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WO2007019733A1 - Dispositif d’eclairage a led de grande puissance et a forte capacite de dissipation thermique - Google Patents

Dispositif d’eclairage a led de grande puissance et a forte capacite de dissipation thermique Download PDF

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Publication number
WO2007019733A1
WO2007019733A1 PCT/CN2005/001301 CN2005001301W WO2007019733A1 WO 2007019733 A1 WO2007019733 A1 WO 2007019733A1 CN 2005001301 W CN2005001301 W CN 2005001301W WO 2007019733 A1 WO2007019733 A1 WO 2007019733A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat
diode
lighting device
hole
led lighting
Prior art date
Application number
PCT/CN2005/001301
Other languages
English (en)
Chinese (zh)
Inventor
Jen-Shyan Chen
Original Assignee
Neobulb Technologies, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Neobulb Technologies, Inc. filed Critical Neobulb Technologies, Inc.
Priority to US11/990,638 priority Critical patent/US7922361B2/en
Priority to PCT/CN2005/001301 priority patent/WO2007019733A1/fr
Priority to EP05777424A priority patent/EP1916467A1/fr
Priority to JP2008526349A priority patent/JP4620778B2/ja
Publication of WO2007019733A1 publication Critical patent/WO2007019733A1/fr

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/767—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having directions perpendicular to the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to an LED lighting device, and in particular, to a high power, high heat dissipation LED lamp of a system in package. Background technique
  • LEDs light emitting diodes
  • shock resistance shock resistance
  • fast response fast response
  • mass production the current lighting equipment using light-emitting diodes as a light source has been continuously researched and developed.
  • the existing high-power LEDs have a problem of excessive temperature after a period of continuous illumination, so that the luminous efficiency of the LED itself is lowered, and the brightness cannot be improved. Therefore, various products that use high-power LEDs require a good heat dissipation mechanism. Summary of the invention
  • the present invention provides an LED lighting device having high power and high heat dissipation efficiency.
  • the LED lighting device according to the invention is suitable for use as a street light.
  • a main aspect of the present invention is to provide a light-emitting diode illuminating equipment.
  • a light emitting diode lighting apparatus includes a casing (Casing) and N first packaged systems.
  • the housing has a bottom and N side walls, and N penetrating first holes are provided on the bottom of the housing, providing an additional and penetrating second on each side wall Hole, N is a positive integer greater than 2.
  • Each of the N package systems corresponds to one of the N sidewalls and a first hole of the N first holes, wherein each of the first package systems includes a first heat-conducting device, at least one first heat-dissipating fin, and a first light-emitting device (diode light-emitting device) a corresponding second hole and a neck of the first hole, a first flat portion at the end of the neck, and a first tail portion.
  • the first heat guiding device has its own neck corresponding thereto The outer side of the side wall passes through the corresponding second hole and extends into the corresponding first hole so that its first tail is located at its corresponding The outside of the side wall.
  • the at least one first heat dissipation fin is disposed around a tail of the first heat conduction device.
  • the first diode lighting device is planarly bonded to the flat portion of the first thermal guiding device and configured to convert the first electrical energy into a first light, wherein the first diode lighting device operates
  • the heat generated in the first heat guiding device is guided from the first flat portion of the first heat guiding device to the at least one first heat dissipating fin, thereby being dissipated by the at least one first heat dissipating fin.
  • the LED lighting device provided by the present invention integrates the thermal conduction and heat dissipation module and the diode light emitting module, the thermal conduction and heat dissipation module can immediately dissipate the heat energy generated by the diode light emitting module through the respective heat dissipation fins to In the surrounding air, the heat dissipation efficiency is greatly improved. Therefore, the diode lamp according to the present invention is more suitable for use in a lighting device of a light emitting diode requiring high heat dissipation efficiency as compared with the prior art. In particular, the LED lighting device according to the invention is suitable for use as a street light.
  • FIG. 1 is an exploded view of a particular embodiment in accordance with the present invention.
  • FIG. 2 is a structural view of a first diode lighting device in accordance with an embodiment of the present invention.
  • 3 is a block diagram showing the structure of a circuit board in accordance with an embodiment of the present invention. detailed description
  • a main aspect of the present invention is to provide an LED lighting device.
  • the LED lighting device comprises a housing 2 and N first packaging systems 4.
  • the housing has a bottom portion 21 and N side walls 23, and N penetrating first holes 212 are provided in the bottom portion 21 of the housing, and an additional second hole 232 is provided in each of the side walls 23 , N is a positive integer greater than 2.
  • Each of the N first packaging systems 4 corresponds to one of the N side walls 23 and one of the N first holes 212, each of the first packaging systems 4 Each includes a first thermal conduction device 41, at least one first heat dissipation fin 43 and a first diode illumination device 45.
  • the first heat guiding device 41 is divided into a corresponding second hole 232 and a corresponding a neck of the hole 212, a first flat portion at the end of the neck, and a first tail.
  • the first heat guiding device 41 passes its own neck through the corresponding second hole 232 from the outer side of its corresponding side wall 23 and extends into its corresponding first hole 212, thereby causing its own A tail is located outside of its corresponding side wall 23.
  • At least one first heat dissipation fin 43 is disposed around the first tail of the first heat conduction device 41.
  • the first diode lighting device 45 is smoothly joined to the first flat portion of the first thermal guiding device 41 and is configured to convert the first electrical energy into a first light, wherein the first diode lighting device 45 is in operation
  • the generated heat is guided by the first heat guiding device 41 from its own first flat portion to the at least one first heat radiating fin 43 and thereby dissipated by the at least one first heat radiating fin 43.
  • the LED illumination device has a housing bottom 21 and provides a penetrating third aperture 214, and has a top portion 25 that provides a penetrating fourth aperture 252 on the top portion 25 of the housing.
  • the LED lighting device further includes a second package system 8, the second package system including a second thermal guide 81, at least one second heat sink fin 83, and a second diode light emitter 85.
  • the second heat guiding device 81 is divided into a neck portion matching the third hole 214 and the fourth hole 252, a second flat portion at the end of the neck portion, and a second tail portion, and the second heat guiding device 81 is self-contained from the neck portion thereof.
  • the outer side of the top 25 passes through the fourth aperture 252 and extends into the third aperture 214 such that its second tail is located outside of the top 25.
  • At least one second heat dissipation fin 83 is disposed around the second tail of the second heat conduction device 81.
  • the second diode illuminator 85 is planarly coupled to the second flat portion of the second thermal guide 81 and is adapted to convert the second electrical energy into a second ray.
  • the heat generated during the operation of the second diode lighting device 85 is guided by the second thermal guiding device 81 from its second flat portion to the at least one second heat dissipating fin 83, thereby being at least one second heat dissipating portion.
  • the fins 83 dissipate heat.
  • the LED lighting device may further include a circuit board 6 electrically connected to the N first diode lighting devices 45 and electrically connected to the power source, and the power source is provided
  • the N first diode lighting devices 45 emit the first electric energy required for the first light
  • the circuit board 6 is electrically connected to the second diode lighting device 85, and the power source is used to provide the second diode lighting device 85.
  • the second electrical energy required for the second light is used to provide the second diode lighting device 85.
  • N is equal to, but not limited to 8, so that in the above-described embodiment, eight penetrating first holes and one penetrating third hole are provided on the bottom of the housing; Having eight side walls that provide an additional second hole for penetration; and eight A tube illuminator and a second diode illuminator. Therefore, the holes on the bottom of the casing and the arrangement state of the diode light-emitting devices are in a matrix shape. However, when N is equal to other positive integers greater than 2, the arrangement states are not necessarily matrix.
  • FIG. 2 is a block diagram of a first diode lighting device 45 in accordance with an embodiment of the present invention.
  • Each of the first diode illuminators 45 includes a first substrate 452, a first illuminating module 454, and two first electrodes 456.
  • the first light emitting module 454 and the two first electrodes 456 are respectively disposed on the first substrate 452 in an insulating manner.
  • the second diode light emitting device comprises a second substrate, a second light emitting module, and two second electrodes.
  • the second light emitting module and the two second electrodes are respectively disposed on the second substrate in an insulating manner.
  • FIG. 3 is a block diagram showing a circuit board 6 in accordance with an embodiment of the present invention.
  • the circuit board 6 includes a connector 63, nine connecting devices 65, and a hole 67.
  • the circuit board 6 is disposed on the inner side of the top portion 25 of the housing, and the circuit board 6 is electrically connected to the electrode 456 of each of the first diode lighting devices 45 and the second diode lighting device 85 via nine connecting devices 65, respectively. electrode.
  • the hole 67 corresponds to the fourth hole and is provided with a second heat guiding device therethrough.
  • the circuit board 61 is electrically connected to the connector 63, and the connector 63 can be electrically connected to the power source.
  • the power source is an AC power source
  • the LED lighting device further includes a power supply for converting AC power supplied by the AC power source into DC power
  • the connector is electrically connected to the power source via the power supply.
  • the power source is a DC power source.
  • each of the first thermal conductor and the second thermal conduction device can be a heat pipe or a heat column.
  • Each of the first heat guide and the second heat guide is made of a copper material, an aluminum material, or a material having a high thermal conductivity.
  • each of the first lighting module and the second lighting module comprises at least one light emitting diode or at least one laser diode.
  • each of the first substrate and the second substrate is made of a semiconductor material, a metal material, a polymer material, or a ceramic material.
  • the LED lighting device further includes a transparent lampshade 10 secured to the outside of the bottom portion 21 of the housing, and the transparent lampshade 10 covers the N first holes 212 and the third holes 214.
  • the module is integrated with the LED chip.
  • the thermal conduction and heat dissipation module can dissipate the heat generated by the LED chip to the surrounding air through the heat dissipation fins, thereby greatly improving the heat dissipation efficiency.
  • the luminous power of the LED lighting device according to the present invention can also be improved because the heat dissipation efficiency of the diode lamp is improved and the power of the LED is lowered due to overheating. Therefore, compared with the prior art, the LED lighting device provided according to the present invention is more suitable for use in a diode lighting device requiring high power and high heat dissipation efficiency, particularly a street lamp.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

L’invention concerne un dispositif d’éclairage à LED de grande puissance et à forte capacité de dissipation thermique. Le dispositif comprend un boîtier comportant un socle et N parois latérales ; N premiers trous traversants ménagés dans le socle du boîtier ; N deuxièmes trous traversants ménagés dans chacune des parois latérales, où N est un entier positif ; N modules d’encapsulation, chaque module comprenant : un col, une partie plate à une extrémité du col et un élément thermoconducteur à l’autre extrémité du col. Le col de chaque module se prolonge du premier trou traversant au deuxième trou traversant de telle sorte que l’une de ses extrémités se situe à l’extérieur de la paroi latérale ; cette extrémité est entourée d’au moins une ailette de dissipation thermique ; un élément à LED est connecté à sa partie plate et convertit l’énergie électrique en un rayonnement lumineux. Le dispositif d’éclairage à LED est caractérisé en ce que la chaleur générée par l’élément à LED est transmise de la partie plate à l’ailette de dissipation thermique d’où elle se dissipe.
PCT/CN2005/001301 2005-08-19 2005-08-19 Dispositif d’eclairage a led de grande puissance et a forte capacite de dissipation thermique WO2007019733A1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US11/990,638 US7922361B2 (en) 2005-08-19 2005-08-19 Light-emitting diode illuminating equipment with high power and high heat dissipation efficiency
PCT/CN2005/001301 WO2007019733A1 (fr) 2005-08-19 2005-08-19 Dispositif d’eclairage a led de grande puissance et a forte capacite de dissipation thermique
EP05777424A EP1916467A1 (fr) 2005-08-19 2005-08-19 Dispositif d eclairage a led de grande puissance et a forte capacite de dissipation thermique
JP2008526349A JP4620778B2 (ja) 2005-08-19 2005-08-19 高出力と高熱拡散効率を備えるｌｅｄ照明装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2005/001301 WO2007019733A1 (fr) 2005-08-19 2005-08-19 Dispositif d’eclairage a led de grande puissance et a forte capacite de dissipation thermique

Publications (1)

Publication Number Publication Date
WO2007019733A1 true WO2007019733A1 (fr) 2007-02-22

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PCT/CN2005/001301 WO2007019733A1 (fr) 2005-08-19 2005-08-19 Dispositif d’eclairage a led de grande puissance et a forte capacite de dissipation thermique

Country Status (3)

Country Link
EP (1) EP1916467A1 (fr)
JP (1) JP4620778B2 (fr)
WO (1) WO2007019733A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009077010A1 (fr) * 2007-12-19 2009-06-25 Osram Gesellschaft mit beschränkter Haftung Dispositif d'éclairage de terrain d'aviation
WO2009089903A1 (fr) * 2008-01-14 2009-07-23 Osram Gesellschaft mit beschränkter Haftung Dispositif de refroidissement de sources lumineuses à semi-conducteur et projecteur doté de ce dispositif
JP2010520578A (ja) * 2007-03-01 2010-06-10 ネオバルブ テクノロジーズ，インコーポレイテッド 発光ダイオード照明装置

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8827498B2 (en) * 2008-09-30 2014-09-09 Osram Sylvania Inc. LED light source having glass heat pipe with fiberglass wick
DE102009044388A1 (de) 2009-11-02 2011-05-05 Semperlux Aktiengesellschaft - Lichttechnische Werke - Außenleuchte und Hochdrucklampenersatz
KR101364002B1 (ko) 2011-12-02 2014-02-18 쎄딕(주) 엘이디 조명 장치와 그 방열 장치
KR101479635B1 (ko) 2013-05-30 2015-01-26 (주) 피에이에스 고출력 led 조명등 장치

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JP2002158376A (ja) * 2000-11-22 2002-05-31 Matsushita Electric Ind Co Ltd 発光ダイオード照明装置
CN1359137A (zh) * 2001-12-29 2002-07-17 葛世潮 超导热管灯
JP2002299700A (ja) * 2001-04-02 2002-10-11 Nichia Chem Ind Ltd Ｌｅｄ照明装置
CN2564849Y (zh) * 2002-08-21 2003-08-06 财团法人工业技术研究院 光电照明模块
CN2713301Y (zh) * 2004-07-01 2005-07-27 苏国棻 聚光灯散热器及聚光灯

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JP2001267773A (ja) * 2000-03-16 2001-09-28 Hitachi Ltd 電子部品の冷却装置
JP3989794B2 (ja) * 2001-08-09 2007-10-10 松下電器産業株式会社 Ｌｅｄ照明装置およびｌｅｄ照明光源
JP4103437B2 (ja) * 2002-04-23 2008-06-18 日亜化学工業株式会社 照明装置
JP2003331604A (ja) * 2002-05-16 2003-11-21 Harison Toshiba Lighting Corp バックライトユニット
JP2004127782A (ja) * 2002-10-04 2004-04-22 Ichikoh Ind Ltd 車両用灯具および灯火装置
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CN2821749Y (zh) * 2005-07-21 2006-09-27 新灯源科技有限公司 发光显示面板

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Publication number Priority date Publication date Assignee Title
JP2002158376A (ja) * 2000-11-22 2002-05-31 Matsushita Electric Ind Co Ltd 発光ダイオード照明装置
JP2002299700A (ja) * 2001-04-02 2002-10-11 Nichia Chem Ind Ltd Ｌｅｄ照明装置
CN1359137A (zh) * 2001-12-29 2002-07-17 葛世潮 超导热管灯
CN2564849Y (zh) * 2002-08-21 2003-08-06 财团法人工业技术研究院 光电照明模块
CN2713301Y (zh) * 2004-07-01 2005-07-27 苏国棻 聚光灯散热器及聚光灯

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010520578A (ja) * 2007-03-01 2010-06-10 ネオバルブ テクノロジーズ，インコーポレイテッド 発光ダイオード照明装置
WO2009077010A1 (fr) * 2007-12-19 2009-06-25 Osram Gesellschaft mit beschränkter Haftung Dispositif d'éclairage de terrain d'aviation
CN101903246A (zh) * 2007-12-19 2010-12-01 奥斯兰姆有限公司 飞机场照明装置
US8556448B2 (en) 2007-12-19 2013-10-15 Osram Gesellschaft Mit Beschraenkter Haftung Airfield lighting device
CN101903246B (zh) * 2007-12-19 2014-01-15 奥斯兰姆有限公司 飞机场照明装置
WO2009089903A1 (fr) * 2008-01-14 2009-07-23 Osram Gesellschaft mit beschränkter Haftung Dispositif de refroidissement de sources lumineuses à semi-conducteur et projecteur doté de ce dispositif
US8342728B2 (en) 2008-01-14 2013-01-01 Osram Gmbh Arrangement for cooling semiconductor light sources and floodlight having this arrangement

Also Published As

Publication number Publication date
JP4620778B2 (ja) 2011-01-26
EP1916467A1 (fr) 2008-04-30
JP2009505359A (ja) 2009-02-05

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