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WO2007135710A1 - Appareil de contrôle de composants électroniques - Google Patents

Appareil de contrôle de composants électroniques Download PDF

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Publication number
WO2007135710A1
WO2007135710A1 PCT/JP2006/309955 JP2006309955W WO2007135710A1 WO 2007135710 A1 WO2007135710 A1 WO 2007135710A1 JP 2006309955 W JP2006309955 W JP 2006309955W WO 2007135710 A1 WO2007135710 A1 WO 2007135710A1
Authority
WO
WIPO (PCT)
Prior art keywords
test
unit
tray
trays
tst
Prior art date
Application number
PCT/JP2006/309955
Other languages
English (en)
Japanese (ja)
Inventor
Koya Karino
Yoshihito Kobayashi
Kazuyuki Yamashita
Akihiko Ito
Original Assignee
Advantest Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corporation filed Critical Advantest Corporation
Priority to KR1020087028998A priority Critical patent/KR101042652B1/ko
Priority to PCT/JP2006/309955 priority patent/WO2007135710A1/fr
Priority to TW096117208A priority patent/TW200804839A/zh
Publication of WO2007135710A1 publication Critical patent/WO2007135710A1/fr

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Definitions

  • the present invention relates to an electronic component testing apparatus used for testing various electronic components such as semiconductor integrated circuit elements (hereinafter also referred to as IC devices typically).
  • IC devices semiconductor integrated circuit elements
  • an electronic component testing apparatus is used to test the performance and function of the Ic device in the knocked state.
  • a handler that constitutes an electronic component testing apparatus includes a loader unit, a chamber unit, and an unloader unit.
  • the loader section of the handler circulates and conveys the electronic device testing apparatus from a tray (hereinafter referred to as a customer tray) for accommodating the pre-test IC device or the tested IC device. IC devices are reloaded onto the tray (hereinafter referred to as the test tray), and the test tray is loaded into the chamber.
  • a tray hereinafter referred to as a customer tray
  • the test tray for accommodating the pre-test IC device or the tested IC device.
  • IC devices are reloaded onto the tray (hereinafter referred to as the test tray), and the test tray is loaded into the chamber.
  • the chamber portion applies high-temperature or low-temperature thermal stress to the IC device mounted on the test tray, and then, in the test chamber, each IC device is electrically connected to the contact portion of the test head.
  • the electronic component testing device body (hereinafter referred to as a tester) performs the test.
  • the test tray loaded with each IC device for which the test has been completed is unloaded from the chamber portion to the unloader portion, and the IC device is remounted on the customer tray according to the test result in the unloader portion. In this way, good products are classified into defective products and sorted into categories.
  • the depth of the test unit If the number of test trays is increased to 3 or 4 in the direction, only the depth dimension increases according to the increased number of sheets.
  • the depth dimension of the handler is subject to restrictions such as setting the rear side force tester, and the required specifications are stricter than the height dimension and width dimension, so if only the depth dimension increases, it will be difficult to satisfy user needs. Become.
  • Patent Document 1 International Publication No. WO99Z01776 Pamphlet
  • An object of the present invention is to provide an electronic component testing apparatus capable of improving test efficiency.
  • the electronic device under test in a state where the electronic device under test is mounted on a test tray, the electronic device under test is electrically contacted with the contact portion of the test head.
  • An electronic component test apparatus used for testing the electronic device under test wherein the test unit is in a direction substantially perpendicular to the direction of travel of the test tray in the test unit.
  • the test trays are arranged in m rows along the direction N, the test trays are arranged in n columns along a direction substantially parallel to the traveling direction, and the test trays are arranged in m rows and n columns.
  • an electronic component testing apparatus that makes an electronic component to be tested mounted on X n) test trays electrically contact a contact portion of the test head (see claim 1).
  • m is an integer greater than or equal to 1
  • n is an integer greater than or equal to 2.
  • the test trays are arranged substantially along the direction substantially orthogonal to the direction of travel of the test tray. Arrange test trays along different directions. As a result, the number of simultaneous measurements in the test section can be increased, so that the test efficiency of the electronic component test apparatus can be improved.
  • an application unit that applies thermal stress at a predetermined temperature to the electronic device under test in a state where the electronic device under test is mounted on the test tray.
  • the unit arranges the test trays in m rows along a direction substantially perpendicular to the traveling direction, and arranges the test trays in a row in a direction substantially parallel to the traveling direction. It is preferable to have a first moving means for moving the (m X 1) test trays arranged in a row and 1 column in a direction approaching the test section (see claim 2).
  • the first moving means has the (m X 1) test trays arranged in n stages at predetermined intervals along a direction approaching the test unit. It is preferable to move them in order (see claim 3).
  • the test tray is arranged in m rows and n columns, whereas in the application unit, the test tray is arranged in m rows and 1 column, thereby minimizing the increase in the space occupied by the electronic component test apparatus.
  • the test efficiency of the electronic component test apparatus can be improved.
  • the first moving means may move (m X 1) test trays in each stage at the same time, or may move them independently of each other.
  • the first moving means sequentially moves the test tray along the vertical direction.
  • the first moving means sequentially moves the test tray along the horizontal direction.
  • (m X 1) pieces of the test tray in which the side force close to the test portion in the first moving means is also arranged in the P-stage are used as the test tray in the test portion. It is preferable to include first transport means for transporting to the p column or the (n + 1-p) column of the m-row / n-column arrangement (see claim 4). Where p is an integer l ⁇ p ⁇ n
  • the first transport means is the first transfer means. It is preferable that the (m X n) test trays arranged in the first to n-th stages from the side close to the test unit are transported to the test unit substantially simultaneously (see claim 5). .
  • the electronic device further includes a removing unit that removes thermal stress from the electronic device under test in a state where the electronic device under test is mounted on the test tray.
  • the removing unit arranges the test trays in m rows along a direction substantially perpendicular to the traveling direction, and arranges the test trays in one column along a direction substantially parallel to the traveling direction. It is preferable to have a second moving means for moving the (m X 1) test trays arranged side by side and arranged in m rows and 1 column in a direction away from the test force (see claim 6).
  • the second moving means is a state in which the (m X 1) test trays are arranged in n stages at predetermined intervals along a direction away from the test unit. It is preferable to move sequentially with (see claim 7).
  • the test tray is arranged in m rows and n columns, while in the removal unit, the test tray is arranged in m rows and 1 column, thereby minimizing the increase in the space occupied by the electronic component test equipment.
  • the test efficiency of the electronic component test apparatus can be improved.
  • the second moving means may move (m X 1) test trays in each stage at the same time, or may move them independently of each other.
  • the second moving means sequentially moves the test tray along the vertical direction.
  • the second moving means sequentially moves the test tray along the horizontal direction.
  • the second moving means includes second conveying means for conveying the second moving means so as to be arranged in the q-th or (n + 1-q) -th order from the side close to the test unit. 8).
  • q is an integer of l ⁇ q ⁇ n.
  • the second transport means includes the test unit.
  • (m X n) test trays arranged in m rows and n columns are transported substantially simultaneously to the second moving means (see claim 9).
  • the test electronic component is mounted on the test tray, a loader unit that carries the test tray into the application unit, the test tray is received from the removal unit, and a test result And an unloader unit that classifies the electronic components to be tested.
  • the loader unit carries the test tray one by one into the application unit, and the unloader unit It is preferable to carry out the test trays one by one from the removal unit (see claim 10).
  • FIG. 1 is a schematic cross-sectional view showing an electronic component test apparatus according to a first embodiment of the present invention.
  • FIG. 2 is a perspective view showing the electronic device test apparatus according to the first embodiment of the present invention.
  • FIG. 3 is a conceptual diagram showing tray handling in the electronic device test apparatus according to the first embodiment of the present invention.
  • FIG. 4 is an exploded perspective view showing an IC stock force used in the electronic component testing apparatus according to the first embodiment of the present invention.
  • FIG. 5 is a perspective view showing a customer tray used in the electronic component testing apparatus according to the first embodiment of the present invention.
  • FIG. 6 is an exploded perspective view showing a test tray used in the electronic device test apparatus according to the first embodiment of the present invention.
  • FIG. 7 is a side view of the vertical transfer device provided in the soak chamber of the electronic device test apparatus according to the first embodiment of the present invention.
  • FIG. 8A is a cross-sectional view of the chamber portion of the electronic device test apparatus according to the first embodiment of the present invention, showing a state before supplying a test tray to the test chamber.
  • FIG. 8B is a cross-sectional view taken along line VIIIB-VIIIB in FIG. 8A.
  • FIG. 9A is a cross-sectional view of the chamber portion of the electronic device test apparatus according to the first embodiment of the present invention, showing a state in which a test tray is supplied to the test chamber.
  • FIG. 9B is a cross-sectional view taken along the line IXB-IXB in FIG. 9A.
  • FIG. 10A is a cross-sectional view of the chamber portion of the electronic device test apparatus according to the first embodiment of the present invention, showing a state in which the IC device is pressed against the test head.
  • FIG. 10B is a cross-sectional view taken along line XB-XB in FIG. 10A.
  • FIG. 11 is a cross-sectional view of the chamber portion of the electronic device test apparatus according to the first embodiment of the present invention, showing a state in which the test tray is being unloaded from the test chamber.
  • FIG. 12 is a schematic cross-sectional view showing the order of transport of test trays in the chamber portion of the electronic device test apparatus according to the first embodiment of the present invention.
  • FIG. 13 is a schematic cross-sectional view showing the order of transport of test trays in the chamber portion of the electronic device test apparatus according to the second embodiment of the present invention.
  • FIG. 14 is a schematic cross-sectional view showing the order of transport of test trays in the chamber portion of the electronic device test apparatus according to the third embodiment of the present invention.
  • FIG. 15 is a conceptual diagram showing tray handling in the electronic device test apparatus according to the fourth embodiment of the present invention.
  • FIG. 16 is a plan view showing an example of a structure for connecting test trays in the fourth embodiment of the present invention.
  • FIG. 17 is a perspective view showing another example of a structure for connecting test trays in the fourth embodiment of the present invention.
  • FIG. 18 is a perspective view showing a transport path of a test tray in a soak chamber of an electronic device test apparatus according to a fifth embodiment of the present invention.
  • First tray transfer device 141 ... 1st upper conveyor
  • FIG. 1 is a schematic sectional view showing an electronic component testing apparatus according to the first embodiment of the present invention
  • FIG. 2 is a perspective view showing the electronic component testing apparatus according to the first embodiment of the present invention
  • FIG. 3 is a conceptual diagram showing a tray handling method in the electronic device test apparatus according to the first embodiment of the invention.
  • the electronic device test apparatus tests (inspects) whether or not the IC device operates properly in a state where high temperature or low temperature stress is applied to the IC device.
  • This device classifies IC devices based on test results, and consists of handler 1, test head 5, and tester 6.
  • the IC device test using this electronic component test equipment is performed by replacing the IC device from the customer tray KST (see Fig. 5) to the test tray TST (see Fig. 6).
  • the IC device is indicated by the symbol IC in the figure. As shown in FIGS.
  • the handler 1 in this embodiment includes a storage unit 200 that stores a pre-test IC device and a customer tray KST loaded with a post-test IC device, and a storage unit 200.
  • a loader unit 300 that loads the IC device to be sent onto the test tray TST and sends it to the chamber unit 100, a chamber unit 100 that includes the test head 5 and tests the IC device while mounted on the test tray TST, and a test It consists of an unloader unit 400 that unloads existing IC devices from the chamber unit 100 and transfers them to the customer tray KST while sorting them.
  • the handler 1 according to the present embodiment is capable of pressing the IC device against the socket 50 of the test head 5 in a state where the four test trays TST are arranged in two rows and two columns in the chamber unit 100.
  • a socket 50 provided in the test head 5 is connected to a tester 6 through a cable 7 shown in FIG. 1, and an IC device is tested by a test signal from the tester 6.
  • a space is formed in a part of the lower portion of the handler 1, and a test head 5 is replaceably disposed in this space, and a through hole formed in the device base of the handler 1 is formed.
  • the IC device and the socket 50 on the test head 5 can be brought into electrical contact.
  • the test device is replaced with another test head that has a socket suitable for the shape and pin count of that type of IC device.
  • FIG. 4 is an exploded perspective view showing an IC stocker used in the electronic component testing apparatus according to the first embodiment of the present invention
  • FIG. 5 is a customer tray used in the electronic component testing apparatus according to the first embodiment of the present invention. It is a perspective view shown.
  • the storage unit 200 includes a pre-test IC stocker 201 that stores pre-test IC devices, and a tested IC stocker 202 that stores IC devices classified according to test results. .
  • these stockers 201 and 202 include a frame-like tray support frame 203 and an elevator 204 that can be moved up and down by the lower force of the tray support frame 203 also entering the upper part. And.
  • a plurality of customer trays KST are stacked on the tray support frame 203, and only the stacked customer trays KST are moved up and down by the elevator 204.
  • 60 accommodating portions 31 for accommodating IC devices are arranged in 10 rows ⁇ 6 columns. Actually, there are various array variations depending on the type of IC device.
  • the numbers of the pre-test IC stocker 201 and the tested IC stocker 202 are appropriately set as necessary. can do.
  • two pre-test IC stockers 201 are provided with two stock forces STK-B, and two empty tray stocks STK-E are provided next to them. It has been.
  • Each empty tray stock strength STK-E is obtained by stacking empty customer trays KST sent to the unloader section 400! /.
  • tray stockers STK-1, STK-2, ..., STK-8 are installed in the tested IC stocker 202 next to the empty tray stock force STK-E. It is configured so that it can be sorted and stored in up to 8 categories. In other words, in addition to non-defective products and defective products, it is possible to sort non-defective products into high-speed, medium-speed, low-speed, or defective products that require retesting. It has become.
  • FIG. 6 is an exploded perspective view showing a test tray used in the electronic component testing apparatus according to the first embodiment of the present invention.
  • the above-described customer tray KST is transported from the lower side of the device base 101 to the two window portions 306 of the loader unit 300 by the tray transfer arm 205 provided between the storage unit 200 and the device base 101. It is. Then, in the loader unit 300, the IC device loaded in the customer tray KST is transferred by the device transfer device 304 to the precursor 305, where the mutual positional relationship of the IC devices is corrected. Thereafter, the IC device transferred to the precursor 305 is reloaded on the test tray TST stopped on the device transporter 304 force loader unit 300 again.
  • the test tray TST has bars 13 provided in parallel to the square frame 12 at equal intervals. Both sides of the bars 13 and the side 12a of the frame 12 facing the bars 13 are A plurality of mounting pieces 14 are formed so as to protrude at equal intervals. Between these bars 13 or An insert accommodating portion 15 is configured by the space between the cross 13 and the side 12a and the two mounting pieces 13.
  • Each insert accommodating portion 15 accommodates one insert 16, and this insert 16 is attached to two attachment pieces 14 in a floating state using fasteners 17. .
  • attachment holes 19 for attaching the insert 16 to the attachment piece 14 are formed at both ends of the insert 16.
  • 64 of these inserts 16 are attached to one test tray TST and arranged in 4 rows and 16 columns.
  • Each insert 16 has the same shape and the same dimensions, and an IC device is accommodated in each insert 16.
  • the IC accommodating portion 18 of the insert 16 is determined according to the shape of the IC device to be accommodated, and is a rectangular concave portion in the example shown in FIG.
  • the loader unit 300 includes a device transfer device 304 that transfers an IC device from the customer tray KST to the test tray TST.
  • the device transport device 304 reciprocally moves between the test tray TST and the customer tray KST by means of the two rails 301 installed on the device base 101 and the two rails 301 ( This direction is defined as the Y direction.)
  • a movable arm 302 that can be), a movable head 303 that is supported by the movable arm 302 and is movable in the X-axis direction along the movable arm 302, and a force are also configured.
  • a suction pad (not shown) is mounted downward on the movable head 303 of the device transport device 304.
  • the suction head moves while sucking to hold the IC device from the customer tray KST. Then, transfer the IC device to the test tray TST.
  • about eight suction pads are attached to one movable head 303, and eight IC devices can be loaded onto the test tray TST at one time.
  • FIG. 7 is a side view showing the vertical transfer device provided in the soak chamber of the electronic component testing apparatus according to the first embodiment of the present invention
  • FIGS. 8A, 9A, 10A and 11 are the first embodiment of the present invention.
  • FIG. 8A is a cross-sectional view of the chamber portion of the electronic component test apparatus according to the embodiment
  • FIG. 8A is a diagram showing a state before supplying the test tray to the test chamber
  • FIG. 9A is a diagram showing a state in which the test tray is supplied to the test chamber.
  • 10A is a state where the IC device is pressed against the test head
  • FIG. 11 is a diagram showing a state where the test tray is unloaded from the test chamber.
  • FIG. 8B is a cross-sectional view taken along line VIIIB-VIIIB in FIG. 8A
  • FIG. 9B is a cross-sectional view taken along line IXB-IXB in FIG. 9A
  • FIG. 10B is a cross-sectional view taken along line XB-XB in FIG. is there.
  • FIG. 12 is a schematic cross-sectional view showing the order in which the test tray is conveyed in the chamber portion of the electronic component testing apparatus according to the first embodiment of the present invention.
  • test tray TST described above is sent to the chamber unit 100, and the test of each IC device is executed with the IC device mounted on the test tray TST.
  • the chamber section 100 includes a soak chamber 110 that applies a thermal stress of about 55 ° C to 150 ° C to an IC device loaded on the test tray TST, and an IC device in a state in which this thermal stress is applied.
  • the test chamber 120 is configured to make electrical contact with the test head 5, and the unsoak chamber 170 is configured to remove the applied thermal stress from the IC device tested in the test chamber 120.
  • the unsoak chamber 170 is thermally insulated from the soak chamber 110 and the test chamber 120. Actually, a predetermined thermal stress is applied to the region between the soak chamber 110 and the test chamber 120. Are applied, and the unsoak chamber 170 is thermally insulated from these. For convenience, these are collectively referred to as the chamber portion 100.
  • the soak chamber 110 is provided with a vertical transfer device 111 for sequentially moving a plurality of test trays TST downward as shown in FIG.
  • the TST waits while being supported by the vertical transfer device. Mainly, thermal stress is applied to IC devices during this standby.
  • the vertical transfer device 111 includes a plurality of clamps 11 lb capable of holding the test tray TST in a horizontal posture, and an endless in which the clamps 11 lb are provided at substantially equal intervals.
  • the belt conveyor 112a can be moved along the vertical direction by the belt conveyor 11lb.
  • the vertical transport device 111 is lowered over a certain time while holding the test tray TST in a horizontal posture by the clamp 1 ib. During this time, thermal stress is applied to multiple IC devices mounted on the test tray TST. It is.
  • each clamp 11 lb of the vertical conveyance device 111 can hold two test trays TST arranged in two rows and one column along the Y-axis direction.
  • the soak chamber 110 is configured to push out the test trays TST stacked in the second and bottom stages from the bottom of the vertical transfer device 111 toward the test chamber 120 side.
  • An extrusion device 112 capable of performing the above is further provided.
  • a test head 5 is arranged at the center of the test chamber 120.
  • the test tray TST is carried on the test head 5, and the IC device is mounted on the test tray TST with the test head 5 mounted thereon.
  • the IC device is tested by pressing it against the socket 50 and bringing the input / output terminals of each IC device into electrical contact with the contact pins of the socket 50.
  • a direction (handler 1) that is substantially orthogonal to the traveling direction (X-axis direction) of the test tray TST in the test chamber 120 is provided in the test chamber 120.
  • the test tray TST is arranged in two rows along the depth direction), and two test trays TST are arranged in a direction substantially parallel to the X-axis direction, and the test tray TST is arranged in two rows and two columns.
  • the IC devices mounted on the four test trays can be simultaneously pressed against the socket 50 of the test head 5.
  • the arrangement of the test trays TST in the test chamber 120 is not particularly limited to 2 rows and 2 columns, but m rows and n columns (provided that m is an integer of 1 or more and n is 2 or more). If it is an integer, it may be 1 row and n columns, 3 rows or more, or 3 columns or more.
  • test tray arranged in one row and one column in the test chamber 120 is referred to as a first test tray TST, and the test tray arranged in one row and two columns in the test chamber 120. Is called the second test tray TST and the test chamber 120
  • the test tray placed in 2 rows and 2 columns is called the third test tray TST.
  • the test tray arranged in 2 rows and 1 column in the chamber 120 is connected to the fourth test tray TST.
  • the test chamber 120 has four test trays TST that can be arranged in two rows and two columns. -Fourth contact parts 51-54 are provided. [0065] The first contact portion 51 is arranged on the test head 5 so as to face the first test tray TST ⁇ , and the second contact portion 52 goes to the test so as to face the second test tray TST. Tsu
  • the third contact part 53 is placed on the terminal 5 so that the third contact portion 53 faces the third test tray TST.
  • the fourth contact portion 54 is arranged on the strike head 5 and faces the fourth test tray TST.
  • the first to fourth contact portions 51 to 54 are mounted on test trays TST to TST, which face each other.
  • Each is composed of an assembly of the same number (64) of sockets 50 as the mounted IC devices.
  • a Z-axis drive device 130 for simultaneously pressing each IC device mounted on the test tray TST against the socket 50 of the test head 5, and First to fourth tray transfer devices 140 to 160 for loading and unloading the test tray TST are provided.
  • the fourth tray transport device is hidden behind the first tray transport device 140 in FIG. 8A, and V is hidden behind the third tray transport device 160 in FIG. 8B. Also shown in the figure.
  • the Z-axis drive device 130 includes a drive shaft 131 that can move along the Z-axis direction by driving an actuator (not shown), a drive plate 132 that is supported at the lower end of the drive shaft 131, and a drive plate 132.
  • the first to fourth pusher groups 133 to 135 mounted on the lower surface of the drive plate 132 and the first to fourth abutting members 136 to 138 also mounted on the lower surface of the drive plate 132 are tested. It is provided above the head 5. Note that the fourth pusher group and the fourth abutting member are hidden behind the first pusher group and the first abutting member in FIG. 8A, and the third pusher group and the third abutting member in FIG. 8B. Because it is hidden behind the abutting member, it is shown in any figure.
  • the first pusher group 133 is used to press the 64 IC devices mounted on the first test tray TST against the sockets 50 of the first contact portion 51 at the same time.
  • the drive plate 132 is disposed on the lower surface so as to face the contact portion 51.
  • the first pusher group 133 is composed of a collection of pushers that come into contact with and press against the upper surface of the IC device, and the same number of IC devices (that is, 64 in this embodiment) mounted on the first test tray TST. ) Pusher! / [0070]
  • four first abutting members 136 for abutting a first upper conveyor 141 described later to push down the first tray transport device 140 are provided around the first pusher group 133.
  • the Each first contact member 136 protrudes downward from the lower surface of the drive plate 132.
  • the second pusher group 134 also has 64 IC devices mounted on the second test tray TST.
  • the lower surface of the drive plate 132 is disposed so as to face the second contact portion 52 of the test head 5.
  • the number of second pusher groups 134 is the same as the number of IC devices mounted on the second test tray TST.
  • each second contact member 137 projects downward from the lower surface of the drive plate 132.
  • the amount of push-down of second tray transport device 150 when pressed by Z-axis drive device 130 is relative to the amount of push-down of first tray transport device 140 or fourth tray transport device. Therefore, the second abutting member 137 is relatively shorter than the first abutting member 136 and the fourth abutting member (not shown).
  • the third pusher group 135 also has 64 IC devices mounted on the third test tray TST.
  • the drive plate 132 is disposed on the lower surface of the test head 5 so as to face the third contact portion 53.
  • the number of third pusher groups 135 is the same as the number of IC devices mounted on the third test tray TST.
  • the third pusher group 135 Around the third pusher group 135, four third abutting members 138 for abutting a third upper conveyor 161 described later to push down the third tray conveying device 160 are provided.
  • the Each third contact member 138 protrudes downward from the lower surface of the drive plate 132.
  • the amount of depression of the third tray conveyance device 160 during pressing is compared with the amount of depression of the first tray conveyance device 140 or the fourth tray conveyance device.
  • the third contact member 138 is relatively shorter than the first contact member 136 and the fourth contact member (not shown).
  • the fourth pusher group is not particularly shown, but 64 pieces mounted on the fourth test tray TST.
  • the IC device is disposed on the lower surface of the drive plate 132 so as to face the fourth contact portion of the test head 5 in order to simultaneously press the IC device against each socket of the fourth contact portion.
  • This fourth group of pushers is the same as the number of IC devices mounted on the fourth test tray TST (
  • the pusher is composed of 64 pushers.
  • a fourth abutting member cap for abutting a fourth upper conveyor (not shown), which will be described later, to push down the fourth tray conveying device is provided around the fourth pusher group. It is installed.
  • Each of the fourth contact members protrudes downward from the lower surface of the drive plate 132.
  • the first tray transport device 140 includes a first upper conveyor 141 and a first lower conveyor 143 for horizontally transporting the test tray TST in the test chamber 120.
  • the first support member 145 supports the conveyors 141 and 143 so as to be movable up and down.
  • the first upper conveyor 141 is provided to convey the test tray TST, which is located in the first row and the first column of the second row from the bottom in the vertical conveyance device 111, into the test chamber 120. ing.
  • the first lower conveyor 143 is provided in the vertical transport device 111 to be located at the lowest row in the first row and in the first column and to transport the test tray TST into the test chamber 120. Yes.
  • the first upper conveyor 141 and the first lower conveyor 143 are each composed of, for example, a pair of belt conveyors provided to support both sides of the test tray TST. ing. An interval through which the first contact portion 51 can pass is provided between the pair of belt conveyors. As shown in FIG. 8A, a stopper 142 for stopping the test tray TST conveyed by the conveyor 141 is provided on the first upper conveyor 141.
  • the stopper 142 has an air cylinder or the like that can be expanded and contracted along the Y-axis direction. Then, when stopping the test tray TST on the first upper conveyor 141, the air cylinder is extended so that the stopper 142 is positioned on the conveyor and passes the test tray TST on the first upper conveyor 141. To prevent this, retract the air cylinder and retract the stopper 142 from the conveyor.
  • the first upper conveyor 141 and the first lower conveyor 143 are fixed by a first connecting member 144. Since the first connecting member 144 cannot be expanded and contracted, a space through which the test tray TST can pass is formed between the first upper conveyor 141 and the first lower conveyor 143.
  • the first conveyors 141 and 143 integrated together by the first connecting member 144 are supported by the first support member 145 so as to be movable in the vertical direction.
  • the first support member 145 is composed of an elastic body such as a coil spring, for example, and the first support member 145 is pushed downward when the first conveyors 141 and 143 are pushed downward by the Z-axis drive device 130. When the 145 contracts and the pressing by the Z-axis driving device 130 is released, the first support member 145 returns the first conveyors 141 and 143 to their original positions by the elastic force.
  • the second tray transport device 150 also allows the second upper conveyor 151 and the second lower conveyor 152 to horizontally transport the test tray in the test chamber 120, and the conveyors 151 and 152 can be moved up and down.
  • the supporting second support member 155 and the force are also configured.
  • the second upper conveyor 151 further moves the test tray TST carried by the first upper conveyor 141 of the first tray transfer device 140 toward the unsoak chamber 170 side, and the unsoak chamber 170 Is provided to deliver the test tray TST to the position of the first row and the first column in the second row from the bottom.
  • both the second upper conveyor 151 and the first lower conveyor 152 are configured by a pair of belt conveyors provided so as to support both sides of the test tray TST, for example. ing. Between the pair of belt conveyors, as shown in FIGS. 8B and 10B, an interval through which the second contact portion 52 can pass is provided.
  • a stopper 153 for stopping the test tray TST conveyed by the conveyor 152 is provided on the second lower conveyor 152.
  • This stocker 153 has an air cylinder or the like that can expand and contract along the Y-axis direction.
  • the air cylinder is extended.
  • the stopper 153 is positioned on the conveyor and the second lower conveyor 152 is passed through the test tray TST, the air cylinder is contracted so that the stopper 153 also retracts the force on the conveyor.
  • the second upper conveyor 151 and the second lower conveyor 152 are fixed by the second connecting member 154. Since the second connecting member 154 is not extendable, a predetermined interval is formed between the second upper conveyor 151 and the second lower conveyor 152 so that the test tray TST can pass therethrough. Yes.
  • the second conveyors 151 and 152 integrated together by the second connecting member 154 are supported by the second support member 155 so as to be movable in the vertical direction.
  • the second support member 155 is made of an elastic body such as a coil spring, for example.
  • the second support device When the second conveyors 151 and 152 are pushed downward by the Z-axis drive device 130, the second support device When 155 contracts and the pressing by the Z-axis drive device 130 is released, the first support member 155 returns the second conveyors 151 and 152 to their original positions by the elastic force.
  • the third tray transport device 160 has basically the same configuration as the second tray transport device 150, and includes a third upper conveyor 161, a third lower conveyor 162, a stopper (not shown), The third connecting member 164 and the third supporting member 165 are configured.
  • the third upper conveyor 161 moves the test tray TST transported by the fourth upper conveyor of the fourth tray transport device further toward the unsoak chamber 170, so that the vertical transport device of the unsoak chamber 170 is moved. In order to deliver the test tray TST to the 2nd row, 1st column, 2nd from the bottom.
  • the third lower conveyor 162 further moves the test tray TST conveyed by the fourth lower conveyor of the fourth tray transport device toward the unsoak chamber 170 side, and the unsoak In the vertical transfer device of the chamber 170, it is provided to deliver the test tray TST to the position of 2 rows and 1 column at the bottom.
  • Both the third upper conveyor 161 and the third lower conveyor 162 are composed of, for example, a pair of belt conveyors provided so as to support both sides of the test tray TST. As shown in FIG. 8B and FIG. 10B, an interval through which the third contact portion 53 can pass is provided between the pair of belt conveyors.
  • a stagger is provided for stopping the test tray TST conveyed by the conveyor 162! /
  • the third upper conveyor 161 and the third lower conveyor 162 are fixed by a third connecting member 164. Since the third connecting member 164 is not expandable / contractable, an interval through which the test tray TST can sufficiently pass is formed between them. Third connecting member 1
  • the third conveyors 161 and 162 integrated together by 64 are supported by a third support member 165 so as to be movable in the vertical direction.
  • the fourth tray transport device has basically the same configuration as the first tray transport device 140, and includes a fourth upper conveyor, a stagger, a fourth lower conveyor, It is composed of a connecting member and a fourth supporting member.
  • the fourth upper conveyor is located in the second row and the second column of the second row from the bottom in the vertical conveyance device 111, and is provided to convey the test tray TST into the test chamber 120! /
  • the fourth lower conveyor is located in the lowest row in two rows and one column in the vertical conveyance device 111 and is provided to convey the test tray TST into the test chamber 120.
  • the fourth upper conveyor and the fourth lower conveyor are each composed of a pair of belt conveyors provided so as to support both sides of the test tray TST, for example. An interval through which the fourth contact portion 54 can pass is provided between the pair of belt competitors.
  • the fourth upper conveyor A stover for stopping the test tray TST conveyed by the conveyor is provided.
  • the fourth upper conveyor and the fourth lower conveyor are fixed by the fourth connecting member! Since the fourth connecting member is not extendable, an interval through which the test tray TT can pass is formed between them.
  • the fourth conveyor integrated by the fourth connecting member is supported by the fourth support member so as to be movable in the vertical direction.
  • the unsoak chamber 170 is also provided with a vertical transfer device having the same structure as the vertical transfer device 111 provided in the soak chamber 110, and this vertical transfer device sequentially moves a plurality of test trays TST upward. IC device force is also removed from thermal stress.
  • this unsoak chamber 170 when a high-temperature heat stress is applied to the IC device in the soak chamber 110, the IC device is cooled to the room temperature by blowing air. On the other hand, when a low temperature is applied in the soak chamber 110, the IC device is heated with warm air or a heater to a temperature at which condensation does not occur, and then the removed IC device is removed from the unloader section. Carry out to 400.
  • the soak chamber 110 and the unsoak chamber 170 are arranged so as to protrude above the test chamber 120.
  • an inlet for carrying the test tray TST from the apparatus base 101 is formed in the upper part of the soak chamber 110.
  • an outlet for unloading the test tray TST from the apparatus base 101 is also formed in the upper part of the unsoaked tank 170.
  • the apparatus base 101 is provided with a tray transfer apparatus 102 for taking the test tray TST out and in and out of the chamber section 100 through these inlets and outlets.
  • the tray transfer device 102 is constituted by, for example, a rotary loader.
  • test tray TST unloaded from the unsoak chamber 170 by the tray transport device 102 is returned to the soak chamber 110 via the unloader unit 400 and the loader unit 300.
  • one test tray TST is carried into the chamber unit 100 from the loader unit 300 one by one, and one test tray TST is carried out from the chamber unit 100 to the unloader unit 400 one by one.
  • the two test stacks stacked in the second stage from the bottom in the vertical transfer device 111 of the soak chamber 110 are used.
  • the lay TST and the two test trays TST stacked at the bottom are pushed out to the test chamber 120 side by the extrusion device 112.
  • the test tray TST located in the first row and the first column of the second row from the bottom of the vertical transfer device 111 is placed in the test chamber 120 by the first upper conveyor 141.
  • the stopper 142 is stopped on the first upper conveyor 141 by the stopper 142, and is positioned between the first contact portion 51 and the first pusher group 133 as the first test tray TST.
  • test tray TST located in the first row and the first column of the vertical stage of the vertical transfer device 111 is taken into the test chamber 120 by the first lower conveyor 143 and unsoaked by the second lower conveyor 152. Further moved to the chamber 170 side, stopped on the second lower conveyor 152 by the stopper 153, and connected to the second contact portion 52 as the second test tray TST.
  • test tray TST located in the bottom two rows and one column of the vertical transfer device 111 is taken into the test chamber 120 by the fourth lower conveyor, and the unsoak chamber 170 by the third lower conveyor 162. Is stopped on the third lower conveyor 162 by the stopper, and the third contact portion 53 and the third plug are used as the third test tray TST.
  • test tray TST located in the second row and the second column of the second stage from the bottom of the vertical transport device 111 is taken into the test chamber 120 by the fourth upper conveyor, and the fourth upper conveyor by the stopper. Stop on the 4th contact tray 54 and 4th as the 4th test tray TST
  • each pusher of the first pusher group 133 when the drive shaft 131 of the Z-axis drive device 130 expands and the drive plate 132 moves downward in the Z-axis, each pusher of the first pusher group 133
  • the C device is pressed against each socket 50 of the first contact portion 51, and the input / output terminals of each IC device are brought into electrical contact with the contact pins of each socket 50.
  • each pusher force of the second pusher group 134 is kept in the second test tray TST.
  • Each pusher force of the third pusher group 135 is held on the third test tray TST.
  • Each IC device is contacted to each IC device, and each IC device is pressed against each socket 50 of the third contact portion 53, and the input / output terminals of each IC device are brought into electrical contact with the contact pins of each socket 50.
  • each pusher force of the fourth pusher group contacts each IC device held on the fourth test tray TST4, and each IC device is connected to each socket of the fourth contact portion 54. Press to 50 and make the input / output terminals of each IC device electrically contact the contact pins of each socket 50.
  • Device testing can be performed simultaneously.
  • the lengths of the first contact member 136 and the fourth contact member are the same as those of the second contact member 137 and the third contact member 138. Since it is relatively long compared to the length, each IC device mounted on the first and fourth test trays TST and TST held on the upper conveyor and the lower conveyor Second and
  • each device mounted on TST can be pressed simultaneously
  • the test result of the IC device is stored, for example, in an address determined by the identification number assigned to each test tray TST and the number of the IC device assigned in the test tray TST.
  • the Z-axis drive device 130 is raised, and the first test tray TST is moved by the first upper conveyor 141 and the second upper conveyor 151. And is delivered to the second row, first column from the bottom of the vertical transport device in the unsoak chamber 170.
  • the second test tray TST is conveyed by the second lower conveyor 152, and is unsoaked.
  • the third test tray TST is conveyed by the third lower conveyor 162, and is unsoaked. Passed to 2 rows and 1 column at the bottom of number 170.
  • the fourth test tray TST is obtained by the fourth upper conveyor 161 and the third upper conveyor 161.
  • the first to fourth test trays TST to TST are heated in the unsoak chamber 170.
  • test tray TST is carried out one by one to the unloader section 400 as the unsoak chamber 170 force.
  • the first and fourth test trays TST, TST are placed in the unsoak chamber.
  • FIG. 13 is a schematic cross-sectional view showing the order of transport of the test tray in the chamber section of the electronic component testing apparatus according to the second embodiment of the present invention
  • FIG. 14 is an electronic component testing apparatus according to the third embodiment of the present invention.
  • FIG. 6 is a schematic cross-sectional view showing a test tray transporting order in the chamber portion.
  • the first to fourth test trays TST to TST may be transported in the transport order as shown in FIGS. 13 and 14, for example, without being limited to the transport order described above.
  • test trays TST, TST stacked at the bottom of the vertical transfer device 111 of the soak chamber 110 are arranged in the test chamber 120 in one row, one column, and two.
  • test trays TST and TST stacked in the second row from the bottom of the vertical transfer device 111 are placed in one row and two columns in the test chamber 120.
  • test trays TST and TST stacked at the lowest level of the vertical transfer device 111 of the soak chamber 110 are arranged in the test chamber 120 in one row, one column, and two.
  • test trays TST and TST stacked in the second stage from the bottom of the vertical transfer device 111 are placed in the test chamber 120 in one row and two columns.
  • FIG. 15 is a conceptual diagram showing tray handling in the electronic component testing apparatus according to the fourth embodiment of the present invention.
  • test trays TST to TST are divided into the test chamber 120.
  • the present invention is not particularly limited to this.
  • the soak chamber 110, the test chamber 120, and the unsoak chamber 170 are transported. Also good.
  • Examples of the structure for connecting the test trays TST to each other include the examples shown in Figs.
  • a convex portion 20 protruding from the side surface of one test tray TST is formed, and a concave portion 21 having a shape corresponding to the convex portion 20 is formed on the side surface of the other test tray TST.
  • the test trays TST are connected to each other by inserting the protrusions 20 into the recesses 21 and engaging them.
  • step portions 22 and 23 are formed on the side surfaces of the test tray TST, respectively, and the protruding portion 22a is formed on the step portion 22 of one test tray TST, while the other side is formed.
  • a hole 23a having a shape corresponding to the protrusion 22a is formed in the step 23 of the test tray TST, the protrusion 22a is inserted into the hole 23a, and the steps 22 and 23 are overlapped with each other. They are linked together.
  • FIG. 18 is a perspective view showing the transport path of the test tray in the soak chamber of the electronic device test apparatus according to the fifth embodiment of the present invention.
  • the force in which the test trays TST are arranged in two rows and one column in all the stages from the uppermost stage to the lowermost stage is not particularly limited to this.
  • the test trays TST are arranged in two rows and one column only in the second and bottom rows from the bottom, and one test tray TST is placed in the third row and above from the bottom. good.
  • the test tray TST may be arranged in 2 rows and 1 column only in the lowermost stage, and one test tray TST may be arranged in the second and higher stages.
  • the unloader section 400 is also provided with two device transport apparatuses 404 having the same structure as the device transport apparatus 304 provided in the loader section 300.
  • This device transport apparatus 404 The test tray TST force carried to the unloader unit 400 is also reloaded into the customer tray KST according to the tested IC device force test results.
  • the device base 101 in the unloader unit 400 has a pair of windows in which the customer tray KST carried from the storage unit 200 to the unloader unit 400 is arranged as desired on the upper surface of the device base 101. Two sets of parts 406 are formed.
  • an elevating table for elevating and lowering the customer tray KST is provided below each window 406.
  • a full load of tested IC devices is loaded.
  • the customer tray KST, which has become, is lowered and transferred to the tray transfer arm 205.
  • the electronic component test apparatus tests the test tray in a horizontal posture.
  • the present invention is not particularly limited to this.
  • the present invention is also applicable to an electronic component testing apparatus that tests a test tray in a vertical posture. can do.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

L'invention concerne un dispositif de manipulation (1) conçu pour contrôler des composants de circuit intégré, ce qui consiste à mettre ces composants en contact électrique avec les parties de contact (51, 54) d'une tête de contrôle (5) dans un état dans lequel ces composants sont montés sur un plateau d'essai (TST). Ce dispositif peut mettre les composants de circuit imprimé montés sur les quatre plateaux d'essai (TST) en contact électrique avec les parties de contact (51, 54) de la tête de contrôle (5) dans un état dans lequel ces plateaux d'essai (TST) sont disposés deux par deux, notamment deux plateaux (TST) selon un axe Y et deux plateaux (TST) selon un axe X.
PCT/JP2006/309955 2006-05-18 2006-05-18 Appareil de contrôle de composants électroniques WO2007135710A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020087028998A KR101042652B1 (ko) 2006-05-18 2006-05-18 전자부품 시험장치
PCT/JP2006/309955 WO2007135710A1 (fr) 2006-05-18 2006-05-18 Appareil de contrôle de composants électroniques
TW096117208A TW200804839A (en) 2006-05-18 2007-05-15 Electronic component testing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2006/309955 WO2007135710A1 (fr) 2006-05-18 2006-05-18 Appareil de contrôle de composants électroniques

Publications (1)

Publication Number Publication Date
WO2007135710A1 true WO2007135710A1 (fr) 2007-11-29

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PCT/JP2006/309955 WO2007135710A1 (fr) 2006-05-18 2006-05-18 Appareil de contrôle de composants électroniques

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KR (1) KR101042652B1 (fr)
TW (1) TW200804839A (fr)
WO (1) WO2007135710A1 (fr)

Cited By (3)

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Publication number Priority date Publication date Assignee Title
WO2010146709A1 (fr) * 2009-06-19 2010-12-23 株式会社アドバンテスト Système et procédé de transfert de pièces électroniques
WO2010146708A1 (fr) * 2009-06-19 2010-12-23 株式会社アドバンテスト Appareil de transfert de pièces électroniques et système de test de pièces électroniques fournis avec le dispositif de transfert
CN114035009A (zh) * 2020-07-21 2022-02-11 株式会社爱德万测试 电子部件处理装置及电子部件试验装置

Families Citing this family (1)

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Publication number Priority date Publication date Assignee Title
WO2010004844A1 (fr) * 2008-07-08 2010-01-14 株式会社アドバンテスト Méthode d'essai d'un composant électronique, insert, plateau et appareil d'essai d'un composant électronique

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WO1999001776A1 (fr) * 1997-07-02 1999-01-14 Advantest Corporation Controleur de semi-conducteurs et plateau d'essai associe
JP2000065895A (ja) * 1998-08-24 2000-03-03 Ando Electric Co Ltd オートハンドラおよびオートハンドラのキャリアの搬送方法
JP2000206187A (ja) * 1999-01-14 2000-07-28 Advantest Corp 電子部品試験装置用マッチプレ―ト
JP2001091576A (ja) * 1999-09-27 2001-04-06 Hitachi Ltd 半導体装置の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999001776A1 (fr) * 1997-07-02 1999-01-14 Advantest Corporation Controleur de semi-conducteurs et plateau d'essai associe
JP2000065895A (ja) * 1998-08-24 2000-03-03 Ando Electric Co Ltd オートハンドラおよびオートハンドラのキャリアの搬送方法
JP2000206187A (ja) * 1999-01-14 2000-07-28 Advantest Corp 電子部品試験装置用マッチプレ―ト
JP2001091576A (ja) * 1999-09-27 2001-04-06 Hitachi Ltd 半導体装置の製造方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010146709A1 (fr) * 2009-06-19 2010-12-23 株式会社アドバンテスト Système et procédé de transfert de pièces électroniques
WO2010146708A1 (fr) * 2009-06-19 2010-12-23 株式会社アドバンテスト Appareil de transfert de pièces électroniques et système de test de pièces électroniques fournis avec le dispositif de transfert
JPWO2010146709A1 (ja) * 2009-06-19 2012-11-29 株式会社アドバンテスト 電子部品移載装置及び電子部品の移載方法
TWI409204B (zh) * 2009-06-19 2013-09-21 Advantest Corp Electronic component processing device and electronic component testing device
CN114035009A (zh) * 2020-07-21 2022-02-11 株式会社爱德万测试 电子部件处理装置及电子部件试验装置

Also Published As

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TW200804839A (en) 2008-01-16
KR101042652B1 (ko) 2011-06-20
KR20090015938A (ko) 2009-02-12
TWI327224B (fr) 2010-07-11

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