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WO2008149772A1 - Laminated film for electronic component mounting, film carrier tape for electronic component mounting, and semiconductor device - Google Patents

Laminated film for electronic component mounting, film carrier tape for electronic component mounting, and semiconductor device Download PDF

Info

Publication number
WO2008149772A1
WO2008149772A1 PCT/JP2008/059908 JP2008059908W WO2008149772A1 WO 2008149772 A1 WO2008149772 A1 WO 2008149772A1 JP 2008059908 W JP2008059908 W JP 2008059908W WO 2008149772 A1 WO2008149772 A1 WO 2008149772A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic component
component mounting
film
conductor layer
insulating film
Prior art date
Application number
PCT/JP2008/059908
Other languages
French (fr)
Japanese (ja)
Inventor
Makoto Yamagata
Noriaki Iwata
Original Assignee
Mitsui Mining & Smelting Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co., Ltd. filed Critical Mitsui Mining & Smelting Co., Ltd.
Priority to JP2008532529A priority Critical patent/JPWO2008149772A1/en
Publication of WO2008149772A1 publication Critical patent/WO2008149772A1/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F99/00—Subject matter not provided for in other groups of this subclass
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Wire Bonding (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

This invention provides a laminated film for electronic component mounting, which is excellent in adhesion between a conductor layer and an insulating film, can realize a very high light transmittance and a colorless state of the insulating film after patterning the conductor layer, can further realize wiring patterning of a fine pitch, and has excellent tensile strength, folding resistance and other properties, and a film carrier tape for electronic component mounting. A laminated film for electronic component mounting (20) comprises an insulating film (12) provided on a conductor layer (11). The conductor layer (11) contains columnar copper crystal particles having a major axis length of not less than 3 µm and is formed of an electrolytic copper foil having a thickness of not more than 15 µm and an elongation of not less than 5% at 25ºC. The insulating film (12) has a light transmittance of more than 67% and not more than 95% and is formed of a substantially colorless polyimide layer.
PCT/JP2008/059908 2007-06-08 2008-05-29 Laminated film for electronic component mounting, film carrier tape for electronic component mounting, and semiconductor device WO2008149772A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008532529A JPWO2008149772A1 (en) 2007-06-08 2008-05-29 Laminated film for mounting electronic parts, film carrier tape for mounting electronic parts, and semiconductor device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-153294 2007-06-08
JP2007153294 2007-06-08

Publications (1)

Publication Number Publication Date
WO2008149772A1 true WO2008149772A1 (en) 2008-12-11

Family

ID=40093588

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/059908 WO2008149772A1 (en) 2007-06-08 2008-05-29 Laminated film for electronic component mounting, film carrier tape for electronic component mounting, and semiconductor device

Country Status (4)

Country Link
JP (1) JPWO2008149772A1 (en)
KR (1) KR20100006575A (en)
TW (1) TW200908272A (en)
WO (1) WO2008149772A1 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015108191A1 (en) * 2014-01-17 2015-07-23 Jx日鉱日石金属株式会社 Surface-treated copper foil, copper foil with carrier, printed wiring board, copper-clad laminate, laminate and method for producing printed wiring board
JP2015172250A (en) * 2015-05-11 2015-10-01 Jx日鉱日石金属株式会社 Surface-treated copper foil, copper foil with carrier, printed wiring board, printed circuit board, copper-clad laminate, and printed wiring board manufacturing method
JP2016157752A (en) * 2015-02-23 2016-09-01 住友金属鉱山株式会社 Substrate for flexible wiring board and flexible wiring board
WO2016208609A1 (en) * 2015-06-26 2016-12-29 住友金属鉱山株式会社 Conductive substrate
WO2018012553A1 (en) * 2016-07-12 2018-01-18 大日本印刷株式会社 Patterned conductor, sheet with conductor, heat-generating plate, vehicle, and method for producing patterned conductor
CN108728874A (en) * 2017-04-18 2018-11-02 长春石油化学股份有限公司 Electrolytic copper foil with low bounce, manufacturing method and application thereof

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI755773B (en) * 2014-06-30 2022-02-21 日商半導體能源研究所股份有限公司 Light-emitting device, module, and electronic device
KR101866901B1 (en) * 2016-10-12 2018-06-14 한국기계연구원 Multi-layered carrier film and the transfer method using the device and electronics manufacturing method using the same method
GB2595291A (en) * 2020-05-21 2021-11-24 Mcmahon Raymond A putter head and a putter

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05301958A (en) * 1992-04-28 1993-11-16 Japan Synthetic Rubber Co Ltd Polyimide and its production
JPH09328545A (en) * 1996-06-10 1997-12-22 Toyobo Co Ltd Copolyimide resin
JP2006066814A (en) * 2004-08-30 2006-03-09 Kyocera Chemical Corp Electronic component
JP2006199945A (en) * 2004-12-24 2006-08-03 Mitsubishi Gas Chem Co Inc Low water absorbable polyimide resin and process for its production
JP2007059892A (en) * 2005-07-27 2007-03-08 Nippon Steel Chem Co Ltd Manufacturing method for high-flexible copper clad laminate
JP2007131946A (en) * 2005-10-14 2007-05-31 Mitsui Mining & Smelting Co Ltd Flexible copper clad laminate, flexible printed wiring board obtained by using flexible copper clad laminate thereof, film carrier tape obtained by using flexible copper clad laminate thereof, semiconductor device obtained by using flexible copper clad laminate thereof, method of manufacturing flexible copper clad laminate and method of manufacturing film carrier tape

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05301958A (en) * 1992-04-28 1993-11-16 Japan Synthetic Rubber Co Ltd Polyimide and its production
JPH09328545A (en) * 1996-06-10 1997-12-22 Toyobo Co Ltd Copolyimide resin
JP2006066814A (en) * 2004-08-30 2006-03-09 Kyocera Chemical Corp Electronic component
JP2006199945A (en) * 2004-12-24 2006-08-03 Mitsubishi Gas Chem Co Inc Low water absorbable polyimide resin and process for its production
JP2007059892A (en) * 2005-07-27 2007-03-08 Nippon Steel Chem Co Ltd Manufacturing method for high-flexible copper clad laminate
JP2007131946A (en) * 2005-10-14 2007-05-31 Mitsui Mining & Smelting Co Ltd Flexible copper clad laminate, flexible printed wiring board obtained by using flexible copper clad laminate thereof, film carrier tape obtained by using flexible copper clad laminate thereof, semiconductor device obtained by using flexible copper clad laminate thereof, method of manufacturing flexible copper clad laminate and method of manufacturing film carrier tape

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015108191A1 (en) * 2014-01-17 2015-07-23 Jx日鉱日石金属株式会社 Surface-treated copper foil, copper foil with carrier, printed wiring board, copper-clad laminate, laminate and method for producing printed wiring board
JP2016157752A (en) * 2015-02-23 2016-09-01 住友金属鉱山株式会社 Substrate for flexible wiring board and flexible wiring board
JP2015172250A (en) * 2015-05-11 2015-10-01 Jx日鉱日石金属株式会社 Surface-treated copper foil, copper foil with carrier, printed wiring board, printed circuit board, copper-clad laminate, and printed wiring board manufacturing method
JPWO2016208609A1 (en) * 2015-06-26 2018-04-26 住友金属鉱山株式会社 Conductive substrate
WO2016208609A1 (en) * 2015-06-26 2016-12-29 住友金属鉱山株式会社 Conductive substrate
JP6341456B1 (en) * 2016-07-12 2018-06-13 大日本印刷株式会社 Pattern conductor, sheet with conductor, heating plate, vehicle, and manufacturing method of pattern conductor
WO2018012553A1 (en) * 2016-07-12 2018-01-18 大日本印刷株式会社 Patterned conductor, sheet with conductor, heat-generating plate, vehicle, and method for producing patterned conductor
JP2018156947A (en) * 2016-07-12 2018-10-04 大日本印刷株式会社 Pattern conductor, sheet with conductor, heating plate, vehicle, and manufacturing method of pattern conductor
CN109478445A (en) * 2016-07-12 2019-03-15 大日本印刷株式会社 The manufacturing method of patterned conductor, the piece with electric conductor, heating board, the vehicles and patterned conductor
EP3486923A4 (en) * 2016-07-12 2020-03-11 Dai Nippon Printing Co., Ltd. Patterned conductor, sheet with conductor, heat-generating plate, vehicle, and method for producing patterned conductor
US11279323B2 (en) 2016-07-12 2022-03-22 Dai Nippon Printing Co., Ltd. Patterned conductor, sheet with conductor, heating plate, vehicle, and manufacturing method of patterned conductor
JP7220994B2 (en) 2016-07-12 2023-02-13 大日本印刷株式会社 Patterned conductor, sheet with conductor, heating plate, vehicle, and method for manufacturing patterned conductor
CN108728874A (en) * 2017-04-18 2018-11-02 长春石油化学股份有限公司 Electrolytic copper foil with low bounce, manufacturing method and application thereof

Also Published As

Publication number Publication date
JPWO2008149772A1 (en) 2010-08-26
TW200908272A (en) 2009-02-16
KR20100006575A (en) 2010-01-19

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