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WO2008149772A1 - Film stratifié pour un montage de composant électronique, bande porteuse de film pour un montage de composant électronique, et dispositif semi-conducteur - Google Patents

Film stratifié pour un montage de composant électronique, bande porteuse de film pour un montage de composant électronique, et dispositif semi-conducteur Download PDF

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Publication number
WO2008149772A1
WO2008149772A1 PCT/JP2008/059908 JP2008059908W WO2008149772A1 WO 2008149772 A1 WO2008149772 A1 WO 2008149772A1 JP 2008059908 W JP2008059908 W JP 2008059908W WO 2008149772 A1 WO2008149772 A1 WO 2008149772A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic component
component mounting
film
conductor layer
insulating film
Prior art date
Application number
PCT/JP2008/059908
Other languages
English (en)
Japanese (ja)
Inventor
Makoto Yamagata
Noriaki Iwata
Original Assignee
Mitsui Mining & Smelting Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co., Ltd. filed Critical Mitsui Mining & Smelting Co., Ltd.
Priority to JP2008532529A priority Critical patent/JPWO2008149772A1/ja
Publication of WO2008149772A1 publication Critical patent/WO2008149772A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F99/00—Subject matter not provided for in other groups of this subclass
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Wire Bonding (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

Cette invention propose un film stratifié pour un montage de composant électronique, qui présente une excellente adhérence entre une couche conductrice et un film isolant, peut réaliser une transmittance de lumière très élevée et un état incolore du film isolant après formation des motifs de la couche conductrice, peut en outre réaliser une formation de motif de câblage d'un pas fin, et possède d'excellentes résistance à la traction, résistance au pliage et autres propriétés, et une bande porteuse de film pour un montage de composant électronique. Un film stratifié pour un montage de composant électronique (20) comprend un film isolant (12) formé sur une couche conductrice (11). La couche conductrice (11) contient des particules de cristal de cuivre colonnaire ayant une longueur de grand axe non inférieure à 3 µm et est formée d'une feuille de cuivre électrolytique ayant une épaisseur non supérieure à 15 µm et un allongement non inférieur à 5% à 25°C. Le film isolant (12) a une transmittance de lumière supérieure à 67% et non supérieure à 95% et est formé d'une couche de polyimide sensiblement incolore.
PCT/JP2008/059908 2007-06-08 2008-05-29 Film stratifié pour un montage de composant électronique, bande porteuse de film pour un montage de composant électronique, et dispositif semi-conducteur WO2008149772A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008532529A JPWO2008149772A1 (ja) 2007-06-08 2008-05-29 電子部品実装用積層フィルム、電子部品実装用フィルムキャリアテープ及び半導体装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-153294 2007-06-08
JP2007153294 2007-06-08

Publications (1)

Publication Number Publication Date
WO2008149772A1 true WO2008149772A1 (fr) 2008-12-11

Family

ID=40093588

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/059908 WO2008149772A1 (fr) 2007-06-08 2008-05-29 Film stratifié pour un montage de composant électronique, bande porteuse de film pour un montage de composant électronique, et dispositif semi-conducteur

Country Status (4)

Country Link
JP (1) JPWO2008149772A1 (fr)
KR (1) KR20100006575A (fr)
TW (1) TW200908272A (fr)
WO (1) WO2008149772A1 (fr)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015108191A1 (fr) * 2014-01-17 2015-07-23 Jx日鉱日石金属株式会社 Feuillard de cuivre à traitement de surface, feuillard de cuivre avec support, carte de circuit imprimé, stratifié cuivré, stratifié et procédé de fabrication de carte de circuit imprimé
JP2015172250A (ja) * 2015-05-11 2015-10-01 Jx日鉱日石金属株式会社 表面処理銅箔、キャリア付銅箔、プリント配線板、プリント回路板、銅張積層板及びプリント配線板の製造方法
JP2016157752A (ja) * 2015-02-23 2016-09-01 住友金属鉱山株式会社 フレキシブル配線用基板およびフレキシブル配線板
WO2016208609A1 (fr) * 2015-06-26 2016-12-29 住友金属鉱山株式会社 Substrat conducteur
WO2018012553A1 (fr) * 2016-07-12 2018-01-18 大日本印刷株式会社 Conducteur à motifs, feuille à conducteur, plaque de génération de chaleur, véhicule et procédé de production de conducteur à motifs
CN108728874A (zh) * 2017-04-18 2018-11-02 长春石油化学股份有限公司 具有低反弹力的电解铜箔、其制造方法及其应用

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI755773B (zh) * 2014-06-30 2022-02-21 日商半導體能源研究所股份有限公司 發光裝置，模組，及電子裝置
KR101866901B1 (ko) * 2016-10-12 2018-06-14 한국기계연구원 다층형 캐리어 필름 및 이를 이용한 소자 전사 방법과 이 방법을 이용하여 전자제품을 제조하는 전자제품 제조방법
GB2595291A (en) * 2020-05-21 2021-11-24 Mcmahon Raymond A putter head and a putter

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05301958A (ja) * 1992-04-28 1993-11-16 Japan Synthetic Rubber Co Ltd ポリイミドおよびその製造法
JPH09328545A (ja) * 1996-06-10 1997-12-22 Toyobo Co Ltd 共重合ポリイミド樹脂
JP2006066814A (ja) * 2004-08-30 2006-03-09 Kyocera Chemical Corp 電子部品
JP2006199945A (ja) * 2004-12-24 2006-08-03 Mitsubishi Gas Chem Co Inc 低吸水性ポリイミド樹脂およびその製造方法
JP2007059892A (ja) * 2005-07-27 2007-03-08 Nippon Steel Chem Co Ltd 高屈曲性フレキシブル銅張積層板の製造方法
JP2007131946A (ja) * 2005-10-14 2007-05-31 Mitsui Mining & Smelting Co Ltd フレキシブル銅張積層板、そのフレキシブル銅張積層板を用いて得られるフレキシブルプリント配線板、そのフレキシブル銅張積層板を用いて得られるフィルムキャリアテープ、そのフレキシブル銅張積層板を用いて得られる半導体装置、フレキシブル銅張積層板の製造方法及びフィルムキャリアテープの製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05301958A (ja) * 1992-04-28 1993-11-16 Japan Synthetic Rubber Co Ltd ポリイミドおよびその製造法
JPH09328545A (ja) * 1996-06-10 1997-12-22 Toyobo Co Ltd 共重合ポリイミド樹脂
JP2006066814A (ja) * 2004-08-30 2006-03-09 Kyocera Chemical Corp 電子部品
JP2006199945A (ja) * 2004-12-24 2006-08-03 Mitsubishi Gas Chem Co Inc 低吸水性ポリイミド樹脂およびその製造方法
JP2007059892A (ja) * 2005-07-27 2007-03-08 Nippon Steel Chem Co Ltd 高屈曲性フレキシブル銅張積層板の製造方法
JP2007131946A (ja) * 2005-10-14 2007-05-31 Mitsui Mining & Smelting Co Ltd フレキシブル銅張積層板、そのフレキシブル銅張積層板を用いて得られるフレキシブルプリント配線板、そのフレキシブル銅張積層板を用いて得られるフィルムキャリアテープ、そのフレキシブル銅張積層板を用いて得られる半導体装置、フレキシブル銅張積層板の製造方法及びフィルムキャリアテープの製造方法

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015108191A1 (fr) * 2014-01-17 2015-07-23 Jx日鉱日石金属株式会社 Feuillard de cuivre à traitement de surface, feuillard de cuivre avec support, carte de circuit imprimé, stratifié cuivré, stratifié et procédé de fabrication de carte de circuit imprimé
JP2016157752A (ja) * 2015-02-23 2016-09-01 住友金属鉱山株式会社 フレキシブル配線用基板およびフレキシブル配線板
JP2015172250A (ja) * 2015-05-11 2015-10-01 Jx日鉱日石金属株式会社 表面処理銅箔、キャリア付銅箔、プリント配線板、プリント回路板、銅張積層板及びプリント配線板の製造方法
JPWO2016208609A1 (ja) * 2015-06-26 2018-04-26 住友金属鉱山株式会社 導電性基板
WO2016208609A1 (fr) * 2015-06-26 2016-12-29 住友金属鉱山株式会社 Substrat conducteur
JP6341456B1 (ja) * 2016-07-12 2018-06-13 大日本印刷株式会社 パターン導電体、導電体付きシート、発熱板、乗り物及びパターン導電体の製造方法
WO2018012553A1 (fr) * 2016-07-12 2018-01-18 大日本印刷株式会社 Conducteur à motifs, feuille à conducteur, plaque de génération de chaleur, véhicule et procédé de production de conducteur à motifs
JP2018156947A (ja) * 2016-07-12 2018-10-04 大日本印刷株式会社 パターン導電体、導電体付きシート、発熱板、乗り物及びパターン導電体の製造方法
CN109478445A (zh) * 2016-07-12 2019-03-15 大日本印刷株式会社 图案化导电体、带导电体的片、发热板、交通工具和图案化导电体的制造方法
EP3486923A4 (fr) * 2016-07-12 2020-03-11 Dai Nippon Printing Co., Ltd. Conducteur à motifs, feuille à conducteur, plaque de génération de chaleur, véhicule et procédé de production de conducteur à motifs
US11279323B2 (en) 2016-07-12 2022-03-22 Dai Nippon Printing Co., Ltd. Patterned conductor, sheet with conductor, heating plate, vehicle, and manufacturing method of patterned conductor
JP7220994B2 (ja) 2016-07-12 2023-02-13 大日本印刷株式会社 パターン導電体、導電体付きシート、発熱板、乗り物及びパターン導電体の製造方法
CN108728874A (zh) * 2017-04-18 2018-11-02 长春石油化学股份有限公司 具有低反弹力的电解铜箔、其制造方法及其应用

Also Published As

Publication number Publication date
JPWO2008149772A1 (ja) 2010-08-26
TW200908272A (en) 2009-02-16
KR20100006575A (ko) 2010-01-19

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