de génération de chaleur, véhicule et procédé de production de conducteur à motifs |
JP2018156947A (ja) * | 2016-07-12 | 2018-10-04 | 大日本印刷株式会社 | パターン導電体、導電体付きシート、発熱板、乗り物及びパターン導電体の製造方法 |
CN109478445A (zh) * | 2016-07-12 | 2019-03-15 | 大日本印刷株式会社 | 图案化导电体、带导电体的片、发热板、交通工具和图案化导电体的制造方法 |
EP3486923A4 (fr) * | 2016-07-12 | 2020-03-11 | Dai Nippon Printing Co., Ltd. | Conducteur à motifs, feuille à conducteur, plaque de génération de chaleur, véhicule et procédé de production de conducteur à motifs |
US11279323B2 (en) | 2016-07-12 | 2022-03-22 | Dai Nippon Printing Co., Ltd. | Patterned conductor, sheet with conductor, heating plate, vehicle, and manufacturing method of patterned conductor |
JP7220994B2 (ja) | 2016-07-12 | 2023-02-13 | 大日本印刷株式会社 | パターン導電体、導電体付きシート、発熱板、乗り物及びパターン導電体の製造方法 |
CN108728874A (zh) * | 2017-04-18 | 2018-11-02 | 长春石油化学股份有限公司 | 具有低反弹力的电解铜箔、其制造方法及其应用 |
Also Published As
Publication number | Publication date |
---|---|
JPWO2008149772A1 (ja) | 2010-08-26 |
TW200908272A (en) | 2009-02-16 |
KR20100006575A (ko) | 2010-01-19 |
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