WO2006046545B1 - 弾性表面波素子及び通信装置 - Google Patents
弾性表面波素子及び通信装置Info
- Publication number
- WO2006046545B1 WO2006046545B1 PCT/JP2005/019573 JP2005019573W WO2006046545B1 WO 2006046545 B1 WO2006046545 B1 WO 2006046545B1 JP 2005019573 W JP2005019573 W JP 2005019573W WO 2006046545 B1 WO2006046545 B1 WO 2006046545B1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- metal layer
- alloy
- layer
- orientation
- titanium
- Prior art date
Links
- 229910052751 metal Inorganic materials 0.000 claims abstract 21
- 239000002184 metal Substances 0.000 claims abstract 21
- 229910001069 Ti alloy Inorganic materials 0.000 claims abstract 5
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims abstract 5
- 229910052719 titanium Inorganic materials 0.000 claims abstract 5
- 239000010936 titanium Substances 0.000 claims abstract 5
- 229910052782 aluminium Inorganic materials 0.000 claims abstract 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract 4
- 239000000758 substrate Substances 0.000 claims abstract 4
- 229910000838 Al alloy Inorganic materials 0.000 claims abstract 3
- 229910001020 Au alloy Inorganic materials 0.000 claims abstract 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims abstract 3
- 229910000599 Cr alloy Inorganic materials 0.000 claims abstract 3
- 229910000881 Cu alloy Inorganic materials 0.000 claims abstract 3
- 229910052804 chromium Inorganic materials 0.000 claims abstract 3
- 239000011651 chromium Substances 0.000 claims abstract 3
- 239000000788 chromium alloy Substances 0.000 claims abstract 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract 3
- 239000010931 gold Substances 0.000 claims abstract 3
- 229910052737 gold Inorganic materials 0.000 claims abstract 3
- 239000003353 gold alloy Substances 0.000 claims abstract 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract 2
- 229910052802 copper Inorganic materials 0.000 claims abstract 2
- 239000010949 copper Substances 0.000 claims abstract 2
- 238000010897 surface acoustic wave method Methods 0.000 claims 8
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 2
- 229910045601 alloy Inorganic materials 0.000 claims 2
- 239000000956 alloy Substances 0.000 claims 2
- 239000013078 crystal Substances 0.000 claims 2
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/125—Driving means, e.g. electrodes, coils
- H03H9/145—Driving means, e.g. electrodes, coils for networks using surface acoustic waves
- H03H9/14538—Formation
- H03H9/14541—Multilayer finger or busbar electrode
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Abstract
Claims
条約第 1 9条 (1 ) に基づく説明書 請求の範囲第 1項の 「第 2の金属層と力 交互に積層されて」 の記載を、 「第 2の金属層とが、 それぞれ一層ずつ交互に積層されて」 と補正する。 請求の範囲第 5項の 「第 2の金属層と力 交互に積層されて」 の記載を、 「第 2の金属層とが、 それぞれ一層ずつ交互に積層されて」 と補正する。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006543161A JP4686472B2 (ja) | 2004-10-26 | 2005-10-25 | 弾性表面波素子及び通信装置 |
US11/577,982 US7795788B2 (en) | 2004-10-26 | 2005-10-25 | Surface acoustic wave element and communication device |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004-311244 | 2004-10-26 | ||
JP2004311244 | 2004-10-26 | ||
JP2004342835 | 2004-11-26 | ||
JP2004-342835 | 2004-11-26 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2006046545A1 WO2006046545A1 (ja) | 2006-05-04 |
WO2006046545B1 true WO2006046545B1 (ja) | 2006-11-23 |
Family
ID=36227785
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2005/019573 WO2006046545A1 (ja) | 2004-10-26 | 2005-10-25 | 弾性表面波素子及び通信装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US7795788B2 (ja) |
JP (1) | JP4686472B2 (ja) |
WO (1) | WO2006046545A1 (ja) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007235711A (ja) * | 2006-03-02 | 2007-09-13 | Murata Mfg Co Ltd | 弾性表面波装置 |
JP5188714B2 (ja) * | 2007-01-15 | 2013-04-24 | トライクイント・セミコンダクター・インコーポレイテッド | 表面弾性波デバイス |
EP2175556B1 (en) * | 2007-07-30 | 2014-09-03 | Murata Manufacturing Co. Ltd. | Elastic wave device and method for manufacturing the same |
US20110104404A1 (en) * | 2008-03-24 | 2011-05-05 | Kyocera Corporation | Ceramic for Decorative Part and Decorative Part Comprising the Same |
DE102008033704B4 (de) * | 2008-07-18 | 2014-04-03 | Epcos Ag | Elektronisches Bauelement |
JP5392489B2 (ja) * | 2009-11-26 | 2014-01-22 | セイコーエプソン株式会社 | アクチュエーター、液体噴射ヘッド、および液体噴射装置 |
DE102009056663B4 (de) * | 2009-12-02 | 2022-08-11 | Tdk Electronics Ag | Metallisierung mit hoher Leistungsverträglichkeit und hoher elektrischer Leitfähigkeit und Verfahren zur Herstellung |
JP2011135469A (ja) * | 2009-12-25 | 2011-07-07 | Murata Mfg Co Ltd | 弾性波装置 |
US8981627B2 (en) | 2012-06-04 | 2015-03-17 | Tdk Corporation | Piezoelectric device with electrode films and electroconductive oxide film |
JP5880520B2 (ja) * | 2013-10-30 | 2016-03-09 | 株式会社村田製作所 | 弾性波装置及びその製造方法 |
JP6487458B2 (ja) * | 2014-11-18 | 2019-03-20 | 京セラ株式会社 | 弾性波素子、フィルタ素子および通信装置 |
JP6567982B2 (ja) * | 2016-01-29 | 2019-08-28 | 京セラ株式会社 | 弾性表面波素子及びそれを用いた弾性表面波装置 |
US11539342B2 (en) * | 2016-07-26 | 2022-12-27 | Kyocera Corporation | Acoustic wave device and communication apparatus |
JP6653647B2 (ja) * | 2016-12-21 | 2020-02-26 | 太陽誘電株式会社 | 弾性波デバイス |
CN110313130B (zh) * | 2017-02-22 | 2023-02-28 | 株式会社村田制作所 | 声表面波元件 |
US10536131B2 (en) | 2017-06-20 | 2020-01-14 | Skyworks Solutions, Inc. | Surface acoustic wave device with thermally conductive layer |
JP2019022093A (ja) * | 2017-07-18 | 2019-02-07 | 太陽誘電株式会社 | 弾性波デバイス |
US10700662B2 (en) | 2017-12-28 | 2020-06-30 | Taiyo Yuden Co., Ltd. | Acoustic wave device, filter, and multiplexer |
DE102018109849B4 (de) * | 2018-04-24 | 2020-03-05 | RF360 Europe GmbH | Elektroakustischer Resonator und Verfahren zum Bilden desselben |
JP2020096226A (ja) * | 2018-12-10 | 2020-06-18 | 太陽誘電株式会社 | 弾性波デバイス、フィルタおよびマルチプレクサ |
CN113346857B (zh) * | 2021-05-27 | 2023-11-28 | 北京超材信息科技有限公司 | 声表面波装置的制作方法 |
CN113346867B (zh) * | 2021-05-27 | 2024-04-12 | 北京超材信息科技有限公司 | 声表面波装置 |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6480113A (en) * | 1987-09-22 | 1989-03-27 | Hitachi Ltd | Surface acoustic wave device |
GB8808599D0 (en) | 1988-04-12 | 1988-05-11 | Glaxo Group Ltd | Medicaments |
JPH04288718A (ja) * | 1991-02-22 | 1992-10-13 | Seiko Epson Corp | 弾性表面波素子の電極構造 |
JP2937613B2 (ja) | 1991-07-16 | 1999-08-23 | 日本電気株式会社 | 薄膜配線およびその製造方法 |
JPH05199062A (ja) | 1991-09-24 | 1993-08-06 | Seiko Epson Corp | 弾性表面波素子とその製造方法および弾性表面波素子用基板 |
JPH05267979A (ja) | 1992-03-23 | 1993-10-15 | Matsushita Electric Ind Co Ltd | 弾性表面波素子 |
EP0548862A1 (en) | 1991-12-27 | 1993-06-30 | Matsushita Electric Industrial Co., Ltd. | Surface accoustic wave device |
JP3033331B2 (ja) * | 1992-02-10 | 2000-04-17 | 日本電気株式会社 | 薄膜配線の製造方法 |
JPH06350377A (ja) | 1993-06-11 | 1994-12-22 | Hitachi Ltd | 弾性表面波素子 |
JP3379049B2 (ja) * | 1993-10-27 | 2003-02-17 | 富士通株式会社 | 表面弾性波素子とその製造方法 |
JPH0998043A (ja) | 1995-09-29 | 1997-04-08 | Toshiba Corp | 弾性表面波デバイスおよびその製造方法 |
JP3430745B2 (ja) * | 1995-11-08 | 2003-07-28 | 松下電器産業株式会社 | Sawデバイス |
KR100507784B1 (ko) * | 1998-04-21 | 2005-08-17 | 마쯔시다덴기산교 가부시키가이샤 | 탄성표면파 디바이스와 그 제조방법 및 이것을 사용한이동통신기기 |
US6259185B1 (en) * | 1998-12-02 | 2001-07-10 | Cts Corporation | Metallization for high power handling in a surface acoustic wave device and method for providing same |
JP3351402B2 (ja) * | 1999-04-28 | 2002-11-25 | 株式会社村田製作所 | 電子素子、弾性表面波素子、それらの実装方法、電子部品または弾性表面波装置の製造方法、および、弾性表面波装置 |
JP3387060B2 (ja) * | 1999-05-31 | 2003-03-17 | ティーディーケイ株式会社 | 弾性表面波装置 |
US6452305B1 (en) * | 2000-03-14 | 2002-09-17 | Motorola, Inc. | High power surface acoustic wave device |
EP2458735A3 (en) * | 2000-10-23 | 2012-08-29 | Panasonic Corporation | Surface acoustic wave filter |
JP3971128B2 (ja) | 2001-06-05 | 2007-09-05 | 富士通株式会社 | 弾性表面波素子 |
JP3539419B2 (ja) | 2001-12-19 | 2004-07-07 | 三菱電機株式会社 | 弾性表面波装置とその製造方法 |
JP4060090B2 (ja) * | 2002-02-15 | 2008-03-12 | 沖電気工業株式会社 | 弾性表面波素子 |
JP2005229566A (ja) | 2004-01-15 | 2005-08-25 | Seiko Epson Corp | 弾性表面波装置及びその製造方法 |
JP4359535B2 (ja) * | 2004-02-06 | 2009-11-04 | アルプス電気株式会社 | 弾性表面波素子 |
JP2005347892A (ja) * | 2004-05-31 | 2005-12-15 | Fujitsu Media Device Kk | 弾性表面波素子 |
WO2006016544A1 (ja) * | 2004-08-11 | 2006-02-16 | Murata Manufacturing Co., Ltd. | デュプレクサ及び通信装置 |
-
2005
- 2005-10-25 US US11/577,982 patent/US7795788B2/en active Active
- 2005-10-25 WO PCT/JP2005/019573 patent/WO2006046545A1/ja active Application Filing
- 2005-10-25 JP JP2006543161A patent/JP4686472B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US7795788B2 (en) | 2010-09-14 |
JP4686472B2 (ja) | 2011-05-25 |
WO2006046545A1 (ja) | 2006-05-04 |
US20090243430A1 (en) | 2009-10-01 |
JPWO2006046545A1 (ja) | 2008-08-07 |
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