WO2007019733A1

WO2007019733A1 - Led illumination device with high power and high heat dissipation rate

Info

Publication number: WO2007019733A1
Application number: PCT/CN2005/001301
Authority: WO
Inventors: Jen-Shyan Chen
Original assignee: Neobulb Technologies, Inc.
Priority date: 2005-08-19
Filing date: 2005-08-19
Publication date: 2007-02-22
Also published as: JP4620778B2; JP2009505359A; EP1916467A1

Abstract

The invention relates to an LED illumination device with high power and high heat dissipation rate. The device comprises a housing composed of a base and N side walls, N first through-holes provided on the base of the housing, N second through-holes provided on each of side walls, wherein N is a positive integer; N packaging units, each unit comprising a neck , a flat portion which is on the one end of the neck, and a heat conduction apparatus which is on the other end of the neck. The neck of the heat conduction apparatus passes from the outside of the side wall via the second through-hole to the first through-hole, so that the other end of the neck lies outside the side wall; at least a fin for heat-dissipation, which is provided around the other end of the neck; a LED apparatus, which is connected to the flat portion of the neck, and converts the electric energy into light ray, wherein the heat produced by the LED apparatus is conducted from the flat portion to the fin for heat-dissipation, thus can be dissipated from the fin.

Description

LED lighting device with high power and high heat dissipation efficiency

The present invention relates to an LED lighting device, and in particular, to a high power, high heat dissipation LED lamp of a system in package. Background technique

Since light emitting diodes (LEDs) have many advantages such as power saving, shock resistance, fast response, and mass production, the current lighting equipment using light-emitting diodes as a light source has been continuously researched and developed. However, the existing high-power LEDs have a problem of excessive temperature after a period of continuous illumination, so that the luminous efficiency of the LED itself is lowered, and the brightness cannot be improved. Therefore, various products that use high-power LEDs require a good heat dissipation mechanism. Summary of the invention

Accordingly, the present invention provides an LED lighting device having high power and high heat dissipation efficiency. In particular, the LED lighting device according to the invention is suitable for use as a street light.

A main aspect of the present invention is to provide a light-emitting diode illuminating equipment. A light emitting diode lighting apparatus according to a preferred embodiment of the present invention includes a casing (Casing) and N first packaged systems. The housing has a bottom and N side walls, and N penetrating first holes are provided on the bottom of the housing, providing an additional and penetrating second on each side wall Hole, N is a positive integer greater than 2.

Each of the N package systems corresponds to one of the N sidewalls and a first hole of the N first holes, wherein each of the first package systems includes a first heat-conducting device, at least one first heat-dissipating fin, and a first light-emitting device (diode light-emitting device) a corresponding second hole and a neck of the first hole, a first flat portion at the end of the neck, and a first tail portion. The first heat guiding device has its own neck corresponding thereto The outer side of the side wall passes through the corresponding second hole and extends into the corresponding first hole so that its first tail is located at its corresponding The outside of the side wall. The at least one first heat dissipation fin is disposed around a tail of the first heat conduction device.

The first diode lighting device is planarly bonded to the flat portion of the first thermal guiding device and configured to convert the first electrical energy into a first light, wherein the first diode lighting device operates The heat generated in the first heat guiding device is guided from the first flat portion of the first heat guiding device to the at least one first heat dissipating fin, thereby being dissipated by the at least one first heat dissipating fin.

Since the LED lighting device provided by the present invention integrates the thermal conduction and heat dissipation module and the diode light emitting module, the thermal conduction and heat dissipation module can immediately dissipate the heat energy generated by the diode light emitting module through the respective heat dissipation fins to In the surrounding air, the heat dissipation efficiency is greatly improved. Therefore, the diode lamp according to the present invention is more suitable for use in a lighting device of a light emitting diode requiring high heat dissipation efficiency as compared with the prior art. In particular, the LED lighting device according to the invention is suitable for use as a street light.

The advantages and spirit of the present invention will be further understood from the following detailed description of the invention and the accompanying drawings. DRAWINGS

1 is an exploded view of a particular embodiment in accordance with the present invention.

2 is a structural view of a first diode lighting device in accordance with an embodiment of the present invention. 3 is a block diagram showing the structure of a circuit board in accordance with an embodiment of the present invention. detailed description

A main aspect of the present invention is to provide an LED lighting device.

See Figure 1. 1 is an exploded view of a preferred embodiment of the present invention. The LED lighting device according to the invention comprises a housing 2 and N first packaging systems 4. The housing has a bottom portion 21 and N side walls 23, and N penetrating first holes 212 are provided in the bottom portion 21 of the housing, and an additional second hole 232 is provided in each of the side walls 23 , N is a positive integer greater than 2.

Each of the N first packaging systems 4 corresponds to one of the N side walls 23 and one of the N first holes 212, each of the first packaging systems 4 Each includes a first thermal conduction device 41, at least one first heat dissipation fin 43 and a first diode illumination device 45. The first heat guiding device 41 is divided into a corresponding second hole 232 and a corresponding a neck of the hole 212, a first flat portion at the end of the neck, and a first tail. The first heat guiding device 41 passes its own neck through the corresponding second hole 232 from the outer side of its corresponding side wall 23 and extends into its corresponding first hole 212, thereby causing its own A tail is located outside of its corresponding side wall 23. At least one first heat dissipation fin 43 is disposed around the first tail of the first heat conduction device 41. The first diode lighting device 45 is smoothly joined to the first flat portion of the first thermal guiding device 41 and is configured to convert the first electrical energy into a first light, wherein the first diode lighting device 45 is in operation The generated heat is guided by the first heat guiding device 41 from its own first flat portion to the at least one first heat radiating fin 43 and thereby dissipated by the at least one first heat radiating fin 43.

In a specific embodiment, the LED illumination device has a housing bottom 21 and provides a penetrating third aperture 214, and has a top portion 25 that provides a penetrating fourth aperture 252 on the top portion 25 of the housing. The LED lighting device further includes a second package system 8, the second package system including a second thermal guide 81, at least one second heat sink fin 83, and a second diode light emitter 85.

The second heat guiding device 81 is divided into a neck portion matching the third hole 214 and the fourth hole 252, a second flat portion at the end of the neck portion, and a second tail portion, and the second heat guiding device 81 is self-contained from the neck portion thereof. The outer side of the top 25 passes through the fourth aperture 252 and extends into the third aperture 214 such that its second tail is located outside of the top 25. At least one second heat dissipation fin 83 is disposed around the second tail of the second heat conduction device 81. The second diode illuminator 85 is planarly coupled to the second flat portion of the second thermal guide 81 and is adapted to convert the second electrical energy into a second ray. The heat generated during the operation of the second diode lighting device 85 is guided by the second thermal guiding device 81 from its second flat portion to the at least one second heat dissipating fin 83, thereby being at least one second heat dissipating portion. The fins 83 dissipate heat.

See also Figure 1. In a specific embodiment, the LED lighting device may further include a circuit board 6 electrically connected to the N first diode lighting devices 45 and electrically connected to the power source, and the power source is provided The N first diode lighting devices 45 emit the first electric energy required for the first light, and the circuit board 6 is electrically connected to the second diode lighting device 85, and the power source is used to provide the second diode lighting device 85. The second electrical energy required for the second light.

In a specific embodiment, N is equal to, but not limited to 8, so that in the above-described embodiment, eight penetrating first holes and one penetrating third hole are provided on the bottom of the housing; Having eight side walls that provide an additional second hole for penetration; and eight A tube illuminator and a second diode illuminator. Therefore, the holes on the bottom of the casing and the arrangement state of the diode light-emitting devices are in a matrix shape. However, when N is equal to other positive integers greater than 2, the arrangement states are not necessarily matrix.

See Figure 2. 2 is a block diagram of a first diode lighting device 45 in accordance with an embodiment of the present invention. Each of the first diode illuminators 45 includes a first substrate 452, a first illuminating module 454, and two first electrodes 456. The first light emitting module 454 and the two first electrodes 456 are respectively disposed on the first substrate 452 in an insulating manner.

In a specific embodiment, the second diode light emitting device comprises a second substrate, a second light emitting module, and two second electrodes. The second light emitting module and the two second electrodes are respectively disposed on the second substrate in an insulating manner.

Please refer to Figure 3. 3 is a block diagram showing a circuit board 6 in accordance with an embodiment of the present invention. In one embodiment, the circuit board 6 includes a connector 63, nine connecting devices 65, and a hole 67. The circuit board 6 is disposed on the inner side of the top portion 25 of the housing, and the circuit board 6 is electrically connected to the electrode 456 of each of the first diode lighting devices 45 and the second diode lighting device 85 via nine connecting devices 65, respectively. electrode. The hole 67 corresponds to the fourth hole and is provided with a second heat guiding device therethrough. And the circuit board 61 is electrically connected to the connector 63, and the connector 63 can be electrically connected to the power source.

In one embodiment, the power source is an AC power source, and the LED lighting device further includes a power supply for converting AC power supplied by the AC power source into DC power, and the connector is electrically connected to the power source via the power supply. In a specific embodiment, the power source is a DC power source.

In a specific embodiment, each of the first thermal conductor and the second thermal conduction device can be a heat pipe or a heat column. Each of the first heat guide and the second heat guide is made of a copper material, an aluminum material, or a material having a high thermal conductivity.

In a specific embodiment, each of the first lighting module and the second lighting module comprises at least one light emitting diode or at least one laser diode.

In a specific embodiment, each of the first substrate and the second substrate is made of a semiconductor material, a metal material, a polymer material, or a ceramic material.

See Figure 1. In a specific embodiment, the LED lighting device further includes a transparent lampshade 10 secured to the outside of the bottom portion 21 of the housing, and the transparent lampshade 10 covers the N first holes 212 and the third holes 214.

Because the diode lamp in the LED lighting device provided by the invention will thermally and thermally dissipate The module is integrated with the LED chip. The thermal conduction and heat dissipation module can dissipate the heat generated by the LED chip to the surrounding air through the heat dissipation fins, thereby greatly improving the heat dissipation efficiency. The luminous power of the LED lighting device according to the present invention can also be improved because the heat dissipation efficiency of the diode lamp is improved and the power of the LED is lowered due to overheating. Therefore, compared with the prior art, the LED lighting device provided according to the present invention is more suitable for use in a diode lighting device requiring high power and high heat dissipation efficiency, particularly a street lamp.

From the detailed description of the preferred embodiments above, it is desirable to more clearly describe the features of the present invention. Rather, the intention is to cover various modifications and equivalent arrangements within the scope of the appended claims.

Claims

Rights request

1. An LED lighting device comprising:

a housing having a bottom and N side walls, providing N penetrating first holes on the bottom of the housing, providing an additional and penetrating second on each side wall Hole, N is a positive integer greater than 2;

'N first encapsulation systems, each of the N package systems corresponding to one of the N side walls and one of the N first holes, each A first package system consists of:

a first thermal guiding device, the first thermal guiding device is divided into a second hole corresponding to the corresponding second hole and the first hole, a first flat portion at the end of the neck portion, and a first tail portion, The first heat guiding device has its own neck passing through its corresponding second hole from the outer side of its corresponding side wall and extending into its corresponding first hole, so that its first tail is located The outer side of the corresponding side wall;

At least one first heat dissipation fin, the at least one first heat dissipation fin being disposed around the first tail of the first thermal conductive device;

a first diode illuminating device, the first diode illuminating device is smoothly joined to the first flat portion of the first thermal guiding device, and is configured to convert the first electric energy into the first ray, wherein The heat generated during operation of the first diode lighting device is guided by the first thermal guiding device from its first flat portion to the at least one first heat sink fin, and thereby by the at least A first heat sink fin dissipates heat.

,

2. The LED lighting device of claim 1, wherein a penetrating third hole is further provided on a bottom of the housing, the housing further having a top on top of the housing Providing a penetrating fourth hole, the LED lighting device further includes a second packaging system, the second packaging system comprising:

a second heat guiding device, the second heat guiding device is divided into a neck portion matching the three holes and the fourth hole, a second flat portion at the end of the neck portion, and a second tail portion The second heat guiding device passes through the fourth hole from the outer side of the top portion and extends into the third hole with its own neck portion such that its second tail portion is located outside the top portion;

At least one second heat dissipation fin, the at least one second heat dissipation fin being disposed around the second tail of the second heat conduction device; a second diode lighting device, the second diode lighting device is smoothly joined to the second flat portion of the second thermal guiding device, and configured to convert the second electric energy into the second light;

Wherein the heat generated during operation of the second diode lighting device is guided by the second thermal guiding device from the second flat portion thereof to the at least one second heat dissipating fin, thereby The at least one second heat sink fin dissipates heat.

3. The LED lighting device of claim 2, further comprising a circuit board electrically connected to the N first diode lighting devices and electrically connectable to a power source, wherein the power source is Providing a first electric energy required by the N first diode lighting devices to emit the first light, and the circuit board is electrically connected to the second diode lighting device, wherein the power source is used to provide The second diode lighting device emits the second electrical energy required for the second light.

4. The LED lighting device of claim 3, wherein each of the first diode lighting devices comprises a first substrate, a first lighting module, and two first electrodes, the first lighting module and The two first electrodes are respectively disposed on the first substrate in an insulating manner, and the second diode light emitting device comprises a second substrate, a second light emitting module and two second electrodes, the second The light emitting module and the two second electrodes are respectively disposed on the second substrate in an insulating manner.

The LED lighting device of claim 4, wherein each of the first lighting module and the second lighting module comprises at least one light emitting diode or at least one laser diode.

The light emitting diode illumination device according to claim 4, wherein each of the first substrate and the second substrate is made of a material selected from a semiconductor material, a metal material, a polymer material, or a ceramic material.

7. The LED lighting device of claim 3, wherein each of the first thermal guiding device and the second thermal guiding device is a thermal conductive column or a heat pipe.

The LED lighting device of claim 3, wherein each of the first thermal guiding device and the second thermal guiding device is made of a material selected from a copper material, an aluminum material or having a high thermal conductivity Made of materials of materials.

9. The LED lighting device of claim 4, wherein the circuit board comprises a connector, the circuit board is disposed on an inner side of a top of the housing, and the circuit board is electrically connected to each An electrode of the first diode light emitting device and an electrode of the second diode light emitting device, and the circuit board is electrically connected to the connector, the connector being electrically connected to the power source.

10. The LED lighting device of claim 9, wherein the power source is an AC power source, the LED lighting device further comprising a power supply device for converting AC power supplied by the AC power source into DC power, The connector is electrically connected to the power source via the power supply.

11. The LED lighting device of claim 9, wherein the power source is a DC power source.

12. The LED lighting device of claim 3, further comprising a transparent lamp cover, the transparent lamp cover being fixed on an outer side of the bottom of the housing, and the transparent lamp cover covering the N first holes and the Said third hole.